技术领域technical field
本发明是一种整合背光模块的电路板及其制造方法，尤指一种在电路板上直接整合背光模块的相关技术。The invention relates to a circuit board integrating a backlight module and a manufacturing method thereof, in particular to a related technology of directly integrating a backlight module on a circuit board.
背景技术Background technique
液晶显示器仍是目前普及率最高的平面显示器，而液晶显示器的特点之一在于本身并不会发光，其画面上的光源来自内部的背光模块，既有的背光模块大致可分为侧入式与直下式背光模块，所谓的侧入式背光模块如图6所示，主要是在一导光板70长度方向的一端设有一冷阴极灯管(CCFL)71，而在导光板70的内侧设有一反射片72，导光板70外侧则由内而外依序设有一下扩散膜73、两增光片74及一上扩散膜75。又导光板70的内侧面呈一斜面，该反射片72亦作斜向设置而与导光板70的内侧面平行相对。Liquid crystal display is still the most popular flat-panel display at present. One of the characteristics of liquid crystal display is that it does not emit light itself. The light source on the screen comes from the internal backlight module. The existing backlight modules can be roughly divided into side-type and The direct-type backlight module, the so-called side-type backlight module, is mainly provided with a cold cathode lamp (CCFL) 71 at one end of a light guide plate 70 in the longitudinal direction, and a reflector is provided on the inner side of the light guide plate 70, as shown in FIG. 6 . 72 , the outer side of the light guide plate 70 is sequentially provided with a lower diffusion film 73 , two brightness enhancement sheets 74 and an upper diffusion film 75 from inside to outside. In addition, the inner surface of the light guide plate 70 is an inclined surface, and the reflective sheet 72 is also arranged obliquely so as to be parallel to and opposite to the inner surface of the light guide plate 70 .
上述侧入式背光模块的工作原理是令冷阴极灯管71产生的光线由导光板70的侧边送入，送入的光线经由导光板70的传导换向而朝其外侧方向送出，另一方面光线亦由导光板70的内侧面送出，经反射片72反射回导光板70，再由导光板70的外侧面送出。The working principle of the above-mentioned side-type backlight module is that the light generated by the cold-cathode lamp tube 71 is sent in from the side of the light guide plate 70, and the light sent in is sent out to the outside through the conduction and reversing of the light guide plate 70. On the one hand, the light is also sent out from the inner side of the light guide plate 70 , reflected back to the light guide plate 70 by the reflector 72 , and then sent out from the outer side of the light guide plate 70 .
由上述可知，侧入式背光模块意即光源由导光板70的侧边送入，经传导反射后由导光板70表面送出。而直下式背光模块与侧入式背光模块的差异在于：其光源直接设在导光板70的下方(内侧)。From the above, it can be seen that the side-type backlight module means that the light source is sent in from the side of the light guide plate 70 , and sent out from the surface of the light guide plate 70 after conduction and reflection. The difference between the direct-type backlight module and the side-type backlight module is that the light source is directly disposed below (inside) the light guide plate 70 .
前述背光模块已行之有年，其运用亦十分普遍，然而其运用特定的电子装置时，即衍生许多问题。例如运用在智能手机或平板电脑时，最显著的问题是造成该等装置的厚度无法有效降低，原因即在前述背光模块具有一相当厚度的导光板及多层构造，就背光模块本身而言已具相当厚度，运用在前述智能手机或平板电脑时，在对其厚度自有先天上的限制。The above-mentioned backlight module has been used for many years, and its application is also very common. However, when it is used in a specific electronic device, many problems arise. For example, when used in smart phones or tablet computers, the most obvious problem is that the thickness of these devices cannot be effectively reduced. The reason is that the aforementioned backlight module has a light guide plate of considerable thickness and a multi-layer structure. It has a considerable thickness, and when it is used in the aforementioned smart phone or tablet computer, there is an inherent limitation on its thickness.
