技术领域technical field
本发明系有关于一种LED料带结构的技术，尤指一种具有陶瓷基板的LED料带结构及其制造方法。The invention relates to a technology of an LED strip structure, in particular to an LED strip structure with a ceramic substrate and a manufacturing method thereof.
背景技术Background technique
发光二极体(Light Emitting Diode，LED)具有体积小、耗电量低、使用寿命长、高亮度、环保等优点，故逐渐成为现代最常用的光源之一。其中，发光二极体的制作主要是将LED晶片焊接于导线架上，并利用萤光胶覆盖LED晶片，用以将LED晶片所发射出的可见光谱转换成白光或其他颜色光谱。Light Emitting Diode (LED) has the advantages of small size, low power consumption, long service life, high brightness, and environmental protection, so it has gradually become one of the most commonly used light sources in modern times. Among them, the production of light-emitting diodes is mainly to weld the LED chip on the lead frame, and cover the LED chip with fluorescent glue, so as to convert the visible spectrum emitted by the LED chip into white light or other color spectrums.
上述发光二极体，为了调节LED晶片的发光角度，会于导线架上覆盖一凹杯，并将LED晶片固定在凹杯中，使LED晶片可透过凹杯内周缘的环壁反射或折射，进而提升LED晶片出光效率及发光角度。In order to adjust the light-emitting angle of the LED chip, the above-mentioned light-emitting diode will cover a concave cup on the lead frame, and fix the LED chip in the concave cup, so that the LED chip can be reflected or refracted through the ring wall of the inner peripheral edge of the concave cup. , thereby improving the light-emitting efficiency and light-emitting angle of the LED chip.
然而，发光二极体若为高效率类型，则导线架会配合以一陶瓷基板所制成，但因陶瓷基板的材质易脆，故不易于陶瓷基板上直接成型凹杯，通常必须额外制造凹杯，再将凹杯粘覆于导线架上，导致制程的步骤复杂及成本昂贵。另外，额外制造的凹杯内周缘无法成形倾斜环壁，导致LED晶片的发光散射不良。有鉴于此，本发明人遂针对上述现有技术，特潜心研究并配合学理的运用，尽力解决上述的问题点，即成为本发明人开发的目标。However, if the light-emitting diode is a high-efficiency type, the lead frame will be made with a ceramic substrate. However, because the material of the ceramic substrate is brittle, it is not easy to directly form the concave cup on the ceramic substrate. Usually, additional concave cups must be manufactured. cup, and then glue the concave cup on the lead frame, resulting in complicated manufacturing steps and high cost. In addition, the inner periphery of the additionally manufactured concave cup cannot form an inclined ring wall, resulting in poor light scattering of the LED chip. In view of this, the present inventor has focused on the above-mentioned prior art and devoted himself to research and application of theories to try his best to solve the above-mentioned problems, which has become the goal of the inventor's development.
发明内容Contents of the invention
本发明的目的在于提供一种具有陶瓷基板的LED料带结构及其制造方法，其结构简单，提高发光二极体的使用寿命，增加发光角度及出光效率，利用硅树脂(Silicone)材料以模内射出方式成型凹杯，让凹杯能够直接形成在陶瓷基板上，使LED料带结构制程具有降低步骤及节省成本的优点。The purpose of the present invention is to provide a LED strip structure with a ceramic substrate and a manufacturing method thereof. The inner injection method forms the concave cup, so that the concave cup can be directly formed on the ceramic substrate, so that the LED strip structure process has the advantages of reducing steps and saving costs.
为了达成上述的目的，本发明提供一种具有陶瓷基板的LED料带结构，包括：In order to achieve the above object, the present invention provides a LED strip structure with a ceramic substrate, comprising:
一陶瓷基板，设有多个安置区，每一该安置区具有相对的一上表面、一下表面及设有贯穿该上表面和该下表面的多个通孔；A ceramic substrate is provided with a plurality of placement areas, each of which has an opposite upper surface, a lower surface and a plurality of through holes passing through the upper surface and the lower surface;
多个导线架，每一该导线架由一金属层披覆于该上表面、该下表面及该等通孔表面而形成；以及a plurality of lead frames, each of which is formed by a metal layer coating the upper surface, the lower surface and the through-hole surfaces; and
多个凹杯，由硅树脂(Silicone)材料以模内射出方式成型，各该凹杯透过该等通孔而固定于各该安置区上，并裸露出该导线架。A plurality of concave cups are molded by in-mold injection of silicone material, each of the concave cups is fixed on each of the placement areas through the through holes, and the lead frame is exposed.
