Embodiment
Below in conjunction with accompanying drawing and embodiment, the present invention is described in further detail.Be understandable that, embodiment provides many applicable inventive concepts, the change that it can be wider.The specific embodiment of being discussed is only used for disclosing the ad hoc approach that uses embodiment, and is not used for limiting the category disclosing.
In interior literary composition, it " embodiment " refers to certain patterns, structure or the feature relevant at least one embodiment of the present invention below.Therefore the narration of " in one embodiment ", does not refer to same embodiment.In addition, the certain patterns in one or more embodiment, structure or feature combination by rights.It should be noted that the graphic of this instructions proportionally do not illustrate, it is only used for disclosing the present invention.
Figure 1A-Fig. 1 J shows the sectional view in one embodiment of the invention contact panel each stage of method for making.Below coordinate Figure 1A-Fig. 1 J to describe and disclose one embodiment of the invention contact panel method for making.First, one substrate 101 is provided, substrate 101 comprises one first side 1011 and second side 1012 with respect to this first side 1011, wherein the first side 1011 is touch control components (will in follow-up detailed description) of the various storehouse of carrying, the second side 1012 is to accept user's contact, for example, by finger or pointer.Substrate 101 can have an induction zone 101A and at least one Yi Ce surrounding zone, induction zone 101B that is arranged on, and in the present embodiment, surrounding zone 101A is arranged on the surrounding of induction zone 101B.In the present embodiment, substrate 101 can form for any material that can be penetrated by light, as substrate can form for glass, acryl (Polymethylmethacrylate is called for short PMMA) or polycarbonate (Polycarbonate is called for short PC).Fig. 2 shows one embodiment of the invention contact panel making planimetric map of next stage, Figure 1B shows the sectional view along Fig. 2 profile line I-I ', please refer to Figure 1B and Fig. 2, form a sensing electrode layer 102 in the first side 1011 of substrate 101, in one embodiment, sensing electrode layer 102 can form for any transparent conductive material, for example indium tin oxide (ITO) or indium-zinc oxide (IZO).The method that forms sensing electrode layer 102 can be wire mark method or other.Fig. 3 shows one embodiment of the invention contact panel making planimetric map of next stage, Fig. 1 C shows the sectional view along Fig. 3 profile line I-I ', please refer to Fig. 1 C and Fig. 3, periphery in the first side 1011 of substrate 101 forms a light shield layer 103, wherein light shield layer 103 is arranged at this surrounding zone, and cover the sensing electrode layer 102 that is positioned at surrounding zone 101B, so can be so that the sensing electrode layer being covered form an induction zone 101A, light shield layer 103 can intercept ultraviolet ray 104.Light shield layer 103 has a plurality of through holes 105 to expose the part sensing electrode layer 102 that is positioned at surrounding zone 101B, and the size of through hole 105 and position system are through configuration, be used at subsequent step filled conductive packed layer 1061, signal transmission line 107 is arranged on light shield layer 103, and signal transmission line 107 is electrically connected sensing electrode layer 102 by the conductive fill layer 1061 in through hole 105.
The material of this light shield layer is that optical density value is greater than 3 in one embodiment, optical density=1g (1/trans) wherein, trans is the transmittance of light shield layer, hence one can see that, and when optical density value is greater than 3, transmittance is less than 0.1%, now ultraviolet 104 transmitances will be less than 0.1%, wherein the optical density value of light shield layer can reach by adjusting light shield layer 103 thickness, and as when light shield layer 103 is black ink material, when the thickness of light shield layer 103 is greater than 10um, optical density value is greater than 3.
