技术领域technical field
本发明涉及通信领域，尤其涉及一种电路板连接组件及移动终端。The invention relates to the communication field, in particular to a circuit board connection assembly and a mobile terminal.
背景技术Background technique
由于科技的发展，智能移动终端设备的功能越来越多，电路板上的布线也越来越复杂。Due to the development of science and technology, smart mobile terminal equipment has more and more functions, and the wiring on the circuit board is also becoming more and more complicated.
目前，由于柔性线路板本身的易弯折特性，通常需要在柔性电路板上做补强，这样使得在柔性电路板(FPC)上进行布线时，由于做了补强的位置不能够进行布线，同时也不能布器件与其他元件连接，故而使得柔性线路板上的布线体积变小。At present, due to the easy bending characteristics of the flexible circuit board itself, it is usually necessary to make reinforcements on the flexible circuit board, so that when wiring on the flexible circuit board (FPC), the wiring cannot be performed due to the reinforced position. At the same time, the device cannot be connected with other components, so the wiring volume on the flexible circuit board is reduced.
然而，当柔性电路板上进行大密度布线以连接电子元器件时，通常为了满足布线要求，多采用软硬结合板的形式，然后同时在柔性电路板以及硬板上进行布线，而此举由于加工工序较为复杂，故而成本较高，不利于控制生产成本。However, when large-density wiring is carried out on the flexible circuit board to connect electronic components, in order to meet the wiring requirements, the form of a flexible and rigid board is usually used, and then the wiring is carried out on the flexible circuit board and the hard board at the same time. The processing procedure is more complicated, so the cost is higher, which is not conducive to controlling the production cost.
发明内容Contents of the invention
本发明实施例所要解决的技术问题在于，提供一种满足大密度布线要求、加工工序简单并且成本较低电路板连接组件及移动终端。The technical problem to be solved by the embodiments of the present invention is to provide a circuit board connection assembly and a mobile terminal that meet the requirements of large-density wiring, have simple processing procedures, and are relatively low in cost.
为了实现上述目的，本发明实施方式提供如下技术方案：In order to achieve the above object, the embodiment of the present invention provides the following technical solutions:
第一方面，本发明提供一种电路板连接组件，所述电路板连接组件包括印刷电路板以及柔性电路板，所述印刷电路板包括至少两层铜箔层以及至少一层介质层，所述至少两层铜箔层中的每两层之间均夹持一层所述介质层，所述至少两层铜箔层中位于外侧的两个铜箔层上分别设置有若干个第一焊盘以及若干个第二焊盘，并且所述若干个第一焊盘沿其所在的铜箔层的延伸方向依次排列，若干个第二焊盘沿其所在的铜箔层的延伸方向依次排列，所述若干个第一焊盘或第二焊盘用以连接电子元器件，所述柔性电路板上相对应所述若干个第一焊盘或第二焊盘设置有若干个第三焊盘，所述若干个第三焊盘与所述若干个第一焊盘或第二焊盘连接。In a first aspect, the present invention provides a circuit board connection assembly, the circuit board connection assembly includes a printed circuit board and a flexible circuit board, the printed circuit board includes at least two copper foil layers and at least one dielectric layer, the A layer of the dielectric layer is sandwiched between every two layers of the at least two copper foil layers, and a plurality of first pads are respectively arranged on the two outer copper foil layers of the at least two copper foil layers and several second pads, and the several first pads are arranged sequentially along the extending direction of the copper foil layer where they are located, and several second pads are arranged sequentially along the extending direction of the copper foil layer where they are located, so The plurality of first pads or second pads are used to connect electronic components, and the flexible circuit board is provided with a plurality of third pads corresponding to the plurality of first pads or second pads, so The several third pads are connected to the several first pads or the second pads.
结合第一方面，在第一方面的第一种可能的实现方式中，所述铜箔层为四层，分别为依次叠加设置的第一铜箔层、第二铜箔层、第三铜箔层以及第四铜箔层，所述介质层为三层，分别依次夹设于所述铜箔层之间，并且所述第一铜箔层上设置有所述若干个第一焊盘，所述第四铜箔层上设置有所述若干个第二焊盘。With reference to the first aspect, in the first possible implementation manner of the first aspect, the copper foil layer is four layers, which are the first copper foil layer, the second copper foil layer, and the third copper foil layer that are sequentially stacked. Layer and the fourth copper foil layer, the dielectric layer is three layers, respectively sandwiched between the copper foil layers, and the first copper foil layer is provided with the plurality of first pads, so The plurality of second pads are arranged on the fourth copper foil layer.
