技术领域：Technical field:
本发明涉及一种可发光的隐私镀膜玻璃及绑定方法，应用于交通工具或建筑领域且具有照明和隐私功能的玻璃，尤其是安装在交通工具上的汽车天窗玻璃。The invention relates to a luminous privacy coated glass and a binding method, which is applied to the glass with lighting and privacy functions in the field of vehicles or buildings, especially the glass of the automobile sunroof installed on the vehicles.
背景技术：Background technique:
汽车天窗安装于车顶，能够有效地使车内空气流通，增加新鲜空气的进入，为车主带来健康、舒适的享受。同时汽车车窗也可以开阔视野，也常用于移动摄影摄像的拍摄需求。随着汽车天窗由半景天窗向全景天窗转变，大众审美水平不断提高，我们将天窗替换为发光玻璃，不仅可以在漆黑的夜里看到满天星星烟火，也可作为车内照明使用，在不点亮时也不会看到线路，不会整体影响美观。The car sunroof is installed on the roof of the car, which can effectively circulate the air in the car, increase the entry of fresh air, and bring healthy and comfortable enjoyment to the car owner. At the same time, car windows can also broaden the field of vision, and are often used for shooting needs of mobile photography. As the car sunroof changes from a half-view sunroof to a panoramic sunroof, the aesthetic level of the public continues to improve. We replace the sunroof with luminous glass. Not only can you see the sky full of stars and fireworks in the dark night, but it can also be used as interior lighting. You won't see the lines when it's on, and it won't affect the overall appearance.
发光玻璃亦称LED玻璃或光源玻璃，是一款应用专利透明导电技术，将LED(发光二极管)结构层胶合在两层玻璃之间的高端定制光电玻璃。可根据应用需求，将LED设计成星星状、矩阵、文字、图案、花纹等各种不同排列方式。LED玻璃拥有安全玻璃的所有特性，并承袭LED高效发光、低碳节能的优点，二者完美融合后呈现出的通透质感、无导线外观和璀璨光芒，更让这款高端玻璃产品充满科技感和未来感。LED玻璃开创了玻璃全新的应用领域；也引领了灯具材料行业的全新革命。具有通透、防暴、防水、防紫外线、可设计等特点。主要用于室内外装饰、家具设计、灯管照明设计、室外幕墙玻璃、阳光房设计等领域。Luminous glass, also known as LED glass or light source glass, is a high-end customized photoelectric glass that applies patented transparent conductive technology and glues LED (light-emitting diode) structural layers between two layers of glass. According to the application requirements, the LEDs can be designed in various arrangements such as stars, matrixes, characters, patterns, patterns, etc. LED glass has all the characteristics of safety glass, and inherits the advantages of LED high-efficiency luminescence, low carbon and energy saving. The perfect fusion of the two presents a transparent texture, wire-free appearance and bright light, which makes this high-end glass product full of technology. and futuristic. LED glass has created a new application field of glass; it has also led a new revolution in the lighting material industry. It has the characteristics of transparency, anti-riot, waterproof, anti-ultraviolet, and designable. Mainly used in indoor and outdoor decoration, furniture design, lamp lighting design, outdoor curtain wall glass, sun room design and other fields.
发明内容：Invention content:
本发明的目的是提供一种可发光的隐私镀膜玻璃及绑定方法。The purpose of the present invention is to provide a luminous privacy coated glass and a binding method.
上述的目的通过以下的技术方案实现：Above-mentioned purpose realizes by following technical scheme:
一种可发光的隐私镀膜玻璃，其组成包括：LED、玻璃基板、母线、隐私镀膜，所述的玻璃基板的上表面均匀的粘贴有导电膜，所述的玻璃基板的下表面均匀的粘贴有所述的隐私镀膜，所述的玻璃基板上表面通过保护膜进行覆盖，所述的LED通过导电胶设置在所述的玻璃基板和所述的导电膜所构成的导电玻璃基板的上表面，所述的LED为成品LED或LED芯片中的一种，所述的成品LED或LED芯片通过密封胶进行密封。A luminous privacy coated glass, which consists of: LED, glass substrate, bus bar, privacy coating, the upper surface of the glass substrate is uniformly pasted with a conductive film, and the lower surface of the glass substrate is uniformly pasted with In the privacy coating, the upper surface of the glass substrate is covered by a protective film, and the LED is arranged on the upper surface of the conductive glass substrate composed of the glass substrate and the conductive film through conductive glue, so The above-mentioned LED is a kind of finished LED or LED chip, and the above-mentioned finished LED or LED chip is sealed by a sealant.
