技术领域technical field
本发明涉及显示技术领域，尤其涉及一种阵列基板及其制作方法、显示面板、显示装置。The present invention relates to the field of display technology, in particular to an array substrate and a manufacturing method thereof, a display panel, and a display device.
背景技术Background technique
液晶显示器(Liquid Crystal Display，LCD)是目前常用的平板显示器，LCD显示器以其低电压、低功耗、适宜于电路集成、轻巧便携等优点而受到广泛的研究与应用。Liquid Crystal Display (LCD) is a commonly used flat-panel display at present. LCD display has been widely researched and applied due to its advantages of low voltage, low power consumption, suitable for circuit integration, light weight and portability.
随着液晶显示技术的发展，对液晶显示面板的响应速度、分辨率以及开口率的要求不断提高。现有技术增大开口率通常采用有机膜层作为钝化层的一部分减低公共电极与源极/漏极线之间的电容。主要目的是减少源极/漏极信号对公共电极的影响，进而减少源极/漏极信号对源极/漏极线附近液晶偏转的影响，从而减少信号线以及扫描线上方黑矩阵的尺寸，进而提高液晶显示面板像素的开口率。With the development of liquid crystal display technology, the requirements for the response speed, resolution and aperture ratio of the liquid crystal display panel are constantly increasing. In the prior art to increase the aperture ratio, an organic film layer is usually used as a part of the passivation layer to reduce the capacitance between the common electrode and the source/drain line. The main purpose is to reduce the influence of the source/drain signal on the common electrode, thereby reducing the influence of the source/drain signal on the liquid crystal deflection near the source/drain line, thereby reducing the size of the signal line and the black matrix above the scanning line, Furthermore, the aperture ratio of the pixels of the liquid crystal display panel is increased.
如图1所示，现有技术的显示面板包括相对设置的阵列基板11和彩膜基板12，以及位于阵列基板11和彩膜基板12之间的液晶层13和封框胶14，具体地，阵列基板11包括依次设置在衬底基板110上的栅极绝缘层111、第一钝化层112、有机膜层113、第一电极层114、第二钝化层115和第二电极层116。从图1中可以看到，封框胶14位于第二钝化层115上。As shown in FIG. 1 , the display panel in the prior art includes an array substrate 11 and a color filter substrate 12 disposed opposite to each other, and a liquid crystal layer 13 and a sealant 14 located between the array substrate 11 and the color filter substrate 12. Specifically, The array substrate 11 includes a gate insulating layer 111 , a first passivation layer 112 , an organic film layer 113 , a first electrode layer 114 , a second passivation layer 115 and a second electrode layer 116 sequentially disposed on the base substrate 110 . It can be seen from FIG. 1 that the sealant 14 is located on the second passivation layer 115 .
为了验证图1所示的显示面板的显示特性，对图1所示的显示面板进行信赖性测试，即将图1所示的显示面板放入高温、高湿和高压的测试环境中一段时间后，测试显示面板的显示特性是否变化，一般现有技术采用的信赖性测试时的温度为60℃、湿度为80％、压强为两个大气压、时间为240小时。测试结果显示，该显示面板的显示特性变差，主要原因是在进行第二钝化层115镀膜时，由于镀膜时的温度小于200℃，镀膜得到的第二钝化层115的特性较差，因此，实际生产过程中镀膜时的温度大于200℃，而有机膜层113在大于150℃的情况下表面会发生升华，升华的有机膜会参与第二钝化层115镀膜的初期反应，反应影响第二钝化层115与其下面膜层之间的粘附性，在进行信赖性测试条件下，外界水汽很容易从粘附性较差的界面处进入显示面板内部，在显示面板内部形成气泡15，进而使得显示面板的显示特性变差。In order to verify the display characteristics of the display panel shown in Figure 1, a reliability test is performed on the display panel shown in Figure 1, that is, after the display panel shown in Figure 1 is placed in a high temperature, high humidity and high pressure test environment for a period of time, To test whether the display characteristics of the display panel have changed, generally the reliability test adopted in the prior art has a temperature of 60° C., a humidity of 80%, a pressure of 2 atmospheres, and a time of 240 hours. The test results show that the display characteristics of the display panel deteriorate, mainly because when the second passivation layer 115 is coated, the temperature of the coating is less than 200°C, and the properties of the second passivation layer 115 obtained by coating are poor. Therefore, in the actual production process, the temperature during coating is greater than 200°C, and the surface of the organic film layer 113 will be sublimated when the temperature is greater than 150°C, and the sublimated organic film will participate in the initial reaction of the coating of the second passivation layer 115, and the reaction affects Adhesion between the second passivation layer 115 and the lower film layer, under the condition of reliability test, external water vapor can easily enter the display panel from the interface with poor adhesion, forming bubbles 15 inside the display panel , thereby deteriorating the display characteristics of the display panel.
