Summary of the invention
For above-mentioned the deficiencies in the prior art, technical matters to be solved by this invention is: provide that a kind of structure is simple, cost is lower and the sound effect processing circuit for Vehicular navigation system that stability is higher.
For solving the problems of the technologies described above, the technical scheme that the present invention adopts is: provide a kind of sound effect processing circuit for Vehicular navigation system, comprise audio effect processing chip, some resistance and some electric capacity; Wherein:
The first end of one resistance R89 is connected with the GPS/BT_AL pin of omniselector control chip, and second end of described resistance R89 is connected with the first end of a resistance R88, the second end ground connection of described resistance R88; Second end of described resistance R89 is also connected with the first end of electric capacity C45, and second end of described electric capacity C45 is connected with the 5th of audio effect processing chip the pin SE2L; The first end of resistance R112 is connected with the GPS/BT_AR pin of omniselector control chip, and second end of described resistance R112 is connected with the first end of resistance R84, the second end ground connection of described resistance R84; Second end of described resistance R112 is also connected with the first end of electric capacity C3, and second end of described electric capacity C3 is connected with second pin SE2R of audio effect processing chip; First pin SE3R of described audio effect processing chip connects the TUNER_R pin of omniselector control chip; 3rd pin SE1R of described audio effect processing chip is connected with the first end of electric capacity C15, second end of described electric capacity C15 is connected with the first end of resistance R68, second end of described resistance R68 is connected with the DTV_AUDIO_R pin of omniselector control chip, second end of described electric capacity C15 is also connected with the first end of resistance R48, the second end ground connection of described resistance R48, second end of described electric capacity C15 is also connected with the first end of electric capacity C105, the second end ground connection of described electric capacity C105; 4th pin SE1L of described audio effect processing chip is connected with the first end of electric capacity C20, second end of described electric capacity C20 is connected with the first end of resistance R25, the second end ground connection of described resistance R25, second end of described electric capacity C20 is also connected with the first end of electric capacity C104, the second end ground connection of described electric capacity C104, second end of described electric capacity C20 is also connected with the first end of resistance R32, and second end of described resistance R32 is connected with omniselector control chip DTV_AUDIO_L pin; 6th pin SE3L of described audio effect processing chip is connected with the AUNER_L pin of omniselector control chip; 7th pin DIFFL of described audio effect processing chip is connected with the 4052_L pin of omniselector control chip; 8th pin DIFFG ground connection of described audio effect processing chip; 9th pin DIFFR of described audio effect processing chip is connected with the 4052_R pin of omniselector control chip; Tenth pin IGL of described audio effect processing chip is connected with the first end of electric capacity C71, and second end of described electric capacity C71 is connected with the 11 pin VOL of described audio effect processing chip; 12 pin IDL ground connection of described audio effect processing chip; 13 pin IGL of described audio effect processing chip is connected with the first end of electric capacity C77, and second end of described electric capacity C77 is connected with the 14 the pin VOR of described audio effect processing chip U3; 15 pin IDR ground connection of described audio effect processing chip; 16 pin BL1 of described audio effect processing chip is connected with the first end of electric capacity C79, the second end ground connection of described electric capacity C79; 17 pin BL2 of described audio effect processing chip is connected with second end of electric capacity C80, the second end ground connection of described electric capacity C80; 18 pin TRL of described audio effect processing chip is connected with the first end of electric capacity C81, the second end ground connection of described electric capacity C81; The nineteen pin TRR of described audio effect processing chip is connected with the first end of electric capacity C82, the second end ground connection of described electric capacity C82; 20 pin BR2 of described audio effect processing chip is connected with the first end of electric capacity C83, the second end ground connection of described electric capacity C83; 21 pin BR1 of described audio effect processing chip is connected with the first end of electric capacity C84, the second end ground connection of described electric capacity C84; 23 pin SOUT of described audio effect processing chip is connected with the first end of electric capacity C85, and second end of described electric capacity C85 is connected with the 24 pin SIN of described audio effect processing chip; 25 pin C2 ground connection of described audio effect processing chip; 26 pin C1P of described audio effect processing chip is connected with