The application requires the U.S. Provisional Application that is entitled as " Dielectric Waveguides " the 61/803rd of submitting on March 19th, 2013, the priority of No. 435 (attorney docket TI-73114PS) and be incorporated to by reference the application.
Embodiment
Describe specific embodiment of the present invention in detail with reference to accompanying drawing.For consistency, the like in each figure is represented by similar reference number.In describing in detail, many details have been set forth to understand more up hill and dale the present invention below of the present invention.But, it is obviously easy to see that for those of ordinary skills, can in the situation that there is no these details, put into practice the present invention.In other cases, well-known feature is not described in detail, and complicates thereby avoided unnecessarily making describing.
Along with the frequency in electronic building brick and system increases, wavelength reduces in the corresponding way.For example, many computer processors operate at present in Gigahertz territory.Along with frequency of operation is increased to Asia-Pacific hertz (sub-terahertz), it is enough short that wavelength becomes, and can serve as antenna and signal radiation can occur thereby exceed short-range holding wire.Fig. 1 is through the curve chart of wavelength contrast frequency of material with various dielectric constants.As shown in curve 102, wherein this curve represents that the material with low-k 3 is as printed circuit board (PCB), and 100GHz signal will have the wavelength of about 1.7mm.Therefore, length only the holding wire of 1.7mm can serve as all-wave antenna and give off the signal energy of significant proportion.
Ripple is propagated along all directions in open space, as spherical wave.In this way, the power of described ripple is with square loss in proportion of distance; ,, at the distance R place apart from described source, power is that source power is divided by R2.In relatively long distance, can carry high-frequency signal with waveguide.Waveguide is limited in ripple along dimension and propagates, therefore under ideal conditions, and ripple loss power not in the time propagating.Electromagnetic wave is described by wave equation along the propagation of the axis of waveguide, described wave equation derives from Maxwell equation (Maxwell's equation), and its medium wavelength depends on the material (air, plastics, vacuum etc.) in structure and the waveguide of waveguide, and depends on wave frequency.Conventional waveguide only has several classes.A modal class waveguide is the waveguide with rectangular cross section, and described rectangular cross section is not square conventionally.The long limit of this cross section is two double-lengths of its minor face normally.These features are useful for the electromagnetic wave of load level polarization or perpendicular polarization.
The minimum wavelength running into for Asia-Pacific hertz radio frequency (RF) signal, dielectric waveguide performance is good, and than hollow metal waveguide, manufactures more cheap.In addition, metal waveguide has the cut-off frequency being determined by the size of waveguide.Lower than cut-off frequency, there is not the propagation of electromagnetic field.Dielectric waveguide (DWG) has wider opereating specification, and without fixing cut-off point.Various types of dielectric waveguides are described in this article and for dielectric waveguide being coupled to integrated circuit or being coupled to the technology of another dielectric waveguide.
DWG cable can provide the effective means that connects two devices by bandwidth interconnections.Can construct fixing or mobile electronic installation with retractible dielectric waveguide cable, described retractible dielectric waveguide cable can be used for being coupled to another device and provide safe high-speed data to connect.As hereinafter described in more detail, rotation male part can make dielectric waveguide cable be easy to extend to be coupled to remote-control device and then retract in the time no longer needing to connect, and described dielectric waveguide cable is arranged in electronic installation with the collocation form on spiral or bobbin.An end of DWG is connected to the communication chip in device, and another end of DWG cable can have socket connector to be coupled to remote-control device.Dielectric waveguide bobbin can be activated by spring-feel mechanism (spring loaded mechanism), and described spring-feel mechanism allows to use minimum pulling force to launch DWG cable.Can provide lock-in feature that DWG cable is locked in to all lengths.The details of the device with retractible DWG cable with rotation male part has been described in more detail about Figure 37-42.All kinds DWG cable and the signaling interface structure that can in described device, use have been described about Fig. 2-36.
Fig. 2 A-2D illustrates the various configurations of the dielectric waveguide that uses printed-board technology generation.Dielectric waveguide can be used as the interconnection of chip on printed circuit board (PCB) (PCB) high data rate communication to chip.The embodiment of this dielectric waveguide can be assembled into extra surface mounting assembly and can resist lead-free solder reflux technique at the assembly process of PCB in production line.
Fig. 2 A illustrates multi-layer PCB 200, and it contains several conductive layers that separated by insulating barrier.As everyone knows, each conductive layer can be patterned into interconnection pattern and pass through through-hole interconnection.Through hole is also brought to the surface of PCB and provides connection pad for integrated circuit (IC) substrate 210.As everyone knows, soldered ball 202 provides being electrically connected between the pin on carrier 210 and the via pad on PCB200.IC240 is installed on substrate 210 and contains the Circuits System that uses known technology to produce high-frequency signal.
IC210 comprises the high-frequency circuit system of the generation signal that is connected to dipole antenna 212.Dielectric waveguide 220 joins dipole antenna and reflector 214 to by interface area 222, and this interface area can be a part for dielectric waveguide.Dielectric waveguide (DWG) 220 is installed in PCB200 above and must be able to withstands the reflux technique for IC210 being attached to PCB.
Dielectric waveguide 220 can be manufactured by Standard PC B manufacturing technology.PCB manufacturer has the ability by for example produce the sheet material with differing dielectric constant as dopant with micro-filler.Dielectric waveguide can be manufactured by following operation: passage and fill described passage with the material of high-k (ε k1) connects up out in the sheet material of low-k (ε k2).Fig. 2 B-2D illustrates three interface options that can be used for engaging DWG220 and microelectronic component substrate 210.Fig. 2 B illustrates the interface area 222 being formed by metal waveguide, and described metal waveguide uses vertical copper wall and top and bottom copper layer (not shown) to make.DWG core component 225 is made up of the material with high-k, and covering 226 is made up of the PCB material that having compared with low-k.Fig. 2 C illustrates similar idea, but having formed loudspeaker 223 helps catch more radiation from the dipole antenna of microelectronic component substrate 210.Fig. 2 D illustrates a kind of scheme that does not use metal waveguide.Only between the dipole antenna 212 of IC carrier substrates 210 and the dielectric matched edges 224 of waveguide 220, form interface.Any one in these three kinds of waveguide design can be manufactured by following operation: in PCB, repeating repeatedly and then pcb board is sawn into can be as the independent waveguide of independent surperficial mounting parts.
Fig. 3 A-3C is the orthographic projection of exemplary dielectric waveguide 300, and this exemplary dielectric waveguide is similar to Fig. 2 B that uses typical PCB manufacturing technology to manufacture.Fig. 3 A-3C illustrates how DWG300 manufactures.In this example, show three DWG300-302 that cut out from single PCB; But this is only used to illustrate, and conventionally can on a PCB, manufactures the DWG of greater number and then described DWG is cut into independent DWG along line of cut 320.It should be noted that, DWG302 comprises two passages; Can be by the passage of the larger quantity of same way manufacture.
Fig. 4 is the flow chart illustrating for the manufacture of the technique of dielectric waveguide.Also referring to Fig. 3 A-3C, PCB initial substrate layer 310 comprises copper layer or other conductive layer 311, and described conductive layer is etched to form the bottom side of metal waveguide part 222 or 223, again referring to Fig. 2 B, Fig. 2 C.In the time of the DWG manufacturing as shown in Figure 2 D, omit copper layer 311.In substrate layer 310, form 402 grooves for each DWG passage.Normally rectangle of described passage, its width is the twice of the degree of depth normally.Based on known waveguide theory, the frequency and the gained wavelength that are intended to carry based on DWG are selected size.Described passage can form by various known technologies, as: machinery wiring or grinding, by using percussion drill bit scraping, by using chemical etchant etching to penetrate mask or medium injection etc.
Again, referring to Fig. 2 B, Fig. 2 C, can form by the technique that is similar to formation through hole for the sidewall 315,316 of metal waveguide part (as part 222 or 223).Be similar to the hole that is formed for through hole, for each sidewall wire laying slot and then with being similar to for groove described in the technique plating of the technique of through hole.The size of metal waveguide part can be similar to the size of electric dielectric core part, or one can be greater than another slightly.The technique that forms channel groove also can be removed the material between sidewall after forming sidewall.
Once formation passage, can apparatus have the pcb board material of higher differing dielectric constant fill 404 described in passage, thereby form core component 318.The dielectric constant values of PCB substrate layer 310 conventionally can be in the scope of about 2.5-4.5.Can promote with micro-filler the dielectric constant values of core component 318 as dopant, make the dielectric constant of core component 318 higher than clad material 310,312 and 314.Use common obtainable material and dopant, the dielectric constant of core component can be selected from a series of values of about 3-12 conventionally.For example, can use various types of materials as dopant, as ZnO or BaTiO3.PCB and filler material can obtain from various sources, as Luo Jie company (Roger Corporation): for example, for the RO3003 of PCB, and for RO3006 or the RO3010 of filler.
Also have through the top layer 314 of etched copper layer 313 can lamination 406 on the top of substrate layer 310, thereby form the top of covering 226.In certain embodiments, the DWG that top layer 314 can omit and cut can be inverted and be arranged on PCB carrier board (as PCB200) above, thereby forms remaining clad section.In other embodiments, top layer can omit and dielectric constant is that approximately 1.0 air will form the top of covering.Omitting in the embodiment of top layer 314, can on plane layer 310, optionally apply conformal coating or other protective layer.Conventionally, when DWG will be not by the mankind or near other when object contact, can omit top layer and carry out cost saving.
Then plane layer 310 is cut open 408 to produce for example independent DWG300-302.Each independent DWG can contain a passage, or it can contain two or more passages, and this depends on how plane layer 310 is cut open.
