本申请是2011年6月1日提交的申请号为201110152173.1，发明名称为“发光器件封装”的专利申请的分案申请。This application is a divisional application of the patent application filed on June 1, 2011 with the application number 201110152173.1 and the title of the invention "Encapsulation of Light Emitting Devices".
相关申请的交叉引用Cross References to Related Applications
本申请要求2010年6月1日提交的韩国专利申请No.10-2010-0051840的优先权，通过引用将其整体并入这里，如在此完全阐述一样。This application claims priority from Korean Patent Application No. 10-2010-0051840 filed Jun. 1, 2010, which is hereby incorporated by reference in its entirety as if fully set forth herein.
本申请要求2011年4月14日提交的韩国专利申请No.10-2011-0034720的优先权，通过引用将其整体并入这里，如在此完全阐述一样。This application claims priority from Korean Patent Application No. 10-2011-0034720 filed Apr. 14, 2011, which is hereby incorporated by reference in its entirety as if fully set forth herein.
技术领域technical field
本发明涉及一种发光器件封装。The invention relates to a light emitting device package.
背景技术Background technique
例如发光二极管的发光器件可以包括将电能转换为光的半导体器件。这样的发光二极管可以使用这样的半导体器件产生光，从而与例如白炽灯或者荧光灯相比，消耗相对少的能量。发光二极管可以使用半导体器件的势隙来产生光，从而提供相对长的寿命和快速响应时间，并且是环保的。Light emitting devices such as light emitting diodes may include semiconductor devices that convert electrical energy into light. Such light emitting diodes may generate light using such semiconductor devices, thereby consuming relatively little energy compared to, for example, incandescent or fluorescent lamps. Light emitting diodes can generate light using the potential gap of a semiconductor device, thereby providing relatively long lifetime and fast response time, and are environmentally friendly.
发明内容Contents of the invention
发光器件封装包括：主体，该主体具有形成在其中的腔体，该腔体包括侧表面和底部；第一反射杯和第二反射杯，该第一反射杯和第二反射杯设置在腔体的底部中并且通过腔体的底部的一部分相互分离；第一发光器件，该第一发光器件设置在第一反射杯中；以及第二发光器件，该第二发光器件设置在第二反射杯中。The light emitting device package includes: a main body having a cavity formed therein, the cavity including a side surface and a bottom; a first reflective cup and a second reflective cup disposed in the cavity In the bottom of the cavity and separated from each other by a part of the bottom of the cavity; a first light emitting device, the first light emitting device is arranged in the first reflective cup; and a second light emitting device, the second light emitting device is arranged in the second reflective cup .
第一反射杯和第二反射杯在腔体的底部中形成凹陷。第一反射杯和第二反射杯中的每一个的一部分能够通过主体并且暴露到主体的外部。第一反射杯和第二反射杯的形状和尺寸能够基本对称。第一反射杯和第二反射杯中的每一个的各个侧表面相对于其各个底表面的倾斜角能够处于90°与160°之间。The first reflective cup and the second reflective cup form a depression in the bottom of the cavity. A portion of each of the first reflective cup and the second reflective cup can pass through the body and be exposed to the outside of the body. The shape and size of the first reflective cup and the second reflective cup can be substantially symmetrical. An inclination angle of each side surface of each of the first reflective cup and the second reflective cup relative to a respective bottom surface thereof can be between 90° and 160°.
发光器件封装能够进一步包括台阶边缘，该台阶边缘形成在主体的上表面和形成在主体中的腔体的上端之间，该台阶边缘与主体的上表面具有规定的高度差并且平行于主体的上表面。第一反射杯的上表面平行于第一发光器件的上表面并且第二反射杯的上表面能够平行于第二发光器件的上表面。第一反射杯的高度大于第一发光器件的高度并且第二反射杯的高度能够大于第二发光器件的高度。第一反射杯的深度能够大于第一发光器件的高度且能够小于第一发光器件的高度的两倍，并且第二反射杯的深度能够大于第二发光器件的高度且能够小于第二发光器件的高度的两倍。第一反射杯的高度能够小于第一发光器件的高度并且第二反射杯的高度能够小于第二发光器件的高度。第一反射杯的深度能够小于第一发光器件的高度并且能够大于第一发光器件的高度的一半，并且第二反射杯的深度能够小于第二发光器件的高度并且能够大于第二发光器件的高度的一半。The light emitting device package can further include a stepped edge formed between the upper surface of the body and an upper end of the cavity formed in the body, the stepped edge having a prescribed height difference from the upper surface of the body and parallel to the upper surface of the body. surface. The upper surface of the first reflective cup is parallel to the upper surface of the first light emitting device and the upper surface of the second reflective cup can be parallel to the upper surface of the second light emitting device. The height of the first reflective cup is greater than that of the first light emitting device and the height of the second reflective cup can be greater than that of the second light emitting device. The depth of the first reflective cup can be greater than the height of the first light emitting device and can be less than twice the height of the first light emitting device, and the depth of the second reflective cup can be greater than the height of the second light emitting device and can be less than the height of the second light emitting device twice the height. The height of the first reflective cup can be smaller than the height of the first light emitting device and the height of the second reflective cup can be smaller than the height of the second light emitting device. The depth of the first reflective cup can be less than the height of the first light emitting device and can be greater than half of the height of the first light emitting device, and the depth of the second reflective cup can be less than the height of the second light emitting device and can be greater than the height of the second light emitting device half of.
发光器件封装能够进一步包括包封材料，该包封材料填充主体的腔体的内部、其中设置第一发光器件的第一反射杯的内部以及其中设置第二发光器件的第二反射杯的内部，以将第一发光器件和第二发光器件与外部隔离。The light emitting device package can further include an encapsulation material filling the interior of the cavity of the body, the interior of the first reflective cup in which the first light emitting device is disposed, and the interior of a second reflective cup in which the second light emitting device is disposed, In order to isolate the first light emitting device and the second light emitting device from the outside.
发光器件封装包括：主体，该主体具有形成在其中的腔体；第一反射杯和第二反射杯，该第一反射杯和第二反射杯设置在腔体的底部中；第一发光器件，该第一发光器件设置在第一反射杯中；第二发光器件，该第二发光器件设置在第二反射杯中；以及连接焊盘，该连接焊盘设置在腔体的底部中并且与第一反射杯和第二反射杯分离。The light emitting device package includes: a main body having a cavity formed therein; first and second reflective cups disposed in the bottom of the cavity; a first light emitting device, The first light-emitting device is arranged in the first reflective cup; the second light-emitting device is arranged in the second reflective cup; and the connection pad is arranged in the bottom of the cavity and connected to the first light-emitting device. A reflective cup is separated from a second reflective cup.
第一和第二反射杯能够通过腔体的底部的一部分相互分离，并且其中经由连接焊盘电连接第一发光器件和第二发光器件。The first and second reflective cups can be separated from each other by a part of the bottom of the cavity, and wherein the first light emitting device and the second light emitting device are electrically connected via the connection pad.
发光器件封装能够进一步包括：第一布线，该第一布线连接第一反射杯和第一发光器件；第二布线，该第二布线连接第一发光器件和连接焊盘；第三布线，该第三布线连接连接焊盘和第二发光器件；以及第四布线，该第四布线连接第二发光器件和第二反射杯，其中第一发光器件和第二发光器件通过第一布线、第二布线、第三布线以及第四布线串联地连接。The light emitting device package can further include: a first wiring connecting the first reflective cup and the first light emitting device; a second wiring connecting the first light emitting device and the connection pad; a third wiring connecting the first light emitting device and the connection pad; Three wirings are connected to the connection pad and the second light-emitting device; and the fourth wiring is connected to the second light-emitting device and the second reflective cup, wherein the first light-emitting device and the second light-emitting device pass through the first wiring and the second wiring , the third wiring, and the fourth wiring are connected in series.
发光器件封装能够进一步包括第一布线，该第一布线连接第一反射杯和第一发光器件；第二布线，该第二布线连接第一发光器件和第二反射杯；第三布线，该第三布线连接第一反射杯和第二发光器件；以及第四布线，该第四布线连接第二发光器件和第二反射杯，其中第一发光器件和第二发光器件通过第一布线、第二布线、第三布线以及第四布线并联地连接。The light emitting device package can further include a first wiring connecting the first reflective cup and the first light emitting device; a second wiring connecting the first light emitting device and the second reflective cup; a third wiring connecting the first reflective cup and the second reflective cup; The third wiring connects the first reflective cup and the second light emitting device; and the fourth wiring connects the second light emitting device and the second reflective cup, wherein the first light emitting device and the second light emitting device pass through the first wiring, the The wiring, the third wiring, and the fourth wiring are connected in parallel.
发光器件封装能够进一步包括第一布线，该第一布线连接第一反射杯和第一发光器件；第二布线，该第二布线连接第一发光器件和第二发光器件；以及第三布线，该第三布线连接第二发光器件和第二反射杯，其中第一发光器件和第二发光器件通过第一布线、第二布线、以及第三布线串联地连接。The light emitting device package can further include a first wiring connecting the first reflective cup and the first light emitting device; a second wiring connecting the first light emitting device and the second light emitting device; and a third wiring connecting the first light emitting device and the second light emitting device. The third wiring connects the second light emitting device and the second reflective cup, wherein the first light emitting device and the second light emitting device are connected in series through the first wiring, the second wiring, and the third wiring.
发光器件封装包括：第一和第二反射杯，该第一和第二反射杯定位为彼此邻近，其中第一和第二反射杯的轮廓分别形成第一和第二腔体；第一和第二发光器件，该第一和第二发光器件分别设置在形成在第一和第二反射杯中的第一和第二腔体中；侧壁，该侧壁包围第一和第二反射杯的外围部分；以及分隔壁，该分隔壁设置在第一和第二反射杯之间，其中分隔壁的高度小于侧壁的高度。The light emitting device package includes: first and second reflective cups positioned adjacent to each other, wherein contours of the first and second reflective cups form first and second cavities, respectively; Two light emitting devices, the first and second light emitting devices are respectively arranged in the first and second cavities formed in the first and second reflective cups; the side wall surrounds the first and second reflective cups a peripheral portion; and a partition wall disposed between the first and second reflective cups, wherein the partition wall has a height less than that of the side walls.
侧壁能够从第一和第二反射杯的顶表面向上延伸以限定第三腔体。第一和第二反射杯能够在第三腔体的底部形成凹陷。第一反射杯的第一部分和第二反射杯的第一部分能够通过第三腔体的底部中的各个开口暴露到发光器件封装的外部。第一反射杯的第二部分和第二反射杯的第二部分能够通过侧壁的各个部分延伸到发光器件封装的外部。Sidewalls can extend upwardly from the top surfaces of the first and second reflective cups to define a third cavity. The first and second reflective cups can form a depression at the bottom of the third cavity. The first portion of the first reflective cup and the first portion of the second reflective cup can be exposed to the outside of the light emitting device package through the respective openings in the bottom of the third cavity. The second portion of the first reflective cup and the second portion of the second reflective cup can extend to the outside of the light emitting device package through respective portions of the sidewall.
发光器件封装能够进一步包括：连接焊盘，该连接焊盘设置在第三腔体的底部上，与第一反射杯和第二反射杯分离，其中经由连接焊盘电连接第一发光器件和第二发光器件。发光器件封装能够进一步包括多条布线，每条布线具有连接到第一或者第二发光器件的第一端和分别连接到第一或者第二反射杯中的一个、或者连接焊盘的第二端。The light emitting device package can further include: a connection pad disposed on the bottom of the third cavity, separated from the first reflective cup and the second reflective cup, wherein the first light emitting device and the second reflective cup are electrically connected via the connection pad. Two light-emitting devices. The light emitting device package can further include a plurality of wires, each wire having a first end connected to the first or second light emitting device and a second end respectively connected to one of the first or second reflective cups, or the connection pad .
第一发光器件的顶表面能够定位在第一反射杯的顶边缘下方并且第二发光器件的顶表面能够定位在第二反射杯的顶边缘下方。第一发光器件的顶表面能够延伸超出第一反射杯的顶边缘，并且第二发光器件的顶表面能够延伸超出第二反射杯的顶边缘。第一发光器件的顶表面能够基本上平行于第一反射杯的顶表面，并且第二发光器件的顶表面能够基本上平行于第二反射杯的顶表面。The top surface of the first light emitting device can be positioned below the top edge of the first reflective cup and the top surface of the second light emitting device can be positioned below the top edge of the second reflective cup. The top surface of the first light emitting device can extend beyond the top edge of the first reflective cup, and the top surface of the second light emitting device can extend beyond the top edge of the second reflective cup. A top surface of the first light emitting device can be substantially parallel to a top surface of the first reflective cup, and a top surface of the second light emitting device can be substantially parallel to a top surface of the second reflective cup.
