技术领域technical field
本发明涉及微型器件。更具体地，本发明的实施例涉及用于从承载衬底转移微型器件的系统和方法。The present invention relates to microdevices. More specifically, embodiments of the invention relate to systems and methods for transferring microdevices from a carrier substrate.
背景技术Background technique
商业化微型器件诸如射频(RF)微机电系统(MEMS)微动开关、发光二极管(LED)显示系统，以及MEMS或基于石英振荡器的可行性很大程度上受到与制造这些器件相关联的难度和成本的制约。制造工艺通常包括基于晶圆的加工和转移技术。The viability of commercializing miniature devices such as radio frequency (RF) microelectromechanical systems (MEMS) microswitches, light emitting diode (LED) display systems, and MEMS or quartz-based oscillators is largely hampered by the difficulties associated with fabricating these devices and cost constraints. Manufacturing processes typically include wafer-based processing and transfer techniques.
器件转移工艺包括从转移晶圆转移到接收晶圆。一种此类具体实施为“直印”，其涉及器件阵列从转移晶圆到接收晶圆的一个键合步骤，之后进行转移晶圆的移除。另一种此类具体实施为“转印”，其涉及两个键合/解键合步骤。在转印中，转移晶圆可从供体晶圆拾取器件阵列并将器件键合至接收晶圆。在转印之后，转移晶圆可使用包括激光剥离(LLO)、磨光或抛光以及蚀刻的技术来移除。The device transfer process includes transferring from a transfer wafer to a receiver wafer. One such implementation is "direct printing," which involves one bonding step of the device array from the transfer wafer to the receiver wafer, followed by removal of the transfer wafer. Another such implementation is "transfer printing", which involves two bonding/debonding steps. In transfer printing, a transfer wafer can pick up an array of devices from a donor wafer and bond the devices to a receiver wafer. After transfer, the transferred wafer can be removed using techniques including laser lift off (LLO), grinding or polishing, and etching.
已将平衡环机构用于晶圆抛光设备以有助于对该晶圆均匀抛光。例如，抛光设备中的无源平衡环机构有助于晶圆与抛光垫的对准。Gimbal mechanisms have been used in wafer polishing equipment to aid in uniform polishing of the wafer. For example, passive gimbal mechanisms in polishing equipment help align the wafer to the polishing pad.
发明内容Contents of the invention
本发明公开了一种质量转移工具操纵器组件以及使用质量转移工具操纵器组件来从承载衬底转移微型器件阵列的方法。在一个实施例中，质量转移工具操纵器组件包括外壳、翻转-倾斜-z挠曲部、致动器组件和微型拾取阵列支座。微型拾取阵列可独立于质量转移工具操纵器组件提供或与质量转移工具操纵器组件一体化形成。翻转-倾斜-z挠曲部可包括顶部挠曲部件，该顶部挠曲部件与外壳相接合并且通过柔性耦接件与底部挠曲部件连接。例如，顶部挠曲部件和底部挠曲部件可为由柔性耦接件连接的凸缘。致动器组件可与底部挠曲部件可操作地耦接，使得对致动器组件的致动使底部挠曲部件相对于顶部挠曲部件移动。例如，在一个实施例中，质量转移工具操纵器组件包括将致动器组件与底部挠曲部件耦接的分布板。微型拾取阵列支座还可与底部挠曲部件耦接。此外，微型拾取阵列支座可包括与柔顺性元件诸如横梁耦接的枢转平台。位移传感器可与柔顺性元件集成。在一个实施例中，具有支撑静电转移头部的衬底的微型拾取阵列可能够与枢转平台接合。The present invention discloses a mass transfer tool manipulator assembly and a method of using the mass transfer tool manipulator assembly to transfer an array of micro devices from a carrier substrate. In one embodiment, a mass transfer tool manipulator assembly includes a housing, a tip-tilt-z flexure, an actuator assembly, and a micro pick up array mount. The micropickup array can be provided independently of or integrated with the mass transfer tool manipulator assembly. The flip-tilt-z flexure may include a top flexure engaged with the housing and connected to a bottom flexure by a flexible coupling. For example, the top and bottom flexures may be flanges connected by a flexible coupling. The actuator assembly can be operably coupled to the bottom flexure such that actuation of the actuator assembly moves the bottom flexure relative to the top flexure. For example, in one embodiment, a mass transfer tool manipulator assembly includes a distribution plate coupling the actuator assembly to the bottom flexure. A micro pick up array mount can also be coupled to the bottom flexure. Additionally, the micro pick up array mount may include a pivoting platform coupled to a compliant element such as a beam. Displacement sensors can be integrated with compliant elements. In one embodiment, a micropickup array with a substrate supporting an electrostatic transfer head may be capable of engaging a pivoting platform.
在一个实施例中，微型拾取阵列支座可进一步包括基部，该基部侧向地围绕枢转平台，其中柔顺性元件位于枢转平台和基部之间并且在枢轴处与枢转平台和基部耦接。例如，柔顺性元件可在位于基部边缘上的外枢轴处与基部耦接并且在位于枢转平台边缘上的内枢轴处与枢转平台耦接，该枢转平台边缘正交于基部边缘。柔顺性元件还可在第二内枢轴处与枢转平台耦接，并且在第二外枢轴处与基部耦接，其中该第二内枢轴跨枢转平台与内枢轴相对，并且该第二外枢轴跨枢转平台与外枢轴相对。在一个实施例中，微型拾取阵列支座可包括第二柔顺性元件，该第二柔顺性元件通过位于第二基部边缘上的第二外枢轴与基部耦接并且通过位于第二枢转平台边缘上的第二内枢轴与枢转平台耦接。此外，第二位移传感器可与第二柔顺性元件集成。In one embodiment, the micro pick up array mount may further include a base laterally surrounding the pivoting platform, wherein the compliant element is positioned between and coupled to the pivoting platform and the base at a pivot. catch. For example, the compliant element may be coupled to the base at an outer pivot on an edge of the base and coupled to the pivot platform at an inner pivot on an edge of a pivoting platform that is normal to the edge of the base . The compliant element is further coupled to the pivot platform at a second inner pivot, and coupled to the base at a second outer pivot, wherein the second inner pivot is opposite the inner pivot across the pivot platform, and The second outer pivot is opposite the outer pivot across the pivot platform. In one embodiment, the micro pick up array mount may include a second compliant element coupled to the base via a second outer pivot located on the edge of the second base and via a second pivot platform located on the second pivot platform. A second inner pivot on the edge is coupled to the pivot platform. Additionally, a second displacement sensor may be integrated with the second compliant element.
在一个实施例中，位移传感器可为附接至柔顺性元件的接近内枢轴或外枢轴的高应变区域的应变仪。例如，可将应变仪键合到高应变区域。另选地，可将应变仪沉积于高应变区域上。此外，应变仪可通过对高应变区域进行掺杂来形成。在一个实施例中，微型拾取阵列支座可包括与位于柔顺性元件上的位移传感器相邻的参考应变仪。位移传感器和参考应变仪可提供惠斯通半桥中的相邻桥臂。In one embodiment, the displacement sensor may be a strain gauge attached to a high strain region of the compliant element near the inner or outer pivot. For example, strain gauges can be bonded to high strain areas. Alternatively, strain gauges can be deposited on high strain areas. Additionally, strain gauges can be formed by doping regions of high strain. In one embodiment, the micro pick-up array mount may include a reference strain gauge adjacent to a displacement sensor located on the compliant element. Displacement transducers and reference strain gauges are provided to adjacent arms in a Wheatstone half bridge.
在一个实施例中，微型拾取阵列支座可包括各种触件和电连接件。例如，微型拾取阵列支座可包括与位移传感器电连接的位于基部上的位移传感器触件。在一个实施例中，质量转移工具操纵器组件可包括通过位移传感器触件与位移传感器电连接的位置感测模块。例如，位移传感器触件可通过柔性电路或弹簧触件与位置感测模块电连接。在一个实施例中，微型拾取阵列支座可包括位于基部上的基部操作电压触件，该基部操作电压触件与位于枢转平台上的枢转平台操作电压触件电连接。此外，微型拾取阵列支座可包括位于基部上的基部钳位触件，该基部钳位触件与位于枢转平台上的键合位处的钳位电极电连接。在一个实施例中，微型拾取阵列支座可包括位于枢转平台上的键合位，该键合位包括金属诸如金、铜或铝。In one embodiment, a micro pick up array mount may include various contacts and electrical connections. For example, a micro pick up array mount may include displacement sensor contacts on a base that are electrically connected to the displacement sensor. In one embodiment, the mass transfer tool manipulator assembly may include a position sensing module electrically connected to the displacement sensor through displacement sensor contacts. For example, the displacement sensor contacts may be electrically connected to the position sensing module through flexible circuits or spring contacts. In one embodiment, the micro pick up array mount may include a base operating voltage contact on the base that is electrically connected to a pivoting platform operating voltage contact on the pivoting platform. Additionally, the micro pick-up array mount may include base clamp contacts on the base that are electrically connected to clamp electrodes at the bonding sites on the pivoting platform. In one embodiment, the micro pick up array mount may include a bonding site on the pivoting platform, the bonding site comprising a metal such as gold, copper or aluminum.
在一个实施例中，微型拾取阵列支座还可包括位于枢转平台上的温度传感器和加热元件。加热元件可包括例如电阻合金或表面安装技术电阻器。此外，质量转移工具操纵器组件可包括位于加热元件和位置感测模块之间的绝缘板。微型拾取阵列支座的基部可与绝缘板耦接并且绝缘板可进一步与分布板耦接。In one embodiment, the micro pick up array mount may also include a temperature sensor and a heating element on the pivoting platform. The heating element may comprise, for example, a resistive alloy or a surface mount technology resistor. Additionally, the mass transfer tool manipulator assembly may include an insulating plate between the heating element and the position sensing module. The base of the micro pick-up array mount may be coupled with the insulating plate and the insulating plate may be further coupled with the distribution plate.
在一个实施例中，该方法包括朝承载衬底移动质量转移工具操纵器组件以及使位于承载衬底上的微型器件阵列接触与质量转移工具操纵器组件的枢转平台耦接的静电转移头部阵列。该方法还可包括感测与枢转平台耦接的柔顺性元件的变形。例如，感测变形可包括感测与柔顺性元件集成的位移传感器的应变。在一个实施例中，该方法进一步包括在感测变形之后并且在停止质量转移工具操纵器组件和承载衬底之间的相对移动之前，调整与柔顺性元件耦接的基部的位置。例如，调整位置可包括对耦接至基部的致动器组件进行致动以通过倾斜或翻转基部来进一步使基部与承载衬底的平面对准。该方法还可包括向静电转移头部阵列施加电压以在微型器件阵列上产生夹持压力以及从承载衬底拾取微型器件阵列。在一个实施例中，该方法包括在拾取微型器件阵列时向静电转移头部阵列施加热量。In one embodiment, the method includes moving a mass transfer tool manipulator assembly toward a carrier substrate and contacting an array of micro devices on the carrier substrate with an electrostatic transfer head coupled to a pivoting platform of the mass transfer tool manipulator assembly array. The method may also include sensing deformation of a compliant element coupled to the pivoting platform. For example, sensing deformation may include sensing strain of a displacement sensor integrated with the compliant element. In one embodiment, the method further includes adjusting a position of the base coupled to the compliant element after sensing the deformation and before stopping the relative movement between the mass transfer tool manipulator assembly and the carrier substrate. For example, adjusting the position may include actuating an actuator assembly coupled to the base to further align the base with a plane of the carrier substrate by tilting or flipping the base. The method may also include applying a voltage to the array of electrostatic transfer heads to generate clamping pressure on the array of micro-devices and picking up the array of micro-devices from the carrier substrate. In one embodiment, the method includes applying heat to the array of electrostatic transfer heads while picking up the array of micro devices.
在一个实施例中，该方法包括朝接收衬底移动质量转移工具操纵器组件以及使接收衬底接触由与质量转移工具操纵器组件的枢转平台耦接的静电转移头部阵列所承载的微型器件阵列。该方法还可包括感测与枢转平台耦接的柔顺性元件的变形。例如，感测变形可包括感测与柔顺性元件集成的位移传感器的应变。在一个实施例中，该方法进一步包括在感测变形之后并且在停止质量转移工具操纵器组件和接收衬底之间的相对移动之前，调整与柔顺性元件耦接的基部的位置。例如，调整位置可包括对与基部耦接的致动器组件进行致动以通过倾斜或翻转基部来进一步使基部与接收衬底的平面对准。该方法还可包括从静电转移头部阵列移除电压，以及将微型器件阵列释放到接收衬底上。在一个实施例中，该方法包括在移除电压之前向静电转移头部阵列施加热量。In one embodiment, the method includes moving a mass transfer tool manipulator assembly toward a receiving substrate and contacting the receiving substrate with microscopic device array. The method may also include sensing deformation of a compliant element coupled to the pivoting platform. For example, sensing deformation may include sensing strain of a displacement sensor integrated with the compliant element. In one embodiment, the method further includes adjusting a position of the base coupled to the compliant element after sensing the deformation and before stopping the relative movement between the mass transfer tool manipulator assembly and the receiving substrate. For example, adjusting the position may include actuating an actuator assembly coupled to the base to further align the base with the plane of the receiving substrate by tilting or flipping the base. The method may also include removing the voltage from the array of electrostatic transfer heads, and releasing the array of micro devices onto the receiving substrate. In one embodiment, the method includes applying heat to the array of electrostatic transfer heads prior to removing the voltage.
附图说明Description of drawings
图1是根据本发明的实施例的质量转移工具的透视图图示。Figure 1 is a perspective view illustration of a mass transfer tool according to an embodiment of the invention.
图2是根据本发明的实施例的保持微型拾取阵列的质量转移工具操纵器组件的透视图图示。2 is a perspective view illustration of a mass transfer tool manipulator assembly holding a micro pick-up array in accordance with an embodiment of the present invention.
图3是根据本发明的实施例的相对于图2的剖面线A-A获取的质量转移工具操纵器组件的横截面透视图图示。3 is a cross-sectional perspective view illustration of a mass transfer tool manipulator assembly taken relative to section line A-A of FIG. 2 in accordance with an embodiment of the present invention.
图4A是根据本发明的实施例的具有致动器和挠曲附接件的致动器组件的侧视图图示。4A is a side view illustration of an actuator assembly with an actuator and a flexure attachment, according to an embodiment of the invention.
图4B是根据本发明的实施例的质量转移工具操纵器组件的翻转-倾斜-z挠曲部的透视图。4B is a perspective view of a tip-tilt-z flexure of a mass transfer tool manipulator assembly in accordance with an embodiment of the invention.
图5A是根据本发明的实施例的具有与柔顺性元件集成的位移传感器的微型拾取阵列支座的透视图。5A is a perspective view of a micro pick-up array mount with displacement sensors integrated with compliant elements, according to an embodiment of the invention.
图5B是根据本发明的实施例的取自图5A的细节X的与微型拾取阵列支座的柔顺性元件集成的位移传感器的平面图。Figure 5B is a plan view of a displacement sensor integrated with a compliant element of a micro pick-up array mount taken from detail X of Figure 5A in accordance with an embodiment of the invention.
图6是根据本发明的实施例的具有位于枢转平台上的加热元件的微型拾取阵列支座的透视图。6 is a perspective view of a micro pick up array mount with a heating element on a pivoting platform according to an embodiment of the invention.
图7是根据本发明的实施例的具有支撑静电转移头部阵列的衬底的微型拾取阵列的侧视图。7 is a side view of a micropickup array with a substrate supporting an array of electrostatic transfer heads in accordance with an embodiment of the invention.
图8是根据本发明的实施例的与微型拾取阵列接合的微型拾取阵列支座的侧视图图示。8 is a side view illustration of a micro pick up array mount engaged with a micro pick up array in accordance with an embodiment of the invention.
图9是根据本发明的实施例的具有与柔顺性元件集成的位移传感器和位于枢转平台上的静电转移头部阵列的微型拾取阵列支座的透视图。9 is a perspective view of a micropickup array mount with a displacement sensor integrated with a compliant element and an array of electrostatic transfer heads on a pivoting platform in accordance with an embodiment of the invention.
图10是根据本发明的实施例的具有位于枢转平台上的加热元件的微型拾取阵列支座的透视图。10 is a perspective view of a micro pick up array mount with heating elements on a pivoting platform, according to an embodiment of the invention.
图11是根据本发明的实施例的相对于图9的剖面线获取的与弹簧触件电连接的微型拾取阵列支座的横截面侧视图图示。11 is a cross-sectional side view illustration of a micro pick-up array mount electrically connected to spring contacts taken relative to the section line of FIG. 9 in accordance with an embodiment of the invention.
图12是根据本发明的实施例的具有柔性区域的微型拾取阵列支座的透视图图示。Figure 12 is a perspective view illustration of a micro pick up array mount having a flexible region in accordance with an embodiment of the present invention.
图13是根据本发明的实施例的保持微型拾取阵列并且与控制系统互连的质量转移工具操纵器组件的侧视图图示。13 is a side view illustration of a mass transfer tool manipulator assembly holding a micropickup array and interconnected with a control system in accordance with an embodiment of the invention.
图14是根据本发明的实施例的用于调整质量转移工具操纵器组件的控制回路的示意图。14 is a schematic diagram of a control loop for adjusting a mass transfer tool manipulator assembly according to an embodiment of the invention.
图15是示出根据本发明的实施例的从承载衬底拾取微型器件阵列的方法的流程图。15 is a flowchart illustrating a method of picking up an array of micro devices from a carrier substrate according to an embodiment of the present invention.
图16是根据本发明的实施例的朝承载衬底移动的质量转移工具操纵器组件的示意图。16 is a schematic illustration of a mass transfer tool manipulator assembly moving toward a carrier substrate in accordance with an embodiment of the present invention.
图17是根据本发明的实施例的与接触该承载衬底上的微型器件阵列的质量转移工具操纵器组件耦接的静电转移头部阵列的示意图。17 is a schematic diagram of an array of electrostatic transfer heads coupled to a mass transfer tool manipulator assembly contacting an array of micro devices on the carrier substrate, according to an embodiment of the invention.
图18是根据本发明的实施例的调整微型拾取阵列支座的位置的质量转移工具操纵器组件的示意图。18 is a schematic diagram of a mass transfer tool manipulator assembly for adjusting the position of a micro pick up array mount according to an embodiment of the invention.
图19是根据本发明的实施例的从承载衬底拾取微型器件阵列的质量转移工具操纵器组件的示意图。Figure 19 is a schematic illustration of a mass transfer tool manipulator assembly for picking up an array of micro devices from a carrier substrate in accordance with an embodiment of the present invention.
图20是示出根据本发明的实施例的将微型器件阵列置于接收衬底上的方法的流程图。20 is a flowchart illustrating a method of placing an array of micro devices on a receiving substrate according to an embodiment of the present invention.
图21是根据本发明的实施例的朝接收衬底移动的质量转移工具操纵器组件的示意图。21 is a schematic illustration of a mass transfer tool manipulator assembly moving toward a receiving substrate according to an embodiment of the invention.
图22是由与接触接收衬底的质量转移工具操纵器组件耦接的静电转移头部阵列所承载的微型器件阵列的示意图。22 is a schematic illustration of an array of microdevices carried by an array of electrostatic transfer heads coupled to a mass transfer tool manipulator assembly contacting a receiving substrate.
图23是根据本发明的实施例的调整微型拾取阵列支座的位置的质量转移工具操纵器组件的示意图。23 is a schematic illustration of a mass transfer tool manipulator assembly for adjusting the position of a micro pick up array mount according to an embodiment of the invention.
图24是根据本发明的实施例的将微型器件阵列释放到接收衬底上的质量转移工具操纵器组件的示意图。Figure 24 is a schematic illustration of a mass transfer tool manipulator assembly releasing an array of micro devices onto a receiving substrate according to an embodiment of the present invention.
图25是可根据本发明的实施例使用的计算机系统的示意图。Figure 25 is a schematic diagram of a computer system that may be used in accordance with embodiments of the present invention.
