Specific embodiment
In order to make the object, technical scheme and advantages of the embodiment of the invention clearer, below in conjunction with the embodiment of the present inventionIn attached drawing, technical scheme in the embodiment of the invention is clearly and completely described, it is clear that described embodiment isA part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, those of ordinary skill in the artEvery other embodiment obtained without making creative work, shall fall within the protection scope of the present invention.
As Figure 1-Figure 2, the present embodiment semiconductor refrigerating equipment, including refrigeration equipment cabinet, wherein refrigeration equipmentInclude the metal liner 100 that shell 101 at least two is spaced each other with cabinet, is provided with one in each metal liner 100Semiconductor refrigerating mould group, the semiconductor refrigerating mould group include that semiconductor refrigerating module 200, cold end radiator 300 and hot end dissipateHot device 400, the cold end radiator 300 are connected to the cold end of the semiconductor refrigerating module 200, the hot-side heat dissipation device 400It is connected to the hot end of the semiconductor refrigerating module 200, the cold end radiator 300 is also connect with the metal liner 100.
Specifically, the present embodiment semiconductor refrigerating equipment includes multiple metal liners 100 and is arranged outside metal liner 100There is shell 101, insulating layer is provided between shell 101 and metal liner 100, metal liner 100 forms storage space for coldHiding or frozen goods.Wherein, each metal liner 100 is corresponding with semiconductor refrigerating mould group, and semiconductor refrigerating mould group will be correspondingFreeze metal liner 100 in storage space, and in semiconductor refrigerating mould group semiconductor refrigerating module 200 cold end generate it is coldAmount is transmitted in metal liner 100 by cold end radiator 300, and rapidly cooling capacity will be discharged into it by metal liner 100Freeze in the storage space of formation, and the heat that the hot end of semiconductor refrigerating module 200 generates passes through hot-side heat dissipation device 400Heat dissipation.And be arranged since multiple metal liners 100 are spaced, meanwhile, each metal liner 100 is by corresponding semiconductor refrigerating module200 carry out independent refrigeration, in actual use, can be freezed according to the article stored in different metal liner 100It is required that it is different, the cooling capacity that corresponding semiconductor refrigerating module 200 discharges adaptive capacity is controlled, realizes multi-temperature zone refrigeration.
Wherein, thermal insulating connectors 102, the two neighboring metal are provided between the two neighboring metal liner 100Liner 100 is linked together by the thermal insulating connectors 102.Specifically, as shown in Figure 3-Figure 5,102 1 side of thermal insulating connectorsFace, which can play, links together two adjacent metal liners 100, on the other hand can also be subtracted by thermal insulating connectors 102Heat transfer occurs less or between the two neighboring metal liner 100 of blocking, so that each metal liner 100 is formed by warm areaIt is more independent.Thermal insulating connectors 102 can use various ways, such as: the thermal insulating connectors 102 are provided with backwards to arrangementSlot 1021, the metal liner 100 is inserted in the slot 1021, will be in metal when assembling two metal liners 100The edge of gallbladder 100 is inserted into slot 1021, realizes that two metal liners 100 link together, and metal liner 100 is inserted in instituteIt can be fastened using modes such as gluing, screw fixations after stating in slot 1021, it is preferred that the metal liner 100 is installed on slottingIn slot 1021, specifically, the end that the metal liner 100 is inserted in the slot 1021 is provided with barb structure 1001, it is describedThe side wall of slot 1021 is provided with the fixture block 1022 with the barb structure 1001 cooperation, and the barb structure 1001 is stuck in describedOn fixture block 1022.In addition, horizontal arrangement can be used between multiple metal liners 100 in the present embodiment, it is preferred that Duo GesuoMetal liner 100 is stated from top to bottom to be stacked, and semiconductor refrigerating module 200 is respectively positioned on the metal liner of topmostOn 100.Specifically, semiconductor refrigerating module 200 is uniformly mounted in the metal liner 100 of topmost, and in order to facilitate the installation ofEqual semiconductor refrigerating module 200,100 are provided with mounting plate 103, the semiconductor system in the metal liner of topmostCold module 200 is fixed on the mounting plate 103.Mounting plate 103 can be supported using heat-barrier material, to avoid metal liner100 by occurring heat transmitting between mounting plate 103 and semiconductor refrigerating module 200, and be also provided with and add in mounting plate 103Strong plate 1031, enhances the structural strength of mounting plate 103 by stiffening plate 1031.Metal liner 100 can be that cross section is U-shapedEnclosing structure, the metal liner 100 positioned at topmost also have top cover, and the metal liner 100 positioned at topmost is gone backWith bottom plate, to realize that multiple metal liners 100 form the structure of storage spaces perforation, and thermal insulating connectors 102 are reduced orIt blocks and heat transfer occurs between two neighboring metal liner 100, so that forming different warm areas in 100 region of different metal liner.And in order to avoid draining, drainage hole (not shown) is additionally provided on the bottom plate of the metal liner 100 of bottom.
