This application claims the interim Shens in the U.S. of entitled " the Dielectric Waveguides " that submits on March 19th, 2013Priority that please be No. 61/803,435 (attorney docket TI-73114PS) and the application is incorporated by reference.
Specific embodiment
Let us now refer to the figures detailed description of the present invention specific embodiment.For consistency, similar member in each figurePart is indicated by similar reference number.In the following detailed description of the invention, numerous specific details are set forth so as to more thoroughlyGround understands the present invention.However, it is obviously easy to see that, can there is no these details for those of ordinary skillsIn the case where practice the present invention.In other cases, well-known feature is not described in detail, so as to avoid unnecessarilyDescription is set to complicate.
As the frequency in electronic building brick and system increases, wavelength reduces in the corresponding way.For example, at many computersReason device operates in Gigahertz domain at present.As operating frequency increases to Asia-Pacific hertz (sub-terahertz), wavelength becomesIt is short enough, to be more than that short-range signal wire can serve as antenna and signal radiation can occur.Fig. 1 is each across havingThe curve graph of the wavelength comparison frequency of the material of kind dielectric constant.As shown in curve 102, wherein the curve indicates there is low dielectricThe material of constant 3 such as printed circuit board, the wavelength that 100GHz signal will have about 1.7mm.Therefore, the signal of length only 1.7mmLine can serve as all-wave antenna and give off the signal energy of significant proportion.
Wave is propagated in all directions in open space, such as spherical wave.By this method, the power of the wave is with the flat of distanceSide is lost in proportion；That is, power is source power divided by R at the distance R away from the source2.It, can be in relatively long distanceHigh-frequency signal is conveyed using waveguide.Wave is limited in and propagates along a dimension by waveguide, therefore under ideal conditions, wave is passingSowing time not loss power.Electromagnetic wave is described along the propagation of the axis of waveguide by wave equation, and the wave equation derives fromMaxwell equation (Maxwell's equation), and structure of its medium wavelength depending on waveguide and the material in waveguide(air, plastics, vacuum etc.), and depend on the frequency of wave.Common waveguide only has several classes.Most common one kind waveguide is that haveThe waveguide of rectangular cross section, the rectangular cross section are not usually square.The long side of this cross section is usually its short sideTwo double-lengths.These features polarize for load level or the electromagnetic wave of vertical polarization is useful.
For the minimum wavelength that Asia-Pacific hertz rf signal is encountered, dielectric waveguide performance is good, and compared toFor hollow metal waveguide, manufacture cheaper.In addition, metal waveguide has the cutoff frequency determined by the size of waveguide.It is lowIn cutoff frequency, there is no the propagation of electromagnetic field.Dielectric waveguide (DWG) has wider opereating specification, and without fixed cut-offPoint.Various types of dielectric waveguides are described herein and for dielectric waveguide to be coupled to integrated circuit or is coupled to anotherThe technology of dielectric waveguide.
DWG cable can provide with bandwidth interconnections the effective means for connecting two devices.Retractible Jie can be usedElectric wave cable constructs fixed or mobile electronic device, and the retractible dielectric waveguide cable can be used to be coupled toAnother device and provide safe high-speed data connection.It will be described in further detail in as follows, rotatable communication part can makeDielectric waveguide cable is easy to extend to be coupled to remote-control device and the then retraction when no longer needing to connect, the dielectric waveCable is arranged in electronic device with the collocation form on spiral or spool.An end of DWG is connected in deviceCommunication chip, and another end of DWG cable can have socket connector to be coupled to remote-control device.Dielectric waveguide lineAxis can be activated by spring-feel mechanism (spring loaded mechanism), and the spring-feel mechanism allows using mostDWG cable is unfolded in small pulling force.Lock-in feature can be provided, DWG cable is locked in various length.It is more detailed about Figure 37-42Ground describes the details of the device with retractible DWG cable with rotatable communication part.Describing about Fig. 2-36 can be withThe various types DWG cable and signaling interface structure used in described device.
Fig. 2A -2D shows the various configurations of the dielectric waveguide generated using printed-board technology.Dielectric waveguide can be usedMake the interconnection of chip on printed circuit board (PCB) to the high data rate communication of chip.The embodiment energy of this dielectric waveguideIt is enough to be assembled into additional surface mounting assembly in production line and lead-free solder reflux work be resisted during the assembling of PCBSkill.
Fig. 2A shows multi-layer PCB 200, contains several conductive layers separated by insulating layer.It is well known that each conductionLayer can be patterned into interconnection pattern and pass through through-hole interconnection.Through-hole is also brought to the surface of PCB and is integrated circuit(IC) substrate 210 provides connection pad.It is well known that soldered ball 202 provides the through-hole on pin and PCB200 on carrier 210Electrical connection between pad.IC240 is installed on substrate 210 and containing the circuit for being generated high-frequency signal using known technologySystem.
IC210 includes the high-frequency circuit system for being connected to the generation signal of dipole antenna 212.Dielectric waveguide 220 is by connecingMouth region 222 is joined to dipole antenna and reflector 214, which can be a part of dielectric waveguide.Dielectric waveguide (DWG)220 are installed on PCB200 and must be able to withstand the reflux technique for IC210 to be attached to PCB.
Standard PCB manufacturing technology can be used to manufacture in dielectric waveguide 220.PCB manufacturer have the ability by usingMicro- filler produces the plate with differing dielectric constant as dopant.Dielectric waveguide can be made by following operationIt makes: being routed out channel in the plate of low-k (ε k2) and led to the filling of the material of high dielectric constant (ε k1) is describedRoad.Fig. 2 B-2D shows three interface options that can be used to engage DWG220 Yu microelectronic device substrate 210.Fig. 2 B show byThe interface area 222 that metal waveguide is formed, the metal waveguide are (not shown) next using vertical copper wall and top and bottom layers of copperIt is made.DWG core component 225 is made of the material with high dielectric constant, and covering 226 is by having compared with low-kPCB material is made.Fig. 2 C shows similar idea, but forms loudspeaker 223 to help the idol from microelectronic device substrate 210Pole antenna trapping more radiates.Fig. 2 D shows a kind of scheme without using metal waveguide.Only in the dipole of IC carrier substrates 210Interface is formed between antenna 212 and the dielectric matched edges 224 of waveguide 220.Any one of these three waveguide designs all may be usedTo be manufactured by following operation: repeating repeatedly and to be then sawn into pcb board in the pcb may be used as independent surface and pacifiesFill the independent waveguide of part.
Fig. 3 A-3C is the orthographic projection of Exemplary dielectric waveguide 300, which is similar to using typicalFig. 2 B of PCB manufacturing technology manufacture.Fig. 3 A-3C shows how DWG300 manufactures.In this example, it shows from singleThree DWG300-302 that PCB is cut out；However, this is just for the sake of illustrating, and can usually be manufactured on a PCBGreater number of DWG and the DWG is then cut into individual DWG along cutting line 320.It should be noted that DWG302 includesTwo channels；Greater amount of channel can be manufactured in the same way.
Fig. 4 is the flow chart for showing the technique for manufacturing dielectric waveguide.Referring also to Fig. 3 A-3C, PCB initial substrate layer310 include layers of copper or other conductive layers 311, and the conductive layer is etched to form the bottom side of metal waveguide part 222 or 223,Referring again to Fig. 2 B, Fig. 2 C.Layers of copper 311 is omitted when manufacturing DWG as shown in Figure 2 D.It is each DWG in substrate layer 310Channel forms 402 grooves.The channel is usually rectangle, and width is usually twice of depth.Based on known waveguide theory,Size is selected based on the DWG frequency for being intended to convey and gained wavelength.The channel can be formed by various known technologies,Such as: machinery wiring or grinding, by penetrating mask by using chemical etchant etching or medium being sprayed with percussion drill bit scrapingIt penetrates.
Referring again to Fig. 2 B, Fig. 2 C, the side wall 315,316 for metal waveguide part (such as part 222 or 223) can makeIt is formed with the technique for forming through-hole is similar to.Similar to formed be used for through-hole hole, be each side wall wire laying slot andThen the groove described in the technique plating being similar to for the technique of through-hole.The size of metal waveguide part can be similar to electricity and be situated betweenThe size of electric core or one can be slightly larger than another.The technique for forming channel groove can also be in shapeAt the material removed after side wall between side wall.
Channel once being formed, it can 404 channels are filled with the pcb board material of differing dielectric constant with higher,To form core component 318.The dielectric constant values of PCB substrate layer 310 usually can be in the range of about 2.5-4.5.It can be withThe dielectric constant values for using micro- filler as dopant and being promoted core component 318, so that the dielectric constant of core component 318Higher than clad material 310,312 and 314.Using typically available material and dopant, the dielectric constant of core component is logicalA series of values of about 3-12 can be often selected from.It is, for example, possible to use various types of materials as dopant, such as ZnO orBaTiO3.PCB and filler material can be obtained from various sources, such as Luo Jie company (Roger Corporation): for example, withIn the RO3003 of PCB, and for the RO3006 or RO3010 of filler.
Also the top layer 314 with etched layers of copper 313 can be laminated 406 on the top of substrate layer 310, to be formedThe top of covering 226.In some embodiments, top layer 314 can be omitted and the DWG cut can be inversely installed at PCBOn carrier board (such as PCB200), to form remaining clad section.In other embodiments, top layer can be omitted and dielectricThe air that constant is about 1.0 will form the top of covering.It, can be on plane layer 310 in the embodiment for omitting top layer 314Optionally apply conformal coating or other protective layers.In general, when DWG will not by the mankind or it is other nearby object contacts when, can be withTop layer is omitted to save money.
Then plane layer 310 is cut open 408 to generate for example individual DWG300-302.Each individual DWG can be withContaining a channel or its can contain two or more channels, this depend on plane layer 310 how to be cut open.
Then individual DWG can be mounted 410 on carrier PCB and for conveying by integrated circuit (such as IC240)The Asia-Pacific hertz signal of generation.