第一反射杯的深度能够大于第一发光器件的高度并且能够小于第一发光器件的高度的两倍，并且第二反射杯的深度能够大于第二发光器件的高度并且能够小于第二发光器件的高度的两倍。第一反射杯的深度能够小于第一发光器件的高度并且能够大于第一发光器件的高度的一半，并且第二反射杯的深度能够小于第二发光器件的高度并且能够大于第二发光器件的高度的一半。The depth of the first reflective cup can be greater than the height of the first light emitting device and can be less than twice the height of the first light emitting device, and the depth of the second reflective cup can be greater than the height of the second light emitting device and can be less than the height of the second light emitting device twice the height. The depth of the first reflective cup can be less than the height of the first light emitting device and can be greater than half of the height of the first light emitting device, and the depth of the second reflective cup can be less than the height of the second light emitting device and can be greater than the height of the second light emitting device half of.
发光器件封装包括：主体；第一反射杯和第二反射杯，该第一反射杯和第二反射杯设置在主体中，并且通过主体的一部分相互分离；第一发光器件，该第一发光器件设置在第一反射杯中；以及第二发光器件，该第二发光器件设置在第二反射杯中，其中第一反射杯和第二反射杯由不同于主体的材料制成。The light-emitting device package includes: a main body; a first reflective cup and a second reflective cup, the first reflective cup and the second reflective cup are arranged in the main body and are separated from each other by a part of the main body; a first light-emitting device, the first light-emitting device disposed in the first reflective cup; and a second light emitting device disposed in the second reflective cup, wherein the first reflective cup and the second reflective cup are made of a material different from the main body.
发光器件封装能够进一步包括连接焊盘，该连接焊盘设置在主体中，并且与第一反射杯和第二反射杯分离，其中连接焊盘由不同于主体的材料制成。能够经由连接焊盘电连接第一发光器件和第二发光器件。主体能够由诸如聚邻苯二甲酰胺(PPA)、或者硅(Si)、光敏玻璃(PSG)或者蓝宝石(Al2O3)的材料制成。The light emitting device package can further include a connection pad provided in the body and separated from the first reflective cup and the second reflective cup, wherein the connection pad is made of a material different from the body. The first light emitting device and the second light emitting device can be electrically connected via the connection pad. The body can be made of a material such as polyphthalamide (PPA), or silicon (Si), photosensitive glass (PSG), or sapphire (Al2 O3 ).
发光器件封装包括主体；第一反射杯和第二反射杯，该第一反射杯和第二反射杯设置在主体中；第一发光器件，该第一发光器件设置在第一反射杯中，其中第一发光器件包括第一电极和第二电极；以及第二发光器件，该第二发光器件设置在第二反射杯中，其中第二发光器件包括第三电极和第四电极，其中第一电极电连接到第一反射杯并且第四电极连接到第二反射杯，并且第一电极和第四电极具有彼此不同的极性。The light-emitting device package includes a main body; a first reflective cup and a second reflective cup, the first reflective cup and the second reflective cup are arranged in the main body; a first light-emitting device, the first light-emitting device is arranged in the first reflective cup, wherein The first light emitting device includes a first electrode and a second electrode; and a second light emitting device, which is arranged in a second reflective cup, wherein the second light emitting device includes a third electrode and a fourth electrode, wherein the first electrode The first reflective cup is electrically connected and the fourth electrode is connected to the second reflective cup, and the first electrode and the fourth electrode have polarities different from each other.
第二电极能够电连接到第二反射杯，并且第三电极电连接到第一反射杯。第二电极电连接到第三电极。The second electrode can be electrically connected to the second reflective cup, and the third electrode is electrically connected to the first reflective cup. The second electrode is electrically connected to the third electrode.
发光器件封装能够进一步包括连接焊盘，该连接焊盘设置在主体中并且与第一反射杯和第二反射杯分离，其中连接焊盘电连接第二电极和第三电极。第一电极和第三电极能够是彼此相同的极性。The light emitting device package can further include a connection pad provided in the body and separated from the first reflective cup and the second reflective cup, wherein the connection pad electrically connects the second electrode and the third electrode. The first electrode and the third electrode can be of the same polarity as each other.
发光器件封装包括：底部主体；第一反射杯，该第一反射杯设置在底部主体中；第二反射杯，该第二反射杯设置在底部中并且通过底部主体的一部分与第一反射杯分离；第一发光器件，该第一发光器件设置在第一反射杯中；第二发光器件，该第二发光器件设置在第二反射杯中；以及在底部主体上的侧表面，该侧表面包围第一反射杯和第二反射杯。发光器件封装能够进一步包括在底部主体中的连接焊盘并且该连接焊盘通过底部主体的另一部分与第一反射杯和第二反射杯分离。The light emitting device package includes: a bottom body; a first reflective cup disposed in the bottom body; a second reflective cup disposed in the bottom and separated from the first reflective cup by a part of the bottom body ; a first light emitting device, the first light emitting device is disposed in the first reflective cup; a second light emitting device, the second light emitting device is disposed in the second reflective cup; and a side surface on the bottom body, the side surface surrounds A first reflective cup and a second reflective cup. The light emitting device package can further include a connection pad in the bottom body and the connection pad is separated from the first reflective cup and the second reflective cup by another part of the bottom body.
附图说明Description of drawings
将参考附图详细地描述实施例，其中相同的附图标记表示相同的元件，其中：Embodiments will be described in detail with reference to the accompanying drawings, wherein like reference numerals denote like elements, wherein:
图1是根据在此宽泛地描述的实施例的发光器件封装的透视图；1 is a perspective view of a light emitting device package according to embodiments broadly described herein;
图2是图1中所示的发光器件封装的底视图；FIG. 2 is a bottom view of the light emitting device package shown in FIG. 1;
图3是图1中所示的发光器件封装的第一侧视图；3 is a first side view of the light emitting device package shown in FIG. 1;
图4是图1中所示的发光器件封装的第二侧视图；4 is a second side view of the light emitting device package shown in FIG. 1;
图5是图1中所示的发光器件封装的第三侧视图；5 is a third side view of the light emitting device package shown in FIG. 1;
图6是图1中所示的发光器件封装的第四侧视图；6 is a fourth side view of the light emitting device package shown in FIG. 1;
图7是图1中所示的发光器件封装的平面图；7 is a plan view of the light emitting device package shown in FIG. 1;
图8是沿着图7中所示的发光器件封装的线A-A’截取的截面图；8 is a cross-sectional view taken along line A-A' of the light emitting device package shown in FIG. 7;
图9是沿着图7中所示的发光器件封装的线B-B’截取的截面图；9 is a cross-sectional view taken along line B-B' of the light emitting device package shown in FIG. 7;
图10示出根据在此宽泛地描述的实施例的发光器件封装的发光器件的串联连接；Figure 10 illustrates a series connection of light emitting devices of a light emitting device package according to embodiments broadly described herein;
图11示出根据在此宽泛地描述的另一实施例的发光器件封装的发光器件的并联连接；Figure 11 illustrates parallel connection of light emitting devices of a light emitting device package according to another embodiment broadly described herein;
图12示出根据在此宽泛地描述的另一实施例的发光器件封装的发光器件的串联连接；Figure 12 illustrates a series connection of light emitting devices of a light emitting device package according to another embodiment broadly described herein;
图13a示出根据在此宽泛地描述的实施例的第一反射杯的深度；Figure 13a shows the depth of a first reflective cup according to embodiments broadly described herein;
图13b示出根据在此宽泛地描述的另一实施例的第一反射杯的深度；Figure 13b shows the depth of a first reflective cup according to another embodiment broadly described herein;
图13c示出根据在此宽泛地描述的另一实施例的第一反射杯的深度；Figure 13c shows the depth of a first reflective cup according to another embodiment broadly described herein;
图14是根据在此宽泛地描述的实施例的第一发光器件和第二发光器件；Figure 14 is a first light emitting device and a second light emitting device according to embodiments broadly described herein;
图15是根据在此宽泛地描述的实施例的第一、第二、第三、以及第四电极之间的第一连接；Figure 15 is a first connection between first, second, third, and fourth electrodes according to embodiments broadly described herein;
图16是根据在此宽泛地描述的实施例的第一、第二、第三、以及第四电极之间的第二连接；16 is a second connection between first, second, third, and fourth electrodes according to embodiments broadly described herein;
图17是根据在此宽泛地描述的实施例的第一、第二、第三、以及第四电极之间的第三连接；Figure 17 is a third connection between first, second, third, and fourth electrodes according to embodiments broadly described herein;
图18是根据在此宽泛地描述的实施例的包括发光器件封装的照明设备的分解透视图；以及18 is an exploded perspective view of a lighting device including a light emitting device package according to embodiments broadly described herein; and
图19是根据在此宽泛地描述的实施例的包括发光器件封装的显示设备的分解透视图。19 is an exploded perspective view of a display apparatus including a light emitting device package according to embodiments broadly described herein.
具体实施方式Detailed ways
在下面详细的描述中，参考形成其一部分的附图，并且借助于在此宽泛地描述的说明性的特定实施例示出。在附图中，为了描述的方便和清楚起见，各层的厚度或者尺寸可以被夸大、省略或者示意性地示出。此外，各元件的尺寸不需要表示其实际尺寸。此外，只要可能，通过相同的附图标记来表示相同或者类似的元件，尽管可能在不同的附图中进行描述。In the following detailed description, reference is made to the accompanying drawings which form a part hereof, and in which is shown by way of illustration specific embodiments broadly described herein. In the drawings, for convenience and clarity of description, the thickness or size of each layer may be exaggerated, omitted, or schematically shown. In addition, the size of each element does not necessarily mean its actual size. Furthermore, wherever possible, the same or similar elements are denoted by the same reference numerals even though they may be described in different drawings.
如图1中所示，根据在此宽泛地描述的实施例的发光器件封装100可以包括：主体110、第一反射杯122、第二反射杯124、连接焊盘126、发光器件132和134、齐纳二极管150、以及布线152、154、156、158以及159。As shown in FIG. 1 , a light emitting device package 100 according to embodiments broadly described herein may include: a main body 110 , a first reflective cup 122 , a second reflective cup 124 , connection pads 126 , light emitting devices 132 and 134 , Zener diode 150 , and wirings 152 , 154 , 156 , 158 , and 159 .
主体110可以由例如诸如聚邻苯二甲酰胺(PPA)的树脂、硅(Si)、金属、光敏玻璃(PSG)、蓝宝石(Al2O3)、以及印刷电路板(PCB)中的一个的材料制成。在某些实施例中，主体110由诸如聚邻苯二甲酰胺(PPA)的树脂制成。主体110可以由导体组成。如果主体110由导电材料制成，那么绝缘膜可以形成在主体110的表面上以防止主体110与第一反射杯122、第二反射杯124以及连接焊盘126电短路。The main body 110 may be made of, for example, one of resin such as polyphthalamide (PPA), silicon (Si), metal, photosensitive glass (PSG), sapphire (Al2 O3 ), and printed circuit board (PCB). material. In some embodiments, the body 110 is made of a resin such as polyphthalamide (PPA). The body 110 may be composed of a conductor. If the body 110 is made of a conductive material, an insulating film may be formed on the surface of the body 110 to prevent the body 110 from being electrically shorted with the first reflective cup 122 , the second reflective cup 124 , and the connection pad 126 .
当从顶部看时，根据特定发光器件封装的用途和设计，主体110的上表面106可以具有诸如三角形、矩形、多边形、圆形、或者合适的其它形状的各种形状。例如，如图1中所示，发光器件封装100可以用在边缘型背光单元(BLU)中。例如，如果发光器件封装100应用于便携式闪光灯或者家庭照明设备，那么主体110可以修改为具有可以容易地安装在便携式闪光灯或者家庭照明设备内的尺寸和形状。When viewed from the top, the upper surface 106 of the body 110 may have various shapes such as a triangle, a rectangle, a polygon, a circle, or other suitable shapes according to the usage and design of a specific light emitting device package. For example, as shown in FIG. 1, the light emitting device package 100 may be used in an edge type backlight unit (BLU). For example, if the light emitting device package 100 is applied to a portable flash or home lighting, the body 110 may be modified to have a size and shape that can be easily installed in the portable flash or home lighting.