综上所述，现有技术的显示面板在实际使用过程中，外界水汽很容易从粘附性较差的界面进入显示面板内，从而影响显示面板的显示特性，显示面板的信赖性较差。To sum up, during the actual use of the display panel in the prior art, external water vapor can easily enter the display panel from the interface with poor adhesion, thereby affecting the display characteristics of the display panel, and the reliability of the display panel is poor.
发明内容Contents of the invention
本发明实施例提供了一种阵列基板及其制作方法、显示面板、显示装置，用以避免外界水汽进入阵列基板内，提高显示面板的信赖性。Embodiments of the present invention provide an array substrate and a manufacturing method thereof, a display panel, and a display device, which are used to prevent external water vapor from entering the array substrate and improve the reliability of the display panel.
本发明实施例提供的一种阵列基板，包括设置在衬底基板上的栅极绝缘层、第一钝化层、有机膜层和第二钝化层，其中，An array substrate provided by an embodiment of the present invention includes a gate insulating layer, a first passivation layer, an organic film layer, and a second passivation layer disposed on a base substrate, wherein,
所述第二钝化层设置有镂空区域，所述镂空区域与用于贴合封框胶的区域对应。The second passivation layer is provided with a hollowed-out area, and the hollowed-out area corresponds to the area used for pasting the sealant.
由本发明实施例提供的阵列基板，包括设置在衬底基板上的栅极绝缘层、第一钝化层、有机膜层和第二钝化层，其中，所述第二钝化层设置有镂空区域，所述镂空区域与用于贴合封框胶的区域对应。由于本发明实施例中与用于贴合封框胶的区域对应的区域不设置第二钝化层，与现有技术相比，能够有效避免外界水汽因为第二钝化层界面粘附性问题进入阵列基板内，提高阵列基板的信赖性。The array substrate provided by the embodiment of the present invention includes a gate insulating layer, a first passivation layer, an organic film layer and a second passivation layer arranged on the base substrate, wherein the second passivation layer is provided with a hollow area, the hollowed out area corresponds to the area for pasting the sealant. Since the second passivation layer is not provided in the area corresponding to the area used for pasting the sealant in the embodiment of the present invention, compared with the prior art, it can effectively avoid the problem of the interface adhesion of the second passivation layer caused by external water vapor Into the array substrate, improve the reliability of the array substrate.
较佳地，所述第一钝化层设置有镂空区域，该镂空区域与所述第二钝化层设置的镂空区域对应。Preferably, the first passivation layer is provided with a hollow area corresponding to the hollow area provided by the second passivation layer.
这样，后续贴合的封框胶直接与栅极绝缘层接触，与现有技术相比，能够有效避免外界水汽因为第二钝化层界面粘附性问题进入阵列基板内，提高阵列基板的信赖性。In this way, the subsequent bonding of the frame sealant directly contacts the gate insulating layer. Compared with the existing technology, it can effectively prevent external water vapor from entering the array substrate due to the problem of the interface adhesion of the second passivation layer, and improve the reliability of the array substrate. sex.
较佳地，所述阵列基板包括绝缘设置的第一电极层和第二电极层，其中，Preferably, the array substrate includes a first electrode layer and a second electrode layer that are insulated, wherein,
所述第一电极层为像素电极，所述第二电极层为公共电极；或，The first electrode layer is a pixel electrode, and the second electrode layer is a common electrode; or,
所述第一电极层为公共电极，所述第二电极层为像素电极。The first electrode layer is a common electrode, and the second electrode layer is a pixel electrode.