Referring again to Fig. 2A, dipole antenna 212 and reflector 214, which provide, a kind of to be emitted to signal from microelectronic componentStructure in dielectric waveguide.On another end of dielectric waveguide interconnection, similar structures can be used to adopt signal from waveguideCollect in microelectronic component.
Dipole antenna 212 can be used to the dielectric waveguide by signal radiation into dielectric waveguide 220 by microelectronic componentOutside packaging body but it is extremely close to packaging body.According to its property, dipole antenna 212 will be towards dielectric waveguide with degree of orientationVery high radiation mode radiation, but be also to be radiated towards the direction of the core of packaging body in opposite to that direction.In dipoleReflector on the antenna back side can reflect the radiation radiated towards package center along the direction of dielectric waveguide.
Two different emitting structural designs will be described in further detail now.A kind of design is suitable for along coplanar with PCBDirection engaged with dielectric waveguide, and second of design is suitable for the dielectric waveguide that is disposed vertically with the plane defined by PCB and connectsIt closes.
Fig. 5 is the isometric view for the reflector array 514 being used together with dipole antenna 512 and Fig. 6 is its section view,This is the enlarged drawing of dipole antenna 212 and reflector 214 shown in Fig. 2A.Referring back to Fig. 2A, it is noted that dipole antenna212 and reflector 214 position in substrate 210.The outer edge of carrier 212 forms interface surface 211, the interface surfaceIt is configured as being joined to DWG220.Reflector structure 214 is formed in carrier substrates, and the carrier substrates are adjacent to dipole antenna212 and opposite with interface surface 211.
Referring again to Fig. 5, dipole antenna 512 is connected to by differential signal line 513 generates or receives Asia-Pacific hertz high frequency letterNumber IC240.Ground level (ground plane) 505 is oriented in the signal emitted from dipole antenna 512 towards DWG520'sDirection, but it is also oriented in the direction far from DWG520.Differential signal line with specified cross section is spaced apart with ground level 505One controlled quatity, thus Formation and characteristics impedance.Characteristic impedance is typically designed to about 50 ohm；However, other embodiments can be usedFor the optimized different characteristic impedance of specific application.
Reflector 514 is the plated-through hole array between two coplanar reflector panels 515,516, the two coplanar reflectionsDevice plate is above and below the plane of fixing dipole antenna 512.In some embodiments, there may be one or more additionalReflector panel 517, be coupled to through-hole array and be arranged essentially parallel to dipole antenna be arranged in it is identical with dipole antennaIn plane.Additional parallel reflectors plate can be added in other layers of (if present).Purpose is to make substantially vertical goldBelong to " wall " to erect, the metallic walls reflect radiation energy from dipole antenna 512 towards DWG520.Through-hole can be grounded,Or suspension joint can be kept.The metal structure serves as " short-circuiting device " from dipole antenna to radiation field.Make solid metal reflector knotStructure and about half wavelength of dipole antenna interval can provide best volume reflection.Alternatively, reflector structure can be placed on away from idol1.5 times of wavelength of pole antenna, 2.5 times of wavelength equidistants.Although the distance of a half-wavelength be it is optimal, in its 0.3-0.7Distance again or within the scope of more times provides applicable volume reflection.
Fig. 7 is the curve graph of the insertion loss of simulative display dipole antenna 512 and reflector 514 based on this configuration.It answersIt is noted that insertion loss is maintained at about -2.6db until about 168GHz fairly constantly.
Fig. 8 A and Fig. 8 B are shown coupled to another embodiment of the DWG820 of integrated circuit 240.In this embodiment,DWG820 is joined to the interface surface 811 on the bottom side of carrier 810, and the carrier is configured to pass through the engagement of the hole in PWB800DWG820.Reflector structure 818 is formed in carrier substrates, adjacent to dipole antenna 812 and opposite with interface surface 811.In this embodiment, reflector structure 818 can be disposed upon the metal plate of 812 top of dipole antenna.Make solid metal reflector knotStructure and about half wavelength of dipole antenna interval can provide best volume reflection.Alternatively, reflector structure can be placed on away from idol1.5 times of wavelength of pole antenna, 2.5 times of wavelength equidistants.Although the distance of a half-wavelength be it is optimal, in its 0.3-0.7Again or the distance within the scope of more times can provide applicable volume reflection.Reflector panel 818 can be grounded, or can keep suspension joint.
Fig. 8 B is the curve graph for showing the insertion loss of dipole antenna 812 and reflector 814 of the simulation based on this configuration.It should be noted that insertion loss is less than about -2db until about 166GHz.
As can be seen that provide a kind of good mode with the reflector structure of dipole antenna combination emit or receive byThe Asia-Pacific hertz signal that integrated circuit generates or receives.Two embodiments described herein provide low insertion loss and easilyIn implementation.It is needs dielectric waveguide relative to PCB is parallel or the application of vertical orientation provides implementation option.
Fig. 9-10 shows the embodiment for DWG to be directly connectcted to IC.Chip-scale package (CSP) is a kind of integrated electricityRoad chip carrier.In order to keep chip-scale qualified, the area of packaging body is typically not greater than 1.2 times of die area and the encapsulationBody is a kind of single tube core, the installable packaging body of direct surface.It is commonly available to ensure these packaging bodies as the another of CSPA criterion is that its ball spacing should be no more than 1mm.Tube core may be mounted to be formed on the interpolater of pad or ball above, asFlip chip ball grid array (BGA) encapsulation is the same or pad can be etched directly or is printed on silicon wafer, generation and silicone tubeThe extremely similar encapsulation of the size of core.Such packaging body is referred to as wafer level chip scale package (WL-CSP) or wafer-class encapsulation(WLP).
The technology for engaging microelectronic component directly with the dielectric waveguide communicated for THz RF will now be described.?Under frequency higher than Asia-Pacific hertz, conducting electromagnetic signals cannot be carried out using copper, this is because by known " skin depth effectCaused by impedance caused by (skin depth effect) " extremely increases.As discussed above, electromagnetic RF signal can be usedDielectric waveguide conveys, and the size of the dielectric waveguide is similar to that described above for the signal under the hertz frequency of Asia-PacificDWG。
Referring to Fig. 9, in this example, chip-scale package 940 constitutes microelectronic component.In CSP device, it can produceOr the logic semiconductor and circuit of reception Asia-Pacific hertz RF signal are formed in epitaxial layer (epi-layer) 943.In this exampleIn, CSP940 is mounted on PCB900, and the PCB can have the extra means being mounted thereto.In this example, solder is convexSCP940 is fastened to PCB900 by block 941；However, in other embodiments, it can be used being currently known or be developed laterDifferent types of mount scheme.
Silicon perforation (TSV) technology can be used by the opposite side of RF signal transduction to chip.Silicon perforation is to pass completely through siliconThe vertical electrical connection of chip or tube core (perpendicular interconnection accesses (Vertical Interconnect Access)).TSV is to be used forGenerate the high performance technology of 3D encapsulation and 3D integrated circuit.Compared to replacing for such as laminate packaging (package-on-package)Mode is changed, TSV is provided may substantially higher via densities, and the connection length that providing may be shorter.
On the side opposite with epitaxial layer 943 of chip, pattern metal compound constitute antenna 944 with emit and/orReceive the RF signal from dielectric waveguide 920.In this example, DWG920 is vertically mounted to (i.e. perpendicular to) chip.Figure 10The example that DWG was horizontally mounted to and (was parallel to) chip is shown.Metalized antenna can be formed in several ways, such as logicalIt crosses using sputtering, thermal evaporation or electron beam evaporation (e-gun evaporation) technology.This metal compound can be used it is variousMetallization process knowing or being developed later realizes, such as forms the titanium layer that contacts with Si to serve as adhesive layer, on the top of titaniumNi layers are formed in portion to serve as barrier layer (thus the pollution for avoiding Si tube core), and form one layer in the top of this last layerAluminium, copper, gold or any other metal with high conductivity.
Or it will be in the back side of antenna pattern to silicon die using photoetching process it is, for example, possible to use hard mask.For example, instituteStating antenna can be simple dipole antenna, Marconi antenna (Marconi antenna) or more elaborate paster antenna.In this example, two silicon perforations 945,946 provide antenna or from antenna to epitaxial layer 943 differential RF signal.
The ground level 942 being embedded in PCB900 is used as ELECTROMAGNETIC REFLECTION device, thus may edge and dielectric waveguide phase by antennaThe signal that opposite direction is sent is reflected towards dielectric waveguide.Underfill 941 can be installed so that DWG920 to be attached toSCP940。
This technology produces the low insertion loss between SCP940 and DWG920, easy to implement, and has used standard systemProducing material material and processing technology.
Figure 10 shows an exemplary system, and the system comprises PCB1000, and face is equipped on the pcbSCP1040-1 and 1040-2.SCP1040-1 includes the circuit system for generating Asia-Pacific hertz or terahertz signal, as described above, makingThe signal is transmitted to SCP1040-2 via DWG1020 with the silicon perforation for leading to back mounted antenna.Similarly,SCP1040-2 includes the circuit system for receiving Asia-Pacific hertz or terahertz signal, as described above, back mounted using being coupled toThe silicon perforation of antenna transmits the signal via DWG1020.PCB1000 is similar to PCB900 and including for will be byThe energy of dipole antenna radiation in SCP1040-1 is towards the reflected ground level of DSG1020.In this example, DWG1020Each end has interface surface on its lateral surface, and the interface surface is for being bonded on SCP1040-1's and 1040-2Antenna on back side allows DWG1020 to install from chip to chip level.
In some embodiments, the short section of DWG can be permanently attached to CSP or other types of encapsulation IC, such as aboveShown in Fig. 2A, Fig. 8 A, Fig. 9 or Figure 10, to form module.Then DWG section included in module is coupled to separatelyOne DWG section can become necessary to.The various schemes for engaging DWG section will now be described.