主体110可以包括腔体105(在下文中，被称为“主体腔体”)。腔体105的上部可以是敞开的，并且可以包括侧表面102和底部103。主体腔体105可以具有杯形或者凹陷容器形状，并且主体腔体105的侧表面102可以相对于底部103垂直或者倾斜。其它的布置也可以是适合的。The body 110 may include a cavity 105 (hereinafter, referred to as "body cavity"). The upper portion of the cavity 105 may be open, and may include side surfaces 102 and a bottom 103 . The body cavity 105 may have a cup shape or a concave container shape, and the side surface 102 of the body cavity 105 may be vertical or inclined relative to the bottom 103 . Other arrangements may also be suitable.
当从顶部看时，主体腔体105的形状可以是圆形、椭圆形、多边形(例如，矩形)、或者合适的其它的形状。在某些实施例中，主体腔体105的角部可以是成曲线的。在图1中所示的实施例中，当从顶部看时，主体腔体105的形状实质上是八角形的，并且主体腔体105的侧表面102包括八个平面。八个平面中的四个可以被称为面向主体110的各个角部并且形成主体腔体105的侧表面102的第一平面，并且剩下的四个平面可以被称为在第一平面之间延伸并且形成主体腔体105的伸长的侧表面102的第二平面。第一平面的面积小于第二平面的面积。第一平面和第二平面当中的相对平面的形状能够相同。第一平面和第二平面当中的相对平面的面积能够相等。在另一实施例中，主体腔体105的侧表面102能够包括少于八个的平面，并且其中一些平面能够是能够相互相对的曲表面。When viewed from the top, the shape of the body cavity 105 may be circular, elliptical, polygonal (eg, rectangular), or other suitable shapes. In some embodiments, the corners of the body cavity 105 may be curved. In the embodiment shown in FIG. 1 , the body cavity 105 is substantially octagonal in shape when viewed from the top, and the side surface 102 of the body cavity 105 includes eight flat surfaces. Four of the eight planes may be referred to as first planes facing respective corners of the body 110 and forming the side surfaces 102 of the body cavity 105, and the remaining four planes may be referred to as being between the first planes. The second plane extends and forms the elongated side surface 102 of the body cavity 105 . The area of the first plane is smaller than the area of the second plane. A shape of an opposite plane among the first plane and the second plane can be the same. Areas of opposite planes among the first plane and the second plane can be equal. In another embodiment, the side surface 102 of the body cavity 105 can include less than eight flat surfaces, and some of the flat surfaces can be curved surfaces that can be opposite to each other.
第一反射杯122和第二反射杯124可以定位在主体腔体105的底部103下面的主体110内，从而第一和第二反射杯122和124通过主体腔体105的底部103的一部分相互分离。可以将第一反射杯122从主体腔体105的底部103下压，同时第一反射杯122的上部是敞开的。The first reflective cup 122 and the second reflective cup 124 may be positioned within the body 110 below the bottom 103 of the body cavity 105 such that the first and second reflective cups 122 and 124 are separated from each other by a portion of the bottom 103 of the body cavity 105 . The first reflective cup 122 can be pressed down from the bottom 103 of the body cavity 105 while the upper part of the first reflective cup 122 is open.
例如，第一腔体162可以形成主体腔体105的底部103中，并且第一腔体162的上部是敞开的。第一腔体162可以包括侧表面和底部，并且第一反射杯122可以定位在第一腔体162内。For example, the first cavity 162 may be formed in the bottom 103 of the body cavity 105, and an upper portion of the first cavity 162 is opened. The first cavity 162 may include side surfaces and a bottom, and the first reflection cup 122 may be positioned within the first cavity 162 .
第二反射杯124可以与第一腔体162分离并且也从主体腔体105的底部103下压，并且第二反射杯124的上部是敞开的。例如，第二腔体164可以形成在主体腔体105的底部103中，并且第二腔体164的上部是敞开的。第二腔体164可以包括侧表面和底部，并且第二反射杯124可以定位在第二腔体164内。通过主体腔体105的底部103位于第一反射杯122和第二反射杯124之间的一部分可以将第二腔体164与第一腔体162分离，该部分使第一反射杯122和第二反射杯124相互分离并且隔离。The second reflective cup 124 may be separated from the first cavity 162 and also pressed down from the bottom 103 of the body cavity 105, and the upper portion of the second reflective cup 124 is opened. For example, the second cavity 164 may be formed in the bottom 103 of the body cavity 105, and an upper portion of the second cavity 164 is opened. The second cavity 164 may include side surfaces and a bottom, and the second reflective cup 124 may be positioned within the second cavity 164 . The second cavity 164 can be separated from the first cavity 162 by a part of the bottom 103 of the body cavity 105 between the first reflective cup 122 and the second reflective cup 124, which makes the first reflective cup 122 and the second reflective cup 122 separate. The reflective cups 124 are separated and isolated from each other.
从顶部看时，第一腔体162和第二腔体164可以具有杯形或者凹陷容器形状，并且其侧表面可以相对于其底部垂直或者倾斜。其它的布置也可以是合适的。The first cavity 162 and the second cavity 164 may have a cup shape or a sunken container shape when viewed from the top, and side surfaces thereof may be vertical or inclined relative to the bottom thereof. Other arrangements may also be suitable.
第一反射杯122和第二反射杯124中的每一个的至少一部分可以经过主体110并且暴露到主体110的外部。因为第一反射杯122和第二反射杯124中的每一个的至少一部分暴露到主体110的外部，所以可以提高将第一发光器件132和第二发光器件134产生的热发射到主体110的外部的效率。At least a portion of each of the first reflection cup 122 and the second reflection cup 124 may pass through the body 110 and be exposed to the outside of the body 110 . Since at least a portion of each of the first reflective cup 122 and the second reflective cup 124 is exposed to the outside of the main body 110, it is possible to improve emission of heat generated by the first light emitting device 132 and the second light emitting device 134 to the outside of the main body 110. s efficiency.
例如，第一反射杯122的一端142可以经过主体110的第一侧表面并且暴露到外部。类似地，第二反射杯142的一端144可以经过主体110的第二侧表面并且暴露到外部。主体110的第一侧表面和第二侧表面可以彼此相对，或者以其它方式适当地定位。For example, the one end 142 of the first reflective cup 122 may pass through the first side surface of the body 110 and be exposed to the outside. Similarly, the one end 144 of the second reflective cup 142 may pass through the second side surface of the body 110 and be exposed to the outside. The first side surface and the second side surface of the body 110 may be opposite to each other, or otherwise suitably positioned.
第一反射杯122和第二反射杯124可以由诸如银、金、铜的金属材料、或者其它材料制成，或者可以通过镀金属而制成。第一反射杯122和第二反射杯124可以由与主体110相同的材料制成，并且与主体110一体地形成。替代地，第一反射杯122和第二反射杯124可以由不同于主体110的材料制成，并且与主体110分离地形成。在某些实施例中，第一反射杯122和第二反射杯124的形状和尺寸可以相对于连接焊盘126对称。连接焊盘126可以形成在主体腔体105的底部103下面的主体110内，从而连接焊盘126与第一反射杯122和第二反射杯124分离。连接焊盘126可以由导电材料制成。The first reflective cup 122 and the second reflective cup 124 may be made of metal materials such as silver, gold, copper, or other materials, or may be made by metal plating. The first reflection cup 122 and the second reflection cup 124 may be made of the same material as the body 110 and integrally formed with the body 110 . Alternatively, the first reflective cup 122 and the second reflective cup 124 may be made of a material different from the main body 110 and formed separately from the main body 110 . In some embodiments, the shape and size of the first reflective cup 122 and the second reflective cup 124 may be symmetrical with respect to the connection pad 126 . The connection pad 126 may be formed in the body 110 below the bottom 103 of the body cavity 105 such that the connection pad 126 is separated from the first reflective cup 122 and the second reflective cup 124 . The connection pad 126 may be made of a conductive material.
如图1中所示，连接焊盘126可以定位在第一反射杯122和第二反射杯124之间。例如，连接焊盘126可以定位在主体腔体105的底部103的内部，与主体腔体105的第三侧表面相邻并且位于第一反射杯122和第二反射杯124之间。其它的布置也可以是合适的。As shown in FIG. 1 , the connection pad 126 may be positioned between the first reflective cup 122 and the second reflective cup 124 . For example, the connection pad 126 may be positioned inside the bottom 103 of the body cavity 105 , adjacent to the third side surface of the body cavity 105 and between the first reflective cup 122 and the second reflective cup 124 . Other arrangements may also be suitable.
连接焊盘126的至少一部分可以经过主体110并且暴露到主体110的外部。例如，连接焊盘126的一端146可以经过主体腔体105的第三侧表面并且暴露到外部。在本示例性实施例中，主体110的第三侧表面可以相对于第一和第二反射杯122和124的端部142和144从其经过的主体110的第一和第二侧表面垂直。At least a portion of the connection pad 126 may pass through the body 110 and be exposed to the outside of the body 110 . For example, one end 146 of the connection pad 126 may pass through the third side surface of the body cavity 105 and be exposed to the outside. In this exemplary embodiment, the third side surface of the body 110 may be perpendicular to the first and second side surfaces of the body 110 through which the ends 142 and 144 of the first and second reflective cups 122 and 124 pass.
齐纳二极管150可以设置在第一反射杯122或者第二反射杯124中的一个上，以提高发光器件封装100的击穿电压。如图1中所示，齐纳二极管150可以安装在第二反射杯124的上表面124-1上。其它的布置也可以是合适的。The Zener diode 150 may be disposed on one of the first reflective cup 122 or the second reflective cup 124 to increase the breakdown voltage of the light emitting device package 100 . As shown in FIG. 1 , a Zener diode 150 may be mounted on the upper surface 124 - 1 of the second reflective cup 124 . Other arrangements may also be suitable.
图2是图1中所示的发光器件封装的底视图，并且图3-6是图1中所示的发光器件封装的各种侧视图。参考图2至图6，通过其中形成的开口，第一反射杯122的下表面202被暴露在主体110的下表面107处，并且第一反射杯122的端部142从主体110的第一侧表面210突出并且被暴露到主体110的外部。通过其中形成的另一开口，第二反射杯124的下表面204也被暴露在主体110的下表面107处，并且第二反射杯124的端部144从主体110的第二侧表面220突出并且被暴露到主体110的外部。连接焊盘126的端部146从主体110的第三侧表面230突出并且被暴露到主体110的外部。第一和第二反射杯122和124的暴露的下表面202和204以及端部142和144可以允许将第一发光器件132和第二发光器件134产生的热传递到主体110的外部并且散发，并且允许更加有效地冷却发光器件封装。2 is a bottom view of the light emitting device package shown in FIG. 1 , and FIGS. 3-6 are various side views of the light emitting device package shown in FIG. 1 . 2 to 6, through the opening formed therein, the lower surface 202 of the first reflective cup 122 is exposed at the lower surface 107 of the main body 110, and the end 142 of the first reflective cup 122 is exposed from the first side of the main body 110. The surface 210 protrudes and is exposed to the outside of the body 110 . Through another opening formed therein, the lower surface 204 of the second reflective cup 124 is also exposed at the lower surface 107 of the main body 110, and the end 144 of the second reflective cup 124 protrudes from the second side surface 220 of the main body 110 and is exposed to the outside of the main body 110. The end portion 146 of the connection pad 126 protrudes from the third side surface 230 of the body 110 and is exposed to the outside of the body 110 . The exposed lower surfaces 202 and 204 and the end portions 142 and 144 of the first and second reflective cups 122 and 124 may allow heat generated by the first light emitting device 132 and the second light emitting device 134 to be transferred to the outside of the main body 110 and dissipated, And it allows more efficient cooling of the light emitting device package.
第一和第二反射杯122和124的暴露的端部142和144以及连接焊盘126的暴露的端部146可以具有诸如矩形、圆形、U形或者适当的其它形状的各种形状。第一反射杯122、第二反射杯124以及连接焊盘126的各厚度可以是200μm～300μm。暴露的端部142、144、146的各厚度可以是0.2mm～0.3mm。The exposed end portions 142 and 144 of the first and second reflective cups 122 and 124 and the exposed end portion 146 of the connection pad 126 may have various shapes such as rectangular, circular, U-shaped, or other suitable shapes. Each thickness of the first reflective cup 122 , the second reflective cup 124 and the connection pad 126 may be 200 μm˜300 μm. Each thickness of the exposed ends 142, 144, 146 may be 0.2 mm to 0.3 mm.