较佳地，所述第一电极层为面电极，所述第二电极层为条形电极。Preferably, the first electrode layer is a surface electrode, and the second electrode layer is a strip electrode.
较佳地，所述栅极绝缘层的材料为氧化硅或氮化硅。Preferably, the material of the gate insulating layer is silicon oxide or silicon nitride.
较佳地，所述第一钝化层的材料为氧化硅或氮化硅。Preferably, the material of the first passivation layer is silicon oxide or silicon nitride.
较佳地，所述第二钝化层的材料为氧化硅或氮化硅。Preferably, the material of the second passivation layer is silicon oxide or silicon nitride.
本发明实施例还提供了一种显示面板，包括相对设置的第一基板和第二基板，以及位于所述第一基板和所述第二基板之间的液晶层和封框胶，其中，所述第一基板为上述的阵列基板。An embodiment of the present invention also provides a display panel, including a first substrate and a second substrate oppositely arranged, and a liquid crystal layer and a sealant between the first substrate and the second substrate, wherein the The first substrate is the above-mentioned array substrate.
本发明实施例还提供了一种显示装置，该显示装置包括上述的显示面板。An embodiment of the present invention also provides a display device, which includes the above-mentioned display panel.
本发明实施例还提供了一种阵列基板的制作方法，所述方法包括：The embodiment of the present invention also provides a method for manufacturing an array substrate, the method comprising:
通过构图工艺在衬底基板上依次制作栅极绝缘层、第一钝化层、有机膜层和第二钝化层；Fabricate a gate insulating layer, a first passivation layer, an organic film layer and a second passivation layer sequentially on the base substrate through a patterning process;
通过构图工艺去除预设区域的第二钝化层；或，去除预设区域的第二钝化层和第一钝化层；所述预设区域与用于贴合封框胶的区域对应。The second passivation layer in the predetermined area is removed through a patterning process; or, the second passivation layer and the first passivation layer in the predetermined area are removed; the predetermined area corresponds to the area for pasting the sealant.
附图说明Description of drawings
图1为现有技术显示面板边缘的截面结构示意图；FIG. 1 is a schematic diagram of a cross-sectional structure of an edge of a display panel in the prior art;
图2为本发明实施例提供的一种阵列基板边缘的截面结构示意图；FIG. 2 is a schematic cross-sectional structure diagram of an edge of an array substrate provided by an embodiment of the present invention;
图3为本发明实施例提供的另一阵列基板边缘的截面结构示意图；3 is a schematic cross-sectional structure diagram of another array substrate edge provided by an embodiment of the present invention;
图4为本发明实施例提供的再一阵列基板边缘的截面结构示意图；FIG. 4 is a schematic cross-sectional structure diagram of another array substrate edge provided by an embodiment of the present invention;
图5为本发明实施例提供的一种显示面板边缘的截面结构示意图；FIG. 5 is a schematic cross-sectional structure diagram of an edge of a display panel provided by an embodiment of the present invention;
图6为本发明实施例提供的一种阵列基板的制作方法流程图；FIG. 6 is a flowchart of a manufacturing method of an array substrate provided by an embodiment of the present invention;
图7为本发明实施例提供的制作第二钝化层后的阵列基板边缘的截面结构示意图。FIG. 7 is a schematic cross-sectional structure diagram of the edge of the array substrate after the second passivation layer is fabricated according to an embodiment of the present invention.
具体实施方式Detailed ways
本发明实施例提供了一种阵列基板及其制作方法、显示面板、显示装置，用以避免外界水汽进入阵列基板内，提高显示面板的信赖性。Embodiments of the present invention provide an array substrate and a manufacturing method thereof, a display panel, and a display device, which are used to prevent external water vapor from entering the array substrate and improve the reliability of the display panel.
为了使本发明的目的、技术方案和优点更加清楚，下面将结合附图对本发明作进一步地详细描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其它实施例，都属于本发明保护的范围。In order to make the purpose, technical solutions and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings. Obviously, the described embodiments are only some of the embodiments of the present invention, rather than all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
下面结合附图详细介绍本发明具体实施例提供的阵列基板和显示面板。The array substrate and the display panel provided by the specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.
