技术领域technical field
本发明涉及一种模块集成电路封装结构及其制作方法，尤指一种具有电性屏蔽功能的模块集成电路封装结构及其制作方法。The invention relates to a module integrated circuit packaging structure and a manufacturing method thereof, in particular to a module integrated circuit packaging structure with an electrical shielding function and a manufacturing method thereof.
背景技术Background technique
近几年来，科技的快速成长，使得各种产品纷纷朝向结合科技的应用，并且还不断地在进步发展当中。此外由于产品的功能越来越多，使得目前大多数的产品都是采用模块化的方式来整合设计。然而，在产品中整合多种不同功能的模块，虽然得以使产品的功能大幅增加，但是在现今讲究产品小型化及精美外观的需求之下，要如何设计出兼具产品体积小且多功能的产品，便是目前各行各业都在极力研究的目标。In recent years, with the rapid development of science and technology, various products are oriented toward the application of technology, and are still in the process of continuous progress and development. In addition, due to more and more functions of products, most of the current products are designed in a modular way. However, the integration of multiple modules with different functions in the product can greatly increase the function of the product, but under the current demand for miniaturization and exquisite appearance of the product, how to design a product that is both small in size and multi-functional? Product is the goal that all walks of life are currently researching.
而在半导体制造方面，便是不断地通过工艺技术的演进以越来越高阶的技术来制造出体积较小的芯片或元件，以使应用的模块厂商相对得以设计出较小的功能模块，进而可以让终端产品作为更有效的利用及搭配。而目前的已知技术来看，大部分的应用模块仍是以印刷电路板、环氧树脂基板或BT（Bismaleimide Triazine）基板等不同材质的基板来作为模块的主要载板，而所有芯片、元件等零件再通过表面黏着技术（SMT）等打件方式来黏着于载板的表面。于是载板纯粹只是用以当载具而形成电路连接之用，其中的结构也只是用以作为线路走线布局的分层结构。In terms of semiconductor manufacturing, it is to continuously manufacture smaller chips or components through the evolution of process technology with increasingly higher-level technologies, so that the applied module manufacturers can relatively design smaller functional modules. In turn, end products can be used and matched more effectively. According to the current known technology, most of the application modules still use substrates of different materials such as printed circuit boards, epoxy resin substrates or BT (Bismaleimide Triazine) substrates as the main carrier of the module, and all chips and components The parts are then adhered to the surface of the carrier board by surface mount technology (SMT) and other punching methods. Therefore, the carrier board is purely used as a carrier to form circuit connections, and the structure therein is only used as a layered structure for wiring layout.
再者，随着射频通讯技术的发展，意味着无线通信元件于电路设计上必须更严谨与效能优化。无线通信产品大都要求重量轻、体积小、高品质、低价位、低消耗功率及高可靠度等特点，这些特点促进了射频/微波集成电路的技术开发与市场成长。而无线通信产品中无线模块的电磁屏蔽功能及品质要求相对显得重要，以确保信号不会彼此干扰而影响到通讯品质。Furthermore, with the development of radio frequency communication technology, it means that the circuit design of wireless communication components must be more rigorous and performance optimized. Most wireless communication products require features such as light weight, small size, high quality, low price, low power consumption, and high reliability. These features promote the technology development and market growth of RF/microwave integrated circuits. The electromagnetic shielding function and quality requirements of wireless modules in wireless communication products are relatively important to ensure that signals will not interfere with each other and affect communication quality.
已知无线模块或其他需要作电磁屏蔽的电路模块，其必须依据所需应用而加设电磁屏蔽的结构，例如电磁屏蔽金属盖体设计。而电磁屏蔽结构的尺寸大小又必须配合不同的模块，以使得线路中的信号源能被隔离及隔绝。但此种已知的电磁屏蔽金属盖体必须针对不同的模块或装置进行设计制作，使已知电磁屏蔽金属盖体需耗费较多的工时、人力与成本。Known wireless modules or other circuit modules that require electromagnetic shielding must be provided with electromagnetic shielding structures according to the required applications, such as the design of electromagnetic shielding metal covers. The size of the electromagnetic shielding structure must match different modules, so that the signal source in the line can be isolated and isolated. But this kind of known electromagnetic shielding metal cover must be designed and manufactured for different modules or devices, so that the known electromagnetic shielding metal cover needs more man-hours, manpower and cost.
