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CN105108417B - A kind of diode welding mould and using method thereof - Google Patents

A kind of diode welding mould and using method thereof
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Publication number
CN105108417B
CN105108417BCN201510590342.8ACN201510590342ACN105108417BCN 105108417 BCN105108417 BCN 105108417BCN 201510590342 ACN201510590342 ACN 201510590342ACN 105108417 BCN105108417 BCN 105108417B
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China
Prior art keywords
diode
cover plate
base
base plate
hole
Prior art date
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Active
Application number
CN201510590342.8A
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Chinese (zh)
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CN105108417A (en
Inventor
杨长福
朱灿
陈林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
GUIZHOU YAGUANG ELECTRONIC TECHNOLOGY Co Ltd
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GUIZHOU YAGUANG ELECTRONIC TECHNOLOGY Co Ltd
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Priority to CN201510590342.8ApriorityCriticalpatent/CN105108417B/en
Publication of CN105108417ApublicationCriticalpatent/CN105108417A/en
Application grantedgrantedCritical
Publication of CN105108417BpublicationCriticalpatent/CN105108417B/en
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Abstract

The present invention provides a kind of diode welding mould and using method thereof, including base plate and cover plate, cover plate covers on base plate, at least two baseplate pin axis hole it is provided with on base plate, just to being provided with penny washer hole at baseplate pin axis hole on cover plate, it is provided with an alignment pin in each baseplate pin axis hole and corresponding penny washer hole, diode-base locating slot it is provided with on the upper surface of base plate, just to being provided with hole, diode lead location at diode-base locating slot on cover plate, it is correspondingly arranged on a steel ball in each diode-base locating slot or hole, corresponding diode lead location.Undesirable to solve the existing diode effect that freezes, freeze second-rate, the problem that percent defective is higher.Invention belongs to diode manufacture field.