所述的可发光的隐私镀膜玻璃，所述的成品LED通过绑定机台将所述的成品LED绑定于所述的玻璃基板上，通过点胶机将热固型透明硅胶滴于所述的成品LED上。For the luminous privacy coated glass, the finished LED is bound to the glass substrate by a binding machine, and the thermosetting transparent silica gel is dropped on the glass substrate by a dispenser. on the finished LED.
所述的可发光的隐私镀膜玻璃，所述的LED芯片在预绑定的两侧所述的导电膜上镀上金属层，所述的金属层长宽小于50um*50um，所述的LED芯片通过绑定机台以所述的金属层在预固晶区域画上导电胶，将所述的LED芯片使绑定于所述的玻璃基板上，通过点胶机将热固型透明硅胶滴于所述的LED芯片上，将金线、所述的LED芯片均完全密封于硅胶内。In the luminous privacy coated glass, the LED chip is coated with a metal layer on the conductive film on both sides of the pre-binding, the length and width of the metal layer are less than 50um*50um, and the LED chip Use the metal layer to draw conductive glue on the pre-bonding area through the binding machine, bind the LED chip on the glass substrate, and drop the thermosetting transparent silicone on the glass substrate through the glue dispenser. On the LED chip, the gold wire and the LED chip are completely sealed in silica gel.
所述的可发光的隐私镀膜玻璃，所述的导电膜为透明导电氧化物膜层为FTO、ITO、AZO、ATO、IZO、GZO和LaNiO3中的一种或为金属网格或纳米银线充当导体。In the luminous privacy coated glass, the conductive film is one of FTO, ITO, AZO, ATO, IZO, GZO and LaNiO3 or is a metal grid or nano-silver wire. conductor.
所述的可发光的隐私镀膜玻璃，所述的隐私镀层为金属膜或金属氧化薄膜。In the luminescent privacy coated glass, the privacy coating is a metal film or a metal oxide film.
所述的可发光的隐私镀膜玻璃，所述的母线为导电胶或银浆或银胶或金属箔带，所述的金属箔带外表设置镀锡层，表面设置金属线接头。As for the luminous privacy coated glass, the bus bar is conductive glue or silver paste or silver glue or metal foil strip, the surface of the metal foil strip is provided with a tin-plated layer, and the surface is provided with metal wire connectors.
所述的可发光的隐私镀膜玻璃，所述的保护膜为PVB或EVA，其厚度范围1mm—5mm，所述的导电玻璃方电阻是1~100欧/方。As for the luminous privacy coated glass, the protective film is PVB or EVA, and its thickness ranges from 1 mm to 5 mm, and the square resistance of the conductive glass is 1 to 100 ohms/square.
所述的可发光的隐私镀膜玻璃，所述的导电玻璃上含有线路，所述的线路使用激光划刻、蚀刻或掩模镀膜法制作，所述的线路，根据加载电压与LED额定电流电压，计算出线路所需总电阻，在根据电阻公式，计算线路宽度，90°转角按二分之一电阻计算，所述的母线与所述的金属线接头可根据设计而定。The luminous privacy coated glass, the conductive glass contains lines, the lines are made by laser scribing, etching or mask coating method, the lines, according to the loading voltage and the rated current and voltage of the LED, Calculate the total resistance required by the line, calculate the line width according to the resistance formula, and calculate the 90° corner as one-half of the resistance. The bus bar and the metal wire joint can be determined according to the design.
所述的可发光的隐私镀膜玻璃的绑定方法，该方法包括如下步骤：The binding method of the luminous privacy coated glass includes the following steps:
成品LED绑定Finished LED Binding
（1）镀膜：玻璃为基板，使用真空镀膜等镀膜方式玻璃镀上导电膜，使玻璃导电，在将玻璃另一表面镀上隐私膜，隐私膜透过率根据产品设计。(1) Coating: Glass is used as the substrate, and vacuum coating and other coating methods are used to coat the glass with a conductive film to make the glass conductive, and the other surface of the glass is coated with a privacy film. The transmittance of the privacy film is based on the product design.