再者，前述背光模块是利用有限光源经由导光、扩散后提供一面光源，因此在亮度上亦有限制。另一方面，传统背光模块使用反射片及较多数量的光学膜，因此同时存在制造成本较高的问题。Furthermore, the above-mentioned backlight module uses a limited light source to provide a surface light source through light guide and diffusion, so the brightness is also limited. On the other hand, the traditional backlight module uses a reflective sheet and a large number of optical films, so there is also a problem of high manufacturing cost.
由上述可知，既有背光模块运用在智能手机、平板电脑等尽量要求轻薄的电子装置时，反而造成该等电子装置的厚度限制，因而有必要进一步检讨，并谋求可行的解决方案。It can be seen from the above that when the existing backlight modules are used in electronic devices such as smart phones and tablet computers that require as thin and light as possible, the thickness of these electronic devices is limited. Therefore, it is necessary to further review and seek a feasible solution.
发明内容Contents of the invention
因此本发明主要目的在提供一种整合背光模块的电路板，主要是利用电子装置的电路板，将背光模块整合其上，以提供一直接光源，由于直接整合在电子装置的电路板上，在厚度上可有效缩小，同时可相对降低成本；另一方面，因电路板上的背光模块可产生直接光源，故可有效提升其亮度。Therefore, the main purpose of the present invention is to provide a circuit board integrating a backlight module, which mainly uses the circuit board of an electronic device to integrate the backlight module on it to provide a direct light source. The thickness can be effectively reduced, and the cost can be relatively reduced; on the other hand, since the backlight module on the circuit board can generate a direct light source, its brightness can be effectively improved.
为达成前述目的采取的主要技术手段是令前述整合背光模块的电路板包括：一电路板，具有一第一表面、一相对于第一表面的第二表面；其第一表面上设有一电子装置线路；其第二表面上形成有多个作矩阵排列的焊垫及一位于各焊垫间的反射金属层；一面光源模块，包括多个发光二极管及一导光材料层，各发光二极管以表面粘着方式安装在电路板第二表面的各焊垫上，该导光材料层覆盖于电路板的第二表面及其上的发光二极管；The main technical means adopted to achieve the aforementioned object is to make the aforementioned integrated backlight module circuit board include: a circuit board with a first surface and a second surface opposite to the first surface; an electronic device is arranged on its first surface circuit; a plurality of welding pads arranged in a matrix and a reflective metal layer between the welding pads are formed on the second surface; a light source module on one side includes a plurality of light-emitting diodes and a light-guiding material layer, and each light-emitting diode is formed on the surface Installed on each welding pad on the second surface of the circuit board in an adhesive manner, the light-guiding material layer covers the second surface of the circuit board and the light-emitting diodes thereon;
上述整合背光模块的电路板是以第一表面设置电子装置线路，以作为电子装置的主机板，当电子装置具有液晶显示器，则位于电路板第二表面的面光源模块可作为液晶显示器的背光模块，面光源模块是多个发光二极管均匀地排列在电路板第二表面上，该等发光二极管产生的光源将可由电路板第二表面上的反射金属层充分反射及导光材料层的导光，而提供一兼具均匀度与亮度的平面光源。The circuit board of the above-mentioned integrated backlight module is to set the circuit of the electronic device on the first surface as the motherboard of the electronic device. When the electronic device has a liquid crystal display, the surface light source module located on the second surface of the circuit board can be used as the backlight module of the liquid crystal display In the surface light source module, a plurality of light-emitting diodes are evenly arranged on the second surface of the circuit board, and the light source generated by these light-emitting diodes can be fully reflected by the reflective metal layer on the second surface of the circuit board and guided by the light-guiding material layer, A planar light source with both uniformity and brightness is provided.
本发明又一目的在提供一种整合背光模块的电路板制造方法。Another object of the present invention is to provide a method for manufacturing a circuit board with an integrated backlight module.