Figure 11-13 shows the simulation of the radiation energy for the configuration of various DWG interfaces.For example, this interface can be used for connectingTwo identical waveguides are connect with development length, or in the case where may be a part of electronic device for wherein one for connecting twoA different waveguide, the electronic device is for example are as follows: computer, server, smart phone, tablet computer or any other communicationDevice etc..For example, the DWG section of a part as IC module may be coupled to another DWG section.
When two dielectric waveguides are coupled, there may be gaps between two DWG.This gap generates impedance and losesMatch, the impedance mismatching can generate significant loss caused by the radiation energy caused by impedance mismatching.Extent of deterioration takesThe certainly material in the geometry and gap in gap.Based on simulation, angle is cut docking (square cut butt joint) and is seemedProvide significant impedance mismatching.
Figure 11 shows the analog result of the inclined cut interface between two DWG sections 1101,1102.Core component existsIt is shown at 1125 and covering is shown at 1126.In this example, gap 1104 is about 1.2mm.It should be noted that existing a large amount ofRadiation energy, as indicated by shadow region 1106.In Figure 14, curve 1401 is shown between the insertion loss comparison of inclined cut interfaceGap length.
Figure 12 shows the analog result of the cutting interface of the spearhead shape between two DWG sections 1201,1202.Core component existsIt is shown at 1225 and covering is shown at 1226.In this example, gap 1204 is about 1.2mm.It should be noted that existing lessThe radiation energy of amount, as indicated by shadow region 1206.In Figure 14, curve 1402 shows the insertion loss comparison of spearhead shape interfaceGap length.
If completing taper/tapered (taper) in only two sides of DWG, this spearhead shape is effectively, stillIt is more preferable when completing taper in four sides in DWG to form pyramid.This taper can also be used on four sidesCone or arch on two side faces make energy deflect back to any of DWG from signal by opposite side cutting deflectionOther shapes substitution.
Spearhead shape, pyramid, cone, arch or similar type shape provide connecing with extremely low insertion lossMouthful, easy to implement, mechanical autoregistration, and be flexible and steady for small misalignment.These shapes can use markQuasi- manufacture material and processing technology generate.
Referred to as " high frequency simulator structure (High Frequency Simulator Structure；HFSS simulation) "Device (can obtain from ANSYS company) is used to analysis various shape as discussed above.HFSS is a kind of three-dimensional for any 3DThe field high-performance full-wave electromagnetic (EM) simulator of passive device modeling.It uses finite element method (FEM) and integral Equation MethodsTo integrate simulation, visualization, solid modelling and automation.HFSS can extract collision matrix parameter (S, Y, Z parameter), visuallyChange in 3-D electromagnetic field (near field and far field), and generates the all-wave SPICE model for being linked to breadboardin.
Material in gap
In example as discussed above, the material for filling gap is only air, and dielectric constant is about 1.0.Such as elder generationPreceding to be discussed, the dielectric constant of core material usually will be in the range of 3-12, and the dielectric constant of clad material usually will beIn the range of 2.5-4.5.The difference of dielectric constant between mismatched impedance and the material in DWG and gap is proportional.This meaningEven if in the optimized situation of geometry of socket, the air gap between DWG is not still best configuration.In order to minimizeImpedance mismatching can design DWG socket, the dielectric constant and DWG core and packet of the rubber-like material with rubber-like materialThe dielectric constant of layer is extremely close.Flexible material is needed to accommodate and fill all spaces in gap.Dielectric constant is 2.5Example to 3.5 rubber-like material is silicone.The other materials with similar characteristics that can be used belong to following two classType: unsaturated rubber and saturated rubber.
Unsaturated rubberIncluding for example: synthetic polyisoprenes, polybutadiene, chloroprene rubber, butyl rubber, halogenationButyl rubber, SBR styrene butadiene rubbers, nitrile rubber, hydrogenated nitrile-butadiene rubber etc..
Saturated rubberIncluding for example: EPM(ethylene propylene rubber), EPDM rubber (ethylene propylene diene rubber), epichlorohydrinRubber (ECO), polyacrylic rubber (ACM, ABR), silicone rubber (SI, Q, VMQ), flurosilicone rubber (FVMQ), fluoroelastomer(FKM and FEPM) ties up logical (Viton), Te Nuofulong (Tecnoflon), Fu Luorui (Fluorel), Perfluoroelastomer (FFKM) spyNuo Fulong PFR, Ka Lerui (Kalrez), Ke Lazi (Chemraz), pendant La Sita (Perlast), polyether block amide(PEBA), chlorosulfonated polyethylene (CSM), (Hypalon (Hypalon)), ethane-acetic acid ethyenyl ester (EVA) etc..
Figure 13 shows the analog result of the cutting interface of the spearhead shape between two DWG sections 1301,1302.Core component existsIt is shown at 1325 and covering is shown at 1326.In this example, gap 1304 is about 1.2mm and is filled with silicon materials.It should be noted that the amount of radiation energy is negligible.
Figure 14 is the curve graph for showing the insertion loss comparison gap length of various interface configurations.Curve 1403, which is shown, to be hadThe insertion loss of the spearhead shape cutting interface of silicon rubber gap filling agent compares gap length.Curve 1401 shows inclined cut and connectsThe insertion loss of mouth compares gap length.Curve 1402 shows the insertion loss comparison gap length of spearhead shape cutting interface.
As can be seen that using the optimal design with spearhead geometry and with silicone material filling gap for arriving greatlyThe gap of 1.5mm produces 1dB decaying below, as shown in curve 1403.
As gap becomes narrower, close to 0.0mm, the insertion loss of any configuration is reduced to about zero；However, when usingWhen the non-precision DWG of economy, 0.0 gap is generally difficult to maintain.
Although simulation shown in Figure 13 has used the silicon gap filling agent of the uniform dielectric constant with 2.5-3.5,It is in another embodiment, it is possible to produce a kind of deformable gap filling agent, the deformable gap filling agent is inThe dielectric constant of core material is preferably matched in heart district with high dielectric constant, while there is lower Jie in outside areaElectric constant is to match the covering of DWG.
Figure 15 shows two DWG1501,1502 coupled with the hasp connector with silicon gap filler materials 1512.One sheet 1510 of hasp connector is mounted on the end of DWG1510.Another sheet 1511 of hasp connector is installedOn the end of DWG1511.The installation site of hasp connector sheet is controlled, so that when engaged, deformable gap fillingAgent material 1512 is compressed empty to eliminate most of (if not all) in the gap between DWG1501 and DWG1502Gas.
Although the specific configuration of connector is shown in FIG. 15, any number of mesh is can be used in other embodimentsConnector that is preceding known or designing later is designed so that two DWG to be coupled, while being maintained mechanical registeration and being providedIt is enough to maintain the bonding force of the rock deformation pressure on gap filler materials.
For example, deformable material can usually adhere to the male end of DWG1501 or adhere to the female end of DWG1502.It is variableShape material can be used glue, heat fusing or other bonding techniques and be adhered to non-permanent manner.However, it is possible to by relatively thin one layerDeformable material adheres to the end of DWG1501 and the end of DWG1502, so that gap is filled by two layers of deformable material.
Referring back to Fig. 8 A, for example, the DWG with right-angled corner can be used to be connected to the bottom side of IC module.Another useWay, which can be from backboard, is connected to the PWB being inserted into backboard in a vertical manner.As can be seen that the DWG with right-angled corner hasMany purposes.Problem is that the electromagnetic signal advanced in dielectric waveguide can be significantly lost when passing through sharp corner.ThisAn extremely serious problem because dielectric waveguide application usually require dielectric waveguide can be bent in 90 degree of corners andIt may need to do so in the case where short-radius.
Figure 16 A and Figure 16 B show the simulation of the radiation energy of the right-angled corner from DWG1601.This simulation example is shownThe loss of signal for 90 degree of corners that the dielectric waveguide mean curvature radius for being 1 × 2mm in section is 2mm.Such as 1610 Hes of Figure 16 AIndicated by the 1612 of Figure 16 B, there is the big energy radiated from DWG at the outer radius of DWG.
Figure 17 is the diagram that right-angled corner is minimized the DWG1701 of radiation leakage by shielding 1702.DWG1701 is sharpMetal deposition is carried out in the outer radius wall of angle corner will escape out dielectric if there is no plated reflector to reduce/eliminateThe example of the dielectric waveguide of the electromagnetic wave of waveguide.In general, dielectric waveguide 1701 can be made of plastic, and such as polypropylene gathersEthylene, PMMA(poly- (methyl methacrylate), commonly known as Plexiglass (Plexiglass)) etc..PMMA can haveThere is high dielectric constant value, especially when being handled with such as ceramic filler, and can be used for being formed the core component of DWG.It is poly-Propylene and polyethylene have lower dielectric constant and can be used for being coated on DWG.Metal deposition 1702 can be with variousMetal component is completed, such as copper, aluminium, gold, silver.
Metal screen 1702 can be applied to the outside of the covering in corner outer radius.In another embodiment, metalShielding part can be placed between the covering in the corner outer radius of core component and core component.Metal screen can pass throughVarious methods are formed, such as: selective plating technique uses glue or other bonding skills by adhesiving metal adhesive tape, by adherencyPreformed metal parts of art etc..
For example, surface 1704 can be shown coupled to the another of circuit board 1704 with indication circuit plate and surface 1706Circuit board.Circuit board 1704 can have various integrated circuits and other components mounted thereto.For example, similar to Fig. 2A's210,240 IC package body may be mounted at thereon and be coupled to DWG1701.In another configuration, electronic device such as 900,940 may be mounted on circuit board 1706 and be coupled to DWG1701.Similarly, circuit board 1706, which can have, is mounted on itGo up and be coupled to the electronic device of DWG1701.For example, in another configuration, circuit board 1706 be can be signal from DWG1701It is transferred to the backboard of another circuit board.