Then independent DWG can be mounted 410 on carrier PCB and for delivery of the Asia-Pacific hertz signal being produced by integrated circuit (as IC240).
Referring to Fig. 2 A, dipole antenna 212 and reflector 214 provide a kind of signal have been transmitted into the structure dielectric waveguide from microelectronic component again.On another end of dielectric waveguide interconnection, similar structures can be used for signal to collect microelectronic component from waveguide.
Dipole antenna 212 can be used for signal amplitude to be mapped in dielectric waveguide 220 by microelectronic component, and described dielectric waveguide is positioned at the outside but extremely close packaging body of packaging body.According to its character, dipole antenna 212 by towards dielectric waveguide with the very high radiation mode radiation of degree of orientation, but also in the direction contrary with it towards the direction radiation of the core of packaging body.Reflector on the dipole antenna back side can reflect the radiation towards package center radiation along the direction of dielectric waveguide.
To two kinds of different emitting structural designs be described in more detail now.A kind of design is applicable to engage with dielectric waveguide along the direction coplanar with PCB, and the second design is applicable to engage with the dielectric waveguide of the vertical placement of the plane being defined by PCB.
Fig. 5 be together with dipole antenna 512 use reflector array 514 isometric view and Fig. 6 is its cross sectional view, this is the enlarged drawing of the dipole antenna 212 shown in Fig. 2 A and reflector 214.Return to the A referring to Fig. 2, it should be noted that, the position of dipole antenna 212 and reflector 214 is in substrate 210.The outward flange of carrier 212 has formed interface surface 211, and described interface surface is configured to join to DWG220.Reflector structure 214 is formed in carrier substrates, the contiguous dipole antenna 212 and relative with interface surface 211 of described carrier substrates.
Referring to Fig. 5, differential signal line 513 is connected to dipole antenna 512 IC240 that produces or receive Asia-Pacific hertz high-frequency signal again.Ground level (ground plane) 505 makes the signal of launching from dipole antenna 512 be oriented in the direction towards DWG520, but is also oriented in the direction away from DWG520.There is differential signal line and the spaced apart controlled variable of ground level 505 of specifying cross section, thus Formation and characteristics impedance.Characteristic impedance is typically designed to approximately 50 ohm; But other embodiment can use for the optimized different characteristic impedance of application-specific.
Reflector 514 is two plated-through hole arrays between coplanar reflector panel 515,516, and these two coplanar reflector panels are in the above and below of the plane of fixing dipole antenna 512.In certain embodiments, can have one or more extra reflector panels 517, it is coupled to via-hole array and is arranged essentially parallel to dipole antenna and is arranged in the plane identical with dipole antenna.Can be at the extra parallel reflectors plate of the upper interpolation of other layer (if existence).Object is that the metal " wall " that makes perpendicular is erect, and described metallic walls reflects from dipole antenna 512 emittance towards DWG520.Through hole can ground connection, or can keep suspension joint.Described metal structure is served as " short-circuiting device " from dipole antenna to radiation field.Make solid metal reflector structure and dipole antenna interval approximately one half-wavelength that best volume reflection can be provided.Alternatively, reflector structure can be placed on apart from 1.5 times of wavelength of dipole antenna, 2.5 times of wavelength equidistants.Although the distance of a half-wavelength is best, the distance at its 0.3-0.7 doubly or within the scope of many times provides applicable volume reflection.
Fig. 7 is the curve chart that shows the insertion loss of dipole antenna 512 and reflector 514 based on the simulation of this configuration.It should be noted that, be maintained at about quite consistently-2.6db of insertion loss is until about 168GHz.
Fig. 8 A and Fig. 8 B illustrate another embodiment of the DWG820 that is coupled to integrated circuit 240.In this embodiment, DWG820 joins the interface surface 811 on the bottom side of carrier 810 to, and described carrier is configured to engage DWG820 through the hole in PWB800.Reflector structure 818 is formed in carrier substrates, its contiguous dipole antenna 812 and relative with interface surface 811.In this embodiment, reflector structure 818 can be the metallic plate that is placed in dipole antenna 812 tops.Make solid metal reflector structure and dipole antenna interval approximately one half-wavelength that best volume reflection can be provided.Alternately, reflector structure can be placed on apart from 1.5 times of wavelength of dipole antenna, 2.5 times of wavelength equidistants.Although the distance of a half-wavelength is best, the distance at its 0.3-0.7 doubly or within the scope of many times can provide applicable volume reflection.Reflector panel 818 can ground connection, or can keep suspension joint.
Fig. 8 B is the curve chart that the dipole antenna 812 of the simulation based on this configuration and the insertion loss of reflector 814 are shown.It should be noted that, be less than approximately-2db of insertion loss is until about 166GHz.
Can find out, provide a kind of good mode to launch or received the Asia-Pacific hertz signal that produces or receive by integrated circuit with the reflector structure of dipole antenna combination.Two embodiment described herein provide low insertion loss and easy to implement.It is for needing dielectric waveguide application parallel with respect to PCB or vertical orientation that enforcement option is provided.
Fig. 9-10 illustrate the embodiment for DWG directly being joined to IC.Chip-scale package (CSP) is an adhesive integrated circuit chip carrier.In order to make chip-scale qualified, it is a kind of single tube core, the installable packaging body of direct surface that the area of packaging body is no more than 1.2 times of die area and this packaging body conventionally.Conventionally be applicable to guarantee that these packaging bodies are that its sphere gap should be no more than 1mm as another criterion of CSP.Tube core can be arranged on and be formed with on the interpolater of pad or ball above, the same as flip chip ball grid array (BGA) encapsulation, or directly etching or be printed onto on silicon wafer the extremely close encapsulation of size of generation and silicon die of pad.This type of packaging body is called wafer level chip scale package (WL-CSP) or wafer-class encapsulation (WLP).
Use description to now the technology that microelectronic component is directly engaged with the dielectric waveguide of communicating by letter for THz RF.Under the frequency higher than Asia-Pacific hertz, can not carry out Conducted Electromagnetic signal with copper, this is due to due to the impedance that caused by known " skin depth effect (skin depth effect) " extremely increases.As discussed above, electromagnetism RF signal can be carried with dielectric waveguide, and the size of described dielectric waveguide is similar to the DWG for the signal under the hertz frequency of Asia-Pacific as described above.
Referring to Fig. 9, in this example, chip-scale package 940 forms microelectronic component.In CSP device, logic semiconductor and the circuit that can produce or receive Asia-Pacific hertz RF signal are formed in epitaxial loayer (epi-layer) 943.In this example, it is upper that CSP940 is arranged on PCB900, and described PCB can have the extra means being installed on it.In this example, SCP940 is fastened to PCB900 by solder projection 941; But, in other embodiments, can use dissimilar mount scheme at present known or that later research and develop.
Can use silicon perforation (TSV) technology RF signal to be transmitted to the opposite side of chip.Silicon perforation is the vertical electrical connection (perpendicular interconnection access (Vertical InterconnectAccess)) that passes completely through silicon wafer or tube core.TSV is the high performance technology for generation of 3D encapsulation and 3D integrated circuit.The replaceable mode of comparing for example laminate packaging (package-on-package), TSV provides via densities that may be higher in fact, and provide may be shorter connecting length.
In a side relative with epitaxial loayer 943 of chip, pattern metal compound forms antenna 944 with transmitting and/or receives the RF signal from dielectric waveguide 920.In this example, DWG920 is vertically installed to (perpendicular to) chip.Figure 10 illustrates that DWG is flatly installed to the example of (being parallel to) chip.Metallization antenna can form by several mode, for example, by using sputter, thermal evaporation or electron beam evaporation (e-gun evaporation) technology.This metallide can be realized with various metallization process known or research and development later, for example form the titanium layer contacting with Si and serve as tack coat, on the top of titanium, form Ni layer and serve as the barrier layer pollution of Si tube core (thereby avoid), and above this last one deck, form one deck aluminium, copper, gold or there is any other metal of high conductivity.
For example, can use hard mask or use photoetching process by antenna pattern in the dorsal part of silicon die.For example, described antenna can be simple dipole antenna, Marconi antenna (Marconi antenna) or more elaborate paster antenna.In this example, two silicon perforation 945,946 provides antenna or 943 difference RF signal from antenna to epitaxial loayer.
The ground level 942 being embedded in PCB900 is used as ELECTROMAGNETIC REFLECTION device, thereby the signal of antenna possibility edge and the transmission of dielectric waveguide rightabout is reflected towards dielectric waveguide.Underfill 941 can be installed so that DWG920 is attached to SCP940.
This technology has produced the low insertion loss between SCP940 and DWG920, easy to implement, and has used standard manufacture material and process technology.
Figure 10 illustrates an example system, and described system comprises PCB1000, and SCP1040-1 and 1040-2 are installed on described PCB.SCP1040-1 comprises the Circuits System that produces Asia-Pacific hertz or terahertz signal, as mentioned above, uses the silicon perforation of leading to back mounted antenna that described signal is sent to SCP1040-2 via DWG1020.Similarly, SCP1040-2 comprises the Circuits System that receives Asia-Pacific hertz or terahertz signal, as mentioned above, uses the silicon perforation of being coupled to back mounted antenna to transmit described signal via DWG1020.PCB1000 is similar to PCB900 and comprises the ground level for the energy of the dipole antenna radiation by SCP1040-1 is reflected towards DSG1020.In this example, DWG1020 each end on its side has interface surface, and described interface surface is for being bonded on the antenna on the dorsal part of SCP1040-1 and 1040-2, and it allows DWG1020 to install from chip to chip level.
