A kind of temperature control equipment and constant-temperature control methodTechnical field
The present invention relates to medical instrument domain of control temperature, and in particular to a kind of temperature control equipment and thermostatic control sideMethod.
Background technique
It includes that blood coagulation analyzer needs to configure temperature control equipment to meet detection working condition that two classes, which examine medical instrument,Under demand to temperature control.In order to improve equipment operating efficiency, existing frequently-used inspection class Medical Devices mostly use revolverAs sample and reagent position device, this kind of equipment is related to blood class and test agent pattern detection mostly, and blood class and testReagent generally requires to save at normal temperature to the more demanding of temperature, blood class sample, and reagent requirement saves at 2 DEG C -8 DEG C,It then requires to work under 37 DEG C of states when detection, and temperature control requirement is ± 0.5 DEG C.
Now as design particularity of the rotation class detection device in structure, this kind of device be difficult to carry out accurately to freeze andThe temperature control accurately heated.
Summary of the invention
It is an object of the invention to overcome problem above of the existing technology, a kind of temperature control equipment and constant temperature are providedControl method, temperature control equipment of the invention are rotary integrated device, can be realized the accurate temperature freezed and accurately heatedDegree control, and device temperature control adjusting is high-efficient, it is at low cost, it can satisfy rotary in the coagulation analysis class device of domestic marketThe demand of temperature control device development.
To realize above-mentioned technical purpose and the technique effect, the invention is realized by the following technical scheme:
A kind of temperature control equipment comprising:
The top end surface of pallet, the pallet is equipped with several reagent positions and several sample bits, the reagent position and samplePosition is blind hole, circumferentially arranges at equal intervals between several reagent positions, is at equal intervals between several sample bitsThe periphery of the reagent position is arranged in circumferential arrangement, the sample bit；
Shaft, the shaft are able to drive the pallet rotation through the tray center；
The first resistive heater, the first heating electricity are equipped in hollow gap between the shaft and the reagent positionThe outside for hindering silk is equipped with insulating protective layer, and first resistive heater is used to heat the reagent in the reagent position；
The periphery of the sample bit is equipped with the second resistive heater, and the outside of second resistive heater is equipped with insulation and protectsSheath, second resistive heater are used to heat the sample in the sample bit；
The tray bottom of the pallet is hollow structure, and the tray bottom includes the first chassis and the second chassis, the sampleThe bottom of position is second chassis, and the bottom of the reagent position is first chassis, first chassis and the second chassisBetween be equipped with cooling piece, the cooling piece is adjacent to the bottom surface on first chassis, and the cooling piece is for freezing.
Preferably, further include temperature sensor, temperature sensor setting first chassis and the second chassis itBetween.
Preferably, the heating temperature of first resistive heater and the second resistive heater can reach 37 DEG C ± 0.5℃。
Preferably, first resistive heater and the thermostatically controlled temperature error of the second resistive heater be 37 DEG C ±0.1℃。
Preferably, the cryogenic temperature of the cooling piece can be to 14 DEG C ± 2 DEG C.
Preferably, a kind of constant-temperature control method, comprising the following steps:
S1 MCU unit is sent according to pre-set heating, refrigeration and temperature control process parameter to sample bit, reagent positionTemperature control order；
S2 for the first resistive heater of reagent position heating, the second resistive heater for being heated on sample bit andCooling piece carries out various unit warming operations, refrigerating operation according to the order received；
The temperature signal monitored is transferred to chip NE5532 by S3 temperature sensor, and sensor signal passes through chipAfter NE5532 signal amplifier, it is transferred to MCU unit；
S4 MCU unit carries out the analysis of analog signal A/D translation operation, calculates the target temperature of current temperature value and settingBetween relationship, the first resistive heater and the second resistive heater are controlled, if current temperature value is than the temperature of settingDegree is high, the heater for closing the first resistive heater and the second resistive heater is controlled by MCU unit, if current temperature value ratioThe temperature of setting is low, and the heater for opening the first resistive heater and the second resistive heater is controlled by MCU unit；
Temperature controlled implementing result is transferred to MCU unit by S5.The beneficial effects of the present invention are:
One, temperature control equipment of the invention are a kind of rotary sample devices, which is equipped with sample bit, reagentPosition carries the pallet of above-mentioned sample bit and reagent position using aluminium material, aluminium material has good heating conduction, and selectsIt is arranged under mandrel using hollow structure, facilitates refrigeration component and the export of temperature sensor control line, refrigeration component is using electricityCooling piece.