此外，上述已知电磁屏蔽金属盖体的另一缺点为需要作电磁屏蔽的电子电路或装置的大小、形状、区块不一，如需针对每一个不同大小、形状、区块的模块予以制作手工模具、进行冲压加工及逐步元件封装，则使得电磁屏蔽金属盖体的制作困难且无法适用于快速生产的生产在线，而得使已知电磁屏蔽金属盖体生产的经济效益与产业利用性降低。In addition, another disadvantage of the above-mentioned known electromagnetic shielding metal cover is that the size, shape, and block of the electronic circuit or device that needs to be used for electromagnetic shielding are different. If it is necessary to manufacture modules with different sizes, shapes, and blocks Manual moulds, stamping processing and step-by-step component packaging make the production of electromagnetic shielding metal covers difficult and cannot be applied to the production line of rapid production, which reduces the economic benefits and industrial utilization of known electromagnetic shielding metal covers. .
发明内容Contents of the invention
本发明实施例在于提供一种具有电性屏蔽功能的模块集成电路封装结构及其制作方法，其可有效解决“已知使用电磁屏蔽金属盖体”的缺陷。The embodiment of the present invention is to provide a modular integrated circuit packaging structure with electrical shielding function and its manufacturing method, which can effectively solve the defect of "the known electromagnetic shielding metal cover".
本发明其中一实施例所提供的一种具有电性屏蔽功能的模块集成电路封装结构，其包括：一基板单元、一电子单元、一封装单元及一屏蔽单元。所述基板单元包括一具有一外环绕周围的电路基板、一设置在所述电路基板内部且被所述电路基板完全包覆的接地层、一设置在所述电路基板的所述外环绕周围上的外导电结构、及一设置在所述电路基板内部且电性连接于所述接地层及所述外导电结构之间的内导电结构，其中所述外导电结构包括多个设置在所述电路基板的所述外环绕周围上的外导电层，所述内导电结构包括多个分别对应于所述外导电层的内导电层，且每一个所述内导电层的两个相反末端分别直接接触所述接地层及相对应的所述外导电层。所述电子单元包括多个设置在所述电路基板上且电性连接于所述电路基板的电子元件，其中所述电子元件通过所述电路基板以电性连接于所述接地层。所述封装单元包括一设置在所述电路基板上且覆盖所述电子元件的封装胶体。所述屏蔽单元包括一披覆在所述封装胶体的外表面上且直接接触所述外导电结构的金属屏蔽层，其中所述接地层依序通过所述内导电结构及所述外导电结构，以电性连接于所述金属屏蔽层。An embodiment of the present invention provides a modular integrated circuit packaging structure with electrical shielding function, which includes: a substrate unit, an electronic unit, a packaging unit and a shielding unit. The substrate unit includes a circuit substrate with an outer circumference, a ground layer disposed inside the circuit substrate and completely covered by the circuit substrate, and a ground layer disposed on the outer circumference of the circuit substrate. An outer conductive structure, and an inner conductive structure arranged inside the circuit substrate and electrically connected between the ground layer and the outer conductive structure, wherein the outer conductive structure includes a plurality of An outer conductive layer on the outer periphery of the substrate, the inner conductive structure includes a plurality of inner conductive layers respectively corresponding to the outer conductive layer, and two opposite ends of each inner conductive layer directly contact The ground layer and the corresponding outer conductive layer. The electronic unit includes a plurality of electronic components disposed on the circuit substrate and electrically connected to the circuit substrate, wherein the electronic components are electrically connected to the ground layer through the circuit substrate. The encapsulation unit includes an encapsulant disposed on the circuit substrate and covering the electronic components. The shielding unit includes a metal shielding layer coated on the outer surface of the encapsulant and directly contacting the outer conductive structure, wherein the ground layer passes through the inner conductive structure and the outer conductive structure in sequence, electrically connected to the metal shielding layer.