In another example, the right angle DWG820 of Fig. 8 A can be configured as with corner reflector as described herein.Therefore, many combinations of circuit board, substrate and electronic device, which can be configured as, utilizes right angle DWG, such as DWG1701.
Figure 18 A-18B shows the simulation of the radiation energy of the shielded right-angled corner from DWG.This simulation example is shownThe loss of signal for 90 degree of corners that the dielectric waveguide mean curvature radius for being 1 × 2mm in section is 2.5mm.It should be noted that turningThe shortage of radiation energy in the outer radius at angle is shielded caused by 1702 due to existing.
Figure 19 is the insertion loss comparison frequency for showing the DWG between the end for the system simulated with quarter bend tuneThe curve graph of rate.Curve 1902 shows the insertion loss of the DWG section in the outer radius of corner with reflector, and curve1904 show the insertion loss of the DWG section without reflector.
Plating can also extend on the side of dielectric waveguide, but if all four sides are all plated, justProduce the metal waveguide with the cutoff frequency determined by the size of dielectric waveguide.Not in the case where being lower than cutoff frequencyThere are the propagation of electromagnetic field.
Although showing to form about 90 degree of curved corners in this example, identical principle can be adapted for being greater than orBending less than 90 degree.For example, in some circumstances it may be desirable to the bending of 180 degree, and in other cases it can be required toOnly 45 degree of bending.
In this way, it is possible to provide having for low insertion loss using standard DWG material and the manufacture of known processing technologyAnxious curved DWG.
Figure 20 is the diagram of example flexible DWG2000.As discussed above, for using modulated RF (RF) technologyPoint-to-point communication, dielectric waveguide provide the low-loss method for energy to be directed to receiver (RX) from transmitter (TX).Many configurations are possible for waveguide itself.For example, describing solid DWG above for Fig. 2A.Solid DWG is generally suitableFor the short interconnection or longer interconnection in fixed system.However, its rigidity will limit its interconnecting assembly may need relative toPurposes in the case where moving each other.Flexible waveguide configuration can have core component, and the core component is by high dielectric constant (εK1 flexible electrical dielectric material) is made and the covering made of the flexible dielectric material low-k (ε k2) surrounds.Although air theoretically can be used instead of covering, because air has about 1.0 dielectric constant, the mankind or other objectsAny contact can all introduce the severe impedance mismatch effect that may cause loss of signal or error.Therefore, free air is usualSuitable covering is not provided.
Figure 20 shows flexible DWG2000, is configured to the core material fine strip shape object surrounded by clad material.Show hereinIn example, the thin rectangular bar of core material 2010 is surrounded by clad material 2012.For Asia-Pacific hertz signal, such as in 130-In 150 gigahertz ranges, the kernel size of about 0.5mm × 1.0mm works well.It is, for example, possible to use known extruding skillsArt manufactures DWG2000.
Figure 21 A-21D shows the various configurations of multichannel flexible DWG.There are the inadequate many situations in the single channel DWG.For example, two-way communication may need two channels DWG.Simple binary channels DWG2100 configuration is shown in Figure 21 A.Show hereinIn example, two core components 2101,2102 with higher ε k1 value are surrounded by the covering 2108 with lower ε k2 value.This stripe shapeThe configuration of cable shape can easily be extended to provide any number of multichannel.
However, such configuration is not always desired.As the number of DWG " channel " increases, the width of bar inclinesTo Yu Zengjia, this may be undesirable for some applications.In addition, the waveguide itself in stripe shape configuration is connected with adjacent waveThe spread pattern configuration that crosstalk between road may invade, because all waveguides are substantially in approximately the same plane.In order to alleviatePotential cross-interference issue can increase channel spacing or may need to add shielding.
The another way for solving crosstalk will now be described.This solution is how multiple waves to be constructed in cable combination partThe geometry solution that the problem of leading is provided convenience.Although embodiment shown here is intended for flexible cable application,But these geometry solutions can also be used in rigid waveguide sub-assembly.
Figure 21 B shows a kind of stripe shape cable 2110, wherein must be positioned as close to multiple channel arrangements to reduce cablePhysical size, to reduce manufacturing cost and increase interconnection density.In this example, adjacent DWG core component is (such as2111,2112) with the alternating horizontal of high ε k1 bar that by clad material 2118 is surrounded and vertical pattern form arrangement.AlthoughFour channels are shown here, but can be in the same bar by pacifying multichannel perpendicular to each other as illustrated in fig. 21bIt sets to implement two, three or more than four channels.The configuration of this " polarization " bar provides the maximum between adjacency channelAny shielding is added in isolation without increase channel spacing or between channels.
Figure 21 C shows the multichannel DWG cable 2120 of stacking.In this example, two row core components, which are stacked, (such as existsShown at 2121-2123) and surrounded by covering 2128.All core components are disposed perpendicular to each other so that crosstalk minimization.In this example, covering has substantially rectangular cross sectional shape.
Figure 21 D shows multichannel DWG cable 2130, and wherein covering 2138 has generally circular cross sectional shape.ThisIn the case of, it is surrounded completely by low ε k1 material envelope using round cable combination part and high ε k1 material bar.It should be noted thatMultiple cores component bar (such as 2131) disposes vertically to reduce crosstalk.
In the examples described above, waveguide itself configures and so that margin maximization between high ε k1 " channel " verticallyForm arrangement.This configuration makes the crosstalk minimization between channel, this is because the RF energy in each waveguide is polarized.90It spends polarized RF energy and does not interfere another channel.Therefore, made by rotating channel each other in 90 degree of arrangements, with identical polarInterval between channel is maximized.Channel with opposite polarizations mode can be spaced closer, because its interference is by mostSmallization.
Figure 21 D also shows that the flat zone 2139 that can serve as key (key).In any above embodiment, cable can be withBy " keying " in order to provide positive alignment.For example, in the case where rectangular bar key can be added by making corner flatten.Other common key control technologies, such as zigzag cable, the addition rib into extramural cladding can be applied.
Although multiple electricity dielectric cores are shown with roughly the same size, in some embodiments, oneOr more core size may exist difference, to optimize the efficiency of transmission of the RF signal with dramatically different wavelength.WithFrequency increases, and wavelength reduces and the physical size of electric dielectric core can be also reduced with the signal for higher frequency.
Standard manufacture material and processing technology manufacture can be used in above-mentioned flexible cable.The geometry of these cables can be withUsing stretching, extruding or smelting process construction, these are all quotidian things for manufacture plastics.
However, there is independent flexibility DWG for the interface between two components and inadequate many situations.For example,DWG essence is a kind of insulator.Although its can effectively direct high-frequency RF signal, transmitting considerable power level is notIt may.In many cases it may be desirable to providing DC or low frequency conventional conductive line solution and by one or more flexibility DWGThe combination in the high-frequency communication path of burden.
In another example, it may be desirable to include DWG in the cabling system of existing type.For example, USB is commonInterconnection, using the conductive cabling of high speed with 12MBps(USB1.1), 480Mbps(USB2.0) and 5.0Gbps(USB3.0) speed provides data and in addition from host apparatus, device provides power to the periphery.It will make in USB comprising DWGObtaining same cable can be used in MBps(megabit per second) and for Asia-Pacific hertz data communication.Another example is by PC(meter on kneeCalculation machine, palmtop computer, tablet computer, phone etc.) it is connected to the common power supply line of power supply.This can be AC line (PC'sIn the case of) or DC power supply.It supplies electric power for example, can permit comprising DWG using power cable with power cable and also mentionsThe network connection for being included for the electric system that high-speed data is transferred to building.
The aspect that these examples all have jointly is that existing cable or other required cables are always covered by dielectric substanceLid is to completely cut off and shield interior metal conductor.Combined cable system can use clad material of the outer insulator as DWGA part.By selecting low ε k2 material appropriate, shielding needed for this insulator will provide internal cabling and in heightAppropriate dielectric constant needed for limiting RF energy in dielectric constant core material.
Figure 22-25 is shown the various modes of flexible DWG and flexible metal cable combination.Figure 22, which is shown, to be had by dielectricThe communication cable 2200 for one or more conductor wires 2202 that sheath 2204 surrounds.Sheath component has low dielectric constant values, exampleSuch as within the scope of 2.5-4.5.Electric dielectric core component 2206 is neighbouring and to contact the outer surface of sheath component 2204 placed longitudinally.CoreHeart component has the high dielectric constant value higher than the first dielectric constant values, such as within the scope of 3-12.In this example, electricity is situated betweenElectric core component can have the rectangle of about 0.5mm × 1.0mm suitable for Asia-Pacific Hertz wave (such as approximation 80-200GHz)Section.
Covering 2208 surrounds sheath component 2204 and electric dielectric core component 2206.Dielectric constant (ε k) value of the covering is lowIn core dielectric constant values, and the value of sheath dielectric constant can be similar to.By this method, dielectric waveguide passes through electric dielectric coreHeart component is formed.There may be the regions or this region shown at 2210 for including air can pass through the deformation of coveringOr it is filled by other filler materials with low-k.
Figure 23 shows the communication cable 2300 with the one or more conductor wires 2302 surrounded by dielectric sheath 2304.In this example, the single layer dielectrics body on metallic cable is substituted by external three layers " interlayers ".For example, sheath member has low εK2 value, such as within the scope of 2.5-4.5.Electric dielectric core component 2306 is neighbouring and contacts the outer surface of sheath member 2304 longitudinal directionIt places.Core component has the higher ε k1 value higher than the first dielectric constant values, such as within the scope of 3-12.In this example, electricDielectric core component 2306 surrounds dielectric sheath 2304 completely.The thickness of about 0.5mm thickness is suitable for Asia-Pacific Hertz wave, for example, about80-200GHz.The third layer of covering 2308 surrounds sheath member 2204 and electric dielectric core component 2306.Covering, which has, is lower than coreThe lower ε k3 value of heart dielectric constant values, and the value of sheath dielectric constant can be similar to.By this method, dielectric waveguide passes throughElectric dielectric core component is formed.This technology can be extended to include the additional alternating layer of ε k2 and ε k1 material, to provide additionalWaveguide.