Description

A kind of diode welding mould and using method thereof
Technical field
The present invention relates to a kind of welding mould and using method thereof, belong to diode manufacture field.
Background technology
nullDiode adds man-hour,Need to be by diode-base、Diode chip for backlight unit、Freeze as integral type structure in one end of diode copper coin and diode lead,I.e. its each parts are sprayed scaling powder,Freeze in the equipment of freezing after being combined again,Existing freeze typically all each for diode parts fixed Combination to be integrated by mould freeze again,But the using effect of existing mold is unsatisfactory,First,Mould is susceptible to dislocation during freezing,Diode each position link position is made to misplace,So that the diode quality after freezing is the most up to standard,Become waste product,Simultaneously,Diode lead is due to the reason of other end gravity,When freezing,One end that diode lead is connected with diode copper coin effect that freezes is poor,Cannot freeze with diode copper coin and be integrated in even one end of diode lead,Also diode can be made to freeze quality dissatisfaction,Use current mould percent defective higher.
Summary of the invention
It is an object of the invention to: a kind of diode welding mould and using method thereof are provided, undesirable to solve the existing diode effect that freezes, freeze second-rate, the problem that percent defective is higher.
The present invention intends using such a diode welding mould, including base plate and cover plate, cover plate covers on base plate, at least two baseplate pin axis hole it is provided with on base plate, just to being provided with penny washer hole at baseplate pin axis hole on cover plate, it is provided with an alignment pin in each baseplate pin axis hole and corresponding penny washer hole, diode-base locating slot it is provided with on the upper surface of base plate, just to being provided with hole, diode lead location at diode-base locating slot on cover plate, it is correspondingly arranged on a steel ball in each diode-base locating slot or hole, corresponding diode lead location.
Diode-base locating slot be the length of side be the square groove of 8-14mm, groove depth is less than or equal to 3mm, and hole, described diode lead location is strip-type hole, and the stage casing width of diode lead location hole cross section is less than two ends width.
Described base plate and cover plate are stripe board, and base plate upper end is identical with the form and dimension of cover plate lower end, and the lower end of cover plate overlaps with the upper end of base plate setting.
When freezing, for ease of the location of base plate and improve its steadiness, a leg it is provided with at the corner of base plate lower end, wherein, the bottom of adjacent two legs is all affixed with a location lath, the bottom of two other leg is affixed with another location lath, and two location laths are parallel, and the two is arranged in same level.
On the upper surface of base plate, distribution is provided with multiple rows of diode-base locating slot, and cover plate is also correspondingly provided with hole, multiple rows of diode lead location.
Above-mentioned mold use method is as follows: first, cover plate is taken off from base plate, diode-base is positioned in the diode-base locating slot of base plate upper surface, afterwards, cover plate is covered on base plate, by alignment pin, cover plate is positioned on base plate, again by diode chip for backlight unit, one end of diode copper coin and diode lead is overlayed on diode-base successively by the hole, diode lead location on cover plate, again steel ball is pressed on the diode lead being arranged on diode copper coin, finally, this mould is positioned over diode freeze diode is freezed by equipment, after having freezed, remove alignment pin, cover plate is taken off by base plate, can be by by diode-base, diode chip for backlight unit, the molding diode that diode copper coin and welding lead of diode are integrated takes out.
The present invention is compared with prior art, major advantage is that diode-base, diode chip for backlight unit, diode copper coin and diode lead are positioned by this mould by base plate and cover plate, enable diode need freeze connect position be connected with each other, need to be freezed diode-base, diode chip for backlight unit, diode copper coin and diode lead position compression again that be connected by steel ball, its real connection the tightst, it is ensured that the welding quality at diode each position when freezing;Being correspondingly arranged pin shaft hole on base plate and cover plate and inserted by alignment pin, it is ensured that when freezing, base plate will not misplace with cover plate, greatly reduces the percent defective that diode freezes, and improves the quality that freezes, and saves production cost.
Accompanying drawing explanation
Fig. 1 is the main TV structure schematic diagram of the present invention;
Fig. 2 is the left view of Fig. 1;
Fig. 3 is the top view of Fig. 1;
Fig. 4 is the top view of base plate;
Fig. 5 freeze after the main TV structure schematic diagram of diode;
Fig. 6 is the top view of Fig. 5;
Fig. 7 is the plan structure schematic diagram after loading each parts of diode in a diode lead positions hole;
Fig. 8 be in Fig. 7 A-A to sectional view.
Detailed description of the invention
For making the object, technical solutions and advantages of the present invention clearer, the present invention is described in further detail below with reference to accompanying drawings,
Embodiment:
nullWith reference to Fig. 1-Fig. 8,The present embodiment provides a kind of diode welding mould,Including base plate 1 and cover plate 2,Cover plate 2 covers on base plate 1,Base plate 1 and cover plate 2 are stripe board,Base plate 1 upper end is identical with the form and dimension of cover plate 2 lower end,And the lower end of cover plate 2 overlaps with the upper end of base plate 1 setting,At least two baseplate pin axis hole 11 it is provided with on base plate 1,Just to being provided with penny washer hole 21 at baseplate pin axis hole 11 on cover plate 2,It is provided with an alignment pin 3 in each baseplate pin axis hole 11 and corresponding penny washer hole 21,On the upper surface of base plate 1, branch is provided with four row's diode-base locating slots 12,Just to being also correspondingly arranged on four holes 22, row's diode lead location at diode-base locating slot 12 on cover plate 2,Diode-base locating slot 12 is the square groove of 8-14mm for the length of side,Groove depth is less than or equal to 3mm,Hole 22, described diode lead location is strip-type hole,And the stage casing width of hole 22, diode lead location cross section is less than two ends width,It is correspondingly arranged on a steel ball 6 in each diode-base locating slot 12 or hole 22, corresponding diode lead location.
A leg 4 it is provided with at the corner of base plate 1 lower end, wherein, the bottom of adjacent two legs 4 is all affixed with a location lath 5, and the bottom of two other leg 4 is affixed with another location lath 5, two location laths 5 are parallel, and the two is arranged in same level.
nullAbove-mentioned mold use method is as follows: first,Cover plate 2 is taken off from base plate 1,Diode-base 71 is positioned in the diode-base locating slot 12 of base plate 1 upper surface,Afterwards,Cover plate 2 is covered on base plate 1,By alignment pin 3, cover plate 2 is positioned on base plate 1,Again by diode chip for backlight unit 72、One end of diode copper coin 73 and diode lead 74 is overlayed on diode-base 71 successively by the hole 22, diode lead location on cover plate 2,Again steel ball 6 is pressed on the diode lead 74 being arranged on diode copper coin 73,Finally,This mould is positioned over diode freeze diode is freezed by equipment,After having freezed,Remove alignment pin 3,Cover plate 2 is taken off by base plate 1,Can be by by diode-base 71、Diode chip for backlight unit 72、Diode copper coin 73 and the diode lead 74 molding diode 7 being integrated that freezes takes out.

