A kind of display deviceTechnical field
The application is related to display technology field, more particularly to a kind of display device with encapsulating structure.
Background technology
The necessary basis that organic luminescent device (OLED) can be widely used is that device can for a long time, stably, continuouslyGround works.It has been found that after OLED works certain time, blackspot occurs in its luminous component, and electrode portion branch occursBubble, this phenomenon are considered as the main reason for causing component failure.The Crack cause of blackspot and bubble is organic except deviceThe metallic cathode of the fuel factor of functional layer, mainly device, organic function layer and between the extraneous steam penetrated into of device, oxygenChemical reaction.In order to improve OLED lives of product, it is necessary to by encapsulation process come isolate from the extraneous water vapour of device withOxygen.
Thin-film package is packaged type widely used at present, and display device is general as shown in Fig. 1 100.In substrate 101On prepare have OLED display layers 102, display layer 102 is then completely covered in thin-film encapsulation layer 103.
During the processing procedure of display panel, multiple display panels are produced on a motherboard simultaneously, to the end of processing procedure itAfterwards, motherboard is cut, so as to form multiple independent display panels.In cutting, currently used technology has machinery to cutCut and be cut by laser.Machine cuts can cause thin-film encapsulation layer generation since marginal position to split due to the pressure of cutter head counter plateLine, it can equally be cracked using laser cutting mode due to fuel factor, the generation of crackle is then steam and oxygen from sideInfiltration provides path.Meanwhile cutting stress can cause certain destruction to display layer device and thin-film encapsulation layer.
The content of the invention
In view of drawbacks described above of the prior art or deficiency, it is expected to provide a kind of thin-film package that can suppress marginal positionThe diffusion of layer crackle when panel is cut, and can effectively alleviate destruction of the cutting stress to display layer device and thin-film encapsulation layerScheme.To achieve these goals, this application provides a kind of display device.
The display device includes：Substrate, the substrate include intermediate flat area and surround the intermediate flat areaFringe region, in the first surface of the substrate, the fringe region is higher or lower than the intermediate flat area；DisplayLayer, the display layer is located at the first surface of the substrate, and the display layer is located on the intermediate flat area；FilmEncapsulated layer, the display layer is between the thin-film encapsulation layer and the substrate.
In certain embodiments, the substrate is flexible base board.
In certain embodiments, the fringe region and the junction of the intermediate flat area have first end face, instituteThe angle stated between the surface of first end face and the intermediate flat area is more than 90 degree.
In certain embodiments, outside of the fringe region away from intermediate flat area has a second end face, and describedAngle between the second surface of biend and the substrate is less than or equal to 90 degree.
In certain embodiments, the fringe region and the junction of the intermediate flat area have first end face, instituteIt is arc-shaped curved surface to state first end face.
In certain embodiments, outside of the fringe region away from intermediate flat area has a second end face, and describedBiend is arc-shaped curved surface.
In certain embodiments, the fringe region is higher than the intermediate flat area, and the fringe region is included at leastOne groove.
In certain embodiments, the section of the groove be trapezoidal, rectangle, triangle or one kind in curvilinear boundary quadrilateral orIt is several.
In certain embodiments, the fringe region is less than the intermediate flat area, and the fringe region is included at leastOne-level step.
In certain embodiments, the step has the 3rd end face, what the 3rd end face was connected with the 3rd end faceAngle between upper and lower surface is all higher than 90 degree.
In certain embodiments, the step has the 3rd end face, and the 3rd end face is arc-shaped curved surface.
In certain embodiments, the thin-film encapsulation layer includes replacing the stepped construction formed with organic layer by inorganic layer,The stepped construction comprises at least three layers, wherein, point to the direction of the display layer along the substrate, the stepped construction according toIt is secondary to be：First inorganic layer, the first organic layer, the second inorganic layer.
In certain embodiments, first inorganic layer and the second inorganic layer cover the substrate；Described first is organicLayer covers the display layer, and first organic layer is coated by second inorganic layer.
The display device that the application provides, using the fringe region higher or lower than intermediate flat area, avoids faceAccumulation of the stress in same layer plane, the thin-film encapsulation layer that can suppress marginal position produce when panel is cut when plate is cutThe diffusion of crackle, and can effectively alleviate destruction of the cutting stress to display layer device and thin-film encapsulation layer.
