相关申请案的交叉参考Cross References to Related Applications
本申请案为2013年12月16日申请的标题为“具有光致发光波长转换的固态发光装置及标牌(“Solid-State Light Emitting Devices and Signage with PhotoluminescenceWavelength Conversion)”的第14/108,163号美国专利申请案的部分接续，所述美国专利申请案为2011年10月4日申请的标题为“具有光致发光波长转换的固态发光装置及标牌(Solid-State Light Emitting Devices and Signage with Photoluminescence WavelengthConversion)”的第13/253,031号美国专利申请案(现颁布为第8,610,340号美国专利)的接续，所述美国专利申请案主张2010年10月5日申请的标题为“具有光致发光波长转换的固态发光装置及标牌(Solid-State Light Emitting Devices and Signage withPhotoluminescence Wavelength Conversion)”的第61/390,091号美国临时专利申请案的优先权益且主张2010年12月27日申请的标题为“具有远程磷光体波长转换组件的固态发光装置(Solid-State Light Emitting Devices with Remote Phosphor WavelengthConversion Component)”的第61/427,411号美国临时专利申请案的优先权益，所有这些申请案特此以全文引用的并入。This application is U.S. Patent No. 14/108,163, filed December 16, 2013, entitled "Solid-State Light Emitting Devices and Signage with Photoluminescence Wavelength Conversion" A partial continuation of the application, said U.S. patent application filed on October 4, 2011, entitled "Solid-State Light Emitting Devices and Signage with Photoluminescence Wavelength Conversion" The continuation of U.S. Patent Application No. 13/253,031 (now issued as U.S. Patent No. 8,610,340), which asserts the title of "Solid State Light Emitting with Photoluminescence Wavelength Conversion" filed on October 5, 2010 Priority benefit of U.S. Provisional Patent Application No. 61/390,091 for Solid-State Light Emitting Devices and Signage with Photoluminescence Wavelength Conversion" and asserting the title of the December 27, 2010 application entitled "Having Remote Phosphor Wavelength Conversion Priority benefit of U.S. Provisional Patent Application No. 61/427,411 for Solid-State Light Emitting Devices with Remote Phosphor Wavelength Conversion Component (Solid-State Light Emitting Devices with Remote Phosphor Wavelength Conversion Component), all of which are hereby incorporated by reference in their entirety.
技术领域technical field
本发明的实施例涉及固态发光装置，其使用光致发光波长转换以将由固态发光体(通常为LED(发光二极管))产生的光转换为所需色彩的光。Embodiments of the invention relate to solid state light emitting devices that use photoluminescence wavelength conversion to convert light generated by solid state light emitters, typically LEDs (light emitting diodes), into light of a desired color.
背景技术Background technique
白色发光LED(“白色LED”)在此项技术是已知的且是相对较新近的创新。归因于其长操作寿命预期值(>50,000小时)及高发光效率(每瓦特70流明及更高)，越来越多地使用高亮度白色LED来替代常规荧光光源、小型荧光光源及白炽光源。White emitting LEDs ("white LEDs") are known in the art and are a relatively recent innovation. Due to their long operating life expectancy (>50,000 hours) and high luminous efficiency (70 lumens per watt and higher), high-brightness white LEDs are increasingly used to replace conventional fluorescent, compact fluorescent and incandescent light sources .
直到开发出在电磁光谱的蓝色/紫外线部分中发射的LED，开发基于LED的白光源才变得实际。如在例如第5,998,925号美国专利中所教示，白色LED包含一或多种光致发光材料(例如，磷光体材料)，其吸收由所述LED发射的一部分辐射，且重新发射不同色彩(波长)的辐射。通常，LED芯片或裸片产生蓝光，且所述磷光体吸收一定百分比的蓝光，且重新发射黄光或绿光及红光、绿光及黄光、绿光及橙光或黄光及红光的组合。由所述LED产生的未被所述磷光体吸收的蓝光部分与由所述磷光体发射的光组合，提供对于人眼呈现为接近白色的光。It was not practical to develop LED-based white light sources until LEDs were developed that emit in the blue/ultraviolet portion of the electromagnetic spectrum. As taught, for example, in U.S. Patent No. 5,998,925, white LEDs contain one or more photoluminescent materials (e.g., phosphor materials) that absorb a portion of the radiation emitted by the LED and re-emit a different color (wavelength) radiation. Typically, the LED chip or die produces blue light and the phosphor absorbs a percentage of the blue light and re-emits yellow or green and red, green and yellow, green and orange or yellow and red The combination. The portion of the blue light produced by the LED that is not absorbed by the phosphor combines with the light emitted by the phosphor to provide light that appears nearly white to the human eye.
由所述LED光产生的确切色彩在很大程度上取决于由所述磷光体材料发射的光的量，这是因为所述磷光体发射的光的量(及波长)及残余的蓝光的量(及波长)的组合决定所得光的色彩。因此，用来产生白光的基于磷光体的LED装置将需要足够量的磷光体以正确运作，因为不具有足够量的磷光体材料的所述基于磷光体的LED装置将无法产生呈现为白色的光。The exact color produced by the LED light is largely dependent on the amount of light emitted by the phosphor material because the amount (and wavelength) of light emitted by the phosphor and the amount of residual blue light The combination of these (and wavelengths) determines the color of the resulting light. Accordingly, a phosphor-based LED device used to produce white light will require a sufficient amount of phosphor to function properly, as such a phosphor-based LED device without a sufficient amount of phosphor material will not be able to produce light that appears white .
问题在于磷光体材料相对昂贵，且因此对应于生产基于磷光体的LED装置的成本的主要部分。通常，在LED灯中的磷光体材料与光透射材料(例如硅酮或环氧树脂材料)混合，且所述混合物直接施覆到LED裸片的发光表面。这导致直接置于LED裸片上的磷光体材料的较小占据面积层，但其在生产上仍然昂贵，且这部分是因为所述磷光体材料的高昂成本。The problem is that phosphor materials are relatively expensive and thus represent a major part of the cost of producing phosphor-based LED devices. Typically, the phosphor material in an LED lamp is mixed with a light transmissive material, such as a silicone or epoxy material, and the mixture is applied directly to the light emitting surface of the LED die. This results in a smaller footprint layer of phosphor material placed directly on the LED die, but it is still expensive to produce, and this is partly because of the high cost of the phosphor material.
如颁予Li的美国专利申请案US 2008/0218992 A1号中所揭示，还已知将磷光体材料提供为光学组件上的层，或将磷光体材料合并在光学组件内，所述光学组件在物理上位于LED裸片远程。这通常导致具有比前述段落中描述的方法大很多的占据面积的一层磷光体材料。因为其较大大小，通常需要更大量的磷光体以制造此类“远程磷光体”LED装置。因此，为提供此类远程磷光体LED装置所需要的增加量的磷光体材料的成本也相应更大。例如，第7,937,865号美国专利教示固态发光标志，其中来自LED的蓝光用于激发发光标牌表面上的磷光体材料，以产生所需色彩的光。通常必须存在大量磷光体材料才能装填所述发光标牌的宽阔表面，以使所述装置针对其所欲光功能性而产生适当色彩。It is also known to provide a phosphor material as a layer on an optical component, or to incorporate a phosphor material within an optical component, as disclosed in US Patent Application No. US 2008/0218992 A1 to Li, which is in Physically located remotely from the LED die. This typically results in a layer of phosphor material with a much larger footprint than the approach described in the preceding paragraph. Because of their larger size, generally larger quantities of phosphor are required to make such "remote phosphor" LED devices. Accordingly, the cost of the increased amount of phosphor material required to provide such remote phosphor LED devices is correspondingly greater. For example, US Patent No. 7,937,865 teaches solid state light emitting signs in which blue light from an LED is used to excite a phosphor material on the surface of the light emitting sign to produce light of a desired color. Typically a substantial amount of phosphor material must be present to fill the expansive surface of the lighted sign in order for the device to produce the proper color for its intended light functionality.
因此，需要实施LED照明装备的改进方法，其维持装置的所需色彩性质，但不需要使用在现有方法中需要的大量光致发光材料(例如，磷光体材料)。Accordingly, there is a need for improved methods of implementing LED lighting fixtures that maintain the desired color properties of the devices, but do not require the use of large quantities of photoluminescent materials (eg, phosphor materials) that are required in existing methods.
本发明的一些实施例的目的是提供发光装置、发光标志、光致发光波长转换组件及光致发光标牌表面，其至少部分克服已知装置的限制。It is an object of some embodiments of the present invention to provide light emitting devices, light emitting signs, photoluminescent wavelength conversion components, and photoluminescent signage surfaces that at least partially overcome the limitations of known devices.
发明内容Contents of the invention
本发明的实施例涉及固态发光装置，其包括固态发光体(通常为LED)阵列，其可操作以产生激发光(通常为蓝色)，所述激发光用于激发光致发光波长转换组件，所述光致发光波长转换组件含有可激发蓝光的光致发光(例如，磷光体材料)的颗粒与光反射材料(本文中还称为“光散射材料”)的颗粒的混合物。将光反射材料的颗粒与磷光体材料合并可增加磷光体材料的光致发光的光产生。据信增加的光致发光的光产生源自光反射材料增加光子与磷光体材料的颗粒的碰撞的可能性。在一些实施例中，包含所述光反射材料可针对给定发射产物色彩及强度潜在地将磷光体材料的使用减小33％且最多减少50％。Embodiments of the invention relate to solid state light emitting devices comprising an array of solid state light emitters (typically LEDs) operable to generate excitation light (typically blue) for exciting a photoluminescent wavelength conversion component, The photoluminescent wavelength conversion component contains a mixture of particles of photoluminescent (eg, phosphor material) that can excite blue light and particles of light reflective material (also referred to herein as "light scattering material"). Combining particles of light reflective material with a phosphor material can increase the photoluminescent light production of the phosphor material. It is believed that the increased photoluminescent light production results from the light reflective material increasing the probability of photon collisions with the particles of the phosphor material. In some embodiments, the inclusion of the light reflective material can potentially reduce phosphor material usage by 33% and up to 50% for a given emission product color and intensity.
根据一实施例的一个方面，一种发光装置包括：光透射电路板；第一固态发光体阵列，其安装在所述光透射电路板的第一面上且电连接到所述光透射电路板的第一面；及光致发光波长转换组件，其包括至少一种光致发光材料的颗粒与光反射材料的颗粒的混合物。将固态发光体安装在光透射电路板的优点为：这实现了从所述电路板的正面及后面以及电路板的边缘的光发射，使得所述装置具有大致上全向发射特性。此发射特性对于希望用于替代白炽灯泡的装置是合意的。在一些方面中，所述装置进一步包括第二固态发光体阵列，其安装在光透射电路板的第二面上且电连接到光透射电路板的第二面。通常，发光体安装在电路板的相对面上且经定向成其主发射方向在相反方向上。According to an aspect of an embodiment, a light emitting device includes: a light-transmitting circuit board; a first solid-state light emitter array mounted on a first surface of the light-transmitting circuit board and electrically connected to the light-transmitting circuit board and a photoluminescent wavelength conversion component comprising a mixture of particles of at least one photoluminescent material and particles of a light reflective material. An advantage of mounting the solid state light emitter on a light transmissive circuit board is that this enables light emission from the front and back of the circuit board as well as the edges of the circuit board, giving the device a substantially omnidirectional emission characteristic. This emission characteristic is desirable for devices intended to replace incandescent light bulbs. In some aspects, the device further includes a second array of solid state light emitters mounted on and electrically connected to the second side of the light-transmissive circuit board. Typically, the luminaires are mounted on opposite sides of the circuit board and oriented with their main emission directions in opposite directions.
为辅助消散由发光体阵列产生的热量，光透射电路板宜额外具有导热性。所述导热电路板是尤其有利的，其中波长转换组件包括直接施覆到且覆盖所述发光体阵列或每一发光体的至少一种光致发光及光散射材料的囊封剂。为增加机械强度，所述电路板可包括具有其上安装发光体的导热光透射层的层压结构，其支撑在光透射层上。在一些实施例中，光透射电路板的至少一部分包括透光性氧化镁、蓝宝石、氧化铝、石英玻璃、氮化铝或金刚石。除消散由发光体产生的热量之外，所述电路板还用于提供电力以操作发光体。在一些实施例中，衬底进一步包括由提供在衬底的面上的导电轨的图案组成的电路。举例来说，此类轨可由铜、金、银或其它良好导电材料组成。在其它实施例中设想导电轨包括光透射导电材料，例如氧化铟锡(ITO)或类似物。To assist in dissipating heat generated by the array of light emitters, the light transmissive circuit board is additionally thermally conductive. The thermally conductive circuit board is particularly advantageous wherein the wavelength converting component comprises an encapsulant of at least one photoluminescent and light scattering material applied directly to and covering the or each light emitter array. For increased mechanical strength, the circuit board may comprise a laminated structure with a thermally conductive light-transmissive layer on which the luminous body is mounted, supported on the light-transmissive layer. In some embodiments, at least a portion of the light-transmissive circuit board includes light-transmissive magnesium oxide, sapphire, aluminum oxide, quartz glass, aluminum nitride, or diamond. In addition to dissipating the heat generated by the lights, the circuit board is also used to provide electrical power to operate the lights. In some embodiments, the substrate further includes a circuit consisting of a pattern of conductive tracks provided on a face of the substrate. For example, such rails may be composed of copper, gold, silver, or other good conductive materials. In other embodiments it is contemplated that the conductive tracks comprise a light transmissive conductive material such as indium tin oxide (ITO) or the like.
光致发光组件可包括施覆到所述固体发光体阵列或每一固态发光体的光致发光材料与光反射材料的颗粒的混合物。通常，在此类布置中，光致发光组件呈覆盖固态发光体阵列的囊封剂的形式。The photoluminescent component may comprise a mixture of photoluminescent material and particles of light reflective material applied to the or each solid state light emitter array. Typically, in such arrangements, the photoluminescent component is in the form of an encapsulant covering the array of solid state light emitters.