第一发光器件132可以设置在第一反射杯122的第一腔体162内，并且第二发光器件134可以设置在第二反射杯124的第二腔体164内。即，第一发光器件132可以定位在第一反射杯122的第一腔体162的底部上并且第二发光器件134可以定位在第二反射杯124的第二腔体164的底部上。第一发光器件132可以与第一腔体162的侧表面分离，并且第二发光器件134可以与第二腔体164的侧表面分离。第一发光器件132的长度和第二发光器件134的长度可以分别是400μm～1200μm。第一发光器件132的宽度和第二发光器件134的宽度可以分别是400μm～1200μm。第一发光器件132的厚度和第二发光器件134的厚度可以分别是100μm～200μm。例如，第一发光器件132的芯片尺寸和第二发光器件的芯片尺寸可以是800μm×400μm。第一发光器件132的厚度和第二发光器件的厚度可以是100μm～150μm。The first light emitting device 132 may be disposed in the first cavity 162 of the first reflective cup 122 , and the second light emitting device 134 may be disposed in the second cavity 164 of the second reflective cup 124 . That is, the first light emitting device 132 may be positioned on the bottom of the first cavity 162 of the first reflective cup 122 and the second light emitting device 134 may be positioned on the bottom of the second cavity 164 of the second reflective cup 124 . The first light emitting device 132 may be separated from a side surface of the first cavity 162 , and the second light emitting device 134 may be separated from a side surface of the second cavity 164 . The length of the first light emitting device 132 and the length of the second light emitting device 134 may be 400 μm˜1200 μm, respectively. The width of the first light emitting device 132 and the width of the second light emitting device 134 may be 400 μm˜1200 μm, respectively. The thickness of the first light emitting device 132 and the thickness of the second light emitting device 134 may be 100 μm˜200 μm, respectively. For example, the chip size of the first light emitting device 132 and the chip size of the second light emitting device may be 800 μm×400 μm. The thickness of the first light emitting device 132 and the thickness of the second light emitting device may be 100 μm˜150 μm.
布线152、154、156以及158可以经由连接焊盘126连接第一发光器件132和第二发光器件134。在图1中所示的实施例中，第一布线152连接第一发光器件132和第二反射杯122，第二布线154连接第一发光器件132和连接焊盘126，第三布线156连接连接焊盘126和第二发光器件134，并且第四布线158连接第二发光器件134和第二反射杯124。第二布线154可以结合在连接焊盘126和第一发光器件132之间，并且第三布线156可以结合在连接焊盘126和第二发光器件134之间，从而电连接第一发光器件132和第二发光器件134。The wirings 152 , 154 , 156 and 158 may connect the first light emitting device 132 and the second light emitting device 134 via the connection pad 126 . In the embodiment shown in FIG. 1, the first wiring 152 connects the first light-emitting device 132 and the second reflective cup 122, the second wiring 154 connects the first light-emitting device 132 and the connection pad 126, and the third wiring 156 connects the connection The pad 126 and the second light emitting device 134 , and the fourth wiring 158 connects the second light emitting device 134 and the second reflective cup 124 . The second wiring 154 may be bonded between the connection pad 126 and the first light emitting device 132, and the third wiring 156 may be bonded between the connection pad 126 and the second light emitting device 134, thereby electrically connecting the first light emitting device 132 and the second light emitting device 132. The second light emitting device 134 .
如图1中所示，齐纳二极管150可以安装在第二反射杯124的上表面124-1上，并且可以通过第五布线159电连接到第一反射杯122。例如，第五布线159的一端可以结合到齐纳二极管150，并且第五布线159的另一端可以结合到第一反射杯122的上表面122-1。在替代实施例中，齐纳二极管150可以安装在第一反射杯122的上表面122-1上，并且第五布线159的一端可以结合到齐纳二极管150并且第五布线159的另一端可以结合到第二反射杯124的上表面124-1。As shown in FIG. 1 , a Zener diode 150 may be mounted on the upper surface 124 - 1 of the second reflective cup 124 , and may be electrically connected to the first reflective cup 122 through a fifth wiring 159 . For example, one end of the fifth wiring 159 may be coupled to the Zener diode 150 , and the other end of the fifth wiring 159 may be coupled to the upper surface 122 - 1 of the first reflection cup 122 . In an alternative embodiment, the Zener diode 150 may be mounted on the upper surface 122-1 of the first reflective cup 122, and one end of the fifth wiring 159 may be bonded to the Zener diode 150 and the other end of the fifth wiring 159 may be bonded to to the upper surface 124 - 1 of the second reflective cup 124 .
连接焊盘126可以与第一反射杯122和第二反射杯124分离，因此独立于第一发光器件132和第二发光器件134。这可以允许连接焊盘126稳定地串联电连接第一发光器件132和第二发光器件134，从而提高电可靠性。The connection pad 126 may be separated from the first reflective cup 122 and the second reflective cup 124 , thus being independent from the first light emitting device 132 and the second light emitting device 134 . This may allow the connection pad 126 to stably electrically connect the first light emitting device 132 and the second light emitting device 134 in series, thereby improving electrical reliability.
当第一发光器件132和第二发光器件134发射光时，它们还可以在操作的过程中产生热。第一反射杯122可以防止由第一发光器件132产生的热被辐射或者传递到主体110，并且第二反射杯124可以防止由第二发光器件134产生的热被辐射或者传递到主体110。即，第一反射杯122和第二反射杯124可以使第一发光器件132和第二发光器件134热分离。此外，第一反射杯122和第二反射杯124可以防止从第一发光器件132发射的光与从第二发光器件134发射的光相互干涉。此外，因为第一反射杯122和第二反射杯124定位在主体110的内底部处，因此可以改进第一反射杯122和第二反射杯124之间的热分离，并且可以改进第一发光器件132和第二发光器件134之间的光干涉的防止。When the first light emitting device 132 and the second light emitting device 134 emit light, they may also generate heat during operation. The first reflective cup 122 may prevent heat generated by the first light emitting device 132 from being radiated or transferred to the body 110 , and the second reflective cup 124 may prevent heat generated by the second light emitting device 134 from being radiated or transferred to the body 110 . That is, the first reflective cup 122 and the second reflective cup 124 may thermally separate the first light emitting device 132 and the second light emitting device 134 . In addition, the first reflective cup 122 and the second reflective cup 124 can prevent the light emitted from the first light emitting device 132 and the light emitted from the second light emitting device 134 from interfering with each other. In addition, since the first reflective cup 122 and the second reflective cup 124 are positioned at the inner bottom of the main body 110, thermal separation between the first reflective cup 122 and the second reflective cup 124 can be improved, and the first light emitting device can be improved. 132 and the second light emitting device 134 to prevent light interference.
因此，在本实施例中，第一发光器件132定位在第一反射杯122的第一腔体162内，并且第二发光器件134定位在第二反射杯124的第二腔体164内，从而第一发光器件132和第二发光器件134相互热和光分离。Therefore, in this embodiment, the first light emitting device 132 is positioned in the first cavity 162 of the first reflective cup 122, and the second light emitting device 134 is positioned in the second cavity 164 of the second reflective cup 124, thereby The first light emitting device 132 and the second light emitting device 134 are thermally and optically separated from each other.
通过其可以将树脂注入主体110中的树脂注入孔240可以形成在主体110的下表面107上。树脂注入孔240可以位于第一反射杯122和第二反射杯124之间的位置处。A resin injection hole 240 through which resin may be injected into the main body 110 may be formed on the lower surface 107 of the main body 110 . The resin injection hole 240 may be located at a position between the first reflective cup 122 and the second reflective cup 124 .
图7是图1中所示的发光器件封装的平面图。在图7中，仅为了描述的清楚方便起见，省略了图1的布线152、154、156、158以及159。如图7中所示，第一反射杯122和第二反射杯124可以分离指定距离D1，并且可以由聚邻苯二甲酰胺(PPA)制成的主体110的底部的一部分可以位于其间。FIG. 7 is a plan view of the light emitting device package shown in FIG. 1 . In FIG. 7 , the wirings 152 , 154 , 156 , 158 , and 159 of FIG. 1 are omitted only for clarity and convenience of description. As shown in FIG. 7 , the first reflective cup 122 and the second reflective cup 124 may be separated by a specified distance D1, and a portion of the bottom of the body 110, which may be made of polyphthalamide (PPA), may be located therebetween.
为了分离热源(通过第一和第二芯片132和134的操作产生的热)并且有效地防止发光器件132和134之间的光干涉，第一反射杯122和第二反射杯124之间的分离距离D1可以是例如，100μm或者更多。基于相关组件的相对尺寸，其它分离距离也可以是合适的。In order to separate heat sources (heat generated by the operation of the first and second chips 132 and 134) and effectively prevent light interference between the light emitting devices 132 and 134, the separation between the first reflective cup 122 and the second reflective cup 124 The distance D1 may be, for example, 100 μm or more. Other separation distances may also be suitable based on the relative sizes of the components involved.
此外，为了有效地防止发光器件132和134之间的光干涉并且增加反射效率，第一发光器件132可以定位在第一反射杯124的底部上并且与第一反射杯122的侧表面分离指定距离，并且第二发光器件134可以定位在第二反射杯124的底部上并且与第二反射杯124的侧表面分离指定距离。从第一发光器件132到第一反射杯122的对侧表面的分离距离可以是相等或者不相等的。从第二发光器件134到第二反射杯124的对侧表面的分离距离可以是相等或者不相等的。In addition, in order to effectively prevent light interference between the light emitting devices 132 and 134 and increase reflection efficiency, the first light emitting device 132 may be positioned on the bottom of the first reflective cup 124 and separated from the side surface of the first reflective cup 122 by a specified distance. , and the second light emitting device 134 may be positioned on the bottom of the second reflective cup 124 and separated from the side surface of the second reflective cup 124 by a specified distance. Separation distances from the first light emitting device 132 to opposite side surfaces of the first reflective cup 122 may be equal or unequal. Separation distances from the second light emitting device 134 to opposite side surfaces of the second reflective cup 124 may be equal or unequal.
例如，安装在第一反射杯122上的第一发光器件132和安装在第二反射杯124上的第二发光器件134之间的节距可以是2mm～3mm。For example, the pitch between the first light emitting device 132 mounted on the first reflective cup 122 and the second light emitting device 134 mounted on the second reflective cup 124 may be 2mm˜3mm.
例如，第一发光器件132可以安装在第一反射杯122的底部的中心处，并且第二发光器件134可以安装在第二反射杯124的底部的中心处。For example, the first light emitting device 132 may be installed at the center of the bottom of the first reflective cup 122 , and the second light emitting device 134 may be installed at the center of the bottom of the second reflective cup 124 .
更加详细地，从第一反射杯122的短边表面到第一发光器件132的分离距离D2可以是例如200μm，并且从第一反射杯122的长边表面到第一发光器件132的分离距离D3可以是例如500μm。基于与反射杯尺寸有关的芯片尺寸，其它分离距离也可以是合适的。In more detail, the separation distance D2 from the short side surface of the first reflective cup 122 to the first light emitting device 132 may be, for example, 200 μm, and the separation distance D3 from the long side surface of the first reflective cup 122 to the first light emitting device 132 It may be, for example, 500 μm. Other separation distances may also be suitable based on chip size in relation to reflective cup size.
连接焊盘126可以与第一反射杯122和第二反射杯124分离指定距离D4，并且可以由聚邻苯二甲酰胺(PPA)制成的主体110的底部的一部分可以位于其间。The connection pad 126 may be separated from the first reflective cup 122 and the second reflective cup 124 by a specified distance D4, and a portion of the bottom of the body 110, which may be made of polyphthalamide (PPA), may be located therebetween.
例如，第一反射杯122和连接焊盘126之间的分离距离D4可以等于第一反射杯122和第二反射杯124之间的分离距离D1。基于相关组件的相对尺寸，其它分离距离也可以是合适的。For example, the separation distance D4 between the first reflective cup 122 and the connection pad 126 may be equal to the separation distance D1 between the first reflective cup 122 and the second reflective cup 124 . Other separation distances may also be suitable based on the relative sizes of the components involved.
图8是沿着图7中所示的发光器件封装的线A-A’截取的截面图。在图8中，仅为了清楚起见，省略了布线152、154、156、158以及159。FIG. 8 is a cross-sectional view taken along line A-A' of the light emitting device package shown in FIG. 7 . In FIG. 8 , wirings 152 , 154 , 156 , 158 , and 159 are omitted for clarity only.
如图8中所示，第一反射杯122的侧表面的倾斜角θ1可以不同于主体腔体105的侧表面的倾斜角。例如，第一反射杯122的侧表面相对于第一反射杯122的底部的倾斜角θ1可以是90～160°。其它的取向也可以是合适的。主体腔体105的侧表面102相对于主体腔体105的底部103的倾斜角θ2可以是140～170°。As shown in FIG. 8 , the inclination angle θ1 of the side surface of the first reflection cup 122 may be different from the inclination angle of the side surface of the body cavity 105 . For example, the inclination angle θ1 of the side surface of the first reflective cup 122 relative to the bottom of the first reflective cup 122 may be 90˜160°. Other orientations may also be suitable. The inclination angle θ2 of the side surface 102 of the body cavity 105 relative to the bottom 103 of the body cavity 105 may be 140˜170°.