In another embodiment, light shield layer 103 also can self properties of materials and is reached function of shielding ultraviolet radiation, for example, add ultraviolet screening agent.Wherein ultraviolet screening agent can be mineral-type ultraviolet screening agent, mineral-type ultraviolet screening agent is mainly the fine powder of ceramic-like, these powder comprise porcelain earth, calcium carbonate, talcum powder or its potpourri, are combined incident ultraviolet ray are played to the effect of reflection or scatters ultraviolet shielding by fine powder with light shield layer material, thereby prevent that ultraviolet ray from penetrating light shield layer 103.The ultraviolet screening agent that wherein added can be also organic ultraviolet screening agent, this organic ultraviolet screening agent comprises salicylate class, benzophenone class, benzotriazole, group-substituted acrylonitrile or triazines and hindered amines potpourri, such screener is mainly to play absorb ultraviolet ray and carry out the effect of energy conversion, by ultraviolet ray being become to the shorter electromagnetic wave of low-energy heat energy or wavelength, thereby prevent that ultraviolet ray from penetrating light shield layer 103.The ultraviolet screening agent that wherein added can be also mineral compound and its potpourri of organic compound, by incident ultraviolet ray being played to reflection or scattering and ultraviolet ray being become to low-energy heat energy or the shorter electromagnetic double action of wavelength, thereby prevent that ultraviolet ray from penetrating light shield layer 103.
Fig. 4 shows one embodiment of the invention contact panel making planimetric map of next stage, Fig. 1 D shows the sectional view along Fig. 4 profile line I-I ', please refer to Fig. 1 D and Fig. 4, form a conductive layer 106 that can be cured ultraviolet ray reaction on light shield layer 103, and insert in those through holes 105, this conductive layer 106 is strip, and to be wherein filled in the part of those through holes be conductive fill layer 1061 to this conductive layer 106, and the part being directly formed on light shield layer 103 is conductive surface layer 1062.
In this embodiment, the material of conductive layer 106 is conductive materials of ultraviolet-curable, further the conductive material of this ultraviolet-curable is ultraviolet conducting resinl, ultraviolet ray conducting resinl mainly comprises monomer and light trigger, wherein monomer mainly comprises acrylate, cyanoacrylate, epoxy resin, silicone.
Light trigger in ultraviolet ray conducting resinl produces the free radical of activation under ultraviolet irradiation, the free radical of surface active is under ultraviolet ray (250nm) is irradiated, with oxygen chemically reactive, generate titanium dioxide base and monomer, the free radical of inner activation and monomer be chemically reactive under ultraviolet ray (365nm) is irradiated, generate monomer free radical, it is combined with monomer chemically reactive again under ultraviolet ray (365nm) is irradiated again, so analogize, finally become polymkeric substance, thereby be cured.
The present embodiment does not need to aim at accurately each through hole 105 in the step that forms conductive layer 106, concrete alignment method is as follows, as shown in Figure 4, the conductive layer 106 of formation can be the strip structure of a plurality of through holes 105 of a covering, and it can form the frame-shaped construction (as shown in Figure 4) on light shield layer 103.Then, as shown in Fig. 1 E, use a ultraviolet ray 104 (ultraviolet range is 200-400nm), from the second side 1012 of substrate 101, through the through hole 105 substrate 101 and light shield layer 103, expose to conductive layer 106, because the optical density value of light shield layer 103 is greater than 3, transmittance is less than 0.1%, known according to the solid energy=illumination * time * transmittance of light, directly be formed at the conductive surface layer 1062 on light shield layer 103, the solid energy of light obtaining is not as good as 0.1% of conductive fill layer 1061, therefore after conductive fill layer 1061 solidifies, conductive surface layer 1061 can not produce reaction and solidify.
In another embodiment when light shield layer 103 is added with ultraviolet screening agent, ultraviolet ray 104 can be absorbed or reflection by the ultraviolet screening agent in light shield layer 103, therefore ultraviolet ray 104 can not see through light shield layer 103 and be irradiated to conductive surface layer 1062, so conductive surface layer 1062 can not react curing.And because through hole 105 does not exist the light shield layer 103 that is added with ultraviolet screening agent, therefore ultraviolet ray 104 can not be absorbed or reflect away, can shine directly into the conductive fill layer 1061 that is arranged in through hole 105, and make it to produce curing.
