Disclosure of Invention
The invention aims to provide a touch device, an electronic device and a mobile phone, wherein the touch device can shield the interference of external factors on the back surface of the touch device, so that the touch sensitivity is improved.
Specifically, the present invention provides a touch device, including:
a machine shell, a first cover plate and a second cover plate,
the system mainboard is divided into a first surface and a second surface and is arranged in the shell;
the touch driving integrated chip is electrically connected with the system mainboard through a connector and arranged on the first surface of the system mainboard; and
and the shielding electrode layer is electrically connected with the system mainboard and is arranged on the first surface of the shell, and the touch drive integrated chip loads a shielding signal to the shielding electrode layer through the system mainboard.
Preferably, the shielding electrode layer is disposed on the first surface of the chassis in an entire layer.
Preferably, the area of the shielding electrode layer and the area of the first surface of the chassis are equal.
Preferably, the edge of the chassis is provided with a contact point metal sheet.
Preferably, the shielding electrode layer is equally divided into a plurality of shielding electrode strips, and each shielding electrode strip is connected with the contact point metal sheet through a lead.
Preferably, the second surface of the system main board is provided with metal pad contact points, and the metal pad contact points are connected with the contact point metal sheet.
Preferably, the shielding electrode layer is an ITO conductive film or a non-transparent conductive layer.
Preferably, the connector is a flexible connector.
On the basis, the invention also provides an electronic device which comprises the touch device.
On the basis, the invention also provides a mobile phone which comprises the electronic device.
In the touch device, the electronic device and the mobile phone provided by the embodiment of the invention, the shielding electrode layer is arranged in the casing of the touch device, and when external interference factors act on the back surface of the casing, for example, the casing of the touch device is held by hands to increase the capacitance value of the touch sensing part, at the moment, the touch driving integrated chip loads the shielding signal to the shielding electrode layer through the system mainboard to shield the interference of the interference signal to the touch sensing layer, so that the touch sensitivity is improved.
The foregoing description is only an overview of the technical solutions of the present invention, and in order to make the technical means of the present invention more clearly understood, the present invention may be implemented in accordance with the content of the description, and in order to make the above and other objects, features, and advantages of the present invention more clearly understood, the following preferred embodiments are described in detail with reference to the accompanying drawings.
Detailed Description
To further illustrate the technical means and effects of the present invention adopted to achieve the predetermined objectives, the following detailed description will be provided with reference to the accompanying drawings and preferred embodiments for describing specific embodiments, methods, steps, structures, features and effects of a touch device, an electronic device and a mobile phone according to the present invention.
The foregoing and other technical and scientific aspects, features and advantages of the present invention will be apparent from the following detailed description of preferred embodiments, which is to be read in connection with the accompanying drawings. While the present invention has been described in connection with the preferred embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but is intended to cover various modifications, equivalent arrangements, and specific embodiments thereof.
Referring to fig. 3 and 4 together, fig. 3 is a schematic plan view of a touch device according to an embodiment of the present invention, and fig. 4 is a cross-sectional view of the touch device according to the embodiment of the present invention. The touch device includes ahousing 50, asystem board 60, a touch driving integrated chip 70 (as shown in fig. 6), and ashielding electrode layer 80.
In the embodiment, theshielding electrode layer 80 is disposed on thefirst surface 50A of thechassis 50, preferably, theshielding electrode layer 80 is electroplated on thefirst surface 50A of thechassis 50, and theshielding electrode layer 80 is an ITO conductive film or a non-transparent conductive layer.
The systemmain board 60 of the present embodiment is disposed in thehousing 50, and is disposed opposite to theshielding electrode layer 80. Thefirst surface 60A of thesystem motherboard 60 is provided with the touch driving integratedchip 70, and the touch driving integratedchip 70 is electrically connected to thesystem motherboard 60 through theconnector 90. Theconnector 90 of the present embodiment is a flexible connector.
