相关申请的交叉引用Cross References to Related Applications
本发明是2013年2月13日提交的并转让给飞思卡尔半导体股份有限公司的美国专利申请号13/766,771的部分继续申请案。This application is a continuation-in-part of US Patent Application Serial No. 13/766,771 filed February 13, 2013 and assigned to Freescale Semiconductor Incorporated.
技术领域technical field
本发明针对集成电路封装和一种制作通过集成太阳能电池的使用自供电的集成电路封装的方法。The present invention is directed to an integrated circuit package and a method of making an integrated circuit package that uses self-power through integrated solar cells.
背景技术Background technique
随着晶圆技术的进步，集成电路（IC）芯片的尺寸和功率要求已经降低。例如，球栅阵列（BGA）封装被广泛应用于移动设备，因为它们是非常小的并且具有低功率要求。然而，提供给IC芯片的功率通常来自于外部电源，诸如电池。因此，IC芯片的放置必须始终仔细考虑，使得IC芯片可以被充分访问以用于与外部电源耦合。这使得IC芯片在诸如衣服、鞋子、自行车、人体等等物品中的嵌入很困难。As wafer technology has advanced, the size and power requirements of integrated circuit (IC) chips have decreased. For example, ball grid array (BGA) packages are widely used in mobile devices because they are very small and have low power requirements. However, the power supplied to the IC chip usually comes from an external power source, such as a battery. Therefore, the placement of the IC chip must always be carefully considered so that the IC chip is sufficiently accessible for coupling with an external power supply. This makes it difficult to embed IC chips in items such as clothes, shoes, bicycles, human bodies, and so on.
同时，太阳能电池的效率不断改进。具体地，在最佳条件下，所需要发电的太阳能电池的光接收表面面积减小了。已发现，与IC芯片的大小的幅度量级相同的太阳能电池的尺寸可以足够有效以满足这种IC芯片在低功率环境下的功率需求。At the same time, the efficiency of solar cells continues to improve. Specifically, under optimal conditions, the light-receiving surface area of the solar cell required to generate electricity is reduced. It has been found that a solar cell size of the same magnitude as the size of an IC chip can be sufficiently efficient to meet the power requirements of such an IC chip in a low power environment.
因此希望提供具有集成的太阳能电池的IC芯片封装以便降低或排除IC芯片依赖于外部电源的需要。It is therefore desirable to provide IC chip packages with integrated solar cells in order to reduce or eliminate the need for the IC chip to be dependent on an external power source.
附图说明Description of drawings
本发明通过举例的方式说明并没有被附图中示出的其实施例所限制，在附图中类似的参考符号表示相同的元素。附图中的元素为了简便以及清晰而被图示，并且不一定按比例绘制。注意，某些垂直尺寸相对于某些水平尺寸被夸张。The present invention is illustrated by way of example and not limited to the embodiments thereof shown in the drawings, in which like reference numerals denote like elements. Elements in the figures are illustrated for simplicity and clarity and have not necessarily been drawn to scale. Note that some vertical dimensions are exaggerated relative to some horizontal dimensions.
在附图中：In the attached picture:
图1是根据本发明的第一实施例的集成电路器件的剖面侧视图；1 is a cross-sectional side view of an integrated circuit device according to a first embodiment of the present invention;
图2是根据本发明的第二实施例的集成电路封装的剖面侧视图；2 is a cross-sectional side view of an integrated circuit package according to a second embodiment of the present invention;
图3是根据本发明的第三实施例的集成电路封装的剖面侧视图；3 is a cross-sectional side view of an integrated circuit package according to a third embodiment of the present invention;
图4是根据本发明的第四实施例的集成电路封装的剖面侧视图；4 is a cross-sectional side view of an integrated circuit package according to a fourth embodiment of the present invention;
图5A1和图5A2是太阳能电池晶圆和在其上封装以层压的底层平面图和顶层平面图；5A1 and 5A2 are bottom and top plan views of a solar cell wafer and packaging thereon for lamination;
图5B是在由此分离各个太阳能电池之前的图5A1和图5A2的晶圆的底层平面图；以及5B is a bottom plan view of the wafer of FIGS. 5A1 and 5A2 before individual solar cells are thereby separated; and
图5C-5H是根据本发明的实施例的图示装配自供电集成电路（IC）器件的步骤的一系列图表。5C-5H are a series of diagrams illustrating steps in assembling a self-powered integrated circuit (IC) device in accordance with an embodiment of the present invention.