为达成前述目的采取的技术手段是令前述方法包括：提供一电路板，该电路板具有相对的第一表面及第二表面，其第一表面具有一电子装置线路，第二表面具有多个焊垫及一反射金属层；将多个发光二极管分别安装在电路板第二表面的各个焊垫上；在电路板的第二表面上形成一导光材料层，由导光材料层覆盖电路板的第二表面及其上的发光二极管。The technical means adopted to achieve the aforementioned object is to make the aforementioned method include: providing a circuit board, the circuit board has a first surface and a second surface opposite, the first surface has an electronic device circuit, and the second surface has a plurality of solder Pads and a reflective metal layer; a plurality of light emitting diodes are respectively installed on each welding pad on the second surface of the circuit board; a layer of light-guiding material is formed on the second surface of the circuit board, and the first layer of the circuit board is covered by the layer of light-guiding material Two surfaces and light emitting diodes on them.
利用上述结构及方法将背光模块整合在电子装置的电路板上，其有益的效果包括：Using the above structure and method to integrate the backlight module on the circuit board of the electronic device, the beneficial effects include:
1、有效缩小电子装置的外壳厚度，使电子装置的外壳不因背光模块的使用而有一定的厚度限制。1. The thickness of the shell of the electronic device is effectively reduced, so that the shell of the electronic device does not have a certain thickness limit due to the use of the backlight module.
2、兼具均匀度与亮度：本发明是在电路板的第二表面上均匀地排列多个发光二极管，利用反射金属层的反射和导光材料层的导光，得以使面光源的均匀度及亮度俱有效提升。2. Both uniformity and brightness: the present invention evenly arranges a plurality of light-emitting diodes on the second surface of the circuit board, and utilizes the reflection of the reflective metal layer and the light guide of the light-guiding material layer to make the uniformity of the surface light source and brightness are effectively improved.
3、将背光模块整合在电子装置的电路板上，将有助于降低背光模块的制造成本。3. Integrating the backlight module on the circuit board of the electronic device will help reduce the manufacturing cost of the backlight module.
附图说明Description of drawings
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域技术人员来讲，在不付出创造性劳动性的前提下，还可以根据这些附图获得其他的附图。In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings that need to be used in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description are only These are some embodiments of the present invention. For those skilled in the art, other drawings can also be obtained according to these drawings on the premise of not paying creative efforts.
图1为本发明一较佳实施例的一立体图。FIG. 1 is a perspective view of a preferred embodiment of the present invention.
图2为本发明一较佳实施例的又一立体图。Fig. 2 is another perspective view of a preferred embodiment of the present invention.
图3为本发明一较佳实施例的一剖视及工艺示意图。FIG. 3 is a cross-sectional view and a schematic diagram of a process of a preferred embodiment of the present invention.
图4为本发明一较佳实施例又一剖视及工艺示意图。Fig. 4 is yet another cross-sectional view and process schematic diagram of a preferred embodiment of the present invention.
图5为本发明一较佳实施例再一剖视及工艺示意图。FIG. 5 is another cross-sectional view and process schematic diagram of a preferred embodiment of the present invention.
图6为已知背光模块的示意图。FIG. 6 is a schematic diagram of a known backlight module.
附图标号说明：Explanation of reference numbers:
10电路板 100导通孔10 circuit board 100 via holes
11第一表面 12第二表面11 first surface 12 second surface
13反射金属层 14焊垫13 reflective metal layer 14 welding pad
20电子装置线路20 electronics circuit
30面光源模块 31发光二极管30 surface light source module 31 light emitting diodes
32导光材料层32 layers of light guide material
70导光板 71冷阴极灯管70 light guide plate 71 cold cathode lamp
72反射片 73下扩散膜72 reflective sheet 73 lower diffusion film
74增光片 75上扩散膜74 Brightening film 75 Upper diffusion film
具体实施方式detailed description
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
关于本发明的一较佳实施例，首先请参阅图1、图2所示，其包括一电路板10，尤指一种电子装置的电路板，该电子装置包括但不限于手机、平板电脑、个人数字播放器、个人数字助理等。Regarding a preferred embodiment of the present invention, first please refer to Fig. 1 and Fig. 2, which includes a circuit board 10, especially a circuit board of an electronic device, which includes but is not limited to mobile phones, tablet computers, Personal digital players, personal digital assistants, etc.