主体腔体105的侧表面的上端可以包括弯曲边缘。即，主体腔体105的上端的侧表面可以是弯曲的。更加详细地，主体腔体105可以具有位于主体110的上表面802和底部103之间的边缘部分804。边缘部分804可以与主体110的上表面802具有高度差K1，并且可以平行于主体110的上表面802。例如，边缘部分804可以形成在主体腔体105的侧表面102的上端处。An upper end of a side surface of the body cavity 105 may include a curved edge. That is, the side surface of the upper end of the body cavity 105 may be curved. In more detail, the body cavity 105 may have an edge portion 804 between the upper surface 802 and the bottom 103 of the body 110 . The edge portion 804 may have a height difference K1 from the upper surface 802 of the main body 110 and may be parallel to the upper surface 802 of the main body 110 . For example, an edge portion 804 may be formed at an upper end of the side surface 102 of the body cavity 105 .
主体腔体105的上表面802与边缘部分804之间的高度差K1可以是例如50～80μm，并且边缘部分804的长度K2可以是50～130μm。基于相关组件的尺寸，其它的高度/长度也可以是合适的。此外，主体腔体105的侧表面102的上端可以具有超过两个的边缘部分，每个边缘部分具有高度差以形成一系列台阶。在主体腔体105的侧表面102的上端处的与上表面802具有高度差K1的边缘部分804的形成可以延长气体渗透路径，从而防止外部气体渗透到发光器件封装100的内部并且因此改进了发光器件封装100的气密性。A height difference K1 between the upper surface 802 of the body cavity 105 and the edge portion 804 may be, for example, 50˜80 μm, and the length K2 of the edge portion 804 may be 50˜130 μm. Other heights/lengths may also be suitable based on the dimensions of the associated components. In addition, the upper end of the side surface 102 of the body cavity 105 may have more than two edge portions, each edge portion having a height difference to form a series of steps. The formation of the edge portion 804 at the upper end of the side surface 102 of the main body cavity 105 with a height difference K1 from the upper surface 802 can extend the gas permeation path, thereby preventing external gas from penetrating into the interior of the light emitting device package 100 and thus improving light emission. Hermeticity of the device package 100 .
为了防止发光器件132和134之间的光干涉并且提高光反射效率，通过考虑发光器件132和134的高度可以确定第一反射杯122和第二反射杯124的深度H。In order to prevent light interference between the light emitting devices 132 and 134 and improve light reflection efficiency, the depth H of the first reflective cup 122 and the second reflective cup 124 may be determined by considering the height of the light emitting devices 132 and 134 .
例如，如图13a中所示，第一反射杯122的上表面122-1可以平行于安装在第一反射杯122的底部122-2上的第一发光器件132的上表面。第一反射杯122的深度H1可以等于第一发光器件132的高度a1(H1＝a1)。深度H1可以是第一反射杯122的上表面122-1和底部122-2之间的距离。可以以类似的方式确定本实施例中与发光器件134的高度有关的第二反射杯124的深度。在某些实施例中，第一反射杯122的深度可以等于第二反射杯124的深度。反射杯122和124的其它高度和发光器件132和134的相应高度及其组合也可以是合适的。For example, as shown in FIG. 13 a , the upper surface 122 - 1 of the first reflective cup 122 may be parallel to the upper surface of the first light emitting device 132 mounted on the bottom 122 - 2 of the first reflective cup 122 . The depth H1 of the first reflective cup 122 may be equal to the height a1 of the first light emitting device 132 (H1=a1). The depth H1 may be the distance between the upper surface 122 - 1 and the bottom 122 - 2 of the first reflective cup 122 . The depth of the second reflective cup 124 related to the height of the light emitting device 134 in this embodiment can be determined in a similar manner. In some embodiments, the depth of the first reflective cup 122 may be equal to the depth of the second reflective cup 124 . Other heights of reflective cups 122 and 124 and corresponding heights of light emitting devices 132 and 134 and combinations thereof may also be suitable.
在图13b中所示的实施例中，第一反射杯122的上表面122-1高于安装在第一反射杯122的底部122-2上的第一发光器件132的上表面。即，第一反射杯122的深度H2大于第一发光器件132的高度a1(H2>a1)。在某些实施例中，第一反射杯122的深度H2可以大于第一发光器件132的高度a1并且小于第一发光器件132的高度a1的两倍(a1<H2<2a1)。可以以类似的方式确定本实施例中与发光器件134有关的第二反射杯124的深度。In the embodiment shown in FIG. 13 b , the upper surface 122 - 1 of the first reflective cup 122 is higher than the upper surface of the first light emitting device 132 mounted on the bottom 122 - 2 of the first reflective cup 122 . That is, the depth H2 of the first reflective cup 122 is greater than the height a1 of the first light emitting device 132 (H2>a1). In some embodiments, the depth H2 of the first reflective cup 122 may be greater than the height a1 of the first light emitting device 132 and less than twice the height a1 of the first light emitting device 132 (a1<H2<2a1). The depth of the second reflective cup 124 related to the light emitting device 134 in this embodiment can be determined in a similar manner.
在图13c中所示的实施例中，第一反射杯122的上表面122-1低于安装在第一反射杯122的底部122-2上的第一发光器件132的上表面。第一反射杯122的深度H3小于第一发光器件132的高度a1(H3<a1)。在某些实施例中，第一反射杯122的深度H3可以小于第一发光器件132的高度a1并且大于第一发光器件132的高度a1的一半(a1/2<H3<a1)。可以以类似的方式确定本实施例中与发光器件134有关的第二反射杯124的高度。In the embodiment shown in FIG. 13 c , the upper surface 122 - 1 of the first reflective cup 122 is lower than the upper surface of the first light emitting device 132 mounted on the bottom 122 - 2 of the first reflective cup 122 . The depth H3 of the first reflective cup 122 is smaller than the height a1 of the first light emitting device 132 (H3<a1). In some embodiments, the depth H3 of the first reflective cup 122 may be less than the height a1 of the first light emitting device 132 and greater than half of the height a1 of the first light emitting device 132 (a1/2<H3<a1). The height of the second reflective cup 124 related to the light emitting device 134 in this embodiment can be determined in a similar manner.
图9是沿着图7中所示的发光器件封装的线B-B’截取的截面图。在图9中，仅为了清楚起见，省略了布线152、154、156、158以及159。如图9中所示，连接焊盘126的上表面可以基本平行于第一反射杯122和第二反射杯124的上表面，并且当它经过主体110的第三侧表面230并且暴露到主体110的外部时，连接焊盘126的端部146可以形成主体110的底部的一部分。FIG. 9 is a cross-sectional view taken along line B-B' of the light emitting device package shown in FIG. 7 . In FIG. 9 , wirings 152 , 154 , 156 , 158 , and 159 are omitted for clarity only. As shown in FIG. 9, the upper surface of the connection pad 126 may be substantially parallel to the upper surfaces of the first reflective cup 122 and the second reflective cup 124, and when it passes through the third side surface 230 of the main body 110 and is exposed to the main body 110 Externally, the end 146 of the connection pad 126 may form part of the bottom of the main body 110 .
在根据本实施例的发光器件封装100中，如图8中所示，主体腔体105的内部可以被填充有包封材料820，以便密封和保护第一发光器件132和第二发光器件134。In the light emitting device package 100 according to the present embodiment, as shown in FIG. 8 , the inside of the body cavity 105 may be filled with an encapsulation material 820 in order to seal and protect the first light emitting device 132 and the second light emitting device 134 .
包封材料820可以填充其中安装第一发光器件132的第一反射杯122的内部和其中安装第二发光器件134的第二反射杯124的内部、以及主体腔体105的内部，以将第一发光器件132和第二发光器件134与外部隔离。例如，包封材料820可以是硅、树脂、或者其它这样的材料。通过使用硅或者树脂材料填充主体腔体105的内部，并且然后适当地固化材料可以实现包封材料820的形成。包封材料820可以是以适当的方式填充在腔体105中的其它材料。The encapsulation material 820 may fill the inside of the first reflective cup 122 where the first light emitting device 132 is installed, the inside of the second reflective cup 124 where the second light emitting device 134 is installed, and the inside of the body cavity 105, so that the first The light emitting device 132 and the second light emitting device 134 are isolated from the outside. For example, encapsulation material 820 may be silicon, resin, or other such materials. Formation of the encapsulation material 820 may be achieved by filling the interior of the body cavity 105 with a silicon or resin material, and then curing the material appropriately. The encapsulation material 820 may be other materials filled in the cavity 105 in a suitable manner.
包封材料820可以包括荧光体以改变从第一发光器件132和第二发光器件134发射的光的特性，并且通过荧光体可以激励从第一和第二发光器件132和134发射的光从而实现不同的颜色。例如，如果发光器件132和134是蓝色发光二极管并且包封材料820包括黄荧光体，那么通过黄荧光体激励蓝光，从而产生白光。如果发光器件132和134发射紫外(UV)光，那么包封材料820可以包括红(R)、绿(G)以及蓝(B)荧光体以产生白光。此外，透镜也可以设置在包封材料820上以调节由发光器件封装100发射的光的分布。The encapsulation material 820 may include a phosphor to change characteristics of light emitted from the first light emitting device 132 and the second light emitting device 134, and the light emitted from the first and second light emitting devices 132 and 134 may be excited by the phosphor to achieve different color. For example, if light emitting devices 132 and 134 are blue light emitting diodes and encapsulation material 820 includes yellow phosphor, then blue light is excited by the yellow phosphor, thereby generating white light. If the light emitting devices 132 and 134 emit ultraviolet (UV) light, the encapsulation material 820 may include red (R), green (G) and blue (B) phosphors to generate white light. In addition, a lens may also be disposed on the encapsulation material 820 to adjust the distribution of light emitted by the light emitting device package 100 .
图10示出根据在此宽泛地描述的实施例的发光器件封装的发光器件的串联连接。如图10中所示，第一布线1052的一端可以结合到第一反射杯122的上表面122-1，并且第一布线1052的另一端可以结合到第一发光器件132。此外，第二布线1054的一端可以结合到第一发光器件132，并且第二布线1054的另一端可以结合到连接焊盘126。第三布线1056的一端可以结合到连接焊盘126，并且第三布线1056的另一端可以结合到第二发光器件134。此外，第四布线1058的一端可以结合到第二发光器件134，并且第四布线1058的另一端可以结合到第二反射杯124的上表面124-1。Fig. 10 shows a series connection of light emitting devices of a light emitting device package according to embodiments broadly described herein. As shown in FIG. 10 , one end of the first wiring 1052 may be bonded to the upper surface 122 - 1 of the first reflective cup 122 , and the other end of the first wiring 1052 may be bonded to the first light emitting device 132 . In addition, one end of the second wiring 1054 may be coupled to the first light emitting device 132 , and the other end of the second wiring 1054 may be coupled to the connection pad 126 . One end of the third wiring 1056 may be coupled to the connection pad 126 , and the other end of the third wiring 1056 may be coupled to the second light emitting device 134 . In addition, one end of the fourth wiring 1058 may be coupled to the second light emitting device 134 , and the other end of the fourth wiring 1058 may be coupled to the upper surface 124 - 1 of the second reflective cup 124 .
图10中所示的发光器件132和134通过第一至第四布线1052、1054、1056以及1058可以串联地电连接。因为经由独立于发光器件132和134的连接焊盘126实现图10中所示的发光器件132和134之间的串联连接，所以可以稳定地串联电连接第一发光器件132和第二发光器件134，从而提高发光器件封装的电可靠性。The light emitting devices 132 and 134 shown in FIG. 10 may be electrically connected in series through first to fourth wirings 1052 , 1054 , 1056 and 1058 . Since the series connection between the light emitting devices 132 and 134 shown in FIG. 10 is realized via the connection pad 126 independent of the light emitting devices 132 and 134, the first light emitting device 132 and the second light emitting device 134 can be stably electrically connected in series. , thereby improving the electrical reliability of the light emitting device package.