结合第一方面的第一种可能的实现方式，在第一方面的第二种可能的实现方式中，三层所述介质层上均设置有若干个导通孔，所述若干个导通孔分别用以导通每相邻的两层所述铜箔层。In combination with the first possible implementation of the first aspect, in the second possible implementation of the first aspect, several via holes are provided on each of the three dielectric layers, and the several via holes They are respectively used to connect two adjacent layers of the copper foil layers.
结合第一方面或者第一方面的第一种可能的实现方式，在第一方面的第三种可能的实现方式中，所述电路板连接组件相对应所述若干个第二焊盘设置有若干个电子元器件，所述若干个电子元器件分别与若干个第二焊盘通过表面贴装技术贴装在一起。With reference to the first aspect or the first possible implementation of the first aspect, in a third possible implementation of the first aspect, the circuit board connection assembly is provided with several electronic components, and the plurality of electronic components are respectively mounted together with the plurality of second pads through surface mount technology.
结合第一方面的第一种可能的实现方式，在第一方面的第四种可能的实现方式中，所述若干个第一焊盘以及第二焊盘分别电镀于所述第一铜箔层以及所述第四铜箔层上。With reference to the first possible implementation of the first aspect, in a fourth possible implementation of the first aspect, the plurality of first pads and second pads are respectively electroplated on the first copper foil layer and on the fourth copper foil layer.
结合第一方面的第一种可能的实现方式，在第一方面的第五种可能的实现方式中，所述第一铜箔层上还设置有阻焊层，所述若干个第一焊盘设置于所述阻焊层上。With reference to the first possible implementation of the first aspect, in a fifth possible implementation of the first aspect, a solder resist layer is further provided on the first copper foil layer, and the plurality of first pads set on the solder resist layer.
结合第一方面，在第一方面的第六种可能的实现方式中，所述至少一层介质层为绝缘层，并且所述至少一层介质层的材质为聚丙烯。With reference to the first aspect, in a sixth possible implementation manner of the first aspect, the at least one dielectric layer is an insulating layer, and a material of the at least one dielectric layer is polypropylene.
结合第一方面，在第一方面的第七种可能的实现方式中，所述若干个第一焊盘以及若干个第三焊盘分别通过导电胶压合连接。With reference to the first aspect, in a seventh possible implementation manner of the first aspect, the plurality of first pads and the plurality of third pads are respectively press-fitted and connected by conductive glue.
结合第一方面，在第一方面的第八种可能的实现方式中，所述柔性线路板包括依次叠加设置的基材层、第五铜箔层以及覆盖膜层，所述若干个第三焊盘设于所述第五铜箔层上。With reference to the first aspect, in an eighth possible implementation manner of the first aspect, the flexible circuit board includes a substrate layer, a fifth copper foil layer, and a cover film layer that are stacked in sequence, and the plurality of third solder The disc is disposed on the fifth copper foil layer.
第二方面，本发明还提供了一种移动终端，所述移动终端包括本体以及如上述的电路板连接组件，所述本体上设置有收容腔，所述电路板连接组件容置于所述收容腔内。In the second aspect, the present invention also provides a mobile terminal, the mobile terminal includes a body and the above-mentioned circuit board connection assembly, the body is provided with a housing cavity, and the circuit board connection assembly is accommodated in the housing cavity.