其中，每一该安置区的通孔数量为二，该二通孔分别形成在该安置区的两侧，该金属层包含相互分离的一第一金属层及一第二金属层，该第一金属层沿着该上表面的一侧、该下表面的一侧及其一该通孔的表面披覆，该第二金属层沿着该上表面的另一侧、该下表面的另一侧及另一该通孔的表面披覆。Wherein, the number of through holes in each placement area is two, and the two through holes are respectively formed on both sides of the placement area, the metal layer includes a first metal layer and a second metal layer separated from each other, the first The metal layer is coated along one side of the upper surface, one side of the lower surface and a surface of the through hole, and the second metal layer is covered along the other side of the upper surface and the other side of the lower surface And another surface coating of the through hole.
其中，每一该安置区的通孔数量为四，其二该通孔分别形成在该安置区的一侧，另二该通孔分别形成在该安置区的另一侧，该金属层包含相互分离的一第一金属层及一第二金属层，该第一金属层沿着该上表面的一侧、该下表面的一侧及其二该通孔的表面披覆，该第二金属层沿着该上表面的另一侧、该下表面的另一侧及另二该通孔的表面披覆。Wherein, the number of through holes in each placement area is four, two of the through holes are respectively formed on one side of the placement area, and the other two through holes are respectively formed on the other side of the placement area, and the metal layer includes mutual A first metal layer and a second metal layer are separated, the first metal layer is coated along one side of the upper surface, one side of the lower surface and the surfaces of the two through holes, the second metal layer Drape along the other side of the upper surface, the other side of the lower surface and the other two surfaces of the through holes.
其中，每一该安置区在该第一金属层及该第二金属层之间形成有一绝缘段。Wherein, each placement area forms an insulating segment between the first metal layer and the second metal layer.
其中，每一该凹杯具有填充该等通孔并配置在该上表面周缘的一环墙，该导线架的局部裸露于该环墙的内部。Wherein, each of the concave cups has a surrounding wall that fills the through holes and is disposed on the periphery of the upper surface, and part of the lead frame is exposed inside the surrounding wall.
其中，每一该环墙的内周缘具有一倾斜环壁。Wherein, the inner periphery of each ring wall has an inclined ring wall.
其中，每一该金属层包含相互分离的一第一金属层及一第二金属层，每一该安置区在该第一金属层及该第二金属层之间形成有一绝缘段，该第一金属层、该第二金属层及该绝缘段的局部裸露于该环墙的内部。Wherein, each of the metal layers includes a first metal layer and a second metal layer separated from each other, and each placement area forms an insulating segment between the first metal layer and the second metal layer, and the first Parts of the metal layer, the second metal layer and the insulation section are exposed inside the ring wall.
为了达成上述的目的，本发明系提供一种制备如上述具有陶瓷基板的LED料带结构的制造方法，其步骤包括：In order to achieve the above object, the present invention provides a method for preparing the above-mentioned LED strip structure with a ceramic substrate, the steps of which include:
a)提供一模具，将该模具配置在该安置区的上、下两侧；a) providing a mold, and disposing the mold on the upper and lower sides of the placement area;
b)对该模具填充一液态硅树脂(Silicone)，并朝该安置区方向进行模内射出；以及b) filling the mold with a liquid silicone (Silicone), and injecting it in the direction of the placement area; and
c)再对该液态硅树脂(Silicone)进行加热作业，而令该液态硅树脂(Silicone)受热固化后于该安置区上成型该凹杯。c) Heating the liquid silicone resin (Silicone) again, so that the liquid silicone resin (Silicone) is heated and solidified to form the concave cup on the placement area.
其中，a步骤中该模具具有一上模具及一下模具，至少其中之一该上模具及该下模具和该安置区的之间具有一间距。Wherein, in step a, the mold has an upper mold and a lower mold, at least one of the upper mold, the lower mold and the placement area has a distance.
其中，该间距为0.1至0.2mm。Wherein, the distance is 0.1 to 0.2 mm.