In certain embodiments, short section of DWG can for good and all be attached to the encapsulation IC of CSP or other type, as above about as shown in Fig. 2 A, Fig. 8 A, Fig. 9 or Figure 10, thereby form module.Then DWG section included in module being coupled to another DWG section can become and be necessary.Now use description to engage the various schemes of DWG section.
Figure 11-13 illustrate the simulation for the emittance of various DWG interface configuration.For example, this interface can be for connecting two identical waveguides with development length, or therein one may be in the situation of a part of electronic device for connecting two different waveguide, described electronic device is for example: computer, server, smart phone, flat computer or any other communicator etc.For example, can be coupled to another DWG section as the DWG section of the part of IC module.
In the time that two dielectric waveguides are coupled, between two DWG, may there is gap.This gap produces impedance mismatching, and described impedance mismatching can produce the remarkable loss that the emittance that produces due to impedance mismatching causes.Extent of deterioration depends on the material in geometry and the gap in gap.Based on simulation, angle is cut docking (square cut butt joint) and is seemed to provide significant impedance mismatching.
Figure 11 illustrates the analog result of the inclined cut interface between two DWG sections 1101,1102.Core component illustrates at 1125 places and covering illustrates at 1126 places.In this example, gap 1104 is about 1.2mm.It should be noted that, have a large amount of emittance, as indicated in shadow region 1106.In Figure 14, curve 1401 illustrates the insertion loss contrast gap length of inclined cut interface.
Figure 12 illustrates the analog result of the spearhead shape cutting interface between two DWG sections 1201,1202.Core component illustrates at 1225 places and covering illustrates at 1226 places.In this example, gap 1204 is about 1.2mm.It should be noted that, have the emittance of less amount, as indicated in shadow region 1206.In Figure 14, curve 1402 illustrates the insertion loss contrast gap length of spearhead shape interface.
If complete taper/convergent (taper) in only two sides of DWG, this spearhead shape is effectively so, thereby but better in the time completing taper formation pyramid in four sides at DWG.This taper also can be used in conical on four sides or the arch on two sides or cut by opposite side any other shape that deflection makes energy get back to DWG from signal deflection alternative.
The shape of spearhead shape, pyramid, taper shape, arch or similar type provides the interface with utmost point low insertion loss, easy to implement, mechanical autoregistration, and be also sane flexibly for small misalignment.These shapes can be used standard manufacture material and process technology to produce.
Be called as " high frequency simulator structure (High Frequency Simulator Structure; HFSS) simulator (can obtain from ANSYS company) " is used to analyze various shapes as discussed above.HFSS is a kind of high-performance all-wave electromagnetism (EM) field stimulation device for the three-dimensional passive device modeling of any 3D.Its uses Finite Element Method (FEM) and integral Equation Methods to integrate simulation, visual, solid modelling and automation.HFSS can extract collision matrix parameter (S, Y, Z parameter), visual 3-D electromagnetic field (near field and far field), and produce the all-wave SPICE model that is linked to breadboardin.
material in gap
In example as discussed above, the material of filling gap is only air, and its dielectric constant is approximately 1.0.As discussed previously, the dielectric constant of core material is conventionally by the scope of 3-12, and the dielectric constant of clad material is conventionally by the scope of 2.5-4.5.The difference of the dielectric constant between the material in mismatch impedance and DWG and gap is proportional.Even if this means that, in the optimized situation of geometry of socket, the air gap between DWG is not still best configuration.In order to minimize impedance mismatching, can design DWG socket by rubber-like material, the dielectric constant of the dielectric constant of described rubber-like material and DWG core and covering is extremely close.The institute that needs flexible material to hold and to fill in gap has living space.Dielectric constant is that the example of 2.5 to 3.5 rubber-like material is silicone.Operable other material with similar characteristics belongs to following two types: unsaturated rubber and saturated rubber.
unsaturated rubberfor example comprise: synthetic polyisoprenes, polybutadiene, chloroprene rubber, butyl rubber, halogenated butyl rubber, styrene butadiene rubbers, acrylonitrile-butadiene rubber, hydrogenated nitrile-butadiene rubber etc.
saturated rubberfor example comprise: EPM(ethylene propylene rubber), EPDM rubber (propylene diene rubber), epichlorohydrin rubber (ECO), polyacrylic acid rubber (ACM, ABR), silicone rubber (SI, Q, VMQ), flurosilicone rubber (FVMQ), fluoroelastomer (FKM and FEPM) dimension logical (Viton), Te Nuofulong (Tecnoflon), Fu Luorui (Fluorel), Perfluoroelastomer (FFKM) Te Nuofulong PFR, Ka Lerui (Kalrez), Ke Lazi (Chemraz), pendant Lars tower (Perlast), polyether block amide (PEBA), chlorosulfonated polyethylene (CSM), (Hypalon (Hypalon)), ethane-acetic acid ethyenyl ester (EVA) etc.
Figure 13 illustrates the analog result of the spearhead shape cutting interface between two DWG sections 1301,1302.Core component illustrates at 1325 places and covering illustrates at 1326 places.In this example, gap 1304 is about 1.2mm and fills with silicon materials.It should be noted that, the amount of emittance can be ignored.
Figure 14 is the curve chart that the insertion loss contrast gap length of various interface configuration is shown.Curve 1403 illustrates the insertion loss contrast gap length of the spearhead shape cutting interface with the agent of silicon rubber gap-fill.Curve 1401 illustrates the insertion loss contrast gap length of inclined cut interface.Curve 1402 illustrates the insertion loss contrast gap length of spearhead shape cutting interface.
Can find out, use have the optimal design of spearhead geometry and with silicone material fill gap for having produced the decay below 1dB to the gap of 1.5mm greatly, as shown in curve 1403.
Along with gap becomes narrower, approach 0.0mm, the insertion loss of arbitrary configuration is reduced to and is about zero; But in the time using economic non-accurate DWG, 0.0 gap is difficult to maintain conventionally.
Although the simulation shown in Figure 13 has been used the silicon gap-fill agent of the even dielectric constant with 2.5-3.5, but in another embodiment, can produce a kind of deformable gap-fill agent, described deformable gap-fill agent has high dielectric constant to mate better the dielectric constant of core material in center, has the covering with coupling DWG compared with low-k simultaneously in outside area.
Figure 15 illustrates two DWG1501,1502 that are coupled with the hasp connector with silicon gap-fill agent material 1512.A sheet part 1510 of hasp connector is arranged on the end of DWG1510.Another sheet part 1511 of hasp connector is arranged on the end of DWG1511.Control the installation site of hasp connector sheet part, make in the time coordinating, deformable gap-fill agent material 1512 is compressed to eliminate most of (if not all) air the gap between DWG1501 and DWG1502.
Although figure 15 illustrates the customized configuration of connector, but other embodiment can use the connector of the current known of any number or design later to design so that two DWG are coupled, and maintains mechanical registeration simultaneously and the bonding force that is enough to maintain the rock deformation pressure on gap-fill agent material is provided.
For example, deformable material conventionally can adhere to the male end of DWG1501 or adhere to the female end of DWG1502.Deformable material can use glue, heat fusing or other bonding techniques to adhere in permanent mode.But, thinner one deck deformable material can be adhered to the end of DWG1501 and the end of DWG1502, so that gap is filled by two-layer deformable material.
Return to the A referring to Fig. 8, for example, the DWG with right-angled corner can be used for being connected to the bottom side of IC module.Another purposes can be to be connected to vertical mode and to be inserted into the PWB backboard from backboard.Can find out, the DWG with right-angled corner has many purposes.Problem is that the electromagnetic signal of advancing in dielectric waveguide can suffer significant loss in the time passing through sharp corner.This is an extremely serious problem, because dielectric waveguide application needs dielectric waveguide can be in 90 degree corners bending and do like this may be in short-radius in the situation that conventionally.
Figure 16 A and Figure 16 B illustrate the simulation from the emittance of the right-angled corner of DWG1601.This simulation example is illustrated in the loss of signal that cross section is the dielectric waveguide mean curvature radius of 1 × 2mm, the 90 degree corners that are 2mm.As 1610 of Figure 16 A and Figure 16 B 1612 indicated, there is at the outer radius place of DWG the large energy radiating from DWG.
Figure 17 is right-angled corner conductively-closed 1702 to minimize the diagram of DWG1701 of radiation leakage.Thereby DWG1701 carries out metal deposition to reduce/eliminate if there is no through the reflector of plating the example of the electromagnetic dielectric waveguide of effusion dielectric waveguide in the outer radius wall of sharp corner.In general, dielectric waveguide 1701 can be used plastics manufacture, as polypropylene, polyethylene, PMMA(poly-(methyl methacrylate), is commonly called Plexiglass (Plexiglass)) etc.PMMA can have high dielectric constant value, especially in the time processing with ceramic filler for example, and can be used to form the core component of DWG.Polypropylene and polyethylene have lower dielectric constant and can be for being coated on DWG.Metal deposition 1702 can complete with various metal ingredients, as copper, aluminium, gold, silver etc.
Metal screen 1702 can be applied to the outside of the covering in corner outer radius.In another embodiment, metal screen can be placed between the covering in the corner outer radius of core component and core component.Metal screen can form by the whole bag of tricks, as: selective plating technique, by adhesiving metal adhesive tape, use glue or the preformed metal parts of other bonding techniques etc. by adhesion.
For example, surface 1704 can indication circuit plate and surface 1706 can represent to be coupled to another circuit board of circuit board 1704.Circuit board 1704 can have various integrated circuits and other assembly mounted thereto.For example, being similar to 210,240 the IC packaging body of Fig. 2 A can be mounted thereto and be coupled to DWG1701.In another configuration, electronic device can be arranged on circuit board 1706 and be coupled to DWG1701 as 900,940.Similarly, circuit board 1706 can have mounted thereto and be coupled to the electronic device of DWG1701.For example, in another configuration, circuit board 1706 can be the backboard of signal being transferred to another circuit board from DWG1701.