本发明提供的电路板连接组件通过设置印刷电路板包括至少两层铜箔层以及夹设于至少两层铜箔层之间的至少一层介质层，然后在至少两层铜箔层上分别设置若干第一焊盘以及第二焊盘，该第一焊盘或第二焊盘可用以连接电子元器件，从而实现在印刷电路板上进行布置器件。然后在柔性电路板上相对应设置若干个第三焊盘，并且该第三焊盘可与第一焊盘或第二焊盘连接，从而实现将印刷电路板与柔性电路板连接起来。此外，由于印刷电路板为至少两层板，因此能够进行大密度布线以及布置器件，因此，柔性电路板上无需布置器件，大大地节省了柔性电路板的空间，同时，也由于柔性电路板与印刷电路板连接，故而柔性电路板无需额外设置补强，故而能够减少生产成本。The circuit board connection assembly provided by the present invention comprises at least two layers of copper foil layers and at least one dielectric layer interposed between at least two layers of copper foil layers by setting the printed circuit board, and then respectively disposing on the at least two layers of copper foil layers Several first soldering pads and second soldering pads, the first soldering pads or the second soldering pads can be used to connect electronic components, so as to realize the arrangement of devices on the printed circuit board. Then several third pads are correspondingly arranged on the flexible circuit board, and the third pads can be connected with the first pad or the second pad, so as to realize the connection between the printed circuit board and the flexible circuit board. In addition, because the printed circuit board has at least two layers, it is possible to carry out large-density wiring and arrange devices. Therefore, there is no need to arrange devices on the flexible circuit board, which greatly saves the space of the flexible circuit board. At the same time, because the flexible circuit board and The printed circuit board is connected, so the flexible circuit board does not need additional reinforcement, so the production cost can be reduced.
附图说明Description of drawings
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings that need to be used in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description are only These are some embodiments of the present invention. Those skilled in the art can also obtain other drawings based on these drawings without creative work.
图1是本发明实施例提供的电路板连接组件的结构示意图；Fig. 1 is a schematic structural diagram of a circuit board connection assembly provided by an embodiment of the present invention;
图2是本发明实施例提供的电路板连接组件上布置器件的结构示意图。FIG. 2 is a schematic structural diagram of devices arranged on a circuit board connection assembly provided by an embodiment of the present invention.
具体实施方式detailed description
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
请一并参阅图1至图2，本发明实施例提供的一种移动终端，包括本体(图中未标示)以及电路板连接组件100，所述本体上设置有收容腔，所述电路板连接组件100容置于所述收容腔内。Please refer to Figures 1 to 2 together. A mobile terminal provided by an embodiment of the present invention includes a body (not shown in the figure) and a circuit board connection assembly 100. The body is provided with a housing cavity, and the circuit board connection The component 100 is accommodated in the receiving chamber.
本实施例中，所述移动终端可为但不限于手机、平板、电脑或者个人数字助理(PDA)等。本发明优选地以所述移动终端为手机为例进行说明。In this embodiment, the mobile terminal may be, but not limited to, a mobile phone, a tablet, a computer, or a personal digital assistant (PDA). The present invention is preferably described by taking the mobile terminal as an example.
所述本体可为手机本体，包括壳体、显示组件以及触控组件等，所述壳体上设置有所述收容腔，所述显示组件以及所述触控组件均收容于所述收容腔内，并且所述显示组件以及所述触控组件均与所述电路板连接组件100电连接，以实现所述显示组件的显示功能以及所述触控组件的触控功能。The body can be a mobile phone body, including a housing, a display component, and a touch control component. The housing is provided with the housing cavity, and the display component and the touch control component are both accommodated in the housing cavity. , and both the display component and the touch control component are electrically connected to the circuit board connection component 100, so as to realize the display function of the display component and the touch control function of the touch control component.
所述电路板连接组件100包括印刷电路板10以及柔性电路板20。所述印刷电路板10包括至少两层铜箔层12以及至少一层介质层13。所述至少两层铜箔层12中的每两层之间均夹持一层所述介质层13。所述至少两层铜箔层12中位于外侧的两个铜箔层12上分别设置有若干个第一焊盘121以及若干个第二焊盘122，并且所述若干个第一焊盘121沿其所在的铜箔层12的延伸方向依次排列。所述若干个第二焊盘122沿其所在的铜箔层12的延伸方向依次排列设置。所述若干个第一焊盘121或第二焊盘122用以连接电子元器件。所述柔性电路板20上相对应所述若干个第一焊盘121或第二焊盘122设置有若干个第三焊盘21，所述若干个第三焊盘21与所述若干个第一焊盘121或第二焊盘122连接。The circuit board connection assembly 100 includes a printed circuit board 10 and a flexible circuit board 20 . The printed circuit board 10 includes at least two copper foil layers 12 and at least one dielectric layer 13 . A layer of the dielectric layer 13 is sandwiched between every two layers of the at least two copper foil layers 12 . A plurality of first pads 121 and a plurality of second pads 122 are respectively provided on the two outer copper foil layers 12 of the at least two copper foil layers 12, and the plurality of first pads 121 are arranged along the The extension directions of the copper foil layers 12 where they are located are arranged in sequence. The plurality of second solder pads 122 are arranged sequentially along the extending direction of the copper foil layer 12 where they are located. The plurality of first pads 121 or second pads 122 are used to connect electronic components. The flexible circuit board 20 is provided with several third pads 21 corresponding to the several first pads 121 or the second pads 122, and the several third pads 21 are connected to the several first pads 122. The pad 121 or the second pad 122 is connected.