具体实施方式detailed description
本发明的实施例描述了用于从承载衬底转移微型器件或微型器件阵列的系统和方法。例如，微型器件或微型器件阵列可以是在相关的美国专利申请13/372,222、13/436,260、13/458,932和13/625,825中举例说明并描述的微型LED器件结构中的任一种微型LED器件结构。尽管具体地针对微型LED器件描述了本发明的一些实施例，但本发明的实施例并不限于此，并且某些实施例还可适用于其他微型LED器件和微型器件诸如二极管、晶体管、集成电路(IC)芯片和MEM。Embodiments of the present invention describe systems and methods for transferring microdevices or arrays of microdevices from a carrier substrate. For example, the micro-device or array of micro-devices can be any of the micro-LED device structures exemplified and described in related U.S. patent application Ser. . Although some embodiments of the present invention are described specifically with respect to micro LED devices, embodiments of the present invention are not limited thereto and certain embodiments are also applicable to other micro LED devices and microdevices such as diodes, transistors, integrated circuits (IC) chips and MEMs.
在各种实施例中，参照附图进行描述。然而，某些实施例可在不存在这些具体细节中的一个或多个具体细节或者与其他已知方法和配置相结合的情况下实施。在以下的描述中，示出许多具体细节诸如特定配置、尺寸和工艺以提供对本发明的透彻理解。在其他情况下，未对熟知的工艺和制造技术进行特别详细地描述，以免不必要地模糊本发明。整个本说明书中所提到的“一个实施例”(“one embodiment”，“an embodiment”)等是指结合实施例所描述的特定特征、结构、构型或特性包括在本发明的至少一个实施例中。因此，整个本说明书中多处出现短语“一个实施例”(“one embodiment”，“an embodiment”)等不一定是指本发明的相同实施例。此外，特定特征、结构、构型或特性可以任何适当的方式结合在一个或多个实施例中。In various embodiments, the description is made with reference to the figures. However, certain embodiments may be practiced without one or more of these specific details, or in combination with other known methods and configurations. In the following description, numerous specific details are shown, such as specific configurations, dimensions and processes, in order to provide a thorough understanding of the present invention. In other instances, well known processes and fabrication techniques have not been described in particular detail so as not to unnecessarily obscure the present invention. References throughout this specification to "one embodiment" ("one embodiment", "an embodiment"), etc. mean that a specific feature, structure, configuration or characteristic described in conjunction with an embodiment is included in at least one implementation of the present invention. example. Thus, appearances of the phrases "one embodiment," "an embodiment," etc. in various places throughout this specification are not necessarily referring to the same embodiment of the invention. Furthermore, the particular features, structures, configurations or characteristics may be combined in any suitable manner in one or more embodiments.
本文所使用的术语“在...上面”、“到”、“在...之间”和“在...上”可指一层或部件相对于其他层或部件的相对位置。一层在另一层“上面”或“上”或者键合“到”另一层可为与其他层直接接触或可具有一个或多个中间层。一层在层“之间”可为与该层直接接触或可具有一个或多个中间层。As used herein, the terms "on," "to," "between," and "on" may refer to the relative position of one layer or component with respect to other layers or components. A layer that is "on" or "on" or bonded "to" another layer may be in direct contact with the other layer or may have one or more intervening layers. A layer "between" layers can be in direct contact with the layer or can have one or more intervening layers.
本文所使用的术语“微型”器件或“微型”LED结构可指根据本发明的实施例的某些器件或结构的描述性尺寸。如本文所用，术语“微型”器件或结构是指1μm到100μm的尺度。然而，本发明的实施例并不一定限于此，并且实施例的某些方面可适用于更大和可能更小的尺度。在一个实施例中，微型器件阵列中的单个微型器件和静电转移头部阵列中的单个静电转移头部均具有1μm到100μm的最大尺寸，例如长度或宽度。在一个实施例中，每个微型器件或静电转移头部的顶部接触面具有1μm到100μm的最大尺寸。在一个实施例中，每个微型器件或静电转移头部的顶部接触面具有3μm到20μm的最大尺寸。在一个实施例中，微型器件阵列的节距和对应的静电转移头部阵列的节距可为(1μm到100μm)×(1μm到100μm)，例如20μm×20μm或5μm×5μm的节距。在一个方面，在不限于特定理论的情况下，本发明的实施例描述微型器件转移头和头阵列，所述微型器件转移头和头阵列根据静电夹使用异性电荷相吸来拾取微型器件的原理来操作。根据本发明的实施例，可向微型器件转移头施加吸合电压以便在微型器件上产生夹持压力并拾取微型器件。As used herein, the term "micro" device or "micro" LED structure may refer to descriptive dimensions of certain devices or structures according to embodiments of the present invention. As used herein, the term "micro" device or structure refers to dimensions of 1 μm to 100 μm. Embodiments of the present invention are not necessarily so limited, however, and certain aspects of the embodiments are applicable to larger and possibly smaller scales. In one embodiment, a single microdevice in the array of microdevices and a single electrostatic transfer head in the array of electrostatic transfer heads each have a largest dimension, eg, length or width, of 1 μm to 100 μm. In one embodiment, the top contact surface of each microdevice or electrostatic transfer head has a maximum dimension of 1 μm to 100 μm. In one embodiment, the top contact surface of each microdevice or electrostatic transfer head has a maximum dimension of 3 μm to 20 μm. In one embodiment, the pitch of the micro-device array and the corresponding electrostatic transfer head array may be (1 μm to 100 μm)×(1 μm to 100 μm), such as a pitch of 20 μm×20 μm or 5 μm×5 μm. In one aspect, without being limited to a particular theory, embodiments of the invention describe micro device transfer heads and head arrays that pick up micro devices based on the principle that electrostatic clamps use opposite charges to attract to operate. According to an embodiment of the present invention, a pull-in voltage may be applied to the micro-device transfer head to generate clamping pressure on the micro-device and pick up the micro-device.
在一个方面，本发明的实施例描述了使用质量转移工具操纵器组件进行微型器件的质量转移的系统和方法，该质量转移工具操纵器组件具有用于调整静电转移头部阵列与承载衬底上的微型器件阵列对准的反馈机构。在一个实施例中，质量转移工具操纵器组件包括翻转-倾斜-z挠曲部、致动器组件和微型拾取阵列支座，该微型拾取阵列支座具有与一个或多个柔顺性元件集成的一个或多个位移传感器。例如，位移传感器可为附接至柔顺性元件的高应变区域的应变仪。这样，位移传感器可用于在静电转移头部阵列接触微型器件阵列时感测柔顺性元件的变形。在一个实施例中，基于来自一个或多个位移传感器的反馈，质量转移工具操纵器组件的致动器组件可调整微型拾取阵列支座的空间取向以在微型拾取阵列支座上改变压力的中心。因此，质量转移工具操纵器组件可基于闭环反馈回路来促成安装在微型拾取阵列支座上的静电转移头部阵列与微型器件阵列的主动对准。由于精对准可在拾取微型器件时以及类似地在释放微型器件时完成，因此主动对准可提高微型器件的转移速率。In one aspect, embodiments of the invention describe systems and methods for mass transfer of microdevices using a mass transfer tool manipulator assembly having a device for aligning an array of electrostatic transfer heads with a A Feedback Mechanism for Microdevice Array Alignment. In one embodiment, a mass transfer tool manipulator assembly includes a tip-tilt-z flexure, an actuator assembly, and a micro pick-up array mount having integrated one or more compliant elements. One or more displacement sensors. For example, the displacement sensor may be a strain gauge attached to a high strain region of the compliant element. In this way, the displacement sensor can be used to sense the deformation of the compliant element when the array of electrostatic transfer heads contacts the array of microdevices. In one embodiment, based on feedback from one or more displacement sensors, the actuator assembly of the mass transfer tool manipulator assembly can adjust the spatial orientation of the micro pick up array mount to change the center of pressure on the micro pick up array mount . Thus, the mass transfer tool manipulator assembly can facilitate active alignment of an array of electrostatic transfer heads mounted on a micropickup array mount with an array of microdevices based on a closed-loop feedback loop. Active alignment can increase the transfer rate of the micro-devices since fine alignment can be done when picking up the micro-devices and similarly when releasing the micro-devices.
在另一方面，本发明的实施例描述了使用与质量转移工具操纵器组件的致动器组件耦接的翻转-倾斜-z挠曲部进行微型器件的质量转移的系统和方法。在一个实施例中，翻转-倾斜-z挠曲部对致动器组件赋予无功负载以在由致动器组件进行调整期间进行微型拾取阵列支座的平滑运动。在一个实施例中，翻转-倾斜-z挠曲部对微型拾取阵列支座赋予恢复性负载以从承载衬底拾取微型器件阵列。因此，质量转移工具操纵器组件可有助于接触并使用静电转移头部阵列拾取微型器件阵列，而不损坏微型器件或静电转移头部。In another aspect, embodiments of the present invention describe systems and methods for mass transfer of micro devices using a flip-tilt-z flexure coupled to an actuator assembly of a mass transfer tool manipulator assembly. In one embodiment, the flip-tilt-z flexure imparts a reactive load to the actuator assembly for smooth motion of the micro pick up array mount during adjustment by the actuator assembly. In one embodiment, the flip-tilt-z flexure imparts a restorative load to the micro pick-up array mount to pick up the array of micro-device from the carrier substrate. Accordingly, the mass transfer tool manipulator assembly can facilitate contacting and picking up an array of microdevices using an array of electrostatic transfer heads without damaging the microdevices or the electrostatic transfer heads.
在另一方面，本发明的实施例描述了一种利用静电转移头部阵列进行预制造的微型器件阵列的质量转移的方式。例如，预制造的微型器件可具有特定功能，诸如但不限于用于发光的LED、用于逻辑部件和存储器的硅IC，以及用于射频(RF)通信的砷化镓(GaAs)电路。在一些实施例中，准备好拾取的微型LED器件阵列被描述为具有20μm×20μm的节距，或5μm×5μm的节距。在这些密度下，例如，6英寸的衬底可以10μm×10μm的节距容纳约1.65亿个微型LED器件，或以5μm×5μm的节距容纳约6.6亿个微型LED器件。包括与对应的微型LED器件阵列的节距的整数倍相匹配的静电转移头部阵列的质量转移工具操纵器组件可用于拾取微型LED器件阵列并将其转移到接收衬底。这样，可以高转移速率将微型LED器件集成并装配到异类集成系统中，包括从微型显示器到大面积显示器的范围的任何尺寸的衬底。例如，1cm×1cm的静电转移头部阵列可拾取并转移100,000个以上的微型器件，利用更大的静电转移头部阵列能够转移更多的微型器件。In another aspect, embodiments of the present invention describe a method for mass transfer of an array of prefabricated microdevices using an array of electrostatic transfer heads. For example, prefabricated microdevices may have specific functions such as, but not limited to, LEDs for light emission, silicon ICs for logic components and memory, and gallium arsenide (GaAs) circuits for radio frequency (RF) communications. In some embodiments, the array of micro LED devices ready to be picked is described as having a pitch of 20 μm by 20 μm, or a pitch of 5 μm by 5 μm. At these densities, for example, a 6-inch substrate can accommodate approximately 165 million micro-LED devices at a 10 μm × 10 μm pitch, or approximately 660 million micro-LED devices at a 5 μm × 5 μm pitch. A mass transfer tool manipulator assembly comprising an array of electrostatic transfer heads matched to an integer multiple of the pitch of a corresponding array of micro LED devices can be used to pick up and transfer an array of micro LED devices to a receiving substrate. In this way, micro LED devices can be integrated and assembled into heterogeneous integrated systems at high transfer rates, including substrates of any size ranging from microdisplays to large area displays. For example, a 1cm×1cm electrostatic transfer head array can pick up and transfer more than 100,000 micro devices, and a larger electrostatic transfer head array can transfer more micro devices.
参见图1，其示出根据本发明的实施例的质量转移工具的透视图图示。如图所示，质量转移工具100可包括质量转移工具操纵器组件102，该质量转移工具操纵器组件用于从由承载衬底保持器104所保持的承载衬底拾取微型器件阵列并且用于将微型器件阵列转移并释放到由接收衬底保持器106所保持的接收衬底上。质量转移工具100和质量转移工具操纵器组件102的操作可至少部分地由计算机系统108来控制。在一个实施例中，如下进一步详述的，计算机系统108可基于从位于与质量转移工具操纵器组件102耦接的微型拾取阵列支座上的各种传感器接收的反馈信号来控制质量转移工具操纵器组件102的操作。Referring to FIG. 1 , an illustration of a perspective view of a mass transfer tool in accordance with an embodiment of the present invention is shown. As shown, the mass transfer tool 100 may include a mass transfer tool manipulator assembly 102 for picking up an array of micro devices from a carrier substrate held by a carrier substrate holder 104 and for The array of micro devices is transferred and released onto a receiving substrate held by receiving substrate holder 106 . Operation of mass transfer tool 100 and mass transfer tool manipulator assembly 102 may be controlled at least in part by computer system 108 . In one embodiment, the computer system 108 may control the mass transfer tool manipulation based on feedback signals received from various sensors located on a micro pick up array mount coupled to the mass transfer tool manipulator assembly 102, as described in further detail below. The operation of the device component 102.
在一个实施例中，质量转移工具100和质量转移工具操纵器组件102的部件和子组件可相对于彼此移动。例如，质量转移工具100和质量转移工具操纵器组件102可调整部件之间的空间关系以有助于利用静电转移头部阵列来转移微型器件阵列。此类调整可能需要多个自由度的精确移动。例如，质量转移工具操纵器组件102可包括用于以至少三个自由度(例如，翻转、倾斜和在z方向上移动)调整微型拾取阵列支座的致动器组件。类似地，承载衬底保持器104可由质量转移工具100的具有例如沿水平面内的正交轴的至少两个自由度的x-y板110来移动。因此，在一个实施例中，由质量转移工具操纵器组件102支撑的静电转移头部阵列和由承载衬底保持器104所保持的承载衬底支撑的微型器件阵列可以五个自由度相对于彼此精确移动。然而，质量转移工具100和质量转移工具操纵器组件102可包括在微型器件阵列和静电转移头部阵列之间或在系统的其他部件之间提供更多自由度的附加致动器。例如，质量转移工具操纵器组件102可安装在相对于x-y板110移动的x-y板上，在由质量转移工具操纵器组件102支撑的静电转移头部阵列和由承载衬底保持器104所保持的承载衬底支撑的微型器件阵列之间创建另外两个自由度。In one embodiment, components and subassemblies of mass transfer tool 100 and mass transfer tool manipulator assembly 102 are movable relative to each other. For example, mass transfer tool 100 and mass transfer tool manipulator assembly 102 can adjust the spatial relationship between components to facilitate transferring an array of microdevices using an array of electrostatic transfer heads. Such adjustments may require precise movement in multiple degrees of freedom. For example, the mass transfer tool manipulator assembly 102 may include an actuator assembly for adjusting the micro pick-up array mount in at least three degrees of freedom (eg, flip, tilt, and move in the z-direction). Similarly, the carrier substrate holder 104 is movable by an x-y plate 110 of the mass transfer tool 100 having at least two degrees of freedom, for example along orthogonal axes in a horizontal plane. Thus, in one embodiment, the array of electrostatic transfer heads supported by the mass transfer tool manipulator assembly 102 and the array of microdevices supported by the carrier substrate held by the carrier substrate holder 104 can be relative to each other in five degrees of freedom. Move with precision. However, the mass transfer tool 100 and mass transfer tool manipulator assembly 102 may include additional actuators that provide more degrees of freedom between the array of micro devices and the array of electrostatic transfer heads or between other components of the system. For example, mass transfer tool manipulator assembly 102 may be mounted on an x-y plate that moves relative to x-y plate 110, between an array of electrostatic transfer heads supported by mass transfer tool manipulator assembly 102 and held by carrier substrate holder 104. Two additional degrees of freedom are created between the array of micro-device supported by the carrier substrate.
参见图2，其示出根据本发明的实施例的保持微型拾取阵列的质量转移工具操纵器组件的透视图图示。图2呈现质量转移工具操纵器组件102的实施例的结构部件的概述。质量转移工具操纵器组件102可包括与质量转移工具100的质量转移工具支座200耦接的外壳210。外壳210可具有与翻转-倾斜-z致动器组件220可完全地或部分地包含在外壳210内，并且致动器组件220可通过分布板240与翻转-倾斜-z挠曲部230耦接。分布板240还可与微型拾取阵列支座250耦接。在一个实施例中，微型拾取阵列支座250可通过绝缘板260与分布板240耦接，例如通过使微型拾取阵列支座250直接保持在绝缘板260上。在一个实施例中，微型拾取阵列支座250可与中间部件例如保持板270接合，该中间部件通过保持环280保持紧贴绝缘板260。此外，支撑静电转移头部阵列的微型拾取阵列290可与微型拾取阵列支座250集成。Referring to FIG. 2 , an illustration of a perspective view of a mass transfer tool manipulator assembly holding a micropickup array is shown, in accordance with an embodiment of the present invention. FIG. 2 presents an overview of the structural components of an embodiment of the mass transfer tool manipulator assembly 102 . The mass transfer tool manipulator assembly 102 may include a housing 210 coupled to the mass transfer tool mount 200 of the mass transfer tool 100 . The housing 210 may have a tilt-tilt-z actuator assembly 220 that may be fully or partially contained within the housing 210 and the actuator assembly 220 may be coupled to the tilt-tilt-z flexure 230 through a distribution plate 240 . The distribution plate 240 can also be coupled with the micro pick up array mount 250 . In one embodiment, the micro pick-up array mount 250 can be coupled to the distribution plate 240 through the insulating plate 260 , for example by holding the micro pick-up array mount 250 directly on the insulating plate 260 . In one embodiment, micro pick up array mount 250 may engage an intermediate member, such as retaining plate 270 , held against insulating plate 260 by retaining ring 280 . Additionally, a micropickup array 290 supporting an array of electrostatic transfer heads may be integrated with the micropickup array mount 250 .
参见图3，其示出根据本发明的实施例的相对于图2的剖面线A-A获取的质量转移工具操纵器组件的横截面透视图图示。图3呈现质量转移工具操纵器组件102的实施例的结构组件之间的机械相互作用的更多细节。例如，致动器组件220可包括一个或多个致动器310，该一个或多个致动器具有可与外壳210和/或质量转移工具支座200固定地耦接的第一致动器附接件312。致动器310可进一步包括能够相对于第一致动器附接件312移动的第二致动器附接件314。如上所述，第二致动器附接件314可进一步与分布板240紧固在一起。因此，对致动器310进行致动可引起分布板240和外壳210之间的相对移动。Referring to FIG. 3 , an illustration of a cross-sectional perspective view of a mass transfer tool manipulator assembly taken relative to section line A-A of FIG. 2 is shown, in accordance with an embodiment of the present invention. FIG. 3 presents more details of the mechanical interactions between the structural components of an embodiment of the mass transfer tool manipulator assembly 102 . For example, actuator assembly 220 may include one or more actuators 310 having a first actuator that may be fixedly coupled to housing 210 and/or mass transfer tool mount 200 Attachment 312 . The actuator 310 may further include a second actuator attachment 314 movable relative to the first actuator attachment 312 . As noted above, the second actuator attachment 314 may further be secured with the distributor plate 240 . Accordingly, actuation of the actuator 310 may cause relative movement between the distribution plate 240 and the housing 210 .
因此，对致动器310进行致动可具有至少两个结果。第一，由于微型拾取阵列支座250可与分布板240直接地或间接地耦接，因此对致动器310进行致动可改变微型拾取阵列支座250或与微型拾取阵列支座250接合的微型拾取阵列290和外壳210之间的空间关系。第二，由于分布板240和外壳210可与翻转-倾斜-z挠曲部230的相对端耦接，因此在分布板240相对于外壳210移动时对致动器310进行致动可向翻转-倾斜-z挠曲部230施加拉伸负载、压缩负载和/或扭转负载。Thus, actuating the actuator 310 may have at least two consequences. First, since the micro pick up array mount 250 can be directly or indirectly coupled to the distribution plate 240, actuating the actuator 310 can change the position of the micro pick up array mount 250 or the micro pick up array mount 250. Spatial relationship between micro pick-up array 290 and housing 210 . Second, since the distribution plate 240 and the housing 210 can be coupled to opposite ends of the flip-tilt-z flexure 230, actuating the actuator 310 as the distribution plate 240 moves relative to the housing 210 can move towards the flip-tilt-z flexure 230. The tilt-z flexure 230 applies a tensile load, a compressive load, and/or a torsional load.