在其它实施例中且为减少从发光体阵列到磷光体材料的热传递，光致发光组件与固态发光体阵列或每一固态发光体分离且位于固态发光体阵列或每一固态发光体远程。在本申请案中，“远程”及“远程地”表示通过(例如)空气间隙或光透射介质而在物理上分离。其与其中波长转换组件为装置的整体部分且磷光体材料与固态发光体直接接触的布置形成对比。在远程磷光体布置中，磷光体材料分布在比发光体阵列的发光表面的面积大得多的面积上。此布置确保色彩更均匀的光产生。将所述磷光体材料与所述固态发射体分离减少到所述磷光体材料的热传递，且减小所述磷光体材料的热降解，波长转换组件的表面有利地可定位于距所述固态发光体阵列至少5mm的距离处。在此类方面中，波长转换组件可包括其上光致发光材料与光反射材料的混合物提供为至少一个层的光透射衬底。在另一布置中，所述波长转换组件包括具有遍及其体积而均匀地分布的磷光体与光反射材料的混合物的光透射衬底。优选地，所述光透射衬底包括热塑性材料，所述热塑性材料包含聚碳酸酯、丙烯酸、PVC(聚氯乙烯)、尼龙、HDPE(高密度聚丙烯)、聚乙烯、PET(聚对苯二甲酸乙酯)或POM(聚甲醛)。或者，其可包括环氧树脂、硅酮或玻璃。在一些实施例中，光致发光组件包括实质上圆柱形管，其中发光体阵列沿着组件的轴定位。此组件优选地通过注射模制的挤出制造。在磷光体与光反射材料的混合物由一层组成的情况下，可通过丝网印刷将所述混合物施覆到衬底的表面。或者，可通过喷墨印刷、旋涂或刮刀涂覆(dotor blading)将所述混合物沉积在衬底上。当所述组件通过挤出制造时，可共同挤出磷光体/光反射材料。In other embodiments and to reduce heat transfer from the light emitter array to the phosphor material, the photoluminescent assembly is separate from and remotely located from the or each solid state light emitter array. In this application, "remote" and "remotely" mean physically separated by, for example, an air gap or a light transmissive medium. This is in contrast to arrangements where the wavelength converting component is an integral part of the device and the phosphor material is in direct contact with the solid state light emitter. In remote phosphor arrangements, the phosphor material is distributed over an area much larger than the area of the emitting surface of the emitter array. This arrangement ensures a more uniformly colored light production. Separating the phosphor material from the solid state emitter reduces heat transfer to the phosphor material and reduces thermal degradation of the phosphor material, the surface of the wavelength conversion component may advantageously be positioned at a distance from the solid state emitter. At least 5mm distance from the illuminant array. In such aspects, the wavelength conversion component can include a light transmissive substrate on which a mixture of photoluminescent material and light reflective material is provided as at least one layer. In another arrangement, the wavelength conversion component comprises a light transmissive substrate having a mixture of phosphor and light reflective material uniformly distributed throughout its volume. Preferably, the light transmissive substrate comprises a thermoplastic material comprising polycarbonate, acrylic, PVC (polyvinyl chloride), nylon, HDPE (high density polypropylene), polyethylene, PET (polyterephthalmic ethyl formate) or POM (polyoxymethylene). Alternatively, it may comprise epoxy, silicone or glass. In some embodiments, the photoluminescent assembly comprises a substantially cylindrical tube with the array of light emitters positioned along the axis of the assembly. This component is preferably produced by extrusion by injection moulding. In the case where the mixture of phosphor and light reflective material consists of one layer, the mixture can be applied to the surface of the substrate by screen printing. Alternatively, the mixture can be deposited on the substrate by inkjet printing, spin coating or doctor blading. When the assembly is manufactured by extrusion, the phosphor/light reflective material can be co-extruded.
在一些实施例中，用在所述波长转换组件内的光反射/散射材料具有经选择使得比起所述颗粒将散射由所述磷光体材料产生的较短波长光，其将散射相对更多的较长波长蓝色激发光的粒度。例如，所述光反射颗粒大小可经选择使得比起所述颗粒将散射由所述至少一个磷光体材料产生的光，其将散射相对至少两倍的蓝光。这确保将散射从所述波长转换层发射的更高比例的蓝光，从而增加光子与磷光体材料颗粒交互的可能性，且导致产生光致发光的光。同时，磷光体产生的光可通过而被散射的可能性较低。光反射材料的颗粒相对于光致发光产生的光散射激发光的程度取决于颗粒大小。举例来说，在激发光包括蓝光且光致发光包括黄绿光的情况下，光反射材料有利地具有在0.01μm到10μm范围中的颗粒大小。更优选地，光反射材料具有在0.01μm到0.1μm且更优选地在0.1μm到1μm的范围中的颗粒大小。In some embodiments, the light reflective/scattering material used within the wavelength conversion component has a material selected such that it will scatter relatively more light of shorter wavelengths than the particles will scatter shorter wavelength light produced by the phosphor material. The particle size of the longer wavelength blue excitation light. For example, the light reflective particle size may be selected such that it will scatter relatively at least twice as much blue light as the particle will scatter light generated by the at least one phosphor material. This ensures that a higher proportion of the blue light emitted from the wavelength converting layer will be scattered, increasing the likelihood of photons interacting with the phosphor material particles and resulting in photoluminescent light. At the same time, the light generated by the phosphor can pass through and is less likely to be scattered. The degree to which particles of light reflective material scatter excitation light relative to photoluminescence-generated light depends on particle size. For example, where the excitation light comprises blue light and the photoluminescence comprises yellow-green light, the light reflective material advantageously has a particle size in the range of 0.01 μm to 10 μm. More preferably, the light reflective material has a particle size in the range of 0.01 μm to 0.1 μm and more preferably in the range of 0.1 μm to 1 μm.
优选地，光反射材料对至少一种光致发光材料的重量百分比装载在0.01％到10％；0.01％到1％；0.1％到1％及0.5％到1％的范围中。Preferably, the weight percent loading of light reflective material to at least one photoluminescent material is in the range of 0.01% to 10%; 0.01% to 1%; 0.1% to 1% and 0.5% to 1%.
一些实施例中的磷光体材料优选地具有在从2μm到60μm的范围中且通常在10μm到20μm的范围中的颗粒大小。据信在一些实施例中，所述光反射材料的颗粒大小优选小于所述磷光体材料的颗粒大小至少10倍是有利的。The phosphor material in some embodiments preferably has a particle size in the range from 2 μm to 60 μm and typically in the range 10 μm to 20 μm. It is believed that in some embodiments it is advantageous that the particle size of the light reflective material is preferably at least 10 times smaller than the particle size of the phosphor material.
为改善波长转换组件在“关断状态”中的视觉外观，发光装置可进一步包括邻近于光致发光波长转换组件的光扩散层。光扩散层通常定位在观察者与光致发光波长转换材料之间。如同与磷光体合并的光反射颗粒，光扩散层可包括光反射材料的颗粒，所述颗粒具有的粒度使得比起所述颗粒反射由至少一种光致发光材料产生的光，其散射相对更多的由固态发光体产生的激励光。在此类实施例中，光反射材料具有在100nm到150nm范围中的颗粒大小。To improve the visual appearance of the wavelength converting component in the "off state", the light emitting device may further comprise a light diffusing layer adjacent to the photoluminescent wavelength converting component. A light diffusing layer is typically positioned between the viewer and the photoluminescent wavelength converting material. Like the light reflective particles incorporated with the phosphor, the light diffusing layer may comprise particles of light reflective material having a particle size such that they scatter relatively more light than the particles reflect light generated by the at least one photoluminescent material. Most of the excitation light produced by solid state light emitters. In such embodiments, the light reflective material has a particle size in the range of 100 nm to 150 nm.
在一些实施例中，所述固态发光体包括LED，所述LED可操作以产生具有在440nm到480nm的波长范围中的峰值波长的蓝光。或者，所述固态发光体可包括激光器或激光二极管。In some embodiments, the solid state light emitter comprises an LED operable to generate blue light having a peak wavelength in the wavelength range of 440nm to 480nm. Alternatively, the solid state light emitters may comprise lasers or laser diodes.
附图说明Description of drawings
为更充分理解本发明，现将参考附图仅作为实例而描述根据本发明的实施例的固态发光装置及标志，在附图中：For a fuller understanding of the present invention, solid state light emitting devices and signs according to embodiments of the present invention will now be described, by way of example only, with reference to the accompanying drawings, in which:
图1为根据本发明的实施例的基于LED的发光装置的示意性表示；Figure 1 is a schematic representation of an LED-based lighting device according to an embodiment of the invention;
图2为说明已知发光装置的操作原理的示意图；2 is a schematic diagram illustrating the operating principle of a known light emitting device;
图3为说明图1的发光装置的操作原理的示意图；3 is a schematic diagram illustrating the operating principle of the light emitting device of FIG. 1;
图4为根据本发明的基于LED的发光装置对于不同重量百分比装载的光反射材料的发射强度对色度(chromaticity)CIE x的标绘图(plot)；4 is a plot of emission intensity versus chromaticity (chromaticity) CIE x for light-reflecting materials loaded with different weight percentages of an LED-based light-emitting device according to the present invention;
图5为根据本发明的替代实施例的基于LED的发光装置的示意性表示；Figure 5 is a schematic representation of an LED-based lighting device according to an alternative embodiment of the present invention;
图6为根据本发明的另一实施例的基于LED的发光装置的示意性表示；Figure 6 is a schematic representation of an LED-based lighting device according to another embodiment of the present invention;
图7为根据本发明的进一步实施例的基于LED的发光装置的示意性表示；Figure 7 is a schematic representation of an LED-based lighting device according to a further embodiment of the invention;
图8为说明图7的发光装置的操作原理的示意图；8 is a schematic diagram illustrating the operating principle of the light emitting device of FIG. 7;
图9为根据本发明的实施例的磷光体波长转换组件的示意图；9 is a schematic diagram of a phosphor wavelength conversion assembly according to an embodiment of the present invention;
图10为根据本发明的另一实施例的磷光体波长转换组件的示意图；10 is a schematic diagram of a phosphor wavelength conversion assembly according to another embodiment of the present invention;
图11展示红光、绿光及蓝光的相对光散射对于光衍射颗粒大小(nm)的标绘图；Figure 11 shows a plot of relative light scattering versus light diffraction particle size (nm) for red, green, and blue light;
图12说明根据本发明的进一步实施例的基于LED的发光装置；Figure 12 illustrates an LED-based lighting device according to a further embodiment of the invention;
图13说明根据本发明的进一步实施例的图12的基于LED的发光装置的横截面图；13 illustrates a cross-sectional view of the LED-based lighting device of FIG. 12 according to a further embodiment of the present invention;
图14说明根据本发明的另一实施例的全向基于LED的发光装置的示意横截面A-A侧视图及部分剖视平面图；14 illustrates a schematic cross-sectional A-A side view and partially cut-away plan view of an omnidirectional LED-based lighting device according to another embodiment of the present invention;
图15a及15b分别说明利用图14的发光装置的基于LED的灯泡的部分横截面B-B侧视图及平面图；15a and 15b illustrate partial cross-sectional B-B side and plan views, respectively, of an LED-based light bulb utilizing the light emitting device of FIG. 14;
图16a及16b分别说明利用图14的发光装置的基于LED的灯泡的部分横截面C-C侧视图及平面图；16a and 16b illustrate partial cross-section C-C side and plan views, respectively, of an LED-based light bulb utilizing the light emitting device of FIG. 14;
图17a、17b及17c分别说明利用图14的发光装置的基于LED的灯泡的部分横截面D-D侧视图、部分横截面E-E侧视图及平面图；17a, 17b, and 17c illustrate, respectively, a partial cross-section D-D side view, a partial cross-section E-E side view, and a plan view of an LED-based light bulb utilizing the light emitting device of FIG. 14;
图18说明根据本发明的另一实施例的全向基于LED的发光装置的示意横截面F-F侧视图及部分剖视平面图；Figure 18 illustrates a schematic cross-sectional F-F side view and partial cutaway plan view of an omnidirectional LED-based lighting device according to another embodiment of the present invention;
图19a及19b分别展示利用图19的发光引擎的根据本发明的另一实施例的全向基于LED的发光装置的分解透视图及横截面G-G视图；19a and 19b show an exploded perspective view and a cross-sectional G-G view, respectively, of an omnidirectional LED-based lighting device according to another embodiment of the invention utilizing the light engine of FIG. 19;
图20说明基于LED的光引擎的示意侧视图及平面图；以及Figure 20 illustrates a schematic side view and plan view of an LED-based light engine; and
图21为利用图19a及19b的发光装置的基于LED的灯泡的部分横截面图。Figure 21 is a partial cross-sectional view of an LED-based light bulb utilizing the light emitting device of Figures 19a and 19b.
具体实施方式Detailed ways
本发明的实施例是针对包括多个固态发光体(通常为LED)的固态发光装置，所述多个固态发光体可操作以产生激发光(通常为蓝光)，其用于激发含有光致发光材料(例如可激发蓝光的磷光体材料)的颗粒的波长转换组件。此外，所述波长转换组件包括以混合物的形式与所述磷光体材料合并的光反射材料(在本文中还称为“光散射材料”)的颗粒，以增强由所述磷光体材料进行的光致发光的光产生。据信增强的光产生源自(result from)所述光反射材料增加激发光子与所述磷光体材料的颗粒碰撞的数目。最终结果是减少用于具有所选择的发射色彩的发光装置的磷光体材料使用。Embodiments of the present invention are directed to solid state light emitting devices comprising a plurality of solid state light emitters (typically LEDs) operable to generate excitation light (typically blue light) for exciting photoluminescent light-containing A wavelength converting component of particles of material, such as a phosphor material that excites blue light. In addition, the wavelength conversion component includes particles of light reflective material (also referred to herein as "light scattering material") combined with the phosphor material in admixture to enhance light transmission by the phosphor material. Luminescent light is produced. It is believed that enhanced light production results from the light reflective material increasing the number of excitation photons colliding with particles of the phosphor material. The end result is reduced phosphor material usage for the light emitting device with the selected emission color.
仅出于说明目的，参考具体体现为磷光体材料的光致发光材料进行以下描述。然而，本发明可适用于任何类型的光致发光材料，例如磷光体材料或量子点。量子点是物质(例如，半导体)的一部分，其激发子被限制在所有三个空间维度中，所述激发子可由辐射能量激发以发射特定波长或波长范围的光。因而，除非主张基于磷光体的波长转换组件，否则本发明并不限于基于磷光体的波长转换组件。此外，在本专利说明书中，相同参考数字用于指示相同部分。For purposes of illustration only, the following description is made with reference to photoluminescent materials embodied as phosphor materials. However, the invention is applicable to any type of photoluminescent material, such as phosphor materials or quantum dots. A quantum dot is a portion of matter (eg, a semiconductor) whose excitons, which can be excited by radiant energy to emit light at a specific wavelength or range of wavelengths, are confined in all three spatial dimensions. Thus, the present invention is not limited to phosphor-based wavelength conversion components unless phosphor-based wavelength conversion components are claimed. Also, in this patent specification, the same reference numerals are used to designate the same parts.