附图中各层薄膜厚度和区域大小形状不反应各膜层的真实比例，目的只是示意说明本发明内容。The film thickness and area size and shape of each layer in the drawings do not reflect the real proportion of each film layer, and the purpose is only to schematically illustrate the content of the present invention.
如图2所示，本发明具体实施例提供了一种阵列基板，包括设置在衬底基板110上的栅极绝缘层111、第一钝化层112、有机膜层113和第二钝化层115，其中，第二钝化层115设置有镂空区域20，镂空区域20与用于贴合封框胶的区域对应。As shown in FIG. 2 , a specific embodiment of the present invention provides an array substrate, including a gate insulating layer 111 , a first passivation layer 112 , an organic film layer 113 and a second passivation layer disposed on a base substrate 110 115, wherein the second passivation layer 115 is provided with a hollowed out area 20, and the hollowed out area 20 corresponds to the area for pasting the sealant.
优选地，如图3所示，本发明具体实施例中的第一钝化层112设置有镂空区域30，该镂空区域30与第二钝化层115设置的镂空区域20对应。Preferably, as shown in FIG. 3 , the first passivation layer 112 in the specific embodiment of the present invention is provided with a hollow area 30 corresponding to the hollow area 20 provided by the second passivation layer 115 .
优选地，本发明具体实施例中栅极绝缘层111的材料为氧化硅(SiO2)或氮化硅(SiN)，当然，还可以为SiO2和SiN的复合膜，本发明具体实施例并不对栅极绝缘层111的具体材料做限定。本发明具体实施例中的第一钝化层112的材料为SiO2或SiN，当然，还可以为SiO2和SiN的复合膜，本发明具体实施例并不对第一钝化层112的具体材料做限定。本发明具体实施例中的第二钝化层115的材料为SiO2或SiN，当然，还可以为SiO2和SiN的复合膜，本发明具体实施例并不对第二钝化层115的具体材料做限定。Preferably, the material of the gate insulating layer 111 in the specific embodiment of the present invention is silicon oxide (SiO2) or silicon nitride (SiN), of course, it can also be a composite film of SiO2 and SiN. The specific material of the pole insulating layer 111 is limited. The material of the first passivation layer 112 in the specific embodiment of the present invention is SiO2 or SiN, certainly, can also be the composite film of SiO2 and SiN, the specific embodiment of the present invention does not limit the specific material of the first passivation layer 112 . The material of the second passivation layer 115 in the specific embodiment of the present invention is SiO2 or SiN, certainly, also can be the composite film of SiO2 and SiN, the specific embodiment of the present invention does not limit the specific material of the second passivation layer 115 .
优选地，如图4所示，本发明具体实施例中的阵列基板包括绝缘设置的第一电极层114和第二电极层116，其中，第一电极层114为像素电极，第二电极层116为公共电极；或，第一电极层114为公共电极，第二电极层116为像素电极。当然，在实际设置中，也可以只设置第一电极层114，不设置第二电极层，第一电极层114也可以直接设置在衬底基板110上。本发明具体实施例中第一电极层114为面电极，第二电极层116为条形电极。Preferably, as shown in FIG. 4 , the array substrate in the specific embodiment of the present invention includes a first electrode layer 114 and a second electrode layer 116 that are insulated, wherein the first electrode layer 114 is a pixel electrode, and the second electrode layer 116 is a common electrode; or, the first electrode layer 114 is a common electrode, and the second electrode layer 116 is a pixel electrode. Of course, in actual settings, only the first electrode layer 114 may be provided without the second electrode layer, and the first electrode layer 114 may also be directly provided on the base substrate 110 . In the specific embodiment of the present invention, the first electrode layer 114 is a surface electrode, and the second electrode layer 116 is a strip electrode.