（2）制作电路：将设计好的电路使用激光划刻、蚀刻或掩模镀膜法制作于导电玻璃上。(2) Make the circuit: Make the designed circuit on the conductive glass by laser scribing, etching or mask coating.
（3)母线制作：根据设计，使用导电胶或银浆利用印刷方式制作母线；或使用金属箔带制作母线。并制作金属线接头。(3) Busbar production: According to the design, use conductive glue or silver paste to make busbars by printing; or use metal foil tapes to make busbars. And make metal wire joints.
（4）绑定：使用绑定机台将成品LED绑定于制作好线路的玻璃上。(4) Binding: Use a binding machine to bind the finished LED to the glass with the circuit made.
（5）点胶封装：使用点胶机将热固型透明硅胶滴于成品LED上，使LED完全密封于硅胶内，起保护作用。(5) Dispensing encapsulation: Use a dispensing machine to drop thermosetting transparent silica gel on the finished LED, so that the LED is completely sealed in the silica gel for protection.
（6)贴保护膜：将保护膜（PVB或EVA）完全贴在贴有LED面的导电玻璃膜面上，其厚度为LED厚度+0.1mm~1mm。(6) Paste the protective film: Paste the protective film (PVB or EVA) completely on the conductive glass film surface with the LED surface, and its thickness is the thickness of the LED + 0.1mm~1mm.
（7)层压：将玻璃贴有保护膜面朝上，在覆盖上高温布，使用层压机或真空釜设备对产品层压。(7) Lamination: Put the glass with the protective film facing up, cover it with a high-temperature cloth, and use a laminator or vacuum kettle to laminate the product.
芯片绑定chip bonding
（1）镀膜：玻璃为基板，使用真空镀膜等镀膜方式玻璃镀上导电膜，使玻璃导电，在将玻璃另一表面镀上隐私膜，隐私膜透过率根据产品设计。(1) Coating: Glass is used as the substrate, and vacuum coating and other coating methods are used to coat the glass with a conductive film to make the glass conductive, and the other surface of the glass is coated with a privacy film. The transmittance of the privacy film is based on the product design.
（2）制作电路：将设计好的电路使用激光划刻、蚀刻或掩模镀膜法制作于导电玻璃上。(2) Make the circuit: Make the designed circuit on the conductive glass by laser scribing, etching or mask coating.
（3）PAD点制作：根据LED位置，在预绑定的两侧导电膜上镀上金属层，金属层长宽小于50um*50um。(3) PAD point production: According to the position of the LED, a metal layer is plated on the conductive film on both sides of the pre-binding, and the length and width of the metal layer are less than 50um*50um.
（4）母线制作：根据设计，使用导电胶或银浆利用印刷方式制作母线；或使用金属箔带制作母线。并制作金属线接头。(4) Busbar production: According to the design, use conductive glue or silver paste to make busbars by printing; or use metal foil tapes to make busbars. And make metal wire joints.
（5）绑定：使用绑定机台以金属层为PR，在预固晶区域画上导电胶，将LED芯片使绑定于导电玻璃上。(5) Binding: Use a bonding machine to use the metal layer as PR, draw conductive glue on the pre-bonding area, and bind the LED chip to the conductive glass.
（6）打线：使用打线机台，将LED芯片与导电玻璃连通。(6) Wire bonding: use a wire bonding machine to connect the LED chip with the conductive glass.
（7）点胶封装：使用点胶机将热固型透明硅胶滴于LED芯片上，将金线、LED芯片均完全密封于硅胶内，起保护作用。(7) Dispensing encapsulation: Use a dispensing machine to drop thermosetting transparent silica gel on the LED chip, and completely seal the gold wire and LED chip in the silica gel for protection.
（8）贴保护膜：将保护膜（PVB或EVA）完全贴在贴有LED面的导电玻璃膜面上，其厚度为LED厚度+0.1mm~1mm。(8) Paste the protective film: Paste the protective film (PVB or EVA) completely on the conductive glass film surface with the LED surface, and its thickness is the thickness of the LED + 0.1mm~1mm.
（9）层压：将玻璃贴有保护膜面朝上，在覆盖上高温布，使用层压机或真空釜设备对产品层压。(9) Lamination: Put the glass with the protective film facing up, cover it with a high-temperature cloth, and use a laminator or vacuum kettle to laminate the product.