In another example, the right angle DWG820 of Fig. 8 A can be configured to have corner reflector as described herein.Therefore, many combinations of circuit board, substrate and electronic device can be configured to utilize right angle DWG, as DWG1701.
Figure 18 A-18B illustrates the simulation from the emittance of the right-angled corner of the conductively-closed of DWG.This simulation example is illustrated in the loss of signal that cross section is the dielectric waveguide mean curvature radius of 1 × 2mm, the 90 degree corners that are 2.5mm.It should be noted that, the shortage of the emittance in the outer radius of corner is to shield due to 1702 owing to existing.
Figure 19 is the curve chart that is illustrated in the insertion loss contrast frequency of the DWG between the end of simulated system with quarter bend tune.Curve 1902 is illustrated in the insertion loss in the outer radius of corner with the DWG section of reflector, and curve 1904 illustrates the insertion loss of the DWG section without reflector.
Plating also can extend on the side of dielectric waveguide, if but all four sides are all plated, so just produce the metal waveguide with the cut-off frequency being determined by the size of dielectric waveguide.Lower than cut-off frequency in the situation that, there is not the propagation of electromagnetic field.
Although illustrate in this example and form the bending corner of approximately 90 degree, identical principle goes for being greater than or less than the bending of 90 degree.For example, in some cases, the bending of 180 degree may be needed, and in other cases, the only bending of 45 degree may be needed.
In this way, can use standard DWG material and known process technology manufacture that the DWG with sharp turn song of low insertion loss is provided.
Figure 20 is the diagram of exemplary flexible DWG2000.As discussed above, for the point-to-point communication that uses modulated RF (RF) technology, dielectric waveguide provides the low-loss method for energy is directed to receiver (RX) from reflector (TX).For waveguide itself, many configurations are possible.For example, about Fig. 2 A, solid DWG has been described above.Solid DWG is generally applicable to short interconnection or the long interconnection in fixed system.But its rigidity can limit the purposes in its situation that may need relative to each other to move at interconnecting assembly.Flexible waveguide configuration can have core component, and this core component is made up of the flexible electrical dielectric material of high-k (ε k1) and by the encompasses of being made up of the flexible dielectric material of low-k (ε k2).Although can use in theory air to replace covering, because air has approximately 1.0 dielectric constant, any contact of the mankind or other object all can be introduced the serious impedance mismatching effect that may cause loss of signal or error.Therefore, free air does not provide suitable covering conventionally.
Figure 20 illustrates flexible DWG2000, the core material fine strip shape thing that it is configured to be surrounded by clad material.In this example, the thin rectangular bar of core material 2010 is surrounded by clad material 2012.For Asia-Pacific hertz signal, as in 130-150 gigahertz range, the kernel size of about 0.5mm × 1.0mm is respond well.For example, can use known extrusion technique to manufacture DWG2000.
Figure 21 A-21D illustrates the various configurations of multichannel flexible DWG.There are the inadequate many situations of single DWG passage.For example, two-way communication may need two DWG passages.Simple binary channels DWG2100 is configured in shown in Figure 21 A.In this example, the covering 2108 that two core components 2101,2102 that have a higher ε k1 value are had lower ε k2 value surrounds.This stripe shape cable shape configuration can easily expand to provide the multichannel of any number.
But this type of configuration is always not desirable.Along with the number of DWG " passage " increases, the width of bar tends to increase, and this may be undesirable concerning some application.In addition, the spread pattern configuration that the waveguide itself in stripe shape configuration may be invaded with crosstalking between adjacent waveguide passage, because all waveguides are substantially in same plane.In order to alleviate potential cross-interference issue, can increase channel spacing maybe may need to add shielding.
Solve the another way of crosstalking by describing now.This solution is how in cable group component, to build the geometry solution that the problem of multiple waveguides is provided convenience.Although execution mode shown here is intended to for flexible cable application, these how much solutions also can be used in rigid waveguide sub-assembly.
Figure 21 B illustrates a kind of stripe shape cable 2110, wherein multiple channel arrangements must be positioned as close to reduce the physical size of cable, thereby reduces manufacturing cost and increase interconnection density.In this example, adjacent DWG core component (as 2111,2112) arranges with the alternately horizontal and vertical pattern form of the high ε k1 bar that surrounded by clad material 2118.Although at four passages this illustrate, can be in same bar implement two, more than three or four passage by multichannel is settled perpendicular to each other as shown in Figure 21 B.This " polarization " bar configuration provides the maximum isolation between adjacency channel and has not needed to increase channel spacing or between passage, add any shielding.
Figure 21 C illustrates stacking multichannel DWG cable 2120.In this example, two row core components are stacked (as illustrated at 2121-2123 place) and are surrounded by covering 2128.All core components settle perpendicular to each other so that crosstalk minimization.In this example, covering has the cross sectional shape of essentially rectangular.
Figure 21 D illustrates multichannel DWG cable 2130, and wherein covering 2138 has the cross sectional shape of circular.In this case, use round cable group component and high ε k1 material bar completely by low ε k1 material encompasses.It should be noted that, multiple core component bars (as 2131) are perpendicular to one another to settle to reduce and crosstalk.
In above-mentioned example, waveguide itself is perpendicular to one another and configures and so that the form arrangement of the margin maximization between high ε k1 " passage ".This configuration makes the crosstalk minimization between passage, and this is because the RF energy in each waveguide is polarized.The RF energy of 90 degree polarization does not disturb another passage.Therefore, make to be each other 90 degree arrange by rotating channel, the interval having between the passage of identical polar is maximized.Have the passage of contrary polarization mode can interval obtain tightr because its interference is minimized.
Figure 21 D also illustrates the flat zone 2139 that can serve as key (key).In arbitrary above-mentioned execution mode, cable can be by " keying " to provide positive alignment.For example, the in the situation that of rectangular bar, can be by making corner flatten to add key.Can use other common key control technology, as zigzag cable, add rib etc. in extramural cladding.
Although multiple electric dielectric core are shown as having roughly the same size, in certain embodiments, the size of one or more cores can there are differences, to optimize the efficiency of transmission of the RF signal with remarkable different wave length.Along with frequency increases, wavelength reduces and the physical size of electric dielectric core also can be reduced the signal for higher frequency.
Above-mentioned flexible cable can use standard manufacture material and process technology manufacture.The geometry of these cables can be used stretching, extruding or smelting process construction, and these are all quotidian things for manufacturing plastics.
But, exist the interface of independent flexible DWG between two assemblies and inadequate many situations.For example, DWG essence is a kind of insulator.Although it is direct high-frequency RF signal effectively, it is impossible transmitting considerable power level.May expect in many cases to provide the combination with the HF communication path by one or more flexible DWG burdens of DC or low frequency conventional conductive line solution.
In another example, may be desirably in the cabling system of existing type and comprise DWG.For example, USB is common interconnection, and it uses and at a high speed conducts electricity cabling with 12MBps(USB1.1), 480Mbps(USB2.0) and speed 5.0Gbps(USB3.0) provide data and in addition from host apparatus to the periphery device power is provided.In USB, comprising DWG will make same cable can be used in MBps(megabit per second) and for Asia-Pacific hertz data communication.Another example is by PC(laptop computer, palmtop computer, flat computer, phone etc.) be connected to the common power line of power supply.This can be AC line (in the situation that of PC) or DC power supply.For example, comprising DWG with power cable can allow the network comprising with the electric power system that power cable is supplied electric power and provided high-speed data to transfer to building to connect.
The aspect that these examples all have is jointly that existing cable or other required cable are always covered to completely cut off and shielded interior metal conductor by dielectric substance.The cable system of combination can utilize the part of outer insulator as the clad material of DWG.By selecting suitable low ε k2 material, this insulator will provide the required shielding of inner cabling and in high-k core material, limit the required suitable dielectric constant of RF energy.
Figure 22-25 illustrate the variety of way of flexible DWG and flexible metal cable combination.Figure 22 illustrates the telecommunication cable 2200 with the one or more conductor wires 2202 that surrounded by dielectric sheath 2204.Sheath component has low dielectric constant values, for example, within the scope of 2.5-4.5.Electricity dielectric core member 2206 is close to and the outer surface that contacts sheath component 2204 is longitudinally placed.Core component has the high dielectric constant value higher than the first dielectric constant values, for example, within the scope of 3-12.In this example, electric dielectric core member can have the square-section of the about 0.5mm × 1.0mm that is applicable to Asia-Pacific Hertz wave (for example approximate 80-200GHz).
Covering 2208 surrounds sheath component 2204 and electric dielectric core member 2206.(ε k) is worth lower than core dielectric constant values the dielectric constant of this covering, and can be similar to the value of sheath dielectric constant.In this way, dielectric waveguide forms by electric dielectric core member.Can have the region showing at 2210 places that comprises air, or this region can be filled by the distortion of covering or by other filler material with low-k.
Figure 23 illustrates the telecommunication cable 2300 with the one or more conductor wires 2302 that surrounded by dielectric sheath 2304.In this example, the individual layer insulator on metallic cable is substituted by three layers " interlayers " of outside.For example, sheath member has low ε k2 value, for example, within the scope of 2.5-4.5.Electricity dielectric core member 2306 is close to and the outer surface that contacts sheath member 2304 is longitudinally placed.Core component has the higher ε k1 value higher than the first dielectric constant values, for example, within the scope of 3-12.In this example, electric dielectric core member 2306 surrounds dielectric sheath 2304 completely.The thickness that about 0.5mm is thick is applicable to Asia-Pacific Hertz wave, for example about 80-200GHz.The 3rd layer of covering 2308 is surrounded sheath member 2204 and electric dielectric core member 2306.Covering has the lower ε k3 value lower than core dielectric constant values, and can be similar to the value of sheath dielectric constant.In this way, dielectric waveguide forms by electric dielectric core member.This technology can expand to comprise the extra alternating layer of ε k2 and ε k1 material, thereby extra waveguide is provided.