在一个实施例中，绝缘板260可用于以加热方式使微型拾取阵列支座250与质量转移工具操纵器组件102的其他部件隔离。例如，可将绝缘板260置于微型拾取阵列支座250和致动器组件220或质量转移工具操纵器组件102的其他部件之间。此外，可通过限制部件之间的接触区域来将绝缘板260和微型拾取阵列支座250或质量转移工具操纵器组件102的其他部件之间的接触最小化。例如，绝缘板260可使用利用紧固件连接至部件的绝缘柱来与分布板240耦接，而不是使用导电耦接件诸如焊缝与部件耦接。In one embodiment, insulating plate 260 may be used to thermally isolate micro pick up array mount 250 from other components of mass transfer tool manipulator assembly 102 . For example, an insulating plate 260 may be placed between the micro pick up array mount 250 and the actuator assembly 220 or other components of the mass transfer tool manipulator assembly 102 . Furthermore, contact between the insulating plate 260 and the micro pick up array mount 250 or other components of the mass transfer tool manipulator assembly 102 can be minimized by limiting the contact area between the components. For example, the insulating plate 260 may be coupled to the distribution plate 240 using insulating posts connected to the components with fasteners, rather than coupling to the components using conductive couplings such as welds.
在一个实施例中，绝缘板260可由在被加热至200℃时表现出低热导率例如低于约1.5W/m*℃的热导率的材料形成。例如，绝缘板260可由不透明熔融石英材料或具有绝缘特性的其他材料形成。在一个实施例中，绝缘板260由包含均匀分布的小于约20微米的微小气泡的高纯度不透明熔融石英材料形成，例如由总部设在Mentor,OH的Pyromatics Corp.制造的“Pyro-LD80”。因此，如下进一步详述的，绝缘板260可作为隔热层来以加热方式使质量转移工具操纵器组件102的部件诸如致动器310(例如，压电致动器)和感测模块316与用于加热支撑静电转移头部阵列的微型拾取阵列290的加热元件隔离。In one embodiment, the insulating plate 260 may be formed of a material that exhibits low thermal conductivity when heated to 200°C, for example, a thermal conductivity below about 1.5 W/m*°C. For example, insulating plate 260 may be formed from an opaque fused silica material or other material having insulating properties. In one embodiment, insulating plate 260 is formed of a high purity opaque fused silica material containing uniformly distributed microscopic gas bubbles smaller than about 20 microns, such as "Pyro-LD80" manufactured by Pyromatics Corp. headquartered in Mentor, OH. Accordingly, as described in further detail below, the insulating plate 260 can act as a thermal barrier to thermally separate components of the mass transfer tool manipulator assembly 102, such as the actuator 310 (e.g., a piezoelectric actuator) and the sensing module 316, from each other. The heating element used to heat the micropickup array 290 supporting the electrostatic transfer head array is isolated.
在一个实施例中，保持板270和微型拾取阵列支座250可由具有类似热膨胀系数的材料形成。例如，微型拾取阵列支座250可由硅形成并且保持板270可由受控膨胀镍合金例如低膨胀“合金39”形成。合金39为受控膨胀合金，在一个实施例中，该受控膨胀合金包括0.05C、0.40Mn、0.25Si、39.00Ni、BalFe的化学组成。通过比较，合金39在25℃附近表现出约2(×10-6/℃)的热膨胀系数，而硅在相同温度附近表现出约3(×10-6/℃)的线性热膨胀系数。因此，微型拾取阵列支座250和保持板270不必具有相同的热膨胀特性，但这些部件在经受温度变化时可在相同的数量级内伸展和收缩。In one embodiment, retention plate 270 and micro pick up array mount 250 may be formed of materials with similar coefficients of thermal expansion. For example, micro pick up array mount 250 may be formed from silicon and retainer plate 270 may be formed from a controlled expansion nickel alloy such as low expansion "Alloy 39". Alloy 39 is a controlled expansion alloy comprising, in one embodiment, a chemical composition of 0.05C, 0.40Mn, 0.25Si, 39.00Ni, BalFe. By comparison, Alloy 39 exhibits a thermal expansion coefficient of about 2 (×10-6/°C) around 25°C, while silicon exhibits a linear thermal expansion coefficient of about 3 (×10-6/°C) around the same temperature. Thus, micro pick up array mount 250 and retainer plate 270 do not necessarily have the same thermal expansion characteristics, but these components can expand and contract within the same order of magnitude when subjected to temperature changes.
在一个实施例中，保持环280可使用夹具、螺纹紧固件或其他已知的紧固机构紧固在绝缘板260上或直接紧固在分布板240上。此外，保持环280可包括紧压微型拾取阵列290或保持板270的一个或多个插片或唇缘以使保持板270紧贴夹持绝缘板260并且使微型拾取阵列支座250与分布板240耦接。也可使用用于保持微型拾取阵列支座250的其他方式。例如，保持板270可使用已知的粘合或热键合技术例如熔接或焊接直接键合至绝缘板260。In one embodiment, retaining ring 280 may be fastened to insulating plate 260 or directly to distribution plate 240 using clamps, threaded fasteners, or other known fastening mechanisms. Additionally, retaining ring 280 may include one or more tabs or lips that press against micro pick up array 290 or retaining plate 270 so that retaining plate 270 snugly holds insulating plate 260 and aligns micro pick up array mount 250 with the distribution plate. 240 coupling. Other means for holding the micro pick up array mount 250 may also be used. For example, retainer plate 270 may be directly bonded to insulating plate 260 using known adhesive or thermal bonding techniques such as welding or welding.
参见图4A，其示出根据本发明的实施例的具有致动器和挠曲附接件的致动器组件的侧视图图示。在一个实施例中，致动器组件220包括在第一致动器附接件312和第二致动器附接件314之间产生运动的至少一个致动器310。例如，致动器组件220可包括三个线性致动器，每个线性致动器在单个线性方向上相对于第二致动器附接件314移动第一致动器附接件312。因此，致动器组件220可在与第一致动器附接件312耦接的质量转移工具支座200和与第二致动器附接件314耦接的分布板240之间创建至少两个自由度的总和。更具体地，致动器组件220可使分布板240相对于质量转移工具支座200翻转并倾斜。可改变致动器组件220中的致动器310的数量和类型以改变质量转移工具支座200和分布板240之间的自由度和/或运动范围，例如致动器310可为旋转致动器而不是线性致动器。因此，在一个实施例中，致动器组件220可通过同时延伸三个线性致动器中的每个线性致动器来在z方向上提供第三自由度。然而，在另一个实施例中，另外的自由度可由质量转移工具操纵器组件102之外的致动器来提供，例如由质量转移工具100的可在z方向上移动质量转移工具支座200的单个线性致动器来提供。类似地，如上所述，x-y板110可在质量转移工具100和质量转移工具操纵器组件102的部件之间提供附加自由度。因此，在一个实施例中，致动分布板240可不仅仅依赖于致动器组件220的移动，还可依赖于外部致动器。Referring to FIG. 4A , an illustration of a side view of an actuator assembly with an actuator and a flexure attachment is shown, in accordance with an embodiment of the present invention. In one embodiment, the actuator assembly 220 includes at least one actuator 310 that generates motion between a first actuator attachment 312 and a second actuator attachment 314 . For example, the actuator assembly 220 may include three linear actuators that each move the first actuator attachment 312 relative to the second actuator attachment 314 in a single linear direction. Accordingly, the actuator assembly 220 can create at least two positions between the mass transfer tool mount 200 coupled to the first actuator attachment 312 and the distribution plate 240 coupled to the second actuator attachment 314. the sum of degrees of freedom. More specifically, the actuator assembly 220 can flip and tilt the distribution plate 240 relative to the mass transfer tool mount 200 . The number and type of actuators 310 in the actuator assembly 220 can be varied to vary the degrees of freedom and/or range of motion between the mass transfer tool mount 200 and the distribution plate 240, for example, the actuators 310 can be rotationally actuated actuators rather than linear actuators. Thus, in one embodiment, the actuator assembly 220 may provide a third degree of freedom in the z-direction by simultaneously extending each of the three linear actuators. However, in another embodiment, additional degrees of freedom may be provided by actuators other than mass transfer tool manipulator assembly 102, such as by mass transfer tool mount 200 of mass transfer tool 100 that can move in the z-direction. provided by a single linear actuator. Similarly, x-y plate 110 may provide additional degrees of freedom between components of mass transfer tool 100 and mass transfer tool manipulator assembly 102, as described above. Thus, in one embodiment, actuation of the distribution plate 240 may not only rely on movement of the actuator assembly 220, but may also rely on an external actuator.
在一个实施例中，致动器310可为压电致动器。尽管可使用其他线性致动器，例如液压致动器、气动致动器或机电致动器，但压电致动器在由通过致动器引线404传送的信号控制时通过相对较短的移动可表现出精定位分辨率。在一个实施例中，致动器310可为具有约30微米运动范围的压电致动器。In one embodiment, the actuator 310 may be a piezoelectric actuator. Although other linear actuators can be used, such as hydraulic, pneumatic, or electromechanical actuators, piezoelectric actuators move through relatively short Fine positioning resolution can be exhibited. In one embodiment, the actuator 310 may be a piezoelectric actuator with a range of motion of about 30 microns.
在一个实施例中，第一致动器附接件312可包括第一挠曲附接件402。第一挠曲附接件402可包括一个或多个挠曲缓解件406。挠曲缓解件406可被配置为在不同于致动器310的运动方向的方向上向第一挠曲附接件402提供挠曲性。例如，挠曲缓解件406可包括在第一挠曲附接件402中加工的通道以在正交于致动器310的长度的方向上提供挠曲性。此外，第一挠曲附接件402可提供无滞后的移动以抵消可能存在于致动器310中的任何反冲。致动器310和第一挠曲附接件402可与耦接轴408耦接，该耦接轴具有对形成于致动器310和第一挠曲附接件402中的孔进行接合的端部。可使用已知的键合和夹持方法，允许耦接轴408浮动于孔内或刚性固定于孔中。In one embodiment, first actuator attachment 312 may include first flexure attachment 402 . The first flex attachment 402 may include one or more flex reliefs 406 . The flex relief 406 may be configured to provide flex to the first flex attachment 402 in a direction different from the direction of motion of the actuator 310 . For example, flex relief 406 may include channels machined into first flex attachment 402 to provide flex in a direction normal to the length of actuator 310 . Additionally, the first flexure attachment 402 may provide hysteresis-free movement to counteract any backlash that may be present in the actuator 310 . The actuator 310 and the first flexure attachment 402 can be coupled with a coupling shaft 408 having ends that engage holes formed in the actuator 310 and the first flexure attachment 402 department. The coupling shaft 408 is allowed to float within the bore or be rigidly fixed in the bore using known keying and clamping methods.
参见图4B，其示出根据本发明的实施例的质量转移工具操纵器组件的翻转-倾斜-z挠曲部的透视图。翻转-倾斜-z挠曲部230可包括顶部挠曲部件410和底部挠曲部件412。在一个实施例中，顶部挠曲部件410和底部挠曲部件412由柔性耦接件414连接。柔性耦接件414可具有多个构型，例如柔性耦接件414可包括具有穿过翻转-倾斜-z挠曲部230的侧壁的一部分的一个或多个径向槽416的横梁耦接件或螺旋耦接件。在一个实施例中，径向槽416可被一个或多个分隔部418彼此分开。另选地，径向槽416可为穿过翻转-倾斜-z挠曲部230的单个螺旋形成的槽。Referring to FIG. 4B , a perspective view of a tip-tilt-z flexure of a mass transfer tool manipulator assembly is shown, in accordance with an embodiment of the present invention. The flip-tilt-z flexure 230 may include a top flexure 410 and a bottom flexure 412 . In one embodiment, the top flexure 410 and the bottom flexure 412 are connected by a flexible coupling 414 . The flexible coupling 414 may have a number of configurations, for example the flexible coupling 414 may include a beam coupling having one or more radial slots 416 through a portion of the sidewall of the flip-tilt-z flexure 230 pieces or screw couplings. In one embodiment, radial slots 416 may be separated from one another by one or more dividers 418 . Alternatively, the radial slot 416 may be a single helically formed slot through the flip-tilt-z flexure 230 .
柔性耦接件414可被配置为允许顶部挠曲部件410和底部挠曲部件412沿z轴420并且围绕翻转轴422和倾斜轴424相对于彼此移动。因此，当顶部挠曲部件410通过刚性外壳210与质量转移工具支座200耦接并且底部挠曲部件412通过刚性分布板240与致动器组件220耦接时，顶部挠曲部件410和底部挠曲部件412之间的运动反映了质量转移工具支座200和分布板240之间的运动。因此，翻转-倾斜-z挠曲部230允许致动器组件220相对于质量转移工具支座200调整分布板240以及与分布板240耦接的微型拾取阵列支座250和/或微型拾取阵列290。Flexible coupling 414 may be configured to allow top flexure 410 and bottom flexure 412 to move relative to each other along z-axis 420 and about flip axis 422 and tilt axis 424 . Thus, when top flexure 410 is coupled to mass transfer tool mount 200 through rigid housing 210 and bottom flexure 412 is coupled to actuator assembly 220 through rigid distribution plate 240 , top flexure 410 and bottom flexure 410 Movement between curved members 412 mirrors movement between mass transfer tool mount 200 and distribution plate 240 . Thus, flip-tilt-z flexure 230 allows actuator assembly 220 to adjust distribution plate 240 and micro pick up array mount 250 and/or micro pick up array 290 coupled to distribution plate 240 relative to mass transfer tool mount 200 .
除了允许致动与分布板240耦接的微型拾取阵列支座250和/或微型拾取阵列290之外，翻转-倾斜-z挠曲部230还可以多种方式促成此类致动。例如，可对翻转-倾斜-z挠曲部230的柔性耦接件414的刚度进行调整以允许微型拾取阵列支座250在接触承载衬底上的微型器件时变形。另外，可对翻转-倾斜-z挠曲部230的柔性耦接件414的刚度进行调整以使致动器组件220的运动流畅。此外，可对翻转-倾斜-z挠曲部230的柔性耦接件414的刚度进行调整以提供拾取力，该拾取力回缩由静电转移头部703从承载衬底夹持的微型器件。In addition to allowing actuation of micro pick up array mount 250 and/or micro pick up array 290 coupled to distribution plate 240 , flip-tilt-z flexure 230 may facilitate such actuation in a number of ways. For example, the stiffness of the flexible coupling 414 of the flip-tilt-z flexure 230 can be adjusted to allow the micro pick up array mount 250 to deform when contacting a micro device on a carrier substrate. Additionally, the stiffness of the flexible coupling 414 of the tip-tilt-z flexure 230 can be adjusted to smooth the movement of the actuator assembly 220 . In addition, the stiffness of the flexible coupling 414 of the flip-tilt-z flexure 230 can be adjusted to provide a pick-up force that retracts the microdevice held by the electrostatic transfer head 703 from the carrier substrate.
在一个实施例中，柔性耦接件414可比下文进一步详述的微型拾取阵列支座250的柔顺性元件的刚度更强。以这种方式匹配柔性耦接件414和柔顺性元件之间的刚度可允许在静电转移头部阵列接触微型器件阵列时柔顺性元件按需变形。即，接触负载可替代性地由柔顺性元件吸收，而不是接触负载由柔性耦接件414吸收。此外，柔顺性元件可在这种负载下变形并且该变形可由与柔顺性元件集成的位移传感器518来感测并且用作反馈以调整致动器组件220。In one embodiment, the flexible coupling 414 may be stiffer than the compliant element of the micro pick up array mount 250 as described in further detail below. Matching the stiffness between the flexible coupling 414 and the compliant element in this manner may allow the compliant element to deform as desired when the array of electrostatic transfer heads contacts the array of microdevices. That is, instead of the contact load being absorbed by the flexible coupling 414 , the contact load may alternatively be absorbed by the compliant element. Additionally, the compliant element may deform under such loads and this deformation may be sensed by displacement sensor 518 integrated with the compliant element and used as feedback to adjust actuator assembly 220 .
在一个实施例中，在致动器组件220移动分布板240时，柔性耦接件414可向分布板240提供无功负载。例如，在由具有三个致动器的致动器组件220使分布板240翻转的情况下，每个致动器的运动学可能略不匹配，从而导致不需要的抖动或扭转，例如分布板240的偏航。可对柔性耦接件414的刚度进行调整以抵消该运动学不匹配并抵抗不需要的移动。例如，在一个实施例中，柔性耦接件414具有如上所述的横梁耦接件，即具有位于径向槽416之间的分隔部418，柔性耦接件414的扭转刚度可高到足以防止围绕z轴420旋转，从而完全限制分布板240的围绕翻转轴422和倾斜轴424翻转并倾斜的运动。In one embodiment, the flexible coupling 414 may provide a reactive load to the distribution plate 240 as the actuator assembly 220 moves the distribution plate 240 . For example, where the distribution plate 240 is turned over by the actuator assembly 220 having three actuators, the kinematics of each actuator may be slightly mismatched, causing unwanted shaking or twisting, such as the distribution plate 240 yaw. The stiffness of the flexible coupling 414 can be adjusted to offset this kinematic mismatch and resist unwanted movement. For example, in one embodiment where the flexible coupling 414 has a beam coupling as described above, ie, with a divider 418 between the radial slots 416, the torsional stiffness of the flexible coupling 414 may be high enough to prevent Rotation about the z-axis 420 , thereby fully constraining the movement of the distributor plate 240 from flipping and tilting about the flip axis 422 and the tilt axis 424 .
在一个实施例中，柔性耦接件414在由致动器组件220施加的拉伸负载下可在长度上伸展，但施加于柔性耦接件414上的力可产生存储的势能以在使致动器组件220去激活之后产生恢复性负载。换句话讲，在移除致动器组件220的偏置负载之后，柔性耦接件414可充当拉伸弹簧以拉取分布板240，以及与分布板240耦接的微型拾取阵列支座250。在静电转移头部阵列703静电地夹持附接至承载衬底的微型器件阵列的情况下，由柔性耦接件414产生的恢复性负载可大于从承载衬底拾取微型器件阵列所需的负载，即破坏压力。例如，在一个实施例中，可预期破坏压力为约两个大气压，从而可对柔性耦接件414进行调整以在延伸时产生相当于高于两个大气压的压力的恢复性负载。因此，在使静电转移头部阵列夹持微型器件阵列之后，可使致动器组件220去激活并且可由来自柔性耦接件414的恢复性负载提供拾取压力。In one embodiment, the flexible coupling 414 can stretch in length under the tensile load applied by the actuator assembly 220, but the force applied to the flexible coupling 414 can generate stored potential energy to cause the Restorative loads are generated after the actuator assembly 220 is deactivated. In other words, after removing the biasing load of the actuator assembly 220, the flexible coupling 414 can act as a tension spring to pull the distribution plate 240, and the micro pick-up array mount 250 coupled to the distribution plate 240 . Where the array of electrostatic transfer heads 703 electrostatically clamps an array of microdevices attached to a carrier substrate, the restorative load created by the flexible coupling 414 may be greater than the load required to pick up the array of microdevices from the carrier substrate , that is, the destruction pressure. For example, in one embodiment, a burst pressure of about two atmospheres can be expected, so flexible coupling 414 can be tuned to produce a recovering load equivalent to a pressure above two atmospheres when extended. Thus, after the array of electrostatic transfer heads clamps the array of micro devices, the actuator assembly 220 can be deactivated and the pick-up pressure can be provided by the restorative load from the flexible coupling 414 .
在一个实施例中，微型拾取阵列支座250包括通过一个或多个电连接件诸如柔性电路318来向位置感测模块316和/或计算机系统108提供反馈信号的传感器。如下所述，反馈可包括来自用于控制回路的位移传感器的模拟信号以调整致动器310的致动，因此调整微型拾取阵列支座250的空间取向。位置感测模块316可位于微型拾取阵列支座250附近以通过限制模拟信号必须从位移传感器行进至位置感测模块316的距离来减少信号劣化。位置感测模块316还可位于绝缘板260的相对侧以减少从微型拾取阵列支座250到位置感测模块316和致动器310的热量转移。保持位置感测模块316和微型拾取阵列支座250之间的热绝缘可减少由对位置感测模块316的热效应引起的信号畸变。保持致动器310诸如压电致动器和微型拾取阵列支座250之间的热绝缘可避免致动器310并且因此避免质量转移工具操纵器组件102的能力的热漂移以准确调整支撑微型器件阵列的微型拾取阵列支座250的空间取向。In one embodiment, micro pick up array mount 250 includes sensors that provide feedback signals to position sensing module 316 and/or computer system 108 through one or more electrical connections, such as flex circuit 318 . As described below, the feedback may include analog signals from displacement sensors used in the control loop to adjust the actuation of the actuator 310 and thus adjust the spatial orientation of the micro pick up array mount 250 . The position sensing module 316 may be located near the micro pick up array mount 250 to reduce signal degradation by limiting the distance the analog signal must travel from the displacement sensor to the position sensing module 316 . Position sensing module 316 may also be located on the opposite side of insulating plate 260 to reduce heat transfer from micro pick up array mount 250 to position sensing module 316 and actuator 310 . Maintaining thermal insulation between position sensing module 316 and micro pick up array mount 250 may reduce signal distortion caused by thermal effects on position sensing module 316 . Maintaining thermal isolation between the actuator 310, such as a piezoelectric actuator, and the micro pick-up array mount 250 avoids thermal drift of the actuator 310, and thus the ability of the mass transfer tool manipulator assembly 102, to accurately adjust the support microdevice The spatial orientation of the micro-pickup array mount 250 of the array.