图1展示根据本发明的实施例的基于LED的白色发光装置10的示意性表示。装置10包括蓝色发光LED 12及位于所述LED远程的光致发光波长转换组件14。如所展示，波长转换组件14可包括光透射窗(衬底)16，其在至少一个面上具有磷光体转换层18。磷光体转换层18包括可激发蓝光的磷光体材料20的颗粒、光反射材料22的颗粒与光透射粘合剂材料24的混合物。光透射窗16可包括任何光透射材料，例如聚合物材料，例如，聚碳酸酯、丙烯酸、硅酮或环氧树脂或玻璃(例如石英玻璃)。通常，为了容易制造，光透射窗16是平面的，通常为圆盘形的形状，但其可取决于所要应用而为正方形、矩形或其它形状。在所述光透射窗在一些实施例中是圆盘形的情况下，直径可在约1cm与10cm之间，其是面积在0.8cm2与80cm2之间的光学孔径。在替代实施例中，设想光透射窗16包括以所选择的方向引导光的光学组件，例如凸透镜或凹透镜。为减少从LED 12到波长转换组件14的热传递，尤其到所述磷光体材料的热传递，所述波长转换组件位于所述LED远程，物理上分离至少5mm的距离L。本发明的实施例涉及其中在所述LED远程提供所述波长转换组件及(更重要地)所述磷光体材料的装置，以减少从所述发光体到所述磷光体材料的热传递。在本申请案的上下文中，远程表示例如以空气间隙或光透射介质而在物理上分离。将了解，在远程磷光体装置中，所述磷光体材料分布在比所述LED的所述发光表面的面积(例如，0.03cm2)大很多的面积上(例如，0.8cm2到80cm2)。通常，所述磷光体材料分布在所述LED的发光面积的至少五十倍(通常至少100倍)的面积上。Figure 1 shows a schematic representation of an LED-based white light emitting device 10 according to an embodiment of the invention. Device 10 includes a blue emitting LED 12 and a photoluminescent wavelength conversion component 14 remotely located from the LED. As shown, the wavelength converting component 14 may include a light transmissive window (substrate) 16 having a phosphor converting layer 18 on at least one face. Phosphor conversion layer 18 includes a mixture of particles of blue light excitable phosphor material 20 , particles of light reflective material 22 and light transmissive binder material 24 . The light transmissive window 16 may comprise any light transmissive material, such as a polymeric material such as polycarbonate, acrylic, silicone or epoxy, or glass (eg quartz glass). Typically, for ease of manufacture, the light transmissive window 16 is planar, generally disc-shaped in shape, but it may be square, rectangular or other shape depending on the desired application. Where the light transmissive window is disc-shaped in some embodiments, the diameter may be between about 1 cm and 10 cm, which is an optical aperture with an area between 0.8 cm2 and 80 cm2 . In alternative embodiments, it is contemplated that the light transmissive window 16 includes an optical component, such as a convex or concave lens, that directs light in a selected direction. To reduce heat transfer from the LED 12 to the wavelength conversion component 14, particularly to the phosphor material, the wavelength conversion component is located remotely from the LED, physically separated by a distance L of at least 5mm. Embodiments of the invention relate to devices in which the wavelength conversion component and (more importantly) the phosphor material are provided remotely from the LED to reduce heat transfer from the light emitter to the phosphor material. In the context of this application, remote means physically separated, for example by an air gap or a light-transmitting medium. It will be appreciated that in a remote phosphor arrangementthe phosphor material is distributed over an area much larger (eg 0.8 cm to 80 cm2 ) than the area of the light emitting surface of the LED (eg 0.03 cm2 ). . Typically, the phosphor material is distributed over an area that is at least fifty times (typically at least 100 times) the light emitting area of the LED.
蓝色LED 12可包括基于GaN(基于氮化镓)的LED，其可操作以产生具有在440nm到480nm的波长范围中(通常为465nm)的峰值波长λ1的蓝光26。蓝色LED 12经配置以用蓝色激发光26照射波长转换组件14，由磷光体材料20吸收一定比例，且作为响应而发射不同波长λ2的光28，通常对于冷白色发光装置为黄-绿色。装置10的发射产物30(其经配置以呈现为白色)包括由LED发射的光26与由磷光体材料20产生的光28的组合。Blue LED 12 may comprise a GaN-based (gallium nitride-based) LED operable to generate blue light26 having a peak wavelength λ1 in the wavelength range of 440 nm to 480 nm, typically 465 nm. The blue LED 12 is configured to illuminate the wavelength conversion component 14 with blue excitation light 26, which is absorbed in proportion by the phosphor material 20, and in response emits light28 of a different wavelength λ, typically yellow- green. Emission product 30 of device 10 , which is configured to appear white, includes a combination of light 26 emitted by the LED and light 28 generated by phosphor material 20 .
磷光体材料20及光反射材料22(其呈粉末形式)按已知比例与光透射粘合剂材料24彻底混合，光透射粘合剂材料24例如为聚合物材料(例如，热可固化或UV可固化硅酮或环氧树脂材料)，或透明墨水，例如UV可固化石版透明罩印PSLC-294。所述混合物作为具有均匀厚度的一或多个层而施覆到窗16的面。在优选实施例中，所述混合物通过丝网印刷而施覆到所述光透射窗，且所述层的厚度t通过印刷次数而控制。如将对于所属领域的技术人员显而易见，所述磷光体/反射材料的混合物可使用其它方法施覆，包含喷墨印刷、旋涂，或使用刮刀(例如刮板)将所述混合物横扫于所述表面上(例如，刮刀涂敷)。The phosphor material 20 and light reflective material 22 (which is in powder form) are thoroughly mixed in known proportions with a light transmissive adhesive material 24, such as a polymeric material (e.g., heat curable or UV curable silicone or epoxy materials), or transparent inks such as UV curable lithographic transparent overprint PSLC-294. The mixture is applied to the face of the window 16 as one or more layers of uniform thickness. In a preferred embodiment, the mixture is applied to the light transmissive window by screen printing, and the thickness t of the layer is controlled by the number of printings. As will be apparent to those skilled in the art, the phosphor/reflective material mixture can be applied using other methods, including inkjet printing, spin coating, or using a doctor blade (such as a squeegee) to sweep the mixture over the On the surface (eg, doctor blade coating).
在进一步实施例中，设想将磷光体与光反射材料的混合物在所述光透射窗内合并。例如，所述磷光体与光反射材料混合物可与光透射聚合物混合，且所述聚合物/磷光体混合物被挤出或注射模制，以形成具有遍及所述组件的体积而均匀地分布的所述磷光体及光反射材料的波长转换组件14。In a further embodiment, it is envisaged to incorporate a mixture of phosphor and light reflective material within said light transmissive window. For example, the phosphor and light reflective material mixture can be mixed with a light transmissive polymer and the polymer/phosphor mixture extruded or injection molded to form a The wavelength conversion component 14 of the phosphor and light reflective material.
使所述磷光体材料位于所述LED远处提供许多优点，例如减少所述磷光体材料的热降解。此外，对比于其中所述磷光体材料直接接触所述LED裸片的发光表面而提供的装置，在远处提供所述磷光体材料减少吸收由所述LED裸片背部散射的光。此外，使所述磷光体位于远处实现产生更一致色彩及/或CCT的光，因为对比于将所述磷光体直接提供在所述LED裸片的发光表面上，所述磷光体材料是提供在大得多的面积上。Locating the phosphor material remotely from the LED provides a number of advantages, such as reducing thermal degradation of the phosphor material. Furthermore, providing the phosphor material remotely reduces absorption of light backscattered by the LED die compared to devices where the phosphor material is provided in direct contact with the light emitting surface of the LED die. In addition, having the phosphor located remotely enables the generation of more consistent color and/or CCT of light, since the phosphor material is a better source of light than providing the phosphor directly on the light-emitting surface of the LED die. on a much larger area.
所述磷光体材料可包括无机或有机磷光体，例如普通组合物A3Si(O,D)5或A2Si(O,D)4的基于硅酸盐的磷光体，其中Si是硅，O是氧，A包括锶(Sr)、钡(Ba)、镁(Mg)或钙(Ca)，且D包括氯(Cl)、氟(F)、氮(N)或硫(S)。基于硅酸盐的磷光体的实例揭示于以下美国专利中：US 7,575,697“铕激活的基于硅酸盐的绿色磷光体(Europium activatedsilicate-based green phosphor)”(让与给Intematix Corp.)；US 7,601,276“两相的基于硅酸盐的黄色磷光体(Two phase silicate-based yellow phosphor)”(让与给Intematix Corp.)；US7,601,276“基于硅酸盐的橙色磷光体(Silicate-based orange phosphor)”(让与给IntematixCorp.)及US 7,311,858“基于硅酸盐的黄绿色磷光体(Silicate-based yellow-greenphosphor)”(让与给Intematix Corp.)。所述磷光体还可包括基于铝酸盐的材料(例如我们同在申请中的第US2006/0158090号专利申请案“基于铝酸盐的绿色磷光体(Aluminate-based green phosphor)”及第US 7,390,437号专利“基于铝酸盐的蓝色磷光体(Aluminate-based blue phosphor)”(让与给Intematix Corp.)中所教示)、硅酸铝磷光体(如在同在申请中的第US2008/0111472号申请案“硅酸铝橙红色磷光体(Aluminum-silicateorange-red phosphor)”中教示)或基于氮化物的红色磷光体材料(例如在第8,274,215号美国专利中所教示)。将了解，所述磷光体材料并不限于本文中描述的实例，且可包括任何磷光体材料，包含氮化物及/或硫酸盐磷光体材料、氧氮化物及氧硫酸盐磷光体或石榴石材料(YAG)。The phosphor material may comprise inorganic or organic phosphors, such as silicate-based phosphors of the common compositionA3Si (O,D)5 orA2Si (O,D)4 , where Si is silicon, O is oxygen, A includes strontium (Sr), barium (Ba), magnesium (Mg) or calcium (Ca), and D includes chlorine (Cl), fluorine (F), nitrogen (N) or sulfur (S). Examples of silicate-based phosphors are disclosed in the following US patents: US 7,575,697 "Europium activatedsilicate-based green phosphor" (assigned to Intematix Corp.); US 7,601,276 "Two phase silicate-based yellow phosphor" (assigned to Intematix Corp.); US7,601,276 "Silicate-based orange phosphor " (assigned to Intematix Corp.) and US 7,311,858 "Silicate-based yellow-green phosphor" (assigned to Intematix Corp.). The phosphors may also include aluminate-based materials (such as our co-pending patent application US2006/0158090 "Aluminate-based green phosphor" and US 7,390,437 Patent No. "Aluminate-based blue phosphor (Aluminate-based blue phosphor)" (assigned to Intematix Corp.) taught), aluminum silicate phosphor (as in the co-pending application No. US2008/0111472 Application No. "Aluminum-silicate orange-red phosphor (Aluminum-silicate orange-red phosphor)" or nitride-based red phosphor materials such as taught in US Patent No. 8,274,215). It will be appreciated that the phosphor material is not limited to the examples described herein, and may comprise any phosphor material, including nitride and/or sulfate phosphor materials, oxynitride and oxysulfate phosphors, or garnet materials (YAG).
所述磷光体材料包括大体上为具有10μm到20μm且通常为15μm数量级的直径的球形形状的颗粒。所述磷光体材料可包括2μm到60μm的大小的颗粒。The phosphor material comprises substantially spherical shaped particles having a diameter of the order of 10 μm to 20 μm and typically of the order of 15 μm. The phosphor material may comprise particles with a size of 2 μm to 60 μm.
光反射材料22包括具有较高反射率(通常为0.9或更高的反射系数)的粉末材料。所述光反射材料的颗粒大小通常在0.1μm到10μm的范围中，且在优选实施例中在0.1μm到10μm的范围中。光反射材料对磷光体材料的重量百分比装载在0.1％到10％的范围中，且在优选实施例中在1％到2％的范围中。光反射材料的实例包含氧化镁(MgO)、二氧化钛(TiO2)、硫酸钡(BaSO4)及其组合。所述光反射材料还可包括白色墨水，例如NorcoteInternational Inc.的超级白色墨水GN-027SA，其已包含高度光反射材料(通常为TiO2)的颗粒。The light reflective material 22 includes a powder material with relatively high reflectivity (typically 0.9 or higher reflectance). The particle size of the light reflective material is typically in the range of 0.1 μm to 10 μm, and in a preferred embodiment is in the range of 0.1 μm to 10 μm. The weight percent loading of light reflective material to phosphor material is in the range of 0.1% to 10%, and in a preferred embodiment in the range of 1% to 2%. Examples of light reflective materials include magnesium oxide (MgO), titanium dioxide (TiO2 ), barium sulfate (BaSO4 ), and combinations thereof. The light reflective material may also comprise a white ink, such as Norcote International Inc.'s super white ink GN-027SA, which already contains particles of a highly light reflective material, typicallyTiO2 .
在描述本发明的装置的操作之前，将参考图2描述已知发光装置的操作，图2展示利用磷光体波长转换的基于冷白色LED的发光装置的示意图。与本发明的装置一样，所述已知装置包含波长转换组件18，其包含遍及光透射粘合剂24的体积而均匀分布的磷光体材料颗粒20。不同于本发明的装置，所述已知装置并不包含光反射材料的颗粒。在操作中，来自所述LED的蓝光26由光透射粘合剂24传输，直到其撞击磷光体材料的颗粒。据信光子与磷光体材料颗粒的交互平均只有万分之一导致光致发光的光的吸收及产生。光子与磷光体颗粒的交互的大部分(约99.99％)导致所述光子的散射。归因于散射过程的各向同性本质，平均一半的散射光子将在往回朝向所述LED的方向中。测试指示通常全部入射蓝光的约10％在往回朝向所述LED的方向中从所述波长转换组件散射且发射。对于冷白色发光装置，磷光体材料的量经选择以允许全部入射蓝光的约10％被发射穿过所述窗，且促成发射产物的形成。所述入射光的大部分(约80％)被所述磷光体材料吸收，且重新发射为光致发光的光28。归因于光致发光的光产生的各向同性本质，由所述磷光体材料产生的约一半的光28将在朝向所述LED的方向中发射。结果，全部入射光的至多(↑)40％将发射为波长λ2的光28，且促成发射产物30的形成，而全部入射光的至多(↑)40％将在往回朝向所述LED的方向中发射为波长λ2的光28。通常，朝向所述LED发射的光由反射镜(未展示)重新引导，以增加所述装置的总体效率。Before describing the operation of the device of the present invention, the operation of a known lighting device will be described with reference to Figure 2, which shows a schematic diagram of a cool white LED based lighting device utilizing phosphor wavelength conversion. As with the device of the present invention, the known device comprises a wavelength conversion component 18 comprising phosphor material particles 20 uniformly distributed throughout the volume of a light transmissive adhesive 24 . Unlike the device of the invention, the known device does not contain particles of light-reflecting material. In operation, blue light 26 from the LED is transmitted by the light transmissive adhesive 24 until it strikes particles of phosphor material. It is believed that on average only 1 in 10,000 interactions of photons with phosphor material particles result in the absorption and generation of photoluminescent light. The majority (approximately 99.99%) of photon interactions with phosphor particles result in scattering of said photons. Due to the isotropic nature of the scattering process, on average half of the scattered photons will be in the direction back towards the LED. Testing indicated that typically about 10% of all incident blue light was scattered and emitted from the wavelength conversion component in the direction back towards the LED. For cool white light emitting devices, the amount of phosphor material is selected to allow about 10% of all incident blue light to be emitted through the window and to contribute to the formation of emission products. A majority (approximately 80%) of the incident light is absorbed by the phosphor material and re-emitted as photoluminescent light 28 . Due to the isotropic nature of photoluminescent light production, approximately half of the light 28 produced by the phosphor material will be emitted in the direction towards the LED. As a result, up to (↑) 40% of the total incident light will be emitted as light 28 at wavelengthλ2 and contribute to the formation of emission products 30, while up to (↑) 40% of the total incident light will be emitted back toward the LED's The light 28 is emitted as wavelength λ2 in the direction. Typically, light emitted towards the LEDs is redirected by mirrors (not shown) to increase the overall efficiency of the device.