In actual use, the existing equipment using semiconductor refrigerating generallys use cooling fin and carries out forced convertion,With by cooling capacity by being dispersed into storage space, and in order to enable the heat of 200 cold end of semiconductor refrigerating module is more effectively rightStorage space freezes, and ensures being evenly distributed for cooling capacity, the cold end heat dissipation as shown in Fig. 6-Fig. 9, in the present embodimentDevice 300 includes the first heat carrier 31 and the first heat pipe of Duo Gen 32, is formed with cavity (not shown), institute in first heat carrier 31The sealing of the first heat pipe 32 is stated to be inserted in first heat carrier 31 and be connected to the cavity；First heat carrier 31 is attached to instituteThe cold end of semiconductor refrigerating module 200 is stated, first heat pipe 32 is attached in the metal liner 100, and the first heat pipe 32 passes throughFirst heat carrier 31 is realized to be thermally connected with the cold end of semiconductor refrigerating module 200.Specifically, semiconductor refrigerating module 200 is coldThe cooling capacity that end generates passes to the first heat pipe 32 by the first heat carrier 31, and the first heat pipe 32 can quickly disperse cooling capacityOnto metal liner 100, cooling capacity directly can be discharged into its internal storage space formed and freezed by metal liner 100,Effectively raise refrigerating efficiency, avoid semiconductor refrigerating module 200 cold end generate cooling capacity using cooling fin carry out it is scatteredIt is cold and the low phenomenon of refrigerating efficiency occur.Wherein, multiple jacks 311, first heat pipe 32 are offered on the first heat carrier 31Sealing is inserted in the jack 311, and the first through hole 312, first heat pipe are provided between the two neighboring jack 31132 ends being inserted in the jack 311 offer the second through hole (not shown), and first through hole is passed through with described secondThrough-hole, which is interconnected, forms channel, and the channel is the cavity.During cold end 300 actual assembled of radiator, the first heatPipe 32 is inserted into jack 311, the position of the second through hole in the depth and the first heat pipe 32 by rationally designing jack 311It sets, so that the first through hole 312 is connected to form channel with the second through hole, alternatively, during actual assembled, the first heat carrierIt is first provided with jack 311 on 31, after the first heat pipe 32 is inserted into jack 311, is opened from the side wall of the first heat carrier 31Through hole equipped with perforation the first heat carrier 31 and the first heat pipe 32, to form cavity in the first heat carrier 31, then, then willFor in gas-liquid phase transition refrigerant filling in heat pipe to the first heat pipe 32 and cavity, so that the first heat pipe 32 has heat pipe speed heatPerformance.And can quickly enter in the first heat pipe 32 and freeze for the ease of the refrigerant after liquefaction, described firstThe lower end of heat carrier 31 offers the jack 311.Wherein, switchable filling is additionally provided on first heat carrier 31Mouth 313, the filler 313 is connected to the cavity, can be easily perfused and be made into the first heat pipe 32 by filler 313Cryogen, and in actual use, in order to avoid leading to semiconductor refrigerating module 200 due to being not normally functioning because of failureThe excessive generation bombing of pressure in first heat pipe 32 is additionally provided with safe pressure valve 314, the safety pressure on the first heat carrier 31Power valve 314 is