图5A-图6和图8-图12示出微型拾取阵列支座250的另选实施例，其可与分布板240耦接以在致动器组件220调整分布板240时允许对微型拾取阵列支座250的空间取向进行调整。每个实施例允许通过微型拾取阵列支座250或微型拾取阵列290的关节运动对静电转移头部的空间取向进行调整。在一个实施例中，微型拾取阵列支座250可包括在相关的美国专利申请号13/715,557和13/715,591中所示和所述的自对准结构中的任一种自对准结构，这些专利申请据此以引用方式并入。FIGS. 5A-6 and 8-12 illustrate an alternative embodiment of a micro pick-up array mount 250 that can be coupled with the distribution plate 240 to allow for adjustment of the micro pick-up array when the actuator assembly 220 adjusts the distribution plate 240. The spatial orientation of the support 250 is adjusted. Each embodiment allows adjustment of the spatial orientation of the electrostatic transfer head through articulation of the micro pick up array mount 250 or the micro pick up array 290 . In one embodiment, the micro pick-up array mount 250 may comprise any of the self-aligning structures shown and described in related U.S. Patent Application Serial Nos. 13/715,557 and 13/715,591, which The patent application is hereby incorporated by reference.
参见图5A，其示出根据本发明的实施例的具有与柔顺性元件集成的位移传感器的微型拾取阵列支座的透视图。出于参考目的，所示出的视图可被称为微型拾取阵列支座250的“前侧”或“正面”。在一个实施例中，微型拾取阵列支座250包括基部502和枢转平台504。在一个实施例中，基部502围绕枢转平台504的全部或一部分。例如，基部502可围绕枢转平台504侧向地延伸。在另选实施例中，基部502不围绕枢转平台504。基部502和枢转平台504可由一个或多个柔顺性元件互连。例如，在示出的实施例中，柔顺性元件可由横梁506来表示。横梁506可在一个或多个枢轴位置诸如内枢轴508,514和外枢轴510,516处与基部502和枢转平台504连接。在一个实施例中，内枢轴508,514和外枢轴510,516可位于彼此正交的基部502和枢转平台504的边缘上。Referring to FIG. 5A , a perspective view of a micro pick-up array mount with displacement sensors integrated with compliant elements is shown in accordance with an embodiment of the present invention. For reference purposes, the view shown may be referred to as the "front side" or "front side" of micro pick up array mount 250 . In one embodiment, micro pick up array mount 250 includes a base 502 and a pivot platform 504 . In one embodiment, base 502 surrounds all or a portion of pivot platform 504 . For example, base 502 may extend laterally about pivot platform 504 . In alternative embodiments, base 502 does not surround pivot platform 504 . Base 502 and pivot platform 504 may be interconnected by one or more compliant elements. For example, in the illustrated embodiment, the compliant elements may be represented by beams 506 . Cross beam 506 may be connected to base 502 and pivot platform 504 at one or more pivot locations, such as inner pivots 508 , 514 and outer pivots 510 , 516 . In one embodiment, the inner pivots 508, 514 and outer pivots 510, 516 may be located on edges of the base 502 and pivot platform 504 that are orthogonal to each other.
根据本发明的实施例，微型拾取阵列支座250可由一个或多个部分或部件形成。例如，在一个实施例中，基部502、枢转平台504和一个或多个柔顺性元件(例如，横梁506)可由硅晶圆形成以产生不同区域。更具体地，可使用已知工艺诸如深蚀刻、激光切割等来形成通道522。在至少一个实施例中，通道522可通过在例如基部502、横梁506和枢转平台504区域之间提供间隔来限定微型拾取阵列支座250的结构。例如，通道522可在基部502和横梁506之间以及横梁506和枢转平台504之间形成约一百微米的间隔。除硅之外的材料可基于材料在外施负载、热稳定性和最小弹簧质量下偏转的能力来用于微型拾取阵列支座250。例如，除硅之外，为形成微型拾取阵列支座250所选择的合适材料可包括但不限于碳化硅、氮化铝、不锈钢和铝。According to embodiments of the present invention, micro pick up array mount 250 may be formed from one or more parts or components. For example, in one embodiment, base 502, pivot platform 504, and one or more compliant elements (eg, beams 506) may be formed from a silicon wafer to create distinct regions. More specifically, the channel 522 may be formed using known processes such as etch back, laser cutting, and the like. In at least one embodiment, channel 522 may define the structure of micro pick up array mount 250 by providing spacing between, for example, base 502 , beam 506 , and pivot platform 504 regions. For example, channel 522 may create a separation of approximately one hundred microns between base 502 and beam 506 and between beam 506 and pivot platform 504 . Materials other than silicon may be used for the micro pick up array mount 250 based on the material's ability to deflect under applied loads, thermal stability, and minimal spring mass. For example, in addition to silicon, suitable materials selected for forming micro pick up array mount 250 may include, but are not limited to, silicon carbide, aluminum nitride, stainless steel, and aluminum.
横梁506可围绕枢转平台504从内枢轴508侧向延伸至外枢轴510。更具体地，横梁506可通过在基部502和枢转平台504之间进行适配并且至少部分地填充这些部件之间的孔隙来与这些部件相符。在一个实施例中，横梁506的侧向延伸部提供杠杆臂，在将力施加于枢转平台504或施加于安装在枢转平台504上的微型拾取阵列290时，该杠杆臂允许横梁506、内枢轴508、514和外枢轴510、516的弯曲和扭转。更具体地，在将力施加于枢转平台504上时，诸如在位于已安装的微型拾取阵列290上的静电转移头部接触位于承载衬底上的微型器件时，枢转平台504可相对于基部502偏转。该偏转可伴随产生一个或多个高应变区域而发生，如由外枢轴510附近的虚线区域细节X所表示的。类似的应变区域可根据将力施加于枢转平台504的位置来产生靠近的内枢轴508,514和外枢轴516。Cross beam 506 may extend laterally around pivot platform 504 from inner pivot 508 to outer pivot 510 . More specifically, beam 506 may conform to these components by fitting between base 502 and pivot platform 504 and at least partially filling voids between these components. In one embodiment, the lateral extension of beam 506 provides a lever arm that allows beam 506, Bending and twisting of the inner pivots 508 , 514 and outer pivots 510 , 516 . More specifically, when a force is applied to pivoting platform 504, such as when an electrostatic transfer head on mounted micropickup array 290 contacts a microdevice on a carrier substrate, pivoting platform 504 may be relative to The base 502 is deflected. This deflection may occur with the creation of one or more regions of high strain, as represented by the dashed region detail X near the outer pivot 510 . Similar regions of strain may result in closer inner pivots 508 , 514 and outer pivots 516 depending on where a force is applied to pivoting platform 504 .
在一个实施例中，可选择横梁506刚度以有助于从承载衬底拾取微型器件并将其放置到接收衬底。例如，可对横梁506刚度进行调整以确保枢转平台504上的静电转移头部在接触承载衬底上的微型器件之后或在由静电转移头部所夹持的微型器件接触接收衬底之后不受损坏。即，横梁506刚度可允许横梁变形，该变形足以允许枢转平台504通过接触范围偏转。例如，在一个实施例中，当静电转移头部以小于损坏静电转移头部所需负载的负载接触微型器件阵列时，可预期枢转平台504向上偏转至少三十微米。In one embodiment, beam 506 stiffness can be selected to facilitate picking up and placing microdevices from a carrier substrate to a receiving substrate. For example, the beam 506 stiffness can be adjusted to ensure that the electrostatic transfer head on the pivoting platform 504 does not contact the micro-device on the carrier substrate or after the micro-device held by the electrostatic transfer head contacts the receiving substrate. damaged. That is, beam 506 stiffness may allow beam deformation sufficient to allow pivoting platform 504 to deflect through the contact range. For example, in one embodiment, the pivoting platform 504 is expected to deflect upwardly by at least thirty microns when the electrostatic transfer head contacts the array of micro devices with a load less than that required to damage the electrostatic transfer head.
此外，可对横梁506刚度进行调整以在从承载衬底拾取微型器件期间避免梁506的塑性变形。例如，在静电转移头部夹持承载衬底上的微型器件时，回缩质量转移工具操纵器组件102可使基部502相对于与静电转移头部相关联的枢转平台504向上移动。本质上，微型拾取阵列支座250作为拉伸弹簧，其拉取由静电转移头部阵列夹持的微型器件阵列。在一个实施例中，横梁506刚度在不导致横梁506的塑性变形的情况下允许此类移动。例如，在需要约两个大气压的预期值来从承载衬底提升微型器件的实施例中，横梁506在塑性变形之前抵抗施加于枢转平台504的至少两个大气压。Additionally, the beam 506 stiffness can be adjusted to avoid plastic deformation of the beam 506 during pickup of the micro device from the carrier substrate. For example, retracting the mass transfer tool manipulator assembly 102 may move the base 502 upward relative to the pivoting platform 504 associated with the electrostatic transfer head while the electrostatic transfer head is clamping a micro device on a carrier substrate. Essentially, the micropickup array holder 250 acts as an extension spring that pulls the array of microdevices held by the array of electrostatic transfer heads. In one embodiment, beam 506 stiffness allows for such movement without causing plastic deformation of beam 506 . For example, in embodiments where an expected value of about two atmospheres of pressure is required to lift the micro device from the carrier substrate, beam 506 resists at least two atmospheres of pressure applied to pivoting platform 504 before plastically deforming.
在一个实施例中，在高应变区域处或附近，一个或多个位移传感器418可与横梁506集成。位移传感器418能够感测由施加于微型拾取阵列支座250的一部分诸如枢转平台504的负载所导致的横梁506位移。例如，位移传感器418可直接检测横梁506的移动，或者其可检测内部变形以推断出横梁506的移动。In one embodiment, one or more displacement sensors 418 may be integrated with beam 506 at or near regions of high strain. Displacement sensor 418 is capable of sensing displacement of beam 506 caused by a load applied to a portion of micro pick up array mount 250 , such as pivot platform 504 . For example, displacement sensor 418 may directly detect movement of beam 506 , or it may detect internal deformation to infer movement of beam 506 .
参见图5B，其示出根据本发明的实施例的取自图5A的细节X的与微型拾取阵列支座的柔顺性元件集成的位移传感器的平面图。在一个实施例中，位移传感器518可为测量横梁506的变形的应变仪。应变仪可表现出随材料变形而变化的电阻。更具体地，应变仪可被配置为在横梁506变形时变形。即，可基于与从承载衬底转移微型器件相关联的环境和操作条件来选择应变仪设计，以实现必要的准确性、稳定性、循环耐久性等。因此，应变仪可由各种材料形成并且以多种方式与横梁506集成以实现该目标。下文描述了若干个此类实施例。See Figure 5B, which shows a plan view of a displacement sensor integrated with a compliant element of a micro pick-up array mount, taken from detail X of Figure 5A, in accordance with an embodiment of the present invention. In one embodiment, displacement sensor 518 may be a strain gauge that measures deformation of beam 506 . Strain gauges exhibit electrical resistance that changes as the material deforms. More specifically, the strain gauges may be configured to deform when beam 506 deforms. That is, the strain gauge design can be selected to achieve the necessary accuracy, stability, cycle durability, etc. based on the environmental and operating conditions associated with transferring the micro-device from the carrier substrate. Accordingly, strain gauges can be formed from various materials and integrated with beam 506 in a variety of ways to achieve this goal. Several such embodiments are described below.
应变仪可独立于横梁506形成并且附接于此。在一个实施例中，应变仪包括绝缘柔性背衬，该绝缘柔性背衬支撑由多晶硅形成的箔并且使该箔与横梁506电绝缘。例如，箔可以螺线形图案来布置。可附接的应变仪的实例为由总部设在Malvern,PA的VishayPrecision Group制造的Series 015DJ通用应变仪。独立于横梁506形成的应变仪可使用多种工艺附接至横梁506。例如，应变仪背衬可通过粘合或其他键合操作直接附接至横梁506。更具体地，应变仪背衬可使用焊料、环氧树脂或焊料和高温环氧树脂的组合固定到横梁506的表面。Strain gauges may be formed separately from beam 506 and attached thereto. In one embodiment, the strain gauge includes an insulating flexible backing that supports a foil formed of polysilicon and electrically insulates the foil from the beam 506 . For example, the foils may be arranged in a spiral pattern. An example of an attachable strain gauge is the Series 015DJ Universal Strain Gauge manufactured by Vishay Precision Group based in Malvern, PA. Strain gauges formed separately from beam 506 may be attached to beam 506 using a variety of techniques. For example, the strain gauge backing may be attached directly to beam 506 by adhesive or other bonding operations. More specifically, the strain gauge backing may be secured to the surface of beam 506 using solder, epoxy, or a combination of solder and high temperature epoxy.
在另一个实施例中，应变仪可以期望图案诸如螺线形图案形成在横梁506上。在一个实施例中，应变仪可使用沉积工艺直接形成在横梁506上。例如，康铜(constantan)铜镍迹线可以螺线形图案直接溅射在横梁506上。经溅射应变仪的具有螺线形图案的绞线尺寸可为约8微米宽，其中绞线长度之间的距离为8微米，并且可沉积至约105纳米的厚度。In another embodiment, strain gauges may be formed in a desired pattern, such as a spiral pattern, on beam 506 . In one embodiment, strain gauges may be formed directly on beam 506 using a deposition process. For example, constantan copper-nickel traces can be sputtered directly on beam 506 in a spiral pattern. The strands of the sputtered strain gauge having a helical pattern can measure about 8 microns wide with a distance between strand lengths of 8 microns and can be deposited to a thickness of about 105 nm.
在另一个实施例中，可修改横梁506的材料以形成集成的应变仪。更具体地，横梁506可掺杂有压阻材料以在横梁506内形成应变仪。例如，横梁506的表面可掺杂有硅。掺杂材料可为具有随所施加的应变而变化的尺寸的螺线形图案。因此，应变仪可完全集成于并物理地混合于横梁506的其余部分。In another embodiment, the material of beam 506 may be modified to form integrated strain gauges. More specifically, beam 506 may be doped with piezoresistive material to form strain gauges within beam 506 . For example, the surface of beam 506 may be doped with silicon. The dopant material can be a spiral pattern with dimensions that vary with applied strain. Thus, the strain gauges can be fully integrated and physically blended with the rest of the beam 506 .
在一个实施例中，位移传感器518可为位于横梁506上的具有在预期应变的方向上对准的纵长绞线的图案(例如，螺线形)的应变仪。例如，横梁506可期望在高应变区域中观测到与通道522对准的压缩负载或拉伸负载，因此位移传感器518的纵长绞线可平行于通道522。然而，在其他方向上看到主应变平面的具有柔顺性元件的微型拾取阵列支座250的实施例中，可对位移传感器518进行取向以检测此类应变。In one embodiment, the displacement sensor 518 may be a strain gauge located on the beam 506 having a pattern (eg, a helix) of lengthwise strands aligned in the direction of expected strain. For example, the beam 506 may expect to observe a compressive load or a tensile load aligned with the channel 522 in a region of high strain, so the lengthwise strand of the displacement sensor 518 may be parallel to the channel 522 . However, in embodiments of the micro pick up array mount 250 with compliant elements looking at the principal strain plane in other directions, the displacement sensors 518 may be oriented to detect such strains.
在从承载衬底转移微型器件期间，横梁506和位移传感器518可经受升高的温度，因此温度补偿可为必要的。在一个实施例中，可对位移传感器进行温度自补偿。更具体地，可对应变仪材料进行选择以在转移工艺的操作条件下限制由温度引起的视应变。然而，在另选的实施例中，可使用用于温度补偿的其他方式。例如，温度补偿可使用虚拟测量技术来实现。During transfer of the micro-device from the carrier substrate, the beam 506 and the displacement sensor 518 may experience elevated temperatures, so temperature compensation may be necessary. In one embodiment, the displacement sensor can be self-compensated for temperature. More specifically, the strain gauge material can be chosen to limit the apparent strain induced by temperature under the operating conditions of the transfer process. However, in alternative embodiments, other means for temperature compensation may be used. For example, temperature compensation can be implemented using virtual measurement techniques.
仍参见图5B，在一个实施例中，虚拟测量技术利用参考应变仪520来补偿位移传感器518。更具体地，参考应变仪520可位于相同应变区域内的位移传感器518附近。尽管位移传感器518的绞线可与所施加的应变的方向对准，但参考应变仪520的绞线可正交于位移传感器518的绞线并正交于所施加的应变的方向而延伸。另选地，参考应变仪520可位于微型拾取阵列支座250的非应变区域中，该参考应变仪远离位于横梁506的高应变区域中的位移传感器518。例如，参考应变仪520可位于基部502或枢转平台504上。因此，位移传感器518可被配置为检测施加于横梁506的应变，并且参考应变仪可被配置为检测由热效应对微型拾取阵列支座250产生的应变。因此，对两种应变仪的应变的比较可用于确定并补偿与横梁506的热膨胀相关的应变。Still referring to FIG. 5B , in one embodiment, a virtual measurement technique utilizes a reference strain gauge 520 to compensate displacement sensor 518 . More specifically, reference strain gauge 520 may be located adjacent to displacement sensor 518 within the same strain region. While the strands of the displacement sensor 518 may be aligned with the direction of the applied strain, the strands of the reference strain gauge 520 may extend normal to the strands of the displacement sensor 518 and normal to the direction of the applied strain. Alternatively, reference strain gauge 520 may be located in an unstrained region of micro pick up array mount 250 remote from displacement sensor 518 located in a highly strained region of beam 506 . For example, reference strain gauge 520 may be located on base 502 or pivot platform 504 . Accordingly, displacement sensor 518 may be configured to detect strain applied to beam 506 and reference strain gauge may be configured to detect strain induced by thermal effects on micro pick up array mount 250 . Therefore, a comparison of the strains of the two strain gauges can be used to determine and compensate for the strains associated with thermal expansion of the beam 506 .
再次参见图5A，在一个实施例中，参考应变仪520和位移传感器518可有线地连接到惠斯通半桥的相邻桥臂以抵消位移传感器518和参考应变仪520之间的温度影响。每个位移传感器518和参考应变仪520可形成惠斯通半桥以感测内枢轴508,514或外枢轴510,516附近的高应变区域中的应变。然而，每个内枢轴508,514和外枢轴510,516可包括第二高应变区域，该第二高应变区域与第一高应变区域相对并且位于由通道522所限定的枢轴的第二侧向边缘附近。另一位移传感器518或一对位移传感器518和参考应变仪520可位于该第二高应变区域中以感测变形。此外，该一对位移传感器518和参考应变仪520两者可以惠斯通全桥的方式有线地连接在一起，可对它们进行监测以确定内枢轴508,514和外枢轴510,516附近的材料应变。如下所述，监测这些应变信号可用于推断施加于枢转平台504的压力。此外，控制算法可使用应变信号来确定在枢转平台504上均匀分布压力所需的翻转、倾斜和z(正交于枢转平台表面)移动。Referring again to FIG. 5A , in one embodiment, reference strain gauge 520 and displacement sensor 518 may be wired to adjacent arms of the Wheatstone half-bridge to cancel temperature effects between displacement sensor 518 and reference strain gauge 520 . Each displacement sensor 518 and reference strain gauge 520 may form a Wheatstone half bridge to sense strain in regions of high strain near the inner pivots 508 , 514 or outer pivots 510 , 516 . However, each inner pivot 508 , 514 and outer pivot 510 , 516 may include a second high strain region opposite the first high strain region and located at a second lateral edge of the pivot defined by the channel 522 nearby. Another displacement sensor 518 or a pair of displacement sensors 518 and a reference strain gauge 520 may be located in this second high strain region to sense deformation. Additionally, both the pair of displacement transducers 518 and the reference strain gauge 520 can be wired together in a Wheatstone full bridge and can be monitored to determine material strain near the inner pivots 508,514 and outer pivots 510,516. As described below, monitoring these strain signals can be used to infer the pressure applied to the pivoting platform 504 . Additionally, the control algorithm may use the strain signal to determine the roll, tilt, and z (normal to the pivoting platform surface) movement required to evenly distribute pressure on the pivoting platform 504 .