本发明具体实施例中的第一电极层114的材料为氧化铟锡(ITO)或氧化铟锌(IZO)的单层膜，或为ITO和IZO组成的复合膜，当然，还可以为其它类型的透明导电薄膜，本发明具体实施例并不对第一电极层114的具体材料做限定。本发明具体实施例中的第二电极层116的材料为ITO或IZO的单层膜，或为ITO和IZO组成的复合膜，当然，还可以为其它类型的透明导电薄膜，本发明具体实施例并不对第二电极层116的具体材料做限定。优选地，本发明具体实施例中第一电极层114的材料与第二电极层116的材料相同。The material of the first electrode layer 114 in the specific embodiment of the present invention is a single-layer film of indium tin oxide (ITO) or indium zinc oxide (IZO), or a composite film composed of ITO and IZO, of course, it can also be other types The specific embodiment of the present invention does not limit the specific material of the first electrode layer 114 . The material of the second electrode layer 116 in the specific embodiment of the present invention is the monolayer film of ITO or IZO, or is the composite film that ITO and IZO are formed, certainly, also can be other types of transparent conductive film, the specific embodiment of the present invention The specific material of the second electrode layer 116 is not limited. Preferably, the material of the first electrode layer 114 is the same as that of the second electrode layer 116 in the specific embodiment of the present invention.
本发明具体实施例中的阵列基板还包括设置在衬底基板上的栅极、栅极线、数据线等结构，由于这些结构不涉及本发明具体实施例的改进部分，故这里不做详细说明。The array substrate in the specific embodiment of the present invention also includes structures such as gates, gate lines, and data lines arranged on the base substrate. Since these structures do not involve the improved parts of the specific embodiment of the present invention, they will not be described in detail here. .
如图5所示，本发明具体实施例还提供了一种显示面板，包括相对设置的第一基板21和第二基板22，以及位于第一基板21和第二基板22之间的液晶层13和封框胶14，其中，第一基板21为上面描述的阵列基板。与现有技术的显示面板相比，由于本发明具体实施例中与用于贴合封框胶14的区域对应的区域不设置第二钝化层，因此能够有效的避免在使用过程中外界水汽从粘附性较差的界面处进入显示面板内部，提高显示面板的显示特性，提高显示面板的信赖性。As shown in FIG. 5 , the specific embodiment of the present invention also provides a display panel, including a first substrate 21 and a second substrate 22 oppositely arranged, and a liquid crystal layer 13 between the first substrate 21 and the second substrate 22 And the sealant 14, wherein the first substrate 21 is the array substrate described above. Compared with the display panel of the prior art, since the area corresponding to the area for pasting the sealant 14 in the specific embodiment of the present invention is not provided with a second passivation layer, it can effectively avoid external moisture during use. Enter the interior of the display panel from the interface with poor adhesion, improve the display characteristics of the display panel, and improve the reliability of the display panel.
优选地，本发明具体实施例中的第一基板21为阵列基板，第二基板22为彩膜基板。当然，在实际生产过程中，也可以将彩膜层制作在第一基板21上，本发明具体实施例仅以第一基板21为阵列基板，第二基板22为彩膜基板为例进行介绍。Preferably, the first substrate 21 in the specific embodiment of the present invention is an array substrate, and the second substrate 22 is a color filter substrate. Of course, in the actual production process, the color filter layer can also be fabricated on the first substrate 21 , and the specific embodiment of the present invention is only introduced by taking the first substrate 21 as an array substrate and the second substrate 22 as a color filter substrate as an example.
本发明具体实施例中的显示面板可以为边缘场面内转动(Fringe FieldSwitching，FFS)模式的显示面板，也可以为高级超维场转换(Advanced SuperDimension Switch，ADS)模式的显示面板，也可以为平面方向转换(In-Plane-Switching，IPS)模式的显示面板，也可以为扭曲向列型(TwistedNematic，TN)显示面板。The display panel in the specific embodiment of the present invention can be a display panel in Fringe Field Switching (FFS) mode, or a display panel in Advanced SuperDimension Switching (ADS) mode, or a flat panel. The display panel in In-Plane-Switching (IPS) mode may also be a Twisted Nematic (TN) display panel.
本发明具体实施例还提供一种显示装置，包括上述的显示面板，该显示装置可以为液晶面板、液晶显示器、液晶电视、OLED面板、OLED显示器、OLED电视或电子纸等显示装置。A specific embodiment of the present invention also provides a display device, including the above-mentioned display panel, and the display device may be a display device such as a liquid crystal panel, a liquid crystal display, a liquid crystal television, an OLED panel, an OLED display, an OLED television, or electronic paper.
下面结合附图详细介绍本发明具体实施例提供的阵列基板的制作方法。The manufacturing method of the array substrate provided by the specific embodiment of the present invention will be described in detail below with reference to the accompanying drawings.