Figure 24 shows another flexible communication cable 2400.In this example, many dielectric waveguides can be embedded in encirclementIn the insulator of conductor cable 2402.Multiple electric dielectric core components 2406 with higher ε k1 value are neighbouring and contact with low εIt places the outer surface of the sheath component 2404 of k2 value.Multiple electricity dielectric core components are separated from each other and each has approximationThe cross sectional shape of rectangle.Filler 2407 with lower ε k3 value can be placed between core component.Then there is low ε k4The extramural cladding 2408 of value is placed on around multiple cores component.ε k2, ε k3 and ε k4 can have in such as 2.5-4.5Similar value in range.In this way, it is possible to form multiple dielectric waveguides.
Figure 25 shows keying cable 2500.In any above-mentioned solution, cable can be by " keying " in order to provide justAlignment.In this example, the side of cable has flat profile 2520.Other common key control technologies, such as sawtooth can be appliedShape cable adds rib etc. into extramural cladding.
For example, conductor cable such as 2202,2302 and 2402 can be metal wire or its can be for conduct data orThe another type of cable of energy, such as: one or more fiber optic cables, one or more twisted pairs are (as being used for CAT5 clothLine), coaxial cable etc..
Standard manufacture material and processing technology manufacture can be used in flexible DWG in above-mentioned cable.The geometry of these cablesStretching, extruding or smelting process construction can be used in shape, these are all quotidian things for manufacture plastics.
Figure 26 shows microelectronic package 2610, and wherein dipole antenna 2612 is coupled to induction element 2622DWG2620 is to improve the coupling of the radiation signal emitted by dipole antenna 2612.Electromagnetism RF wave (modulated RF carrier signal)It is generated by the electronic circuit system for including in the IC2640 that is mounted on substrate 2610.RF signal is coupled to mechanical with substrate 2610In the waveguide 2620 of alignment.For example, substrate 2610 and DWG section 2620 can be all mounted on PCB2600 to be aligned with admittedlyIt holds.
As described above, dipole antenna is for the good medium by radiant energy emissions into dielectric waveguide.Such as about figure2A, Fig. 5, Fig. 6 and Fig. 8 A are more fully described, and reflector element can be used to the indefinite energy in direction towards DWG2620It reflects.
It is coupled in DWG2620 to be further improved radiation energy, can includes one or more draw in DWG2620Guiding element.Dipole has the ring radiation figure of the axisymmetrical relative to dipole.In order to improve directionality and therefore dropLow insertion loss can add reflector and induction element.For example, dipole and reflector can reside in the same substrateAs the circuit system 2640 for generating electromagnetic wave on 2610, as being more fully described in Fig. 2A, Fig. 5, Fig. 6 and Fig. 8 A.For example, evenExtremely son and feed line can be implemented in the metal layer of MULTILAYER SUBSTRATE.
Reflector may be embodied as the staggered vias array in substrate, such as be more fully described with reference to Fig. 5,6.AlternativelyGround, reflector may be embodied as the metal ribbon for being for example parallel to dipole antenna orientation.Reflector ribbon can be grounded orIt can electric suspension joint.Reflector ribbon can usually be implemented on the same metal layer for implementing dipole antenna.Keep metal anti-Emitter structure and about half wavelength of dipole antenna interval can provide best volume reflection.Alternatively, reflector structure can be placedIn 1.5 times away from dipole antenna wavelength, 2.5 times of wavelength equidistants.Although the distance of a half-wavelength be it is optimal, at itDistance within the scope of 0.3-0.7 times or more times provides applicable volume reflection.Because skin effect accounts under the hertz frequency of Asia-PacificLeading position, so the thickness of metal reflector element is not crucial.
For example, induction element is similar in operation to Yagi-Uda array (Yagi-Uda array), the Yagi spark gap-spaceField array is commonly used in the beam antenna of communication radio frequency band and amateur frequency band.Yagi-uda is along verticalThe axis of dipole in element plane is driven element and guiding piece orientation from reflector direction.Depending on particular design,Typical spacing between element can change in the range of about 1/10 wavelength to 1/4 wavelength.It is former according to known Antenna DesignReason, the length of guiding piece are usually less than the length for being driven element, and the length for being driven element is less than the length of reflector.TheseElement is usually parallel in one plane.
The bandwidth of yagi-uda is the frequency for instigating its directive gain and impedance matching to maintain in defined standardRange.It is that extremely narrowband, performance are being higher or lower than its design frequency with the Yagi-Uda array that its citation form is presentedOnly just reduced under the frequency of several percentages.However, other than other technologies, by using larger-diameter conductor, bandWidth can substantially extend.
Because guiding piece is passive element, they can be embedded in dielectric waveguide sheet.The length of element 2622Degree and interval be chosen so as to for emit or the specified wavelength of received electromagnetic signal (referred to as RF carrier wave frequency) optimize tieThe directionality and bandwidth of structure.For example, appropriate intervals between dipole and guiding piece pass through the mechanical registeration that is provided by PCB2600To maintain.
The interval of induction element and length depend on the wavelength and total amount of induction element used.In general, with usingMore elements, gain and directionality increase but bandwidth reduces.The design is usually using the known day from textbook or guideLine designing technique is since approximate number.For example, " antenna theory analysis and design (Antenna Theory Analysis andDesign) ", page 1997,513 page-the 532 is incorporated herein by reference.
It can be used to optimize performance until meeting the requirement of specific application using the numerical modeling of known analog tool.It is usually gone on well with the guiding piece of 0.2-0.3 times of wavelength interval.The length of each induction element is in 0.5-0.3 times of wave-length coverageInside go on well.Guide arrays 2612 may include usually 12 or less element.
Table 1 lists the element spacing and number of the exemplary array for guiding piece 2622.Due to high carrier frequency (>100GHz), therefore component size specified in table 1 is fairly small.However, those sizes are based on first order resonant (close to λ/2)And antenna can use higher order resonance (such as λ, (3/2) λ etc.) also to design, this allows looser manufacturing tolerance.
The length of table 1- example guidance element and interval
(source: " Antenna Theory Analysis and Design ", 1997. tables 10.6)
For example, induction element 2612 can be moulded by metallic compound or plated plastic components.Group guidanceElement can be connected with the center sill being spaced by being used to support and is then inserted into the end of DWG section 2620.Usually willIn the end of less than 12 induction element insertion DWG.Because skin effect is occupied an leading position under the hertz frequency of Asia-Pacific,Metal thickness in induction element is not crucial.
By this method, emitting structural is divided into active " feed " section 2612,2614 being present on chip packing-body and depositsPassive " resonance " section 2622 being in waveguide 2620.The size of emitting structural is reduced, this is because the emitting structuralA part is embedded into dielectric waveguide itself.
Figure 27 A-27C is multiple views for Asia-Pacific hertz signal to be emitted to the structure of DWG2720 from strip line 2750Figure.As discussed above, it is slightly more complex for Asia-Pacific hertz electromagnetic signal being emitted to dielectric waveguide from microelectronic component.It is being situated betweenOn another end of electric waveguide, need to capture in microelectronic component from waveguide by the signal of DWG conveying.For example, aboveIt describes with reference to Fig. 2A, Fig. 5, Fig. 6 and Fig. 8 A-10 using antenna and signal is radiated dielectric waveguide from microelectronic component.SoAnd because the signal portion of electromagnetic signal can be radiated along the direction for being different from the position DWG and therefore be damaged in free spaceIt loses, so antenna needs directionality splendid and uniform for optimal design.Another option will now be described；In this exampleIn, electromagnetic signal is restricted to from silicon chip to DWG in its whole length.
Figure 27 A is mounted in the isometric view of a part of the microelectronic component on substrate 2710.It is mounted on substrate 2710On IC(it is not shown) in transmitter or receiver be connected to microstrip line 2750.Coupling mechanism allows microstrip line to be transitioned into metalIn waveguide 2756, so that the IC of microelectronic component be coupled with dielectric waveguide 2720.
Microstrip line 2750 from silicon chip has the matched impedance of silicon die with IC.This impedance is usually 50 ohm.It is well known that the impedance of microstrip line 2750 is determined by its cross-sectional shape and the distance between it and ground level 2752.HorizonFace 2752 extends to the length of microstrip line 2750 or less and the distance between microstrip line 2750 and ground level 2752 are controlled asUniformly.
Figure 27 B is how to illustrate in greater detail metal waveguide 2758 for being transitioned into the side view of DWG from microstrip line.HorizonFace 2752 is connected to the top side of metal waveguide 2756, is such as shown at 2753；And microstrip trace 2750 is connected to metal waveguideBottom side, be such as shown at 2751.As described above, dielectric waveguide 2720 has core component, the core component is by with Gao JieThe dielectric substance of electric constant (ε k1) is made and by the covering made of the dielectric substance with low-k (ε k2)It surrounds.As described above, the section of DWG2720 can be flexible or rigid material.Core component 2725 can be by various types ofDielectric substance is made, and is such as above more fully described.Polymer plastic is the typical material for core component 2725.ElectricityThe extension 2727 of dielectric core component 2725 extends in metal waveguide 2756.
For example, metal waveguide 2756 is typically mounted to package substrate during being assembled using solder reflow process2710.Polymer plastic DWG generally can not withstand the temperature of reflux technique, therefore the extension 2727 of DWG2720 will flow backIt is inserted into metal waveguide 2756 after technique.
It should be noted that how the thickness of the extension 2726 of core component is in a linear fashion from point 2753 to point 2751Increase in transition region.In the region, the width of microstrip line is fused longitudinally and tapered to which to form the taper being shown in further detail in Figure 27 C micro-Band line section 2754.In order to make the impedance of microstrip line and the impedance of metal waveguide 2756 match, linearly increasing microstrip traceWidth is advantageous.Simulation has determined that best taper is to be transitioned into transition region from the width for corresponding to 50 ohm lines 2750The taper of the width of metal waveguide at another end 2751.