本发明的有益效果：Beneficial effects of the present invention:
1.本发明设计将导电玻璃上制作线路，绑定LED，贴中间层，盖隐私玻璃。电流通过导电膜、导电胶实现点亮LED。母线可以根据天窗玻璃的轮廓（油墨区域），沿边缘向内缩进相应的距离，始终保持母线在油墨区域以内，从而在制成产品后母线为不透明的油墨区域所遮蔽而不可见，保证了美观度。1. The design of the present invention is to make lines on the conductive glass, bind LEDs, paste the middle layer, and cover the privacy glass. The current passes through the conductive film and conductive glue to light up the LED. According to the outline of the skylight glass (ink area), the busbar can be indented by a corresponding distance along the edge, and always keep the busbar within the ink area, so that after the product is made, the busbar is covered by the opaque ink area and cannot be seen, ensuring aesthetics.
本发明以上描述是在汽车天窗玻璃上进而论述的，然而，应当理解不限于在汽车天窗玻璃范围内应用，而是可以在任何期望的领域中进行实施，诸如建筑（含住宅和商业建筑）窗户、电器视窗、和/或用于水下、水面、地面、航空、航天交通工具的透明窗等。如上所述的透明窗对可见光的透过率可以达到0%~90%。The above description of the present invention is further discussed on the automobile sunroof glass, however, it should be understood that it is not limited to the application in the scope of the automobile sunroof glass, but can be implemented in any desired field, such as building (including residential and commercial building) windows , electrical windows, and/or transparent windows for underwater, water surface, ground, aviation, space vehicles, etc. The transmittance of the above-mentioned transparent window to visible light can reach 0%~90%.
本发明解决的技术问题是使LED在玻璃上发光，消除导线影响玻璃透过率降低问题，改进LED绑定方式和简化导线制造工艺流程，提供一种可发光的隐私玻璃。The technical problem solved by the invention is to make the LED emit light on the glass, eliminate the problem of wires affecting the reduction of glass transmittance, improve the LED binding method and simplify the manufacturing process of the wires, and provide a luminous privacy glass.
本发明解决的技术问题是使LED在玻璃上发光，消除导线影响玻璃透过率降低问题，改进LED绑定方式和简化导线制造工艺流程。The technical problem solved by the invention is to make the LED emit light on the glass, eliminate the problem that the wire affects the lowering of the glass transmittance, improve the LED binding method and simplify the manufacturing process of the wire.
附图说明：Description of drawings:
附图1是本发明的成品LED绑定剖视结构示意图。Accompanying drawing 1 is the schematic diagram of the cross-sectional structure of the finished LED binding of the present invention.
附图2是本发明的LED芯片绑定剖视结构示意图。Accompanying drawing 2 is the LED chip bonding cross-sectional structure schematic diagram of the present invention.
具体实施方式：detailed description:
实施例1：Example 1:
一种可发光的隐私镀膜玻璃，其组成包括：LED、玻璃基板1、母线、隐私镀膜2，所述的玻璃基板的上表面均匀的粘贴有导电膜3，所述的玻璃基板的下表面均匀的粘贴有所述的隐私镀膜，所述的玻璃基板上表面通过保护膜4进行覆盖，所述的LED通过导电胶5设置在所述的玻璃基板和所述的导电膜所构成的导电玻璃基板的上表面，所述的LED为成品LED7或LED芯片8中的一种，所述的成品LED或LED芯片通过密封胶6进行密封。A luminous privacy coated glass, which consists of: LED, glass substrate 1, bus bar, privacy coating 2, the upper surface of the glass substrate is uniformly pasted with a conductive film 3, and the lower surface of the glass substrate is uniform The privacy coating is pasted, the upper surface of the glass substrate is covered by a protective film 4, and the LED is arranged on the conductive glass substrate composed of the glass substrate and the conductive film through a conductive glue 5 The LED is one of the finished LED 7 or LED chip 8, and the finished LED or LED chip is sealed by a sealant 6.
实施例2：Example 2:
根据实施例1所述的可发光的隐私镀膜玻璃，所述的成品LED通过绑定机台将所述的成品LED绑定于所述的玻璃基板上，通过点胶机将热固型透明硅胶滴于所述的成品LED上。According to the luminous privacy coated glass described in Embodiment 1, the finished LED is bound to the glass substrate by a binding machine, and the thermosetting transparent silicone is glued by a dispenser. Drop on said finished LED.