Claims (5)

nullIt is characterized in that,First its using method comprises the steps:,Cover plate (2) is taken off from base plate (1),Diode-base (71) is positioned in the diode-base locating slot (12) of base plate (1) upper surface,Afterwards,Cover plate (2) is covered on base plate (1),By alignment pin (3), cover plate (2) is positioned on base plate (1),Again by diode chip for backlight unit (72)、One end of diode copper coin (73) and diode lead (74) is overlayed on diode-base (71) successively by diode lead hole, location (22) on cover plate (2),Again steel ball (6) is pressed on the diode lead (74) being arranged on diode copper coin (73),Finally,This mould is positioned over diode freeze diode is freezed by equipment,After having freezed,Remove alignment pin (3),Cover plate (2) is taken off by base plate (1),Can be by by diode-base (71)、Diode chip for backlight unit (72)、The freeze molding diode (7) that is integrated of diode copper coin (73) and diode lead (74) takes out.
CN201510590342.8A2015-09-172015-09-17A kind of diode welding mould and using method thereofActiveCN105108417B (en)

Priority Applications (1)

Application NumberPriority DateFiling DateTitle
CN201510590342.8ACN105108417B (en)2015-09-172015-09-17A kind of diode welding mould and using method thereof

Applications Claiming Priority (1)

Application NumberPriority DateFiling DateTitle
CN201510590342.8ACN105108417B (en)2015-09-172015-09-17A kind of diode welding mould and using method thereof

Publications (2)

Publication NumberPublication Date
CN105108417A CN105108417A (en)2015-12-02
CN105108417Btrue CN105108417B (en)2016-10-05

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Family Applications (1)

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CN201510590342.8AActiveCN105108417B (en)2015-09-172015-09-17A kind of diode welding mould and using method thereof

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CN (1)CN105108417B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
CN107553038B (en)*2017-09-292019-04-02北京时代民芯科技有限公司A kind of tooling and welding method for the welding of double plug diode lead
CN110323166B (en)*2019-08-032024-04-30捷捷半导体有限公司Sintering mold with stress release groove for automobile diode and use method
CN112151417B (en)*2020-09-112025-01-21中国振华集团永光电子有限公司(国营第八七三厂) A U-shaped packaging welding mold

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
CN101913046B (en)*2010-05-212013-05-01苏州固锝电子股份有限公司Welding device for welding diode
US8794501B2 (en)*2011-11-182014-08-05LuxVue Technology CorporationMethod of transferring a light emitting diode
CN202622205U (en)*2012-03-302012-12-26高密星合电子有限公司Diode lead chip compacting device
CN102647860A (en)*2012-05-142012-08-22宜兴市东晨电子科技有限公司Joint welding fixture
CN204913167U (en)*2015-09-172015-12-30贵州雅光电子科技股份有限公司Diode mould that freezes

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Legal Events

DateCodeTitleDescription
C06Publication
PB01Publication
C10Entry into substantive examination
SE01Entry into force of request for substantive examination
C14Grant of patent or utility model
GR01Patent grant
PE01Entry into force of the registration of the contract for pledge of patent right

Denomination of invention:Diode burn-in mold and using method thereof

Effective date of registration:20170116

Granted publication date:20161005

Pledgee:Bank of Guiyang Limited by Share Ltd high tech branch

Pledgor:Guizhou Yaguang Electronic Technology Co.,Ltd.

Registration number:2017990000037

PLDCEnforcement, change and cancellation of contracts on pledge of patent right or utility model
PC01Cancellation of the registration of the contract for pledge of patent right

Date of cancellation:20200317

Granted publication date:20161005

Pledgee:Bank of Guiyang Limited by Share Ltd high tech branch

Pledgor:GUIZHOU YAGUANG ELECTRONICS TECHNOLOGY Co.,Ltd.

Registration number:2017990000037

PC01Cancellation of the registration of the contract for pledge of patent right

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