Such as solder reflow process can be used and be installed to substrate 2710 more greatly for example, by solder projection (not shown)Substrate such as PCB2700 on.Then mount scheme such as binder, mechanical holder etc. can be used to pacify dielectric waveguide 2720It is attached on PCB substrate 2700.The extension 2727 of electric dielectric core component 2725 is extended in metal waveguide 2756 and is filledThe interior zone of metal waveguide.By this method, extremely effective forwarding function is produced between microstrip line and DWG.
Figure 28 shows the analog result of various length metal waveguide transition parts.These S parameter curves are from coupling aboveWhat the HFSS simulation of device design obtained.In this example, this group of curve corresponds to the metal waveguide of different length.S parameter refers toCollision matrix (" S " in S parameter refers to scattering).S parameter describes N-port network to the voltage signal at each portResponse.Collision matrix is the Mathematics structural for quantifying RF energy and how propagating across multiport network.S-matrix is used for complex networkProperty description be simple "black box".For the RF signal being incident in a port, a part of signal rebounds out that endMouthful, some of them, which scatter, simultaneously to be left other ports (and being possibly even amplified), and it is some of disappear, become heat or veryTo electromagnetic radiation.First digit in footnote refers to echo port, and second digit refers to entry port.Therefore S21 meaningTaste the response at port 2 due to the signal at port 1.The three groups of parameters drawn in Figure 28 are indicated for lengthThe metal waveguide of 0.8mm, 0.85mm, 1.0mm and 1.2mm and S11, S12 and the S22 for being directed to the frequency from 100GHz to 180GHzParameter.
Figure 29 is the isogram for signal to be emitted to the electromagnetic horn of DWG from microstrip line.As discussed above, fromMicroelectronic component emits to dielectric waveguide (DWG) and receives the coupling scheme that Asia-Pacific hertz electromagnetic signal needs good design.ThoughSeveral technologies are so had been described above, but transmitting signals to the problems in dielectric waveguide using antenna is if designed notWhen then most of electromagnetic signal can be as being lost along the radiation of direction locating for dielectric waveguide is different from.
The loudspeaker for constructing in the substrate of microelectronic package using multiple layers of copper and engaging with dielectric waveguide will now be describedThe Coupling device of antenna.This equipment can emit the splendid wave beam of the directionality being aligned with dielectric waveguide and thus be provided withThe energy transfer of effect.This interface can be used to electromagnetic signal being emitted to dielectric from the silicon chip being mounted in same package substrateWaveguide.The interface of same type can be used in another end of dielectric waveguide to read the electromagnetism letter sent by transmitterNumber.
Referring still to Figure 29 and Figure 30 A-30B, package substrate 2910 is that have by multiple insulation layers such as printed circuit boardMultiple conductive layer 2911(that material, ceramic material etc. separate are usually copper) MULTILAYER SUBSTRATE.It is well known that in MULTILAYER SUBSTRATEConductive layer can be patterned to form various conductive shapes and interconnection line pattern during the processing of MULTILAYER SUBSTRATE.
Electromagnetic horn 2960 has the generally trapezoidal or tubaeform top plate being formed in the different layers of MULTILAYER SUBSTRATE 29102961 and bottom plate 2962, wherein the through-hole 2962 of one group of close interval forms loudspeaker by the neighboring edge of coupling top plate and bottom plateThe two side walls of antenna.Electromagnetic horn has narrow input terminal 2972 and wider flared end 2970.One of input terminal2973 are divided to can be configured as rectangular metal waveguide.Metal waveguide 2973 provides between microstrip line 2950 and electromagnetic horn 2960Interface.In other embodiments, electromagnetic horn can be used different types of feeding mechanism and be joined to microstrip line.However,Rectangular metal waveguide is convenient and is easy to implement in MULTILAYER SUBSTRATE.
In the input end of waveguide, microstrip line 2950 is coupled to top plate and ground plane elements 2952 are coupled to bottom plate.It is micro-Band line 2950, which is placed in 2952 top of ground plane elements and has, is designed to generate substantially uniform transmission line impedance (usuallyAbout 50 ohm) geometric cross section.Certainly, the amount of space between the cross sectional shape and microstrip line and ground plane elements can becomeChange, to generate different impedances to match specific transmitter amplifier or receiver low-noise amplifier.
In order to form electromagnetic horn and rectangular waveguide, the close-packed array of staggered vias 2962 forms electromagnetic horn and waveguideVertical sidewall.Furthermore it is possible to form one group of thin silk thread in each intermediate copper layer in MULTILAYER SUBSTRATE between top layer and bottom2963, and the thin silk thread is used to connect the through-hole at each layers of copper grade, to improve the reflection characteristic of through-hole wall.FilamentNumber is determined by the number of the conductive layer in MULTILAYER SUBSTRATE 2910.In this example, it can be used for thin silk thread 2963 there are five layer.ItsIts embodiment can have less or more layer.For the viewpoint of performance, in order to manufacture the case where rule allows in substrateUnder close to solid wall, more filaments are preferred.However, the number depend on various substrate layer thickness canThe property used.Target is usually to make cost minimization, therefore less layer (performance needed for only providing enough and function) may be designTarget.For example, the width of every filament may only interconnect staggered through-hole row in specified side or the filament enough can be withIt is wide as staggered through-hole row.In another embodiment, one or more thin silk threads can be extend beyond electromagnetic horn andA part of the bigger ground level of waveguide, however, thin silk thread should not be inserted into electromagnetic horn and the interior section of waveguide.
Microstrip line 2950 can have conical section 2951, and width increases with it close to electromagnetic horn.Conical section2951 provide impedance matching so that the impedance of microstrip line and the substrate collection for integrating sectoral horn (antenna) feed to substrate are rectangularThe impedance of waveguide matches.The taper provides the impedance matching in broadband.
Microstrip line can be with horn tip on the same conductive layer, shown in such example；However, this is not required's.It can extruded on internal layer, and then the internal layer is connected to horn tip by through-hole, and wherein microstrip line flaring is connected to rectangleWaveguide.When microstrip line extruded on internal layer when, should not extend through the inside of rectangular waveguide and loudspeaker, this is because that will change it is entireRectangular waveguide/electromagnetic horn structure wave propagation property.Be intended that from wave propagate microstrip line medium smoothly transition from, then intoIn the rectangular waveguide medium for entering wave propagation, and the field is finally given off into electromagnetic horn.
Ground connection ribbon element is coupled to bottom plate 2962, to make between microstrip line and rectangular waveguide/electromagnetic horn structureWave propagate discontinuity minimize.
Electromagnetic horn lateral dimension (flaring angle, horn length, flaring width) is selected to provide with extremely low back lobeAnd the end-fire with optimum gain radiates.In free space, loudspeaker are longer, and gain is higher；But in lossy substrate,Hardship of the long trumpet by high substrate.Therefore, the material in order to minimize loss, based on operating frequency and for processing MULTILAYER SUBSTRATEMaterial to select horn length and accurate dimension, thus realize higher gain and without the smallest loss.The internal material of loudspeaker is usualIt can be PCB/PWB substrate or IC package substrate material.An initial packet size can be selected based on known antenna analysis technologyIt selects.Then simulation as described above can be used for refining size for such as special operating frequency and substrate material.
Rectangular waveguide cutoff frequency needed for electromagnetic horn height is chosen so as to support main mould (dominant mode), instituteStating main mould is TE10 in this case.Thickness of the height of loudspeaker also by MULTILAYER SUBSTRATE 2910 is limited.However, showing hereinIn example, the distance between top and bottom is limited by top Cu layers with the distance between bottom Cu layers.The size of waveguide is determinedDetermine cutoff frequency, therefore, design constraint is that the distance between top plate and bottom plate provide the cutoff frequency for being higher than expected operating frequency.
Such as solder reflow process can be used and be installed to substrate 2910 more greatly for example, by solder projection (not shown)Substrate such as PCB2900 on.Then mount scheme such as binder, mechanical holder etc. can be used to pacify dielectric waveguide 2720It is attached on PCB substrate 2700.By this method, highly effective forwarding function is generated between microstrip line and DWG.
Figure 31 shows the simulation of the signal radiation of the electromagnetic horn from Figure 29.This electromagnetical analogies is using Ansys HFSSWhat simulator carried out.As it can be seen in the drawing that from microstrip line 2950 emit signal be launched into core component 2925 orIn DWG2920, wherein radiation loss is few.From electromagnetic horn 2960 come out wave beam be it is extremely narrow, have be easy to focusTo the high directivity in DWG core.
Figure 32 shows RJ45 connector 3280 for DWG3220 to be coupled to the purposes of compatible socket.Based on being used for aboveThe description for engaging the various modes of DWG section, generally requires the mechanical couplings of some classifications to maintain the end of two DWG sectionsIn alignment appropriate.Connection should be easy to establish, and is reliable and is pluggable.Connector must satisfy the machine of waveguideTool alignment tolerance.One exemplary mechanical connector is shown in FIG. 15.Another option will now be described.
RJ45 connector is widely used in Ethernet application.In the form of its is well-known, it can have most four linesElectric data transmission is used for (8 lines in total).One or more waveguides are incorporated into standardization by exemplary RJ45 connector 3280In RJ45 connector body.
In order to maintain landing zone (footprint) identical with standard RJ45 connector, some or all of electric contact quiltRemoval is to provide space for dielectric waveguide.Because dielectric waveguide is inherently isolated, it is possible to retain several electric contacts3284 to be, for example, that outer peripheral provides electric power.Electric contact may be coupled to include the electric wire in DWG3220, such as aboveIt is more fully described about Figure 22-24.Similarly, one or more DWG cores shown in the cable 2110 of Figure 21 can be usedCopper or other conductor wires or twisted pair substitution.Known crimping skill used in the RJ45 connector of standard can be used in electric connectorArt is coupled to electric wire.