本发明提供的电路板连接组件100，通过将印刷电路板10设置成至少两层板的结构，然后在印刷电路板10的至少两层铜箔层12中位于外侧的两铜箔层12上分别设置第一焊盘121以及第二焊盘122，所述第一焊盘121或第二焊盘122可用以与电子元器件连接，从而实现在印刷电路板10上布置电子元器件。同时，利用第一焊盘121或者第二焊盘122与柔性电路板20上的第三焊盘21连接，从而能够使得柔性电路板20与印刷电路板10实现电性连接，进而可在印刷电路板10上进行布置电子元器件，然后通过印刷电路板10与柔性电路板20的连接，从而使得电子元器件也可实现与柔性电路板20连接。因而无需在柔性电路板20上进行布线或者布置电子元器件，节省了柔性电路板20的布线空间的同时，也无需在柔性电路板20上设置补强，大大地节省了制作加工成本。In the circuit board connection assembly 100 provided by the present invention, the printed circuit board 10 is arranged into a structure of at least two layers, and then on the two outer copper foil layers 12 of the at least two copper foil layers 12 of the printed circuit board 10, respectively The first pad 121 and the second pad 122 are provided, and the first pad 121 or the second pad 122 can be used to connect with electronic components, so as to realize the arrangement of electronic components on the printed circuit board 10 . At the same time, the first pad 121 or the second pad 122 is connected to the third pad 21 on the flexible circuit board 20, so that the flexible circuit board 20 can be electrically connected to the printed circuit board 10, and then the printed circuit board 10 can be electrically connected. The electronic components are arranged on the board 10 , and then the printed circuit board 10 is connected to the flexible circuit board 20 , so that the electronic components can also be connected to the flexible circuit board 20 . Therefore, there is no need to wire or arrange electronic components on the flexible circuit board 20 , which saves the wiring space of the flexible circuit board 20 , and also does not need to provide reinforcement on the flexible circuit board 20 , which greatly saves manufacturing and processing costs.
具体地，所述印刷电路板10为硬板，并且所述印刷电路板10至少为双层板。优选地，所述印刷电路板10为四层板，即包括四层所述铜箔层12。由于所述印刷电路板10采用至少双层板的设计，从而能够比单层板具有更多的布线空间，当需要进行大密度布置电子元器件时，也能够满足足够的布置空间要求。可以理解的是，在其他实施例中，所述印刷电路板10还可为双层板、六层板或者八层板等，视具体的布线以及布置电子元器件的要求而选择设置。Specifically, the printed circuit board 10 is a hard board, and the printed circuit board 10 is at least a double-layer board. Preferably, the printed circuit board 10 is a four-layer board, which includes four layers of the copper foil layer 12 . Since the printed circuit board 10 adopts at least a double-layer board design, it can have more wiring space than a single-layer board, and can also meet sufficient layout space requirements when large-density layout of electronic components is required. It can be understood that, in other embodiments, the printed circuit board 10 can also be a double-layer board, a six-layer board or an eight-layer board, etc., which can be selected according to the requirements of specific wiring and arrangement of electronic components.