Figure 24 illustrates another kind of flexible telecommunication cable 2400.In this example, many dielectric waveguides can be embedded in the insulator that surrounds conductor cable 2402.The multiple electric dielectric core member 2406 with higher ε k1 value is close to and contacts the outer surface placement of the sheath component 2404 with low ε k2 value.Multiple electric dielectric core members are spaced apart from each other and each has approximate rectangular cross sectional shape.The filler 2407 with lower ε k3 value can be placed between core component.The extramural cladding 2408 then with low ε k4 value is placed on around multiple core components.ε k2, ε k3 and ε k4 can have the similar value within the scope of 2.5-4.5 for example.In this way, can form multiple dielectric waveguides.
Figure 25 illustrates keying cable 2500.In arbitrary above-mentioned solution, cable can be by " keying " to provide positive alignment.In this example, a side of cable has flat profile 2520.Can use other common key control technology, as zigzag cable, add rib etc. in extramural cladding.
For example, conductor cable is as 2202,2302 and 2402 can being metal wire, or it can be the cable of the another kind of type for conducting data or energy, as: one or more fiber optic cables, one or more twisted-pair feeder (as for CAT5 wiring), coaxial cable etc.
Flexible DWG in above-mentioned cable can use standard manufacture material and process technology manufacture.The geometry of these cables can be used stretching, extruding or smelting process construction, and these are all quotidian things for manufacturing plastics.
Figure 26 illustrates microelectronic package 2610, and wherein dipole antenna 2612 is coupled to the DWG2620 with induction element 2622 to improve the coupling of the radiation signal of being launched by dipole antenna 2612.Electromagnetism RF ripple (modulated RF carrier signal) is produced by the electronic circuit system comprising in the IC2640 being arranged on substrate 2610.RF signal coupling to the waveguide 2620 of substrate 2610 mechanical registerations in.For example, substrate 2610 and DWG section 2620 can all be arranged on PCB2600 above to be aimed at fixing.
As mentioned above, dipole antenna is the good medium for emittance being transmitted into dielectric waveguide.As described in more detail about Fig. 2 A, Fig. 5, Fig. 6 and Fig. 8 A, reflector element can be used for energy indefinite direction to reflect towards DWG2620.
Be coupled in DWG2620 in order further to improve emittance, can in DWG2620, comprise one or more induction elements.Dipole has the ring radiation figure with respect to the axis symmetry of dipole.In order to improve directivity and therefore to reduce insertion loss, can add reflector and induction element.For example, dipole and reflector may reside on same substrate 2610 as the Circuits System 2640 generating electromagnetic waves, as described in more detail in Fig. 2 A, Fig. 5, Fig. 6 and Fig. 8 A.For example, dipole and feed line can be implemented in the metal level of MULTILAYER SUBSTRATE.
Reflector may be embodied as the staggered via-hole array in substrate, for example, describe in more detail with reference to figure 5,6.Alternatively, reflector may be embodied as the metal ribbon that is for example parallel to dipole antenna orientation.Reflector ribbon can ground connection or its can electric suspension joint.Reflector ribbon can be implemented conventionally on the same metal level of implementing dipole antenna.Make solid metal reflector structure and dipole antenna interval approximately one half-wavelength that best volume reflection can be provided.Alternatively, reflector structure can be placed on apart from 1.5 times of wavelength of dipole antenna, 2.5 times of wavelength equidistants.Although the distance of a half-wavelength is best, the distance at its 0.3-0.7 doubly or within the scope of many times provides applicable volume reflection.Because skin effect is occupied an leading position under the hertz frequency of Asia-Pacific, so the thickness of metal reflector element is not crucial.
For example, induction element is similar in operation to yagi-uda array (Yagi-Uda array), and described yagi-uda array is generally used for the beam antenna of communication radio frequency band and amateur frequency band.Yagi-uda along the axis of the dipole perpendicular in element plane from reflector towards being subject to driving element and guiding piece orientation.Depend on particular design, the typical interval between element can change at approximately 1/10 wavelength in the scope of 1/4 wavelength.According to known Antenna Design principle, the length of guiding piece is less than the length that is subject to driving element conventionally, is subject to the length of driving element to be less than the length of reflector.These elements are conventionally parallel in a plane.
The bandwidth of yagi-uda is to instigate its directive gain and impedance matching to maintain the frequency range in specified standard.The yagi-uda array that presents with its citation form is arrowband extremely, and its performance is only just reducing under the frequency of several percentages higher or lower than its design frequency.But except other technology, by using larger-diameter conductor, bandwidth can be extended in fact.
Because guiding piece is passive component, thus they can be embedded in dielectric waveguide originally with it.Selected directivity and the bandwidth to optimize structure for the specified wavelength (being called as RF carrier frequency) of the electromagnetic signal of launching or receiving in the length of element 2622 and interval.For example, the appropriate intervals between dipole and guiding piece maintains by the mechanical registeration being provided by PCB2600.
The interval of induction element and length depend on wavelength and the total amount of induction element used.In general, along with using more element, gain and directivity increase but Bandwidth Reduction.This design is conventionally used known antenna designing technique from textbook or guide from approximate number.For example, " antenna theory analysis and design (Antenna Theory Analysis and Design) ", 1997, the 513 pages the-the 532nd page is incorporated herein by reference.
Use the numerical modeling of known analog instrument can be used for Optimal performance until meet the requirement of application-specific.Guiding piece with 0.2-0.3 times of wavelength interval goes on well conventionally.The length of each induction element goes on well in 0.5-0.3 times of wave-length coverage.Guide arrays 2612 can comprise 12 or element still less conventionally.
Table 1 has been enumerated for the element spacing of the exemplary array of guiding piece 2622 and number.Due to high carrier frequency (>100GHz), therefore specified component size is quite little in table 1.Such as, but those sizes are also can utilize more high-order resonance (λ, (3/2) λ etc.) to design based on first order resonant (close to λ/2) and antenna, this allows looser manufacturing tolerance.
Length and the interval of table 1-example guidance element
(source: " Antenna Theory Analysis and Design ", 1997. tables 10.6)
For example, induction element 2612 can be molded by metallic compound, or through the plastic components of plating.This group induction element can be by for supporting the end that is connected and then embeds DWG section 2620 with the center sill at interval.Conventionally embed in the end of DWG being less than 12 induction elements.Because skin effect is occupied an leading position under the hertz frequency of Asia-Pacific, so the metal thickness in induction element is not crucial.
In this way, emitting structural is divided into active " feed " section 2612,2614 being present on chip packing-body and is present in passive " resonance " section 2622 in waveguide 2620.The size of emitting structural is reduced, and this is because a part for described emitting structural is embedded in dielectric waveguide itself.
Figure 27 A-27C is the multiple views for Asia-Pacific hertz signal is transmitted into the structure of DWG2720 from strip line 2750.As discussed above, it is slightly complicated that Asia-Pacific hertz electromagnetic signal is transmitted into dielectric waveguide from microelectronic component.On another end of dielectric waveguide, the signal demand of being carried by DWG captures in microelectronic component from waveguide.For example, above described and signal has been radiated to dielectric waveguide from microelectronic component with antenna with reference to figure 2A, Fig. 5, Fig. 6 and Fig. 8 A-10.But, because the signal portion of electromagnetic signal can be along being different from the direction radiation of DWG position and therefore losing in free space, so antenna needs directionality splendid and even for optimal design.Another option now will be described; In this example, electromagnetic signal is restricted to from silicon to DWG in its whole length.
Figure 27 A is mounted in the isometric view of a part for the microelectronic component on substrate 2710.Be arranged on IC(on substrate 2710 not shown) in reflector or receiver be connected to microstrip line 2750.Coupling mechanism allows microstrip line to be transitioned in metal waveguide 2756, thereby the IC of microelectronic component and dielectric waveguide 2720 are coupled.
Microstrip line 2750 from silicon has the impedance of mating with the silicon die of IC.Normally 50 ohm of this impedances.As everyone knows, the impedance of microstrip line 2750 is determined by the distance between its shape of cross section and it and ground level 2752.The distance that ground level 2752 extends between the length of microstrip line 2750 following and microstrip line 2750 and ground level 2752 is controlled as evenly.
How Figure 27 B illustrates in greater detail metal waveguide 2758 for be transitioned into the end view of DWG from microstrip line.Ground level 2752 is connected to the top side of metal waveguide 2756, as is presented at 2753 places; And microstrip trace 2750 is connected to the bottom side of metal waveguide, as be presented at 2751 places.As mentioned above, dielectric waveguide 2720 has core component, and this core component is made up of the dielectric substance with high-k (ε k1) and by the encompasses of being made up of the dielectric substance with low-k (ε k2).As mentioned above, the section of DWG2720 can be flexibility or rigidity material.Core component 2725 can be made up of various types of dielectric substances, as above described in more detail.Polymer plastic is the typical material for core component 2725.The extension 2727 of electricity dielectric core member 2725 extends in metal waveguide 2756.
For example, metal waveguide 2756 is using solder reflow process to carry out assembly process and be conventionally installed to package substrate 2710.Polymer plastic DWG is not able to take the temperature of reflux technique conventionally, therefore the extension 2727 of DWG2720 will be inserted in metal waveguide 2756 after reflux technique.