前述电路板10具有一表面及一底面，以下将分别称为第一表面11及第二表面12，该电路板10的第一表面11上具有一电子装置线路20，该电子装置线路20用以执行电子装置的主要功能，并可进一步执行液晶面板、触控面板及背光模块的驱动控制功能，亦即电路板10是作为电子装置的主机板使用。The aforementioned circuit board 10 has a surface and a bottom surface, which will be referred to as the first surface 11 and the second surface 12 respectively below. The first surface 11 of the circuit board 10 has an electronic device circuit 20, and the electronic device circuit 20 is used for It performs the main functions of the electronic device, and can further perform the driving control function of the liquid crystal panel, the touch panel and the backlight module, that is, the circuit board 10 is used as the main board of the electronic device.
又电路板10的第二表面12上则设有一面光源模块30，该面光源模块30将作为电子装置上所设液晶显示器的背光源。意即该电路板10不仅作为电子装置的主机板，也同时作为电子装置上所设液晶显示器的背光模块。Moreover, a surface light source module 30 is provided on the second surface 12 of the circuit board 10 , and the surface light source module 30 will be used as a backlight source for a liquid crystal display provided on the electronic device. That is to say, the circuit board 10 not only serves as the motherboard of the electronic device, but also serves as the backlight module of the liquid crystal display installed on the electronic device.
关于前述电路板10进一步的具体构造，请参阅图3所示，该电路板10是由一多层基板构成，其具有一层以上的内层线路和多个导通孔100；请参阅图3所示，在本实施例中，电路板10是一经过浸镀银处理的化银板，其在第一表面11形成前述电子装置线路20，并在第二表面12形成一反射金属层13及多个焊垫14，在本实施例中，该反射金属层13可作为接地(GND)，该等焊垫14是一表面粘着(SMT)接点。Regarding the further specific structure of the aforementioned circuit board 10, please refer to FIG. 3, the circuit board 10 is composed of a multi-layer substrate, which has more than one layer of inner layer circuits and a plurality of via holes 100; please refer to FIG. 3 As shown, in this embodiment, the circuit board 10 is a silver-plated silver plate through immersion silver plating, which forms the aforementioned electronic device circuit 20 on the first surface 11, and forms a reflective metal layer 13 and a reflective metal layer on the second surface 12. A plurality of solder pads 14, in this embodiment, the reflective metal layer 13 can be used as ground (GND), and the solder pads 14 are a surface mount (SMT) contact.
请参阅图2及图4所示，该面光源模块30包括多个发光二极管31及一导光材料层32，该等发光二极管31是一表面粘着元件，而以表面粘着方式分别安装在电路板10第二表面12的各个焊垫14上。2 and 4, the surface light source module 30 includes a plurality of light emitting diodes 31 and a light guide material layer 32, these light emitting diodes 31 are surface mount components, and are mounted on the circuit board in a surface mount manner. 10 on each solder pad 14 of the second surface 12.
在各发光二极管31完成在电路板10第二表面12上的安装后，随后以印刷方式在电路板10第二表面形成该导光材料层32(如图5所示)。在本实施例中，导光材料层32主要是由压克力基或是硅胶等透明材料所构成。当前述发光二极管31发亮时，其产生的光源除由第二表面12上的反射金属层13反射以外，并通过导光材料层32的导光，而得产生一均匀度与亮度均充分提升的面光源，供作为背光使用。前述透明材料中可进一步加入固体微粒(直径1～25um)，以增加光源的散射。After the LEDs 31 are installed on the second surface 12 of the circuit board 10 , the light guide material layer 32 is subsequently formed on the second surface of the circuit board 10 by printing (as shown in FIG. 5 ). In this embodiment, the light guide material layer 32 is mainly composed of transparent materials such as acrylic or silica gel. When the light-emitting diode 31 lights up, the light source generated by it is not only reflected by the reflective metal layer 13 on the second surface 12, but also guided by the light-guiding material layer 32, so that a uniformity and brightness are fully improved. A surface light source for use as a backlight. Solid particles (1-25um in diameter) can be further added to the aforementioned transparent material to increase the scattering of the light source.