通过上述描述可知，本发明具有以下功效：As can be seen from the above description, the present invention has the following effects:
第一、模具和安置区之间具有间距，防止模具上、下夹持陶瓷基板，以避免陶瓷基板受夹持力而产生破裂，并透过液态硅树脂(Silicone)材料粘性较高的特质，使液态硅树脂(Silicone)以模内射出方式成型在安置区上时，液态硅树脂(Silicone)还未发生溢流就被加热固化而形成凹杯，进而降低LED料带结构制程的步骤及成本。First, there is a distance between the mold and the placement area to prevent the mold from clamping the ceramic substrate up and down, so as to avoid the ceramic substrate from being cracked by the clamping force, and through the high viscosity of liquid silicone (Silicone) material, When the liquid silicone resin (Silicone) is molded on the placement area by in-mold injection, the liquid silicone resin (Silicone) is heated and solidified before overflowing to form a concave cup, thereby reducing the steps and costs of the LED strip structure process .
第二、利用模内射出成型的凹杯，可藉由模具的设计，而于环墙的内周缘上制作不同角度的倾斜环壁，使LED晶片能够藉由倾斜环壁而调整反射或折射角度，以达到增加发光角度及出光效率。Second, using the concave cup formed by in-mold injection, the inclined ring wall of different angles can be made on the inner peripheral edge of the ring wall by the design of the mold, so that the LED chip can adjust the reflection or refraction angle by tilting the ring wall , in order to increase the light angle and light efficiency.
第三、进行硅树脂(Silicone)液态射出时，由于尚未在陶瓷基板上进行固晶打线等制成，因此在量产异常时不需负担固晶打线失败的成本损失。Third, when performing silicone resin (Silicone) liquid injection, since the ceramic substrate has not yet been manufactured by die bonding and bonding, there is no need to bear the cost loss of die bonding and bonding failure when mass production is abnormal.
第四、硅树脂(Silicone)材料具有耐热抗UV特性，因此发光二极体若为高效率类型时，硅树脂(Silicone)所制成的凹杯不会发生塑料黄化的问题，以提高发光二极体的使用寿命。Fourth, the silicone resin (Silicone) material has heat-resistant and anti-UV properties, so if the light-emitting diode is a high-efficiency type, the concave cup made of silicone (Silicone) will not have the problem of plastic yellowing, so as to improve The service life of light-emitting diodes.
第五、每一安置区设有贯穿上表面和下表面的通孔，模具将液态硅树脂(Silicone)由各通孔注入而布设于安置区上，从而令每一凹杯具有填充各通孔并配置在上表面周缘的环墙，让环墙的局部和各通孔紧密嵌合，从而使环墙固定在上表面上，令凹杯能够直接并稳固地形成在陶瓷基板，以达到简化LED料带结构制程的步骤及成本。Fifth, each placement area is provided with a through hole that runs through the upper surface and the lower surface, and the mold injects liquid silicone (Silicone) through each through hole and arranges it on the placement area, so that each concave cup has the ability to fill each through hole And configure the ring wall on the periphery of the upper surface, so that the parts of the ring wall and the through holes are tightly fitted, so that the ring wall is fixed on the upper surface, so that the concave cup can be directly and firmly formed on the ceramic substrate, so as to simplify LED. The steps and costs of the ribbon structure manufacturing process.
附图说明Description of drawings
图1：本发明LED料带结构的制造方法的步骤流程图。Fig. 1: a flow chart of the steps of the manufacturing method of the LED strip structure of the present invention.
图2：本发明对陶瓷基板划分安置区的示意图。Fig. 2: Schematic diagram of dividing the placement area of the ceramic substrate according to the present invention.
图3：本发明将金属层披覆于上表面的示意图。Figure 3: A schematic diagram of coating the metal layer on the upper surface of the present invention.
图4：本发明将金属层披覆于上表面、下表面及通孔表面的示意图。Fig. 4: A schematic diagram of coating the metal layer on the upper surface, the lower surface and the surface of the through hole in the present invention.
图5：本发明将模具配置在导线架的上、下两侧的示意图。Fig. 5: A schematic diagram of disposing the mold on the upper and lower sides of the lead frame in the present invention.
图6：本发明模具欲朝导线架方向进行模内射出的示意图。Figure 6: A schematic diagram of the mold of the present invention about to perform in-mold injection towards the lead frame.
图7：本发明模具欲朝导线架方向进行模内射出的放大图。Fig. 7: An enlarged view of the mold of the present invention intended to perform in-mold injection toward the lead frame.