connected to the cavity, and after the pressure in the first heat pipe 32 is more than setting value, safe pressure valve 314 releases openingPower is bled off pressure, to ensure using safe.For the refrigerant of perfusion, needing to be perfused refrigerant working medium in the first heat pipe 32 can be iceCase refrigeration system often uses refrigerant, such as R134a, R600a, CO2, and the selection of specific refrigerant working medium can be according to versatilityIt is required that, system pressure requirements, cooling capacity delivery request, working medium physical property, the combined factors such as environmental protection determine.Preferably, in order to reduceThe quantity of one heat pipe 32, meanwhile, meet cold scattering and uniformly require, cold end radiator 300 includes two first heat pipes 32, instituteIt states and is opened up on the first heat carrier 31 there are four the jack 311, the both ends of first heat pipe 32 are inserted in corresponding describedIn jack 311；Wherein the bending of one first heat pipe 32 is distributed in the both sides of the metal liner 100, another first heat pipe32 bendings are distributed in the back of the metal liner 100.Specifically, the both ends of the first heat pipe 32 are inserted in jack 311, makeThe cold scattering ability that the first heat pipe 32 realizes two heat pipes is obtained, and wherein the bending of one first heat pipe 32 is distributed in metal liner 100Both sides, another first heat pipe 32 are bent the back for being distributed in metal liner 100, during passing through the first 32 cold scattering of heat pipe,The first heat pipe 32 for being bent distribution and the contact area of metal liner 100 are bigger, so that metal liner 100 can moreEven acquisition cooling capacity, meanwhile, the both sides and back of metal liner 100 are distributed with the first heat pipe 31 and carry out cold scattering, so that goldenBelong to the cold scattering surface that liner 100 forms encircling type, so that it is guaranteed that internal storage space refrigeration is uniform.And in order to enable the first heatPipe 31, which can quickly extend cooling capacity from its end, to be transmitted, and the first heat pipe 32 from its both ends, prolong inclined downward respectively by bendingStretch, specifically, the refrigerant in the first heat pipe 32 is gasificated into gas being liquefied as liquid after being cooled when heated, pass through byFirst heat pipe 32 is extended by the way of bending inclined downward, and during the first 32 cold scattering of heat pipe, liquefied refrigerantIt is thermally conductive that the refrigerant that can be flowed downward, and gasify under the effect of gravity can rise to first along inclined first heat pipe 32Freezing in the cavity that body 31 is formed, wherein the first heat pipe 32 will form straight pipe and bend loss after bending extends, forThe tilt angle of the straight pipe of first heat pipe 32 are as follows: the pipeline diameter in millimeters of the first heat pipe 32 (is hereinafter referred to as managedDiameter) it is configured to the 1.2-1.3 of inclination angle theta relative to horizontal direction more than or equal to first heat pipe 32 as unit of spendingTimes, in actual production, the straight pipe of each first heat pipe 32 is arranged with the angle tilt for being with respect to the horizontal plane in 10 ° to 70 °To guarantee that liquid refrigerant flows in it by free gravity, to improve the cold scattering efficiency of the first heat pipe 32.In addition, for listThe first heat pipe of root 32, the both ends of the first heat pipe 32 tilt down bending in symmetric mode and extend.