本发明另外一实施例所提供的一种具有电性屏蔽功能的模块集成电路封装结构，其包括：一基板单元、一电子单元、一封装单元及一屏蔽单元。所述基板单元包括一具有一外环绕周围的电路基板、一设置在所述电路基板内部的接地层、及一设置在所述电路基板的所述外环绕周围上的外导电结构，其中所述外导电结构包括多个设置在所述电路基板的所述外环绕周围上的外导电层，且所述接地层从所述电路基板的所述外环绕周围裸露，以直接接触所述外导电层。所述电子单元包括多个设置在所述电路基板上且电性连接于所述电路基板的电子元件，其中所述电子元件通过所述电路基板以电性连接于所述接地层。所述封装单元包括一设置在所述电路基板上且覆盖所述电子元件的封装胶体。所述屏蔽单元包括一披覆在所述封装胶体的外表面上且直接接触所述外导电结构的金属屏蔽层，其中所述接地层直接通过所述外导电结构，以电性连接于所述金属屏蔽层。Another embodiment of the present invention provides a modular integrated circuit packaging structure with electrical shielding function, which includes: a substrate unit, an electronic unit, a packaging unit and a shielding unit. The substrate unit includes a circuit substrate having an outer circumference, a ground layer disposed inside the circuit substrate, and an outer conductive structure disposed on the outer circumference of the circuit substrate, wherein the The outer conductive structure includes a plurality of outer conductive layers disposed on the outer circumference of the circuit substrate, and the ground layer is exposed from the outer circumference of the circuit substrate to directly contact the outer conductive layer . The electronic unit includes a plurality of electronic components disposed on the circuit substrate and electrically connected to the circuit substrate, wherein the electronic components are electrically connected to the ground layer through the circuit substrate. The encapsulation unit includes an encapsulant disposed on the circuit substrate and covering the electronic components. The shielding unit includes a metal shielding layer coated on the outer surface of the encapsulant and directly contacts the outer conductive structure, wherein the ground layer directly passes through the outer conductive structure to be electrically connected to the Metal shielding.
本发明另外再一实施例所提供的一种具有电性屏蔽功能的模块集成电路封装结构的制作方法，其包括下列步骤：提供一初始基板，所述初始基板包括多个彼此相连且成矩阵排列的基板单元，其中每一个所述基板单元包括一电路基板及一设置在所述电路基板内部的接地层；将多个电子单元分别设置在所述基板单元的所述电路基板上，其中每一个所述电子单元包括多个设置在相对应的所述电路基板上且电性连接于相对应的所述电路基板的电子元件，并且每一个所述电子单元的所述电子元件通过相对应的所述电路基板以电性连接于相对应的所述接地层；在所述初始基板上形成一初始封装单元，以覆盖所述电子单元，其中所述初始封装单元包括多个彼此相连的封装胶体，且每一个所述封装胶体设置在相对应的所述电路基板上且覆盖多个相对应的所述电子元件；切割所述初始基板及所述初始封装单元，以分离所述基板单元及分离所述封装胶体，其中每一个所述基板单元的所述外导电层从相对应的所述电路基板及相对应的所述封装胶体裸露；以及，分别在所述封装胶体的外表面上形成多个金属屏蔽层，其中每一个所述金属屏蔽层直接接触相对应的所述基板单元的所述外导电结构。Another embodiment of the present invention provides a method for manufacturing a modular integrated circuit packaging structure with an electrical shielding function, which includes the following steps: providing an initial substrate, the initial substrate includes a plurality of interconnected and arranged in a matrix A substrate unit, wherein each of the substrate units includes a circuit substrate and a ground layer arranged inside the circuit substrate; a plurality of electronic units are respectively arranged on the circuit substrate of the substrate unit, each of which The electronic unit includes a plurality of electronic components arranged on the corresponding circuit substrate and electrically connected to the corresponding circuit substrate, and the electronic components of each electronic unit pass through the corresponding The circuit substrate is electrically connected to the corresponding ground layer; an initial packaging unit is formed on the initial substrate to cover the electronic unit, wherein the initial packaging unit includes a plurality of packaging glue connected to each other, And each of the encapsulants is disposed on the corresponding circuit substrate and covers a plurality of corresponding electronic components; cutting the initial substrate and the initial packaging unit to separate the substrate unit and separate the The encapsulation compound, wherein the outer conductive layer of each substrate unit is exposed from the corresponding circuit substrate and the corresponding encapsulation compound; and a plurality of Metal shielding layers, wherein each of the metal shielding layers directly contacts the corresponding outer conductive structure of the substrate unit.