It should be noted that the thickness of extension 2726 of core component is if linear mode is how increasing to the transition region of point 2751 from putting 2753.In this region, thereby the width of microstrip line is formed the taper microstrip line section 2754 being shown in further detail in Figure 27 C by taper.For the impedance that makes microstrip line is mated with the impedance phase of metal waveguide 2756, the linear width that increases microstrip trace is favourable.Simulation has determined that best taper is the taper from be transitioned into the width of the metal waveguide of another end 2751 of transition region corresponding to the width of 50 ohm line 2750.
Can use for example solder reflow process, by for example solder projection (not shown), substrate 2710 is installed to larger substrate as on PCB2700.Then can use mount scheme dielectric waveguide 2720 to be installed on PCB substrate 2700 as binding agent, mechanical holder etc.The extension 2727 of electricity dielectric core member 2725 extends in metal waveguide 2756 and fills the interior zone of metal waveguide.In this way, between microstrip line and DWG, produced extremely effectively forwarding function.
Figure 28 illustrates the analog result of all lengths metal waveguide transition piece.These S parameter curves are to obtain from the HFSS simulation of coupler design above.In this example, this suite line is corresponding to the metal waveguide of different length.S parameter refers to collision matrix (" S " in S parameter refers to scattering).S parametric description the response of the voltage signal of N port network to each port.Collision matrix is to quantize RF energy how to propagate the Mathematics structural through multiport network.It is simple "black box" by the property description of complex network that s-matrix is used for.For inciding a RF signal on port, a part of signal that port that rebounds out, some of them scattering is also left other port (and even may be exaggerated), and some of them disappear, and become heat or even electromagnetic radiation.First digit in footnote refers to echo port, and second digit refers to incident port.Therefore S21 means the response at port 2 places due to the signal at port one place.Three groups of Parametric Representations drawing in Figure 28 are the metal waveguide of 0.8mm, 0.85mm, 1.0mm and 1.2mm and S11, S12 and S22 parameter for the frequency from 100GHz to 180GHz for length.
Figure 29 is the isogram for signal is transmitted into the horn antenna of DWG from microstrip line.As discussed above, from microelectronic component to dielectric waveguide, (DWG) transmits and receives the coupling scheme that Asia-Pacific hertz electromagnetic signal needs good design.Although described some technology above, using antenna transmission signal is that so most of electromagnetic signal can be due to the loss along being different from the residing direction radiation of dielectric waveguide if design improperly to the problem in dielectric waveguide.
Now the Coupling device that builds the horn antenna engaging with dielectric waveguide in the substrate of microelectronic package with multiple copper layers will be described in.This equipment can be launched the splendid wave beam of the directionality of aiming at dielectric waveguide and provide thus effective energy to shift.This interface can be used for electromagnetic signal to be transmitted into dielectric waveguide from the silicon being arranged on same package substrate.The electromagnetic signal being sent by reflector can be read with the interface of same type in another end at dielectric waveguide.
Still referring to Figure 29 and Figure 30 A-30B, package substrate 2910 is to have the normally copper of multiple conductive layer 2911(being separated by multiple insulating barriers such as printed circuit board material, ceramic material etc.) MULTILAYER SUBSTRATE.As everyone knows, thus the conductive layer in MULTILAYER SUBSTRATE can be patterned and forms various conductive shapes and interconnection line pattern between the processing period of MULTILAYER SUBSTRATE.
Horn antenna 2960 has roughly trapezoidal or tubaeform top board 2961 and the base plate 2962 in the different layers of MULTILAYER SUBSTRATE of being formed on 2910, and wherein the through hole 2962 of one group of close interval forms two sidewalls of horn antenna by the neighboring edge of coupling top board and base plate.Horn antenna has narrow input 2972 and wider flared end 2970.A part 2973 for input can be configured to rectangular metal waveguide.Metal waveguide 2973 provides the interface between microstrip line 2950 and horn antenna 2960.In other embodiments, horn antenna can use dissimilar feeding mechanism to join microstrip line to.But rectangular metal waveguide is easily and is easy to implement in MULTILAYER SUBSTRATE.
At the input end of waveguide, microstrip line 2950 is coupled to top board and ground plane elements 2952 is coupled to base plate.Microstrip line 2950 is placed in ground plane elements 2952 tops and has and is designed to produce roughly the geometric cross section of transmission line impedance (normally approximately 50 ohm) uniformly.Certainly, the amount of space between this cross sectional shape and microstrip line and ground plane elements can change, and mates specific reflector amplifier or receiver low noise amplifier thereby produce different impedances.
In order to form horn antenna and rectangular waveguide, the close-packed array of staggered through hole 2962 forms the vertical sidewall of horn antenna and waveguide.In addition, can be in MULTILAYER SUBSTRATE in copper layer, form one group of thin silk thread 2963 in the middle of each between top layer and bottom, and described thin silk thread is for connecting the through hole at each copper level place, thereby improves the reflection characteristic of through-hole wall.The number of filament is determined by the number of the conductive layer in MULTILAYER SUBSTRATE 2910.In this example, there are five layers to can be used for thin silk thread 2963.Other embodiment can have still less or more layer.From the viewpoint of performance, in order to approach as much as possible solid walls in the situation that substrate manufacture rule allows, more filament is preferred.But described number depends on the availability of various substrate layer thickness.Target normally makes cost minimization, and therefore layer (desired properties and function are only enough provided) still less may be design object.For example, the staggered through hole that the width of every filament may only enough interconnect in specified side is capable, or described filament can be capable with staggered through hole equally wide.In another embodiment, one or more thin silk threads can be parts that extends beyond the larger ground level of horn antenna and waveguide, but thin silk thread should not be inserted in the interior section of horn antenna and waveguide.
Microstrip line 2950 can have conical section 2951, and its width is along with it approaches horn antenna and increases.Conical section 2951 provides impedance matching so that the impedance of microstrip line is mated with the impedance phase of the integrated rectangular waveguide of substrate to the integrated sectoral horn (antenna) feed of substrate.This taper provides the impedance matching in broadband.
Microstrip line can be with loudspeaker top on same conductive layer, so shown in example; But this not necessarily.It can be on internal layer, and then described internal layer is connected to loudspeaker top by through hole, and wherein microstrip line enlarging is connected to rectangular waveguide.In the time that microstrip line is on internal layer, it should be through the inner side of rectangular waveguide and loudspeaker, and this is because that will change the ripple propagation property of whole rectangular waveguide/horn antenna structure.Be intended that the microstrip line medium transition smoothly of propagating from ripple, then enter in the rectangular waveguide medium of ripple propagation, and the most described field gives off horn antenna.
Earth strip linear element is coupled to base plate 2962, thereby the ripple propagation discontinuity between microstrip line and rectangular waveguide/horn antenna structure is minimized.
Horn antenna lateral dimension (flaring angle, horn length, enlarging width) is selected so that the end-fire radiation that has extremely low back lobe and have optimum gain to be provided.In free space, loudspeaker are longer, gain higher; But in lossy substrate, long trumpet suffers the hardship of high substrate.Therefore, for loss is minimized, select horn length and accurate dimension based on frequency of operation with for processing the material of MULTILAYER SUBSTRATE, thereby realize higher gain and without minimum loss.The internal material of loudspeaker can be PCB/PWB substrate or IC package substrate material conventionally.An initial packet size can be based on known the antenna analysis choice of technology.Then simulation as above can be for carrying out refinement size for for example special operating frequency and backing material.
Horn antenna height is selected to support the required rectangular waveguide cut-off frequency of main mould (dominant mode), and described main mould is TE10 in this case.The height of loudspeaker is also subject to the restriction of the thickness of MULTILAYER SUBSTRATE 2910.But in this example, the distance between top and bottom is subject to the restriction of the distance between top Cu layer and bottom Cu layer.The size of waveguide determines cut-off frequency, and therefore, design constraint is that the distance between top board and base plate provides the cut-off frequency higher than expection frequency of operation.
Can use for example solder reflow process, by for example solder projection (not shown), substrate 2910 is installed to larger substrate as on PCB2900.Then can use mount scheme dielectric waveguide 2720 to be installed on PCB substrate 2700 as binding agent, mechanical holder etc.In this way, between microstrip line and DWG, produce highly effectively forwarding function.
Figure 31 illustrates the simulation from the signal radiation of the horn antenna of Figure 29.This electromagnetical analogies uses Ansys HFSS simulator to carry out.As found out in the drawings, the signal of launching from microstrip line 2950 is launched into core component 2925 or DWG2920, and wherein radiation loss is few.Be extremely narrow from horn antenna 2960 wave beam out, it has and is easy to focus on the high directivity in DWG core.
Figure 32 illustrates that RJ45 connector 3280 is for being coupled to DWG3220 the purposes of compatible socket.For engaging the description of variety of way of DWG section, generally need end that the mechanical couplings of some classifications maintains two DWG sections in suitable aligning based on above.Connection should be easy to set up, and is reliably and is pluggable.Connector must meet the mechanical registeration tolerance of waveguide.An exemplary mechanical connector is shown in Figure 15.Another option now will be described.
RJ45 connector is widely used in Ethernet application.With its well-known form, its can have maximum four lines to (8 lines altogether) for electric transfer of data.Exemplary RJ45 connector 3280 is incorporated into one or more waveguides in standardization RJ45 connector body.