现参考图3描述根据本发明的一些实施例的冷白色发光装置10的操作，图3展示图1的装置的操作的示意图。本发明的装置的操作类似于图2的操作，但额外地包含由所述光反射/散射材料的颗粒的反射或散射光(波长为λ1及λ2)。通过包含光反射材料与所述磷光体材料的颗粒，这可减少产生给定色彩的发射产物所需的磷光体材料的量，例如，在一些实施例中减少多达33％。据信光反射材料的颗粒增加光子撞击磷光体材料的颗粒的可能性，且因此对于给定色彩的发射产物，需要较少磷光体材料。The operation of the cool white light emitting device 10 according to some embodiments of the present invention will now be described with reference to FIG. 3 , which shows a schematic diagram of the operation of the device of FIG. 1 . The operation of the device of the present invention is similar to that of Figure 2, but additionally involves reflection or scattering of light (at wavelengths [lambda]i and [lambda]2 ) by the particles of the light reflecting/scattering material. By including particles of light reflective material with the phosphor material, this can reduce the amount of phosphor material required to produce a given color emission product, for example, by as much as 33% in some embodiments. It is believed that the particles of light reflective material increase the likelihood of photons striking the particles of phosphor material, and thus less phosphor material is required for a given color of emission product.
图4为根据本发明的一些实施例的发光装置对于◆-0％、■-0.4％、▲-1.1％及●-2％的光反射材料的重量百分比装载的发射强度对色度CIE x的标绘图。数据是针对丝网印刷磷光体转换层，其中粘合剂材料包括UV可固化石版透明罩印PSLC-294，且所述磷光体材料包括Intematix公司的磷光体EY4453，其具有15μm的平均颗粒大小。磷光体材料对透明墨水的重量比例是2:1。所述光反射材料包括Norcote International Inc.的超级白色墨水GN-027SA。装载光反射材料的数字指超级白色墨水对透明墨水的重量百分比。与每一数据点相关的较小参考数字指示形成所述磷光体层所使用的印刷次数的数目“n”。将了解，印刷次数的数目与磷光体层18的厚度及磷光体的数量成正比。椭圆32、34、36、38用于圈定具有实质上相同强度及CIE x值的发射产物的数据点。例如，指示类似强度及色彩的发射产物的椭圆32可针对包括以下项目的磷光体转换层18产生：i)在没有光反射材料的情况下，印刷3次，及ii)在2％装载的光反射材料的情况下，印刷2次。这些数据指示通过包含2％重量装载的光反射材料，可使用包括约少33％的磷光体材料的磷光体转换层18产生相同色彩及强度的光。指示相同强度及色彩的发射产物的椭圆34针对包括以下项目的磷光体转换而产生：i)在没有光反射材料的情况下，印刷4次，及ii)在0.4％装载的光反射材料的情况下，印刷3次。这些数据指示对于此实施例，通过包含0.4％重量装载的光反射材料，可使用包括约少25％的磷光体的磷光体转换层产生相同色彩及强度的光。指示相同强度及色彩的发射产物的椭圆36针对包括以下项目的磷光体转换层产生：i)在没有光反射材料的情况下，印刷4次，及ii)在1.1％装载的光反射材料的情况下，印刷3次。这些数据指示，通过包含1.1％重量装载的光反射材料，可使用包括约少25％的磷光体的磷光体转换层产生相同色彩及强度的光。指示相同强度及色彩的发射产物的椭圆38针对包括以下项目的磷光体转换层产生：i)在0.4％重量装载的光反射材料的情况下，印刷4次，及ii)在2％重量装载的光反射材料的情况下，印刷3次。这些数据指示，通过包含0.4％重量装载的光反射材料，可使用包括约少25％的磷光体的磷光体转换层产生相同色彩及强度的光。点40(n＝4，1.1％装载)及42(n＝4，2％装载)暗示存在饱合点，超过所述饱合点，光反射材料装载的增加导致发射强度的减小且对色彩影响极小。4 is a graph of emission intensity versus chromaticity CIE x for ◆-0%, ■-0.4%, ▲-1.1%, and ●-2% weight percent loading of light-reflecting materials for light-emitting devices according to some embodiments of the present invention plotted drawing. Data are for screen printed phosphor conversion layers where binder materials include UV curable lithographic transparent overprint PSLC-294, and the phosphor material includes phosphor EY4453 from Intematix company, which has an average particle size of 15 μm. The weight ratio of phosphor material to clear ink is 2:1. The light reflective material includes super white ink GN-027SA of Norcote International Inc. The number of loaded light reflective material refers to the weight percentage of super white ink to transparent ink. The smaller reference number associated with each data point indicates the number "n" of print passes used to form the phosphor layer. It will be appreciated that the number of print passes is directly proportional to the thickness of the phosphor layer 18 and the amount of phosphor. Ellipses 32, 34, 36, 38 are used to delineate data points of emission products having substantially the same intensity and CIE x value. For example, an ellipse 32 indicating emission products of similar intensity and color can be produced for a phosphor conversion layer 18 comprising: i) 3 prints without light reflective material, and ii) at 2% loaded light In the case of reflective materials, print twice. These data indicate that by including a 2% weight loading of light reflective material, the same color and intensity of light can be produced using a phosphor conversion layer 18 that includes about 33% less phosphor material. Ellipses 34 indicating emission products of the same intensity and color were produced for phosphor conversions comprising: i) 4 prints without light reflective material, and ii) at 0.4% loaded light reflective material Next, print 3 times. These data indicate that for this embodiment, by including a 0.4% weight loading of light reflective material, the same color and intensity of light can be produced using a phosphor conversion layer that includes about 25% less phosphor. Ellipses 36 indicating emission products of the same intensity and color were produced for phosphor conversion layers comprising: i) 4 prints without light reflective material, and ii) at 1.1% loaded light reflective material Next, print 3 times. These data indicate that by including a 1.1% weight loading of light reflective material, the same color and intensity of light can be produced using a phosphor conversion layer that includes about 25% less phosphor. Ovals 38 indicating emission products of the same intensity and color were produced for phosphor conversion layers comprising: i) 4 prints at 0.4 wt% loading of light reflective material, and ii) at 2 wt% loading of In the case of light reflective material, print 3 times. These data indicate that by including a 0.4% weight loading of light reflective material, the same color and intensity of light can be produced using a phosphor conversion layer that includes about 25% less phosphor. Points 40 (n=4, 1.1% loading) and 42 (n=4, 2% loading) suggest that there is a saturation point beyond which an increase in light reflective material loading results in a decrease in emission intensity with a significant impact on color Small.
图5是根据本发明的另一实施例的基于LED的白色发光装置10的示意性表示。在此实施例中，光透射衬底16配置为光导(波导)，且磷光体转换层18提供在所述衬底的一个面(发光面)上。通常，衬底16是实质上平面的，且取决于应用可为圆盘形、正方形、矩形或其它形状。在所述衬底是圆盘形的情况下，所述直径可通常在约5cm与30cm之间，对应于约20cm2与约700cm2之间的面积的发光面。在所述衬底形状为正方形或矩形的情况下，各边可通常在约5cm与40cm之间，对应于约80cm2与约5000cm2之间的发光面。在衬底16的非发光面(如所说明的下方表面)上，可提供一层光反射材料44以防止来自所述装置后方的光发射。反射材料44可包括金属涂层，例如铬，或有光泽的白色材料，例如塑料材料或纸。为使从所述衬底边缘发射的光最小化，所述衬底的边缘优选地包含光反射表面(未展示)。一或多个蓝色LED 12经配置以将蓝光26耦合到衬底16的一或多个边缘中。在操作中，耦合到衬底16中的光26通过全内反射而被引导遍及衬底16的整个体积。以大于临界角的角度撞击所述衬底的发光面的光26将被发射通过所述发光面，且进入磷光体波长转换层18中。所述装置的操作与参考图3描述的操作相同。如图5中所指示，以离开所述发光面的方向发射的磷光体产生的光46可重新进入衬底16，且将最终由于光反射层44的反射而发射通过发光面。从所述装置发射的最终照明产物30是由所述LED产生的蓝光26与由所述磷光体波长转换层18产生的波长转换的光28的组合。Fig. 5 is a schematic representation of an LED-based white light emitting device 10 according to another embodiment of the present invention. In this embodiment, the light transmissive substrate 16 is configured as a light guide (waveguide), and the phosphor conversion layer 18 is provided on one face (light emitting face) of said substrate. Typically, substrate 16 is substantially planar and may be disc-shaped, square, rectangular, or other shapes depending on the application. Where the substrate is disc-shaped, the diameter may typically be between about 5 cm and 30 cm, corresponding to a light emitting face of an area between about 20 cm2 and about 700 cm2 . Where the substrate is square or rectangular in shape, each side may typically be between about 5 cm and 40 cm, corresponding to a light emitting surface of between about 80 cm2 and about 5000 cm2 . On the non-emitting side of the substrate 16 (the lower surface as illustrated), a layer of light reflective material 44 may be provided to prevent light emission from the rear of the device. Reflective material 44 may comprise a metallic coating, such as chrome, or a glossy white material, such as plastic material or paper. To minimize light emission from the edges of the substrate, the edges of the substrate preferably contain light reflective surfaces (not shown). One or more blue LEDs 12 are configured to couple blue light 26 into one or more edges of substrate 16 . In operation, light 26 coupled into substrate 16 is directed throughout the entire volume of substrate 16 by total internal reflection. Light 26 that strikes the light emitting face of the substrate at an angle greater than the critical angle will be emitted through the light emitting face and into the phosphor wavelength conversion layer 18 . The operation of the device is the same as that described with reference to FIG. 3 . As indicated in FIG. 5 , phosphor-generated light 46 emitted in a direction away from the light emitting face may re-enter substrate 16 and will eventually be emitted through the light emitting face due to reflection by light reflective layer 44 . The final illumination product 30 emitted from the device is the combination of the blue light 26 produced by the LED and the wavelength converted light 28 produced by the phosphor wavelength converting layer 18 .
图6为替代的基于LED的白色发光装置10的示意图，其中光透射衬底16配置为光导(波导)。在此实施例中，磷光体转换层18提供在所述衬底的与发光面相对的面上，且光反射层44提供在磷光体转换层18上。Figure 6 is a schematic diagram of an alternative LED-based white light emitting device 10 in which the light transmissive substrate 16 is configured as a light guide (waveguide). In this embodiment, the phosphor conversion layer 18 is provided on the side of the substrate opposite the light emitting side and the light reflective layer 44 is provided on the phosphor conversion layer 18 .
图7展示根据本发明的进一步实施例的基于LED的白色发光装置10的示意图。在此实施例中，波长转换组件14是光反射的，且包括光反射表面48，其上施覆磷光体转换层18。如所展示，光反射表面48可包括抛物面表面，但其还可包括任何表面，包含平面、凸面及凹面。为使从所述装置的光发射最大化，所述光反射表面尽可能具反射性，且优选地具有至少0.9的反射系数。所述光反射表面可包括：抛光金属表面，例如银、铝、铬；光反射聚合物；光反射纸或光反射涂料。为帮助热消散，所述光反射表面优选为导热的。Fig. 7 shows a schematic diagram of an LED-based white light emitting device 10 according to a further embodiment of the present invention. In this embodiment, the wavelength conversion component 14 is light reflective and includes a light reflective surface 48 on which the phosphor conversion layer 18 is applied. As shown, light reflective surface 48 may comprise a parabolic surface, but it may also comprise any surface, including planar, convex, and concave. To maximize light emission from the device, the light reflecting surface is as reflective as possible, and preferably has a reflectance of at least 0.9. The light reflective surface may include: polished metal surfaces such as silver, aluminum, chrome; light reflective polymers; light reflective paper or light reflective paint. To aid in heat dissipation, the light reflecting surface is preferably thermally conductive.
图7的发光装置的操作在图8中说明，且因其类似于图3的操作，所以不详细描述。然而，应了解，因为平均多达一半的LED光26将传播通过所述磷光体转换层两次，所以磷光体转换层18的厚度可对比于具有光透射波长转换组件的布置(图1及5)而为至多一半，即，t/2。由于将所述磷光体材料提供在光反射表面上，所以可在磷光体材料使用上以多达约50％的进一步潜在缩减实现相同色彩的发射产物。将了解，图6的实施例在操作上与图7的操作类似，光透射衬底16用于将LED光26引导到磷光体转换层18。The operation of the light emitting device of FIG. 7 is illustrated in FIG. 8 and will not be described in detail because it is similar to the operation of FIG. 3 . However, it should be appreciated that the thickness of the phosphor conversion layer 18 can be compared to arrangements with light transmissive wavelength conversion components (Figs. ) and is at most half, ie, t/2. Since the phosphor material is provided on a light reflective surface, the same colored emission product can be achieved with a further potential reduction in phosphor material usage of up to about 50%. It will be appreciated that the embodiment of FIG. 6 is similar in operation to that of FIG. 7 , with light transmissive substrate 16 being used to direct LED light 26 to phosphor conversion layer 18 .