进一步地，所述印刷电路板10为小板，即所述印刷电路板10的长度小于所述柔性电路板10的长度。优选地，所述印刷电路板10的长度可为所述柔性电路板20的四分之一或者三分之一，从而能够在满足所述印刷电路板10与所述柔性电路板20连接的同时，还能够减少所述印刷电路板10在所述柔性电路板20上的占用空间。此外，由于所述印刷电路板10为小板，在将所述电路板连接组件100安装于所述移动终端的本体内部时，也能够减少所述电路板组件100在本体的主板上的占用空间，从而有利于移动终端的厚度做薄。Further, the printed circuit board 10 is a small board, that is, the length of the printed circuit board 10 is smaller than the length of the flexible circuit board 10 . Preferably, the length of the printed circuit board 10 can be one quarter or one third of the length of the flexible circuit board 20, so that the connection between the printed circuit board 10 and the flexible circuit board 20 can be satisfied. , can also reduce the space occupied by the printed circuit board 10 on the flexible circuit board 20 . In addition, since the printed circuit board 10 is a small board, when the circuit board connection assembly 100 is installed inside the body of the mobile terminal, the occupied space of the circuit board assembly 100 on the main board of the body can also be reduced. , so as to facilitate the thinning of the mobile terminal.
本实施例中，所述铜箔层12为四层，分别为依次叠加设置的第一铜箔层12a、第二铜箔层12b、第三铜箔层12c以及第四铜箔层12d。具体地，如图1所示，按照纸面方向从下往上看，所述第一铜箔层12a从下往上的第一层，所述第四铜箔层12d为从下往上的第四层。所述第一铜箔层12a上设置有所述第一焊盘121，所述第四铜箔层12d上设置有所述第二焊盘122，从而能够便于所述第一焊盘121与所述柔性电路板20连接，所述第二焊盘20与电子元器件连接。可以理解的是，在其他实施例中，也可在所述第一铜箔层12a上设置所述第二焊盘122，在所述第四铜箔层12d上设置所述第一焊盘121，所述第一焊盘121可用以连接电子元器件或者是与柔性电路板20连接，所述第二焊盘122也可连接柔性电路板20或者是连接电子元器件。In this embodiment, the copper foil layer 12 is four layers, which are the first copper foil layer 12a, the second copper foil layer 12b, the third copper foil layer 12c and the fourth copper foil layer 12d which are stacked in sequence. Specifically, as shown in FIG. 1 , viewed from bottom to top according to the direction of the paper, the first copper foil layer 12a is the first layer from bottom to top, and the fourth copper foil layer 12d is the first layer from bottom to top. fourth floor. The first pad 121 is provided on the first copper foil layer 12a, and the second pad 122 is provided on the fourth copper foil layer 12d, so that the connection between the first pad 121 and the first pad 121 can be facilitated. The flexible circuit board 20 is connected, and the second pad 20 is connected with electronic components. It can be understood that, in other embodiments, the second pad 122 may also be provided on the first copper foil layer 12a, and the first pad 121 may be provided on the fourth copper foil layer 12d. , the first pad 121 can be used to connect to the electronic components or to the flexible circuit board 20 , and the second pad 122 can also be connected to the flexible circuit board 20 or to connect to the electronic components.
进一步地，为了保证所述第一焊盘121以及第二焊盘122分别在所述第一铜箔层12a以及第四铜箔层12d上的附着能力，防止所述第一焊盘121以及第二焊盘122脱落，所述第一焊盘121以及第二焊盘122分别电镀于所述第一铜箔层12a以及第四铜箔层12d上。可以理解的是，在其他实施例中，所述第一焊盘121以及第二焊盘122还可焊接于所述第一铜箔层12a以及第四铜箔层12d上，如采用过锡焊等。Further, in order to ensure the adhesion of the first pad 121 and the second pad 122 on the first copper foil layer 12a and the fourth copper foil layer 12d respectively, prevent the first pad 121 and the second pad from The second pad 122 falls off, and the first pad 121 and the second pad 122 are electroplated on the first copper foil layer 12a and the fourth copper foil layer 12d respectively. It can be understood that, in other embodiments, the first pad 121 and the second pad 122 can also be soldered to the first copper foil layer 12a and the fourth copper foil layer 12d, such as soldering Wait.