为使能更进一步了解本发明的特征及技术内容，请参阅以下有关本发明的详细说明与附图，然而所附图式仅提供参考与说明用，并非用来对本发明加以限制。In order to further understand the features and technical content of the present invention, please refer to the following detailed description and accompanying drawings of the present invention. However, the accompanying drawings are provided for reference and illustration only, and are not intended to limit the present invention.
附图说明Description of drawings
图1为本发明第一实施例所披露的一种具有电性屏蔽功能的模块集成电路封装结构的制作方法的流程图。FIG. 1 is a flow chart of a manufacturing method of a modular integrated circuit package structure with electrical shielding function disclosed in the first embodiment of the present invention.
图2为本发明第一实施例的模块集成电路封装结构的制作方法的步骤S100的上视示意图。FIG. 2 is a schematic top view of step S100 of the manufacturing method of the module integrated circuit package structure according to the first embodiment of the present invention.
图3为图2的A-A割面线的剖面示意图。FIG. 3 is a schematic cross-sectional view of the section line A-A of FIG. 2 .
图4为本发明第一实施例的模块集成电路封装结构的制作方法的步骤S102的剖面示意图。FIG. 4 is a schematic cross-sectional view of step S102 of the manufacturing method of the module integrated circuit packaging structure according to the first embodiment of the present invention.
图5为本发明第一实施例的模块集成电路封装结构的制作方法的步骤S104的剖面示意图。FIG. 5 is a schematic cross-sectional view of step S104 of the manufacturing method of the module integrated circuit packaging structure according to the first embodiment of the present invention.
图6为本发明第一实施例的模块集成电路封装结构的制作方法的步骤S106的剖面示意图。FIG. 6 is a schematic cross-sectional view of step S106 of the manufacturing method of the module integrated circuit packaging structure according to the first embodiment of the present invention.
图7为本发明第一实施例的模块集成电路封装结构的制作方法的步骤S108及模块集成电路封装结构的剖面示意图。7 is a schematic cross-sectional view of step S108 of the manufacturing method of the module integrated circuit package structure and the module integrated circuit package structure according to the first embodiment of the present invention.
图8为本发明第一实施例的模块集成电路封装结构的制作方法的步骤S108及模块集成电路封装结构的上视示意图。FIG. 8 is a schematic top view of step S108 of the manufacturing method of the modular integrated circuit packaging structure and the modular integrated circuit packaging structure according to the first embodiment of the present invention.
图9为本发明第二实施例所披露的模块集成电路封装结构的剖面示意图。FIG. 9 is a schematic cross-sectional view of the package structure of the modular integrated circuit disclosed in the second embodiment of the present invention.
【符号说明】【Symbol Description】
封装结构 ZPackage Structure Z
屏蔽单元初始基板 1’Shield unit initial substrate 1’
基板单元 1base unit 1
电路基板 10Circuit board 10
外环绕周围 100Outer Surround Around 100
接地层 11Ground plane 11
外导电结构 12Outer conductive structure 12
外导电层 120Outer conductive layer 120
切割侧壁 1200Cut sidewall 1200
半穿孔 121half pierced 121
内导电结构 13Inner conductive structure 13
内导电层 130inner conductive layer 130
电子单元 2Electronic unit 2
电子元件 20Electronic components 20
初始封装单元 3’Initial package unit 3’
封装单元 3Package unit 3
封装胶体 30Encapsulant 30
屏蔽单元 4Shielded unit 4
金属屏蔽层 40Metal shield 40
割面线 A-ACut surface line A-A
切割线 X-XCutting line X-X
具体实施方式detailed description
〔第一实施例〕[First embodiment]
请参阅图1至图7所示，本发明第一实施例提供一种具有电性屏蔽功能的模块集成电路封装结构Z的制作方法，其包括下列步骤：Referring to FIGS. 1 to 7, the first embodiment of the present invention provides a method for manufacturing a modular integrated circuit packaging structure Z with an electrical shielding function, which includes the following steps:
首先，步骤S100为：配合图1、图2及图3所示，提供一初始基板1’，初始基板1’包括多个彼此相连且成矩阵排列的基板单元1，其中每一个基板单元1包括一电路基板10、一设置在电路基板10内部的接地层11（例如片状的接地层11）、及一电性连接于接地层11的外导电结构12。举例来说，基板单元1可为一多层电路板结构，而接地层11就是多层电路板结构中的其中一层，当然接地层11也可以是多层电路板结构的最上层，而这最上层的接地层11会被直接设置在电路基板10的顶面上，然而本发明不以此例子为限。Firstly, step S100 is: as shown in FIG. 1 , FIG. 2 and FIG. 3 , an initial substrate 1' is provided. The initial substrate 1' includes a plurality of substrate units 1 connected to each other and arranged in a matrix, wherein each substrate unit 1 includes A circuit substrate 10 , a ground layer 11 (such as a sheet-shaped ground layer 11 ) disposed inside the circuit substrate 10 , and an external conductive structure 12 electrically connected to the ground layer 11 . For example, the substrate unit 1 can be a multi-layer circuit board structure, and the ground layer 11 is one of the layers in the multi-layer circuit board structure. Of course, the ground layer 11 can also be the uppermost layer of the multi-layer circuit board structure, and this The uppermost ground layer 11 is directly disposed on the top surface of the circuit substrate 10 , but the present invention is not limited to this example.
更进一步来说，基板单元1的接地层11被电路基板10所完全包覆，并且基板单元1的外导电结构12设置在电路基板10的一外环绕周围100上。另外，外导电结构12包括多个设置在电路基板10的外环绕周围100上的外导电层120，外导电结构12包括多个设置在电路基板10的外环绕周围100上且贯穿电路基板10的半穿孔121，并且多个外导电层120分别设置在多个半穿孔121的内表面上。此外，基板单元1包括一设置在电路基板10内部且电性连接于接地层11及外导电结构12之间的内导电结构13，内导电结构13包括多个分别对应于多个外导电层120的内导电层130（例如条状的内导电层130），并且每一个内导电层130的两个相反末端分别直接接触接地层11及相对应的外导电层120。Furthermore, the ground layer 11 of the substrate unit 1 is completely covered by the circuit substrate 10 , and the outer conductive structure 12 of the substrate unit 1 is disposed on an outer periphery 100 of the circuit substrate 10 . In addition, the outer conductive structure 12 includes a plurality of outer conductive layers 120 arranged on the outer circumference 100 of the circuit substrate 10, and the outer conductive structure 12 includes a plurality of outer conductive layers 120 arranged on the outer circumference 100 of the circuit substrate 10 and penetrating the circuit substrate 10. The half-through holes 121 , and the plurality of outer conductive layers 120 are respectively disposed on inner surfaces of the plurality of half-through holes 121 . In addition, the substrate unit 1 includes an inner conductive structure 13 disposed inside the circuit substrate 10 and electrically connected between the ground layer 11 and the outer conductive structure 12. The inner conductive structure 13 includes a plurality of outer conductive layers 120 respectively corresponding to The inner conductive layer 130 (for example, a strip-shaped inner conductive layer 130 ), and the two opposite ends of each inner conductive layer 130 directly contact the ground layer 11 and the corresponding outer conductive layer 120 respectively.
接着，步骤S102为：配合图1、图3及图4所示，将多个电子单元2分别设置在多个基板单元1的多个电路基板10上，其中每一个电子单元2包括多个设置在相对应的电路基板10上且电性连接于相对应的电路基板10的电子元件20，并且每一个电子单元2的多个电子元件20通过相对应的电路基板10，以电性连接于相对应的接地层11。举例来说，作为多层电路板结构的电路基板10内部具有至少一电性连接于电子元件20及接地层11之间的导电结构设计，以使得每一个电子单元2的多个电子元件20可通过相对应的电路基板10以电性连接于相对应的接地层11。Next, step S102 is: as shown in FIG. 1, FIG. 3 and FIG. The electronic components 20 on the corresponding circuit substrate 10 are electrically connected to the corresponding circuit substrate 10, and the plurality of electronic components 20 of each electronic unit 2 are electrically connected to the corresponding circuit substrate 10 through the corresponding circuit substrate 10. Corresponding ground plane 11. For example, the circuit substrate 10 as a multi-layer circuit board structure has at least one conductive structure design that is electrically connected between the electronic components 20 and the ground layer 11, so that the multiple electronic components 20 of each electronic unit 2 can be It is electrically connected to the corresponding ground layer 11 through the corresponding circuit substrate 10 .