具体实施方式detailed description
在一个实施例中，本发明提供了一种自供电集成电路（IC）器件。所述器件包括具有相对的第一主表面和第二主表面的引线框、芯片支撑区域和围绕所述芯片支撑区域的多个引线。太阳能电池具有相对的第一主表面和第二主表面，其中所述第一主表面的至少一部分被配置成从外部源接收光，并且所述太阳能电池的所述第二主表面被附着到所述引线框的所述第一主表面的所述芯片支撑区域。所述太阳能电池将接收的光的能量转换成电能。集成电路（IC）芯片具有相对的第一主表面和第二主表面，其中所述IC芯片的所述第一主表面与所述太阳能电池的所述第二主表面面对排列。所述IC芯片被电连接到所述太阳能电池以接收由所述太阳能电池生成的电力。在一个实施例中，所述太阳能电池利用接合线被电连接到所述IC芯片以及在另一个实施例中通过锡球被电连接到所述IC芯片。在一个实施例中，所述IC芯片还利用接合线以及在另一个实施例中利用锡球被电连接到所述引线框的所述引线。至少一部分所述引线框、所述IC芯片、在所述IC芯片和所述太阳能电池之间的电连接以及所述IC芯片和所述引线之间的电连接、以及至少一部分所述太阳能电池利用塑封材料被封装。In one embodiment, the present invention provides a self-powered integrated circuit (IC) device. The device includes a lead frame having opposing first and second major surfaces, a chip support area, and a plurality of leads surrounding the chip support area. A solar cell has opposing first and second major surfaces, wherein at least a portion of the first major surface is configured to receive light from an external source, and the second major surface of the solar cell is attached to the The chip support region of the first major surface of the lead frame. The solar cell converts energy of received light into electrical energy. An integrated circuit (IC) chip has opposing first and second major surfaces, wherein the first major surface of the IC chip is aligned facing the second major surface of the solar cell. The IC chip is electrically connected to the solar cell to receive power generated by the solar cell. In one embodiment, the solar cell is electrically connected to the IC chip with bond wires and in another embodiment with solder balls. In one embodiment, the IC chip is also electrically connected to the leads of the lead frame with bond wires and in another embodiment with solder balls. At least a portion of the lead frame, the IC chip, the electrical connection between the IC chip and the solar cell, and the electrical connection between the IC chip and the lead, and at least a portion of the solar cell utilize The molding compound is encapsulated.
现在参照附图，其中相同的参考符号被用于指定若干附图中的相同组件，根据本发明，图1中所示的是自供电集成电路器件110的第一实施例。Referring now to the drawings, wherein like reference numerals are used to designate like components throughout the several views, shown in FIG. 1 is a first embodiment of a self-powered integrated circuit device 110 in accordance with the present invention.
自供电集成电路器件110包括具有相对的第一主表面和第二主表面112a和112b的引线框112、芯片支撑区域114和围绕所述芯片支撑区域114的多个引线116。在该实施例中，引线框112由一片导电金属或金属薄片形成，诸如铜，并且包括围绕中央开口的多个引线116。芯片支撑区域114包括引线116的近端和引线116的远端，其允许外部电连接到IC芯片，如在下面将要描述的。引线116可以包括一个或多个弯曲以诸如形成如图所示的鸥翼形状。The self-powered integrated circuit device 110 includes a lead frame 112 having opposing first and second major surfaces 112 a and 112 b , a chip support area 114 and a plurality of leads 116 surrounding the chip support area 114 . In this embodiment, lead frame 112 is formed from a sheet of conductive metal or foil, such as copper, and includes a plurality of leads 116 surrounding a central opening. Chip support area 114 includes proximal ends of leads 116 and distal ends of leads 116 that allow external electrical connections to the IC chip, as will be described below. Leads 116 may include one or more bends such as to form a gull-wing shape as shown.