the first end of electric capacity C87, second end of described electric capacity C87 is connected with the 27 pin OUTSW of described audio effect processing chip, and the 27 pin OUTSW of described audio effect processing chip also connects SWOUT mouth; 28 pin RF of described audio effect processing chip is connected with FRONT_R mouth; Second nineteen pin RR of described audio effect processing chip is connected with REAR_R mouth; 30 pin LR of described audio effect processing chip is connected with REAR_L mouth; 31 pin LF of described audio effect processing chip is connected with FRONT_L mouth; 32 pin MIX/SWOUT of described audio effect processing chip is connected with the first end of electric capacity C102, the second end ground connection of described electric capacity C102, second end of described electric capacity C102 is also connected with the first end of resistance R120, second end of described resistance R120 is connected with GPS_MIXL pin, second end of described electric capacity C102 is also connected with the first end of resistance R87, and second end of described resistance R87 is connected with GPS_MIXR pin; 33 pin VDD of described audio effect processing chip is connected with A9V mouth, and described 33 pin VDD be direct ground connection also; 34 pin CREF of described audio effect processing chip and the equal ground connection of the 35 brother's pin GND; 36 pin SDA of described audio effect processing chip connects S_SDA2 mouth; 37 pin SCL of described audio effect processing chip connects S_SDL2 mouth; 22 pin of described audio effect processing chip, the the 30th the eight to four ten four pin NC are all vacant.
Wherein, the described sound effect processing circuit for Vehicular navigation system also comprises electric capacity C78, and described electric capacity C78 is connected between the 15 pin IDR of audio effect processing chip and the earth.
Wherein, the described sound effect processing circuit for Vehicular navigation system also comprises C76, and described electric capacity C76 is connected between the 12 pin IDL of audio effect processing chip and the earth.
Wherein, the described sound effect processing circuit for Vehicular navigation system also comprises C94, and described electric capacity C94 is connected between the 31 pin LF of audio effect processing chip and the earth.
Wherein, the described sound effect processing circuit for Vehicular navigation system also comprises electric capacity C93, and described electric capacity C93 is connected between the 30 pin RR of audio effect processing chip and the earth.
Wherein, the described sound effect processing circuit for Vehicular navigation system also comprises electric capacity C92, and described electric capacity C92 is connected between the 29 pin RR of audio effect processing chip and the earth.
Wherein, the described sound effect processing circuit for Vehicular navigation system also comprises electric capacity C90, and described electric capacity C90 is connected between the 28 pin RF of audio effect processing chip and the earth.
Wherein, the described sound effect processing circuit for Vehicular navigation system also comprises electric capacity C88, and described electric capacity C88 is connected between the 27 pin OUTSW of audio effect processing chip and the earth.
Wherein, the described sound effect processing circuit for Vehicular navigation system also comprises electric capacity C103, and described electric capacity C103 is connected between the 33 pin VDD of audio effect processing chip and the earth.
Wherein, the described sound effect processing circuit for Vehicular navigation system also comprises electric capacity C1, and described electric capacity C1 is connected between the first pin SE3R of audio effect processing chip and the earth.
In the present invention, the left channel signals exported by omniselector control chip core board and right-channel signals, input in this sound effect processing circuit, then have audio effect processing chip U3 to control to adjust to obtain to the size of sound, tone, sound field etc. the sound experience that user wants.Circuit structure is simple, cost is lower and reliability is higher.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, be clearly and completely described the technical scheme in the embodiment of the present invention, obviously, described embodiment is only the present invention's part embodiment, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making the every other embodiment obtained under creative work prerequisite, belong to the scope of protection of the invention.
First, before embodiment is described, be necessary that some terms to occurring make an explanation herein.Such as:
Use the term such as " first ", " second " to describe various element if occur herein, but these elements should not limited by these terms.These terms are only used for differentiation element and another element.Therefore, " first " element also can be called as " second " element and not depart from instruction of the present invention.
In addition, should be understood that, when mentioning an element " connection " or " connection " to another element, it can directly connect or directly be connected to another element or also can there is intermediary element.On the contrary, when mentioning that an element " directly connection " or " directly connecting " are to another element, then there is not intermediary element.