Secondly, the thermostatic control error of temperature control equipment of the invention and method only at 37 DEG C ± 1 DEG C, error rangeSmall, measurement accuracy is high, can guarantee that instrument high quality is run.
The above description is only an overview of the technical scheme of the present invention, in order to better understand the technical means of the present invention,And can be implemented in accordance with the contents of the specification, the following is a detailed description of the preferred embodiments of the present invention and the accompanying drawings.A specific embodiment of the invention is shown in detail by following embodiment and its attached drawing.
Detailed description of the invention
It in order to more clearly illustrate the technical solutions in the embodiments of the present invention, below will be in embodiment technical descriptionRequired attached drawing is briefly described, it should be apparent that, the accompanying drawings in the following description is only some realities of the inventionExample is applied, it for those of ordinary skill in the art, without creative efforts, can also be according to these attached drawingsObtain other attached drawings.
Fig. 1 is the structural schematic diagram of temperature control equipment of the present invention；
Fig. 2 is the A-A sectional view of Fig. 1；
Fig. 3 is the enlarged diagram of part A in Fig. 2；
Fig. 4 is the schematic diagram of intelligent temperature control of the present invention；
Fig. 5 is the wiring diagram of intelligent temperature control of the present invention；
Fig. 6 is principle of heating figure；
Fig. 7 is schematic diagram of refrigerating.
Wherein, 1- pallet, 2- shaft, 101- reagent position, 102- sample bit, the first resistive heater of 103-, 104- secondResistive heater, 105- insulating protective layer, the first chassis 106-, the second chassis 107-, 108- cooling piece.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, completeSite preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based onEmbodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every otherEmbodiment shall fall within the protection scope of the present invention.
Embodiment
A kind of temperature control equipment is disclosed referring to Fig.1 shown in -3, in the present embodiment, which is rotaryDevice mainly includes pallet 1 and shaft 2, wherein above-mentioned pallet 1 is the device for carrying reagent and sample, above-mentioned shaft 2Above-mentioned pallet 1 is able to drive under the drive of rotating electric machine to rotate.
Specific structure between them are as follows: if being equipped with several reagent positions 101 and dry sample in the top end surface of above-mentioned pallet 1One's own department or unit 102, mentioned reagent position 101 and sample bit 102 are blind hole, between several mentioned reagent positions 101 at equal intervals circumferentiallyIt arranges, is circumferentially arranged at equal intervals between several above-mentioned sample bits 102, above-mentioned sample bit 102 is arranged in mentioned reagent position 101Periphery.
Above-mentioned shaft 2 is able to drive above-mentioned pallet rotation through above-mentioned 1 center of pallet, and above-mentioned shaft 2 is driven by rotating electric machineMove its rotation.
Because the temperature control equipment in the present embodiment can be realized it is automatic temperature-controlled, the device be provided with heating unit devicePart is equipped with the first resistive heater in the hollow gap between above-mentioned shaft 2 and mentioned reagent position 101 with refrigeration component103, the outside of above-mentioned first resistive heater 103 is equipped with insulating protective layer, and above-mentioned first resistive heater 103 is for heatingState the reagent in reagent position 101.
The periphery of above-mentioned sample bit 102 is equipped with the second resistive heater 104, the outside of above-mentioned second resistive heater 104Equipped with insulating protective layer 105, above-mentioned second resistive heater 104 is used to heat the sample in above-mentioned sample bit 102.