所述若干个第一焊盘121沿所述第一铜箔层12a的延伸方向均匀排列，所述若干个第二焊盘122沿所述第四铜箔层12d的延伸方向均匀排列。本实施例中，在所述第一铜箔层12a上的所述若干个第一焊盘121的排列位置与在所述第四铜箔层12d上的若干个第二焊盘122的排列位置一致，即，在所述第一铜箔层12a以及第四铜箔层12d上，所述第一焊盘121与所述第二焊盘122相对对称设置。可以理解的是，在其他实施例中，所述第一焊盘121与所述第二焊盘122也可为非对称设置。The plurality of first pads 121 are evenly arranged along the extending direction of the first copper foil layer 12a, and the plurality of second pads 122 are evenly arranged along the extending direction of the fourth copper foil layer 12d. In this embodiment, the arrangement positions of the plurality of first pads 121 on the first copper foil layer 12a and the arrangement positions of the plurality of second pads 122 on the fourth copper foil layer 12d Consistent, that is, on the first copper foil layer 12a and the fourth copper foil layer 12d, the first pad 121 and the second pad 122 are relatively symmetrically arranged. It can be understood that, in other embodiments, the first pad 121 and the second pad 122 may also be arranged asymmetrically.
为了进一步地改进，所述第一铜箔层12a上设置有阻焊层123，所述若干个第一焊盘121设置于所述阻焊层123上。通过将所述第一焊盘121焊接于所述阻焊层123上，能够利用所述阻焊层123的焊接特性，使得所述第一焊盘121牢牢地焊接在所述阻焊层123上，从而使得所述第一焊盘121后续在与所述柔性电路板20的第三焊盘21压合时，不会轻易从所述阻焊层123上脱落。For further improvement, a solder resist layer 123 is disposed on the first copper foil layer 12 a, and the plurality of first pads 121 are disposed on the solder resist layer 123 . By soldering the first pad 121 on the solder resist layer 123, the soldering properties of the solder resist layer 123 can be utilized, so that the first solder pad 121 is firmly soldered to the solder resist layer 123 , so that the first pad 121 will not easily fall off from the solder resist layer 123 when it is subsequently press-fitted with the third pad 21 of the flexible circuit board 20 .
本实施例中，所述介质层13为三层，分别依次夹设于每两层所述铜箔层12之间。具体地，所述介质层13分别为第一介质层13a、第二介质层13b以及第三介质层13c。所述第一介质层13a夹设于所述第一铜箔层12a以及所述第二铜箔层12b之间，所述第二介质层13b夹设于所述第二铜箔层12b以及所述第三铜箔层12c之间，所述第三介质层13c夹设于所述第三铜箔层12c以及第四铜箔层12d之间。并且优选地，为了保证相邻的两层所述铜箔层12之间能够相互导通，所述三层介质层13上均设置有若干个导通孔131，所述若干个导通孔131分别用以导通每相邻的两层所述铜箔层12，从而当相邻的两层铜箔层12上需要进行走线连接时，可通过所述导通孔131进行走线引出或者连接。可以理解的是，在其他实施例中，所述介质层13的层数还可根据所述印刷电路板10的实际设计情况调整，只要在每两层铜箔层12之间夹设一层所述介质层13即可。In this embodiment, the dielectric layer 13 is three layers, which are sequentially sandwiched between every two layers of the copper foil layer 12 . Specifically, the dielectric layers 13 are respectively a first dielectric layer 13a, a second dielectric layer 13b and a third dielectric layer 13c. The first dielectric layer 13a is sandwiched between the first copper foil layer 12a and the second copper foil layer 12b, and the second dielectric layer 13b is sandwiched between the second copper foil layer 12b and the second copper foil layer 12b. Between the third copper foil layer 12c, the third dielectric layer 13c is sandwiched between the third copper foil layer 12c and the fourth copper foil layer 12d. And preferably, in order to ensure mutual conduction between the two adjacent layers of copper foil layers 12, the three dielectric layers 13 are provided with several via holes 131, and the several via holes 131 They are respectively used to conduct the two adjacent layers of copper foil layers 12, so that when wiring connections are required on the two adjacent layers of copper foil layers 12, the wiring can be drawn out through the via hole 131 or connect. It can be understood that, in other embodiments, the number of layers of the dielectric layer 13 can also be adjusted according to the actual design of the printed circuit board 10, as long as a layer of the dielectric layer 12 is interposed between every two layers of copper foil layers 12 The medium layer 13 is enough.