实施例3：Example 3:
根据实施例1或2所述的可发光的隐私镀膜玻璃，所述的LED芯片在预绑定的两侧所述的导电膜上镀上金属层9，所述的金属层长宽小于50um*50um，所述的LED芯片通过绑定机台以所述的金属层在预固晶区域画上导电胶，将所述的LED芯片使绑定于所述的玻璃基板上，通过点胶机将热固型透明硅胶滴于所述的LED芯片上，将金线10、所述的LED芯片均完全密封于硅胶内。According to the luminous privacy coated glass described in embodiment 1 or 2, the metal layer 9 is plated on the conductive film on both sides of the pre-bound LED chip, and the length and width of the metal layer are less than 50um* 50um, the LED chip is drawn with conductive glue on the pre-bonding area with the metal layer through the bonding machine, and the LED chip is bound to the glass substrate, and the Thermosetting transparent silica gel is dropped on the LED chip, and the gold wire 10 and the LED chip are completely sealed in the silica gel.
实施例4：Example 4:
根据实施例1或2或3所述的可发光的隐私镀膜玻璃，所述的导电膜为透明导电氧化物膜层为FTO、ITO、AZO、ATO、IZO、GZO和LaNiO3中的一种或为金属网格或纳米银线充当导体。According to the luminous privacy coated glass described in embodiment 1 or 2 or 3, the conductive film is one of FTO, ITO, AZO, ATO, IZO, GZO and LaNiO3 or is Metal grids or nanosilver wires act as conductors.
实施例5：Example 5:
根据实施例1或2或3或4所述的可发光的隐私镀膜玻璃，所述的隐私镀层为金属膜或金属氧化薄膜。According to the luminous privacy coated glass described in embodiment 1 or 2 or 3 or 4, the privacy coating is a metal film or a metal oxide film.
实施例6：Embodiment 6:
根据实施例1或2或3或4或5所述的可发光的隐私镀膜玻璃，所述的母线为导电胶或银浆或银胶或金属箔带，所述的金属箔带外表设置镀锡层，表面设置金属线接头。According to the luminous privacy coated glass described in embodiment 1 or 2 or 3 or 4 or 5, the bus bar is conductive glue or silver paste or silver glue or metal foil strip, and the outer surface of the metal foil strip is provided with tin plating Layer, the surface is provided with metal wire joints.
实施例7：Embodiment 7:
根据实施例1或2或3或4或5或6所述的可发光的隐私镀膜玻璃，所述的保护膜为PVB或EVA，其厚度范围1mm—5mm，所述的导电玻璃方电阻是1~100欧/方。According to the luminous privacy coated glass described in embodiment 1 or 2 or 3 or 4 or 5 or 6, the protective film is PVB or EVA, its thickness ranges from 1 mm to 5 mm, and the square resistance of the conductive glass is 1 ~100 Euro/square.
实施例8：Embodiment 8:
根据实施例1或2或3或4或5或6或7所述的可发光的隐私镀膜玻璃，所述的导电玻璃上含有线路，线路使用激光划刻、蚀刻或掩模镀膜法制作，所述的线路，根据加载电压与LED额定电流电压，计算出线路所需总电阻，在根据电阻公式，计算线路宽度，90°转角按二分之一电阻计算。母线与金属线接头可根据设计而定。According to the luminous privacy coated glass described in embodiment 1 or 2 or 3 or 4 or 5 or 6 or 7, the conductive glass contains lines, and the lines are made by laser scribing, etching or mask coating method. For the circuit described above, calculate the total resistance required by the circuit according to the loading voltage and the rated current and voltage of the LED, and then calculate the circuit width according to the resistance formula, and calculate the 90° corner as one-half of the resistance. The bus bar and metal wire connector can be determined according to the design.
实施例9：Embodiment 9:
本新型一种可发光的隐私玻璃，包括一片玻璃基板、一面镀导电膜，另一面镀隐私膜，导电膜面上还包括LED和母线。The novel luminous privacy glass comprises a glass substrate, one side is coated with a conductive film, and the other side is coated with a privacy film. The surface of the conductive film also includes LEDs and busbars.