Referring to fig. 5, fig. 5 is a schematic diagram illustrating a connection between a shielding electrode layer and a system motherboard according to an embodiment of the present invention. The contactpoint metal sheet 501 is disposed on the edge of thechassis 50, the metalpad contact point 601 is disposed on thesecond surface 60B of thesystem motherboard 60, and the metalpad contact point 601 is connected to the contactpoint metal sheet 501. In this embodiment, the contactpoint metal sheet 501 is an elastic metal sheet. When themetal pad contact 601 is connected to thecontact metal sheet 501, the touch driving integratedchip 70 loads a shielding signal to theshielding electrode layer 80 through thesystem motherboard 60, so as to shield the interference of the interference signal to the touch sensing layer, thereby improving the touch sensitivity. Thesystem board 60 and theshielding electrode layer 80 are in a point contact manner, which is helpful for protecting theshielding electrode layer 80, and the manufacturing process is simple and reliable. It may damage theshielding electrode layer 80 and be troublesome to handle, as opposed to using soldering or bonding connections.
Referring to fig. 6 and 7 together, fig. 6 is a schematic diagram illustrating a capacitance change of a touch panel when a finger touches the touch panel according to an embodiment of the present invention, and fig. 7 is an equivalent circuit diagram of fig. 6. As shown in FIG. 7, the capacitance part includes a capacitance C formed between the finger and the ground1The capacitor C formed between the coverplate lens substrate 10 and thedisplay screen module 112And a background capacitor C formed by the outside world to the touch device3. The touch terminals of the touch driving integratedchip 70 are respectively connected with the terminals C through R2、C3Connection, capacitance C1Is connected with the touch end of the touch driving integratedchip 70, and a capacitor C1And the other end of the same is connected to the other touch end of the touch driving integratedchip 70. Here, the touch driving integratedchip 70 has 640 signal source terminals, which include a touch signal terminal and a driving signal terminal, and each of the signal source terminals can independently output a certain voltage signal. As shown in fig. 7, when the touch-drivenintegrated chip 70 loads the shielding signal to the shieldingelectrode layer 80 through thesystem motherboard 60, the shielding signal is substantially loadedIn the capacitor C1The shielding signal may be a touch signal or a driving signal generated by the touch driving integratedchip 70. The voltage amplitude of the shielding signal is equal to that of other touch signals, and the voltage frequency of the shielding signal may not be equal to that of the other touch signals. Due to the loading on the capacitor C1The voltage of the shielding signal at the A end is equal to that of the touch signal at the B end, so that the capacitor C1The voltage difference between the two ends is constant zero, and the capacitance C can be ignored on the whole1The influence of the fingers on the touch device can be shielded, so that the touch sensitivity is improved.
For better shielding effect, the shieldingelectrode layer 80 is disposed on thefirst surface 50A of thechassis 50 in a whole layer, and the area of the shieldingelectrode layer 80 is equal to the area of the first surface of thechassis 50. The shieldingelectrode layer 80 can shield an external interference signal at any position of thehousing 50.
Referring to fig. 8, fig. 8 is a schematic view illustrating a shielding electrode layer disposed on a chassis according to an embodiment of the invention. As shown in fig. 8, in the present embodiment, on the basis that the shieldingelectrode layer 80 is entirely disposed on thefirst surface 50A of thechassis 50, the shieldingelectrode layer 80 is equally divided into a plurality of shieldingelectrode strips 801, and each shieldingelectrode strip 801 is connected to the contactpoint metal sheet 501 through a lead. Referring to fig. 9, fig. 9 is a schematic diagram of a PCB trace in a system motherboard according to an embodiment of the invention. As shown in fig. 9, the PCB traces are disposed on the systemmain board 60, and each of the PCB traces corresponds to a lead of each shieldingelectrode bar 801. Thesecond surface 60B of thesystem board 60 is provided with metal pad contact points 601, and the metal pad contact points 601 are connected to the contactpoint metal sheet 501. When themetal pad contact 601 and thecontact metal plate 501 are connected, thetouch driving ic 70 loads a touch signal to the shieldingelectrode layer 80 through thesystem motherboard 60. Therefore, the invention not only can shield the interference signal on the back of the shell, but also can realize some simple touch functions. For example, when holding the touch device, thetouch driver ic 70 scans the touch signal to illuminate the whole screen, so that the operator only needs to touch the back of the touch device to illuminate the whole screen.