其他类型的传感器可用于感测微型拾取阵列支座250的柔顺性元件的变形或位移。例如，包括电容式应变仪和利用光纤感测的应变仪的不同的应变仪类型可用于感测横梁506变形。另选地，可直接测量微型拾取阵列支座250的柔顺性元件或其他部件诸如枢转平台504的位移。在一个实施例中，激光干涉仪可用于感测柔顺性元件或枢转平台504的位移。在另一个实施例中，电容式位移传感器可用于感测柔顺性元件或枢转平台504的位移。因此，可选择多种方式来测量和提供与枢转平台504或柔顺性元件的位移相关的反馈。在一个实施例中，选择可由权衡诸如成本、所要求的精度和环境考虑来引导。例如，补偿对位移传感器518的热效应的能力可为一个选择标准。Other types of sensors may be used to sense deformation or displacement of the compliant elements of the micro pick up array mount 250 . For example, different strain gauge types including capacitive strain gauges and strain gauges utilizing fiber optic sensing may be used to sense beam 506 deformation. Alternatively, displacement of compliant elements or other components of micro pick up array mount 250 such as pivot platform 504 may be measured directly. In one embodiment, a laser interferometer may be used to sense the displacement of the compliant element or pivoting platform 504 . In another embodiment, a capacitive displacement sensor may be used to sense the displacement of the compliant element or pivoting platform 504 . Thus, there are a number of options for measuring and providing feedback related to the displacement of the pivoting platform 504 or compliant element. In one embodiment, the choice may be guided by trade-offs such as cost, required accuracy, and environmental considerations. For example, the ability to compensate for thermal effects on the displacement sensor 518 may be a selection criterion.
在一个实施例中，微型拾取阵列支座250包括位于枢转平台504上的一个或多个枢转平台操作电压触件530。在与微型拾取阵列支座250可操作地连接时，枢转平台操作电压触件530可用于将操作电压转移到微型拾取阵列290上的静电转移头部阵列。在一个实施例中，枢转平台操作电压触件530可使用合适技术形成，该合适技术诸如但不限于将导电材料(例如，金属)溅射或电子束蒸发到枢转平台504的表面上。In one embodiment, micro pick up array mount 250 includes one or more pivoting platform operating voltage contacts 530 on pivoting platform 504 . When operably connected to micro pick up array mount 250 , pivoting platform operating voltage contacts 530 may be used to transfer operating voltage to the electrostatic transfer head array on micro pick up array 290 . In one embodiment, the pivoting platform operating voltage contacts 530 may be formed using a suitable technique such as, but not limited to, sputtering or electron beam evaporation of a conductive material (eg, metal) onto the surface of the pivoting platform 504 .
在一个实施例中，微型拾取阵列支座250可包括用于安装微型拾取阵列290的一个或多个键合位。在一个实施例中，键合位包括位于枢转平台504上的一个或多个钳位电极540。更具体地，钳位电极540可位于与枢转平台操作电压触件530相同的枢转平台504的表面上。钳位电极540可被构造成使用静电原理固定或夹紧微型拾取阵列290。例如，钳位电极540可包括由介电层覆盖的一个或多个导电垫。根据静电夹的原理，当导电垫维持在某电压处并相邻于微型拾取阵列290上的金属或半导体膜钳位区域放置时，静电力将微型拾取阵列290夹紧到微型拾取阵列支座250。这里，术语相邻可指代导电垫仅通过薄介电层与钳位区域分开。In one embodiment, micro pick up array mount 250 may include one or more bonding sites for mounting micro pick up array 290 . In one embodiment, the bonding site includes one or more clamping electrodes 540 located on the pivoting platform 504 . More specifically, the clamping electrode 540 may be located on the same surface of the pivoting platform 504 as the pivoting platform operating voltage contact 530 . The clamping electrodes 540 may be configured to fix or clamp the micro pickup array 290 using electrostatic principles. For example, clamping electrode 540 may include one or more conductive pads covered by a dielectric layer. According to the principle of electrostatic clamping, when the conductive pad is maintained at a certain voltage and placed adjacent to the metal or semiconductor film clamping area on the micro pick-up array 290, the electrostatic force clamps the micro pick-up array 290 to the micro pick-up array support 250 . Here, the term adjacent may mean that the conductive pad is only separated from the clamping region by a thin dielectric layer.
可使位于微型拾取阵列支座250的正面上的部件通过各种引线与质量转移工具100和质量转移工具操纵器组件102的其他部件电连接。例如，前柔性电路550可从质量转移工具100和质量转移工具操纵器组件102的外部部件延伸以与位于基部502的面或边缘上的前柔性电路连接件552电连接。前柔性电路550可为例如多导体带缆并且前柔性电路连接器552可为对接连接器。此外，前柔性电路连接器552可包括终端触件，各种迹线从该终端触件起始并延伸至位于微型拾取阵列支座250的正面上的部件。Components located on the front side of the micro pick up array mount 250 may be electrically connected to other components of the mass transfer tool 100 and mass transfer tool manipulator assembly 102 through various leads. For example, front flex circuit 550 may extend from exterior components of mass transfer tool 100 and mass transfer tool manipulator assembly 102 to electrically connect with front flex circuit connection 552 located on a face or edge of base 502 . Front flex circuit 550 may be, for example, a multi-conductor ribbon cable and front flex circuit connector 552 may be a butt connector. Additionally, front flex circuit connector 552 may include terminal contacts from which various traces originate and extend to components located on the front side of micro pick up array mount 250 .
例如，位移传感器518可通过一条或多条位移传感器迹线554与前柔性电路连接器552电连接。更具体地，位移传感器518可与两条迹线电连接，即与对接连接器的单独终端触件连接的输入迹线和输出迹线(图5B)。在图5A中以图形方式将一条或多条迹线示出为单条线，并且为了简洁说明，省略或以虚线示出迹线以指示已示意性地描绘出实际引线的数量。For example, displacement sensor 518 may be electrically connected to front flex circuit connector 552 via one or more displacement sensor traces 554 . More specifically, the displacement sensor 518 may be electrically connected to two traces, an input trace and an output trace connected to separate terminal contacts of the mating connector (FIG. 5B). One or more traces are shown graphically in FIG. 5A as a single line, and for simplicity of illustration, the traces are omitted or shown in dashed lines to indicate that the number of actual leads has been schematically depicted.
类似地，参考应变仪520可通过一条或多条参考应变仪迹线556与前柔性电路连接器552电连接。枢转平台操作电压触件530可通过一条或多条操作电压迹线558与前柔性电路连接器552电连接。钳位电极540可通过一条或多条钳位电极迹线560与前柔性电路连接器552电连接。在一个实施例中，可使用合适技术诸如溅射或电子束蒸发将迹线直接形成在微型拾取阵列支座250上。在另选的实施例中，迹线可为独立于微型拾取阵列支座250的表面或键合到微型拾取阵列支座250的表面的电线。Similarly, reference strain gauge 520 may be electrically connected to front flex circuit connector 552 via one or more reference strain gauge traces 556 . Pivot platform operating voltage contacts 530 may be electrically connected to front flex circuit connector 552 via one or more operating voltage traces 558 . Clamp electrode 540 may be electrically connected to front flex circuit connector 552 by one or more clamp electrode traces 560 . In one embodiment, the traces may be formed directly on the micro pick up array mount 250 using a suitable technique such as sputtering or e-beam evaporation. In alternative embodiments, the traces may be wires that are separate from or bonded to the surface of the micro pick up array mount 250 .
参见图6，其示出根据本发明的实施例的具有位于枢转平台上的加热元件的微型拾取阵列支座的透视图。出于参考目的，所示出的视图可被称为微型拾取阵列支座250的“后侧”或“背面”。微型拾取阵列支座250可包括位于微型拾取阵列支座250的枢转平台504的后侧上的一个或多个加热元件602。在一个实施例中，加热元件602可由电阻合金形成，诸如溅射在微型拾取阵列支座250上的镍铬合金。因此，加热元件602在电流穿过该加热元件时可经受焦耳加热。因此，热量可从加热元件602转移至微型拾取阵列支座250和/或与其接合的微型拾取阵列290。在另选的实施例中，加热元件602可为基于以取决于施加于电阻器的电流的速度散热的表面安装技术的表面安装的电阻器。在一个实施例中，微型拾取阵列支座可由外部加热部件诸如朝向枢转平台504的红外加热源来加热。Referring to Figure 6, a perspective view of a micro pick up array mount with heating elements on a pivoting platform is shown, in accordance with an embodiment of the present invention. For reference purposes, the view shown may be referred to as the "rear side" or "back side" of micro pick up array mount 250 . The micro pick up array mount 250 may include one or more heating elements 602 located on the rear side of the pivoting platform 504 of the micro pick up array mount 250 . In one embodiment, heating element 602 may be formed from a resistive alloy, such as nichrome sputtered on micro pick up array mount 250 . Accordingly, the heating element 602 may experience Joule heating when current is passed through the heating element. Accordingly, heat may be transferred from the heating element 602 to the micro pick up array mount 250 and/or the micro pick up array 290 bonded thereto. In an alternative embodiment, the heating element 602 may be a surface mount resistor based on surface mount technology that dissipates heat at a rate dependent on the current applied to the resistor. In one embodiment, the micro pick up array mount may be heated by an external heating element such as an infrared heating source directed towards the pivoting platform 504 .
在一个实施例中，微型拾取阵列支座250包括一个或多个温度传感器610以感测微型拾取阵列支座250或附近结构例如微型拾取阵列290的温度。例如，温度传感器610可位于枢转平台504的后侧以测量枢转平台504的温度。例如，温度传感器610可位于枢转平台504的中心、枢转平台504的拐角，或者位于基部502或横梁506上。温度传感器610可为热敏电阻器、热电偶或其他类型的温度传感器。此外，温度传感器610可封装或以其他方式附接到或机械地固定到枢转平台504。In one embodiment, micro pick up array mount 250 includes one or more temperature sensors 610 to sense the temperature of micro pick up array mount 250 or nearby structures such as micro pick up array 290 . For example, temperature sensor 610 may be located on the rear side of pivoting platform 504 to measure the temperature of pivoting platform 504 . For example, temperature sensor 610 may be located in the center of pivoting platform 504 , in the corners of pivoting platform 504 , or on base 502 or beam 506 . Temperature sensor 610 may be a thermistor, thermocouple, or other type of temperature sensor. Additionally, temperature sensor 610 may be packaged or otherwise attached to or mechanically secured to pivot platform 504 .
根据本发明的实施例，加热元件602和/或温度传感器610可位于微型拾取阵列支座250的前侧或后侧。位置选择可由考虑诸如可用空间以及加热元件602和温度传感器610是否将妨碍其他功能来驱动。例如，部件可被放置以避免破坏微型拾取阵列支座250的钳位电极540或微型拾取阵列290的静电转移头部中的电荷。此外，部件可被放置以避免干扰微型拾取阵列290键合到微型拾取阵列支座250。温度传感器610可被放置以紧密接近微型拾取阵列290的峰值温度。必要时可采用温度偏置来实现该接近程度。According to an embodiment of the present invention, the heating element 602 and/or the temperature sensor 610 may be located on the front side or the back side of the micro pick up array mount 250 . Location selection may be driven by considerations such as available space and whether the heating element 602 and temperature sensor 610 will interfere with other functions. For example, components may be placed so as not to disrupt the charge in the clamping electrodes 540 of the micro pick up array mount 250 or the electrostatic transfer heads of the micro pick up array 290 . Additionally, components may be placed so as not to interfere with the bonding of micro pick up array 290 to micro pick up array mount 250 . The temperature sensor 610 may be placed in close proximity to the peak temperature of the micro pick-up array 290 . A temperature bias can be used if necessary to achieve this closeness.
将微型拾取阵列支座250的背面上的部件通过各种引线放置为与质量转移工具100和质量转移工具操纵器组件102的其他部件电连接。例如，后柔性电路620可从质量转移工具100和质量转移工具操纵器组件102的外部部件延伸以与安装在基部502的面或边缘上的后柔性电路连接器630电连接。后柔性电路620可为例如多导体带缆并且后柔性电路连接器630可为对接连接器。此外，后柔性电路连接器630可包括终端触件，各种迹线从该终端触件起始并延伸至位于微型拾取阵列支座250的背面上的部件。这样，加热元件602可通过一条或多条加热迹线640与后柔性电路连接器630电连接。温度传感器610可通过一条或多条温度传感器迹线642与后柔性电路连接器630电连接。在一个实施例中，可使用合适技术的诸如溅射或电子束蒸发将迹线直接形成在微型拾取阵列支座250上。在另选的实施例中，迹线可为独立于微型拾取阵列支座250的表面或键合到微型拾取阵列支座250的表面的电线。Components on the back of the micro pick up array mount 250 are placed in electrical connection with other components of the mass transfer tool 100 and mass transfer tool manipulator assembly 102 through various leads. For example, rear flex circuit 620 may extend from external components of mass transfer tool 100 and mass transfer tool manipulator assembly 102 to electrically connect with rear flex circuit connector 630 mounted on the face or edge of base 502 . Rear flex circuit 620 may be, for example, a multi-conductor ribbon cable and rear flex circuit connector 630 may be a butt connector. Additionally, rear flex circuit connector 630 may include terminal contacts from which various traces originate and extend to components located on the back of micro pick up array mount 250 . As such, heating element 602 may be electrically connected to rear flex circuit connector 630 via one or more heating traces 640 . Temperature sensor 610 may be electrically connected to rear flex circuit connector 630 via one or more temperature sensor traces 642 . In one embodiment, the traces may be formed directly on the micro pick up array mount 250 using a suitable technique such as sputtering or electron beam evaporation. In alternative embodiments, the traces may be wires that are separate from or bonded to the surface of the micro pick up array mount 250 .
参见图7，其示出根据本发明的实施例的具有支撑静电转移头部阵列的衬底的微型拾取阵列。微型拾取阵列290可包括由硅、陶瓷和聚合物中的一者或多者形成的支撑静电转移头部703阵列的基部衬底702。每个静电转移头部703可包括具有顶表面708的台面结构704，该顶表面可支撑电极712。然而，电极712为示例性的，并且在另一个实施例中，台面结构704可为完全或部分导电的，使得电极712可为不必要的。介电层716覆盖每个台面结构704的顶表面708和电极712(在存在的情况下)。每个静电转移头部703的顶部接触表面718具有最大尺寸，例如1μm到100μm的长度或宽度，其可对应于待拾取微型器件的尺寸。Referring to FIG. 7, a micropickup array with a substrate supporting an array of electrostatic transfer heads is shown, according to an embodiment of the present invention. Micropickup array 290 may include a base substrate 702 formed of one or more of silicon, ceramic, and polymer that supports an array of electrostatic transfer heads 703 . Each electrostatic transfer head 703 can include a mesa structure 704 having a top surface 708 that can support an electrode 712 . However, electrode 712 is exemplary, and in another embodiment, mesa structure 704 may be fully or partially conductive such that electrode 712 may be unnecessary. A dielectric layer 716 covers the top surface 708 and electrodes 712 (where present) of each mesa structure 704 . The top contact surface 718 of each electrostatic transfer head 703 has a maximum dimension, eg, a length or width of 1 μm to 100 μm, which may correspond to the size of a micro device to be picked up.
台面结构704突出远离底部基板702以便在拾取操作期间提供顶部接触表面718的局部接触点来拾取特定微型器件。在一个实施例中，台面结构704具有约1μm到5μm或更具体地约2μm的高度。在一个实施例中，台面结构704可具有顶表面708，该顶表面具有介于1平方微米到10,000平方微米的表面积。台面结构704可以例如正方形、矩形、圆形、椭圆形等多种几何形状形成，同时保持该通用表面积范围。对台面结构阵列在基部衬底702上的高度、宽度和平面性进行选择，使得每个静电转移头部703可在拾取操作期间与对应微型器件接触，并且使得静电转移头部703不会在拾取操作期间无意地与相邻于预期的对应微型器件的微型器件接触。The mesa structure 704 protrudes away from the bottom substrate 702 to provide a local point of contact for the top contact surface 718 to pick up a particular micro device during a pick-up operation. In one embodiment, the mesa structure 704 has a height of about 1 μm to 5 μm, or more specifically about 2 μm. In one embodiment, the mesa structure 704 may have a top surface 708 having a surface area between 1 square micron and 10,000 square microns. The mesa structure 704 can be formed in a variety of geometric shapes, such as square, rectangular, circular, oval, etc., while maintaining this general surface area range. The height, width, and planarity of the array of mesa structures on the base substrate 702 are selected such that each electrostatic transfer head 703 can make contact with the corresponding micro-device during a pick-up operation, and such that the electrostatic transfer head 703 does not Inadvertent contact with a micro-device adjacent to the intended corresponding micro-device during operation.
仍参见图7，电极引线714可使电极712或台面结构704与操作电压通路720的端子以及与操作电压触件722的衬底电连接。因此，操作电压可通过操作电压通路720从微型拾取阵列290的衬底操作电压触件722转移到静电转移头部703阵列。操作电压通路720可以多种方式形成。例如，操作电压通路720可通过以下步骤来形成：穿过基部基部衬底702钻出或蚀刻孔，利用绝缘体对孔进行钝化，并且使用合适的技术诸如溅射、电子束蒸发、电镀或无电沉积将导电材料(例如，金属)形成为钝化孔以形成操作电压通路720。Still referring to FIG. 7 , electrode leads 714 may electrically connect electrode 712 or mesa structure 704 to terminals of operating voltage path 720 and to the substrate of operating voltage contact 722 . Accordingly, the operating voltage can be transferred from the substrate operating voltage contact 722 of the micro pick up array 290 to the array of electrostatic transfer heads 703 through the operating voltage path 720 . The operating voltage path 720 can be formed in a variety of ways. For example, the operating voltage pathway 720 may be formed by drilling or etching a hole through the base substrate 702, passivating the hole with an insulator, and using a suitable technique such as sputtering, electron beam evaporation, electroplating, or electroless plating. Electrodeposition forms a conductive material (eg, metal) into a passivation hole to form the operating voltage path 720 .
微型拾取阵列290可包括形成在微型拾取阵列290的后侧上的一个或多个衬底钳位触件724。在一个实施例中，衬底钳位触件724包括导电垫，诸如金属或半导体膜。导电垫可与微型拾取阵列290的其他有源区域电隔离。例如，可在导电垫下方、上方和周围形成绝缘层。在另一个实施例中，衬底钳位触件724可与微型拾取阵列290一体化形成，例如通过由块状硅形成微型拾取阵列290和衬底钳位触件724，并且使衬底钳位触件724与微型拾取阵列290的其他有源区域电隔离。Micro pick up array 290 may include one or more substrate clamp contacts 724 formed on the backside of micro pick up array 290 . In one embodiment, the substrate clamp contacts 724 include conductive pads, such as metal or semiconductor films. The conductive pads may be electrically isolated from other active areas of the micro pick-up array 290 . For example, an insulating layer may be formed under, over, and around the conductive pads. In another embodiment, substrate clamping contacts 724 may be integrally formed with micropickup array 290, such as by forming micropickup array 290 and substrate clamping contacts 724 from bulk silicon, and clamping the substrate Contacts 724 are electrically isolated from other active areas of micro pick-up array 290 .