图11示出根据在此宽泛地描述的另一实施例的发光器件封装的发光器件的并联连接。如图11中所示，第一布线1152的一端可以结合到第一反射杯122的上表面122-1，并且第一布线1152的另一端可以结合到第一发光器件132。第二布线1154的一端可以结合到第一发光器件132，并且第二布线1154的另一端可以结合到第二反射杯124的上表面124-1。第三布线1156的一端可以结合到第一反射杯122的上表面122-1，并且第三布线1156的另一端可以结合到第二发光器件134。最后，第四布线1158的一端可以结合到第二发光器件134，并且第四布线1158的另一端可以结合到第二反射杯124的上表面124-1。因此，发光器件132和134可以通过第一至第四布线1152、1154、1156以及1158并联地电连接。Fig. 11 shows a parallel connection of light emitting devices of a light emitting device package according to another embodiment broadly described herein. As shown in FIG. 11 , one end of the first wiring 1152 may be bonded to the upper surface 122 - 1 of the first reflective cup 122 , and the other end of the first wiring 1152 may be bonded to the first light emitting device 132 . One end of the second wiring 1154 may be coupled to the first light emitting device 132 , and the other end of the second wiring 1154 may be coupled to the upper surface 124 - 1 of the second reflective cup 124 . One end of the third wiring 1156 may be coupled to the upper surface 122 - 1 of the first reflective cup 122 , and the other end of the third wiring 1156 may be coupled to the second light emitting device 134 . Finally, one end of the fourth wiring 1158 may be coupled to the second light emitting device 134 , and the other end of the fourth wiring 1158 may be coupled to the upper surface 124 - 1 of the second reflective cup 124 . Accordingly, the light emitting devices 132 and 134 may be electrically connected in parallel through the first to fourth wirings 1152 , 1154 , 1156 and 1158 .
图12示出根据在此宽泛地描述的另一实施例的发光器件封装的发光器件的串联连接。如图12中所示，第一布线1252的一端可以结合到第一反射杯122的上表面122-1，并且第一布线1252的另一端可以结合到第一发光器件132。此外，第二布线1254的一端可以结合到第一发光器件132，并且第二布线1254的另一端可以直接结合到第二发光器件134。第三布线1256的一端可以结合到第二发光器件134，并且第三布线1256的另一端可以结合到第二反射杯124的上表面124-1。Fig. 12 shows a series connection of light emitting devices of a light emitting device package according to another embodiment broadly described herein. As shown in FIG. 12 , one end of the first wiring 1252 may be bonded to the upper surface 122 - 1 of the first reflective cup 122 , and the other end of the first wiring 1252 may be bonded to the first light emitting device 132 . In addition, one end of the second wiring 1254 may be coupled to the first light emitting device 132 , and the other end of the second wiring 1254 may be directly coupled to the second light emitting device 134 . One end of the third wiring 1256 may be coupled to the second light emitting device 134 , and the other end of the third wiring 1256 may be coupled to the upper surface 124 - 1 of the second reflective cup 124 .
可以通过第一至第三布线1252、1254以及1256串联地电连接图12中所示的发光器件132和134。不同于图10，第一发光器件132和第二发光器件134没有经由连接焊盘126进行连接而是通过第二布线1254直接地连接。The light emitting devices 132 and 134 shown in FIG. 12 may be electrically connected in series through first to third wirings 1252 , 1254 and 1256 . Unlike FIG. 10 , the first light emitting device 132 and the second light emitting device 134 are not connected via the connection pad 126 but are directly connected through the second wiring 1254 .
分别结合到第一反射杯122、第二反射杯124、第一发光器件132、第二发光器件134以及齐纳二极管150的上述布线可以位于主体腔体105的上表面106下面。The aforementioned wirings respectively coupled to the first reflective cup 122 , the second reflective cup 124 , the first light emitting device 132 , the second light emitting device 134 and the Zener diode 150 may be located below the upper surface 106 of the body cavity 105 .
上述实施例没有描述一个杯型的发光器件封装，而是描述了其中发光器件132和134分别安装在主体110中的两个单独的反射杯122和124中的发光器件封装100。通过这样的结构，可以相互分离在操作期间产生热的发光器件132和134，并且通过反射杯122和124可以阻挡由发光器件132和134产生的热，从而防止发光器件封装100的主体110由于热而变色并且延长发光器件封装100的寿命。此外，两个单独的反射杯122和124可以防止发光器件132和134之间的光干涉。The above embodiment does not describe one cup-type light emitting device package, but describes the light emitting device package 100 in which the light emitting devices 132 and 134 are respectively installed in two separate reflective cups 122 and 124 in the main body 110 . With such a structure, the light emitting devices 132 and 134 that generate heat during operation can be separated from each other, and the heat generated by the light emitting devices 132 and 134 can be blocked by the reflective cups 122 and 124, thereby preventing the main body 110 of the light emitting device package 100 from being heated due to heat. And change the color and prolong the life of the light emitting device package 100 . In addition, the two separate reflective cups 122 and 124 can prevent light interference between the light emitting devices 132 and 134 .
图14是根据在此宽泛地描述的实施例的第一发光器件和第二发光器件。如图14中所示，第一发光器件132包括衬底20、发光结构30、导电层40、第一电极12、以及第二电极14。第二发光器件134包括衬底20、发光结构30、导电层40、第三电极16、以及第四电极18。第二发光器件134能够包括与第一发光器件相同的组件。Figure 14 is a first light emitting device and a second light emitting device according to embodiments broadly described herein. As shown in FIG. 14 , the first light emitting device 132 includes a substrate 20 , a light emitting structure 30 , a conductive layer 40 , a first electrode 12 , and a second electrode 14 . The second light emitting device 134 includes a substrate 20 , a light emitting structure 30 , a conductive layer 40 , a third electrode 16 , and a fourth electrode 18 . The second light emitting device 134 can include the same components as the first light emitting device.
衬底20支撑发光结构30并且能够是蓝宝石衬底、硅Si衬底、氧化锌ZnO衬底、以及具有堆叠在其上的GaN、InGaN、AlInGaN、SiC、GaP、InP、Ga2O3、以及GaAs中的至少一个的氮化物半导体衬底或者模板衬底中的任意一个。The substrate 20 supports the light emitting structure 30 and can be a sapphire substrate, a silicon Si substrate, a zinc oxide ZnO substrate, and a substrate having GaN, InGaN, AlInGaN, SiC, GaP, InP, Ga2 O3 , and Any one of a nitride semiconductor substrate of at least one of GaAs or a template substrate.
发光结构130包括第一导电类型半导体层32、有源层33、以及第二导电类型半导体层34。例如，发光结构30能够是其中第一导电类型半导体层32、有源层33、以及第二导电类型半导体层34顺序地堆叠在衬底20上的结构。The light emitting structure 130 includes a first conductive type semiconductor layer 32 , an active layer 33 , and a second conductive type semiconductor layer 34 . For example, the light emitting structure 30 can be a structure in which the first conductive type semiconductor layer 32 , the active layer 33 , and the second conductive type semiconductor layer 34 are sequentially stacked on the substrate 20 .
第一导电类型半导体层32布置在衬底20上。例如，第一导电类型半导体层32能够包括从具有InxAlyGa1-x-yN(0≤x≤1，0≤y≤1，0≤x+y≤1)的组成的半导体材料，例如，GaN、AlN、AlGaN、InGaN、InN、InAlGaN、AlInN中选择的n型半导体层，并且能够被掺杂有诸如Si、Ge、Sn、Se、Te的n型掺杂物。The first conductive type semiconductor layer 32 is disposed on the substrate 20 . For example, the first conductivity type semiconductor layer 32 can include a semiconductor material having a composition of InxAlyGa1-xyN(0≤x≤1 , 0≤y≤1, 0≤x+y≤1), for example , an n-type semiconductor layer selected from GaN, AlN, AlGaN, InGaN, InN, InAlGaN, AlInN, and can be doped with n-type dopants such as Si, Ge, Sn, Se, Te.
有源层22布置在导电类型第一半导体层32上。例如，有源层33能够包括具有InxAlyGa1-x-yN(0≤x≤1，0≤y≤1，0≤x+y≤1)的组成的半导体材料，并且能够包括从量子线结构、量子点结构、单量子阱结构以及多量子阱结构MQW中选择的至少一个。The active layer 22 is disposed on the conductive type first semiconductor layer 32 . For example, the active layer 33 can include a semiconductor material having a composition of InxAlyGa1-xyN(0≤x≤1 , 0≤y≤1, 0≤x+y≤1), and can include quantum At least one selected from a wire structure, a quantum dot structure, a single quantum well structure, and a multiple quantum well structure MQW.
第二导电类型半导体层34布置在有源层33上。例如，第二导电类型半导体层34能够是从具有InxAlyGa1-x-yN(0≤x≤1，0≤y≤1，0≤x+y≤1)的组成的半导体材料，例如，GaN、AlN、AlGaN、InGaN、InN、InAlGaN、AlInN中选择的p型半导体层，并且能够被掺杂有诸如Mg、Zn、Ca、Sr、Ba的p型掺杂物。The second conductive type semiconductor layer 34 is disposed on the active layer 33 . For example, the second conductivity type semiconductor layer 34 can be a semiconductor material having a composition of InxAlyGa1-xyN(0≤x≤1 , 0≤y≤1, 0≤x+y≤1), for example , a p-type semiconductor layer selected from GaN, AlN, AlGaN, InGaN, InN, InAlGaN, AlInN, and can be doped with p-type dopants such as Mg, Zn, Ca, Sr, Ba.
发光结构30能够是其中对第二导电类型半导体层34、有源层33以及第一导电类型半导体层32的一部分进行台面蚀刻以暴露第一导电类型半导体层32的区域的结构。The light emitting structure 30 can be a structure in which a portion of the second conductive type semiconductor layer 34 , the active layer 33 , and the first conductive type semiconductor layer 32 are mesa etched to expose a region of the first conductive type semiconductor layer 32 .
导电层40布置在第二导电类型半导体层34上。因为导电层40不仅减少全反射，而且具有优秀的光透射性，因此导电层40增加从有源层33发射到第二导电类型半导体层34的光的提取效率。导电层40能够由在光的波长上具有高透射率的透明氧化物族材料形成。例如，透明氧化物族材料能够是ITO(铟锡氧化物)、TO(氧化锡)、IZO(铟锌氧化物)以及ZnO(氧化锌)。The conductive layer 40 is disposed on the second conductive type semiconductor layer 34 . Since the conductive layer 40 not only reduces total reflection but also has excellent light transmittance, the conductive layer 40 increases extraction efficiency of light emitted from the active layer 33 to the second conductive type semiconductor layer 34 . The conductive layer 40 can be formed of a transparent oxide group material having high transmittance at the wavelength of light. For example, the transparent oxide group material can be ITO (Indium Tin Oxide), TO (Tin Oxide), IZO (Indium Zinc Oxide), and ZnO (Zinc Oxide).
第一电极12或者第三电极16能够布置在第一导电类型半导体层32的暴露区域上。第二电极14或者第四电极18能够布置在导电层40上。第一电极12和第二电极14是彼此不同的类型。第三电极16和第四电极14是彼此不同的类型。第一电极12和第三电极18是彼此相同的类型。第二电极14和第四电极18是彼此相同的类型。例如，第一电极12和第三电极16能够是n型电极，并且第二电极14和第四电极18能够是p型电极。第一至第四电极12、14、16、18能够是包括从Ti、Al、Al合金、In、Ta、Pd、Co、Ni、Si、Ge、Ag、Ag合金、Au、Hf、Pt、Ru以及Au中选择的至少一个的合金或者材料的单层或者多层。The first electrode 12 or the third electrode 16 can be disposed on the exposed region of the first conductive type semiconductor layer 32 . The second electrode 14 or the fourth electrode 18 can be arranged on the conductive layer 40 . The first electrode 12 and the second electrode 14 are of different types from each other. The third electrode 16 and the fourth electrode 14 are of different types from each other. The first electrode 12 and the third electrode 18 are of the same type as each other. The second electrode 14 and the fourth electrode 18 are of the same type as each other. For example, the first electrode 12 and the third electrode 16 can be n-type electrodes, and the second electrode 14 and the fourth electrode 18 can be p-type electrodes. The first to fourth electrodes 12, 14, 16, 18 can be made from Ti, Al, Al alloy, In, Ta, Pd, Co, Ni, Si, Ge, Ag, Ag alloy, Au, Hf, Pt, Ru And a single layer or multiple layers of at least one alloy or material selected from Au.
图15是根据在此宽泛地描述的实施例的第一、第二、第三、以及第四电极之间的第一连接。如图15中所示，第一电极12和第二电极14中的一个电连接到第一反射杯122，并且第三电极16和第四电极18中的一个电连接到第二反射杯124。连接焊盘126电连接第一电极12和第二电极14中的另一个与第三电极16和第四电极18中的另一个。Figure 15 is a first connection between first, second, third, and fourth electrodes according to embodiments broadly described herein. As shown in FIG. 15 , one of the first electrode 12 and the second electrode 14 is electrically connected to the first reflective cup 122 , and one of the third electrode 16 and the fourth electrode 18 is electrically connected to the second reflective cup 124 . The connection pad 126 electrically connects the other of the first electrode 12 and the second electrode 14 with the other of the third electrode 16 and the fourth electrode 18 .
