CN104806988A - Integral encapsulation light-emitting module of ACLED (Alternating Current Light Emitting Diode) - Google Patents

Abstract

The invention discloses an integral encapsulation light-emitting module of an ACLED (Alternating Current Light Emitting Diode). The integral encapsulation light-emitting module comprises a substrate; LED (Light Emitting Diode) lamp beads and a driving circuit are encapsulated on the substrate, wherein the LED lamp beads are in series connection and or in parallel connection with each other; the driving circuit comprises an IC (Integrated Circuit) driving chip which is connected with a calibration resistor. According to the integral encapsulation light-emitting module of the ACLED, the LED lamp and the driving circuit are encapsulated on the substrate and accordingly the good heat dissipation effect of the LED lamp beads on the substrate can be achieved and the encapsulation shape of the LED lamp can be changed according to requirements of people, the structure is simple, the manufacturing cost is low, the use is convenient, and the like.

Description

A kind of ACLED overall package light emitting module

Technical field

The present invention relates to lighting field, specifically, relate to a kind of ACLED overall package light emitting module.

Background technology

The use power of LED is in the market very high, and the heat that the thing followed is LED lamp bead also becomes very high, and then cause also can reduce the service life of LED lamp bead thereupon, and the shape of LED of the prior art has significant limitation, usually be simple several shape, not there is good diversity.

For the problem in correlation technique, at present effective solution is not yet proposed.

Summary of the invention

The object of this invention is to provide a kind of ACLED overall package light emitting module, to overcome currently available technology above shortcomings.

The object of the invention is to be achieved through the following technical solutions:

A kind of ACLED overall package light emitting module, comprises substrate, and described substrate is packaged with the LED lamp bead and drive circuit of connecting and/or being connected in parallel, described drive circuit comprises IC driving chip, and described IC driving chip is connected with calibrating resistance.

Further, the power of described LED lamp bead comprises 1W, 3W, 5W, 6W or 9W.

Further, the operating voltage of described LED lamp bead is AC90V ~ 120V or AC185V ~ 260V.

Beneficial effect of the present invention is: by LED and drive circuit being encapsulated on substrate, and then it is good to reach the radiating effect of LED lamp bead on substrate, and the encapsulation shape of LED can be changed according to the demand of people, and use power of the present invention is low, reduce the problem of high energy consumption during use, in addition the present invention also has structure simply, the effects such as cost of manufacture is low, easy to use.

Accompanying drawing explanation

In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.

Fig. 1 is the ACLED overall package light emitting module structure schematic diagram according to the embodiment of the present invention.

In figure:

1 substrate; 2, LED lamp bead; 3, drive circuit; 4, IC driving chip; 5, calibrating resistance; .

Detailed description of the invention

Below in conjunction with the accompanying drawing in the embodiment of the present invention, be clearly and completely described the technical scheme in the embodiment of the present invention, obviously, described embodiment is only the present invention's part embodiment, instead of whole embodiments.Based on the embodiment in the present invention, the every other embodiment that those of ordinary skill in the art obtain, all belongs to the scope of protection of the invention.

As shown in Figure 1, a kind of ACLED overall package light emitting module according to embodiments of the invention, comprise substrate 1, described substrate 1 is packaged with series connection/or the LED lamp bead 2 be connected in parallel and drive circuit 3, described drive circuit 3 comprises IC driving chip 4, and described IC driving chip 4 is connected with calibrating resistance 5.

By on thereon packaged LED lamp pearl 2, the heat of LED lamp bead 2 can well be come out fast, ensure that the service life of LED lamp bead 2.

Further, the power of described LED lamp bead 2 comprises 1W, 3W, 5W, 6W or 9W.

Wherein, the power encapsulating later LED lamp bead 2 is above-mentioned set several, realizes low power effect, reaches the effect reducing energy consumption simultaneously, and then saved the energy.Most importantly the ACLED lamp of above-mentioned several different capacity can be used to combine arbitrarily, with the object of any power and shape that reach design lamps.

Further, the operating voltage of described LED lamp bead 2 is AC90V ~ 120V or AC185V ~ 260V.

In sum, by means of technique scheme of the present invention, by LED and drive circuit being encapsulated on substrate, and then it is good to reach the radiating effect of LED lamp bead on substrate, and the encapsulation shape of LED can be changed according to the demand of people, and use power of the present invention is low, reduce the problem of high energy consumption during use, in addition the present invention also has structure simply, the effects such as cost of manufacture is low, easy to use.

The foregoing is only preferred embodiment of the present invention, not in order to limit the present invention, within the spirit and principles in the present invention all, any amendment done, equivalent replacement, improvement etc., all should be included within protection scope of the present invention.

Claims (3)

1. an ACLED overall package light emitting module, it is characterized in that, comprise substrate (1), described substrate (1) is packaged with the LED lamp bead (2) and drive circuit (3) of connecting and/or being connected in parallel, described drive circuit (3) comprises IC driving chip (4), and described IC driving chip (4) is connected with calibrating resistance (5).

2. ACLED overall package light emitting module according to claim 1, is characterized in that, the power of described LED lamp bead (2) comprises 1W, 3W, 5W, 6W or 9W.

3. ACLED overall package light emitting module according to claim 2, is characterized in that, the operating voltage of described LED lamp bead (2) is AC90V ~ 120V or AC185V ~ 260V.