具有相对的第一主表面和第二主表面118a和118b的太阳能电池118被安装到引线框112的芯片支撑区域114。即，太阳能电池118的第二主表面118b被附着到引线框112的第一主表面112a的芯片支撑区域114。在优选实施例中，太阳能电池118利用非导电环氧树脂120被附着到引线框112，以避免使太阳能电池118的第二主表面118b上的金属迹线（未示出）短路。A solar cell 118 having opposing first and second major surfaces 118 a and 118 b is mounted to the chip support region 114 of the lead frame 112 . That is, the second major surface 118b of the solar cell 118 is attached to the chip support region 114 of the first major surface 112a of the leadframe 112 . In a preferred embodiment, the solar cell 118 is attached to the leadframe 112 using a non-conductive epoxy 120 to avoid shorting metal traces (not shown) on the second major surface 118b of the solar cell 118 .
第一主表面118a是太阳能电池118的受光侧。太阳能电池118的第一主表面118a的至少一部分被配置成从外部源122接收光。众所周知，太阳能电池118将接收的光的能量转换成电能。The first main surface 118 a is the light-receiving side of the solar cell 118 . At least a portion of first major surface 118 a of solar cell 118 is configured to receive light from external source 122 . As is well known, the solar cell 118 converts the energy of received light into electrical energy.
太阳能电池118可以是常规的，并且由单晶、多晶，或无定形硅或另一类似的半导体材料或适当掺杂以用于高效光吸收以及电荷载流子的分离和导电的其组合形成。太阳能电池118也可以包括表面导电迹线、防反射涂层、金属接触垫以及常规已知的其它特征。The solar cell 118 may be conventional and formed from monocrystalline, polycrystalline, or amorphous silicon or another similar semiconductor material or a combination thereof suitably doped for efficient light absorption and charge carrier separation and conduction . Solar cell 118 may also include surface conductive traces, anti-reflective coatings, metal contact pads, and other conventionally known features.
集成电路（IC）芯片124也被提供为器件110的一部分。IC芯片124优选地包括相对的第一主表面和第二主表面124a、124b。在该第一实施例中，IC芯片124的第一主表面124a在引线框112的中央开口处与太阳能电池118的第二主表面118a面对排列并附着到其上。太阳能电池118的第一主表面118a的表面面积优选地大于IC芯片124的第一主表面124a的表面面积。在优选实施例中，IC芯片124利用非导电环氧树脂，诸如用于将太阳能电池118附着到引线框112的非导电环氧树脂120，被附着到太阳能电池118，以避免使太阳能电池118的第二主表面118b上的金属迹线（未示出）短路。至少一个第一电互连器126将引线框112的引线116与IC芯片124电连接。优选的是，至少第一电互连器126包括多个接合线，其可以使用常规引线接合工艺和引线接合设备被附着到IC芯片124的第二主表面124b上的接合盘以及引线框112的第二侧112b上的引线116的近端。An integrated circuit (IC) chip 124 is also provided as part of device 110 . The IC chip 124 preferably includes opposing first and second major surfaces 124a, 124b. In this first embodiment, the first major surface 124a of the IC chip 124 is aligned with and attached to the second major surface 118a of the solar cell 118 at the central opening of the lead frame 112 . The surface area of first major surface 118 a of solar cell 118 is preferably greater than the surface area of first major surface 124 a of IC chip 124 . In a preferred embodiment, the IC chip 124 is attached to the solar cell 118 using a non-conductive epoxy, such as the non-conductive epoxy 120 used to attach the solar cell 118 to the lead frame 112, to avoid making the solar cell 118 Metal traces (not shown) on the second major surface 118b are shorted. At least one first electrical interconnect 126 electrically connects the leads 116 of the leadframe 112 to the IC chip 124 . Preferably, at least the first electrical interconnect 126 includes a plurality of bond wires that can be attached to bond pads on the second major surface 124b of the IC chip 124 and to the bonding pads of the lead frame 112 using conventional wire bonding processes and wire bonding equipment. The proximal end of the lead 116 is on the second side 112b.