The present invention further provides an electronic device, as shown in fig. 3 and 4, the electronic device includes ahousing 50, asystem board 60, a touch driving integratedchip 70, and a shieldingelectrode layer 80.
In the embodiment, the shieldingelectrode layer 80 is disposed on thefirst surface 50A of thechassis 50, preferably, the shieldingelectrode layer 80 is electroplated on thefirst surface 50A of thechassis 50, and the shieldingelectrode layer 80 is an ITO conductive film or a non-transparent conductive layer.
The systemmain board 60 of the present embodiment is disposed in thehousing 50, and is disposed opposite to the shieldingelectrode layer 80. Thefirst surface 60A of thesystem motherboard 60 is provided with the touch driving integratedchip 70, and the touch driving integratedchip 70 is electrically connected to thesystem motherboard 60 through theconnector 90. Theconnector 90 of the present embodiment is a flexible connector.
As shown in fig. 5, the edge of thechassis 50 is provided with a contactpoint metal sheet 501, thesecond surface 60B of thesystem board 60 is provided with a metalpad contact point 601, and the metalpad contact point 601 is connected to the contactpoint metal sheet 501. In this embodiment, the contactpoint metal sheet 501 is an elastic metal sheet. When themetal pad contact 601 is connected to thecontact metal sheet 501, the touch driving integratedchip 70 loads a shielding signal to the shieldingelectrode layer 80 through thesystem motherboard 60, so as to shield the interference of the interference signal to the touch sensing layer, thereby improving the touch sensitivity. Thesystem board 60 and the shieldingelectrode layer 80 are in a point contact manner, which is helpful for protecting the shieldingelectrode layer 80, and the manufacturing process is simple and reliable. It may damage the shieldingelectrode layer 80 and be troublesome to handle, as opposed to using soldering or bonding connections.
The present invention further provides a mobile phone, as shown in fig. 3 and 4, the mobile phone includes ahousing 50, asystem board 60, a touch driving integratedchip 70, and a shieldingelectrode layer 80.
In the embodiment, the shieldingelectrode layer 80 is disposed on thefirst surface 50A of thechassis 50, preferably, the shieldingelectrode layer 80 is electroplated on thefirst surface 50A of thechassis 50, and the shieldingelectrode layer 80 is an ITO conductive film or a non-transparent conductive layer.
The systemmain board 60 of the present embodiment is disposed in thehousing 50, and is disposed opposite to the shieldingelectrode layer 80. Thefirst surface 60A of thesystem motherboard 60 is provided with the touch driving integratedchip 70, and the touch driving integratedchip 70 is electrically connected to thesystem motherboard 60 through theconnector 90. Theconnector 90 of the present embodiment is a flexible connector.
As shown in fig. 5, the edge of thechassis 50 is provided with a contactpoint metal sheet 501, thesecond surface 60B of thesystem board 60 is provided with a metalpad contact point 601, and the metalpad contact point 601 is connected to the contactpoint metal sheet 501. In this embodiment, the contactpoint metal sheet 501 is an elastic metal sheet. When themetal pad contact 601 is connected to thecontact metal sheet 501, the touch driving integratedchip 70 loads a shielding signal to the shieldingelectrode layer 80 through thesystem motherboard 60, so as to shield the interference of the interference signal to the touch sensing layer, thereby improving the touch sensitivity. Thesystem board 60 and the shieldingelectrode layer 80 are in a point contact manner, which is helpful for protecting the shieldingelectrode layer 80, and the manufacturing process is simple and reliable. It may damage the shieldingelectrode layer 80 and be troublesome to handle, as opposed to using soldering or bonding connections.
Although the present invention has been described with reference to a preferred embodiment, it should be understood that various changes, substitutions and alterations can be made herein without departing from the spirit and scope of the invention as defined by the appended claims.