如图6所示，本发明具体实施例还提供了一种阵列基板的制作方法，该方法包括：As shown in FIG. 6, a specific embodiment of the present invention also provides a method for manufacturing an array substrate, the method including:
S601、通过构图工艺在衬底基板上依次制作栅极绝缘层、第一钝化层、有机膜层和第二钝化层；S601, sequentially manufacturing a gate insulating layer, a first passivation layer, an organic film layer and a second passivation layer on the base substrate through a patterning process;
S602、通过构图工艺去除预设区域的第二钝化层；或，去除预设区域的第二钝化层和第一钝化层；所述预设区域与用于贴合封框胶的区域对应。S602. Removing the second passivation layer in the predetermined area through a patterning process; or removing the second passivation layer and the first passivation layer in the predetermined area; the predetermined area and the area used for laminating the sealant correspond.
具体地，如图7所示，首先，通过构图工艺在衬底基板110上依次制作栅极绝缘层111、第一钝化层112、有机膜层113和第二钝化层115。本发明具体实施例中的衬底基板110为玻璃基板，或为陶瓷基板等其它类型的基板。优选地，本发明具体实施例中的栅极绝缘层111的材料为SiO或SiN；第一钝化层112的材料为SiO或SiN；第二钝化层115的材料为SiO或SiN，本发明具体实施例并不对栅极绝缘层111、第一钝化层112和第二钝化层115的具体材料做限定。本发明具体实施例中的构图工艺包括：光刻胶的涂覆、曝光、显影、刻蚀以及去除光刻胶的部分或全部过程。本发明具体实施例通过构图工艺在衬底基板110上依次制作栅极绝缘层111、第一钝化层112、有机膜层113和第二钝化层115的具体制作方法与现有技术相同，这里不再赘述。Specifically, as shown in FIG. 7 , firstly, a gate insulating layer 111 , a first passivation layer 112 , an organic film layer 113 and a second passivation layer 115 are formed sequentially on the base substrate 110 through a patterning process. The base substrate 110 in the specific embodiment of the present invention is a glass substrate, or other types of substrates such as a ceramic substrate. Preferably, the material of the gate insulating layer 111 in the specific embodiment of the present invention is SiO or SiN; the material of the first passivation layer 112 is SiO or SiN; the material of the second passivation layer 115 is SiO or SiN, the present invention The specific embodiment does not limit specific materials of the gate insulating layer 111 , the first passivation layer 112 and the second passivation layer 115 . The patterning process in the specific embodiment of the present invention includes: photoresist coating, exposure, development, etching and part or all of the photoresist removal process. In the specific embodiment of the present invention, the specific manufacturing method of sequentially manufacturing the gate insulating layer 111, the first passivation layer 112, the organic film layer 113 and the second passivation layer 115 on the base substrate 110 through a patterning process is the same as that of the prior art. I won't go into details here.
通过构图工艺去除预设区域的第二钝化层，所述预设区域与用于贴合封框胶的区域对应，具体包括：Removing the second passivation layer in the preset area by patterning process, the preset area corresponds to the area used for pasting the sealant, specifically including:
在图7所示的衬底基板上涂覆光刻胶，本发明具体实施例涂覆的光刻胶以正性光刻胶为例说明，对涂覆的光刻胶进行曝光、显影，形成光刻胶保留区和光刻胶去除区，光刻胶去除区对应本发明具体实施例中的预设区域，光刻胶去除区暴露出第二钝化层，接着，对暴露出的第二钝化层进行刻蚀，去除暴露出的第二钝化层，之后，去除剩余光刻胶，形成图2所示的阵列基板。Coating photoresist on the base substrate shown in Figure 7, the photoresist coated in the specific embodiment of the present invention is illustrated by taking positive photoresist as an example, and the coated photoresist is exposed and developed to form The photoresist retention area and the photoresist removal area, the photoresist removal area corresponds to the preset area in the specific embodiment of the present invention, the photoresist removal area exposes the second passivation layer, and then, the exposed second The passivation layer is etched to remove the exposed second passivation layer, and then the remaining photoresist is removed to form the array substrate shown in FIG. 2 .