虽然本发明已关于发光装置加以描述，但本发明的原理还适用于利用光致发光波长转换以产生所需色彩的发射光的固态发光标牌，例如同在申请中的第7,937,865号美国专利中所揭示，其内容以引用的方式并入本文中。将了解，在此类发光标志中，波长转换组件14可用作所述光致发光标牌表面，以产生所需色彩的标牌信息。磷光体材料与光反射材料的混合物可配置为图案，以在所述光透射衬底上定义图像、图片、字母、数字、装置、图案或其它标牌信息。或者，例如为刻槽型文字所需要的，所述标牌表面的形状(即，所述光透射衬底)可经配置以定义标牌信息。本发明在标牌表面的面积为几百平方厘米的标牌应用中尤其有利，这要求所述磷光体材料分布在100cm2的最小面积上(10cm×10cm)，且更通常超过几百平方厘米或甚至几千平方厘米。While the invention has been described in relation to light emitting devices, the principles of the invention are also applicable to solid state light emitting signs that utilize photoluminescence wavelength conversion to produce emitted light of a desired color, such as that disclosed in co-pending U.S. Patent No. 7,937,865. disclosed, the contents of which are incorporated herein by reference. It will be appreciated that in such illuminated signs, the wavelength conversion component 14 may be used as the photoluminescent sign surface to produce sign information in desired colors. The mixture of phosphor material and light reflective material can be configured in a pattern to define an image, picture, letter, number, device, pattern or other signage information on the light transmissive substrate. Alternatively, the shape of the sign surface (ie, the light transmissive substrate) may be configured to define sign information, such as is required for engraved lettering. The present invention is particularly advantageous in signage applications where the area of the signage surface is several hundred square centimeters, which requires the phosphor material to be distributed over a minimum area of 100cm (10 cm x 10 cm), and more typically exceeds several hundred square centimeters or even Thousands of square centimeters.
所述标志可为背光，即，所述LED位于例如灯箱内的标牌表面后，且所述标牌表面覆盖所述灯箱开口而提供。通常，所述标牌表面位于距所述LED至少约5mm的距离处。或者，所述标志可为边缘照亮的，且所述光透射衬底配置为光导，且磷光体材料与光反射材料的混合物提供在所述光导的发光面的至少一部分上。The signage may be backlit, ie the LEDs are provided behind a signage surface, for example within a light box, and the signage surface covers the light box opening. Typically, the signage surface is located at a distance of at least about 5 mm from the LEDs. Alternatively, the logo may be edge lit and the light transmissive substrate configured as a light guide and a mixture of phosphor material and light reflective material is provided on at least a portion of the light emitting face of the light guide.
在一些实施例中，所述光反射材料包括二氧化钛(TiO2)，但其也可包括其它材料，例如硫酸钡(BaSO4)、氧化镁(MgO)、二氧化硅(SiO2)或氧化铝(Al2O3)。在一些实施例中，所述光反射材料具有在1μm到50μm的范围中的平均颗粒大小，且更优选地在10μm到20μm的范围中。In some embodiments, the light reflective material comprises titanium dioxide (TiO2 ), but it may also comprise other materials such as barium sulfate (BaSO4 ), magnesium oxide (MgO), silicon dioxide (SiO2 ) or aluminum oxide (Al2 O3 ). In some embodiments, the light reflective material has an average particle size in the range of 1 μm to 50 μm, and more preferably in the range of 10 μm to 20 μm.
在一些实施例中，用于所述波长转换组件中的光反射/散射材料具有的颗粒大小经选择使得比起所述颗粒将散射由所述光致发光(磷光体)材料产生的光，其将散射相对更多激发(通常为蓝色)光。例如，所述光反射颗粒大小可经选择使得比起所述颗粒将散射由所述至少一个磷光体材料产生的光，其将散射相对至少两倍的激发光。这确保将散射更高比例的蓝色激发光，从而增加光子与磷光体材料颗粒交互的可能性，且导致产生光致发光的光。同时，磷光体产生的光可通过而被散射的可能性较低。In some embodiments, the light reflective/scattering material used in the wavelength conversion component has a particle size selected such that it will scatter light generated by the photoluminescent (phosphor) material compared to the particle size. Relatively more excitation (usually blue) light will be scattered. For example, the light reflective particle size may be selected such that it will scatter at least twice as much excitation light as the particle will scatter light generated by the at least one phosphor material. This ensures that a higher proportion of the blue excitation light will be scattered, increasing the likelihood of photons interacting with the phosphor material particles and resulting in photoluminescent light. At the same time, the light generated by the phosphor can pass through and is less likely to be scattered.
因为此方法可进一步增加蓝色光子与磷光体材料颗粒交互的可能性，因此需要较少磷光体材料以产生选择发射色彩。此布置还可增加所述波长转换组件/装置的发光效率。在利用蓝色(400nm到480nm)激发光的一些实施例中，所述光反射材料具有小于约150nm的平均颗粒大小，且通常具有在100nm到150nm的范围中的平均颗粒大小。Because this approach can further increase the probability of blue photons interacting with the phosphor material particles, less phosphor material is required to produce the selective emission color. This arrangement may also increase the luminous efficiency of the wavelength conversion component/device. In some embodiments utilizing blue (400nm to 480nm) excitation light, the light reflective material has an average particle size of less than about 150nm, and typically has an average particle size in the range of 100nm to 150nm.
所述光反射/散射材料(即，用于优先散射蓝光)可在与所述磷光体材料相同的材料层内体现。The light reflecting/scattering material (ie, for preferentially scattering blue light) may be embodied within the same material layer as the phosphor material.
或者，所述光反射/散射材料可置于邻近于或接近具有所述磷光体材料的层的分离层上。例如，根据本发明的一些实施例且如图9中所展示，波长转换组件136按顺序包括光透射衬底142；光反射层144，其含有光反射颗粒；及波长转换层146，其含有一或多种磷光体(光致发光)与光反射材料的混合物。如图9中可见，波长转换组件136经配置使得在操作中，波长转换层146面对所述LED。根据本发明的一些实施例，波长转换组件136可按顺序包括光透射衬底142；光反射层144，其含有光反射颗粒；及波长转换层146，其含有一或多种磷光体(光致发光)材料。Alternatively, the light reflecting/scattering material may be placed on a separate layer adjacent to or close to the layer with the phosphor material. For example, according to some embodiments of the invention and as shown in FIG. 9 , wavelength conversion component 136 includes, in order, light transmissive substrate 142; light reflective layer 144, which contains light reflective particles; and wavelength conversion layer 146, which contains a or mixtures of various phosphors (photoluminescence) and light reflective materials. As can be seen in Figure 9, the wavelength converting component 136 is configured such that in operation, the wavelength converting layer 146 faces the LED. According to some embodiments of the present invention, the wavelength conversion component 136 may include, in order, a light transmissive substrate 142; a light reflective layer 144 containing light reflective particles; and a wavelength conversion layer 146 containing one or more phosphors (phototropic Luminescent material.
光透射衬底142可为对380nm到740nm的波长范围中的光实质上透射的任何材料，且可包括光透射聚合物(例如聚碳酸酯或丙烯酸)或玻璃(例如硼硅酸盐玻璃)。在一些实施例中，衬底142包括直径为且厚度t1通常为0.5mm到3mm的平面圆盘。在其它实施例中，所述衬底可包括其它几何形状，例如凸起或凹入的形状，例如圆顶形或圆柱形。Light transmissive substrate 142 may be any material that is substantially transmissive to light in the wavelength range of 380 nm to 740 nm, and may include light transmissive polymers such as polycarbonate or acrylic, or glass such as borosilicate glass. In some embodiments, substrate 142 includes a diameter of And the thickness t1 is usually a flat disc of 0.5 mm to 3 mm. In other embodiments, the substrate may comprise other geometric shapes, such as a convex or concave shape, such as a dome or a cylinder.
光扩散层144包括光反射材料(优选地为二氧化钛(TiO2))的颗粒的均匀厚度层。在替代布置中，所述光反射材料可包括硫酸钡(BaSO4)、氧化镁(MgO)、二氧化硅(SiO2)、氧化铝(Al2O3)或具有尽可能高的反射率(通常为0.9或更高的反射系数)的粉末材料。所述光反射材料粉末以已知比例与光透射液体粘合剂材料彻底混合，以形成悬浮液，且所得的混合物优选地通过丝网印刷而沉积在衬底142的面上，以形成遮盖所述衬底的整个面的厚度t2(通常在10μm到75μm的范围中)的均匀层。在光扩散层144中，每单位面积的光衍射材料的量将通常在10μg.cm-2到5mg.cm-2的范围中。Light diffusing layer 144 includes a uniform thickness layer of particles of light reflective material, preferably titanium dioxide (TiO2 ). In alternative arrangements, the light reflective material may comprise barium sulfate (BaSO4 ), magnesium oxide (MgO), silicon dioxide (SiO2 ), aluminum oxide (Al2 O3 ), or have as high a reflectivity as possible ( Usually 0.9 or higher reflectance) powder material. The light reflective material powder is thoroughly mixed in known proportions with a light transmissive liquid binder material to form a suspension, and the resulting mixture is deposited, preferably by screen printing, on the face of the substrate 142 to form a mask. A uniform layer of thickness t2 (typically in the range of 10 μm to 75 μm) over the entire surface of the substrate. In the light diffusing layer 144, the amount of light diffractive material per unit area will generally be in the range of 10 μg.cm−2 to 5 mg.cm−2 .
虽然丝网印刷是沉积光扩散层144的优选方法，但其还可使用其它技术沉积，例如槽模式涂布(slot die coating)、旋涂、滚涂、下拉式涂布(drawdown coating)或刮刀涂敷。所述粘合剂材料可包括可固化液体聚合物，例如聚合物树脂、单体树脂、丙烯酸、环氧树脂(聚环氧化物)、硅酮或氟化聚合物。所述粘合剂材料在其固化状态中对由所述磷光体材料及所述LED产生的所有波长的光实质上透射是重要的，且优选地对于可见光谱(380nm到800nm)具有至少0.9的透射系数。所述粘合剂材料优选地为UV可固化的，但其也可为可热固化的、基于溶剂的或其组合。可UV固化或热固化的粘合剂可为优选的，因为不同于基于溶剂的材料，其并不在聚合作用期间“释气(outgas)”。在一种布置中，所述光衍射材料的平均颗粒大小在5μm到15μm的范围中，但如上文所描述，其还可在纳米范围(nm)内，且宜在100nm到150nm的范围中。光反射材料对液体粘合剂的重量百分比装载通常在7％到35％的范围中。While screen printing is the preferred method of depositing the light diffusing layer 144, it can also be deposited using other techniques such as slot die coating, spin coating, roll coating, drawdown coating, or doctor blade Apply. The adhesive material may comprise a curable liquid polymer such as a polymeric resin, monomeric resin, acrylic, epoxy (polyepoxide), silicone or fluorinated polymer. It is important that the binder material in its cured state is substantially transmissive to all wavelengths of light generated by the phosphor material and the LED, and preferably has an OR of at least 0.9 for the visible spectrum (380nm to 800nm). Transmission coefficient. The adhesive material is preferably UV curable, but it may also be thermally curable, solvent based or a combination thereof. UV-curable or heat-curable adhesives may be preferred because, unlike solvent-based materials, they do not "outgas" during polymerization. In one arrangement the light diffractive material has an average particle size in the range of 5 μm to 15 μm, but as described above it may also be in the nanometer range (nm), and preferably in the range of 100 nm to 150 nm. The weight percent loading of light reflective material to liquid binder is typically in the range of 7% to 35%.
波长转换层146与光扩散层144直接接触而沉积，即没有任何中介层或空气间隙。所述磷光体材料(其呈粉末形式)以已知比例与液体光透射粘合剂材料彻底混合，以形成悬浮液，且所得的磷光体组合物(“磷光体墨水”)直接沉积在反射层144上。所述波长转换层优选地通过丝网印刷而沉积，但也可使用其它沉积技术，例如槽模式涂布、旋涂或刮刀涂敷。为消除波长转换层146与反射层144之间的光学界面，且使这两层之间的光透射最大化，优选地使用相同液体粘合剂材料制造两个层；即，聚合物树脂、单体树脂、丙烯酸、环氧树脂、硅酮或氟化聚合物。The wavelength converting layer 146 is deposited in direct contact with the light diffusing layer 144, ie without any intervening layers or air gaps. The phosphor material (which is in powder form) is thoroughly mixed in known proportions with a liquid light transmissive binder material to form a suspension, and the resulting phosphor composition ("phosphor ink") is deposited directly on the reflective layer 144 on. The wavelength converting layer is preferably deposited by screen printing, but other deposition techniques such as slot-die coating, spin coating or doctor blade coating may also be used. To eliminate the optical interface between the wavelength conversion layer 146 and the reflective layer 144, and to maximize light transmission between the two layers, it is preferable to make both layers using the same liquid adhesive material; i.e., a polymeric resin, a single resins, acrylics, epoxies, silicones or fluorinated polymers.
根据本发明的磷光体波长转换组件136的进一步实例在图10中说明。与图9的波长转换组件一样，所述组件包括光透射衬底142、光扩散层144及波长转换层146。根据本发明，光扩散层144及波长转换层146彼此直接接触而沉积。同样地，在操作中，所述组件经配置使得所述波长转换组件经配置使得波长转换层146面对所述LED。A further example of a phosphor wavelength converting component 136 according to the present invention is illustrated in FIG. 10 . As with the wavelength converting component of FIG. 9 , the component includes a light transmissive substrate 142 , a light diffusing layer 144 and a wavelength converting layer 146 . According to the present invention, the light diffusing layer 144 and the wavelength converting layer 146 are deposited in direct contact with each other. Likewise, in operation, the assembly is configured such that the wavelength converting assembly is configured such that wavelength converting layer 146 faces the LED.
在操作中，由所述LED产生的蓝色激发光128传播通过波长转换层146，直到其撞击磷光体材料的颗粒。据信光子与磷光体材料颗粒的交互平均只有万分之一导致光致发光的光138的吸收及产生。光子与磷光体颗粒的交互的大部分(约99.99％)导致所述光子的散射。归因于散射过程的各向同性本质，平均一半的光子将在往回朝向所述LED的方向中散射。测试指示通常全部入射蓝光128的约10％在往回朝向所述LED的方向中从波长转换组件136散射且发射。对于冷白色发光装置，磷光体材料的量经选择以允许全部入射蓝光的约10％从所述波长转换组件发射，且促成发射产物140的形成。所述入射光的大部分(约80％)被所述磷光体材料吸收，且重新发射为光致发光的光138。归因于光致发光产生的各向同性本质，由所述磷光体材料产生的约一半的光138将在朝向所述LED的方向中被发射。结果，全部入射光的仅至多约40％将发射为波长λ2的光138，且促成发射产物138，其中全部入射光的剩余部分(至多约40％)将在往回朝向所述LED的方向中发射为波长λ2的光138。从波长转换组件136朝向所述LED发射的光由反射腔室的光反射表面重新引导，以促成所述发射产物的形成，且增加所述装置的总体效率。In operation, blue excitation light 128 generated by the LED propagates through the wavelength converting layer 146 until it strikes particles of phosphor material. It is believed that on average only 1 in 10,000 interactions of photons with phosphor material particles result in the absorption and generation of photoluminescent light 138 . The majority (approximately 99.99%) of photon interactions with phosphor particles result in scattering of said photons. Due to the isotropic nature of the scattering process, on average half of the photons will be scattered in the direction back towards the LED. Testing indicated that typically about 10% of all incident blue light 128 was scattered and emitted from wavelength conversion component 136 in a direction back towards the LED. For a cool white light emitting device, the amount of phosphor material is selected to allow about 10% of all incident blue light to be emitted from the wavelength conversion component and contribute to the formation of emission products 140 . A majority (approximately 80%) of the incident light is absorbed by the phosphor material and re-emitted as photoluminescent light 138 . Due to the isotropic nature of photoluminescence production, approximately half of the light 138 produced by the phosphor material will be emitted in the direction towards the LED. As a result, only up to about 40% of the total incident light will be emitted as light 138 at wavelengthλ2 and contribute to emission products 138, where the remainder (up to about 40%) of the total incident light will be in the direction back toward the LED Light 138 is emitted as wavelengthλ2 . Light emitted from the wavelength conversion component 136 towards the LEDs is redirected by the light reflective surfaces of the reflective chamber to facilitate the formation of the emission products and increase the overall efficiency of the device.