然后，步骤S104为：配合图1、图4及图5所示，形成一初始封装单元3’于初始基板1’上，以覆盖多个电子单元2，其中初始封装单元3’包括多个彼此相连的封装胶体30，并且每一个封装胶体30设置在相对应的电路基板10上且覆盖多个相对应的电子元件20。举例来说，封装胶体30可为硅树脂（silicone）或环氧树脂（epoxy）所制成的非透明胶体。Then, step S104 is: as shown in FIG. 1, FIG. 4 and FIG. 5, an initial packaging unit 3' is formed on the initial substrate 1' to cover a plurality of electronic units 2, wherein the initial packaging unit 3' includes multiple The encapsulant 30 is connected, and each encapsulant 30 is disposed on the corresponding circuit substrate 10 and covers a plurality of corresponding electronic components 20 . For example, the packaging colloid 30 can be a non-transparent colloid made of silicone or epoxy.
接下来，步骤S106为：配合图1、图5及图6所示，沿着图5的X-X切割线来切割初始基板1’及初始封装单元3’，以分离多个基板单元1及分离多个封装胶体30，其中每一个基板单元1的外导电层120从相对应的电路基板10及相对应的封装胶体30裸露。更进一步来说，多个半穿孔121被封装胶体30所填满，以使得多个外导电层120被封装胶体30所覆盖。另外，每一个外导电层120的两个相反末端上各具有一切割侧壁1200，并且每一个外导电层120的每一个切割侧壁1200从电路基板10及封装胶体30裸露。Next, step S106 is: as shown in FIG. 1, FIG. 5 and FIG. 6, cut the initial substrate 1' and the initial packaging unit 3' along the X-X cutting line in FIG. Each encapsulant 30 , wherein the outer conductive layer 120 of each substrate unit 1 is exposed from the corresponding circuit substrate 10 and the corresponding encapsulant 30 . Furthermore, the plurality of half-through holes 121 are filled by the encapsulant 30 , so that the plurality of outer conductive layers 120 are covered by the encapsulant 30 . In addition, two opposite ends of each outer conductive layer 120 have a cut sidewall 1200 , and each cut sidewall 1200 of each outer conductive layer 120 is exposed from the circuit substrate 10 and the encapsulant 30 .
最后，步骤S108为：配合图1、图6、图7及图8所示，分别形成多个金属屏蔽层40在多个封装胶体30的外表面上，其中每一个金属屏蔽层40直接接触相对应的基板单元1的多个外导电结构12，以使得每一个基板单元1的接地层11可依序通过相对应的内导电结构13及相对应的外导电结构12，以电性连接于相对应的金属屏蔽层40。Finally, step S108 is: as shown in FIG. 1, FIG. 6, FIG. 7 and FIG. The plurality of outer conductive structures 12 of the corresponding substrate unit 1, so that the ground layer 11 of each substrate unit 1 can pass through the corresponding inner conductive structure 13 and the corresponding outer conductive structure 12 in order to be electrically connected to the phase Corresponding metal shielding layer 40 .
综上所述，配合图7及图8所示，依据上述所提供的制作方法，本发明第一实施例可以提供一种具有电性屏蔽功能的模块集成电路封装结构Z，其包括：一基板单元1、一电子单元2、一封装单元3及一屏蔽单元4。In summary, as shown in FIG. 7 and FIG. 8 , according to the manufacturing method provided above, the first embodiment of the present invention can provide a modular integrated circuit packaging structure Z with an electrical shielding function, which includes: a substrate A unit 1 , an electronic unit 2 , a packaging unit 3 and a shielding unit 4 .