RJ45 coupler 3280 has dielectric connector shell 3281.It can have locking protruding portion 3282 withThe socket interlocking matched.DWG3220 can have single core or multiple cores, such as be described in more detail above.DWG3220 is usualShould be flexible, but its be also possible to it is rigid, such as described by Fig. 2 B, Fig. 3.
Flexible waveguide configuration can have core component 3225, and the core component is by with high dielectric constant (ε k1)Flexible dielectric material is made and is wrapped by the covering 3226 made of the flexible dielectric material with low-k (ε k2)It encloses.Although air theoretically can be used instead of covering, because air has about 1.0 dielectric constant, the mankind or otherAny contact of object can introduce serious matching-impedance effect, and the matching-impedance effect can cause loss of signal or error.Therefore, free air is generally not provided suitable covering.
The end of core component 3225 can be that flat or it can have spearhead shape or cone shape, such as onText about Figure 12 in greater detail.Deformable gap filling material also may include such as closing in the end of DWG3220In greater detail in Figure 13.
For example, binder can be used for connector shell 3281 or other bonding materials are attached to DWG3220.Work as electric contactWhen being crimped onto electric wire included in DWG3220, then it can individually be enough DWG3220 being retained in connector shellIn 3281.
By this method, inexpensive, easy to implement, mechanical self aligned coupling scheme is provided.
Figure 33-34 shows RJ45 connector for coupling the various applications of DWG.It may include PCB or other that Figure 33, which is shown,The electronic system of base substrate 3300.It can be used including Asia-Pacific hertz transmission or the integrated circuit 3340 for receiving circuit systemText technology any in greater detail is mounted in carrier substrates 3310 and is coupled to DWG section 3320.Female RJ45 connector3385 can also be mounted in base carrier 3320 in the way of being similar to described in Figure 32 and be coupled to DWG3320.The end of core component in DWG3320 can be that flat or it can have spearhead shape or cone shape, such as aboveIn greater detail about Figure 12.Deformable gap filling material also may include in the end of DWG3220, such as aboutFigure 13 is in greater detail.Female RJ45 connector can also include the electric contact for cooperating with such as electric contact 3284.It is publicThen RJ45 connector 3280 can be easily inserted into the positive machinery of progress in connector 3385 and connect with signal.
Similarly, female RJ45 connector 3485 can adhere to flexible or rigid DWG section 3420.Core in DWG3420The end of heart component can be that flat or it can have spearhead shape or cone shape, such as more detailed above for Figure 12Carefully describe.Deformable gap filling material also may include retouching in more detail in the end of DWG3420, such as about Figure 13It states.By this method, two flexibility or rigidity DWG can easily and quickly cooperate.
Figure 35 is the flow chart for showing the purposes of dielectric waveguide in systems.System integrator or system user can be usedFirst electronic system is connected the 3502 to the second electronic system by DWG.Two systems can be simply two different IC, describedIC can be a part of the bigger system for example by system integrator's assembling.It is connected to for example, two systems can be userTogether for personal or commercial use computing device and peripheral unit or two computing devices.System may be any type ofComputing device, such as, but not limited to: bracket base, desk pedestal or portable computer, mobile user devices such as notebookFormula computer, tablet computer, smart phone etc..System can be any kind of peripheral unit, such as: media storage dressIt sets, such as rotation or solid magnetic disc driver, modem or other interfaces for high speed network.
For example, DWG can be such as flexibility or rigidity DWG any type of in greater detail above.DWG can be as aboveThe combination cable, the enhanced USB cable for example including DWG.As RJ45 company can be used in more detailed description, connection aboveConnect device.There may be single DWG or may exist multiple DWG, this depends on system requirements.
System is once connected and is opened, so that it may generate 3504 Asia-Pacific hertz RF signal by the IC in the first system.It canTo use known modulation technique that one data flow or multiple data flows are modulated on RF signal.Then using in further detail hereinRF signal from IC transfer 3506 and is emitted 3508 into DWG by any coupling technique of description.
Then second system can be used any coupling technique described in further detail herein and capture 3510 spokes from DWGIt penetrates RF signal and shifts the 3512 RF signals captured.Then the IC in second system can demodulate RF signal, to restoreOne or more data flows in second system for using.
Two DWG can be used for the two-way transfer of data, or can be by providing receipts in each of two systemsHair device comes using single DWG.
Figure 36 is the diagram with the two systems 3601,3602 of DWG3620 interconnection.For example, two systems can be userThe computing device and peripheral unit or two computing devices to link together for personal or commercial use.System can be anyThe computing device of form, such as, but not limited to: bracket base, desk pedestal or portable computer, mobile user devices are such asNotebook computer, tablet computer, smart phone etc..System can be any kind of peripheral unit, such as: media are depositedStorage device, such as rotation or solid magnetic disc driver, modem or other interfaces for high speed network.
For example, DWG3620 can be such as flexibility or rigidity DWG any type of in greater detail above.DWG can beCombination cable as described above, the enhanced USB cable for example including DWG.Connection can be used as above in greater detailRJ45 connector.There may be single DWG or may exist multiple DWG, this depends on system requirements.
Connector 3621 and 3622 can be inserted into matched socket 3611,3612 by user or system integrator.EvenConnecing device and socket can be provided appointing for alignment above with reference to the RJ45 type connector as described in Figure 32-34, or for DWG3620What other types of connector.
Each system 3601,3602 can contain PWB or other types of substrate, be equipped with over the substrate one orMore integrated circuits as generated or received Asia-Pacific hertz signal in greater detail above, the integrated circuit are coupled to DWG,Then the DWG is terminated in socket 3611,3612.For example, the coupled modes between IC and DWG can be used above in more detailAny one of technology of description is implemented.
As described above and shown in example, two or more electronic devices can be held by using techniques described hereinIt changes places interconnection, to provide Asia-Pacific hertz communication path between electronic device.
Retractible DWG with rotatable communication mechanism
Figure 37 A-37C shows the electronic system device 3700 with the retractible DWG using rotary coupler 3750.?In some systems, it is likely to be suited for through retractible DWG cable bond two systems.By this method, cable can be alwaysIt is easily obtainable, but can easily be collected in beyond the invisible when not needed.If for example, electronic device 3700 can beAny one of the fixation of dry type or mobile system such as tablet computer, palmtop computer, smart phone, store equipment, wideField communication device etc. can benefit from the high-bandwidth communication for being linked to another device.
System and device 3700 includes the shell 3712 for covering and protecting substrate 3710, is equipped with execution over the substrateThe various electronic building bricks of system function.For example, substrate 3710 can be MULTILAYER SUBSTRATE, it is the upper surface of as described previously to be equipped with oneOr more packaging system as described in about Fig. 2A substrate 200.The form of shell can change in different embodiments, thisFunction and operation depending on system 3700.In Figure 37 A, shell 3712 is shown in a manner of cutting, to expose windingDWG cable 3720.
For example, DWG cable 3720 can surround spool 3714 as illustrated in figure 37b or allow the cable-pull across outerOther mechanisms of opening 3716 in shell 3712 are wound.DWG cable 3720 can be to be had as previously discussed with respect to described in Figure 20The simple flexible barcode DWG of rectangular core and rectangle covering.In another embodiment, covering can be by for example round or ovalConfiguration is moulded.In another embodiment, for example, DWG cable 3700 may include conductor, as described by Figure 32.
Rectangular core will be usually used, since it is desired that rectangle compares square cross-sectional shaped to ensure specifically to transmit mouldFormula, sometimes even single-mode.Mode determine electric field/magnetic field direction and its propagation property and its how to emit and connectIt receives, to only ensure desired mode with least loss.However, in various embodiments, core can also slightly deviate squareShape, such as: ellipse, round edge rectangle, with the multiple annular strands or internal core of rectangular shape arrangement can be byClosed powder of extramural cladding etc..
Although in other embodiments, core can not be solid for example, dielectric core is usually solid, such as existIn the case that core contains powder or multi cord.In such embodiments, for example, air or other materials may be at strand itBetween.
Connector 3760 can be provided on the end of DWG cable 3720, to allow DWG to easily connect to another dressIt sets.For example, connector 3760 can be similar to one of connector described in Figure 15, Figure 32 and Figure 33.
As being relatively described in detail above, an end of fixed DWG section 3722, which is coupled to, to be configurable for passing throughDWG3722 generates and/or receives the communication device 3740 of high-frequency signal.It is, for example, possible to use structures in greater detail aboveOne of by these high-frequency signals be emitted in DWG3722 or from DWG3722 receive.The other emitting structurals that can be used are more detailedEntitled " the Interchip Communication Using Embedded Dielectric that ground was submitted on April 04th, 2012It is described in related U.S. patent application the 13/439th, 646 of and Metal Waveguides ", side of this application to quoteFormula is incorporated herein.
Another end of DWG3722 retractible DWG3720 is coupled to by rotary coupler 3750.It configures hereinIn, DWG3722 is fixed, and spool 3714 and therefore DWG3720 can be revolved around the c-axis line 3752 perpendicular to substrate 3710Turn, as shown in Figure 37 C.By this method, DWG3720 extends to its overall length and is then retracted into shell 3712.
As shown in Figure 37 B, spool 3714 may be coupled to the wind spring retractor mechanism being mounted on shell 37123715.As DWG3720 is drawn out shell 3712, spring mechanism 3715 stores spring energy, and the spring energy then can be withFor DWG3720 to be retracted into shell 3712.By this method, DWG can be retracted and is wound into around rotatable male part3750 coil.Various types of spring retractors are well-known, such as are used for tape measure, window-blind, and do not needIt is described in further detail herein.In another embodiment, different institutions can be provided to replace spring mechanism for retractingDWG3720, such as the wheel of crank handle or finger manipulation.