添加由光反射材料的颗粒组成的光扩散层144可实质上减少产生所选择色彩的发射光所需的磷光体材料的量。扩散层144通过将光反射回波长转换层146中而增加光子将导致产生光致发光的光的可能性。包含与所述波长转换层直接接触的反射层可减少产生给定色彩的发射产物所需的磷光体材料的量，例如在一些实施例中减少多达40％。Adding a light diffusing layer 144 composed of particles of light reflective material can substantially reduce the amount of phosphor material required to produce a selected color of emitted light. The diffusing layer 144 increases the likelihood that a photon will result in photoluminescent light by reflecting the light back into the wavelength converting layer 146 . Including a reflective layer in direct contact with the wavelength converting layer can reduce the amount of phosphor material required to produce a given color of emission product, for example by as much as 40% in some embodiments.
因此，设想配置光扩散层，使得比起其散射由所述磷光体材料产生的光，其选择性地散射更多由所述LED产生的蓝色激发光。此光扩散层确保从所述波长转换层发射的更高比例的蓝光将被散射，且由所述光反射材料引导回所述波长转换层中，从而增加所述光子与磷光体材料颗粒交互的可能性，且导致产生光致发光的光。同时，磷光体产生的光可以被散射的较低可能性通过所述扩散层。因为所述扩散层增加蓝色光子与磷光体材料颗粒交互的可能性，因此产生所选择的发射色彩需要较少磷光体材料。It is therefore envisaged to configure the light diffusing layer such that it selectively scatters more of the blue excitation light produced by the LED than it scatters light produced by the phosphor material. This light diffusing layer ensures that a higher proportion of the blue light emitted from the wavelength converting layer will be scattered and directed back into the wavelength converting layer by the light reflecting material, thereby increasing the probability of the photons interacting with phosphor material particles. possibility, and lead to the generation of photoluminescent light. At the same time, the light generated by the phosphor can pass through the diffusion layer with a lower probability of being scattered. Because the diffusing layer increases the probability of blue photons interacting with the phosphor material particles, less phosphor material is required to produce the selected emission color.
此外，此布置还可增加所述波长转换组件/装置的发光效率。通过适当选择所述光散射材料的平均颗粒大小，可配置所述光扩散层使得其散射蓝光比散射其它色彩(即绿色及红色)更容易。图11展示红光、绿光及蓝光的相对光散射对照TiO2平均颗粒大小(nm)的标绘图。如从图11可见，具有100nm到150nm的平均颗粒大小的TiO2颗粒比起其将散射绿光(510nm到550nm)或红光(630nm到740nm)，散射蓝光(450nm到480nm)可能超过两倍。例如，具有100nm的平均颗粒大小的TiO2颗粒比起其将散射绿光或红光，将以近三倍(2.9＝0.97/0.33)散射更多蓝光。对于具有200nm的平均颗粒大小的TiO2颗粒，比起其将散射绿光或红光，其将散射超过两倍(2.3＝1.6/0.7)的蓝光。根据本发明的一些实施例，所述光衍射颗粒大小优选地经选择使得所述颗粒将散射比由所述磷光体材料产生的光相对多至少两倍的蓝光。包含由光反射颗粒(与由所述磷光体材料产生的波长的光相比，其优先散射对应于由所述LED产生的波长的光)组成的光反射层的波长转换组件的概念客观地被视为是发明性的。Furthermore, this arrangement may also increase the luminous efficiency of the wavelength conversion component/device. By proper selection of the average particle size of the light scattering material, the light diffusing layer can be configured so that it scatters blue light more readily than other colors (ie green and red). Figure 11 shows a plot of relative light scattering for red, green, and blue light versusTi02 average particle size (nm). As can be seen from Figure 11,TiO2 particles having an average particle size of 100nm to 150nm are more than twice as likely to scatter blue light (450nm to 480nm) than they would be to scatter green light (510nm to 550nm) or red light (630nm to 740nm) . For example,Ti02 particles with an average particle size of 100 nm will scatter blue light nearly three times (2.9=0.97/0.33) more than they will scatter green or red light. For aTi02 particle with an average particle size of 200 nm, it will scatter more than twice (2.3=1.6/0.7) blue light than it will scatter green or red light. According to some embodiments of the invention, the light diffractive particle size is preferably selected such that the particles will scatter blue light relatively at least two times more than the light produced by the phosphor material. The concept of a wavelength conversion component comprising a light-reflecting layer composed of light-reflecting particles that preferentially scatter light corresponding to the wavelength generated by the LED compared to the wavelength generated by the phosphor material is objectively recognized as considered to be inventive.
因此，所述光反射/散射材料可以邻近于或接近包含所述磷光体材料的一层的单独层体现。所述单独光反射层可用于替代将光反射/散射材料混合到与所述磷光体材料相同的层中，及/或除了将光反射/散射材料混合到与所述磷光体材料相同的层中之外而使用。单独的光反射层中可使用与所述磷光体材料混合的所述光反射材料相同或不同的反射材料。Thus, the light reflecting/scattering material may be embodied in a separate layer adjacent to or close to a layer comprising the phosphor material. The separate light reflective layer may be used instead of, and/or in addition to, mixing a light reflective/scattering material into the same layer as the phosphor material use outside. The same or different reflective material as the light reflective material mixed with the phosphor material may be used in a separate light reflective layer.
本文中揭示的发明性概念可应用在涵盖任何适宜形状的波长转换组件。例如，考虑在图12及13中说明的LED照明装置200，其展示替代白炽灯泡的固态灯泡。The inventive concepts disclosed herein are applicable to wavelength conversion components encompassing any suitable shape. For example, consider the LED lighting device 200 illustrated in Figures 12 and 13, which show solid state light bulbs in place of incandescent light bulbs.
LED照明装置200包括照明基座204，其包含螺纹基座206。螺纹基座206经配置以安装在标准灯泡插座中，例如实施为标准爱迪生螺纹基座(Edison screw base)。外包体208可绕LED照明装置200的上方部分延伸。外包体208是光透射材料(例如，玻璃或塑料)，其对LED照明装置200提供保护及/或扩散性质。The LED lighting device 200 includes a lighting base 204 that includes a threaded base 206 . The screw base 206 is configured to fit in a standard light bulb socket, for example implemented as a standard Edison screw base. The outer casing 208 can extend around the upper portion of the LED lighting device 200 . The outer enclosure 208 is a light transmissive material (eg, glass or plastic) that provides protection and/or diffusion properties to the LED lighting device 200 .
LED照明装置200包括波长转换组件202，波长转换组件202具有从照明基座204延伸的伸长圆顶形。蓝色LED装置12位于照明基座204的顶面上，在波长转换组件202之下。波长转换组件202的三维本质建立围绕体积四周且在LED 12上方的相对较大形状。在照明装置200中对波长转换组件202使用三维形状允许某些功能性优点，例如对由照明装置200发射的光执行光塑形的能力。LED lighting device 200 includes a wavelength converting assembly 202 having an elongated dome shape extending from a lighting base 204 . The blue LED device 12 is located on the top surface of the illumination submount 204 , below the wavelength conversion assembly 202 . The three-dimensional nature of the wavelength conversion component 202 creates a relatively large shape around the perimeter of the volume and above the LED 12. The use of three-dimensional shapes for the wavelength conversion component 202 in the lighting device 200 allows certain functional advantages, such as the ability to perform light shaping on the light emitted by the lighting device 200 .
然而，波长转换组件202的这些类型的三维形状也对应于相对较大体积的波长转换组件，其需要用足够量的磷光体材料装填。在现有技术方法的情况下，因此将需要明显较大量的磷光体材料，以制造此类波长转换组件202。可利用本发明的实施例以减少制造此类波长转换组件202所需的磷光体的量。特定来说，波长转换组件202包括磷光体与反射材料的混合物。因为波长转换组件202内的反射性材料具有散射光的性质，所以这减少用于波长转换组件202所需的磷光体的量。However, these types of three-dimensional shapes of the wavelength converting component 202 also correspond to relatively large volumes of the wavelength converting component, which need to be packed with a sufficient amount of phosphor material. In the case of prior art methods, significantly larger quantities of phosphor material would therefore be required to manufacture such a wavelength conversion component 202 . Embodiments of the present invention may be utilized to reduce the amount of phosphor required to fabricate such a wavelength conversion component 202 . In particular, the wavelength conversion component 202 includes a mixture of phosphor and reflective material. This reduces the amount of phosphor required for the wavelength conversion component 202 because the reflective material within the wavelength conversion component 202 has the property of scattering light.
在一些实施例中，可将光扩散层(未展示)添加到波长转换组件202(除了与所述磷光体混合的反射材料外，及/或替代与所述磷光体混合的反射材料)，以减少制造波长转换组件202所需的磷光体材料的量。所述光反射材料可利用任何适宜材料，例如经选择为足够小的光散射颗粒，以更可能散射蓝光。In some embodiments, a light diffusing layer (not shown) may be added to the wavelength conversion component 202 (in addition to, and/or instead of, the reflective material mixed with the phosphor) to The amount of phosphor material required to fabricate the wavelength conversion component 202 is reduced. The light reflective material may utilize any suitable material, such as light scattering particles selected to be small enough to be more likely to scatter blue light.
因此，已描述用于实施基于LED的照明装置及/或减少制造此类装置及组件所需的光致发光材料的量的波长转换组件的改进方法。Accordingly, improved methods for implementing LED-based lighting devices and/or wavelength converting components that reduce the amount of photoluminescent material required to fabricate such devices and components have been described.
全向基于LED的发光装置Omni-directional LED-based lighting fixtures
许多应用(例如用于白炽灯(灯泡)的节能替代物)需要实质上全向发射特性。此类灯以许多形式可用，且通常通过字母与数字的组合来标准地参考。灯的字母标示通常是指所述灯的特定形状类型，例如通用(A，蘑菇形)、高瓦特通用服务(PS-梨形)、装饰性(B-蜡烛，CA-绞形蜡烛，BA-弯曲尖端蜡烛，F-火焰，P-花式圆形，G-球形)、反射镜(R)、抛物线镀铝反射镜(PAR)及多面反射镜(MR)。数字标示是指灯的大小，通常通过以八分之几英寸的单位来指示灯的直径。因此，A-19类型的灯是指其形状由字母“A”参考的通用灯(灯泡)且具有二又八分之三英寸的最大直径。最常用的家用“灯泡”为具有A-19外包体的灯，其在美国通常与E26螺纹基座一起销售。Many applications, such as energy-saving replacements for incandescent lamps (bulbs), require substantially omnidirectional emission characteristics. Such lamps are available in many forms and are often standardly referenced by a combination of letters and numbers. Lamp letter designations usually refer to the specific shape type of the lamp in question, such as General Purpose (A, Mushroom), High Watt General Service (PS-Pear), Decorative (B-Candle, CA-String Candle, BA- Curved Tip Candles, F-Flame, P-Fancy Round, G-Spherical), Reflectors (R), Parabolic Aluminized Reflectors (PAR) and Faceted Reflectors (MR). The numerical designation refers to the size of the light, usually by the diameter of the light in eighths of an inch. Thus, an A-19 type lamp refers to a general purpose lamp (bulb) whose shape is referenced by the letter "A" and has a maximum diameter of two and three-eighths of an inch. The most common household "light bulb" is a lamp with an A-19 outer body, which is usually sold in the United States with an E26 threaded base.
存在提供确切规范以定义根据其授权制造商使用这些标准参考标示标记照明产品的标准的标准化组织及管理部门。关于灯的物理尺寸，ANSI提供概述所要求的大小及形状的规范(ANSI C78.20-2003)，将依据所述规范来授权制造商在得到许可的情况下将灯标记为A-19类型灯。除了灯的物理尺寸及形状之外，还可存在涉及灯的性能及功能性的额外规范及标准。举例来说，在美国，美国环保署(EPA)连同美国能源部(DOE)公布可根据其将灯标示为符合“能源之星(ENERGY STAR)”的产品的灯，例如识别电力使用要求、最小灯输出要求、发光强度分布要求、发光效率要求及预期寿命。There are standardization organizations and governing bodies that provide precise specifications to define the standards for marking lighting products according to which manufacturers are authorized to use these standard reference designations. With regard to the physical dimensions of lamps, ANSI provides a specification outlining the required size and shape (ANSI C78.20-2003), which will authorize manufacturers to mark lamps as Type A-19 lamps under license . In addition to the physical size and shape of the lamp, there may be additional specifications and standards relating to the performance and functionality of the lamp. In the United States, for example, the U.S. Environmental Protection Agency (EPA), along with the U.S. Department of Energy (DOE), publishes lamps upon which lamps can be labeled as ENERGY STAR compliant products, such as identifying power usage requirements, minimum Lamp output requirements, luminous intensity distribution requirements, luminous efficiency requirements and expected life.
举例来说，关于能源之星规范中的发光强度分布标准，为使基于LED的替代灯被能源之星授予A-19替代物的资格，其必须展现出270度以上的平均(+/-20％)光发射及270以上的最小5％的光发射。基于LED的装置的问题是LED本质上具有通常小于90度的相对窄的发光强度分布。For example, with respect to the luminous intensity distribution criteria in the Energy Star specification, in order for an LED-based replacement lamp to qualify as an A-19 replacement by Energy Star, it must exhibit an average (+/-20 %) light emission and a minimum 5% light emission above 270. A problem with LED-based devices is that LEDs inherently have a relatively narrow distribution of luminous intensity, typically less than 90 degrees.
