技术领域technical field
本发明涉及LED技术领域，具体的说是涉及一种LED封装结构及其封装方法。The invention relates to the technical field of LEDs, in particular to an LED packaging structure and a packaging method thereof.
背景技术Background technique
发光二极管（LED）是一种半导体光源，LED与其它光源诸如白炽灯相比具有很多优点，LED通常具有较长的寿命、较好的稳定性、较快的开关特性以及较低的能耗。随着LED作为新一代光源日益深入人们的生活，其应用也越来越广泛。在合成白光方面，最常用的方式是在发蓝光的LED晶片上放置波长转换材料，例如黄色荧光粉，在LED晶片上的波长转换材料层会吸收一些LED发出的光子，并将它们向下转换（down-convert）为可见光波长的光，从而产生具有蓝色和黄色波长光的双色光源。如果产生的黄光和蓝光有正确的比例，那么人眼会感受到白光。Light-emitting diode (LED) is a semiconductor light source. Compared with other light sources such as incandescent lamps, LEDs have many advantages. LEDs usually have longer life, better stability, faster switching characteristics, and lower energy consumption. As the LED as a new generation of light source has become more and more popular in people's lives, its application has become more and more extensive. In terms of synthesizing white light, the most common way is to place a wavelength conversion material, such as yellow phosphor, on a blue-emitting LED chip. The layer of wavelength conversion material on the LED chip will absorb some of the photons emitted by the LED and convert them down. (down-convert) to visible wavelengths of light, resulting in a two-color light source with blue and yellow wavelengths of light. If the correct ratio of yellow and blue light is produced, then the human eye perceives white light.
在现有技术中，LED的封装工艺一般包括固晶、焊线、涂胶、烘烤等步骤，其中涂胶步骤通常将荧光粉按照一定比例混合在硅胶中，用过点胶设备将荧光粉与胶的混合物涂覆在LED晶片上，然而，大粒径荧光粉在点胶过程中容易出现荧光粉沉降的问题，使得荧光粉在胶体中的分布不均匀，由此导致封装出的白光LED出现颜色偏差，就是通常所说的黄圈现象。在其它技术方案中，涂胶也可以通过保型涂覆技术LED晶片表面涂覆非常均匀的荧光粉层，但是，由于蓝光LED晶片本身的发光强度在空间的分布具有不等值的特点对于保型涂覆而言，强度值较大的蓝光通过中心区域荧光粉层的距离比通过边缘区域荧光粉层的距离短，由此导致中心区域色温值高而边缘区域色温值低，同样会出现颜色偏差的问题。而荧光粉物质大部分集中在支架凹槽底部和LED芯片附件，长期受热会出现亮度衰减，影响LED寿命。In the prior art, the packaging process of LEDs generally includes steps such as solid crystal, wire bonding, glue coating, and baking. In the glue coating step, phosphor powder is usually mixed in silica gel according to a certain proportion, and the phosphor powder is mixed with a dispensing device. The mixture with the glue is coated on the LED chip. However, the large particle size phosphor is prone to the problem of phosphor sedimentation during the glue dispensing process, which makes the distribution of the phosphor in the colloid uneven, resulting in the packaging of white LEDs. The occurrence of color deviation is commonly referred to as the yellow circle phenomenon. In other technical schemes, glue coating can also use conformal coating technology to coat a very uniform phosphor layer on the surface of the LED chip. However, due to the unequal distribution of the luminous intensity of the blue LED chip itself in space, it is difficult In terms of type coating, the distance of blue light with higher intensity value passing through the phosphor layer in the central area is shorter than the distance passing through the phosphor layer in the edge area, which results in a high color temperature value in the central area and a low color temperature value in the edge area, and the same color will appear. The problem of deviation. Most of the phosphor material is concentrated at the bottom of the groove of the bracket and the attachment of the LED chip. Long-term heating will cause brightness attenuation and affect the life of the LED.