此外，在其他实施例中，还可在所述第一介质层13a上设置若干个所述导通孔131，并使得若干个所述导通孔131直接贯穿所述第二介质层13b以及所述第三介质层13c，从而无需额外在所述第二介质层13b以及第三介质层13c之间设置所述导通孔131，便于加工。当然，还可直接在所述第二介质层13b或者第三介质层13c上设置若干个所述导通孔131，然后贯穿其他的介质层。In addition, in other embodiments, several via holes 131 may also be provided on the first dielectric layer 13a, and the several via holes 131 directly penetrate through the second dielectric layer 13b and all the via holes 131. The third dielectric layer 13c, so that the via hole 131 does not need to be additionally provided between the second dielectric layer 13b and the third dielectric layer 13c, which facilitates processing. Of course, several via holes 131 can also be directly provided on the second dielectric layer 13b or the third dielectric layer 13c, and then penetrate other dielectric layers.
进一步地，所述介质层13为绝缘层，并且所述介质层13的材质为聚丙烯。即，所述三层介质层13均为绝缘层，以防止相邻的两层铜箔层12之间出现短路现象。可以理解的是，在其他实施例中，所述介质层13还可采用环氧玻璃布层压板(FR4)。Further, the dielectric layer 13 is an insulating layer, and the material of the dielectric layer 13 is polypropylene. That is, the three dielectric layers 13 are insulating layers, so as to prevent short circuit between two adjacent copper foil layers 12 . It can be understood that, in other embodiments, the dielectric layer 13 may also use epoxy glass cloth laminated board (FR4).
所述柔性电路板20包括依次叠加设置的基材层22、第五铜箔层23以及覆盖膜层24，所述若干个第三焊盘21设于所述第五铜箔层23上。本实施例中，所述柔性电路板20可为单层板或者双层板，依实际设计情况调整选择。为了便于所述第三焊盘21与所述第一焊盘121的连接，所述覆盖膜层24上相对应每一个所述第三焊盘21的位置处均设置有开口(图中未标示)，各所述开口可为方形、波浪形或者圆形等，以将所述第三焊盘21露出均可。The flexible circuit board 20 includes a substrate layer 22 , a fifth copper foil layer 23 , and a cover film layer 24 stacked in sequence, and the plurality of third pads 21 are disposed on the fifth copper foil layer 23 . In this embodiment, the flexible circuit board 20 can be a single-layer board or a double-layer board, which can be adjusted and selected according to the actual design situation. In order to facilitate the connection between the third pads 21 and the first pads 121, an opening (not marked in the figure) is provided at a position corresponding to each of the third pads 21 on the cover film layer 24. ), each of the openings may be square, wavy or circular, so as to expose the third pad 21.
所述若干个第三焊盘21分别与所述若干个第一焊盘121压合连接。本实施例中，所述若干个第三焊盘21分别与若干个第一焊盘121通过导电胶压合连接，从而实现所述印刷电路板10与所述柔性电路板20之间的连接。采用导电胶压合连接的方式，能够在保证所述第一焊盘121与所述第三焊盘21的固定的同时，还可以解决目前采用的大密度焊盘之间连接采用焊接有可能造成的虚焊问题。此外，采用导电胶压合连接的方式，工序相对焊接来说较为简单，从而能够便于操作并且降低生产成本。The plurality of third pads 21 are press-fit connected to the plurality of first pads 121 respectively. In this embodiment, the plurality of third pads 21 are respectively connected to the plurality of first pads 121 by pressing and bonding with conductive glue, so as to realize the connection between the printed circuit board 10 and the flexible circuit board 20 . Adopting the method of conductive adhesive press-fit connection can ensure the fixation of the first pad 121 and the third pad 21, and at the same time, it can also solve the possible problems caused by welding between the currently used high-density pads. Welding problems. In addition, the process is relatively simple compared with welding by adopting the method of conductive adhesive press-fit connection, which can facilitate operation and reduce production cost.