图8：本发明LED料带结构的立体组合图。Fig. 8: A three-dimensional assembled view of the LED strip structure of the present invention.
图9：本发明发光二极体的立体示意图。Fig. 9: A three-dimensional schematic diagram of a light-emitting diode of the present invention.
图10：本发明发光二极体的剖面示意图。Fig. 10: A schematic cross-sectional view of a light-emitting diode of the present invention.
具体实施方式Detailed ways
有关本发明的详细说明及技术内容，将配合图式说明如下，然而所附图式仅作为说明用途，并非用于局限本发明。The detailed description and technical content of the present invention will be described as follows with accompanying drawings, but the attached drawings are only for illustration purposes and are not intended to limit the present invention.
请参考图1至图10所示，本发明提供一种具有陶瓷基板的LED料带结构及其制造方法，此LED料带结构主要包括一陶瓷基板1、多个导线架2及多个凹杯3。Please refer to FIG. 1 to FIG. 10, the present invention provides a LED strip structure with a ceramic substrate and its manufacturing method, the LED strip structure mainly includes a ceramic substrate 1, a plurality of lead frames 2 and a plurality of concave cups 3.
如图2所示，陶瓷基板1设有多个安置区11，每一安置区11具有相对的一上表面12、一下表面13及设有贯穿上表面12和下表面13的多个通孔14。As shown in Figure 2, the ceramic substrate 1 is provided with a plurality of placement areas 11, and each placement area 11 has an opposite upper surface 12, a lower surface 13, and a plurality of through holes 14 penetrating the upper surface 12 and the lower surface 13. .
如图3至图4所示，每一导线架2由一金属层21披覆于上表面12、下表面13及各通孔14表面而形成。As shown in FIGS. 3 to 4 , each lead frame 2 is formed by covering the upper surface 12 , the lower surface 13 and the surfaces of the through holes 14 with a metal layer 21 .
进一步说明如下，每一安置区11的通孔14数量至少为二，二通孔14分别形成在安置区11的两侧，金属层21包含相互分离的一第一金属层211及一第二金属层212，第一金属层211沿着上表面12的一侧、下表面13的一侧及其一通孔14的表面披覆，第二金属层212沿着上表面12的另一侧、下表面13的另一侧及另一通孔14的表面披覆。Further description is as follows, the number of through holes 14 in each installation area 11 is at least two, and the two through holes 14 are respectively formed on both sides of the installation area 11, and the metal layer 21 includes a first metal layer 211 and a second metal layer 211 separated from each other. Layer 212, the first metal layer 211 covers one side of the upper surface 12, one side of the lower surface 13 and the surface of a through hole 14, and the second metal layer 212 covers the other side of the upper surface 12, the lower surface The other side of 13 and the surface of another through hole 14 are coated.
本实施例每一安置区11的通孔14数量为四，其二通孔14分别形成在安置区11的一侧，另二通孔14分别形成在安置区11的另一侧，金属层21包含相互分离的一第一金属层211及一第二金属层212，第一金属层211沿着上表面12的一侧、下表面13的一侧及其二通孔14的表面披覆，第二金属层212沿着上表面12的另一侧、下表面13的另一侧及另二通孔14的表面披覆。In this embodiment, the number of through holes 14 in each installation area 11 is four, and two of the through holes 14 are respectively formed on one side of the installation area 11, and the other two through holes 14 are respectively formed on the other side of the installation area 11. The metal layer 21 Comprising a first metal layer 211 and a second metal layer 212 separated from each other, the first metal layer 211 covers one side of the upper surface 12, one side of the lower surface 13 and the surfaces of the two through holes 14, the second The two metal layers 212 cover the other side of the upper surface 12 , the other side of the lower surface 13 and the surfaces of the other two through holes 14 .
另外，每一安置区11在第一金属层211及第二金属层212之间形成有一绝缘段15。In addition, each placement area 11 forms an insulating segment 15 between the first metal layer 211 and the second metal layer 212 .
如图5至图8所示，每一凹杯3由硅树脂(Silicone)材料以模内射出方式成型，各凹杯3透过各通孔14而固定于各安置区11上，并裸露出导线架2。As shown in Figures 5 to 8, each concave cup 3 is formed by in-mold injection from a silicone resin (Silicone) material, and each concave cup 3 is fixed on each placement area 11 through each through hole 14, and is exposed. Lead frame 2.