现参考图14描述根据本发明的实施例的全向基于LED的发光装置300，图14展示所述装置的穿过A-A的横截面侧视图及部分剖视平面。发光装置300包括光透射电路板(衬底)310，其具有直接安装到一个面的蓝色发光(465nm)未封装LED芯片(裸片)320的阵列。在所说明的实施例中，电路板310是平面的且具有细长形状(条形)，其中LED芯片320配置为沿着衬底的长度的线性阵列。如将描述，当装置300用作节能灯泡的一部分时细长阵列可为优选的，这是因为所述装置的外观及发射特性更类似于白炽灯泡的传统灯丝。取决于应用，电路板可包括其它形状，例如为正方形或圆形，且LED芯片配置为其它阵列或配置。应注意，LED芯片320直接安装到电路板310且未封装。此封装原本将阻断在朝向电路板的向后方向上的光发射。An omnidirectional LED-based lighting device 300 according to an embodiment of the invention is now described with reference to FIG. 14 , which shows a cross-sectional side view and partial cutaway plane through A-A of the device. Light emitting device 300 comprises a light transmissive circuit board (substrate) 310 with an array of blue emitting (465nm) unpackaged LED chips (die) 320 mounted directly to one face. In the illustrated embodiment, the circuit board 310 is planar and has an elongated shape (strip shape), with the LED chips 320 arranged in a linear array along the length of the substrate. As will be described, an elongated array may be preferred when the device 300 is used as part of an energy saving light bulb because the appearance and emission characteristics of the device are more similar to the traditional filament of an incandescent light bulb. Depending on the application, the circuit board may comprise other shapes, such as square or circular, and the LED chips arranged in other arrays or configurations. It should be noted that the LED chips 320 are mounted directly to the circuit board 310 and are not packaged. This package would otherwise block light emission in the rearward direction towards the circuit board.
电路板310可包括任何光透射材料，所述光透射材料至少半透明且优选地对可见光具有50％或更大的透射系数。因此，电路板可包括玻璃或塑料材料，例如聚丙烯、硅酮或丙烯酸。为帮助消散由LED芯片320产生的热量，电路板310不仅是光透射的而且还有利地是导热的。合适光透射导热材料的实例包含：氧化镁、蓝宝石、氧化铝、石英玻璃、氮化铝及金刚石。可通过使电路板较薄来增大导热电路板的透射系数。为增加机械强度，电路板可包括层压结构，其中导热层安置在光透射支撑物(例如玻璃或塑料材料)上。Circuit board 310 may comprise any light transmissive material that is at least translucent and preferably has a transmission coefficient of 50% or greater for visible light. Accordingly, the circuit board may comprise glass or plastic material such as polypropylene, silicone or acrylic. To help dissipate the heat generated by the LED chips 320, the circuit board 310 is not only light transmissive but also advantageously thermally conductive. Examples of suitable light transmissive thermally conductive materials include: magnesium oxide, sapphire, aluminum oxide, quartz glass, aluminum nitride, and diamond. The transmittance of a thermally conductive circuit board can be increased by making the circuit board thinner. For increased mechanical strength, the circuit board may comprise a laminated structure in which a thermally conductive layer is placed on a light transmissive support such as glass or plastic material.
电路板310进一步包括导电轨330，其以所需电路配置来配置以电连接LED芯片320。如所说明，LED芯片320串联连接为一串，但将了解，可使用其它电路配置。导电轨330通常包括铜、银或其它金属或透明电导体，例如氧化铟锡(ITO)。如所说明，通常使用接合导线340将LED芯片320电连接到导电轨330。在其它实施例中，LED芯片可包括表面可安装或倒装芯片装置。可通过焊接、导热粘合剂或通过所属领域的技术人员将明白的其它固定方法将LED芯片320安装到电路板。在光透射电路板310包括导热材料的情况下，LED芯片320有利地安装成与电路板热连通。散热化合物(例如，氧化铍)可用于帮助将LED芯片热耦合到电路板。The circuit board 310 further includes conductive tracks 330 configured in a desired circuit configuration to electrically connect the LED chips 320 . As illustrated, the LED chips 320 are connected in series in a string, but it will be appreciated that other circuit configurations may be used. Conductive track 330 typically comprises copper, silver or other metal or a transparent electrical conductor such as indium tin oxide (ITO). As illustrated, LED chips 320 are typically electrically connected to conductive rails 330 using bond wires 340 . In other embodiments, the LED chips may comprise surface mount or flip chip devices. The LED chips 320 may be mounted to the circuit board by soldering, thermally conductive adhesive, or by other methods of attachment that will be apparent to those skilled in the art. Where the light transmissive circuit board 310 comprises a thermally conductive material, the LED chips 320 are advantageously mounted in thermal communication with the circuit board. A heat dissipation compound (eg, beryllium oxide) can be used to help thermally couple the LED chip to the circuit board.
发光装置300进一步包括光致发光波长转换组件350，其包括至少一种光致发光材料与光反射材料的颗粒的混合物，所述混合物以囊封层的形式直接施覆到LED芯片320。通常，所述至少一种光致发光材料包括黄绿色发光磷光体材料。为增大由所述装置产生的光的CRI(显色指数)，光致发光波长转换组件可进一步包括橙红色发光磷光体。在替代实施例中，所述装置可包括红色发光ELD芯片以增大所述装置的发射产物的CRI。为帮助形成均匀发射色彩，红色发光LED还可由光致发光波长转换组件覆盖。The light emitting device 300 further comprises a photoluminescent wavelength conversion component 350 comprising a mixture of at least one photoluminescent material and particles of a light reflective material, said mixture being applied directly to the LED chip 320 in the form of an encapsulation layer. Typically, the at least one photoluminescent material comprises a yellow-green light emitting phosphor material. To increase the CRI (Color Rendering Index) of the light generated by the device, the photoluminescence wavelength conversion component may further include an orange-red light emitting phosphor. In an alternative embodiment, the device may include a red emitting ELD chip to increase the CRI of the emission product of the device. To help create a uniform emission color, the red emitting LED can also be covered by a photoluminescence wavelength conversion component.
在操作中，由LED芯片320产生的蓝色激发光激发光致发光材料产生更长波长的光致发光的光(通常，颜色为黄绿色)。装置的呈现为白色色彩的发射产物包括经组合的光致发光的光与未转换蓝色LED光。如先前所描述，因为光致发光的光产生过程是各向同性的，所以在所有方向上均等地产生磷光体光且在朝向电路板的方向上发射的光可穿过电路板且从所述装置的后方发射。类似地，归因于由光反射颗粒进行的光散射的各向同性本质，未转换的蓝色激发光还将在朝向电路板的方向上散射且此同样可穿过电路板且从所述装置的后方发射。将了解，使用光透射电路板(衬底)使得所述装置能够实现大体上全向的发射特性。相比之下，在其中LED芯片封装或安装在常规非透射(通常为反射性)电路板上的装置中，发射特性始终小于180度。如先前所描述，通过合并光反射材料的颗粒与磷光体，这减少了产生给定发射产物色彩所需的磷光体的量。In operation, blue excitation light generated by LED chip 320 excites the photoluminescent material to produce longer wavelength photoluminescent light (typically, yellow-green in color). The emission product of the device, which assumes a white color, comprises the combined photoluminescent light and unconverted blue LED light. As previously described, because the light generation process of photoluminescence is isotropic, phosphor light is generated equally in all directions and light emitted in the direction towards the circuit board can pass through the circuit board and from the The rear of the device fires. Similarly, due to the isotropic nature of light scattering by light reflective particles, unconverted blue excitation light will also scatter in a direction towards the circuit board and this can also pass through the circuit board and from the device rear launch. It will be appreciated that the use of a light transmissive circuit board (substrate) enables the device to achieve a substantially omnidirectional emission characteristic. In contrast, in devices where the LED chip is packaged or mounted on a conventional non-transmissive (usually reflective) circuit board, the emission characteristic is consistently less than 180 degrees. As previously described, by combining particles of light reflective material with the phosphor, this reduces the amount of phosphor required to produce a given emission product color.
图15a及15b分别说明利用图14的发光装置的基于LED的灯(灯泡)400的穿过B-B的部分横截面侧视图及部分剖视平面图。灯400希望作为用于白炽A-19灯泡的节能替代物且具有符合能源之星要求的发射特性，即其具有270度以上的均匀(+/-20％)光发射及270度以上的最小5％的光发射。15a and 15b illustrate a partial cross-sectional side view and a partial cut-away plan view, respectively, through B-B of an LED-based lamp (bulb) 400 utilizing the light emitting device of FIG. 14 . Lamp 400 is intended as an energy efficient replacement for an incandescent A-19 bulb and has ENERGY STAR compliant emission characteristics, i.e. it has a uniform (+/- 20%) light emission over 270 degrees and a minimum 5 % light emission.
在一些实施例中，灯400经配置以使用如用于北美的110V(r.m.s.)AC(60Hz)主电力供应器进行操作。灯400包括大体上圆锥形的导热主体410。主体410的外表面大体上类似于圆锥体的截头锥体；即，其顶点(尖端)被平行于基座的平面截去的圆锥体(即，截头圆锥形的)。主体410由具有高导热率(通常大于等于150Wm-1K-1，优选大于等于200Wm-1K-1)的材料(例如，铝(约等于250Wm-1K-1)、铝的合金、镁合金、金属装载塑料材料(例如，聚合物，(例如环氧树脂)))制成。便利地，当主体410包括金属合金时其可经模铸，或当主体410包括金属装载聚合物时其可通过(举例来说)注射模制来模制。In some embodiments, lamp 400 is configured to operate using a 110V (rms) AC (60 Hz) mains power supply as used in North America. Lamp 400 includes a generally conical thermally conductive body 410 . The outer surface of the body 410 is generally similar to the frustum of a cone; ie, a cone whose apex (tip) is truncated by a plane parallel to the base (ie, frustoconical).The main body 410 is made of a material (for example, aluminum (about 250Wm -1 K -1),aluminumalloy, magnesium alloy, metal-loaded plastic material (e.g., polymer, (e.g., epoxy resin))). Conveniently, the body 410 may be die cast when it comprises a metal alloy, or it may be molded by, for example, injection molding when it comprises a metal loaded polymer.
如图15a中说明，主体410可进一步包多个横向的径向延伸的热辐射鳍片(纹理)420，其围绕主体410的外弯曲表面在圆周上间隔。因为灯希望替代常规白炽A-19灯泡，所以灯的尺寸经选择以确保其将符合ANSI标准，从而使得灯配合常规灯具。主体410可进一步包括同轴圆柱形腔(未展示)，其从被截去顶点的主体延伸到主体中以容纳用于操作灯的整流器或其它驱动电路。主体410可进一步包含从主体的基座延伸的截头圆锥性的光反射基架部分430。基架部分430可形成为主体410的整体部分或形成为单独组件。当其制造为单独组件时，所述基架以热连通配置安装到所述主体。As illustrated in FIG. 15 a , the body 410 may further comprise a plurality of transverse radially extending heat radiating fins (textures) 420 spaced circumferentially around the outer curved surface of the body 410 . Because the lamp is intended to replace conventional incandescent A-19 bulbs, the dimensions of the lamp were selected to ensure that it would meet ANSI standards so that the lamp would fit conventional light fixtures. Body 410 may further include a coaxial cylindrical cavity (not shown) extending from the truncated body into the body to accommodate a rectifier or other drive circuitry for operating the lamp. The body 410 may further include a frustoconical light reflective base portion 430 extending from the base of the body. The base portion 430 may be formed as an integral part of the main body 410 or as a separate component. When manufactured as a separate component, the base frame is mounted to the body in thermal communication.
灯400进一步包括E26连接器基座(爱迪生螺纹灯座)440，其使得灯能够使用标准电照明螺纹插座直接连接到主电力供应器。将了解，取决于预期的应用，可使用其它连接器基座，例如，如通常用于英国、爱尔兰、澳大利亚、新西兰及英联邦的各个部分中的双接触式卡口连接器(即，B22d或BC)或如用于欧洲的E27螺纹基座(爱迪生螺纹灯座)。连接器基座440安装到主体410的经截去顶点。The lamp 400 further includes an E26 connector base (Edison screw socket) 440 which enables the lamp to be connected directly to the mains power supply using standard electrical lighting threaded sockets. It will be appreciated that other connector bases may be used, depending on the intended application, for example, a dual-contact bayonet connector (i.e., B22d or BC) or as used in Europe the E27 threaded base (Edison threaded lampholder). The connector base 440 is mounted to the truncated apex of the main body 410 .
灯400可进一步包括安装到主体410的基座的光透射外包体或罩盖450。罩盖450可包括玻璃或光透射聚合物，例如聚碳酸酯、丙烯酸、PET或PVC。所述罩壳可额外并入有或具有一层光扩散(散射)材料，例如，氧化锌(ZnO)、氧化钛(TiO2)、硫酸钡(BaSO4)、氧化镁(MgO)、二氧化硅(SiO2)或氧化铝(Al2O3)的颗粒。Lamp 400 may further include a light transmissive enclosure or cover 450 mounted to the base of body 410 . Cover 450 may comprise glass or a light transmissive polymer such as polycarbonate, acrylic, PET or PVC. The enclosure may additionally incorporate or have a layer of light diffusing (scattering) material such as zinc oxide (ZnO), titanium oxide (TiO2 ), barium sulfate (BaSO4 ), magnesium oxide (MgO), dioxide Particles of silicon (SiO2 ) or aluminum oxide (Al2 O3 ).
灯400可进一步包括例如图14中说明的全向基于LED的发光装置的全向基于LED的发光装置300a到300d。装置300a到300d中的每一者经定向成其电路板310在大体上平行于灯泡400的轴460的方向上延伸。装置300a到300d围绕基架430在圆周上均等地间隔，其中每一装置300a到300d的导热电路板310a到310d的第一端安装在基架430的圆锥表面中的狭槽中。每一装置的导热电路310的第一端安装成与导热基架430热连通，从而使得由LED芯片320产生的热量能够通过电路板传导到基架且传导到主体410中。操作装置300a到300d的电力可由每一狭槽(未展示)内的电连接器提供。如图15a中展示，每一发光装置300a到300d以与灯400的轴460所成的约三十度的角度安装到基架430且以圆锥形布置的形式配置。Lamp 400 may further include omnidirectional LED-based lighting devices 300 a - 300 d such as the omnidirectional LED-based lighting devices illustrated in FIG. 14 . Each of devices 300 a - 300 d is oriented with its circuit board 310 extending in a direction generally parallel to axis 460 of bulb 400 . The devices 300 a - 300 d are evenly spaced circumferentially around the base frame 430 , with the first end of the thermally conductive circuit board 310 a - 310 d of each device 300 a - 300 d mounted in a slot in the conical surface of the base frame 430 . The first end of the thermally conductive circuit 310 of each device is mounted in thermal communication with the thermally conductive base frame 430 such that heat generated by the LED chips 320 can be conducted through the circuit board to the base frame and into the main body 410 . Power to operate devices 300a-300d may be provided by electrical connectors within each slot (not shown). As shown in Figure 15a, each light emitting device 300a-300d is mounted to the base frame 430 at an angle of approximately thirty degrees to the axis 460 of the lamp 400 and is configured in a conical arrangement.
