| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510590342.8ACN105108417B (en) | 2015-09-17 | 2015-09-17 | A kind of diode welding mould and using method thereof |
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510590342.8ACN105108417B (en) | 2015-09-17 | 2015-09-17 | A kind of diode welding mould and using method thereof |
| Publication Number | Publication Date |
|---|---|
| CN105108417A CN105108417A (en) | 2015-12-02 |
| CN105108417Btrue CN105108417B (en) | 2016-10-05 |
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510590342.8AActiveCN105108417B (en) | 2015-09-17 | 2015-09-17 | A kind of diode welding mould and using method thereof |
| Country | Link |
|---|---|
| CN (1) | CN105108417B (en) |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107553038B (en)* | 2017-09-29 | 2019-04-02 | 北京时代民芯科技有限公司 | A kind of tooling and welding method for the welding of double plug diode lead |
| CN110323166B (en)* | 2019-08-03 | 2024-04-30 | 捷捷半导体有限公司 | Sintering mold with stress release groove for automobile diode and use method |
| CN112151417B (en)* | 2020-09-11 | 2025-01-21 | 中国振华集团永光电子有限公司(国营第八七三厂) | A U-shaped packaging welding mold |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101913046B (en)* | 2010-05-21 | 2013-05-01 | 苏州固锝电子股份有限公司 | Welding device for welding diode |
| US8794501B2 (en)* | 2011-11-18 | 2014-08-05 | LuxVue Technology Corporation | Method of transferring a light emitting diode |
| CN202622205U (en)* | 2012-03-30 | 2012-12-26 | 高密星合电子有限公司 | Diode lead chip compacting device |
| CN102647860A (en)* | 2012-05-14 | 2012-08-22 | 宜兴市东晨电子科技有限公司 | Joint welding fixture |
| CN204913167U (en)* | 2015-09-17 | 2015-12-30 | 贵州雅光电子科技股份有限公司 | Diode mould that freezes |
| Publication number | Publication date |
|---|---|
| CN105108417A (en) | 2015-12-02 |
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| CN105108417B (en) | A kind of diode welding mould and using method thereof | |
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| PE01 | Entry into force of the registration of the contract for pledge of patent right | Denomination of invention:Diode burn-in mold and using method thereof Effective date of registration:20170116 Granted publication date:20161005 Pledgee:Bank of Guiyang Limited by Share Ltd high tech branch Pledgor:Guizhou Yaguang Electronic Technology Co.,Ltd. Registration number:2017990000037 | |
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| PC01 | Cancellation of the registration of the contract for pledge of patent right | Date of cancellation:20200317 Granted publication date:20161005 Pledgee:Bank of Guiyang Limited by Share Ltd high tech branch Pledgor:GUIZHOU YAGUANG ELECTRONICS TECHNOLOGY Co.,Ltd. Registration number:2017990000037 | |
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