详细说明如下，每一凹杯3具有填充各通孔14并配置在上表面12周缘的一环墙31，使环墙31的局部和各通孔14紧密嵌合，从而让环墙31固定在上表面12上；另外，每一环墙31的内周缘具有一倾斜环壁311。其中，导线架2的局部裸露于环墙31的内部，第一金属层211、第二金属层212及绝缘段15的局部裸露于环墙31的内部。The details are as follows, each concave cup 3 has a ring wall 31 that fills each through hole 14 and is arranged on the periphery of the upper surface 12, so that a part of the ring wall 31 fits closely with each through hole 14, so that the ring wall 31 is fixed on the On the upper surface 12 ; in addition, the inner peripheral edge of each ring wall 31 has an inclined ring wall 311 . Wherein, part of the lead frame 2 is exposed inside the ring wall 31 , and parts of the first metal layer 211 , the second metal layer 212 and the insulating section 15 are exposed inside the ring wall 31 .
本发明LED料带结构10的组合，其利用陶瓷基板1设有多个安置区11，每一安置区11具有相对的一上表面12、一下表面13及设有贯穿上表面12和下表面13的多个通孔14；每一导线架2由一金属层21披覆于上表面12、下表面13及各通孔14表面而形成；每一凹杯3由硅树脂(Silicone)材料以模内射出方式成型，各凹杯3透过各通孔14而固定于各安置区11上，并裸露出导线架2。藉此，硅树脂(Silicone)材料以模内射出方式成型凹杯3，让凹杯3能够直接形成在陶瓷基板1上，使LED料带结构10制程具有降低步骤及节省成本的优点。The combination of the LED strip structure 10 of the present invention uses a ceramic substrate 1 to provide a plurality of placement areas 11, and each placement area 11 has an opposite upper surface 12, a lower surface 13, and is provided with a penetrating upper surface 12 and a lower surface 13. A plurality of through holes 14; each lead frame 2 is formed by covering the upper surface 12, the lower surface 13 and the surfaces of each through hole 14 by a metal layer 21; each concave cup 3 is molded by a silicone resin (Silicone) material Molded by injection molding, each concave cup 3 is fixed on each placement area 11 through each through hole 14 , and the lead frame 2 is exposed. In this way, the concave cup 3 is formed by in-mold injection of silicone material, so that the concave cup 3 can be directly formed on the ceramic substrate 1 , so that the manufacturing process of the LED strip structure 10 has the advantages of reducing steps and saving costs.
如图1所示，系一种制备如上所述的LED料带结构10制作方法的步骤，其详细说明如下。As shown in FIG. 1 , it is a step of the method for preparing the above-mentioned LED strip structure 10 , which is described in detail as follows.
首先，如图1的a步骤及图5至图6所示，提供一模具100，将模具100配置在安置区11的上、下两侧。First, as shown in step a of FIG. 1 and FIGS. 5 to 6 , a mold 100 is provided, and the mold 100 is arranged on the upper and lower sides of the placement area 11 .
进一步说明如下，模具100具有一上模具101及一下模具102，下表面13对应上模具101配置，上表面12对应下模具102配置；又，至少其中之一上模具101及下模具102和安置区11的之间具有一间距S，此间距S为0.1至0.2mm。其中，本实施例之间距S形成在上表面12及下模具102之间，但间距S也能够形成在下表面13及上模具101之间。Further description is as follows, the mold 100 has an upper mold 101 and a lower mold 102, the lower surface 13 is configured corresponding to the upper mold 101, and the upper surface 12 is configured correspondingly to the lower mold 102; again, at least one of the upper mold 101, the lower mold 102 and the placement area There is a space S between 11, and the space S is 0.1 to 0.2 mm. Wherein, the distance S in this embodiment is formed between the upper surface 12 and the lower mold 102 , but the distance S can also be formed between the lower surface 13 and the upper mold 101 .
另外，如图1的b步骤及图6至图7所示，对模具100填充一液态硅树脂(Silicone)，并朝安置区11方向进行模内射出。In addition, as shown in step b of FIG. 1 and FIG. 6 to FIG. 7 , the mold 100 is filled with a liquid silicone resin (Silicone), and injected into the mold toward the installation area 11 .