The export of above-mentioned heating component and sensor conductor for convenience, the tray bottom of above-mentioned pallet 1 is designed toHollow structure, i.e., above-mentioned tray bottom include the first chassis 106 and the second chassis 107, and the bottom of above-mentioned sample bit 102 is above-mentioned secondThe bottom on chassis 107, mentioned reagent position 101 is above-mentioned first chassis 106, between above-mentioned first chassis 106 and the second chassis 107Equipped with cooling piece 108, above-mentioned cooling piece 108 is adjacent to the bottom surface on above-mentioned first chassis 106, and above-mentioned cooling piece 108 is for freezing.
And it is also provided with temperature sensor, above-mentioned temperature sensor is arranged on above-mentioned first chassis 106 and the second chassisBetween 107.The hollow structure of above-mentioned tray bottom is arranged, and facilitates the conducting wire export of heating component and sensor.
In the present embodiment, the heating temperature of above-mentioned first resistive heater 103 and the second resistive heater 104 can reachTo 37 DEG C ± 0.5 DEG C, the cryogenic temperature of above-mentioned cooling piece 108 can be to 14 DEG C ± 2 DEG C, above-mentioned first resistive heater, 103 HeThe thermostatically controlled temperature error of second resistive heater 104 is 37 DEG C ± 0.1 DEG C.Therefore, which can meet in structureThe demand of rotation and temperature control, and temperature controlled precision is higher.
In the present embodiment, in order to preferably conduct heat, the temperature control efficiency of above-mentioned temperature control equipment is improved, onPallet is stated using aluminium material.
As shown in figs. 4-7, the temperature control method and principle of above-mentioned temperature controlled device are as follows:
S1 MCU unit is sent according to pre-set heating, refrigeration and temperature control process parameter to sample bit, reagent positionTemperature control order.
S2 for the first resistive heater of reagent position heating, the second resistive heater for being heated on sample bit andCooling piece for whole device refrigeration carries out various unit warming operations, refrigerating operation according to the order received.
The temperature signal monitored is transferred to chip NE5532 by S3 temperature sensor, and sensor signal passes through chipAfter NE5532 signal amplifier, it is transferred to MCU cellular system.
S4 MCU cellular system carries out operational analysis after carrying out analog signal A/D conversion, calculates current temperature value and settingTarget temperature between relationship, the first resistive heater and the second resistive heater are controlled, if current temperature valueIt is higher than the temperature of setting, the heater for closing the first resistive heater or the second resistive heater is controlled by MCU cellular system,If current temperature value is lower than the temperature of setting, is controlled by MCU cellular system and open the first resistive heater or the second heating electricityHinder the heater of silk.
Temperature controlled implementing result is transferred to MCU unit by S5.
The working principle of the present embodiment is as follows:
MCU unit sends various lives according to pre-set heating, refrigeration and temperature control process parameter, to detector cellIt enables, detector cell is controlled according to trace point setting, the gain that the order received carries out temperature, executes corresponding temperature controlOperation, and the result for returning to execution as needed gives MCU unit.
Temperature signal is transferred to detector by temperature control unit, and the heating component on detector and refrigeration component connectIt begins to warm up and freezes after to order, the temperature signal that sensor obtains is transferred to signal condition amplifying unit, by signal tuneIt is transferred to ADC unit after reason amplifying unit amplification, ADC unit converts a signal into digital quantity signal (real time temperature numerical value), numberValue is read by host.
Thermostatic control is sensor signal value through NE5532 chip signal amplifier, transmits MCU cellular system and carries out simulation letterThe analysis of number A/D translation operation calculates current temperature value and sets the relationship between target temperature, carries out on-off to system heating sourceControl.If current temperature value is higher than set temperature, shutdown heater is controlled by MCU cellular system；If current temperature value ratio is setIt is low to determine temperature, heater is controlled by MCU cellular system；Constant temperature error meets demand for control at 37 ± 0.1 DEG C.
The foregoing description of the disclosed embodiments enables those skilled in the art to implement or use the present invention.Various modifications to these embodiments will be readily apparent to those skilled in the art, as defined hereinGeneral Principle can be realized in other embodiments without departing from the spirit or scope of the present invention.Therefore, of the inventionIt is not intended to be limited to the embodiments shown herein, and is to fit to and the principles and novel features disclosed herein phase oneThe widest scope of cause.