方案一：成品LED绑定Option 1: Finished LED Binding
（1）镀膜：玻璃为基板，使用真空镀膜等镀膜方式玻璃镀上导电膜，使玻璃导电，在将玻璃另一表面镀上隐私膜，隐私膜透过率根据产品设计。(1) Coating: Glass is used as the substrate, and vacuum coating and other coating methods are used to coat the glass with a conductive film to make the glass conductive, and the other surface of the glass is coated with a privacy film. The transmittance of the privacy film is based on the product design.
（2）制作电路：将设计好的电路使用激光划刻、蚀刻或掩模镀膜法制作于导电玻璃上。(2) Make the circuit: Make the designed circuit on the conductive glass by laser scribing, etching or mask coating.
（3)母线制作：根据设计，使用导电胶或银浆利用印刷方式制作母线；或使用金属箔带制作母线。并制作金属线接头。(3) Busbar production: According to the design, use conductive glue or silver paste to make busbars by printing; or use metal foil tapes to make busbars. And make metal wire joints.
（4）绑定：使用绑定机台将成品LED绑定于制作好线路的玻璃上。(4) Binding: Use a binding machine to bind the finished LED to the glass with the circuit made.
（5）点胶封装：使用点胶机将热固型透明硅胶滴于成品LED上，使LED完全密封于硅胶内，起保护作用。(5) Dispensing encapsulation: Use a dispensing machine to drop thermosetting transparent silica gel on the finished LED, so that the LED is completely sealed in the silica gel for protection.
（6)贴保护膜：将保护膜（PVB或EVA）完全贴在贴有LED面的导电玻璃膜面上，其厚度为LED厚度+0.1mm~1mm。(6) Paste the protective film: Paste the protective film (PVB or EVA) completely on the conductive glass film surface with the LED surface, and its thickness is the thickness of the LED + 0.1mm~1mm.
（7)层压：将玻璃贴有保护膜面朝上，在覆盖上高温布，使用层压机或真空釜设备对产品层压。(7) Lamination: Put the glass with the protective film facing up, cover it with a high-temperature cloth, and use a laminator or vacuum kettle to laminate the product.
方案二：LED芯片绑定Solution 2: LED Chip Binding
（1）镀膜：玻璃为基板，使用真空镀膜等镀膜方式玻璃镀上导电膜，使玻璃导电，在将玻璃另一表面镀上隐私膜，隐私膜透过率根据产品设计。(1) Coating: Glass is used as the substrate, and vacuum coating and other coating methods are used to coat the glass with a conductive film to make the glass conductive, and the other surface of the glass is coated with a privacy film. The transmittance of the privacy film is based on the product design.
（2）制作电路：将设计好的电路使用激光划刻、蚀刻或掩模镀膜法制作于导电玻璃上。(2) Make the circuit: Make the designed circuit on the conductive glass by laser scribing, etching or mask coating.
（3）PAD点制作：根据LED位置，在预绑定的两侧导电膜上镀上金属层，金属层长宽小于50um*50um。(3) PAD point production: According to the position of the LED, a metal layer is plated on the conductive film on both sides of the pre-binding, and the length and width of the metal layer are less than 50um*50um.
（4）母线制作：根据设计，使用导电胶或银浆利用印刷方式制作母线；或使用金属箔带制作母线。并制作金属线接头。(4) Busbar production: According to the design, use conductive glue or silver paste to make busbars by printing; or use metal foil tapes to make busbars. And make metal wire joints.
（5）绑定：使用绑定机台以金属层为PR，在预固晶区域画上导电胶，将LED芯片使绑定于导电玻璃上。(5) Binding: Use a bonding machine to use the metal layer as PR, draw conductive glue on the pre-bonding area, and bind the LED chip to the conductive glass.
（6）打线：使用打线机台，将LED芯片与导电玻璃连通。(6) Wire bonding: use a wire bonding machine to connect the LED chip with the conductive glass.
（7）点胶封装：使用点胶机将热固型透明硅胶滴于LED芯片上，将金线、LED芯片均完全密封于硅胶内，起保护作用。(7) Dispensing encapsulation: Use a dispensing machine to drop thermosetting transparent silica gel on the LED chip, and completely seal the gold wire and LED chip in the silica gel for protection.
（8）贴保护膜：将保护膜（PVB或EVA）完全贴在贴有LED面的导电玻璃膜面上，其厚度为LED厚度+0.1mm~1mm。(8) Paste the protective film: Paste the protective film (PVB or EVA) completely on the conductive glass film surface with the LED surface, and its thickness is the thickness of the LED + 0.1mm~1mm.