如图1所示，常规白光LED由第一LED芯片11安装在第一支架12的碗杯内，通过第一金线13与支架引脚实现电路连接，然后在芯片表面覆盖上封装胶体14，封装胶体一般由激发黄色波长荧光粉和封装胶混合而成，有时会添加激发橙红色或绿色波长荧光粉。荧光粉吸收部分蓝光后，释放出波长较长的黄光，然后未被吸收的蓝光和黄光混合成白光。现有技术中，白光LED混光不够均匀，亮度也比较低，荧光粉物质大部分集中在支架凹槽底部和LED芯片附件，长期受热会出现亮度衰减，影响LED寿命。As shown in Figure 1, the conventional white light LED is installed in the cup of the first bracket 12 by the first LED chip 11, realizes circuit connection with the bracket pins through the first gold wire 13, and then covers the surface of the chip with encapsulant 14, The encapsulation colloid is generally made by mixing phosphors with excitation yellow wavelength and encapsulation glue, and sometimes phosphors with orange-red or green wavelength are added. After the phosphor absorbs part of the blue light, it releases yellow light with a longer wavelength, and then the unabsorbed blue light and yellow light mix into white light. In the prior art, the mixed light of white light LED is not uniform enough, and the brightness is relatively low. Most of the phosphor material is concentrated at the bottom of the bracket groove and the attachment of the LED chip. Long-term heating will cause brightness attenuation, which will affect the life of the LED.
发明内容Contents of the invention
针对现有技术中的不足，本发明要解决的技术问题在于提供了一种LED封装结构及其封装方法,本发明LED封装结构能够解决LED白光黄圈问题，同解决LED白光亮度衰减的问题。Aiming at the deficiencies in the prior art, the technical problem to be solved by the present invention is to provide an LED packaging structure and its packaging method. The LED packaging structure of the present invention can solve the problem of the yellow circle of LED white light, and at the same time solve the problem of LED white light brightness attenuation.
为解决上述技术问题，本发明通过以下方案来实现：一种LED封装结构，该LED封装结构包括支架，支架为四方形，所述支架碗杯中心处设置有LED芯片，LED芯片的电极与支架的正负极通过金线连接，在支架的碗杯壁上设置有台阶，该台阶的四个角上各设置有一个注胶孔，每个注胶孔连通到碗杯底部，在台阶上安装玻璃片，所述玻璃片的一面涂覆有荧光粉，玻璃片涂有荧光粉的一面朝下。In order to solve the above technical problems, the present invention is realized through the following solutions: an LED packaging structure, the LED packaging structure includes a bracket, the bracket is square, an LED chip is arranged at the center of the bracket bowl, and the electrodes of the LED chip and the bracket The positive and negative poles of the battery are connected by gold wires. There are steps on the wall of the bowl of the bracket. There is a glue injection hole on each of the four corners of the step. Each glue injection hole is connected to the bottom of the bowl. A glass sheet, one side of the glass sheet is coated with fluorescent powder, and the side of the glass sheet coated with fluorescent powder faces downward.
进一步的，所述注胶孔上部，即在台阶平面之上的注胶孔直径要大于在台阶平面之下的注胶孔直径，上部的注胶孔设置有缺口，该缺口与台阶连通。Further, the upper part of the glue injection hole, that is, the diameter of the glue injection hole above the step plane is larger than the diameter of the glue injection hole below the step plane, and the upper part of the glue injection hole is provided with a gap, and the gap communicates with the step.
进一步的，所述台阶为直角形台阶，其高度大于玻璃片的厚度。Further, the step is a right-angle step whose height is greater than the thickness of the glass sheet.
一种LED封装结构的封装方法，该封装方法包括以下步骤：A packaging method for an LED packaging structure, the packaging method comprising the following steps:
1）、在支架的碗杯底部，进行固晶焊线，即将LED芯片安装在支架碗杯底部中心位置，再将LED芯片的电极与支架的正负极通过金线连接；1) At the bottom of the bowl of the bracket, wire bonding is carried out, that is, the LED chip is installed at the center of the bottom of the bowl of the bracket, and then the electrodes of the LED chip are connected to the positive and negative poles of the bracket through gold wires;
2）、玻璃片的一面涂上荧光粉；2) One side of the glass sheet is coated with fluorescent powder;
3）、玻璃片安装在支架碗杯上的台阶处，有荧光粉的一面朝下；3) The glass piece is installed on the steps on the bracket bowl, with the phosphor side facing down;
4）、通过注胶孔注硅胶液，使支架碗杯内部的空腔填充满；4) Inject silicone liquid through the injection hole to fill the cavity inside the bracket cup;
5）、对支架碗口边缘进行压边，使玻璃片固定；5) Press the edge of the bowl mouth of the bracket to fix the glass piece;
6）、待硅胶液固化后，完成封装。6) After the silicone liquid is cured, the packaging is completed.