IC芯片124也被电连接到太阳能电池118以接收由太阳能电池118生成的电力。在优选实施例中，多个第二电互连器128将太阳能电池118耦合到IC芯片124的第一主表面124a。在进一步的优选实施例中，第二电互连器128包括接合线，其可以使用常规引线接合工艺和常规引线接合设备被附着到芯片接合盘和太阳能电池接合盘。IC chip 124 is also electrically connected to solar cell 118 to receive power generated by solar cell 118 . In a preferred embodiment, a plurality of second electrical interconnects 128 couple the solar cell 118 to the first major surface 124a of the IC chip 124 . In a further preferred embodiment, the second electrical interconnect 128 includes bond wires that can be attached to the die bond pads and the solar cell bond pads using conventional wire bonding processes and conventional wire bonding equipment.
器件110进一步包括第一密封剂130，第一密封剂130覆盖IC芯片124、第一和第二电互连器126、128以及部分引线框112（即，引线116的近端）。如常规已知的。第一密封剂130进一步覆盖太阳能电池118的至少一部分。第一密封剂130可以由如本领域已知的陶瓷材料、聚合物材料等等制成。The device 110 further includes a first encapsulant 130 covering the IC chip 124 , the first and second electrical interconnects 126 , 128 , and a portion of the leadframe 112 (ie, the proximal ends of the leads 116 ). as conventionally known. The first encapsulant 130 further covers at least a portion of the solar cell 118 . The first sealant 130 may be made of ceramic material, polymer material, etc. as known in the art.
在图1中所示的第一实施例中，太阳能电池118的第一主表面118a上没有覆盖第一密封剂130，并因此被暴露出来。由于塑封材料（即，第一密封剂130）通常对被太阳能电池118使用以生成电力的光的波长是不透明的，所以这种配置允许太阳能电池118的第一主表面118a暴露于来自外部源122的光。In the first embodiment shown in FIG. 1 , the first major surface 118a of the solar cell 118 is not covered with the first encapsulant 130 and is thus exposed. Since the molding compound (ie, first encapsulant 130 ) is generally opaque to the wavelengths of light used by solar cell 118 to generate electricity, this configuration allows first major surface 118 a of solar cell 118 to be exposed to light from external source 122 . of light.
在图1中，IC器件110进一步包括第二密封剂132，第二密封剂132至少层压在太阳能电池118的第一主表面118a的光接收部分上。第二密封剂132至少对于所述接收的光的波长是透明的或透射的，使得接收的光可以由太阳能电池118转换成电能。在进一步的优选实施例中，太阳能电池118的第一主表面118a的层压部分也层压有玻璃（未示出）。优选的是，太阳能电池118的第一主表面118a的至少层压部分穿过第一密封剂130暴露。在第二密封剂132存在的情况下，太阳能电池118的第一主表面118a受到保护，并且为了这个目的而不需要第一密封剂130。In FIG. 1 , the IC device 110 further includes a second encapsulant 132 laminated on at least the light receiving portion of the first main surface 118 a of the solar cell 118 . The second encapsulant 132 is transparent or transmissive at least for the wavelength of the received light so that the received light can be converted into electrical energy by the solar cell 118 . In a further preferred embodiment, the laminated portion of the first main surface 118a of the solar cell 118 is also laminated with glass (not shown). Preferably, at least a laminated portion of the first major surface 118 a of the solar cell 118 is exposed through the first encapsulant 130 . In the presence of the second encapsulant 132, the first major surface 118a of the solar cell 118 is protected, and the first encapsulant 130 is not required for this purpose.