进一步地，所述电路板连接组件100相对应所述若干个第二焊盘122设置有若干个电子元器件30，所述若干个电子元器件30分别与若干个所述第二焊盘122通过表面贴装技术(SMT)贴装在一起。通过将所述电子元器件30SMT于所述第二焊盘122，从而能够实现在硬板上(即，所述印刷电路板10)进行布线并且布置器件，然后利用印刷电路板10与柔性电路板20之间的连接，来实现电子元器件30与柔性电路板20之间的连接的目的。从而替代了现有的采用直接在柔性电路板20上进行布置元器件需要补强的问题，或者同时在柔性电路板20以及印刷电路板10上进行布置元器件而导致工序复杂，成本较高的问题。大大地节省了柔性电路板20的布线空间的同时，也简化了加工工序，大大地降低了生产成本。Further, the circuit board connection assembly 100 is provided with a plurality of electronic components 30 corresponding to the plurality of second pads 122, and the plurality of electronic components 30 are respectively connected to the plurality of second pads 122 through Surface mount technology (SMT) mount together. By SMTing the electronic components 30 on the second pad 122, it is possible to carry out wiring and arrange devices on the hard board (that is, the printed circuit board 10), and then use the printed circuit board 10 and the flexible circuit board 20 to achieve the purpose of connecting the electronic components 30 and the flexible circuit board 20 . Therefore, it replaces the existing problem of directly arranging components on the flexible circuit board 20 and requiring reinforcement, or simultaneously arranging components on the flexible circuit board 20 and the printed circuit board 10, resulting in complicated procedures and high costs. question. While greatly saving the wiring space of the flexible circuit board 20 , it also simplifies the processing procedure and greatly reduces the production cost.
本发明提供的电路板连接组件通过设置印刷电路板包括至少两层铜箔层以及夹设于至少两层铜箔层之间的至少一层介质层，然后在至少两层铜箔层上分别设置若干第一焊盘以及第二焊盘，该第一焊盘或第二焊盘可用以连接电子元器件，从而实现在印刷电路板上进行布置器件。然后在柔性电路板上相对应设置若干个第三焊盘，并且该第三焊盘可与第一焊盘或第二焊盘连接，从而实现将印刷电路板与柔性电路板连接起来。此外，由于印刷电路板为至少两层板，因此能够进行大密度布线以及布置器件，因此，柔性电路板上无需布置器件，大大地节省了柔性电路板的空间，同时，也由于柔性电路板与印刷电路板连接，故而柔性电路板无需额外设置补强，故而能够减少生产成本。The circuit board connection assembly provided by the present invention comprises at least two layers of copper foil layers and at least one dielectric layer interposed between at least two layers of copper foil layers by setting the printed circuit board, and then respectively disposing on the at least two layers of copper foil layers Several first soldering pads and second soldering pads, the first soldering pads or the second soldering pads can be used to connect electronic components, so as to realize the arrangement of devices on the printed circuit board. Then several third pads are correspondingly arranged on the flexible circuit board, and the third pads can be connected with the first pad or the second pad, so as to realize the connection between the printed circuit board and the flexible circuit board. In addition, because the printed circuit board has at least two layers, it is possible to carry out large-density wiring and arrange devices. Therefore, there is no need to arrange devices on the flexible circuit board, which greatly saves the space of the flexible circuit board. At the same time, because the flexible circuit board and The printed circuit board is connected, so the flexible circuit board does not need additional reinforcement, so the production cost can be reduced.
以上所述的实施方式，并不构成对该技术方案保护范围的限定。任何在上述实施方式的精神和原则之内所作的修改、等同替换和改进等，均应包含在该技术方案的保护范围之内。The implementation methods described above do not constitute a limitation to the scope of protection of the technical solution. Any modifications, equivalent replacements and improvements made within the spirit and principles of the above implementation methods shall be included in the protection scope of the technical solution.
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511026227.4ACN105578749B (en) | 2015-12-29 | 2015-12-29 | Circuit board connection component and mobile terminal |
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511026227.4ACN105578749B (en) | 2015-12-29 | 2015-12-29 | Circuit board connection component and mobile terminal |
| Publication Number | Publication Date |
|---|---|
| CN105578749Atrue CN105578749A (en) | 2016-05-11 |
| CN105578749B CN105578749B (en) | 2018-07-06 |
| Application Number | Title | Priority Date | Filing Date |
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| CN201511026227.4AExpired - Fee RelatedCN105578749B (en) | 2015-12-29 | 2015-12-29 | Circuit board connection component and mobile terminal |
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| CP01 | Change in the name or title of a patent holder | Address after:523860 No. 18, Wu Sha Beach Road, Changan Town, Dongguan, Guangdong Patentee after:GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. Address before:523860 No. 18, Wu Sha Beach Road, Changan Town, Dongguan, Guangdong Patentee before:GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. | |
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