又，如图1的c步骤所示，再对液态硅树脂(Silicone)进行加热作业，而令液态硅树脂(Silicone)受热固化后于安置区11上成型凹杯3。Also, as shown in step c of FIG. 1 , the liquid silicone resin (Silicone) is heated again, and the liquid silicone resin (Silicone) is heated and solidified to form the concave cup 3 on the placement area 11 .
再者，如图1、7所示，具有陶瓷基板的LED料带结构的制造方法，其更包括在c步骤及b步骤之间的一个步骤c’，其中c’步骤中令液态硅树脂(Silicone)由各通孔14注入而布设于安置区11上。Moreover, as shown in Figures 1 and 7, the manufacturing method of the LED strip structure with a ceramic substrate further includes a step c' between step c and step b, wherein in step c', the liquid silicone resin ( Silicone) is injected through each through hole 14 and arranged on the placement area 11 .
详细说明如下，本实施例模具100将液态硅树脂(Silicone)透过上模具101注入通孔14，并布设于上表面12及下模具102之间，从而令每一凹杯3具有填充各通孔14并配置在上表面12周缘的环墙31。The details are as follows. The mold 100 of this embodiment injects liquid silicone resin (Silicone) through the upper mold 101 into the through hole 14, and arranges it between the upper surface 12 and the lower mold 102, so that each concave cup 3 has the ability to fill each through hole. The hole 14 is arranged in the ring wall 31 on the periphery of the upper surface 12 .
此外，如图1至图4所示，具有陶瓷基板的LED料带结构的制造方法，其更包括在a步骤的前的一个步骤a’，与在a’步骤及a步骤之间的一个步骤a”。In addition, as shown in Figures 1 to 4, the manufacturing method of the LED strip structure with a ceramic substrate further includes a step a' before step a, and a step between step a' and step a a".
如图2所示，其中，a’步骤中对陶瓷基板1划分各安置区11，并在每一安置区11上开设各通孔14。As shown in FIG. 2 , wherein, in step a', the ceramic substrate 1 is divided into placement areas 11, and each through hole 14 is opened in each placement area 11.
如图3至图4所示，其中，a”步骤中将金属层21披覆于上表面12、下表面13及各通孔14表面，而于安置区11上成型导线架2。As shown in FIG. 3 to FIG. 4 , in the step a", the metal layer 21 is coated on the upper surface 12 , the lower surface 13 and the surfaces of the through holes 14 , and the lead frame 2 is formed on the placement area 11 .
相较习知因陶瓷基板本身材质易脆，故需额外制造凹杯，再将凹杯粘覆于陶瓷基板上，而制造成LED料带结构，导致制程上有步骤复杂及成本昂贵的问题。Compared with the conventional ceramic substrate itself, the material is brittle, so it is necessary to manufacture additional concave cups, and then glue the concave cups on the ceramic substrate to manufacture the LED strip structure, resulting in complex steps and high cost in the manufacturing process.
本发明LED料带结构10制作方法的步骤，系利用模具100和安置区11之间具有间距S，以防止模具100上、下夹持陶瓷基板1，进而避免陶瓷基板1受夹持力而产生破裂，并透过液态硅树脂(Silicone)材料粘性较高的特质，使液态硅树脂(Silicone)以模内射出方式成型在导线架上时，液态硅树脂(Silicone)还未发生溢流就被加热固化而形成凹杯3，让凹杯3能够直接形成在陶瓷基板1上，进而降低LED料带结构10制程的步骤及成本。The steps of the manufacturing method of the LED strip structure 10 of the present invention are to use the distance S between the mold 100 and the placement area 11 to prevent the mold 100 from clamping the ceramic substrate 1 up and down, thereby preventing the ceramic substrate 1 from being clamped by clamping force. Cracked, and through the high viscosity of the liquid silicone resin (Silicone), when the liquid silicone resin (Silicone) is molded on the lead frame by in-mold injection, the liquid silicone resin (Silicone) has not yet overflowed. The concave cup 3 is formed by heating and curing, so that the concave cup 3 can be directly formed on the ceramic substrate 1 , thereby reducing the steps and costs of the LED strip structure 10 manufacturing process.
另外，如图8至图10所示，对各安置区11进行裁切，将各凹杯3及其覆盖的导线架2取下时，则形成用来承载LED晶片的单个承载座20。In addition, as shown in FIG. 8 to FIG. 10 , each placement area 11 is cut, and when each concave cup 3 and the lead frame 2 covering it are removed, a single carrier 20 for carrying the LED chip is formed.