In order to maintain and the identical Zhi Zhe of standard RJ45 connector district (footprint), some or all of electric contacts is removed to provide space for dielectric waveguide.Because dielectric waveguide is isolated inherently, so can retain several electric contacts 3284 in order to for example for outer peripheral provides electric power.Electric contact can be coupled to the electric wire being included in DWG3220, for example, above describe in more detail about Figure 22-24.Similarly, the one or more DWG cores shown in the cable 2110 of Figure 21 can substitute with copper or other conductor wire or twisted-pair feeder.Electric connector can use known crimp technology used in the RJ45 connector of standard to be coupled to electric wire.
RJ45 coupler 3280 has dielectric connector shell 3281.It can have locking protuberance 3282 to interlock with the socket mating.DWG3220 can have single core or multiple core, as above described in more detail.DWG3220 should be flexible conventionally, but it can be also rigidity, for example, describe about Fig. 2 B, Fig. 3.
Flexible waveguide configuration can have core component 3225, and described core component is made up of the flexible dielectric material with high-k (ε k1) and is surrounded by the covering 3226 of being made up of the flexible dielectric material with low-k (ε k2).Although can use in theory air to replace covering, because air has approximately 1.0 dielectric constant, any contact of the mankind or other object can be introduced serious impedance mismatching effect, described impedance mismatching effect can cause loss of signal or error.Therefore, free air does not provide suitable covering conventionally.
The end of core component 3225 can be flat, or it can have spearhead shape or cone shape, for example above about Figure 12 in greater detail.Deformable gap filling material for example also can be included in, in the end of DWG3220, about Figure 13 in greater detail.
For example, connector shell 3281 can use binding agent or other bonding material to be attached to DWG3220.In the time that electric contact is crimped onto the electric wire comprising in DWG3220, it just can be enough to DWG3220 to be retained in connector shell 3281 separately so.
In this way, low cost, easy to implement, mechanical self aligned coupling scheme are provided.
Figure 33-34 illustrate the various application of RJ45 connector for the DWG that is coupled.Figure 33 illustrates the electronic system that can comprise PCB or other base substrate 3300.The integrated circuit 3340 that comprises Asia-Pacific hertz transmission or receiving circuit system can use arbitrary in greater detail technology to be above arranged in carrier substrates 3310 and to be coupled to DWG section 3320.Female RJ45 connector 3385 also can be arranged in base carrier 3320 and be coupled to DWG3320 by being similar to about the mode described in Figure 32.The end of the core component in DWG3320 can be flat, or it can have spearhead shape or cone shape, for example above about Figure 12 in greater detail.Deformable gap filling material for example also can be included in, in the end of DWG3220, about Figure 13 in greater detail.Female RJ45 connector can also comprise for electric contact that for example electric contact 3284 coordinates.Then public RJ45 connector 3280 can be easily inserted into and in connector 3385, carry out positive machinery and be connected with signal.
Similarly, female RJ45 connector 3485 can adhere to flexibility or rigidity DWG section 3420.The end of the core component in DWG3420 can be flat, or it can have spearhead shape or cone shape, for example above about Figure 12 in greater detail.Deformable gap filling material for example also can be included in, in the end of DWG3420, about Figure 13 in greater detail.In this way, two flexibility or rigidity DWG can easily and promptly coordinate.
Figure 35 is the flow chart that the purposes of dielectric waveguide in system is shown.System integrator or system user can use DWG that the first electronic system is connected to 3502 to second electronic systems.Two systems can be two different IC simply, and described IC can be a part for the larger system of for example being assembled by system integrator.For example, two systems can be that user links together for calculation element and peripheral unit or two calculation elements of individual or commercial use.System can be any type of calculation element, such as but not limited to: bracket base, desk base or portable computer, mobile user devices are as notebook computer, flat computer, smart phone etc.System can be the peripheral unit of any type, for example: media storage device, as rotation or solid magnetic disc driver, modulator-demodulator or for other interface of express network etc.
For example, DWG can be as any type of in greater detail flexibility or rigidity DWG above.DWG can be combination cable as above, for example, comprise the enhancement mode USB cable of DWG.As being above described in more detail, connection can be used RJ45 connector.Can exist single DWG maybe can have multiple DWG, this depends on system requirements.
Once system connects and opens, just can produce 3504 Asia-Pacific hertz RF signals by the IC in the first system.Can use known modulation technique by a data flow or multiple data stream modulates to RF signal.Then use herein in greater detail any coupling technique by RF signal from IC shift 3506 and transmitting 3508 to DWG.
Then second system can use herein any coupling technique in greater detail to catch the 3510 radiation RF signals from DWG and shift the 3512 RF signals of catching.Then the IC in second system can demodulation RF signal, thereby recovers one or more data flow for using in second system.
Two DWG can be for the two-way transfer of data, or can be by providing transceiver to use single DWG in each of two systems.
Figure 36 is the diagram by two systems 3601,3602 of DWG3620 interconnection.For example, two systems can be that user links together for calculation element and peripheral unit or two calculation elements of individual or commercial use.System can be any type of calculation element, such as but not limited to: bracket base, desk base or portable computer, mobile user devices are as notebook computer, flat computer, smart phone etc.System can be the peripheral unit of any type, for example: media storage device, as rotation or solid magnetic disc driver, modulator-demodulator or for other interface of express network etc.
For example, DWG3620 can be as any type of in greater detail flexibility or rigidity DWG above.DWG can be combination cable as above, for example, comprise the enhancement mode USB cable of DWG.Connection can be used as RJ45 connector in greater detail above.Can exist single DWG maybe can have multiple DWG, this depends on system requirements.
Connector 3621 and 3622 can be inserted in the socket 3611,3612 of coupling by user or system integrator.Connector and socket can be as above with reference to the RJ45 type connector as described in figure 32-34, or provide the connector of any other type of aligning for DWG3620.
Each system 3601,3602 can contain the substrate of PWB or other type, on described substrate, be provided with one or more as produced or receive in greater detail the integrated circuit of Asia-Pacific hertz signal above, described integrated circuit is coupled to DWG, and then described DWG stops in socket 3611,3612.For example, the coupled modes between IC and DWG can with above in greater detail any one in technology implement.
As described above with shown in example, two or more electronic devices can be by using technology described herein easily to interconnect, thereby Asia-Pacific hertz communication path is provided between electronic device.
there is the retractible DWG of rotation coupling mechanism
Figure 37 A-37C illustrates the electronic system device 3700 with the retractible DWG that uses rotary coupler 3750.In some systems, it may be applicable to by two systems of retractible DWG cable bond.In this way, cable can be always obtainable easily, but can easily be collected in beyond the invisible in the time not needing.For example, electronic installation 3700 can be any one in fixing of some types or mobile system, and as flat computer, palmtop computer, smart phone, memory device, wide area communications means etc., it can benefit from the high-bandwidth communication that is linked to another device.
System and device 3700 comprises the shell 3712 that covers and protect substrate 3710, and the various electronic building bricks of executive system function are installed on described substrate.For example, substrate 3710 can be MULTILAYER SUBSTRATE, one or more is installed as previously described as the substrate 200 of the packaging system of describing about Fig. 2 A above.Form at different embodiment housings can change, and this depends on function and the operation of system 3700.In Figure 37 A, shell 3712 shows in incision mode, thereby exposes the DWG cable 3720 of coiling.
For example, DWG cable 3720 can be reeled through other mechanism of the opening 3716 in shell 3712 around cable-pull as described in the bobbin 3714 as shown in Figure 37 B or permission.DWG cable 3720 can be about the described simple flexible barcode DWG with rectangle core and rectangle covering of Figure 20 as previously.In another embodiment, covering can be undertaken molded by for example circular or avette configuration.In another embodiment, for example, DWG cable 3700 can comprise conductor, as described about Figure 32.
Conventionally will use rectangle core, because need rectangle contrast square cross-sectional shaped to guarantee specific transmission mode, sometimes or even single-mode.Pattern determined the direction of electric field/magnetic field and propagation property thereof with and how to transmit and receive, thereby only guarantee the pattern of expecting with least loss.For example, but in various embodiments, core also can slightly depart from rectangle: ellipse, round edge rectangle, the multiple annular strand arranging with essentially rectangular shape, or the internal core powder that can be sealed by extramural cladding etc.
For example, although normally solid of dielectric core, in other embodiments, core can not be solid, as contained powder or multi cord in core in the situation that.In this class embodiment, for example air or other material can be between strands.
Connector 3760 can be provided on the end of DWG cable 3720, to allow DWG to be easily connected to another device.For example, connector 3760 can be similar to one of connector described in Figure 15, Figure 32 and Figure 33.
As above described in detail, an end of fixing DWG section 3722 is coupled to the communicator 3740 being configured to for produced and/or received high-frequency signal by DWG3722.For example, can use above one of structure in greater detail that these high-frequency signals are transmitted in DWG3722 or from DWG3722 and are received.The related U.S. patent application the 13/439th that is called " Interchip Communication Using Embedded Dielectric and MetalWaveguides " that operable other emitting structural is submitted on April 04th, 2012 in more detail, in No. 646, describe, this application is incorporated herein by reference.
Another end of DWG3722 is coupled to retractible DWG3720 by rotary coupler 3750.In this configuration, DWG3722 fixes, and bobbin 3714 and therefore DWG3720 can rotate around the c-axis line 3752 perpendicular to substrate 3710, as shown in Figure 37 C.In this way, DWG3720 can extend to its total length and be retracted into subsequently in shell 3712.
As shown in Figure 37 B, bobbin 3714 can be coupled to the wind spring retractor mechanism 3715 being arranged on shell 3712.Along with DWG3720 is drawn out shell 3712, spring mechanism 3715 is stored spring energy, and described spring energy then can be for being retracted into DWG3720 in shell 3712.In this way, DWG can retract and be wound into around the coil of rotatable male part 3750.Various types of spring retractor are well-known, as for tape measure, window-blind etc., and do not need to describe in further detail in this article.In another embodiment, can provide different institutions to replace spring mechanism for the DWG3720 that retracts, the wheel of for example crank handle or finger manipulation.