通过构图工艺去除预设区域的第二钝化层和第一钝化层，所述预设区域与用于贴合封框胶的区域对应，具体包括：Removing the second passivation layer and the first passivation layer in the predetermined area by patterning process, the predetermined area corresponds to the area used for pasting the sealant, specifically including:
在图7所示的衬底基板上涂覆光刻胶，本发明具体实施例涂覆的光刻胶以正性光刻胶为例说明，对涂覆的光刻胶进行曝光、显影，形成光刻胶保留区和光刻胶去除区，光刻胶去除区对应本发明具体实施例中的预设区域，光刻胶去除区暴露出第二钝化层，接着，对暴露出的第二钝化层进行刻蚀，去除暴露出的第二钝化层，暴露出第一钝化层，并接着对暴露出的第一钝化层进行刻蚀，去除暴露出的第一钝化层，之后，去除剩余光刻胶，形成图3所示的阵列基板。Coating photoresist on the base substrate shown in Figure 7, the photoresist coated in the specific embodiment of the present invention is illustrated by taking positive photoresist as an example, and the coated photoresist is exposed and developed to form The photoresist retention area and the photoresist removal area, the photoresist removal area corresponds to the preset area in the specific embodiment of the present invention, the photoresist removal area exposes the second passivation layer, and then, the exposed second etching the passivation layer, removing the exposed second passivation layer, exposing the first passivation layer, and then etching the exposed first passivation layer, removing the exposed first passivation layer, Afterwards, the remaining photoresist is removed to form the array substrate shown in FIG. 3 .
综上所述，本发明具体实施例提供一种阵列基板及其制作方法、显示面板、显示装置，包括设置在衬底基板上的栅极绝缘层、第一钝化层、有机膜层和第二钝化层，其中，第二钝化层设置有镂空区域，所述镂空区域与用于贴合封框胶的区域对应。由于本发明具体实施例中第二钝化层设置有镂空区域，所述镂空区域与用于贴合封框胶的区域对应，与现有技术相比，封框胶并不直接与第二钝化层接触设置，能够有效的避免在使用过程中外界水汽从粘附性较差的界面处进入显示面板内，提高显示面板的显示特性，提高显示面板的信赖性。In summary, specific embodiments of the present invention provide an array substrate and its manufacturing method, a display panel, and a display device, including a gate insulating layer, a first passivation layer, an organic film layer, and a second The second passivation layer, wherein the second passivation layer is provided with a hollowed out area, and the hollowed out area corresponds to the area for pasting the sealant. Since the second passivation layer in the specific embodiment of the present invention is provided with a hollowed-out area, and the hollowed-out area corresponds to the area for bonding the frame sealant, compared with the prior art, the frame sealant is not directly connected to the second passivation layer. The chemical layer contact setting can effectively prevent external water vapor from entering the display panel from the interface with poor adhesion during use, improve the display characteristics of the display panel, and improve the reliability of the display panel.
显然，本领域的技术人员可以对本发明进行各种改动和变型而不脱离本发明的精神和范围。这样，倘若本发明的这些修改和变型属于本发明权利要求及其等同技术的范围之内，则本发明也意图包含这些改动和变型在内。Obviously, those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and equivalent technologies thereof, the present invention also intends to include these modifications and variations.