首先，基板单元1包括一具有一外环绕周围100的电路基板10、一设置在电路基板10内部且被电路基板10完全包覆的接地层11、一设置在电路基板10的外环绕周围100上的外导电结构12、及一设置在电路基板10内部且电性连接于接地层11及外导电结构12之间的内导电结构13。其中，外导电结构12包括多个设置在电路基板10的外环绕周围100上的外导电层120，内导电结构13包括多个分别对应于多个外导电层120的内导电层130，并且每一个内导电层130的两个相反末端分别直接接触接地层11及相对应的外导电层120。Firstly, the substrate unit 1 includes a circuit substrate 10 with an outer circumference 100 , a grounding layer 11 disposed inside the circuit substrate 10 and completely covered by the circuit substrate 10 , and a ground layer 11 disposed on the outer circumference 100 of the circuit substrate 10 . An outer conductive structure 12 and an inner conductive structure 13 disposed inside the circuit substrate 10 and electrically connected between the ground layer 11 and the outer conductive structure 12 . Wherein, the outer conductive structure 12 includes a plurality of outer conductive layers 120 disposed on the outer periphery 100 of the circuit substrate 10, the inner conductive structure 13 includes a plurality of inner conductive layers 130 respectively corresponding to the plurality of outer conductive layers 120, and each Two opposite ends of an inner conductive layer 130 directly contact the ground layer 11 and the corresponding outer conductive layer 120 respectively.
再者，电子单元2包括多个设置在电路基板10上且电性连接于电路基板10的电子元件20，其中多个电子元件20可通过电路基板10以电性连接于接地层11。举例来说，多个电子元件20可为电阻、电容、电感、或具有一预定功能的半导体芯片等等，然而本发明不以此为限。Moreover, the electronic unit 2 includes a plurality of electronic components 20 disposed on the circuit substrate 10 and electrically connected to the circuit substrate 10 , wherein the plurality of electronic components 20 can be electrically connected to the ground layer 11 through the circuit substrate 10 . For example, the plurality of electronic components 20 can be resistors, capacitors, inductors, or semiconductor chips with a predetermined function, etc., but the invention is not limited thereto.
另外，封装单元3包括一设置在电路基板10上且覆盖多个电子元件20的封装胶体30，并且屏蔽单元4包括一披覆在封装胶体30的外表面上且直接接触外导电结构12的金属屏蔽层40，其中封装胶体30完全被金属屏蔽层40所包覆。藉此，接地层11可依序通过内导电结构13及外导电结构12，以电性连接于金属屏蔽层40。举例来说，依据不同的设计需求，金属屏蔽层40可为一通过喷涂方式（spraying）所形成的导电喷涂层、一通过溅镀方式（sputtering）所形成的导电溅镀层、一通过印刷方式（printing）所形成的导电印刷层、或一通过电镀方式（electroplating）所形成的导电电镀层等等，然而本发明不以此为限。In addition, the encapsulation unit 3 includes an encapsulant 30 disposed on the circuit substrate 10 and covering the plurality of electronic components 20, and the shielding unit 4 includes a metal covering the outer surface of the encapsulant 30 and directly contacting the outer conductive structure 12. The shielding layer 40 , wherein the encapsulant 30 is completely covered by the metal shielding layer 40 . In this way, the ground layer 11 can pass through the inner conductive structure 13 and the outer conductive structure 12 in order to be electrically connected to the metal shielding layer 40 . For example, according to different design requirements, the metal shielding layer 40 can be a conductive sprayed layer formed by spraying, a conductive sputtered layer formed by sputtering, a conductive sputtered layer formed by printing ( A conductive printing layer formed by printing, or a conductive electroplating layer formed by electroplating, etc., however, the present invention is not limited thereto.