参见图8，其示出根据本发明的实施例的与微型拾取阵列接合的微型拾取阵列支座的横截面侧视图图示。微型拾取阵列290和微型拾取阵列支座250可物理地并且可操作地接合。如上所述，根据静电夹原理并且使用异性电荷相吸，微型拾取阵列290的衬底钳位触件724可与微型拾取阵列支座250上的钳位电极540对准并且由其静电保持。更具体地，在通过钳位电极迹线560将静电电压施加于钳位电极540时，静电夹持压力将施加于衬底钳位电极540，使得微型拾取阵列290与微型拾取阵列支座250物理地接合。此外，微型拾取阵列290的一个或多个衬底操作电压触件722可与枢转平台操作电压触件530对准并相邻于其放置。因此，通过操作电压迹线558施加于枢转平台操作电压触件530的电压可通过衬底操作电压触件722和操作电压通路720转移至一个或多个静电转移头部703。因此，微型拾取阵列支座250和微型拾取阵列290可电连接以使微型拾取阵列290能够对微型器件阵列产生静电夹持力。Referring to Figure 8, a cross-sectional side view illustration of a micro pick up array mount engaged with a micro pick up array is shown, in accordance with an embodiment of the present invention. Micro pick up array 290 and micro pick up array mount 250 are physically and operatively engageable. Substrate clamp contacts 724 of micro pick up array 290 may be aligned with and electrostatically held by clamp electrodes 540 on micro pick up array mount 250 according to the electrostatic clamp principle and using opposite charge attraction, as described above. More specifically, when an electrostatic voltage is applied to the clamp electrode 540 through the clamp electrode trace 560, an electrostatic clamping pressure will be applied to the substrate clamp electrode 540 such that the micro pick-up array 290 is physically attached to the micro pick-up array mount 250. ground joint. Additionally, one or more substrate handling voltage contacts 722 of micro pick up array 290 may be aligned with and positioned adjacent to pivoting platform handling voltage contacts 530 . Accordingly, voltage applied to pivoting platform operating voltage contacts 530 via operating voltage traces 558 may be diverted to one or more electrostatic transfer heads 703 through substrate operating voltage contacts 722 and operating voltage paths 720 . Accordingly, the micro pick-up array mount 250 and the micro pick-up array 290 may be electrically connected to enable the micro pick-up array 290 to generate an electrostatic clamping force on the micro-device array.
当这些部件物理地接合时，热量可从微型拾取阵列支座250传送至微型拾取阵列290和/或由微型拾取阵列290夹持的微型器件阵列。更具体地，微型拾取阵列支座250上的加热元件602可通过经由加热迹线640传送电流来被电阻式加热。因此，热量可从加热元件602通过枢转平台504转移至微型拾取阵列290。此外，递送至微型拾取阵列290的热量可通过静电转移头703阵列耗散到由静电转移头703阵列夹持的微型器件阵列中。When these components are physically joined, heat may be transferred from micro pick up array mount 250 to micro pick up array 290 and/or the array of micro devices held by micro pick up array 290 . More specifically, heating element 602 on micro pick up array mount 250 may be resistively heated by passing electrical current through heating trace 640 . Thus, heat may be transferred from heating element 602 to micro pick up array 290 through pivoting platform 504 . Additionally, heat delivered to the micro pick-up array 290 can be dissipated through the array of electrostatic transfer heads 703 into the array of micro devices held by the array of electrostatic transfer heads 703 .
至此上文参见图5A-图8描述的实施例已描绘了能够与微型拾取阵列290可逆地配对的微型拾取阵列支座250的构型。然而，此类构型旨在例示性的而非详尽的。例如，微型拾取阵列支座250的另选实施例可包括与质量转移工具100或质量转移工具操纵器组件102的部件的电连接的不同模式。此外，静电转移头部703和/或微型拾取阵列290可另选地以不同方式与微型拾取阵列支座250接合。另外，可在本发明的范围之内改变微型拾取阵列支座250中柔顺性元件的设计。以下图9-图12示出根据此类变型形式的若干另选的实施例。The embodiments described so far above with reference to FIGS. 5A-8 have depicted configurations of micro pick up array mounts 250 capable of reversibly mating with micro pick up arrays 290 . However, such configurations are intended to be illustrative and not exhaustive. For example, alternative embodiments of the micro pick up array mount 250 may include different modes of electrical connection to components of the mass transfer tool 100 or mass transfer tool manipulator assembly 102 . Furthermore, electrostatic transfer head 703 and/or micro pick up array 290 may alternatively be engaged with micro pick up array mount 250 in a different manner. Additionally, the design of the compliant elements in micro pick up array mount 250 may be varied within the scope of the present invention. Figures 9-12 below illustrate several alternative embodiments according to such variants.
参见图9，其示出根据本发明的实施例的具有与柔顺性元件集成的位移传感器和位于枢转平台上的静电转移头部阵列的微型拾取阵列支座的透视图。图9中所示的微型拾取阵列支座250的实施例的大部分部件与图5A中所示的部件相同或类似。然而，至少两个本质区别如下所述。第一，位于微型拾取阵列支座250的正面上的部件之间的电连接不同地实现。第二，静电转移头部703阵列与微型拾取阵列支座250直接集成在一起，而不是利用单独的微型拾取阵列290。Referring to FIG. 9 , a perspective view of a micropickup array mount with a displacement sensor integrated with a compliant element and an array of electrostatic transfer heads on a pivoting platform is shown, in accordance with an embodiment of the present invention. Most of the components of the embodiment of the micro pick up array mount 250 shown in Figure 9 are the same or similar to those shown in Figure 5A. However, at least two essential differences are described below. First, the electrical connections between components located on the front side of micro pick up array mount 250 are implemented differently. Second, the array of electrostatic transfer heads 703 is directly integrated with the micropickup array mount 250 instead of using a separate micropickup array 290 .
在一个实施例中，部件迹线可终止于基部502上的电压着陆垫以形成电连接。例如，位移传感器迹线554可将位移传感器518与位移传感器着陆垫902互连。类似地，参考应变仪迹线556可将参考应变仪520与参考应变仪着陆垫904互连。此外，操作电压迹线558可将形成在枢转平台504上的静电转移头部703与基部操作电压着陆垫906互连。着陆垫可位于从微型拾取阵列支座250的前侧穿过基部502到后侧的通路结构上。着陆垫可使用类似于用于形成迹线的工艺例如使用溅射工艺而形成。In one embodiment, component traces may terminate at voltage landing pads on base 502 to form electrical connections. For example, displacement sensor trace 554 may interconnect displacement sensor 518 with displacement sensor landing pad 902 . Similarly, reference strain gauge trace 556 may interconnect reference strain gauge 520 with reference strain gauge landing pad 904 . Additionally, operating voltage traces 558 may interconnect the electrostatic transfer head 703 formed on the pivoting platform 504 with the base operating voltage landing pad 906 . The landing pad may be located on the access structure from the front side of the micro pick up array mount 250 through the base 502 to the back side. The landing pads may be formed using a process similar to that used to form the traces, for example using a sputtering process.
在一个实施例中，静电转移头部阵列直接由枢转平台504来支撑。静电转移头703阵列的结构和形成可与上文参见图7所描述的结构和形成相同或类似。例如，每个静电转移头703可包括具有顶表面708的台面结构704，该顶表面由介电层716覆盖并且可选地支撑电极712。然而，静电转移头部阵列位于枢转平台504的表面上，而不是微型拾取阵列290表面上。此外，操作电压迹线458可代替电极引线714。In one embodiment, the array of electrostatic transfer heads is supported directly by the pivoting platform 504 . The structure and formation of the array of electrostatic transfer heads 703 may be the same or similar to that described above with reference to FIG. 7 . For example, each electrostatic transfer head 703 may include a mesa structure 704 having a top surface 708 covered by a dielectric layer 716 and optionally supporting an electrode 712 . However, the array of electrostatic transfer heads is located on the surface of the pivoting platform 504 rather than the surface of the micropickup array 290 . Additionally, operating voltage traces 458 may be substituted for electrode leads 714 .
参见图10，其示出根据本发明的实施例的具有位于枢转平台上的加热元件的微型拾取阵列支座的透视图。在一个实施例中，一个或多个触件可位于基部502上并且与微型拾取阵列支座250的部件电连接。可使基部502触件中的一些与位于微型拾取阵列支座250的前侧上的部件电连接。例如，位移传感器触件1002可位于与位移传感器着陆垫902电连接的位移传感器通路(图11)的端子处。类似地，参考应变仪触件1004可位于与参考应变仪着陆垫904电连接的通路(未示出)的端子处。此外，基部操作电压触件1006可位于与基部操作电压着陆垫906电连接的基部操作电压通路(图11)的端子处。可使基部502触件中的其他触件与位于微型拾取阵列支座250的后侧上的部件电连接。例如，可使加热触件1008通过加热迹线640与加热元件602电连接。类似地，可使温度传感器触件1010通过温度传感器迹线642与温度传感器610电连接。Referring to Figure 10, a perspective view of a micro pick up array mount with heating elements on a pivoting platform is shown, in accordance with an embodiment of the present invention. In one embodiment, one or more contacts may be located on base 502 and electrically connected to components of micro pick up array mount 250 . Some of the base 502 contacts may be electrically connected to components located on the front side of the micro pick up array mount 250 . For example, displacement sensor contacts 1002 may be located at terminals of displacement sensor pathways ( FIG. 11 ) that are electrically connected to displacement sensor landing pad 902 . Similarly, reference strain gauge contacts 1004 may be located at terminals of a via (not shown) that is electrically connected to reference strain gauge landing pad 904 . Additionally, base operating voltage contacts 1006 may be located at terminals of base operating voltage pathways ( FIG. 11 ) that are electrically connected to base operating voltage landing pads 906 . Others of the base 502 contacts may be electrically connected to components located on the rear side of the micro pick up array mount 250 . For example, heating contact 1008 may be electrically connected to heating element 602 through heating trace 640 . Similarly, temperature sensor contact 1010 may be electrically connected to temperature sensor 610 via temperature sensor trace 642 .
参见图11，其示出根据本发明的实施例的相对于图9的剖面线获取的与弹簧触件电连接的微型拾取阵列支座的横截面侧视图图示。一个或多个触件，例如位移传感器触件1002或基部操作电压触件1006，可压紧弹簧触件1106。弹簧触件1106还可通过电连接件诸如电引线和/或触板(未示出)来与质量转移工具100或质量转移工具操纵器组件102的部件连接。因此，可用多种方式来电连接位于微型拾取阵列支座250上的部件和位于质量转移工具100或质量转移工具操纵器组件102上的部件。Referring to FIG. 11 , an illustration of a cross-sectional side view of a micro pick-up array mount electrically connected to spring contacts taken relative to the section line of FIG. 9 is shown in accordance with an embodiment of the present invention. One or more contacts, such as displacement sensor contacts 1002 or base operating voltage contacts 1006 , may compress spring contacts 1106 . The spring contacts 1106 may also be connected to components of the mass transfer tool 100 or mass transfer tool manipulator assembly 102 by electrical connections such as electrical leads and/or contact pads (not shown). Accordingly, components on the micro pick up array mount 250 and components on the mass transfer tool 100 or mass transfer tool manipulator assembly 102 may be electrically connected in a variety of ways.
参见图12，其示出根据本发明的实施例的具有柔性区域的微型拾取阵列支座的透视图图示。图12中所示的微型拾取阵列支座250的实施例的大部分部件与图5A中所示的部件相同或类似。然而，至少两个区别如下所述。第一，在一个实施例中，图12中示出的微型拾取阵列支座250可永久性地与微型拾取阵列290接合。第二，在一个实施例中，图12中示出的微型拾取阵列支座250包括不具有横梁506的柔顺性元件。Referring to FIG. 12 , an illustration of a perspective view of a micro pick-up array mount with a flexible region is shown, in accordance with an embodiment of the present invention. Most of the components of the embodiment of the micro pick up array mount 250 shown in Figure 12 are the same or similar to those shown in Figure 5A. However, at least two differences are described below. First, in one embodiment, the micro pick up array mount 250 shown in FIG. 12 can be permanently bonded to the micro pick up array 290 . Second, in one embodiment, the micro pick up array mount 250 shown in FIG. 12 includes a compliant member without beams 506 .
在一个实施例中，微型拾取阵列支座250和微型拾取阵列290可使用一个或多个焊盘1202来代替钳位电极540进行接合。焊盘1202可由包括聚合物、焊料、金属和其他粘合剂的多种材料形成以有助于形成与另一结构的永久性键合。在一个实施例中，焊盘1202可包括金、铜或铝以有助于与相邻结构的热压键合。然而，热压键合表示用于形成结构间的永久键合的仅一种方式，并且焊盘1202可包括其他材料，该材料有助于形成微型拾取阵列支座250和具有其他键合机制的另一部件或结构之间的键合。例如，可在具有各种形状和尺寸的多个键合位处使用直接键合、粘合键合、反应性键合、焊接等。In one embodiment, micro pick-up array mount 250 and micro pick-up array 290 may be bonded using one or more bonding pads 1202 instead of clamping electrodes 540 . Pad 1202 may be formed from a variety of materials including polymers, solder, metals, and other adhesives to help form a permanent bond to another structure. In one embodiment, pads 1202 may include gold, copper, or aluminum to facilitate thermocompression bonding to adjacent structures. However, thermocompression bonding represents only one way to form a permanent bond between structures, and pad 1202 may include other materials that facilitate micro pick up array mount 250 and other bonding mechanisms. A bond between another part or structure. For example, direct bonding, adhesive bonding, reactive bonding, soldering, etc. may be used at multiple bonding sites of various shapes and sizes.
为了促成微型拾取阵列290和微型拾取阵列支座250之间的永久性键合，位于微型拾取阵列290上的衬底钳位触件724可由有助于与焊盘1202热压键合的金属材料形成，例如，焊盘1202和衬底钳位触件724两者均可由金形成。在对微型拾取阵列支座250和微型拾取阵列290进行永久性地键合之前，枢转平台操作电压触件530和衬底操作电压触件722可对准以允许这些部件可操作地相接合。在对准部件之后，可形成永久性热压键合以永久性地将微型拾取阵列支座250与微型拾取阵列290接合。To facilitate a permanent bond between micropickup array 290 and micropickup array mount 250, substrate clamp contacts 724 on micropickup array 290 may be made of a metallic material that facilitates thermocompression bonding to pads 1202. Formation, for example, both pad 1202 and substrate clamp contact 724 may be formed of gold. Prior to permanent bonding of the micro pick up array mount 250 and the micro pick up array 290 , the pivoting platform handling voltage contacts 530 and the substrate handling voltage contacts 722 may be aligned to allow these components to be operatively engaged. After aligning the features, a permanent thermocompression bond may be formed to permanently join micro pick up array mount 250 to micro pick up array 290 .
在一个实施例中，微型拾取阵列支座250的柔顺性元件包括不具有横梁506的单一表面。更具体地，柔顺性元件可位于未由通道522分开的枢转平台504和基部502之间。例如，柔顺性元件可包括存在于枢转平台504和基部502之间的由虚线表示的柔性区域1204。柔性区域1204可与枢转平台504和基部502一体化形成，但可具有不同于这些部件的刚度。另选地，刚度上的不同可能是由于不同的结构特征所致，诸如通过形成具有较薄横截面或柔性形态(例如在波纹管的情况下)的柔性区域1204。柔性区域1204刚度降低可允许柔性区域1204挠曲并允许枢转平台504和基部502之间的相对移动。因此，一个或多个位移传感器518可与柔性区域1204集成以感测柔性区域1204的变形。在一个实施例中，电引线可在微型拾取阵列支座250的柔性区域1204上直接路由。另外，操作电压迹线558可直接穿过柔性区域1204，不同于绕过图5A的实施例中所示的通道522。In one embodiment, the compliant member of the micro pick up array mount 250 includes a single surface without beams 506 . More specifically, a compliant element may be located between pivot platform 504 and base 502 that are not separated by channel 522 . For example, the compliance element may include a flexible region 1204 represented by dashed lines that exists between the pivot platform 504 and the base 502 . Flexible region 1204 may be integrally formed with pivot platform 504 and base 502, but may have a different stiffness than these components. Alternatively, the difference in stiffness may be due to different structural features, such as by forming the flexible region 1204 with a thinner cross-section or flexible morphology (eg, in the case of bellows). The reduced stiffness of the flexible region 1204 may allow the flexible region 1204 to flex and allow relative movement between the pivoting platform 504 and the base 502 . Accordingly, one or more displacement sensors 518 may be integrated with flexible region 1204 to sense deformation of flexible region 1204 . In one embodiment, electrical leads may be routed directly over the flexible region 1204 of the micro pick up array mount 250 . Additionally, the operating voltage trace 558 may pass directly through the flex region 1204, rather than bypassing the channel 522 shown in the embodiment of FIG. 5A.
已描述了质量转移工具操纵器组件102的若干单个部件，现将注意力转向质量转移工具操纵器组件102的整体功能和控制。参见图13，其示出根据本发明的实施例的保持微型拾取阵列并且与控制系统互连的质量转移工具操纵器组件的侧视图图示。示出的系统可用于执行包括将微型器件从承载衬底转移到接收衬底的方法。更具体地，该系统可用于主动控制与微型拾取阵列支座250耦接的静电转移头部703阵列和位于承载衬底或接收衬底上的微型器件阵列之间的空间关系。此外，系统可用于控制静电转移头部703阵列和微型器件阵列之间的静电夹持力。此外，系统可用于控制例如在静电转移头部703阵列接触微型器件阵列时传送至静电转移头部703阵列的热量。此外，系统可用于控制使静电转移部列保持紧贴微型拾取阵列支座250。Having described several individual components of the mass transfer tool manipulator assembly 102 , attention now turns to the overall function and control of the mass transfer tool manipulator assembly 102 . Referring to Figure 13, a side view illustration of a mass transfer tool manipulator assembly holding a micropickup array and interconnected with a control system is shown, in accordance with an embodiment of the present invention. The illustrated system can be used to perform a method that includes transferring a micro device from a carrier substrate to a receiving substrate. More specifically, the system can be used to actively control the spatial relationship between the array of electrostatic transfer heads 703 coupled to the micropickup array mount 250 and the array of microdevices on a carrier or receiving substrate. Additionally, the system can be used to control the electrostatic clamping force between the array of electrostatic transfer heads 703 and the array of microdevices. Additionally, the system can be used to control the amount of heat transferred to the array of electrostatic transfer heads 703, for example, as the array of electrostatic transfer heads 703 contacts the array of microdevices. Additionally, the system can be used to control the holding of the electrostatic transfer column against the micro pick up array mount 250 .
在一个实施例中，在计算机系统108的控制下对致动器组件220进行致动影响微型拾取阵列290的运动。例如，计算机系统108可直接与致动器功率源1302连接或通过中间控制器与致动器功率源1302连接以提供控制信号，该控制信号致使致动器功率源1302调节一个或多个致动器310例如压电致动器的移动，以便移动与微型拾取阵列支座250耦接的分布板240。微型拾取阵列支座250可保持微型拾取阵列290。此类调节可基于从致动器功率源1302通过致动器引线404递送至致动器组件220的信号。In one embodiment, actuation of the actuator assembly 220 under the control of the computer system 108 affects the motion of the micro pick-up array 290 . For example, computer system 108 may be coupled to actuator power source 1302 directly or through an intermediate controller to provide control signals that cause actuator power source 1302 to adjust one or more actuation Movement of an actuator 310 such as a piezoelectric actuator to move the distribution plate 240 coupled to the micro pick-up array mount 250 . Micro pick-up array holder 250 can hold micro pick-up array 290 . Such adjustments may be based on signals delivered from actuator power source 1302 to actuator assembly 220 through actuator leads 404 .
在一个实施例中，激活静电转移头部阵列提供对微型器件阵列的静电夹持。例如，计算机系统108可与操作电压源1304直接连接或通过中间控制器与操作电压源1304连接以提供控制信号，该控制信号致使操作电压源1304将静电电压通过操作电压引线1306传送至静电转移头部。操作电压引线1306可集成在例如前柔性电路550或后柔性电路620内，以递送如上所述的操作电压。In one embodiment, activating the array of electrostatic transfer heads provides electrostatic clamping of the array of micro-devices. For example, the computer system 108 may be connected directly to the operating voltage source 1304 or through an intermediate controller to provide a control signal that causes the operating voltage source 1304 to transmit the electrostatic voltage to the electrostatic transfer head through the operating voltage lead 1306 department. Operating voltage leads 1306 may be integrated within, for example, front flex circuit 550 or rear flex circuit 620 to deliver operating voltages as described above.