将了解，发光装置300的数目及配置可取决于所要发射特性及/或灯400的应用变化。举例来说，图16a及16b分别说明根据本发明的进一步实施例基于LED的灯400的穿过C-C侧的部分横截面侧视图及平面图。如同图15a及15b的实施例，所述灯希望成为白炽A-19灯泡的节能替代物且具有符合能源之星要求的发射特性。It will be appreciated that the number and configuration of light emitting devices 300 may vary depending on the desired emission characteristics and/or application of lamp 400 . For example, Figures 16a and 16b illustrate partial cross-sectional side and plan views, respectively, through side C-C of an LED-based lamp 400 according to a further embodiment of the present invention. As with the embodiment of Figures 15a and 15b, the lamp is intended to be an energy-efficient replacement for an incandescent A-19 bulb and has emission characteristics that meet Energy Star requirements.
本质上，图16a及16b的灯与图15a及15b的灯相同且相同参考数字用于指示相同部分。在此实施例中，四个发光装置300a到300d以经配置以沿着灯的直径延伸(图16b)的锯齿图案(图16a)配置。外面两个发光装置300a、300b的电路板310a、310d的第一端附接成与相应导热柱470a、470b的第一端热连通。每一柱470a、470b的第二端安装成与基架430的圆锥形表面热连通。除了提供用于将热量从发光装置300a、300d传导到主体410的导热路径之外，导热柱470a、470b可额外地向发光装置提供电力。第一发光装置300a、300d的第二端邻近于基架430的顶面(经截去顶点)而安装在基架430的圆锥形表面中的狭槽中。里面两个发光装置300b、300c的电路板310的第一端安装在邻近于发光装置300a、300d中的相应者的第二端的基架430的顶面中的狭槽中。里面两个发光装置300b、300c经配置使得其第二端在位于灯轴460上的顶点处相遇且通过导热帽480热连通地结合。Essentially, the lamps of Figures 16a and 16b are identical to the lamps of Figures 15a and 15b and the same reference numerals are used to designate the same parts. In this embodiment, four light emitting devices 300a-300d are arranged in a zigzag pattern (Fig. 16a) configured to extend along the diameter of the lamp (Fig. 16b). The first ends of the circuit boards 310a, 310d of the outer two light emitting devices 300a, 300b are attached in thermal communication with the first ends of the respective thermally conductive posts 470a, 470b. A second end of each post 470a, 470b is mounted in thermal communication with the conical surface of the base frame 430 . In addition to providing a thermally conductive path for conducting heat from the light emitting devices 300a, 300d to the main body 410, the thermally conductive posts 470a, 470b may additionally provide power to the light emitting devices. The second end of the first light emitting device 300a, 300d is mounted in a slot in the conical surface of the base frame 430 adjacent to the top surface (truncated apex) of the base frame 430 . The first ends of the circuit boards 310 of the inner two light emitting devices 300b, 300c are mounted in slots in the top surface of the base frame 430 adjacent to the second ends of the respective ones of the light emitting devices 300a, 300d. The inner two light emitting devices 300b, 300c are configured such that their second ends meet at an apex located on the lamp axis 460 and are bonded in thermal communication through a heat conducting cap 480 .
图17a到17c分别说明根据本发明的进一步实施例的基于LED的灯400的穿过D-D的部分横截面侧视图、穿过E-E的部分横截面图侧视图及平面图。如同图15及16的实施例，所述灯希望成为白炽A-19灯泡的节能替代物且具有符合能源之星要求的发射特性。17a-17c illustrate a partial cross-sectional side view through D-D, a partial cross-sectional side view through E-E, and a plan view, respectively, of an LED-based lamp 400 according to a further embodiment of the invention. As with the embodiment of Figures 15 and 16, the lamp is intended to be an energy efficient replacement for an incandescent A-19 bulb and has emission characteristics that meet Energy Star requirements.
在此实施例中，灯400包括单个发光装置300，其经定向使得电路板310沿着灯的直径延伸。所述装置的电路板310的底侧(即，不含有LED芯片的面)安装成与自截头圆锥形基架430的顶面(经截去顶点)延伸的导热支撑部件490热连通。为最大化从电路板310到支撑部件的热传导，如所指示，部件490可实质上延伸电路板的长度。在其它实施例中，支撑部件可包括其它几何形状，例如一或多个柱状物。用于操作LED芯片的电力可由延伸通过支撑物的内部内的通道的引线(未展示)提供。为帮助光发射，支撑部件可包括导热光透射材料。In this embodiment, lamp 400 includes a single light emitting device 300 oriented such that circuit board 310 extends along the diameter of the lamp. The bottom side (ie, the side not containing the LED chips) of the circuit board 310 of the device is mounted in thermal communication with a thermally conductive support member 490 extending from the top side (truncated at the apex) of the frustoconical submount 430 . To maximize heat transfer from the circuit board 310 to the support member, as indicated, member 490 may extend substantially the length of the circuit board. In other embodiments, the support member may comprise other geometries, such as one or more columns. Power for operating the LED chips may be provided by leads (not shown) extending through channels within the interior of the support. To aid light emission, the support member may include a thermally conductive light transmissive material.
图18展示根据本发明的实施例的全向基于LED的发光装置500的穿过F-F的截面边视图及部分剖视平面图。本质上，发光装置500与图14的发光装置相同且相同参考数字用于指示相同部分。在此实施例中，LED芯片320a、320b的相应线性阵列提供在光透射电路板310的相对面上。如所展示，LED芯片320a、320b的每一阵列由包括至少一种光致发光材料与光反射材料的颗粒的混合物的相应光致发光波长转换组件350a、350b直接囊封。如所指示，LED芯片320a、320b经安装使得每一LED与电路板310的相对面上的对应LED芯片对置，即，在制造公差内，一个面上的每一LED处于与相对面上的对应LED芯片相同的位置处。或者，相对面上的LED芯片320a、320b阵列可偏移。对于发射光通过其基座(即，与电路板接触的表面)的LED芯片，此配置可通过减少电路板的相对面上的LED芯片的光吸收来增加来自所述装置的发光。发光装置500的操作与图14的发光装置相同。18 shows a cross-sectional side view through F-F and a partially cut-away plan view of an omnidirectional LED-based lighting device 500 according to an embodiment of the invention. Essentially, the lighting device 500 is the same as that of Figure 14 and the same reference numerals are used to designate the same parts. In this embodiment, respective linear arrays of LED chips 320 a , 320 b are provided on opposite sides of the light transmissive circuit board 310 . As shown, each array of LED chips 320a, 320b is directly encapsulated by a respective photoluminescent wavelength conversion component 350a, 350b comprising a mixture of at least one photoluminescent material and particles of light reflective material. As indicated, the LED chips 320a, 320b are mounted such that each LED is opposite a corresponding LED chip on the opposite side of the circuit board 310, i.e., within manufacturing tolerances, each LED on one side is on the opposite side. Corresponding to the same position as the LED chip. Alternatively, the arrays of LED chips 320a, 320b on opposing sides may be offset. This configuration can increase luminescence from the device by reducing light absorption by the LED chip on the opposite face of the circuit board for the LED chip that emits light through its base (ie, the surface in contact with the circuit board). The operation of the light emitting device 500 is the same as the light emitting device of FIG. 14 .
现在参考图19a、19b描述根据本发明的实施例的替代性的全向基于LED的发光装置600，图19a、19b分别展示装置600的分解透视图及穿过G-G的横截面图。在此实施例中，发光装置600包括两个部分，即，在图20中说明的基于LED的光引擎610及远程光致发光波长转换组件620。An alternative omnidirectional LED-based lighting device 600 according to an embodiment of the present invention is now described with reference to Figures 19a, 19b, which show an exploded perspective view and a cross-sectional view through G-G, respectively, of the device 600. In this embodiment, the lighting device 600 includes two parts, namely, an LED-based light engine 610 and a remote photoluminescent wavelength conversion assembly 620 illustrated in FIG. 20 .
图20展示基于LED的光引擎610的示意侧视图及示意平面图，基于LED的光引擎610与图14的发光装置300相同，区别仅在于其不包含光致发光波长转换组件350。相同参考数字用于指示装置600及装置300的相同部分。因此，光引擎610包括光透射电路板310，其具有安装在所述电路板上且连接到所述电路板的蓝色发光未封装LED芯片320的阵列。如所说明，电路板310的形状可为细长的且LED芯片320配置为沿着电路板的长度的线性阵列。取决于应用，电路板可包括其它形状，例如为正方形或圆形且LED芯片配置为其它阵列或配置。电路板310优选地包括兼具光透射性且导热性的材料且可包括(举例来说)氧化镁、蓝宝石、氧化铝、石英玻璃、氮化铝或金刚石。20 shows a schematic side view and a schematic plan view of an LED-based light engine 610 that is the same as the lighting device 300 of FIG. 14 except that it does not include the photoluminescent wavelength conversion component 350 . Like reference numerals are used to designate like parts of device 600 and device 300 . Thus, the light engine 610 includes a light transmissive circuit board 310 having an array of blue light emitting unpackaged LED chips 320 mounted on and connected to the circuit board. As illustrated, the circuit board 310 may be elongated in shape with the LED chips 320 arranged in a linear array along the length of the circuit board. Depending on the application, the circuit board may comprise other shapes, such as square or circular and the LED chips arranged in other arrays or configurations. The circuit board 310 preferably includes a material that is both light transmissive and thermally conductive and may include, for example, magnesium oxide, sapphire, aluminum oxide, quartz glass, aluminum nitride, or diamond.
参考图19a及19b，全向基于LED的发光装置600包括光引擎610及远程光致发光波长转换组件620。如图中指示，光致发光波长转换组件620可包括管状组件，其中光引擎610安装在组件的钻孔内。将了解，组件620的壁围绕光引擎610。波长转换组件并入有至少一种光致发光材料与遍及组件均匀分布的光反射材料的颗粒的混合物。通常，所述至少一种光致发光材料包括黄绿色发光磷光体材料且可额外包含橙红色磷光体以增加CRI及/或降低所述装置的发射产物的色温。在替代实施例中，光致发光材料与光反射材料的颗粒的混合物可包括波长转换组件620上的分离层。优选地，使用光透射热塑性材料(包含聚碳酸酯、丙烯酸、PVC(聚氯乙烯)、尼龙、HDPE(高密度聚丙烯)、聚乙烯、PET(聚对苯二甲酸乙酯)或POM(聚甲醛))通过挤出或注射模制来制造波长转换组件620。Referring to FIGS. 19a and 19b , an omnidirectional LED-based lighting device 600 includes a light engine 610 and a remote photoluminescent wavelength conversion component 620 . As indicated, the photoluminescence wavelength conversion assembly 620 may comprise a tubular assembly with the light engine 610 mounted within a bore of the assembly. It will be appreciated that the walls of assembly 620 surround light engine 610 . The wavelength conversion component incorporates a mixture of at least one photoluminescent material and particles of light reflective material uniformly distributed throughout the component. Typically, the at least one photoluminescent material includes a yellow-green emitting phosphor material and may additionally include an orange-red phosphor to increase the CRI and/or lower the color temperature of the emission product of the device. In an alternative embodiment, the mixture of photoluminescent material and particles of light reflective material may comprise a separation layer on the wavelength conversion component 620 . Preferably, light transmissive thermoplastic materials including polycarbonate, acrylic, PVC (polyvinyl chloride), nylon, HDPE (high density polypropylene), polyethylene, PET (polyethylene terephthalate) or POM (polyethylene terephthalate) are used. formaldehyde)) to fabricate the wavelength conversion component 620 by extrusion or injection molding.
为防止来自组件的末端的发光，所述装置可进一步包括覆盖组件的敞开端的端帽630、640。端帽630、640可包括光反射材料或与组件620相同的材料且包含光致发光材料与光反射材料的颗粒的混合物。如所展示，一个盖帽630(图中的上盖帽)完全覆盖组件开口，而另一盖帽640(图中的下盖帽)包含孔径650(贯穿通道)，光引擎610的电路板310穿过孔径650。To prevent light emission from the ends of the components, the device may further include end caps 630, 640 covering the open ends of the components. End caps 630, 640 may comprise a light reflective material or the same material as component 620 and comprise a mixture of photoluminescent material and particles of light reflective material. As shown, one cap 630 (the upper cap in the figure) completely covers the assembly opening, while the other cap 640 (the lower cap in the figure) contains an aperture 650 (a through-channel) through which the circuit board 310 of the light engine 610 passes. .
图21说明利用图19的发光装置600的基于LED的灯(灯泡)400的部分横截面侧视图。灯400希望成为白炽A-19灯泡的节能替代物且具有符合能源之星要求的发射特性，即其具有270度以上的均匀(+/-20％)光发射及270度以上的最小5％的光发射。21 illustrates a partial cross-sectional side view of an LED-based lamp (bulb) 400 utilizing the lighting device 600 of FIG. 19 . Lamp 400 is intended to be an energy efficient replacement for the incandescent A-19 bulb and has ENERGY STAR compliant emission characteristics, i.e. it has a uniform (+/- 20%) light emission over 270 degrees and a minimum 5% radiance over 270 degrees. light emission.
本质上，图21的灯与图15、图16及图17的灯相同且相同参考数字用于指示相同部分。在此实施例中，灯400包括三个发光装置600a、600b及600c，其中每一者在平行于灯的轴460的方向上定向。每一发光装置600a到600c的电路板310的第一端安装成与圆锥形基架430的上平坦表面(经截顶点)热连通且当沿着灯的轴观察时装置配置为等边三角形。Essentially, the lamp of Figure 21 is identical to the lamps of Figures 15, 16 and 17 and the same reference numerals are used to designate the same parts. In this embodiment, lamp 400 includes three light emitting devices 600a, 600b, and 600c, each of which is oriented in a direction parallel to axis 460 of the lamp. The first end of the circuit board 310 of each light emitting device 600a-c is mounted in thermal communication with the upper planar surface (through the truncated point) of the conical submount 430 and the device configuration is an equilateral triangle when viewed along the axis of the lamp.
将了解，根据本发明的发光装置并不限于所描述的示范性实施例，且在本发明的范围内可做出变动。例如，虽然本发明已关于基于LED的发光装置加以描述，但本发明还适用于基于其它固态发光体(包含固态激光器及激光二极管)的装置。It will be appreciated that the lighting device according to the invention is not limited to the described exemplary embodiments and that variations may be made within the scope of the invention. For example, while the invention has been described with respect to LED-based light emitting devices, the invention is also applicable to devices based on other solid state light emitters, including solid state lasers and laser diodes.
| Application Number | Priority Date | Filing Date | Title |
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| US14/141,275US8957585B2 (en) | 2010-10-05 | 2013-12-26 | Solid-state light emitting devices with photoluminescence wavelength conversion |
| US14/141,275 | 2013-12-26 |
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| CN104752590B CN104752590B (en) | 2019-06-11 |
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