相对于现有技术，本发明的有益效果是：本发明LED封装结构与封装方法不仅解决LED白光黄圈问题，同时也解决LED白光亮度衰减的问题，通过注胶孔将封装硅胶注入支架碗杯内，操作方便，荧光粉先涂覆玻璃片上，安装好玻璃片后，再进行注胶，荧光粉就不会集中在LED芯片附近或者支架碗杯底部，因此，避免了LED芯片长期受热会出现亮度衰减，从另一方面提高了LED寿命。Compared with the prior art, the beneficial effect of the present invention is that the LED packaging structure and packaging method of the present invention not only solve the problem of the yellow circle of LED white light, but also solve the problem of LED white light brightness attenuation, and inject the packaging silica gel into the bracket bowl cup through the glue injection hole It is easy to operate. The phosphor powder is coated on the glass sheet first, and then the glue is injected after the glass sheet is installed. The phosphor powder will not be concentrated near the LED chip or at the bottom of the bracket bowl. Therefore, the long-term heating of the LED chip will avoid Luminance attenuation, on the other hand, improves the LED life.
附图说明Description of drawings
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings that need to be used in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description are only These are some embodiments of the present invention. Those skilled in the art can also obtain other drawings based on these drawings without creative work.
图1为现有技术中LED封装结构示意图。Fig. 1 is a schematic diagram of LED package structure in the prior art.
图2为本发明支架结构示意图。Fig. 2 is a schematic diagram of the structure of the stent of the present invention.
图3为本发明支架结构剖视图。Fig. 3 is a sectional view of the stent structure of the present invention.
图4为本发明LED封装步骤1示意图。Fig. 4 is a schematic diagram of LED packaging step 1 of the present invention.
图5为本发明LED封装步骤2、步骤3示意图。Fig. 5 is a schematic diagram of step 2 and step 3 of LED packaging in the present invention.
图6为本发明LED封装步骤4示意I图。Fig. 6 is a schematic I diagram of LED packaging step 4 of the present invention.
图7为本发明LED封装步骤4示意Ⅱ图。Fig. 7 is a schematic diagram II of LED packaging step 4 of the present invention.
图8为本发明LED封装步骤5示意图。Fig. 8 is a schematic diagram of step 5 of LED packaging in the present invention.
附图中标记：第一LED芯片11、第一支架12、第一金线13、封装胶体14、支架1-1、台阶1-2、注胶孔1-3、金线2-2、LED芯片2-3、玻璃片2-4。Marks in the drawings: the first LED chip 11, the first bracket 12, the first gold wire 13, the encapsulant 14, the bracket 1-1, the step 1-2, the glue injection hole 1-3, the gold wire 2-2, the LED Chip 2-3, glass sheet 2-4.
具体实施方式detailed description
下面结合附图对本发明的优选实施例进行详细阐述，以使本发明的优点和特征能更易于被本领域技术人员理解，从而对本发明的保护范围做出更为清楚明确的界定。The preferred embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings, so that the advantages and features of the present invention can be more easily understood by those skilled in the art, so as to define the protection scope of the present invention more clearly.
请参照附图2~3，本发明的一种LED封装结构，该LED封装结构包括支架1-1，支架1-1为四方形，所述支架1-1碗杯中心处设置有LED芯片2-3，LED芯片2-3的电极与支架1-1的正负极通过金线2-2连接，在支架1-1的碗杯壁上设置有台阶1-2，该台阶1-2的四个角上各设置有一个注胶孔1-3，每个注胶孔1-3连通到碗杯底部，在台阶1-2上安装玻璃片2-4，所述玻璃片2-4的一面涂覆有荧光粉，玻璃片2-4涂有荧光粉的一面朝下。所述注胶孔1-3上部，即在台阶1-2平面之上的注胶孔直径要大于在台阶1-2平面之下的注胶孔直径，上部的注胶孔设置有缺口，该缺口与台阶1-2连通。述台阶1-2为直角形台阶，其高度大于玻璃片2-4的厚度，这个厚度至少要能够放置玻璃片2-4。Please refer to accompanying drawings 2-3, an LED packaging structure of the present invention, the LED packaging structure includes a bracket 1-1, the bracket 1-1 is square, and the center of the bowl cup of the bracket 1-1 is provided with an LED chip 2 -3. The electrodes of the LED chip 2-3 are connected to the positive and negative poles of the support 1-1 through gold wires 2-2, and a step 1-2 is set on the wall of the bowl of the support 1-1, and the step 1-2 Each of the four corners is provided with a glue injection hole 1-3, and each glue injection hole 1-3 is connected to the bottom of the bowl, and a glass sheet 2-4 is installed on the step 1-2, and the glass sheet 2-4 One side is coated with fluorescent powder, and the side of the glass sheets 2-4 coated with fluorescent powder faces downward. The upper part of the glue injection hole 1-3, that is, the diameter of the glue injection hole above the step 1-2 plane is larger than the diameter of the glue injection hole below the step 1-2 plane, and the upper glue injection hole is provided with a gap. The gap communicates with steps 1-2. The step 1-2 is a right-angled step whose height is greater than the thickness of the glass sheet 2-4, and this thickness must at least be able to place the glass sheet 2-4.