Figure 37 C corresponds to the more detailed view of the rotary coupler 3750 of the hatching A-A in Figure 37 A.As aboveIt is discussed, DWG section 3722 is fixed on substrate 3710, and DWG section 3720 is configured around vertical c-axis line 3752 and revolvesTurn.As described above, DWG3720 has the rectangular core component 3725 surrounded by clad material 3726.Similarly, DWG3722 hasThere is rectangular core component 3723.Due to can get the restricted of space inside electronic device, DWG3720 may must be formed such as figureSharp corner shown in 37C.As described earlier, such sharp corner will lead to signals leakiness.Therefore, reflector 3727 can be simultaneouslyEnter at this sharp corner, such as in greater detail about Figure 16-18.
Above for as described in Figure 11-15, the spearhead shape interface between two DWG sections reduces loss of signal.In order toDWG section 3720 is allowed to rotate, interface area 3754 can be formed as conical by its shape, wherein having convex cone shape on DWG3720And there is matched convex cone shape on DWG3722, or vice versa.
In another embodiment, interface area 3754 is not smooth conical by its shape, and be can be with multiple general planesSlightly taper, as long as DWG3720 still may around axis 3752 rotate.
Referring again to Figure 37 B, another spring mechanism in retractor spring mechanism 3715 or shell 3712 can be configuredTo apply the spring force along 3752 direction of axis, to touch DWG3720 against DWG3722, to make in interface area 3754The length in gap be preferably minimized.For example, this interface area that can permit conical by its shape rotates and is then parked in pyramidIt is in close contact at the position of side alignment.Minimizing the length in the gap in interface area 3754 reduces signal on interface areaSignals leakiness when propagation.
Figure 38 illustrates in greater detail rotary coupler 3750.In this embodiment, fixing section 3722 also has zig zagAnd reflector 3728 is provided to reduce the loss of signal at this turning.
Figure 39 shows another embodiment with the communication device 3940 being mounted on substrate 3910.In this embodiment,Fixed DWG section 3922 is vertically protruded from communication device 3940, such as in greater detail about Fig. 9.
Figure 40 shows another embodiment of rotary coupler 4050, and wherein interface area 4054 is by rotatableIt is simply formed to cutting on the end of DWG4020 and fixed DWG4022.However, as discussed previously, the configuration of this interface can produceRaw significant loss of signal.A kind of mode for reducing loss of signal is can to include in the clearance space of interface area 4054Flexible material, the dielectric constant values of the flexible material are similar to the dielectric constant values of the core component of DWG4020 and 4022.ExampleSuch as, the grease based on silicone can be inserted in interstitial area, to make joint lubrication and introduce dielectric constant similar to DWG coreMaterial.It is of course also possible to be introduced into shown in Figure 37-39 by silicone grease or with the other materials similar to dielectric constantIn the interstitial area of rotary joint.
In terms of Figure 41 A-41D shows the alignment of rotary coupler.Figure 41 A shows the view downward along c-axis line 3752, again7C referring to Fig. 3.Figure 41 B shows the section view at hatching C-C.The core component 3723 of fixed DWG3722 is as schemed instituteShow orientation.The core component 3725 of rotatable DWG3722 may be at any position in its rotation；It is big in Figure 41 AIt causes perpendicular to core component 3723.It is removable in order to which the loss of signal during making signal be transmitted through DWG3720,3722 minimizesThe core 3725 of dynamic DWG and the core 3723 of fixed DWG should be aligned, so that allowing to transmit signal uses the identical of DWGExcitation mode.If this, which is aligned, is not implemented (as shown in the tangent line C-C in Figure 41 A-B), serious increased insertion in connectorLoss can be such that the communication across DWG3720,3722 sharply deteriorates.In order to avoid such case, locking mechanism is provided to lock rotationThe DWG3720 turned is aligned when rotating stopping with fixed DWG3722, as shown in Figure 41 C-41D.Figure 41 C is along c-axis line3752 downward views, and Figure 41 D shows the section view at hatching D-D.
Figure 42 shows the exemplary locking mechanism that can be provided for maintaining core to be aligned.Referring again to Figure 37 B, coiling machineStructure 3715 can also include locking mechanism, and the locking mechanism promotes rotatable DWG3720 equal when rotating stopping wheneverIt is locked at the position for maintaining the alignment between core 3723,3725.For example, the locking mechanism can be together with DWG3720For the simple circular 4260 and tool of rotation there are two retainer 4262, the retainer allows pawl 4264 to lock disk 4260In any one of two positions for being separated by 180 degree.It pulls DWG3720 that will overcome pawl 4264 manually from shell 3712 and permitsPerhaps rotation occurs, and therefore DWG3720 is allowed to be drawn out shell 3712 and also roll the spiral bullet in spring mechanism 3715Spring.Stop once pulling manually, helical spring will be induced to the rotatable coupling of opposite direction and start to roll DWG3720 and circleFor disk 4260 until pawl 4264 encounters one of retainer 4262, rotation at this time will be locked and core 3725 will be with core3723 alignments.It can promote the pawl from 4262 drop out of gear of retainer to the offer of pawl 4264 pressure 4265 and allow DWG3720Spring auxiliary retract restore.For example, pressure 4265 can be provided by manual operation button (not shown).
In another embodiment, such as only single retainer 4262 can be provided.Certainly, retainer 4262 can be based on spineThe mechanical location of pawl 4265 is oriented in different location.
Locking mechanism other known or being developed later can be used to provide rotatable DWG3720 in other embodimentsWith the alignment between fixed DWG3722.It is, for example, possible to use be similar to used in roller blind to be centrifuged locking mechanism.
For typical consumer electronics product, low cost solution is needed.Currently, as described above for low cost dressThe prior art for the rotatable mechanical system set is usually provided in the mechanical alignment tolerances within the scope of some tens of pm.Dielectric waveguidePurposes within the scope of millimeter wave is compatible with mechanical dimension's tolerance of hundreds of microns (to several millimeters)；Therefore, it is possible to use such as thisThe retractible DWG of low cost described in text provides Asia-Pacific hertz communication bandwidth for inexpensive consumer electronics system.On the contrary, this is publicDifference is insufficient to assure that the high data rate in the system based on optical fiber.
By this method, only the thin device (such as tablet computer, palmtop computer or smart phone) of 515mm thickness can haveIt is capable of providing and carries out the retractible DWG cable that Asia-Pacific hertz communicates with another device.Frequency (i.e. 30- in millimeter waveIt 300GHz) can be used for the above-mentioned forming factor.Lower frequency can be used in bigger size.
Other embodiments
Although describing the present invention by reference to illustrative embodiments, this specification is not intended to come in a limiting senseUnderstand.After reference this specification, various other embodiments of the invention will be aobvious for those of ordinary skillsAnd it is clear to.For example, although rectangular core will be usually used, since it is desired that rectangle comparison square cross-sectional shaped is specific to ensureTransmission mode, even single-mode sometimes, but other shapes can be used.Mode determines the direction of electric field/magnetic fieldAnd its propagation property and its how to emit and receive, to only ensure desired mode with least loss.However, in various realitiesIt applies in example, core can also slightly deviate rectangle, such as: ellipse, round edge rectangle, with the multiple of rectangular shape arrangementRound strand or internal core can be by closed powder of extramural cladding etc..
Although dielectric core is usually solid, in other embodiments, which can not be solid, such as in coreIn the case that the heart contains such as powder or multi cord.In such embodiments, such as air or other materials may be at strandBetween.
Although DWG that examples illustrated herein is fixed and rotatable has roughly the same cross sectional shape,In other embodiments, rotatable DWG can have the cross sectional shape different from fixed DWG, as long as the cross sectional shapeSimilar degree is enough compatible and therefore signal is allowed to propagate in the case where acceptable loss of signal across interface.
Dielectric core is usually non-conductive；However, in some embodiments, which may include some as described aboveHardware improve signal transmitting/reception, and reduce the loss in corner as described above or knee.In some implementationsExample in, core may include have differing dielectric constant material and be conducive to one or several Mode Launch and receive withEnhance the mode across the transmission of DWG to shape.
Several in techniques described herein can be combined in various ways.For example, being described with reference to Figure 11-15 eachKind mating interface configuration can be adapted for see, for example Fig. 2A-2D, Fig. 5, Fig. 8 A, Figure 21 A-21D, Figure 22-27, Figure 29 and Figure 32The output end of any one of the DWG section of equal descriptions.Connector described in Figure 15, Figure 32 and Figure 33 can be adapted for thisAny one of DWG section described in text.Each DWG described herein may be coupled to various transmittings described hereinAny one of structure.As described herein, the DWG cable that multiple emitting structurals can be used for having multiple cores component.It can be withMake the other combinations for being not known illustrate herein.
Certain terms are used to refer to specific system component in entire disclosure and claims.Art technologyPersonnel are it should be appreciated that the component in digital display circuit can be referred in the case where not departing from described function with different namesAnd/or it can be combined by mode (not shown) herein.This file is not intended to distinguish different in function in titleComponent.In the following discussion and in detail in the claims, term " includes " and "comprising" by it is a kind of it is open in a manner of use, andAnd it therefore should be interpreted that and mean " including but not limited to ... ".Also, term " coupling " and its derivative be intended to mean that it is indirect, straightIt connects, optics and/or radio connection.Therefore, if first device is coupled to second device, which be can be by straightConnect electrical connection, by the indirect electrical connection of other devices and connection, radio connection is electrically connected and/or passed through by optics.
Although method and step may mode be presented and is described in order herein, shown and description stepOne or more in rapid can be omitted, repeat while carrying out and/or by with it is shown in figure and/or described hereinOrder in a different order carries out.Therefore, the embodiment of the present invention should not be seen as being restricted to institute shown in figure and/or hereinThe specific step sequence of description.
It is anticipated that the appended claims will cover any such of the embodiment for belonging to scope and spirit of the present inventionModification.