The various terms occurred in this article are only not intended to as limitation of the invention for describing the object of concrete embodiment.Unless context is clearly pointed out in addition, then singulative intention also comprises plural form.
" comprise " when using term in this manual and/or " including " time, these terms specify the existence of described feature, entirety, step, operation, element and/or parts, but also do not get rid of more than one other features, entirety, step, operation, element, the existence of parts and/or its group and/or additional.
About embodiment:
Refer to Fig. 1, Fig. 1 is that the present invention is for driving the circuit theory diagrams of the control circuit of on-vehicle navigation apparatus.The sound effect processing circuit for Vehicular navigation system of the present embodiment comprises resistance R89, R112, R84, R88, R68, R32, R25, R48, R16, R17, R120, R87, R53, electric capacity C104, C105, C1, C3, C15, C20, C45, C53, C57, C71, C55, C60, C76, C77, C78, C79, C80, C81, C82, C83, C84, C85, C86, C87, C88, C90, C92, C93, C94, C102, audio effect processing chip U3 and electric capacity EC1.Wherein:
The first end of described resistance R89 is connected with the GPS/BT_AL pin of omniselector control IC, and second end of resistance R89 is connected with the first end of resistance R88, the second end ground connection of described resistance R88; Second end of described resistance R89 is also connected with the first end of electric capacity C45, and second end of described electric capacity C45 is connected with the 5th the pin SE2L of audio effect processing chip U3; The first end of resistance R112 is connected with the GPS/BT_AR pin of omniselector control IC, and the second end of described resistance 112 is connected with the first end of resistance R84, the second end ground connection of described resistance R84; Second end of described resistance R112 is also connected with the first end of electric capacity C3, and second of described electric capacity C3 is connected with second pin SE2R of audio effect processing chip U3.
First pin SE3R of described audio effect processing chip U3 connects the first end of electric capacity C1, and second end of described electric capacity C1 is connected with the TUNER_R pin of omniselector control chip;
3rd the pin SE1R of described audio effect processing chip U3 is connected with the first end of electric capacity C15, second end of described electric capacity C15 is connected with the first end of resistance R68, second end of described resistance R68 is connected with the DTV_AUDIO_R pin of omniselector control chip, second end of described electric capacity C15 is also connected with the first end of resistance R48, the second end ground connection of described resistance R48, second end of described electric capacity C15 is also connected with the first end of electric capacity C105, the second end ground connection of described electric capacity C105;
4th the pin SE1L of described audio effect processing chip U3 is connected with the first end of electric capacity C20, second end of described electric capacity C20 is connected with the first end of resistance R25, the second end ground connection of described resistance R25, second end of described electric capacity C20 is also connected with the first end of electric capacity C104, the second end ground connection of described electric capacity C104, second end of described electric capacity C20 is also connected with the first end of resistance R32, and second end of described resistance R32 is connected with omniselector control chip DTV_AUDIO_L pin;
6th the pin SE3L of described audio effect processing chip U3 is connected with the first end of electric capacity C53, and second end of described electric capacity C53 is connected with the AUNER_L pin of omniselector control chip;
7th the pin DIFFL of described audio effect processing chip U3 is connected with the first end of electric capacity C55, and second end of described electric capacity C55 is connected with the 4052_L pin of omniselector control chip;
8th the pin DIFFG of described audio effect processing chip U3 is connected with the first end of electric capacity C57, the second end ground connection of described electric capacity C57;
9th the pin DIFFR of described audio effect processing chip U3 is connected with the first end of electric capacity C60, and second end of described electric capacity C60 is connected with the 4052_R pin of omniselector control chip;
Tenth the pin IGL of described audio effect processing chip U3 is connected with the first end of electric capacity C71, and second end of described electric capacity C71 is connected with the 11 the pin VOL of described audio effect processing chip U3;
12 the pin IDL of described audio effect processing chip U3 is connected with the first end of electric capacity C76, the second end ground connection of described electric capacity C76;
13 the pin IGL of described audio effect processing chip U3 is connected with the first end of electric capacity C77, and second end of described electric capacity C77 is connected with the 14 the pin VOR of described audio effect processing chip U3;
15 the pin IDR of described audio effect processing chip U3 is connected with the first end of electric capacity C78, the second end ground connection of described electric capacity C78;