在一个实施例中，加热静电转移头部阵列可通过向加热元件602递送电力来控制。例如，计算机系统108可与加热电压源1308直接连接或通过中间控制器与加热电压源1308连接以提供控制信号，该控制信号致使加热电压源1308将电力通过加热电压引线1310递送至加热元件602。加热电压引线1310可集成在例如前柔性电路550或后柔性电路620内，以传送如上所述的热力。In one embodiment, heating of the array of electrostatic transfer heads can be controlled by delivering electrical power to the heating element 602 . For example, computer system 108 may be connected to heating voltage source 1308 directly or through an intermediate controller to provide control signals that cause heating voltage source 1308 to deliver power to heating element 602 through heating voltage lead 1310 . Heating voltage leads 1310 may be integrated within, for example, front flex circuit 550 or rear flex circuit 620 to transmit heat as described above.
在一个实施例中，具有静电转移头部阵列的微型拾取阵列290可通过向钳位电极540递送静电电压来保持紧贴微型拾取阵列支座250。例如，计算机系统108可与钳位电压源1312直接连接或通过中间控制器与钳位电压源1312连接以提供控制信号，该控制信号致使钳位电压源1312将静电电压通过钳位电压引线1314递送至钳位电极540。钳位电压引线1314可集成在例如前柔性电路550或后柔性电路620内，以传送如上所述的钳位电压。In one embodiment, the micro pick-up array 290 with an array of electrostatic transfer heads can be held against the micro pick-up array mount 250 by delivering an electrostatic voltage to the clamp electrodes 540 . For example, computer system 108 may be connected to clamp voltage source 1312 directly or through an intermediate controller to provide a control signal that causes clamp voltage source 1312 to deliver an electrostatic voltage through clamp voltage lead 1314 to clamp electrode 540 . Clamping voltage leads 1314 may be integrated within, for example, front flex circuit 550 or rear flex circuit 620 to carry the clamping voltage as described above.
质量转移工具操纵器组件102的移动、静电夹持和加热功能的控制可基于递送自与微型拾取阵列支座相关联的传感器的反馈。例如，温度数据可通过例如后柔性电路620从温度传感器610提供至计算机系统108。类似地，位置相关数据可从一个或多个位移传感器518通过例如前柔性电路550递送至计算机系统108。Control of the movement, electrostatic clamping, and heating functions of the mass transfer tool manipulator assembly 102 may be based on feedback delivered from sensors associated with the micro pick up array mount. For example, temperature data may be provided from temperature sensor 610 to computer system 108 via, for example, rear flex circuit 620 . Similarly, position-related data may be delivered from one or more displacement sensors 518 to computer system 108 through, for example, front flex circuit 550 .
在一个实施例中，来自位移传感器518的位置相关数据可在传送至计算机系统108之前输入至位置感测模块316并且由其进行转换。例如，位置感测模块316或另一部件可施加励磁电压至一个或多个位移传感器518，例如应变仪，并且来自位移传感器518的模拟输出电压可由位置感测模块316来监测。来自一个或多个位移传感器的模拟输出电压继而可经受位置感测模块316的模数处理，并且所得的数字信号可输入至计算机系统108或通过逻辑运算进一步处理，以促成执行用于控制质量转移工具操纵器组件102的运动的控制算法。In one embodiment, the position-related data from the displacement sensor 518 may be input to and converted by the position sensing module 316 before being transmitted to the computer system 108 . For example, the position sensing module 316 or another component may apply an excitation voltage to one or more displacement sensors 518 , such as strain gauges, and the analog output voltages from the displacement sensors 518 may be monitored by the position sensing module 316 . The analog output voltages from the one or more displacement transducers may then be subjected to analog-to-digital processing by the position sensing module 316, and the resulting digital signal may be input to the computer system 108 or further processed by logic operations to facilitate the implementation of the control mass transfer A control algorithm for the motion of the tool manipulator assembly 102 .
参见图14，其示出根据本发明的实施例的用于调节质量转移工具操纵器组件的控制回路的示意图。在一个实施例中，控制回路可为闭环的以实现在微型拾取阵列支座250上均匀分布压力的目标。换句话讲，控制回路可调节质量转移工具操纵器组件102以将在微型拾取阵列支座250上压力的中心变更为期望位置，例如使施加于枢转平台504的压力居中并且在围绕枢转平台504的一个或多个柔顺性元件整体上均匀分布压力。因此，设定值1402可限定与感测相应横梁506中相同变形的每个位移传感器518对应的一组参考信号。来自每个位移传感器518的位移测量可作为与在微型拾取阵列支座250上的压力分布的当前状态相关的反馈输入至位置感测模块316。位置感测模块316可执行模数信号处理并计算或传送经处理的信号至计算机系统108以供计算例如误差信号。基于误差信号，计算机系统108可使用控制算法来确定适当的控制信号来对致动器组件220进行致动以实现使压力均匀分布在微型拾取阵列支座250上。可将这些控制信号直接传送至致动器组件220，或者可例如通过利用放大器1404提高控制信号功率对这些控制信号进行修改。此外，可将控制信号直接馈送至致动器组件220或用于驱动致动器组件220的致动器功率源1302。可继续监测来自每个位移传感器518的位移测量并将其馈送到控制算法中以继续调节致动器组件20直到输出1406等于设定值1402，即直到压力均匀分布在微型拾取阵列支座250上。下文将相对于用于使用质量转移工具操纵器组件102拾取和放置微型器件阵列的方法的实施例进一步描述该基本控制回路模型。Referring to Figure 14, a schematic diagram of a control loop for regulating a mass transfer tool manipulator assembly is shown, in accordance with an embodiment of the present invention. In one embodiment, the control loop may be closed loop to achieve the goal of evenly distributing the pressure on the micro pick up array mount 250 . In other words, the control loop may adjust the mass transfer tool manipulator assembly 102 to change the center of pressure on the micro pick up array mount 250 to a desired location, such as to center the pressure applied to the pivot platform 504 and pivot around the The one or more compliant elements of platform 504 distribute pressure evenly throughout. Accordingly, setpoint 1402 may define a set of reference signals corresponding to each displacement sensor 518 sensing the same deformation in the corresponding beam 506 . Displacement measurements from each displacement sensor 518 may be input to position sensing module 316 as feedback regarding the current state of the pressure distribution on micro pick up array mount 250 . The position sensing module 316 may perform analog-to-digital signal processing and calculate or transmit the processed signal to the computer system 108 for calculation, such as an error signal. Based on the error signal, computer system 108 may use a control algorithm to determine an appropriate control signal to actuate actuator assembly 220 to achieve an even distribution of pressure across micro pick up array mount 250 . These control signals may be communicated directly to the actuator assembly 220 or may be modified, for example by boosting the power of the control signal using the amplifier 1404 . Additionally, the control signal may be fed directly to the actuator assembly 220 or to the actuator power source 1302 used to drive the actuator assembly 220 . Displacement measurements from each displacement sensor 518 can continue to be monitored and fed into the control algorithm to continue adjusting the actuator assembly 20 until the output 1406 equals the setpoint 1402, i.e. until the pressure is evenly distributed across the micro pick up array mount 250 . This basic control loop model will be further described below with respect to an embodiment of a method for picking and placing an array of micro devices using the mass transfer tool manipulator assembly 102 .
在以下描述中，在描述根据本发明的实施例的操作质量转移工具操纵器组件来转移微型器件阵列的方式时，对图15-24进行参考。应理解，将图16-图19和图21-图24中提供的示意图简化为二维示图。例如，以两个维度举例说明并描述柔顺性元件诸如示意性横梁1606、1608的挠曲和具有一对示例性致动器1602、1604的质量转移工具操纵器组件102的致动。然而，应理解，根据本发明的实施例的质量转移工具操纵器组件102的挠曲和致动并不限于此。例如，如上所述，可使用各种致动器来提供附加自由度，并且这些自由度可能不完全由图16-19和图21-24的二维示图来表示。更具体地，如图4A所示，致动器组件220可包括两个以上的致动器，例如三个致动器310。在此类情况下，可使枢转平台504围绕在页面上延伸的轴线在第三维度翻转或倾斜，其未在图16-图19和图21-图24中呈现出来。In the following description, reference is made to FIGS. 15-24 in describing the manner in which a mass transfer tool manipulator assembly is operated to transfer an array of micro devices according to embodiments of the present invention. It should be understood that the schematic diagrams provided in FIGS. 16-19 and 21-24 are simplified as two-dimensional illustrations. For example, the deflection of compliant elements such as exemplary beams 1606 , 1608 and the actuation of mass transfer tool manipulator assembly 102 with an exemplary pair of actuators 1602 , 1604 are illustrated and described in two dimensions. It should be understood, however, that the flexing and actuation of the mass transfer tool manipulator assembly 102 according to embodiments of the present invention is not so limited. For example, as described above, various actuators may be used to provide additional degrees of freedom, and these degrees of freedom may not be fully represented by the two-dimensional illustrations of FIGS. 16-19 and 21-24. More specifically, as shown in FIG. 4A , the actuator assembly 220 may include more than two actuators, such as three actuators 310 . In such cases, pivoting platform 504 may be flipped or tilted in a third dimension about an axis extending across the page, which is not represented in FIGS. 16-19 and 21-24 .
参见图15，其示出根据本发明的实施例的示出用于从承载衬底拾取微型器件的方法的流程图。为了进行示意性的说明，图15的以下描述参见图16-图19所示的实施例。在操作1501，质量转移工具操纵器组件102朝承载衬底移动。参见图16，其示出根据本发明的实施例的朝承载衬底1601移动的质量转移工具操纵器组件的示意图。操纵器组件的移动以及更具体地，枢转平台504的移动可通过对质量转移工具100的各种致动器进行致动或通过对第一示意性致动器1602和第二示意性致动器1604两者进行致动以在长度上延伸来实现。尽管将静电转移头部703示意性地表示为安装在枢转平台504上，但也可将静电转移头部703安装在保持紧贴枢转平台504的微型拾取阵列290上。如图所示，枢转平台504可相对于基部502未偏转，因此，第一示意性横梁1606和第二示意性横梁1608可未移位或未变形。在该初始状态下，在静电转移头部阵列703和位于承载衬底1601上的微型器件阵列1610之间可存在间隙，例如该快照可为在微型器件阵列1610与静电转移头部阵列703接触之前。这里，示出的间隙夸大指示出枢转平台504和承载衬底1601可彼此未对准。Referring to FIG. 15 , there is shown a flowchart illustrating a method for picking a micro device from a carrier substrate, according to an embodiment of the present invention. For illustrative purposes, the following description of FIG. 15 refers to the embodiment shown in FIGS. 16-19 . At operation 1501, the mass transfer tool manipulator assembly 102 is moved toward a carrier substrate. Referring to Figure 16, a schematic diagram of a mass transfer tool manipulator assembly moving toward a carrier substrate 1601 is shown, according to an embodiment of the present invention. Movement of the manipulator assembly and, more specifically, movement of the pivoting platform 504 can be achieved by actuating various actuators of the mass transfer tool 100 or by actuating the first schematic actuator 1602 and the second schematic This is accomplished by actuating both actuators 1604 to extend in length. Although electrostatic transfer head 703 is schematically shown mounted on pivoting platform 504 , electrostatic transfer head 703 may also be mounted on micropickup array 290 held against pivoting platform 504 . As shown, the pivoting platform 504 may not be deflected relative to the base 502 and, therefore, the first illustrative beam 1606 and the second illustrative beam 1608 may not be displaced or deformed. In this initial state, there may be a gap between the array of electrostatic transfer heads 703 and the array of micro devices 1610 on the carrier substrate 1601, for example, the snapshot may be before the array of micro devices 1610 comes into contact with the array of electrostatic transfer heads 703 . Here, the gap shown is exaggerated to indicate that the pivoting platform 504 and the carrier substrate 1601 may be misaligned with each other.
再次参见图15，在操作1505，位于承载衬底1601上的微型器件阵列1610可与跟质量转移工具操纵器组件102的枢转平台504耦接的静电转移头部阵列703相接触。参见图17，其示出根据本发明的实施例的与接触于承载衬底上的微型器件阵列的质量转移工具操纵器组件耦接的静电转移头的示意图。在一个实施例中，由于枢转平台504未对准地接近承载衬底1601，因此在微型器件1610与最接近第二示意性横梁1608的静电转移头703接触之前，最接近第一示意性横梁1606的静电转移头703可接触微型器件1610。因此，第一示意性横梁1606可能变形，而第二示意性横梁1608可能不变形。Referring again to FIG. 15 , at operation 1505 , array of micro devices 1610 on carrier substrate 1601 may be contacted with array of electrostatic transfer heads 703 coupled to pivoting platform 504 of mass transfer tool manipulator assembly 102 . Referring to FIG. 17 , a schematic diagram of an electrostatic transfer head coupled to a mass transfer tool manipulator assembly contacting an array of micro devices on a carrier substrate is shown in accordance with an embodiment of the present invention. In one embodiment, due to the misaligned approach of the pivoting platform 504 to the carrier substrate 1601, the micro device 1610 is closest to the first schematic beam 1608 before contacting the electrostatic transfer head 703 closest to the second schematic beam 1608. The electrostatic transfer head 703 of 1606 can contact the micro device 1610 . Thus, the first illustrative beam 1606 may be deformed, while the second illustrative beam 1608 may not be deformed.
再次参见图15，在操作1510，可感测与枢转平台504耦接的柔顺性元件的变形。再次参见图17，在一个实施例中，在第一示意性横梁1606变形时，位移传感器518(见图5A)生成与第一示意性横梁1606相关联的位移信号。位移信号可例如由位置感测模块316来监测和/或测量。例如，可将位移信号馈送回位置感测模块316以确定已出现第一示意性横梁1606的变形并且计算指示在枢转平台504上存在不均匀分布的误差信号。Referring again to FIG. 15 , at operation 1510 , deformation of a compliant element coupled to pivot platform 504 may be sensed. Referring again to FIG. 17 , in one embodiment, displacement sensor 518 (see FIG. 5A ) generates a displacement signal associated with first illustrative beam 1606 as first illustrative beam 1606 deforms. The displacement signal may be monitored and/or measured, for example, by the position sensing module 316 . For example, a displacement signal may be fed back to the position sensing module 316 to determine that deformation of the first schematic beam 1606 has occurred and to calculate an error signal indicative of an uneven distribution on the pivoting platform 504 .
参见图18，其示出根据本发明的实施例的调整微型拾取阵列支座的位置的质量转移工具操纵器组件的示意图。在感测第一示意性横梁1606的变形并根据测量数据计算误差信号之后，可将控制信号从计算机系统108递送至致动器组件220，致使第二示意性致动器1604延伸并同时保持第一示意性致动器1602的长度。更具体地，可对第二示意性致动器1604进行延伸以调整枢转平台504的空间取向直到邻近的静电转移头部703接触微型器件1610，例如在枢转平台504与承载衬底1601对准时。此外，调整可基于来自与第一示意性横梁1606和第二示意性横梁1608相关联的位移传感器的持续的反馈信号。即，调节可持续到所测量的第一示意性横梁1606和第二示意性横梁1608的变形近似相等。此时，所示平面中枢转平台504上的压力分布可为均匀的。Referring to FIG. 18 , a schematic diagram of a mass transfer tool manipulator assembly for adjusting the position of a micro pick up array mount is shown in accordance with an embodiment of the present invention. After sensing the deformation of the first illustrative beam 1606 and calculating an error signal from the measurement data, a control signal may be delivered from the computer system 108 to the actuator assembly 220 causing the second illustrative actuator 1604 to extend while maintaining the first illustrative beam 1604. An illustrative actuator 1602 length. More specifically, the second schematic actuator 1604 can be extended to adjust the spatial orientation of the pivoting platform 504 until the adjacent electrostatic transfer head 703 contacts the micro-device 1610, for example, when the pivoting platform 504 is aligned with the carrier substrate 1601. on time. Additionally, adjustments may be based on continuous feedback signals from displacement sensors associated with first illustrative beam 1606 and second illustrative beam 1608 . That is, the adjustment may continue until the measured deformations of the first illustrative beam 1606 and the second illustrative beam 1608 are approximately equal. At this point, the pressure distribution on the pivoting platform 504 in the plane shown may be uniform.
再次参见图15，在操作1515，质量转移工具操纵器组件102和承载衬底1601之间的相对移动停止。再次参见图17，一旦压力均匀分布在枢转平台504上，就可停止根据控制信号对致动器组件220的致动。此时，控制回路的输出1406可等于设定值1402。即，误差信号可为零或在预定义范围内，这指示出每个位移传感器518所感测的变形近似相等。该变形值可通过控制回路被进一步限定以实现静电转移头部阵列703和微型器件阵列1610之间的期望压力。例如，可施加足够压力以确保稳定接触并同时避免过度压力施加对静电转移头703和微型器件1610造成损坏。Referring again to Figure 15, at operation 1515, relative movement between the mass transfer tool manipulator assembly 102 and the carrier substrate 1601 is stopped. Referring again to FIG. 17, once the pressure is evenly distributed across the pivoting platform 504, actuation of the actuator assembly 220 in accordance with the control signal may cease. At this point, the output 1406 of the control loop may be equal to the setpoint 1402 . That is, the error signal may be zero or within a predefined range, indicating that the deformation sensed by each displacement sensor 518 is approximately equal. This deformation value can be further defined by a control loop to achieve a desired pressure between the electrostatic transfer head array 703 and the micro device array 1610 . For example, sufficient pressure may be applied to ensure a stable contact while avoiding damage to electrostatic transfer head 703 and micro device 1610 by excessive pressure application.
再次参见图15，在操作1520，可将电压施加于静电转移头部阵列以在微型器件阵列上产生夹持压力。如图18所示，在使静电转移头部阵列703与微型器件阵列1610接触的情况下，静电电压可通过各种触件和连接件，例如质量转移工具操纵器组件102的操作电压引线1306、微型拾取阵列支座250的操作电压迹线558以及微型拾取阵列290的操作电压通孔720等施加于静电转移头部703。更具体地，可基于来自计算机系统108的控制信号将电压从操作电压源1304传输到静电转移头部阵列703。例如，控制信号可基于控制算法，该控制算法指示：在拾取过程期间，如果每个位移传感器518同时感测到预定义变形的，则静电转移头被激活。因此，静电转移头部阵列向微型器件阵列1610施加夹持压力。Referring again to FIG. 15, at operation 1520, a voltage may be applied to the array of electrostatic transfer heads to create a clamping pressure on the array of micro devices. As shown in FIG. 18, with the electrostatic transfer head array 703 in contact with the microdevice array 1610, electrostatic voltages can be passed through various contacts and connections, such as the operating voltage leads 1306, The operating voltage trace 558 of the micro pick-up array support 250 and the operating voltage via hole 720 of the micro pick-up array 290 are applied to the electrostatic transfer head 703 . More specifically, voltage may be transmitted from operating voltage source 1304 to electrostatic transfer head array 703 based on control signals from computer system 108 . For example, the control signal may be based on a control algorithm indicating that during the pick-up process, if each displacement sensor 518 simultaneously senses a predefined deformation, the electrostatic transfer head is activated. Thus, the array of electrostatic transfer heads applies a clamping pressure to the array of micro devices 1610 .
再次参见图15，在操作1525，可从承载衬底1601拾取微型器件阵列1610。参见图19，其示出根据本发明的实施例的从承载衬底拾取微型器件的质量转移工具操纵器组件的示意图。第一示意性致动器1602和第二示意性致动器1604可由计算机系统108来控制以从承载衬底1601回缩枢转平台504。在回缩期间，在横梁释放存储能量并回弹至初始构型时，第一示意性横梁1606和第二示意性横梁1608可返回到未变形状态。同时，与横梁相关联的位移传感器可将指示横梁未变形的信号传输至位置感测模块316。然而，在该阶段，控制算法可指示枢转平台504进一步回缩以移除微型器件阵列1610以便转移至接收衬底。该回缩可通过对致动器组件220进行致动或者在另一个实施例中通过对质量转移工具100的各种致动器进行致动来实现。此外，在一个实施例中，回缩可通过去激活致动器组件220并允许翻转-倾斜-z挠曲部230的柔性联接件414的固有刚度使翻转-倾斜-z挠曲部230恢复至初始状态来实现，这导致微型拾取阵列支座250回缩。在拾取期间，提供给静电转移头部阵列的静电电压可持续，因此微型器件阵列1610可保持在静电转移头部703上并且从承载衬底1601移除。Referring again to FIG. 15 , at operation 1525 , array of micro devices 1610 may be picked from carrier substrate 1601 . Referring to FIG. 19 , a schematic diagram of a mass transfer tool manipulator assembly for picking up micro devices from a carrier substrate is shown in accordance with an embodiment of the present invention. First illustrative actuator 1602 and second illustrative actuator 1604 can be controlled by computer system 108 to retract pivoting platform 504 from carrier substrate 1601 . During retraction, first illustrative beam 1606 and second illustrative beam 1608 may return to an undeformed state as the beam releases stored energy and springs back to its original configuration. Simultaneously, a displacement sensor associated with the beam may transmit a signal to the position sensing module 316 indicating that the beam is not deformed. However, at this stage, the control algorithm may instruct the pivoting platform 504 to retract further to remove the array of micro devices 1610 for transfer to a receiving substrate. This retraction may be accomplished by actuating the actuator assembly 220 or, in another embodiment, various actuators of the mass transfer tool 100 . Furthermore, in one embodiment, retraction may return the flip-tilt-z flexure 230 to the The initial state is achieved, which causes the micro pick-up array mount 250 to retract. During pick-up, the electrostatic voltage provided to the electrostatic transfer head array can be sustained, so the array of micro devices 1610 can remain on the electrostatic transfer head 703 and be removed from the carrier substrate 1601 .