Fig. 5 shows one embodiment of the invention contact panel making planimetric map of next stage, Fig. 1 F shows the sectional view along Fig. 5 profile line I-I ', please refer to Fig. 1 F and Fig. 5, carry out a cleaning step, in this step, adopt cleaning machine to clean and remove the conductive surface layer 1062 not being cured, only stay and be arranged in through hole by the curing conductive fill layer 1161 of above-mentioned ultraviolet ray irradiation, and this part conductive layer is really to play electric connection effect.
It should be noted that, the present embodiment is used ultraviolet ray 104 through through hole 105, to irradiate conductive layer 106 from the second side 1012 of substrate 101, thereby solidify the conductive fill layer 1061 in through hole, adopt again follow-up cleaning step to remove not by conductive surface layer 1062, adopt method for making of the present invention not need and through hole 105 exactitude positions when forming conductive fill layer 1061 compared with prior art, therefore there will not be because contraposition deviation affects electrically conducting between sensing electrode layer and signal transmission line and make, and then affect product yield.
Next, please refer to Fig. 1 G, form a signal transmission line 122 on light shield layer 110, and be electrically connected conductive fill layer 1161.Signal transmission line 107 can be used wire mark method, the half tone of matching design circuit, signal transmission line 107 printings are covered on light shield layer 103, and contact with the conductive fill layer 1061 in through hole 105, so signal transmission line 107 can see through conductive fill layer 1061 and 102 electric connection of sensing electrode layer.
Then please refer to Fig. 1 H, form insulation course 108 on signal transmission line 107, to avoid signal transmission line 107 to be exposed to, in air, cause oxidation, insulation course 108 can form by wire mark, insulation course 108 is preferably transparent material and forms, for example the composition material of insulation course comprises urethane acrylates, resin.Insulation course 108 can comprise an opening 1081, exposes its underpart signal transmission line 108.
Please refer to again Fig. 1 I, a flexible circuit board (flexible printed circuit is called for short FPC) 109 is sticked together and is fixed on insulation course 108 via a conductive adhesive layer 110, to see through conductive adhesive layer 110, be electrically connected with signal transmission line 107.In one embodiment, be to use hot press by flexible circuit board, using anisotropic conductive as conductive adhesive layer 110, pressing is attached on the signal transmission line 107 that insulation course 108 exposes.
Follow-up, please refer to Fig. 1 J, in flexible circuit board 109 and 101 coatings of substrate, one strengthening glue-line 111, to increase the fixing intensity of flexible circuit board 109, avoid moving improperly and causing flexible circuit board 109 to depart from when successive process steps or assembling.
Please referring again to Fig. 1 J, further to disclose the enforcement structure of contact panel, this contact panel comprises a kind of contact panel, and it comprises: a substrate 101, and this substrate 101 has an induction zone 101A and at least one surrounding zone 101B that is arranged on this induction zone 101A mono-side; One sensing electrode layer 102, be arranged on this substrate 101 and certainly this induction zone 101A extend to this surrounding zone 101B; One light shield layer 103, be arranged at this surrounding zone 101B, and be covered on this sensing electrode layer 102 of this surrounding zone 101B, this light shield layer has a plurality of through holes 105 to expose this sensing electrode layer 103 of part that is positioned at this surrounding zone 101B, and wherein this light shield layer 103 is antiultraviolet materials; One conductive fill layer 1061, fills this through hole 105 of this light shield layer, and wherein this conductive fill layer 1061 is a ultraviolet curing shaped material; And a signal transmission line 107, be arranged on this light shield layer 103, and this signal transmission line 107 is electrically connected these sensing electrode layers 102 by this conductive fill layer 1061.
According to above-mentioned contact panel with and this contact panel method for making, owing to having adopted structure of the present invention and alignment mode to reduce the demand of conductive fill layer printing precision compared to prior art, improved because of problems such as electrically conducting of causing of printing skew are abnormal.
Although the preferred embodiment of this announcement explanation as above; so it is not in order to limit the present invention, anyly has the knack of this skill person, without departing from the spirit and scope of the invention; when doing a little change and retouching, thus the present invention's protection domain when depending on after the attached claim person of defining be as the criterion.