实施例1：Example 1:
本发明的LED封装结构的封装方法，该封装方法包括以下步骤：The encapsulation method of LED encapsulation structure of the present invention, this encapsulation method comprises the following steps:
步骤1、如图4所示，在支架1-1的碗杯底部，进行固晶焊线，即将LED芯片2-3安装在支架碗杯底部中心位置，再将LED芯片2-3的电极与支架的正负极通过金线2-2连接；Step 1, as shown in Figure 4, at the bottom of the cup of the bracket 1-1, carry out the wire bonding, that is, install the LED chip 2-3 at the center of the bottom of the cup of the bracket, and then connect the electrodes of the LED chip 2-3 to the The positive and negative poles of the bracket are connected by gold wires 2-2;
步骤2、如图5所示，玻璃片2-4的一面涂上荧光粉；Step 2, as shown in Figure 5, one side of the glass sheet 2-4 is coated with fluorescent powder;
步骤3、如图5所示，玻璃片2-4安装在支架1-1碗杯上的台阶2-3处，有荧光粉的一面朝下；Step 3, as shown in Figure 5, the glass sheet 2-4 is installed at the step 2-3 on the bowl cup of the bracket 1-1, and the side with the fluorescent powder faces downward;
步骤4、如图6、7所示，通过注胶孔1-3注硅胶液，使支架1-1碗杯内部的空腔填充满；Step 4. As shown in Figures 6 and 7, inject silicone liquid through injection holes 1-3 to fill the cavity inside the bowl of bracket 1-1;
步骤5、如图8所示，对支架1-1碗口边缘进行压边，使玻璃片2-4固定；Step 5, as shown in Figure 8, press the edge of the bowl mouth of the bracket 1-1 to fix the glass sheet 2-4;
步骤6、待硅胶液固化后，完成封装。Step 6. After the silicone liquid is cured, the encapsulation is completed.
本发明LED封装结构与封装方法不仅解决LED白光黄圈问题，同时也解决LED白光亮度衰减的问题，通过注胶孔将封装硅胶注入支架碗杯内，操作方便，荧光粉先涂覆玻璃片上，安装好玻璃片后，再进行注胶，荧光粉就不会集中在LED芯片附近或者支架碗杯底部，因此，避免了LED芯片长期受热会出现亮度衰减，从另一方面提高了LED寿命。The LED packaging structure and packaging method of the present invention not only solve the problem of the yellow circle of LED white light, but also solve the problem of LED white light brightness attenuation. The packaging silica gel is injected into the bowl cup of the bracket through the glue injection hole, which is easy to operate. The phosphor powder is first coated on the glass sheet. After installing the glass sheet and injecting glue, the phosphor will not concentrate near the LED chip or the bottom of the bracket bowl. Therefore, the brightness decay of the LED chip due to long-term heating is avoided, and the life of the LED is improved on the other hand.
以上所述仅为本发明的优选实施方式，并非因此限制本发明的专利范围，凡是利用本发明说明书及附图内容所作的等效结构或等效流程变换，或直接或间接运用在其它相关的技术领域，均同理包括在本发明的专利保护范围内。The above is only a preferred embodiment of the present invention, and does not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made by using the description of the present invention and the contents of the accompanying drawings, or directly or indirectly used in other related All technical fields are equally included in the scope of patent protection of the present invention.
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510839817.2ACN105336835A (en) | 2015-11-27 | 2015-11-27 | LED packaging structure and packaging method thereof |
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510839817.2ACN105336835A (en) | 2015-11-27 | 2015-11-27 | LED packaging structure and packaging method thereof |
| Publication Number | Publication Date |
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| CN105336835Atrue CN105336835A (en) | 2016-02-17 |
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510839817.2APendingCN105336835A (en) | 2015-11-27 | 2015-11-27 | LED packaging structure and packaging method thereof |
| Country | Link |
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| CN (1) | CN105336835A (en) |
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| CN112670389A (en)* | 2020-12-30 | 2021-04-16 | 华南理工大学 | LED support capable of inhibiting fluorescent powder from solidifying and flowing and manufacturing method thereof |
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| Date | Code | Title | Description |
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| RJ01 | Rejection of invention patent application after publication | Application publication date:20160217 | |
| RJ01 | Rejection of invention patent application after publication |