例如，第一发光器件132的第一电极12能够通过第一布线1052电连接到第一反射杯122，并且第二发光器件134的第四电极18能够通过第四布线1058电连接到第二反射杯124。连接焊盘126通过第二和第三布线1054和1056电连接第一发光器件132的第二电极14和第二发光器件134的第三电极16。第一发光器件的第二电极14能够通过第二布线1054电连接到连接焊盘126，并且第二电极134的第三电极16能够通过第三布线1056电连接到连接焊盘126。For example, the first electrode 12 of the first light emitting device 132 can be electrically connected to the first reflective cup 122 through the first wiring 1052, and the fourth electrode 18 of the second light emitting device 134 can be electrically connected to the second reflective cup 122 through the fourth wiring 1058. Cup 124. The connection pad 126 electrically connects the second electrode 14 of the first light emitting device 132 and the third electrode 16 of the second light emitting device 134 through the second and third wirings 1054 and 1056 . The second electrode 14 of the first light emitting device can be electrically connected to the connection pad 126 through the second wiring 1054 , and the third electrode 16 of the second electrode 134 can be electrically connected to the connection pad 126 through the third wiring 1056 .
图16是根据在此宽泛地描述的实施例的第一、第二、第三以及第四电极之间的第二连接。如图16中所示，第一电极12和第二电极14中的一个电连接到第一反射杯122，并且第三电极16和第四电极18中的一个电连接到第二反射杯124。第一电极12和第二电极14中的另一个电连接到第二反射杯124。第三电极16和第四电极18中的另一个电连接到第一反射杯122。Figure 16 is a second connection between the first, second, third and fourth electrodes according to embodiments broadly described herein. As shown in FIG. 16 , one of the first electrode 12 and the second electrode 14 is electrically connected to the first reflective cup 122 , and one of the third electrode 16 and the fourth electrode 18 is electrically connected to the second reflective cup 124 . The other of the first electrode 12 and the second electrode 14 is electrically connected to the second reflective cup 124 . The other of the third electrode 16 and the fourth electrode 18 is electrically connected to the first reflective cup 122 .
例如，第一发光器件132的第一电极12能够通过第一布线1152电连接到第一反射杯122，并且第二发光器件134的第四电极18能够通过第四布线1158电连接到第二反射杯124。第一发光器件的第二电极14能够通过第二布线1154电连接到第二反射杯124，并且第二发光器件134的第三电极16能够通过第三布线1156电连接到第一反射杯122。For example, the first electrode 12 of the first light emitting device 132 can be electrically connected to the first reflective cup 122 through the first wiring 1152 , and the fourth electrode 18 of the second light emitting device 134 can be electrically connected to the second reflective cup 122 through the fourth wiring 1158 . Cup 124. The second electrode 14 of the first light emitting device can be electrically connected to the second reflective cup 124 through the second wiring 1154 , and the third electrode 16 of the second light emitting device 134 can be electrically connected to the first reflective cup 122 through the third wiring 1156 .
图17是根据在此宽泛地描述的实施例的第一、第二、第三、以及第四电极之间的第三连接。如图17中所示，第一电极12和第二电极14中的一个电连接到第一反射杯122，并且第三电极16和第四电极18中的一个电连接到第二反射杯124。第一电极12和第二电极14中的另一个电连接到第三电极16和第四电极18中的另一个。Figure 17 is a third connection between the first, second, third, and fourth electrodes according to embodiments broadly described herein. As shown in FIG. 17 , one of the first electrode 12 and the second electrode 14 is electrically connected to the first reflective cup 122 , and one of the third electrode 16 and the fourth electrode 18 is electrically connected to the second reflective cup 124 . The other of the first electrode 12 and the second electrode 14 is electrically connected to the other of the third electrode 16 and the fourth electrode 18 .
例如，第一发光器件132的第一电极12能够通过第一布线1252电连接到第一反射杯122，并且第二发光器件134的第四电极18能够通过第四布线1258电连接到第二反射杯124。第一发光器件的第二电极14能够通过第三布线1254电连接到第二发光器件134的第三电极16。For example, the first electrode 12 of the first light emitting device 132 can be electrically connected to the first reflective cup 122 through the first wiring 1252, and the fourth electrode 18 of the second light emitting device 134 can be electrically connected to the second reflective cup 122 through the fourth wiring 1258. Cup 124. The second electrode 14 of the first light emitting device can be electrically connected to the third electrode 16 of the second light emitting device 134 through the third wiring 1254 .
图18是包括在此具体化并且宽泛地描述的发光器件封装的照明设备的分解透视图。照明设备可以包括：光源750，该光源750发射光；外壳700，光源750安装在其中；散热装置740，该散热装置740散发光源750的热；以及保持器760，该保持器760将光源750和散热装置740连接到外壳700。Fig. 18 is an exploded perspective view of a lighting device including a light emitting device package embodied and broadly described herein. The lighting device may include: a light source 750 emitting light; a housing 700 in which the light source 750 is installed; a heat sink 740 which dissipates heat from the light source 750; and a holder 760 which holds the light source 750 and The heat sink 740 is connected to the case 700 .
外壳700包括插座连接器710，该插座连接器710用于连接到电插座；和主体730，该主体730与插座连接器710相连接。空气流动孔720可以形成为穿过主体730。The housing 700 includes a receptacle connector 710 for connecting to an electrical receptacle; and a body 730 to which the receptacle connector 710 is connected. The air flow hole 720 may be formed through the body 730 .
替代地，多个空气流动孔720可以形成为穿过主体730。即，一个空气流动孔720可以形成为穿过主体730，或者以放射状形状布置的多个空气流动孔可以形成为穿过主体730。多个空气流动孔730的其它布置也可以是适当的。Alternatively, a plurality of air flow holes 720 may be formed through the body 730 . That is, one air flow hole 720 may be formed through the body 730 , or a plurality of air flow holes arranged in a radial shape may be formed through the body 730 . Other arrangements of the plurality of air flow holes 730 may also be suitable.
光源750可以包括基板754和设置在基板754上的多个发光器件封装752。基板754可以具有能够插入到外壳700的开口中的形状，并且可以由具有相对高的导热性的材料制成以将热传递到散热装置740。The light source 750 may include a substrate 754 and a plurality of light emitting device packages 752 disposed on the substrate 754 . The substrate 754 may have a shape capable of being inserted into an opening of the case 700 , and may be made of a material having relatively high thermal conductivity to transfer heat to the heat sink 740 .
保持器760可以布置在光源750下面。保持器760可以包括框架和额外的空气流动孔。光学构件也可以布置在光源750下面以扩散、散射或者集中从光源750的发光器件封装752发射的光。根据本实施例的照明设备可以采用根据在此宽泛地描述的实施例的发光器件封装，从而延长安装在照明设备上的发光器件封装的寿命并且防止光干涉。The holder 760 may be disposed under the light source 750 . Holder 760 may include a frame and additional air flow holes. Optical members may also be disposed under the light source 750 to diffuse, scatter, or concentrate light emitted from the light emitting device package 752 of the light source 750 . The lighting device according to the present embodiment may employ the light emitting device package according to the embodiments broadly described herein, thereby prolonging the lifetime of the light emitting device package mounted on the lighting device and preventing light interference.
图19是包括在此具体化并且宽泛地描述的发光器件封装的显示设备的分解透视图。19 is an exploded perspective view of a display apparatus including a light emitting device package embodied and broadly described herein.
显示设备800可以包括：光源模块；反射板820，该反射板820设置在底盖810上方；导光板840，该导光板840定位在反射板820的前面以将从光源模块发射的光导向显示设备800的前部；光学片，包括例如棱镜片850和860，并且定位在导光板840的前面；面板870，该面板870定位在棱镜片850和860的前面；以及滤色片880，该滤色片880定位在面板870的前面。底盖810、反射板820、光源模块、导光板840以及光学片可以形成背光单元。The display device 800 may include: a light source module; a reflective plate 820 disposed above the bottom cover 810; a light guide plate 840 positioned in front of the reflective plate 820 to guide light emitted from the light source module to the display device The front portion of 800; the optical sheet, including, for example, prism sheets 850 and 860, and positioned in front of the light guide plate 840; the panel 870, the panel 870 positioned in front of the prism sheets 850 and 860; and a color filter 880, the color filter Sheet 880 is positioned in front of panel 870 . The bottom cover 810, the reflection plate 820, the light source module, the light guide plate 840, and the optical sheets may form a backlight unit.
光源模块可以包括基板830和设置在基板830上的发光器件封装835。印刷电路板(PCB)可以用作基板830，并且图1中所示的发光器件封装100可以用作发光器件封装835。其它的组合也可以是适当的。The light source module may include a substrate 830 and a light emitting device package 835 disposed on the substrate 830 . A printed circuit board (PCB) may be used as the substrate 830 , and the light emitting device package 100 shown in FIG. 1 may be used as the light emitting device package 835 . Other combinations may also be suitable.
底盖810可以容纳显示设备800中的组件。反射板820可以设置为单独的元件，如图19中所示，或者可以通过使用具有高反射率的材料来涂覆导光板840的后表面或者底盖810的前表面来提供反射板820。例如，反射板820可以由诸如聚对苯二甲酸乙二酯(PET)的具有相对高反射率并且可用于/能够在超薄状态下进行制造的材料，或者其它这样的材料制成。The bottom cover 810 may accommodate components in the display device 800 . The reflective plate 820 may be provided as a separate element, as shown in FIG. 19 , or may be provided by coating the rear surface of the light guide plate 840 or the front surface of the bottom cover 810 with a material having high reflectivity. For example, the reflection plate 820 may be made of a material such as polyethylene terephthalate (PET), which has relatively high reflectivity and is available/capable of being manufactured in an ultra-thin state, or other such materials.
导光板840可以散射从光源模块发射的光以将光均匀地分布在显示设备800的不同/所有区域。因此，例如，导光板840可以由诸如聚甲基丙烯酸甲酯(PMMA)、聚碳酸酯(PC)、聚乙烯(PE)的具有高折射率和透射率的材料，或者其它这样的材料制成。The light guide plate 840 may diffuse light emitted from the light source module to uniformly distribute the light in different/all regions of the display apparatus 800 . Therefore, for example, the light guide plate 840 may be made of a material having a high refractive index and transmittance such as polymethyl methacrylate (PMMA), polycarbonate (PC), polyethylene (PE), or other such materials. .
通过使用展现光透射率和弹性的聚合物涂覆基底膜的一个表面可以形成第一棱镜片850，并且聚合物可以包括其中以指定的图案重复多个三维结构的棱镜层。例如，图案可以是其中重复脊和谷的条纹型，如图19中所示，或者适当的其它图案。The first prism sheet 850 may be formed by coating one surface of the base film with a polymer exhibiting light transmittance and elasticity, and the polymer may include a prism layer in which a plurality of three-dimensional structures are repeated in a prescribed pattern. For example, the pattern may be of the stripe type in which ridges and valleys are repeated, as shown in Figure 19, or other suitable patterns.
第二棱镜片860可以被如此构造，在第二棱镜片860的基底膜的一个表面上形成的脊和谷的布置方向相对于在第一棱镜片850的基底膜的一个表面上形成的脊和谷的布置方向垂直。这样的构造可以使从光源模块和反射片发射的光朝着面板870的整个表面均匀地分布。The second prism sheet 860 may be configured such that the arrangement direction of ridges and valleys formed on one surface of the base film of the second prism sheet 860 is relative to the ridges and valleys formed on one surface of the base film of the first prism sheet 850. The arrangement direction of the valley is vertical. Such a configuration may uniformly distribute light emitted from the light source module and the reflective sheet toward the entire surface of the panel 870 .
保护片可以设置在棱镜片850和860中的每一个的上方。保护片可以包括基底膜的两个表面上的保护层，其包括光扩散颗粒和粘合剂。此外，例如，棱镜层可以由诸如聚亚安酯、苯乙烯丁二烯共聚体、聚丙烯酸酯、聚甲基丙烯酸酯、聚甲基丙烯酸甲酯、聚对苯二甲酸乙二酯弹性体、聚异戊二烯、多晶硅等的聚合物制成。A protective sheet may be disposed on each of the prism sheets 850 and 860 . The protective sheet may include protective layers including light diffusing particles and an adhesive on both surfaces of the base film. In addition, for example, the prism layer can be made of such as polyurethane, styrene butadiene copolymer, polyacrylate, polymethacrylate, polymethylmethacrylate, polyethylene terephthalate elastomer, Polymers such as polyisoprene, polysilicon, etc.