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510197509.4ACN104932166B (en) | 2015-04-23 | 2015-04-23 | A kind of array base palte and preparation method thereof, display panel, display device |
| Application Number | Priority Date | Filing Date | Title |
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| CN201510197509.4ACN104932166B (en) | 2015-04-23 | 2015-04-23 | A kind of array base palte and preparation method thereof, display panel, display device |
| Publication Number | Publication Date |
|---|---|
| CN104932166Atrue CN104932166A (en) | 2015-09-23 |
| CN104932166B CN104932166B (en) | 2018-04-17 |
| Application Number | Title | Priority Date | Filing Date |
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| CN201510197509.4AActiveCN104932166B (en) | 2015-04-23 | 2015-04-23 | A kind of array base palte and preparation method thereof, display panel, display device |
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|---|---|
| CN (1) | CN104932166B (en) |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105137667A (en)* | 2015-10-16 | 2015-12-09 | 京东方科技集团股份有限公司 | Display device and manufacturing method thereof |
| CN108169964A (en)* | 2018-01-24 | 2018-06-15 | 京东方科技集团股份有限公司 | Encapsulating structure, liquid crystal display panel and the liquid crystal display of liquid crystal display panel |
| CN108428804A (en)* | 2018-04-19 | 2018-08-21 | 武汉华星光电技术有限公司 | Oled display panel and its packaging method |
| CN110018595A (en)* | 2019-04-25 | 2019-07-16 | 厦门天马微电子有限公司 | A kind of display panel and display device |
| CN111308816A (en)* | 2020-02-28 | 2020-06-19 | 重庆京东方光电科技有限公司 | Organic film, array substrate, display panel and display device |
| CN113867053A (en)* | 2020-06-30 | 2021-12-31 | 京东方科技集团股份有限公司 | Display panel and preparation method thereof |
| WO2024011672A1 (en)* | 2022-07-11 | 2024-01-18 | 广州华星光电半导体显示技术有限公司 | Array substrate and liquid crystal display panel |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030103181A1 (en)* | 2001-12-03 | 2003-06-05 | Hitachi, Ltd. | Liquid crystal display device |
| CN1560686A (en)* | 2004-02-24 | 2005-01-05 | 友达光电股份有限公司 | LCD panel |
| US20090141223A1 (en)* | 2007-12-03 | 2009-06-04 | Mitsubishi Electric Corporation | Transflective type liquid crystal display device and manufacturing method thereof |
| CN102033371A (en)* | 2009-09-24 | 2011-04-27 | 北京京东方光电科技有限公司 | Array substrate and manufacturing method thereof |
| CN102854664A (en)* | 2011-06-29 | 2013-01-02 | 奇美电子股份有限公司 | Image display system |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030103181A1 (en)* | 2001-12-03 | 2003-06-05 | Hitachi, Ltd. | Liquid crystal display device |
| CN1560686A (en)* | 2004-02-24 | 2005-01-05 | 友达光电股份有限公司 | LCD panel |
| US20090141223A1 (en)* | 2007-12-03 | 2009-06-04 | Mitsubishi Electric Corporation | Transflective type liquid crystal display device and manufacturing method thereof |
| CN102033371A (en)* | 2009-09-24 | 2011-04-27 | 北京京东方光电科技有限公司 | Array substrate and manufacturing method thereof |
| CN102854664A (en)* | 2011-06-29 | 2013-01-02 | 奇美电子股份有限公司 | Image display system |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105137667A (en)* | 2015-10-16 | 2015-12-09 | 京东方科技集团股份有限公司 | Display device and manufacturing method thereof |
| CN108169964A (en)* | 2018-01-24 | 2018-06-15 | 京东方科技集团股份有限公司 | Encapsulating structure, liquid crystal display panel and the liquid crystal display of liquid crystal display panel |
| CN108428804A (en)* | 2018-04-19 | 2018-08-21 | 武汉华星光电技术有限公司 | Oled display panel and its packaging method |
| US11094911B2 (en) | 2018-04-19 | 2021-08-17 | Wuhan China Star Optoelectronics Technology Co., Ltd. | Organic light emitting diode display panel and packaging method thereof |
| CN110018595A (en)* | 2019-04-25 | 2019-07-16 | 厦门天马微电子有限公司 | A kind of display panel and display device |
| CN110018595B (en)* | 2019-04-25 | 2021-11-12 | 厦门天马微电子有限公司 | Display panel and display device |
| CN111308816A (en)* | 2020-02-28 | 2020-06-19 | 重庆京东方光电科技有限公司 | Organic film, array substrate, display panel and display device |
| CN113867053A (en)* | 2020-06-30 | 2021-12-31 | 京东方科技集团股份有限公司 | Display panel and preparation method thereof |
| CN113867053B (en)* | 2020-06-30 | 2023-05-16 | 京东方科技集团股份有限公司 | Display panel and preparation method thereof |
| WO2024011672A1 (en)* | 2022-07-11 | 2024-01-18 | 广州华星光电半导体显示技术有限公司 | Array substrate and liquid crystal display panel |
| Publication number | Publication date |
|---|---|
| CN104932166B (en) | 2018-04-17 |
| Publication | Publication Date | Title |
|---|---|---|
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