（9）层压：将玻璃贴有保护膜面朝上，在覆盖上高温布，使用层压机或真空釜设备对产品层压。(9) Lamination: Put the glass with the protective film facing up, cover it with a high-temperature cloth, and use a laminator or vacuum kettle to laminate the product.
实施例10：Example 10:
以上内容对本发明所述的一种可发光的隐私玻璃进行了描述，但是本发明不受以上描述的具体实施方式内容和相应实施例的局限，所以凡根据本发明的技术要点进行任何改进、等同修改和替换等，均属于本发明保护的范围。The above content describes a kind of luminous privacy glass according to the present invention, but the present invention is not limited by the specific implementation details and corresponding examples described above, so any improvement or equivalent Modifications and substitutions, etc., all belong to the protection scope of the present invention.
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610150155.2ACN105633249A (en) | 2016-03-16 | 2016-03-16 | Luminescable privacy coating film glass and binding method |
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610150155.2ACN105633249A (en) | 2016-03-16 | 2016-03-16 | Luminescable privacy coating film glass and binding method |
| Publication Number | Publication Date |
|---|---|
| CN105633249Atrue CN105633249A (en) | 2016-06-01 |
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610150155.2APendingCN105633249A (en) | 2016-03-16 | 2016-03-16 | Luminescable privacy coating film glass and binding method |
| Country | Link |
|---|---|
| CN (1) | CN105633249A (en) |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106927698A (en)* | 2016-09-18 | 2017-07-07 | 深圳市致竑光电有限公司 | The manufacture method and LED transparent luminescent glass of LED transparent luminescent glass |
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN1933930A (en)* | 2004-03-25 | 2007-03-21 | 世和P&C有限公司 | privacy protection film |
| CN101320698A (en)* | 2008-07-07 | 2008-12-10 | 上海耀皮建筑玻璃有限公司 | Production technique of LED luminous laminated glass |
| CN201362648Y (en)* | 2009-01-16 | 2009-12-16 | 中国南玻集团股份有限公司 | Manufacturing system of transparent conducting film glass |
| CN103328207A (en)* | 2011-01-21 | 2013-09-25 | 法国圣戈班玻璃厂 | glowing glass |
| CN203433231U (en)* | 2013-09-12 | 2014-02-12 | 北京众智同辉科技有限公司 | Plastic liquid crystal membrane for membrane sticking |
| CN203812907U (en)* | 2013-05-17 | 2014-09-03 | 东芝照明技术株式会社 | Lighting module |
| CN104979462A (en)* | 2015-07-22 | 2015-10-14 | 厦门腾月光电科技有限公司 | 360-degree transparent LED glass and preparation method thereof |
| CN205508866U (en)* | 2016-03-16 | 2016-08-24 | 成都固泰电子有限责任公司 | Privacy coated glass that can give out light |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1933930A (en)* | 2004-03-25 | 2007-03-21 | 世和P&C有限公司 | privacy protection film |
| CN101320698A (en)* | 2008-07-07 | 2008-12-10 | 上海耀皮建筑玻璃有限公司 | Production technique of LED luminous laminated glass |
| CN201362648Y (en)* | 2009-01-16 | 2009-12-16 | 中国南玻集团股份有限公司 | Manufacturing system of transparent conducting film glass |
| CN103328207A (en)* | 2011-01-21 | 2013-09-25 | 法国圣戈班玻璃厂 | glowing glass |
| CN203812907U (en)* | 2013-05-17 | 2014-09-03 | 东芝照明技术株式会社 | Lighting module |
| CN203433231U (en)* | 2013-09-12 | 2014-02-12 | 北京众智同辉科技有限公司 | Plastic liquid crystal membrane for membrane sticking |
| CN104979462A (en)* | 2015-07-22 | 2015-10-14 | 厦门腾月光电科技有限公司 | 360-degree transparent LED glass and preparation method thereof |
| CN205508866U (en)* | 2016-03-16 | 2016-08-24 | 成都固泰电子有限责任公司 | Privacy coated glass that can give out light |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106927698A (en)* | 2016-09-18 | 2017-07-07 | 深圳市致竑光电有限公司 | The manufacture method and LED transparent luminescent glass of LED transparent luminescent glass |
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| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | Application publication date:20160601 | |
| WD01 | Invention patent application deemed withdrawn after publication |