Brief description of the drawings
By reading the detailed description made to non-limiting example made with reference to the following drawings, the application's is otherFeature, objects and advantages will become more apparent upon：
Fig. 1 is the schematic diagram of general display device in the prior art；
Fig. 2A is a kind of top view for display device that the embodiment of the present application one provides；
Fig. 2 B are sectional views of the Fig. 2A along AA '；
Fig. 3 is the schematic diagram for another display device that the embodiment of the present application one provides；
Fig. 4 is a kind of schematic diagram for display device that the embodiment of the present application two provides；
Fig. 5 is the schematic diagram for another display device that the embodiment of the present application two provides；
Fig. 6 is a kind of schematic diagram for display device that the embodiment of the present application three provides；
Fig. 7 is the schematic diagram for another display device that the embodiment of the present application three provides；
Fig. 8 A are the top views for the third display device that the embodiment of the present application three provides；
Fig. 8 B are sectional views of Fig. 8 A along AA '；
Fig. 9 is the schematic diagram for the 4th kind of display device that the embodiment of the present application three provides；
Figure 10 is a kind of schematic diagram for display device that the embodiment of the present application four provides.
Embodiment
The application is described in further detail with reference to the accompanying drawings and examples.It is understood that this place is retouchedThe specific embodiment stated is used only for explaining related invention, rather than the restriction to the invention.It also should be noted that in order toBe easy to describe, illustrate only in accompanying drawing to about the related part of invention.
It should be noted that in the case where not conflicting, the feature in embodiment and embodiment in the application can phaseMutually combination.Describe the application in detail below with reference to the accompanying drawings and in conjunction with the embodiments.
Embodiment one
Fig. 2A is a kind of top view for display device that the embodiment of the present application one provides, and Fig. 2 B are sections of the Fig. 2A along AA 'Figure.
With reference to figure 2A and Fig. 2 B, display device 200 includes substrate 201, display layer 202 and thin-film encapsulation layer 203.In this realityApply in example, substrate 201 includes intermediate flat area 2011 and surrounds the fringe region 2012 of intermediate flat area 2011, in substrateThe upper surface of substrate 201 in 201 first surface, i.e. Fig. 2 B, the fringe region 2012 of substrate 201 can be less than middle flat areaDomain 2011.Display layer 202 can be located at the first surface of substrate 201, and be located at intermediate flat area 2011.Thin-film encapsulation layer203 can be located at the top of display layer 202 so that display layer 202 can be between thin-film encapsulation layer 203 and substrate 201.
In an optional implementation of the present embodiment, in the first surface of substrate, the fringe region of substrate can be withHigher than intermediate flat area.Fig. 3 is the schematic diagram for another display device that the embodiment of the present application one provides.As shown in Figure 3.It is aobviousShowing device 300 includes substrate 301, display layer 302 and thin-film encapsulation layer 303.Wherein, substrate 301 includes intermediate flat area3011 and surround intermediate flat area fringe region 3012, the upper table of substrate 301 in the first surface of substrate 301, i.e. Fig. 3Face, the fringe region 3012 of substrate 301 can be higher than intermediate flat area 3011.Display layer 302 can be located at the of substrate 301One surface, and it is located at intermediate flat area 3011.Thin-film encapsulation layer 303 can be located at the top of display layer 302.
In some optional implementations, substrate 201 and substrate 301 can be flexible base board.Can using flexible base boardForm flexible display apparatus.
The display device that above-described embodiment of the application provides, by the intermediate flat area below or above substrateSubstrate edge region so that when panel is cut, stress surface and display layer in the same plane, do not avoid cutting stress sameAccumulation in plane, it can effectively alleviate destruction of the cutting stress to display layer device and thin-film encapsulation layer, suppress substrate edgesThe generation of position thin-film encapsulation layer crackle, while the transmission path of stress planar has been blocked, so as to prevent crackle to spread,Prevent the pernicious gases such as steam, oxygen from being permeated from side.
Embodiment two
With further reference to Fig. 4, a kind of schematic diagram of the display device provided it illustrates the embodiment of the present application two.
As shown in figure 4, the display device 400 includes substrate 401, display layer 402 and thin-film encapsulation layer 403.Wherein, substrate401 can include intermediate flat area 4011 and surround the fringe region 4012 of intermediate flat area.In the first table of substrate 401Face is the upper surface of substrate 401, and the fringe region 4012 of substrate 401 can be less than intermediate flat area 4011, and substrate 401The junction of fringe region 4012 and intermediate flat area 4011 there is first end face 4013, first end face 4013 is put down with centreAngle α between the surface in smooth region 4011 can be more than 90 degree.Display layer 402 can be located at the first surface of substrate 401On intermediate flat area 4011, thin-film encapsulation layer 403 can be located at the top of display layer 402.