16 the pin BL1 of described audio effect processing chip U3 is connected with the first end of electric capacity C79, and second end of described electric capacity C79 is connected with the first end of resistance R16, the second end ground connection of described resistance R16;
17 the pin BL2 of described audio effect processing chip U3 is connected with second end of electric capacity C80, and second end of described electric capacity C80 is connected with the first end of described resistance R16;
18 the pin TRL of described audio effect processing chip U3 is connected with the first end of electric capacity C81, the second end ground connection of described electric capacity C81;
The nineteen pin TRR of described audio effect processing chip U3 is connected with the first end of electric capacity C82, the second end ground connection of described electric capacity C82;
20 the pin BR2 of described audio effect processing chip U3 is connected with the first end of electric capacity C83, and second end of described electric capacity C83 is connected with the first end of resistance R17, the second end ground connection of described resistance R17;
21 the pin BR1 of described audio effect processing chip U3 is connected with the first end of electric capacity C84, and second end of described electric capacity C84 is connected with the first end of resistance R17;
22 the pin NC of described audio effect processing chip U3 is vacant;
23 the pin SOUT of described audio effect processing chip U3 is connected with the first end of electric capacity C85, and second end of described electric capacity C85 is connected with the 24 the pin SIN of described audio effect processing chip U3;
25 the pin C2 of described audio effect processing chip U3 is connected with the first end of electric capacity C86, the second end ground connection of described electric capacity C86;
26 the pin C1P of described audio effect processing chip U3 is connected with the first end of electric capacity C87, second end of described electric capacity C87 is connected with the 27 the pin OUTSW of described audio effect processing chip U3, second end of described electric capacity C87 is also connected with the first end of electric capacity C88, the second termination SWOUT mouth of described electric capacity C88;
28 the pin RF of described audio effect processing chip U3 is connected with the first end of electric capacity C90, the second termination FRONT_R mouth of described electric capacity C90;
The second nineteen pin RR of described audio effect processing chip U3 is connected with the first end of electric capacity C92, the second termination REAR_R mouth of described electric capacity C90;
30 the pin LR of described audio effect processing chip U3 is connected with the first end of electric capacity C93, the second termination REAR_L mouth of described electric capacity C93;
31 the pin LF of described audio effect processing chip U3 is connected with the first end of electric capacity C94, the second termination FRONT_L mouth of described electric capacity C94;
32 the pin MIX/SWOUT of described audio effect processing chip U3 is connected with the first end of electric capacity C102, second end of described electric capacity C102 is connected with the first end of resistance R53, the second end ground connection of described resistance R53, second end of described electric capacity C102 is also connected with the first end of resistance R120, second end of described resistance R120 is connected with GPS_MIXL pin, second end of described electric capacity C102 is also connected with the first end of resistance R87, and second end of described resistance R87 is connected with GPS_MIXR pin;
33 the pin VDD of described audio effect processing chip U3 is connected with the first end of electric capacity C103, the second end ground connection of described electric capacity 103, and the first end of described electric capacity C103 is also connected with A9V mouth;
34 the pin CREF of described audio effect processing chip U3 is connected with the first end of electric capacity EC1, the second end ground connection of described electric capacity EC1, and second end of described electric capacity EC1 is also connected with the 35 the pin GND of described audio effect processing chip U3
36 the pin SDA of described audio effect processing chip U3 connects S_SDA2 mouth;
37 the pin SCL of described audio effect processing chip U3 connects S_SDL2 mouth;
30th the eight to four ten four the pin NC of described audio effect processing chip U1 is vacant.
In preferred embodiment of the present invention, the left channel signals exported by omniselector control chip core board and right-channel signals, input in this sound effect processing circuit, then have audio effect processing chip U3 to control to adjust to obtain to the size of sound, tone, sound field etc. the sound experience that user wants.Circuit structure is simple, cost is lower and reliability is higher.
These are only embodiments of the present invention; not thereby the scope of the claims of the present invention is limited; every utilize instructions of the present invention and accompanying drawing content to do equivalent structure or equivalent flow process conversion; or be directly or indirectly used in other relevant technical fields, be all in like manner included in scope of patent protection of the present invention.