And during needing semiconductor refrigerating module 200 being installed to metal liner 100, in metal liner 100Mounting plate 103 is formed with card slot 1032 again, and the first heat carrier 31 is inserted in card slot 1032, and semiconductor refrigerating module 200 andHeat-conducting silicone grease is set between one heat carrier 31 and is installed on mounting plate 103 by the first heat carrier 31.Preferably, semiconductor systemThe periphery of cold module 200 is cased with sealing ring 201, and auxiliary mounting deck 202, auxiliary mounting deck are further fixedly arranged on mounting plate 103Installing port 2021 is provided on 202, sealing ring 201 is located in installing port 2021, passes through sealing ring 201 and auxiliary mounting deck 202Stronger semiconductor refrigerating module 200 can be subjected to installation fixation, meanwhile, sealing ring 201 again can be by semiconductor systemThe peripheral sealing of cold module 200 avoids cooling capacity from scattering and disappearing from the periphery of semiconductor refrigerating module 200.And in order to the first heat pipe 32It is positioned, first heat pipe, 32 stress when carrying out foaming processing before to metal liner 100 and shell 101 is avoided to shift, theThe bending place of one heat pipe 32 is provided with locating piece 104, and the locating piece 104 is fixed in the metal liner 100.First heat pipe32 bending place is positioned by locating piece 104, and locating piece 104 is able to maintain the bending state of the first heat pipe 32, so thatIn foaming process and routine use, the bending state of the first heat pipe 32 is remained unchanged, while avoiding the occurrence of the shifting of the first heat pipe 32Position.Wherein, locating piece 104 includes locating piece 1041 and connecting column 1042, and the locating piece 1041 is connected to the connecting columnOn 1042, the connecting column 1042 is fixed in the metal liner 100, and first heat pipe 32 is wound on the connecting column 1042It goes up and is located between the locating piece 1041 and the metal liner 100, in an assembling process, the first heat pipe 32 is wound on connecting column1042 bendings, and the bending place of the first heat pipe 32 is clipped between locating piece 1041 and the metal liner 100, for locating pieceConnection between 104 and metal liner 100, riveting has riveting nut 105 in metal liner 100, and the locating piece 104 offers logicalHole 1043, the riveting nut 105 are located in the through-hole 1043, and screw 106 is inserted in the through-hole 1043 and is threaded in instituteIt states in riveting nut 105.
In actual use, the existing equipment using semiconductor refrigerating generallys use fan to semiconductor refrigeration module200 hot end carries out wind-cooling heat dissipating, need to consume a large amount of electric energy and fan operating noise is more serious always, such as Fig. 2 and figureShown in 10, the hot-side heat dissipation device 400 in the present embodiment includes the second heat carrier 41, more second heat pipes 42 and cooling fin group 43,Second heat pipe 42 is connected on second heat carrier 41, and the cooling fin group 43 is connected on second heat pipe 42.Specifically, the second heat carrier 41 is attached to the hot end of semiconductor refrigerating module 200, and cooling fin group 43 is attached on shell 101, is partly ledThe heat that the hot end of body refrigeration module 200 generates passes to the second heat pipe 42 by the second heat carrier 41, and the second heat pipe 42 canQuickly transfer heat in cooling fin group 43, and the radiator of larger area can be made in cooling fin group 43 as needed,Cooling fin group 43 can carry out rapid cooling to the heat that the second heat pipe 42 transmits using itself biggish heat dissipation area, thus nothingIt need to directly be radiated to the hot end of semiconductor refrigeration module 200 by fan.Wherein, in order to adequately utilize each cooling finGroup 43 radiates, and third heat pipe 44 is also connected on the second heat carrier 41, and described the in any hot-side heat dissipation device 400Three heat pipes 44 are also connect with the cooling fin group 43 in hot-side heat dissipation device 400 described in remaining.In actual use, when eachWhen the heat that a work of semiconductor refrigerating module 200 generates is identical, each semiconductor refrigerating module 200 passes through respective cooling finGroup 43 radiates, and when the heat dissipation capacity of some