更进一步来说，外导电结构12包括多个设置在电路基板10的外环绕周围100上且贯穿电路基板10的半穿孔121，多个外导电层120分别设置在多个半穿孔121的内表面上，并且多个半穿孔121被封装胶体30所填满，以使得多个外导电层120被封装胶体30所覆盖。另外，每一个外导电层120的两个相反末端上各具有一切割侧壁1200，并且每一个外导电层120的每一个切割侧壁1200从电路基板10及封装胶体30裸露，以直接接触金属屏蔽层40。Furthermore, the outer conductive structure 12 includes a plurality of semi-perforated holes 121 disposed on the outer periphery 100 of the circuit substrate 10 and penetrating the circuit substrate 10, and the plurality of outer conductive layers 120 are respectively disposed on the inner surfaces of the plurality of semi-perforated holes 121. , and the plurality of half-through holes 121 are filled by the encapsulant 30 , so that the plurality of outer conductive layers 120 are covered by the encapsulant 30 . In addition, each outer conductive layer 120 has a cut sidewall 1200 on two opposite ends, and each cut sidewall 1200 of each outer conductive layer 120 is exposed from the circuit substrate 10 and the encapsulant 30 to directly contact the metal. shielding layer 40 .
〔第二实施例〕[Second Embodiment]
请参阅图9所示，本发明第二实施例可以提供一种具有电性屏蔽功能的模块集成电路封装结构Z，其包括：一基板单元1、一电子单元2、一封装单元3及一屏蔽单元4。由图9及图7的比较可知，本发明第二实施例与第一实施例最大的差别在于：在第二实施例中，基板单元1包括一具有一外环绕周围100的电路基板10、一设置在电路基板10内部的接地层11、及一设置在电路基板10的外环绕周围100上的外导电结构12，其中外导电结构12包括多个设置在电路基板10的外环绕周围100上的外导电层120，并且接地层11的末端直接从电路基板10的外环绕周围100裸露，以直接接触多个外导电层120，所以接地层11可以直接通过外导电结构12，以电性连接于金属屏蔽层40。Please refer to FIG. 9, the second embodiment of the present invention can provide a modular integrated circuit packaging structure Z with electrical shielding function, which includes: a substrate unit 1, an electronic unit 2, a packaging unit 3 and a shielding Unit 4. From the comparison of Fig. 9 and Fig. 7, it can be seen that the biggest difference between the second embodiment of the present invention and the first embodiment is that: in the second embodiment, the substrate unit 1 includes a circuit substrate 10 with an outer circumference 100, a The ground layer 11 arranged inside the circuit substrate 10, and an outer conductive structure 12 arranged on the outer periphery 100 of the circuit substrate 10, wherein the outer conductive structure 12 includes a plurality of The outer conductive layer 120, and the end of the ground layer 11 is directly exposed from the outer circumference 100 of the circuit substrate 10 to directly contact a plurality of outer conductive layers 120, so the ground layer 11 can directly pass through the outer conductive structure 12 to be electrically connected to Metal shielding layer 40 .
因此，在第一实施例中，如图7所示，接地层11需要依序通过内导电结构13及外导电结构12，才可以电性连接于金属屏蔽层40；然而，在第二实施例中，如图9所示，接地层11只要单纯通过外导电结构12，即可电性连接于金属屏蔽层40。Therefore, in the first embodiment, as shown in FIG. 7, the ground layer 11 needs to pass through the inner conductive structure 13 and the outer conductive structure 12 in sequence before it can be electrically connected to the metal shielding layer 40; however, in the second embodiment Among them, as shown in FIG. 9 , the ground layer 11 can be electrically connected to the metal shielding layer 40 simply by passing through the outer conductive structure 12 .
以上所述仅为本发明的优选可行实施例，非因此局限本发明的专利范围，故举凡运用本发明说明书及图式内容所做的等效技术变化，均包含于本发明的权利要求范围内。The above descriptions are only preferred feasible embodiments of the present invention, and therefore do not limit the patent scope of the present invention. Therefore, all equivalent technical changes made by using the description and drawings of the present invention are included in the scope of the claims of the present invention. .
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310479235.9ACN104576617B (en) | 2013-10-14 | 2013-10-14 | Module integrated circuit packaging structure and manufacturing method thereof |
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310479235.9ACN104576617B (en) | 2013-10-14 | 2013-10-14 | Module integrated circuit packaging structure and manufacturing method thereof |
| Publication Number | Publication Date |
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| CN104576617A CN104576617A (en) | 2015-04-29 |
| CN104576617Btrue CN104576617B (en) | 2017-10-03 |
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310479235.9AActiveCN104576617B (en) | 2013-10-14 | 2013-10-14 | Module integrated circuit packaging structure and manufacturing method thereof |
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| CN (1) | CN104576617B (en) |
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