The manufacture method of separate elementsTechnical field
The present invention relates to a kind of manufacture method of element, particularly, relate to a kind of manufacture method of separate elements.
Background technology
Brilliant back of the body reduction process and brilliant back of the body metal deposition process is needed in the manufacture process of separate elements, but Chang Yinjing carries on the back mechanical polishing and causes trickle slight crack or deep layer lattice damage (as shown in Figure 5) on crystalline substance back of the body reduction process, form structural defect, cause brilliant back of the body metal peel off in successive process and cause production loss or element quality problem.
Summary of the invention
For defect of the prior art, the object of this invention is to provide a kind of manufacture method of separate elements, it obtains the uniformity of better brilliant back surface roughness (roughness) and reduces the risk of brilliant back of the body metal-stripping (peeling), thus reduces production loss or element quality problem.
According to an aspect of the present invention, a kind of manufacture method of separate elements is provided, it is characterized in that, comprise the following steps:
Step one, common grinding mode is thinning to wafer, and grinding wafer is fallen Part I;
Step 2, fine ground mode is thinning to wafer, and grinding wafer is fallen Part II;
Step 3, the wafer handled well in step 2 by Wet-type etching mode forms uniform outer surface roughness; The defect of trickle brilliant back surface is removed by hybrid solution;
Step 4, implements brilliant back of the body metal deposition process, deposition brilliant back of the body metal on the wafer after step 3 process.
Preferably, the thickness of described Part I is greater than the thickness of Part II.
Preferably, described hybrid solution comprises H2SO4, HNO3, HF, water, interfacial agent.
Compared with prior art, the present invention has following beneficial effect: the present invention's crystalline substance back of the body reduction process adopts the decline processing procedure of the thinning processing procedure of fine lapping and Wet-type etching of mixing machinery obtain the uniformity of better brilliant back surface roughness (roughness) and reduce the risk of brilliant back of the body metal-stripping (peeling), thus reduces production loss or element quality problem.
Accompanying drawing explanation
By reading the detailed description done non-limiting example with reference to the following drawings, other features, objects and advantages of the present invention will become more obvious:
Fig. 1 is the schematic diagram of the invention process step one.
Fig. 2 is the schematic diagram of the invention process step 2.
Fig. 3 is the schematic diagram after the invention process step 2.
Fig. 4 is the schematic diagram of the invention process step 4.
Fig. 5 before being the brilliant back of the body thinning after effect schematic diagram.
Fig. 6 is the effect schematic diagram after the invention process step one and step 2.
Fig. 7 is the effect schematic diagram after the invention process step 3.
Embodiment
Below in conjunction with specific embodiment, the present invention is described in detail.Following examples will contribute to those skilled in the art and understand the present invention further, but not limit the present invention in any form.It should be pointed out that to those skilled in the art, without departing from the inventive concept of the premise, some distortion and improvement can also be made.These all belong to protection scope of the present invention.
As shown in Figures 1 to 4, the manufacture method of separate elements of the present invention comprises the following steps:
Step one, common grinding mode is thinning to wafer, grinds away Part I (dotted portion of Fig. 1) 2 by wafer 1; The lapping mode of step one can be identical with former lapping mode; After this grinding, wafer rear is very coarse, height fluctuating size neither with, often have the surface tear of weight not grade.
Step 2, fine ground mode is thinning to wafer, grinds away Part II (dotted portion of Fig. 2) 3 by wafer 1, after grinding, wafer 1 has the defect 4 (as shown in Figure 6) of trickle brilliant back surface; The thickness of Part I 2 is greater than the thickness of Part II 3; Fine ground mode can reach the abrasive grains degree of 1500-3000Grit.Step 2 makes wafer rear smooth surface, and without the destruction that physics scratches, under different light rays, still cannot see the ring of light of scroll, light reflection is very even.
Step 3, the wafer handled well in step 2 by Wet-type etching mode forms uniform outer surface roughness; Removed the defect 4 (as shown in Figure 7) of trickle brilliant back surface by hybrid solution, to increase the contact area of itself and successive process back metal, to increase its degree of adhesion, play the effect avoiding back metal peeling.Hybrid solution (according to weight percent meter) comprises H2SO4 (80%-90%), HNO3 (10%-20%), HF (1%-5%), water (5%-10%), interfacial agent (1%-3%); Interfacial agent can be gel, BOE etc.
Step 4, implements brilliant back of the body metal deposition process, deposition brilliant back of the body metal 5 on the wafer 1 namely after step 3 process.
The present invention's crystalline substance back of the body reduction process adopts the decline processing procedure of the thinning processing procedure of fine lapping and Wet-type etching of mixing machinery obtain the uniformity of better brilliant back surface roughness (roughness) and reduce the risk of brilliant back of the body metal-stripping (peeling), thus reduces production loss or element quality problem.
Above specific embodiments of the invention are described.It is to be appreciated that the present invention is not limited to above-mentioned particular implementation, those skilled in the art can make various distortion or amendment within the scope of the claims, and this does not affect flesh and blood of the present invention.