Second end face 4014 shown in Fig. 4, in outside of the substrate 401 away from intermediate flat area 4011, i.e. the second endFace 4014 is 401 outermost end face of substrate.Optionally, second end face 4014 can be a plane.It is optional real at someIn existing mode, the second end face 4014 of substrate 401 and the second surface of substrate 401 are the angle β between the lower surface of substrate 40190 degree can be less than or equal to.
The display device that above-described embodiment of the application provides, due to the first end face of substrate and the middle flat area of substrateAngle between domain is more than 90 degree, and the angle between the second end face and second substrate surface of substrate is less than or equal to 90 degree,In the range of this angle, shape between first end face and substrate intermediate flat area and second end face and the second surface of substrateInto gentle transition structure, it is ensured that junction between thin-film encapsulation layer edge region and intermediate flat area it is continuousProperty, realize more preferable steam and oxygen obstruction effect.In another embodiment of the present embodiment, first with embodiment twoHere is omitted for kind embodiment identical part, and difference is, fringe region and the intermediate flat area of substrate connectMeeting place has first end face, and first end face can be arc-shaped curved surface.
Fig. 5 is the schematic diagram for another display device that the present embodiment provides.As shown in figure 5, display device 500 includes basePlate 501, display layer 502 and thin-film encapsulation layer 503.Wherein, the first end face 5013 of substrate 501 can be arc-shaped curved surface.It is optional, outside of the fringe region away from intermediate flat area of substrate 501 has second end face 5014, and second end face 5014 can beArc-shaped curved surface, as shown in Figure 5.
Compared to planar end, arc-shaped curved surface has more smooth structure, in the fringe region and middle flat of substrateThe junction in region, thin-film encapsulation layer have more preferable film forming stability.
It should be noted that except the convex arc-shaped curved surface provided in figure, the edge and centre of connecting substrate upper surface are put downThe first end face in smooth region can also be what matrix arc-shaped curved surface or convex arc-shaped curved surface combined with matrix arc-shaped curved surfaceCurved-surface structure, the application are not limited this.
Embodiment three
With further reference to Fig. 6, a kind of schematic diagram of the display device provided it illustrates the embodiment of the present application three.
As shown in fig. 6, the display device 600 includes substrate 601, display layer 602 and thin-film encapsulation layer 603.In this implementationIn example, here is omitted with the identical part of embodiment two, and difference is, is upper table in the first surface of substrate 601Face, the fringe region 6012 of substrate 601 can be higher than intermediate flat area 6011, and fringe region 6012 and middle flat areaThe junction of domain 6011 can have first end face 6013, and first end face 6013 can be plane, first end face 6013 and substrate 601Intermediate flat area 6011 surface between angle γ can be more than 90 degree.Display layer 602 can be located in substrate 601Between on flat site 6011.
In some optional implementations, the second end face 6014 of substrate 601 and the second surface of substrate 601, i.e. baseAngle theta between the lower surface of plate 601 can be less than or equal to 90 degree.
The display device that embodiments herein three provides, the angle between the first end face and intermediate flat area of substrateSetting more than 90 degree enables to form gentle transition structure between first end face and intermediate flat area, ensures film envelopeFill continuity of the layer in substrate edge region Yu intermediate flat area junction.
In another embodiment of the present embodiment, with the first embodiment identical part of embodiment three hereinRepeat no more, difference is, the first end face of substrate edge region and intermediate flat area junction can be that arc is bentFace.Fig. 7 is the schematic diagram for another display device that the embodiment of the present application three provides.As shown in fig. 7, display device 700 includesSubstrate 701, display layer 702 and thin-film encapsulation layer 703.Wherein, it is upper surface in the first surface of substrate 701, the side of substrate 701The first end face 7013 in edge region and intermediate flat area junction is arc-shaped curved surface.
Compared to planar end, arc-shaped curved surface has more smooth structure, in the fringe region and middle flat of substrateThe junction in region, thin-film encapsulation layer have more preferable film forming stability.
It should be noted that except the matrix arc-shaped curved surface provided in figure, first end face 7013 can also be convex arcThe composite surface structure of curved surface or convex arc-shaped curved surface and matrix arc-shaped curved surface, the application are not limited this.Substrate 701 is remoteThere can be the second end face 7014 of planar shaped from the outer fix of intermediate flat area.
In some optional implementations, second end face can also be arc-shaped curved surface.