Figure 37 C is the more detailed view corresponding to the rotary coupler 3750 of the hatching A-A in Figure 37 A.As discussed above, DWG section 3722 is fixed on substrate 3710, and DWG section 3720 is configured to rotate around vertical c-axis line 3752.As mentioned above, DWG3720 has the rectangle core component 3725 being surrounded by clad material 3726.Similarly, DWG3722 has rectangle core component 3723.Because electronic installation inside can obtain the restricted of space, DWG3720 may the essential sharp corner forming as shown in Figure 37 C.As described earlier, this type of sharp corner can cause signals leakiness.Therefore, reflector 3727 can be incorporated in this sharp corner place, as about Figure 16-18 in greater detail.
As above, about as described in Figure 11-15, the spearhead shape interface between two DWG sections has reduced loss of signal.In order to allow DWG section 3720 to rotate, interface area 3754 can be formed as conical in shape, wherein on DWG3720, have convex cone shape and on DWG3722, have the convex cone shape of coupling, or vice versa.
In another embodiment, interface area 3754 is not level and smooth conical in shape, and can be the taper slightly with multiple general plane, as long as DWG3720 still may be around axis 3752 rotations.
Again referring to Figure 37 B, another spring mechanism in retractor spring mechanism 3715 or shell 3712 can be configured to apply the spring force along axis 3752 directions, to touch DWG3720 against DWG3722, thereby make the length in the gap in interface area 3754 drop to minimum.For example, this can allow the interface area rotation of conical in shape and then be parked in the position close contact that PYR side is aimed at.The length in the gap in interface area 3754 is minimized reduced signal to upload the signals leakiness of sowing time at interface area.
Figure 38 illustrates in greater detail rotary coupler 3750.In this embodiment, fixing section 3722 also has zig zag and cremasteric reflex device 3728 to reduce the loss of signal at this turning.
Figure 39 illustrates another embodiment with the communicator 3940 being arranged on substrate 3910.In this embodiment, fixing DWG section 3922 is vertically outstanding from communicator 3940, for example about Fig. 9 in greater detail.
Figure 40 illustrates another embodiment of rotary coupler 4050, and wherein interface area 4054 is by simply forming cutting on the end at rotatable DWG4020 and fixing DWG4022.But as discussed previously, this interface configuration can produce significant loss of signal.Be in the clearance space of interface area 4054, to comprise flexible material for reducing a kind of mode of loss of signal, the dielectric constant values of described flexible material is similar to the dielectric constant values of the core component of DWG4020 and 4022.For example, the grease based on silicone can insert in interstitial area, thereby makes joint lubricated and introduce dielectric constant and be similar to the material of DWG core.Certainly, also silicone grease or other material with similar dielectric constant can be incorporated in the interstitial area of the swivel joint shown in Figure 37-39.
Figure 41 A-41D illustrates the aligning aspect of rotary coupler.Figure 41 A illustrates the view downward along c-axis line 3752, again referring to Figure 37 C.Figure 41 B is illustrated in the cross sectional view at hatching C-C place.The core component 3723 of fixing DWG3722 is directed as shown in the figure.The core component 3725 of rotatable DWG3722 can be in any position in the time that it rotates; In Figure 41 A, it is approximately perpendicular to core component 3723.For signal transmission is minimized through the loss of signal during DWG3720,3722, movably the core 3723 of the core 3725 of DWG and fixing DWG should be aimed at, thereby allows signal transmission to use the identical excitation mode of DWG.If this aligning unrealized (as shown in the tangent line C-C in Figure 41 A-B), in joint, the serious insertion loss increasing can make sharply to worsen through DWG3720,3722 communication so.For fear of this situation, provide locking mechanism to aim at fixing DWG3722 in the time that rotation stops with the DWG3720 of locking rotation, as shown in Figure 41 C-41D.Figure 41 C is the view downward along c-axis line 3752, and Figure 41 D is illustrated in the cross sectional view at hatching D-D place.
Figure 42 illustrates and can be provided for maintaining core aims at exemplary locking mechanism.Referring to Figure 37 B, spring mechanism 3715 can also comprise locking mechanism again, and described locking mechanism impels rotatable DWG3720 to rotate whenever while stopping, to be all locked in the position that maintains the aligning between core 3723,3725.For example, this locking mechanism can be the simple circular 4260 of rotating together with DWG3720 and have two retainers 4262, and described retainer allows ratchet 4264 disk 4260 to be locked in to any one in two positions of 180 degree of being separated by.Manually pull DWG3720 will overcome ratchet 4264 and allow rotation to occur from shell 3712, and therefore allow DWG3720 to be drawn out shell 3712 and also roll the helical spring in spring mechanism 3715.Once manually pull and stop, helical spring will cause to reciprocal rotatable coupling and start to roll DWG3720 and disk 4260 until ratchet 4264 runs into one of retainer 4262, now rotation locked and core 3725 will be aimed at core 3723.Provide pressure 4265 can impel described ratchet from retainer 4262 drop out of gears and allow auxiliary retraction of spring of DWG3720 to recover to ratchet 4264.For example, pressure 4265 can provide by manual operation button (not shown).
In another embodiment, for example can provide only single retainer 4262.Certainly, retainer 4262 can be oriented in diverse location by the mechanical location based on ratchet 4265.
Other embodiment can be with other locking mechanism known or research and development later aiming between rotatable DWG3720 and fixing DWG3722 is provided.For example, can use and be similar to centrifugal locking mechanism used in roller blind.
For typical consumer electronics product, need low cost solution.Current, the prior art of the rotatable mechanical system for low cost device described above will provide the tolerance of the mechanical registeration in tens of micrometer ranges conventionally.The purposes of dielectric waveguide within the scope of millimeter wave and mechanical dimension's tolerance compatibility of hundreds of micron (to several millimeters); Therefore, can use as described herein the retractible DWG of low cost to provide Asia-Pacific hertz communication bandwidth for low cost consumer electronics system.On the contrary, this tolerance is not enough to guarantee the high data rate in the system based on optical fiber.
In this way, the thin device (as flat computer, palmtop computer or smart phone) that only 515mm is thick can have can provide with another device and carries out the retractible DWG cable that Asia-Pacific hertz is communicated by letter.Frequency (being 30-300GHz) in millimeter wave can be for the above-mentioned shaping factor.Larger size can be used lower frequency.
other embodiment
Although described with reference to an illustrative embodiment the present invention, this specification does not intend to understand in a limiting sense.With reference to after this specification, various other embodiment of the present invention will be apparent for those of ordinary skills.For example, although conventionally will use rectangle core, because need rectangle contrast square cross-sectional shaped to guarantee specific transmission mode, sometimes or even single-mode, can use other shape.Pattern determined the direction of electric field/magnetic field and propagation property thereof with and how to transmit and receive, thereby only guarantee the pattern of expecting with least loss.For example, but in various embodiments, core also can slightly depart from rectangle: ellipse, round edge rectangle, the multiple circular strand arranging with essentially rectangular shape, or the internal core powder that can be sealed by extramural cladding etc.
Although dielectric core is solid normally, in other embodiments, this core can not be solid, such as contain for example powder or multi cord in core in the situation that.In this class embodiment, for example air or other material can be between strands.
Exemplaryly fixing there is roughly the same cross sectional shape with rotatable DWG although shown in this article, but in other embodiments, rotatable DWG can have the cross sectional shape different from fixing DWG, as long as the similar degree of described cross sectional shape is enough to compatible and therefore allows signal to propagate in the situation bottom rail crossover ports of acceptable loss of signal.
Dielectric core is normally non-conductive; But in certain embodiments, this core can comprise that some hardwares as above improve signal transmitting/receiving, and reduces the loss in corner as above or knee.In certain embodiments, core can comprise having the material of differing dielectric constant and launch and receive to strengthen through the mode of the transmission of DWG and be shaped to be conducive to one or several pattern.
Several can combination by variety of way in technology described herein.For example, the various mating interfaces configuration of describing with reference to figure 11-15 goes for any one the output in DWG section that reference example describes as Fig. 2 A-2D, Fig. 5, Fig. 8 A, Figure 21 A-21D, Figure 22-27, Figure 29 and Figure 32 etc.Connector described in Figure 15, Figure 32 and Figure 33 goes for any one in DWG section described herein.Each DWG described herein can be coupled to any one in various emitting structural described herein.As described herein, multiple emitting structurals can be for having the DWG cable of multiple core components.Can make other combination of clearly not setting forth herein.
Some term is used to refer to specific system component of generation in whole specification and claims.It will be understood by a person skilled in the art that the assembly in digital system can refer to different names and/or can combine by not shown mode in the situation that not departing from described function herein.This file does not intend to distinguish in title and different assembly non-functional.In the following discussion and in claims, term " comprises " and " comprising " used in the open mode of one, and therefore should be interpreted as meaning " including but not limited to ... ".Again, term " coupling " and derivative thereof be intended to mean indirectly, directly, optics and/or dedicated radio link.Therefore,, if first device is coupled to the second device, this connection can be by direct electrical connection, is connected, is electrically connected and/or be passed through dedicated radio link by optics by the Indirect Electro of other device and connection so.
Although method step may be in this article in order mode present and describe, one or more in the shown and step described can be omitted, repeat, carry out simultaneously and/or be undertaken by that indicated in the drawings and/or the different order of order described herein.Therefore, embodiments of the invention should not be considered limited in specific step sequence shown in figure and/or described herein.
Therefore expect that appended claims belongs to covering any this type of amendment of the embodiment of scope and spirit of the present invention.