再者，利用模内射出成型的凹杯3，可藉由模具100的设计，而于环墙31的内周缘上制作不同角度的倾斜环壁311，使LED晶片能够藉由倾斜环壁311而调整反射或折射角度，以达到增加发光角度及出光效率。Furthermore, by using the concave cup 3 formed by in-mold injection, the design of the mold 100 can be used to make inclined ring walls 311 with different angles on the inner periphery of the ring wall 31, so that the LED chip can be rotated by tilting the ring wall 311. Adjust the angle of reflection or refraction to increase the angle of light emission and light output efficiency.
又，进行硅树脂(Silicone)液态射出时，由于尚未在陶瓷基板1上进行固晶打线等制成，因此在量产异常时不需负担固晶打线失败的成本损失。In addition, when the silicone resin (Silicone) is injected in a liquid state, since the ceramic substrate 1 has not yet been fabricated by die bonding and bonding, there is no need to bear the cost loss of die bonding and bonding failure when the mass production is abnormal.
此外，硅树脂(Silicone)材料具有耐热抗UV特性，因此发光二极体若为高效率类型时，硅树脂(Silicone)所制成的凹杯3不会发生塑料黄化的问题，以提高发光二极体的使用寿命。In addition, the silicone resin (Silicone) material has heat-resistant and anti-UV properties, so if the light-emitting diode is a high-efficiency type, the concave cup 3 made of silicone resin (Silicone) will not have the problem of plastic yellowing, so as to improve The service life of light-emitting diodes.
并且，每一安置区11设有贯穿上表面12和下表面13的通孔14，模具100将液态硅树脂(Silicone)由各通孔14注入而布设于安置区11上，从而令每一凹杯3具有填充各通孔14并配置在上表面12周缘的环墙31，让环墙31的局部和各通孔14紧密嵌合，从而使环墙31固定在上表面12上，令凹杯3能够直接并稳固地形成在陶瓷基板1，以达到简化LED料带结构10制程的步骤及成本。Moreover, each placement area 11 is provided with a through hole 14 that runs through the upper surface 12 and the lower surface 13, and the mold 100 injects liquid silicone resin (Silicone) into the placement area 11 through each through hole 14, so that each concave The cup 3 has a ring wall 31 that fills each through hole 14 and is arranged on the periphery of the upper surface 12, so that a part of the ring wall 31 fits closely with each through hole 14, so that the ring wall 31 is fixed on the upper surface 12, and the concave cup 3 can be directly and stably formed on the ceramic substrate 1, so as to simplify the steps and cost of the manufacturing process of the LED strip structure 10.
综上所述，本发明的具有陶瓷基板的LED料带结构及其制造方法，亦未曾见于同类产品及公开使用，并具有产业利用性、新颖性与进步性，完全符合发明专利申请要件，爰依专利法提出申请，敬请详查并赐准本案专利，以保障发明人的权利。In summary, the LED strip structure with ceramic substrate and its manufacturing method of the present invention have never been seen in similar products and public use, and have industrial applicability, novelty and progress, and fully meet the requirements for invention patent applications. To file an application in accordance with the Patent Law, please check carefully and grant the patent of this case to protect the rights of the inventor.
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310275974.6ACN104282818A (en) | 2013-07-03 | 2013-07-03 | LED material belt structure with ceramic substrate and method for manufacturing LED material belt structure with ceramic substrate |
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310275974.6ACN104282818A (en) | 2013-07-03 | 2013-07-03 | LED material belt structure with ceramic substrate and method for manufacturing LED material belt structure with ceramic substrate |
| Publication Number | Publication Date |
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| CN104282818Atrue CN104282818A (en) | 2015-01-14 |
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310275974.6APendingCN104282818A (en) | 2013-07-03 | 2013-07-03 | LED material belt structure with ceramic substrate and method for manufacturing LED material belt structure with ceramic substrate |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112310261A (en)* | 2019-07-31 | 2021-02-02 | 立诚光电股份有限公司 | Ceramic substrate structure and process for optical device |
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112310261A (en)* | 2019-07-31 | 2021-02-02 | 立诚光电股份有限公司 | Ceramic substrate structure and process for optical device |
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