In some optional implementations, the fringe region of substrate is higher than intermediate flat area, and fringe region can wrapInclude at least one groove.
Fig. 8 A are the top views for the third display device that the embodiment of the present application three provides, and Fig. 8 B are Fig. 8 A cutting along AA 'Face figure.Display device 800 includes substrate 801, display layer 802 and thin-film encapsulation layer 803.Wherein, in the first surface of substrate 801That is upper surface, substrate 801 include intermediate flat area 8011 and surround the fringe region 8012 of intermediate flat area, substrate 801Fringe region 8012 include groove 8015 shown in phantom, the section of groove 8015 is trapezoidal.
In some optional implementations, number of recesses can have it is multiple, the section of groove can be trapezoidal, rectangle,One or more in triangle or curvilinear boundary quadrilateral.When carrying out panel cutting, the structure of this multiple grooves can be more preferableDestruction of the ground isolation cutting stress to display layer device and thin-film encapsulation layer.
In some optional implementations, the fringe region of substrate can be less than intermediate flat area, and fringe region canWith including at least one-level step.Fig. 9 is the schematic diagram for the 4th kind of display device that the embodiment of the present application three provides.As shown in figure 9,Display device 900 includes substrate 901, display layer 902 and thin-film encapsulation layer 903.Wherein, substrate 901 includes intermediate flat area9011 and the fringe region 9012 of intermediate flat area is surrounded, fringe region 9012 has with the junction of intermediate flat area 9011First end face 9013,9013 is planar end, and it is planar ends to have second end face 9014,9014 away from intermediate flat area 9011Face, there is the 3rd end face 9016 of planar shaped between first end face 9013 and second end face 9014.The He of 3rd end face 9016Angle between coupled upper surface 9017It can be more than between 90 degree, and coupled lower surface 9018Angle ω can also be more than 90 degree.When carrying out panel cutting, the structure of this multi-stage stairs can preferably isolate cutting shouldDestruction of the power to display layer device and thin-film encapsulation layer.
In some optional implementations, first end face, second end face and the 3rd end face can be arc-shaped curved surface.
Example IV
With further reference to Figure 10, a kind of schematic diagram of the display device provided it illustrates the embodiment of the present application four.
As shown in Figure 10, the display device 11 includes substrate 111, display layer 112 and thin-film encapsulation layer 113.Wherein, in baseThe first surface of plate 111 is upper surface, and the fringe region of substrate 111 can be higher than intermediate flat area.Display layer 112 can positionIn the intermediate flat area of the first surface of substrate 111.Display layer 112 is between thin-film encapsulation layer 113 and substrate 111.
In the present embodiment, thin-film encapsulation layer 113 can include replacing the stepped construction formed with organic layer by inorganic layer,This stepped construction comprises at least three layers.As shown in Figure 10, along substrate 111 point to display layer 112 direction, stepped construction according toIt is secondary including：First inorganic layer 1131, the first organic layer 1132 and the second inorganic layer 1133.
In some optional implementations, the first inorganic layer 1131 can be located at the top of display layer 112, and cover basePlate 111.First organic layer 1132 can be located at the top of the first inorganic layer 1131, positioned at intermediate flat area, cover display layer112, and coated by the second inorganic layer 1133 above it.Second inorganic layer 1133 can be located on the first organic layer 1132Side, and cover substrate 111.
It should be noted that the stepped construction of this thin-film encapsulation layer can include three layers, more layers can also be included, thisApplication is not limited this.The display device that embodiments herein four provides, because inorganic layer covers whole substrate, filmEncapsulated layer can effectively completely cut off the infiltration of steam and oxygen, and protection shows layer device.On the other hand, between two layers of inorganic layerThe presence of organic layer can effectively alleviate the stress of inorganic layer film, optimize the flexural property of whole encapsulating structure.And centre hasMachine layer is then advantageous to prevent the steam from the external world, oxygen etc. from breaking intermediate organic layer by the cladding completely of the inorganic layer above itIt is bad.
Above description is only the preferred embodiment of the application and the explanation to institute's application technology principle.People in the artMember should be appreciated that invention scope involved in the application, however it is not limited to the technology that the particular combination of above-mentioned technical characteristic formsScheme, while should also cover in the case where not departing from the inventive concept, carried out by above-mentioned technical characteristic or its equivalent featureThe other technical schemes for being combined and being formed.Such as features described above has similar work(with (but not limited to) disclosed hereinThe technical scheme that the technical characteristic of energy is replaced mutually and formed.