扩散片可以设置在导光板840和第一棱镜片850之间。扩散片可以由聚酯或者聚碳酸酯基材料制成，并且可以通过从背光单元入射的光的折射和散射最大地增加光投射角。此外，扩散片可以包括具有光扩散剂的支撑层、形成在发光表面上(在第一棱镜片的方向上)的第一层以及形成在光入射表面(在反射片的方向上)的第二层。第一和第二层可以不包括光扩散剂。A diffusion sheet may be disposed between the light guide plate 840 and the first prism sheet 850 . The diffusion sheet may be made of polyester or polycarbonate-based material, and may maximize a light projection angle through refraction and scattering of light incident from the backlight unit. In addition, the diffusion sheet may include a supporting layer having a light diffusing agent, a first layer formed on the light emitting surface (in the direction of the first prism sheet), and a second layer formed on the light incident surface (in the direction of the reflection sheet). Floor. The first and second layers may not include light diffusing agents.
在本实施例中，光学片可以包括扩散片、第一棱镜片850以及第二棱镜片860的组合。然而，例如，光学片可以包括诸如微透镜阵列、扩散片和微透镜阵列的组合、或者棱镜片和微透镜阵列的组合的其它组合。In this embodiment, the optical sheet may include a combination of a diffusion sheet, a first prism sheet 850 and a second prism sheet 860 . However, for example, the optical sheet may include other combinations such as a microlens array, a combination of a diffusion sheet and a microlens array, or a combination of a prism sheet and a microlens array.
液晶显示面板可以被用作面板870。然而，也可以采用要求光源的其它种类的显示装置。显示面板870可以被如此构造，液晶层位于玻璃基板之间，并且偏振板安装在玻璃基板上方以利用光的偏振性质。这样的液晶层可以具有液体和固体之间的性质。即，在液晶层中，对是具有类似于液体的流动性的有机分子的液晶进行规则地对准，并且由于外部电场的原因液晶层使用分子对准的变化来显示图像。A liquid crystal display panel may be used as the panel 870 . However, other types of display devices requiring light sources may also be used. The display panel 870 may be configured such that a liquid crystal layer is located between glass substrates, and a polarizing plate is installed over the glass substrates to utilize the polarization property of light. Such a liquid crystal layer may have properties between liquid and solid. That is, in the liquid crystal layer, liquid crystals, which are organic molecules having fluidity similar to liquid, are regularly aligned, and the liquid crystal layer displays images using changes in molecular alignment due to an external electric field.
在显示设备中使用的这样的液晶显示面板可以是有源矩阵型，并且可以使用晶体管作为开关来调节施加给每个像素的电压。此外，滤色片880可以设置在面板870的前表面上，并且可以仅透射每个像素的从面板870投射的R、G以及B光，从而显示图像。Such a liquid crystal display panel used in a display device may be of an active matrix type, and may adjust a voltage applied to each pixel using transistors as switches. Also, the color filter 880 may be disposed on the front surface of the panel 870, and may transmit only R, G, and B lights of each pixel projected from the panel 870, thereby displaying an image.
根据本实施例的显示设备可以采用在此具体化并且宽泛地描述的发光器件封装，从而防止发光器件132和134之间的光干涉。The display apparatus according to the present embodiment may employ the light emitting device package embodied and broadly described herein, thereby preventing light interference between the light emitting devices 132 and 134 .
在此具体化并且宽泛地描述的发光器件封装可以防止主体的变色以延长发光器件封装的寿命，并且可以防止光干涉。The light emitting device package embodied and broadly described herein may prevent discoloration of the body to prolong the lifetime of the light emitting device package, and may prevent light interference.
在此具体化并且宽泛地描述的发光器件封装可以包括：主体，该主体具有包括侧表面和底部的腔体；第一反射杯和第二反射杯，该第一反射杯和第二反射杯布置在主体的腔体的底部中并且相互分离；第一发光器件，该第一发光器件布置在第一反射杯中；以及第二发光器件，该第二发光器件布置在第二反射杯中。可以从主体的腔体的底部下压第一反射杯和第二反射杯。第一反射杯和第二反射杯可以由从包括银、金以及铜的组中选择的一个制成。A light emitting device package embodied and broadly described herein may include: a body having a cavity including side surfaces and a bottom; first and second reflective cups arranged In the bottom of the cavity of the main body and separated from each other; a first light emitting device arranged in the first reflective cup; and a second light emitting device arranged in the second reflective cup. The first reflective cup and the second reflective cup may be depressed from the bottom of the cavity of the body. The first reflective cup and the second reflective cup may be made of one selected from the group consisting of silver, gold, and copper.
第一反射杯和第二反射杯可以防止由第一发光器件和第二发光器件产生的热辐射到主体。The first reflective cup and the second reflective cup can prevent heat generated by the first light emitting device and the second light emitting device from radiating to the main body.
第一反射杯和第二反射杯中的每一个的至少一部分可以经过主体并且暴露到主体的外部。第一反射杯和第二反射杯的形状和尺寸可以是对称的。第一反射杯和第二反射杯中的每一个的侧表面相对于其底部的倾斜角可以是90～160°。At least a portion of each of the first reflective cup and the second reflective cup may pass through the body and be exposed to the outside of the body. The shape and size of the first reflective cup and the second reflective cup may be symmetrical. An inclination angle of a side surface of each of the first reflective cup and the second reflective cup with respect to the bottom thereof may be 90˜160°.
发光器件封装也可以包括位于主体的上表面和主体的腔体的底部之间的边缘部分，其与主体的上表面具有高度差并且平行于主体的上表面。第一反射杯的上表面可以平行于第一发光器件的上表面并且第二反射杯的上表面可以平行于第二发光器件的上表面。The light emitting device package may also include an edge portion between the upper surface of the body and the bottom of the cavity of the body, having a height difference from and parallel to the upper surface of the body. An upper surface of the first reflective cup may be parallel to an upper surface of the first light emitting device and an upper surface of the second reflective cup may be parallel to an upper surface of the second light emitting device.
在此宽泛地描述的另一实施例中，发光器件封装可以包括：主体，该主体具有包括侧表面和底部的腔体；第一反射杯和第二反射杯，该第一反射杯和第二反射杯布置在主体的腔体的底部中并且相互分离；第一发光器件，该第一发光器件布置在第一反射杯内；第二发光器件，该第二发光器件布置在第二反射杯内；以及连接部分，该连接部分形成在主体的腔体的底部中并且与第一反射杯和第二反射杯分离，其中通过连接部分电连接第一发光器件和第二发光器件。可以从主体的腔体的底部下压第一反射杯和第二反射杯。In another embodiment broadly described herein, a light emitting device package may include: a body having a cavity including a side surface and a bottom; a first reflective cup and a second reflective cup, the first reflective cup and the second reflective cup The reflective cup is arranged in the bottom of the cavity of the main body and is separated from each other; the first light emitting device is arranged in the first reflective cup; the second light emitting device is arranged in the second reflective cup and a connecting portion formed in the bottom of the cavity of the main body and separated from the first reflective cup and the second reflective cup, wherein the first light emitting device and the second light emitting device are electrically connected through the connecting portion. The first reflective cup and the second reflective cup may be depressed from the bottom of the cavity of the body.
发光器件封装也可以包括第一布线，该第一布线连接第一反射杯和第一发光器件；第二布线，该第二布线连接第一发光器件和连接部分；第三布线，该第三布线连接连接部分和第二发光器件；以及第四布线，该第四布线连接第二发光器件和第二反射杯，其中第一发光器件和第二发光器件通过第一布线、第二布线、第三布线以及第四布线串联地连接。The light emitting device package may also include first wiring, which connects the first reflective cup and the first light emitting device; second wiring, which connects the first light emitting device and the connection part; third wiring, which connecting the connecting part and the second light emitting device; and the fourth wiring, which connects the second light emitting device and the second reflective cup, wherein the first light emitting device and the second light emitting device pass through the first wiring, the second wiring, the third wiring The wiring and the fourth wiring are connected in series.
发光器件封装还可以包括第一布线，该第一布线连接第一反射杯和第一发光器件；第二布线，该第二布线连接第一发光器件和第二反射杯；第三布线，该第三布线连接第一反射杯和第二发光器件；以及第四布线，该第四布线连接第二发光器件和第二反射杯，其中第一发光器件和第二发光器件通过第一布线、第二布线、第三布线以及第四布线并联地连接。The light emitting device package may further include a first wiring connecting the first reflective cup to the first light emitting device; a second wiring connecting the first light emitting device to the second reflective cup; a third wiring connecting the first reflective cup to the first light emitting device; The third wiring connects the first reflective cup and the second light emitting device; and the fourth wiring connects the second light emitting device and the second reflective cup, wherein the first light emitting device and the second light emitting device pass through the first wiring, the The wiring, the third wiring, and the fourth wiring are connected in parallel.
发光器件封装还可以包括第一布线，该第一布线连接第一反射杯和第一发光器件；第二布线，该第二布线连接第一发光器件和第二发光器件；以及第三布线，该第三布线连接第二发光器件和第二反射杯，其中第一发光器件和第二发光器件通过第一布线、第二布线以及第三布线串联地连接。The light emitting device package may further include a first wiring connecting the first reflective cup and the first light emitting device; a second wiring connecting the first light emitting device and the second light emitting device; and a third wiring connecting the first light emitting device and the second light emitting device. The third wiring connects the second light emitting device and the second reflective cup, wherein the first light emitting device and the second light emitting device are connected in series through the first wiring, the second wiring and the third wiring.
第一反射杯、第二反射杯以及连接部分中的每一个的至少一部分可以经过主体并且暴露到主体的外部。At least a portion of each of the first reflection cup, the second reflection cup, and the connection portion may pass through the body and be exposed to the outside of the body.
在本说明书中对于“一个实施例”、“实施例”、“示例性实施例”等的引用意味着结合实施例描述的特定特征、结构或特性被包括在本发明的至少一个实施例中。在说明书中，在各处出现的这类短语不必都表示相同的实施例。此外，当结合任何实施例描述特定特征、结构或特性时，都认为结合实施例中的其它实施例实现这样的特征、结构或特性也是本领域技术人员所能够想到的。Reference in this specification to "one embodiment," "an embodiment," "exemplary embodiment," etc. means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the present invention. The appearances of such phrases in various places in the specification are not necessarily all referring to the same embodiment. Furthermore, when a particular feature, structure or characteristic is described in conjunction with any embodiment, it is also considered to be possible by those skilled in the art to implement such feature, structure or characteristic in combination with other embodiments.
虽然已经参照本发明的多个示例性实施例描述了实施例，但是应该理解，本领域的技术人员可以想到许多落入本公开原理的精神和范围内的其它修改和实施例。更加具体地，在本公开、附图和所附权利要求书的范围内，主题组合布置的组成部件和/或布置方面的各种变化和修改都是可能性。除了组成部件和/或布置方面的变化和修改之外，对于本领域的技术人员来说，替代使用也将是显而易见的。Although embodiments have been described with reference to a number of illustrative embodiments thereof, it should be understood that numerous other modifications and embodiments can be devised by those skilled in the art that will fall within the spirit and scope of the principles of this disclosure. More particularly, various variations and modifications are possible in the component parts and/or arrangements of the subject combination arrangement within the scope of the disclosure, the drawings and the appended claims. In addition to changes and modifications in component parts and/or arrangements, alternative uses will also be apparent to those skilled in the art.
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| KR10-2010-0051840 | 2010-06-01 | ||
| KR1020100051840AKR101103674B1 (en) | 2010-06-01 | 2010-06-01 | Light emitting element |
| KR1020110034720AKR101859149B1 (en) | 2011-04-14 | 2011-04-14 | Light emitting device package |
| KR10-2011-0034720 | 2011-04-14 | ||
| CN201110152173.1ACN102270630B (en) | 2010-06-01 | 2011-06-01 | Light emitting device package |
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| CN201510784661.2APendingCN105355625A (en) | 2010-06-01 | 2011-06-01 | Light emitting device package |
| CN201110152173.1AActiveCN102270630B (en) | 2010-06-01 | 2011-06-01 | Light emitting device package |
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| CN201510783126.5AActiveCN105448905B (en) | 2010-06-01 | 2011-06-01 | Light emitting device package |
| CN201510784661.2APendingCN105355625A (en) | 2010-06-01 | 2011-06-01 | Light emitting device package |
| CN201110152173.1AActiveCN102270630B (en) | 2010-06-01 | 2011-06-01 | Light emitting device package |
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| CN (4) | CN105448905B (en) |
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