semiconductor refrigerating module 200 is larger, it is connected to the semiconductor refrigerating moduleSecond heat carrier 41 of 200 heats transfers heat to that other semiconductor refrigerating modules 200 are corresponding to be dissipated by third heat pipe 44In backing group 43, so as to more efficiently be radiated using whole cooling fin groups 43；In the design process, each secondHeat carrier 41 can be thermally connected by third heat pipe 44 and remaining cooling fin group 43, for dissipating for whole cooling fin groups 43Thermal energy power, to realize natural cooling.And in order to enhance the draught capacity of cooling fin group 43, cooling fin group 43 radiates including multi-discFin 431 is provided with ventilation hole 432 on the radiating fin 431, multiple 432 shapes of ventilation hole on same axisAt air duct, cooling fin group 43 also utilizes the formation of ventilation hole 432 other than being aerated using the interval between radiating fin 431Air duct is aerated, so as to effectively enhance the draught capacity of cooling fin group 43.And work as each semiconductor refrigerating module 200It is run under relatively high power, in order to meet the requirement of high-power heat-dissipation, fan 45 is arranged side by side and is located at cooling fin group 43The side in air duct, the direction outlet air that fan 45 extends towards air duct, the wind that fan 45 is blown out enter in air duct to accelerate air ductThe flowing of apoplexy, and since hot-air is gentlier easy to flow upward, the wind to flow in ventilation hole 432 is incited somebody to action so that hot-air is twoVortex flow between a radiating fin 431 is radiated using the area of radiating fin 431 to the greatest extent.Such as Figure 10-Figure 12It is shown, in order to more fully be radiated using radiating fin 431, other than being located at the radiating fin 431 in outside, remaining heat dissipationFin 431 opens up jagged 433, and the notch 433 on sustained height position forms auxiliary air duct, and radiating fin 431 is verticalIt arranges, cover 46 is additionally provided in cooling fin group 43, and the fan 45 is also located at the inside in auxiliary air duct and is fixed on cover 46On, cover 46 covers in cooling fin group 43, and the lower end of cover 46 forms air inlet, and the upper end of cover 46 forms outlet airMouthful, fan 45 start after to auxiliary air duct in dry, accelerate radiating fin 431 between air flowing, and hot-air rise fromAir outlet output so that extraneous cold air enters between radiating fin 431 from the air inlet of bottom, enable cold wind fromUnder in supreme motion process, by the whole surface of radiating fin 431, to make full use of the heat-sinking capability of radiating fin 431；AndPosition on cover 46 for installing fan 45 is also provided with ventilation opening 461, fan 45 by ventilation opening 461 by extraneous wind intoOne step is introduced into radiating fin 431.Wherein, the two sides of each second heat carrier 41 are respectively arranged with cooling fin group 43, andFan 45 is located between two cooling fin groups 43 simultaneously.And connect for the ease of heat pipe with the second heat carrier 41, as shown in figure 13,Multiple mounting holes 410 are formed on second heat carrier 41, second heat pipe 42 and the third heat pipe 44 are inserted in corresponding instituteIt states in mounting hole 410, heat pipe is inserted in the contact area being capable of increasing between the second heat carrier 41 in mounting hole 410, improves heatConduction efficiency；And the second heat carrier 41 includes that reeded briquetting 411 is arranged in two surfaces, two briquettings 411 are fixed to be connectedIt being connected together, corresponding two grooves form the mounting hole 410, the second heat carrier 41 is formed using two briquettings 411,It can be convenient for the assembly and connection between heat pipe and the second heat carrier 41.
Finally, it should be noted that the above embodiments are merely illustrative of the technical solutions of the present invention, rather than its limitations；AlthoughPresent invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that: it still may be usedTo modify the technical solutions described in the foregoing embodiments or equivalent replacement of some of the technical features；And these are modified or replaceed, technical solution of various embodiments of the present invention that it does not separate the essence of the corresponding technical solution spirit andRange.