在本实施例中，面光源模块30的工作可进一步由电路板10第一表面11上的电子装置线路20所控制驱动。为达成上述目的，前述电路板10第一表面11上的电子装置线路20是通过导通孔100和第二表面12的焊垫14连接，意即电子装置线路20进一步整合了面光源模块30的驱动电路，而由电子装置线路20负责面光源模块30上各发光二极管31的运作。In this embodiment, the operation of the surface light source module 30 can be further controlled and driven by the electronic device circuit 20 on the first surface 11 of the circuit board 10 . In order to achieve the above purpose, the electronic device circuit 20 on the first surface 11 of the aforementioned circuit board 10 is connected to the pad 14 on the second surface 12 through the via hole 100, which means that the electronic device circuit 20 further integrates the surface light source module 30 driving circuit, and the electronic device circuit 20 is responsible for the operation of each light emitting diode 31 on the surface light source module 30 .
由上述可知，本发明是运用在具有背光型显示器的电子装置的电路板，该电路板在第一表面设置电子装置线路，以作为该电子装置的主机板，其第二表面的面光源模块则作为显示器的背光模块；由于该等背光模块直接整合在电路板上，将有助于电子装置厚度的缩减；而本发明的面光源模块是由多个发光二极管均匀地排列在电路板第二表面上，该等发光二极管产生的光源将可由第二表面上的反射金属层充分反射及导光材料层的导光，而提供一兼具均匀度与亮度的平面光源。其无须使用昂贵的光学膜、反射片，故有助于降低制造成本。As can be seen from the above, the present invention is applied to a circuit board of an electronic device with a backlight display, and the circuit board is provided with electronic device circuits on the first surface to serve as the main board of the electronic device, and the surface light source module on the second surface is then As the backlight module of the display; since the backlight modules are directly integrated on the circuit board, it will help reduce the thickness of the electronic device; and the surface light source module of the present invention is composed of a plurality of light emitting diodes evenly arranged on the second surface of the circuit board Above all, the light source generated by these LEDs can be fully reflected by the reflective metal layer on the second surface and guided by the light-guiding material layer, so as to provide a planar light source with both uniformity and brightness. It does not need to use expensive optical films and reflective sheets, thus helping to reduce manufacturing costs.
以上所述的具体实施例，对本发明的目的、技术方案和有益效果进行了进一步详细说明，所应理解的是，以上所述仅为本发明的具体实施例而已，并不用于限定本发明的保护范围，凡在本发明的精神和原则之内，所做的任何修改、等同替换、改进等，均应包含在本发明的保护范围之内。The specific embodiments described above have further described the purpose, technical solutions and beneficial effects of the present invention in detail. It should be understood that the above descriptions are only specific embodiments of the present invention and are not intended to limit the scope of the present invention. Protection scope, within the spirit and principles of the present invention, any modification, equivalent replacement, improvement, etc., shall be included in the protection scope of the present invention.
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310290501.3ACN104279527A (en) | 2013-07-11 | 2013-07-11 | Circuit board integrating backlight module and manufacturing method thereof |
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310290501.3ACN104279527A (en) | 2013-07-11 | 2013-07-11 | Circuit board integrating backlight module and manufacturing method thereof |
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| CN104279527Atrue CN104279527A (en) | 2015-01-14 |
| Application Number | Title | Priority Date | Filing Date |
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| CN201310290501.3APendingCN104279527A (en) | 2013-07-11 | 2013-07-11 | Circuit board integrating backlight module and manufacturing method thereof |
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| CN (1) | CN104279527A (en) |
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| CN102593085A (en)* | 2011-01-10 | 2012-07-18 | 原相科技股份有限公司 | Chip packaging structure and chip packaging process |
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| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication | Application publication date:20150114 |