在相对于图15所述的拾取操作期间，可对微型拾取阵列支座250上的加热元件602进行加热。例如，可对加热元件602进行电阻式加热以将热量转移至微型拾取阵列290和与静电转移头部接触的微型器件。热量转移可在从承载衬底1601拾取微型器件阵列1610之前、期间和之后发生。The heating element 602 on the micro pick up array mount 250 may be heated during the pick up operation described with respect to FIG. 15 . For example, the heating element 602 can be resistively heated to transfer heat to the micropickup array 290 and the microdevices in contact with the electrostatic transfer head. Heat transfer can occur before, during and after picking up the array of micro devices 1610 from the carrier substrate 1601 .
参见图20，其示出根据本发明的实施例的示出用于将微型器件置于接收衬底上的方法的流程图。为了进行示意性的说明，图20的以下描述参见图21-24所示的实施例。在操作2001，质量转移工具操纵器组件102朝接收衬底移动。参见图21，其示出根据本发明的实施例的朝接收衬底移动的质量转移工具操纵器组件的示意图。操纵器组件的移动以及更具体地，枢转平台504的移动可通过对质量转移工具100的各种致动器进行致动或通过对第一示意性致动器1602和第二示意性致动器1604两者进行致动以在长度上延伸来实现。如图所示，枢转平台504可相对于基部502未偏转，因此，第一示意性横梁1606和第二示意性横梁1608可未移位或未变形。在该初始状态下，在由静电转移头部阵列703夹持的微型器件阵列1610和接收衬底2101之间可能存在间隙，例如该快照可为在接收衬底2101和微型器件阵列1610接触之前。这里，示出的间隙夸大指示出枢转平台504和接收衬底2101可彼此未对准。Referring to FIG. 20 , there is shown a flowchart illustrating a method for placing a micro device on a receiving substrate in accordance with an embodiment of the present invention. For illustrative purposes, the following description of FIG. 20 refers to the embodiment shown in FIGS. 21-24. At operation 2001, the mass transfer tool manipulator assembly 102 is moved toward a receiving substrate. Referring to FIG. 21 , a schematic diagram of a mass transfer tool manipulator assembly moving toward a receiving substrate is shown in accordance with an embodiment of the present invention. Movement of the manipulator assembly and, more specifically, movement of the pivoting platform 504 can be achieved by actuating various actuators of the mass transfer tool 100 or by actuating the first schematic actuator 1602 and the second schematic This is accomplished by actuating both actuators 1604 to extend in length. As shown, the pivoting platform 504 may not be deflected relative to the base 502 and, therefore, the first illustrative beam 1606 and the second illustrative beam 1608 may not be displaced or deformed. In this initial state, there may be a gap between the micro-device array 1610 held by the electrostatic transfer head array 703 and the receiving substrate 2101 , for example, the snapshot may be before the receiving substrate 2101 and the micro-device array 1610 are in contact. Here, the gap shown is exaggerated to indicate that the pivoting platform 504 and receiving substrate 2101 may be misaligned with each other.
再次参见图20，在操作2005，接收衬底2101与跟质量转移工具操纵器之间的枢转平台耦接的静电转移头部阵列所承载的微型器件阵列相接触。参见图22，其示出根据本发明的实施例的由静电转移头部所承载的微型器件的示意图，该静电转移头部与接触于接收衬底的质量转移工具操纵器组件耦接。在一个实施例中，由于枢转平台504未对准地接近接收衬底2101，因此在接收衬底2101接触由最接近第二示意性横梁1608的静电转移头所夹持的微型器件之前，由最接近第一示意性横梁1606的静电转移头部703所夹持的微型器件1610可接触接收衬底2101。因此，第一示意性横梁1606可能变形，而第二示意性横梁1608可能不变形。Referring again to FIG. 20, at operation 2005, a receiving substrate 2101 is contacted with an array of microdevices carried by an array of electrostatic transfer heads coupled to a pivoting stage between mass transfer tool manipulators. Referring to FIG. 22 , a schematic diagram of a micro device carried by an electrostatic transfer head coupled to a mass transfer tool manipulator assembly in contact with a receiving substrate is shown in accordance with an embodiment of the present invention. In one embodiment, due to the misaligned approach of the pivoting platform 504 to the receiving substrate 2101, prior to the receiving substrate 2101 contacting the micro device held by the electrostatic transfer head closest to the second schematic beam 1608, the The micro device 1610 held by the electrostatic transfer head 703 closest to the first schematic beam 1606 can contact the receiving substrate 2101 . Thus, the first illustrative beam 1606 may be deformed, while the second illustrative beam 1608 may not be deformed.
再次参见图20，在操作2010，可感测与枢转平台504耦接的柔顺性元件的变形。再次参见图22，在一个实施例中，在第一示意性横梁1606变形时，与第一示意性横梁1606相关联的位移传感器518生成位移信号。位移信号可例如由位置感测模块316来监测和/或测量。例如，可将位移信号馈送回位置感测模块316以确定已出现第一示意性横梁1606的变形并且计算指示在枢转平台504上存在不均匀分布的误差信号。Referring again to FIG. 20 , at operation 2010 , deformation of a compliant element coupled to pivot platform 504 may be sensed. Referring again to FIG. 22 , in one embodiment, displacement sensor 518 associated with first illustrative beam 1606 generates a displacement signal as first illustrative beam 1606 deforms. The displacement signal may be monitored and/or measured, for example, by the position sensing module 316 . For example, a displacement signal may be fed back to the position sensing module 316 to determine that deformation of the first schematic beam 1606 has occurred and to calculate an error signal indicative of an uneven distribution on the pivoting platform 504 .
参见图23，其示出根据本发明的实施例的调整微型拾取阵列支座的位置的质量转移工具操纵器组件的示意图。在感测第一示意性横梁1606的变形并根据测量数据计算误差信号之后，可将控制信号从计算机系统108传送至致动器组件220，致使第二示意性致动器1604延伸并同时保持第一示意性致动器1602的长度。更具体地，可对第二示意性致动器1604进行延伸以调整枢转平台504的空间取向直到邻近的静电转移头部703接触微型器件1610，例如在枢转平台504与接收衬底2101对准时。此外，调整可基于来自与第一示意性横梁1606和第二示意性横梁1608相关联的位移传感器的持续的反馈信号。即，调整可持续到所测量的第一示意性横梁1606和第二示意性横梁1608的变形近似相等。此时，所示平面中枢转平台504上的压力分布可为均匀的。Referring to FIG. 23 , a schematic diagram of a mass transfer tool manipulator assembly for adjusting the position of a micro pick up array mount is shown in accordance with an embodiment of the present invention. After sensing the deformation of first illustrative beam 1606 and calculating an error signal based on the measurement data, a control signal may be transmitted from computer system 108 to actuator assembly 220 causing second illustrative actuator 1604 to extend while maintaining first illustrative beam 1604. An illustrative actuator 1602 length. More specifically, the second illustrative actuator 1604 can be extended to adjust the spatial orientation of the pivoting platform 504 until the adjacent electrostatic transfer head 703 contacts the microdevice 1610, such as when the pivoting platform 504 is aligned with the receiving substrate 2101. on time. Additionally, adjustments may be based on continuous feedback signals from displacement sensors associated with first illustrative beam 1606 and second illustrative beam 1608 . That is, the adjustment may continue until the measured deformations of the first illustrative beam 1606 and the second illustrative beam 1608 are approximately equal. At this point, the pressure distribution on the pivoting platform 504 in the plane shown may be uniform.
再次参见图20，在操作2015，可停止质量转移工具操纵器组件102和接收衬底2101之间的相对移动。再次参见图23，一旦压力均匀分布在枢转平台504上，就可停止根据控制信号对致动器组件220的致动。此时，控制回路的输出1406可等于设定值1402。即，误差信号可为零或在预定义范围内，这指示出每个位移传感器518所感测的变形近似相同。该变形值可通过控制回路被进一步限定以实现微型器件阵列1610和接收衬底2101之间的期望压力。例如，可施加足够压力以确保稳定接触并同时避免过度压力施加对微型器件造成损坏。Referring again to FIG. 20, at operation 2015, relative movement between mass transfer tool manipulator assembly 102 and receiving substrate 2101 may be stopped. Referring again to FIG. 23, once the pressure is evenly distributed across the pivoting platform 504, actuation of the actuator assembly 220 in accordance with the control signal can cease. At this point, the output 1406 of the control loop may be equal to the setpoint 1402 . That is, the error signal may be zero or within a predefined range, indicating that the deformation sensed by each displacement sensor 518 is approximately the same. This deformation value can be further defined by a control loop to achieve a desired pressure between the array of micro devices 1610 and the receiving substrate 2101 . For example, sufficient pressure can be applied to ensure a stable contact while avoiding damage to the microdevice by excessive pressure application.
再次参见图20，在操作2020，从静电转移头部阵列移除电压。如图23所示，在使微型器件阵列1610与接收衬底2101接触的情况下，静电电压可从静电转移头部阵列703移除。更具体地，可基于来自计算机系统108的控制信号将从操作电压源1304传输到静电转移头部阵列703的操作电压中止。例如，控制信号可基于控制算法，该控制算法指示：在放置操作期间，如果每个位移传感器518同时感测到预定义变形，则静电转移头部703被去激活。因此，从静电转移头部阵列703释放微型器件阵列1610。Referring again to FIG. 20, at operation 2020, the voltage is removed from the array of electrostatic transfer heads. As shown in FIG. 23 , with the array of micro devices 1610 in contact with the receiving substrate 2101 , the electrostatic voltage can be removed from the array of electrostatic transfer heads 703 . More specifically, transmission of operating voltage from operating voltage source 1304 to electrostatic transfer head array 703 may be discontinued based on a control signal from computer system 108 . For example, the control signal may be based on a control algorithm indicating that during the placement operation, if each displacement sensor 518 simultaneously senses a predefined deformation, then the electrostatic transfer head 703 is deactivated. Thus, the array of micro devices 1610 is released from the array of electrostatic transfer heads 703 .
再次参见图20，在操作2025，可将微型器件阵列1610释放到接收衬底2101上。参见图24，其示出根据本发明的实施例的将微型器件释放到接收衬底的质量转移工具操纵器组件的示意图。第一示意性致动器1602和第二示意性致动器1604可由计算机系统108来控制以从接收衬底2101来回缩枢转平台504。在回缩期间，在横梁释放存储能量并回弹至初始构型时，第一示意性横梁1606和第二示意性横梁1608可返回到未变形状态。同时，与横梁相关联的位移传感器可将指示横梁未变形的信号传输至位置感测模块316。然而，在该阶段，控制算法可指示枢转平台504被进一步回缩以清除枢转平台504并开始另一拾取操作。该回缩可通过对致动器组件220进行致动或者在另一个实施例中通过对质量转移工具100的各种致动器进行致动来实现。此外，在一个实施例中，回缩可通过停用致动器组件220并允许翻转-倾斜-z挠曲部230的柔性联接件414的固有刚度使翻转-倾斜-z挠曲部230恢复至初始状态来实现，这导致微型拾取阵列支座250回缩。Referring again to FIG. 20 , at operation 2025 the array of micro devices 1610 may be released onto the receiving substrate 2101 . Referring to Figure 24, a schematic diagram of a mass transfer tool manipulator assembly for releasing micro devices to a receiving substrate is shown, in accordance with an embodiment of the present invention. First illustrative actuator 1602 and second illustrative actuator 1604 can be controlled by computer system 108 to retract pivoting platform 504 from receiving substrate 2101 . During retraction, first illustrative beam 1606 and second illustrative beam 1608 may return to an undeformed state as the beam releases stored energy and springs back to its original configuration. Simultaneously, a displacement sensor associated with the beam may transmit a signal to the position sensing module 316 indicating that the beam is not deformed. At this stage, however, the control algorithm may instruct the pivoting platform 504 to be retracted further to clear the pivoting platform 504 and begin another pick operation. This retraction may be accomplished by actuating the actuator assembly 220 or, in another embodiment, various actuators of the mass transfer tool 100 . Furthermore, in one embodiment, retraction may return the flip-tilt-z flexure 230 to the The initial state is achieved, which causes the micro pick-up array mount 250 to retract.
在相对于图20所述的放置操作期间，可将热量施加于微型器件阵列1610。例如，如上所述，可对加热元件602进行电阻式加热以通过微型拾取阵列支座250将热量转移到夹持微型器件1610的静电转移头部阵列中。以这种方式保持微型拾取阵列支座250的升高的温度可避免由操作环境的温度变化引起的一些问题。在整个放置操作中，可对微型器件1610进行持续加热。然而，更具体地，可在感测到微型器件的挠曲之后和/或在微型器件1610与接收衬底2101接触之后，对微型器件1610进行加热。在一个实施例中，对阵列中的每个静电转移头部703均匀地加热，例如加热至50摄氏度、180摄氏度、200摄氏度乃至高达350摄氏度的温度。这些温度可导致微型器件1610和接收衬底2101之间的熔融或扩散以使微型器件键合至接收衬底。Heat may be applied to the array of micro devices 1610 during the placement operations described with respect to FIG. 20 . For example, as described above, heating element 602 may be resistively heated to transfer heat through micropickup array mount 250 into an array of electrostatic transfer heads holding microdevices 1610 . Maintaining the elevated temperature of the micro pick up array mount 250 in this manner avoids some of the problems caused by temperature changes in the operating environment. Microdevice 1610 may be continuously heated throughout the placement operation. More specifically, however, microdevice 1610 may be heated after sensing a deflection of the microdevice and/or after microdevice 1610 is in contact with receiving substrate 2101 . In one embodiment, each electrostatic transfer head 703 in the array is heated uniformly, for example to a temperature of 50 degrees Celsius, 180 degrees Celsius, 200 degrees Celsius or even as high as 350 degrees Celsius. These temperatures can cause melting or diffusion between the micro device 1610 and the receiving substrate 2101 to bond the micro device to the receiving substrate.
参见图25，其示出可根据本发明的实施例使用的计算机系统的示意图。本发明的实施例的一部分包含位于例如计算机系统108的机器可用介质中的非暂态机器可读和机器可执行指令或由这些指令所控制。计算机系统108为示例性的，并且本发明的实施例可在多个不同计算机系统上或在多个不同计算机系统中进行操作，或者由多个不同计算机系统所控制，该多个不同计算机系统包括通用联网计算机系统、嵌入式计算机系统、路由器、开关、服务器设备、客户端设备、各种中间设备/节点、独立式计算机系统等。此外，尽管以上为了分别论述而对控制系统的一些部件例如放大器1404和位置感测模块316进行拆分，但计算机系统108可直接集成这些部件或包括实现类似功能的附加部件。Referring to Figure 25, a schematic diagram of a computer system that may be used in accordance with embodiments of the present invention is shown. Portions of the embodiments of the present invention comprise or are controlled by non-transitory machine-readable and machine-executable instructions residing in machine-usable media such as computer system 108 . Computer system 108 is exemplary, and embodiments of the invention may operate on or be controlled by a number of different computer systems, including General networked computer systems, embedded computer systems, routers, switches, server devices, client devices, various intermediate devices/nodes, stand-alone computer systems, etc. Furthermore, although some components of the control system, such as the amplifier 1404 and the position sensing module 316, have been split above for separate discussion, the computer system 108 may directly integrate these components or include additional components that perform similar functions.
图25的计算机系统108包括用于传送信息的地址/数据总线2502，以及耦接至总线2502、用于处理信息和指令的中央处理器2504单元。计算机系统108还包括数据存储特征部，诸如耦接至总线2502的用于存储中央处理器2504单元的信息和指令的计算机可用易失性存储器2506例如随机存取存储器(RAM)、耦接至总线2502的用于存储中央处理器2504单元的静态信息和指令的计算机可用非易失性存储器2508例如只读存储器(ROM)，以及耦接至总线2502的用于存储信息和指令的数据存储设备2510(例如，磁盘或光盘和磁盘驱动器)。本实施例的计算机系统108还包括耦接至总线2502、用于向中央处理器2504单元传送信息和命令选择的可选的数字字母混合输入设备2512，该数字字母混合输入设备包括数字字母和功能键。计算机系统108还可选地包括耦接至总线2502、用于向中央处理器2504单元传送用户输入信息和命令选择的可选的光标控制设备2514。本实施例的计算机系统108还包括耦接至总线2502、用于显示信息的可选的显示设备2516。Computer system 108 of FIG. 25 includes an address/data bus 2502 for communicating information, and a central processing unit 2504 unit coupled to bus 2502 for processing information and instructions. Computer system 108 also includes data storage features, such as computer usable volatile memory 2506, such as random access memory (RAM), coupled to bus 2502 for storing information and instructions for the central processing unit 2504 unit, Computer usable non-volatile memory 2508 such as read only memory (ROM) at 2502 for storing static information and instructions for the central processing unit 2504 unit, and data storage device 2510 coupled to bus 2502 for storing information and instructions (for example, a magnetic disk or an optical disk and a disk drive). The computer system 108 of the present embodiment also includes an optional alphanumeric input device 2512 coupled to the bus 2502 for communicating information and command selections to the central processing unit 2504 unit, the alphanumeric input device including alphanumeric and functional key. Computer system 108 also optionally includes an optional cursor control device 2514 coupled to bus 2502 for communicating user input information and command selections to central processing unit 2504 unit. The computer system 108 of the present embodiment also includes an optional display device 2516 coupled to the bus 2502 for displaying information.
数据存储设备2510可包括非暂态机器可读存储介质2518，其上存储有体现本文所述方法或操作中的任何一者或多者的一个或多个指令集(例如，软件2520)。软件2520还可在其由计算机系统108执行期间完全地或至少部分地位于易失性存储器2506、非易失性存储器2508和/或处理器2504内，易失性存储器2506、非易失性存储器2508和处理器2504还构成非暂态机器可读存储介质。Data storage device 2510 may include a non-transitory machine-readable storage medium 2518 having stored thereon one or more sets of instructions (eg, software 2520 ) embodying any one or more of the methods or operations described herein. Software 2520 may also reside wholly or at least partially within volatile memory 2506, nonvolatile memory 2508, and/or processor 2504 during its execution by computer system 108, volatile memory 2506, nonvolatile memory 2508 and processor 2504 also constitute a non-transitory machine-readable storage medium.
如上所用，一个部件紧贴另一部件或与另一部件“耦接”、“紧固”、“接合”、“保持”等可使用诸如螺栓连接、钉接、夹持、热键合或粘合键合等各种公知方法来实现。此类术语的使用并非旨在限制，并且事实上，应设想到在本发明的范围内此类方法在另选的实施例中可为可互换的。As used above, one part is attached to or "coupled", "fastened", "engaged", "retained" with another part may use such as bolting, nailing, clamping, thermal bonding or adhesive Various known methods such as bonding can be realized. The use of such terms is not intended to be limiting, and, in fact, it is contemplated that such methods may be interchangeable in alternative embodiments within the scope of the present invention.
在以上说明书中，已参照本发明的特定示例性实施例描述了本发明。显而易见的是，可在不脱离以下权利要求所示的本发明的更广泛的实质和范围的情况下对实施例做出各种修改。因此，说明书和附图应被认为是出于例证目的而非限制目的。In the foregoing specification, the invention has been described with reference to specific exemplary embodiments thereof. It will be apparent that various modifications may be made to the embodiments without departing from the broader spirit and scope of the invention as shown in the following claims. Accordingly, the specification and drawings should be regarded as illustrative rather than limiting.
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| US13/776,188 | 2013-02-25 | ||
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