图2示出了根据本发明的器件210的第二实施例。第二实施例类似于上述的第一实施例。除了200系列符号已被用于第二实施例，类似的符号已被用于相似元件。因此，已经省略了第二实施例的完整描述，而只描述了差异。Figure 2 shows a second embodiment of a device 210 according to the invention. The second embodiment is similar to the first embodiment described above. Similar symbols have been used for similar elements, except that 200 series symbols have been used for the second embodiment. Therefore, a complete description of the second embodiment has been omitted, and only differences have been described.
第二实施例与第一实施例的不同之处在于，第一密封剂230优选地至少对于由太阳能电池218从外部源222接收的光的波长是透明的或透射的。因此，第二实施例不需要与第一实施例的第二密封剂132相同的第二密封剂。The second embodiment differs from the first embodiment in that first encapsulant 230 is preferably transparent or transmissive at least for the wavelength of light received by solar cell 218 from external source 222 . Therefore, the second embodiment does not require the same second sealant as the second sealant 132 of the first embodiment.
图3示出了根据本发明的封装310的第三实施例。第三实施例类似于上述的第一实施例。除了300系列符号已被用于第三实施例，类似的符号已被用于相似元件。因此，已经省略了第三实施例的完整描述，而只描述了差异。Fig. 3 shows a third embodiment of a package 310 according to the invention. The third embodiment is similar to the first embodiment described above. Similar symbols have been used for similar elements, except that 300 series symbols have been used for the third embodiment. Therefore, a complete description of the third embodiment has been omitted, and only differences have been described.
第三实施例与第一实施例的不同之处在于，引线框112包括位于其中央开口处的管芯盘或标识。太阳能电池118的第二主表面118b被附着到管芯盘的第一侧以及引线116的近端的第一侧。然后，IC芯片324被附着到管芯盘的第二侧112b，而不是被直接附着到太阳能电池118的第二主表面118b。The third embodiment differs from the first embodiment in that the leadframe 112 includes a die pad or flag at its central opening. The second major surface 118b of the solar cell 118 is attached to the first side of the die pad and the first side proximate the ends of the leads 116 . The IC chip 324 is then attached to the second side 112b of the die pad instead of being attached directly to the second major surface 118b of the solar cell 118 .
图4示出了根据本发明的封装器件410的第四实施例。第四实施例类似于上述的第一实施例。除了400系列符号已被用于第四实施例，类似的符号已被用于相似元件。因此，已经省略了第四实施例的完整描述，而只描述了差异。Fig. 4 shows a fourth embodiment of a packaged device 410 according to the invention. The fourth embodiment is similar to the first embodiment described above. Similar symbols have been used for similar elements, except that 400 series symbols have been used for the fourth embodiment. Therefore, a complete description of the fourth embodiment has been omitted, and only differences have been described.
第四实施例与第一实施例的不同之处在于，IC芯片424是倒装型管芯，以及将IC芯片424电连接到引线框412的第一电互连器426包括导电球或隆起物。此外，IC芯片424利用第二电互连器428被电连接到太阳能电池118，第二电互连器428也包括导电球或隆起物。第一电互连器426具有大约是引线宽度的0.25-0.75倍的隆起直径，以允许用于装配过程中的贴装机器的合理公差，以及第二电连接引线428具有大约是其高度的1.0-2.0倍的隆起直径，这取决于引线框（衬底）、非导电环氧树脂和互连器426的总高度或总厚度。The fourth embodiment differs from the first embodiment in that the IC chip 424 is a flip-chip die, and the first electrical interconnect 426 electrically connecting the IC chip 424 to the lead frame 412 includes conductive balls or bumps . Additionally, the IC chip 424 is electrically connected to the solar cell 118 using a second electrical interconnect 428, which also includes conductive balls or bumps. The first electrical interconnector 426 has a ridge diameter that is approximately 0.25-0.75 times the width of the lead to allow for reasonable tolerances for placement machines in the assembly process, and the second electrical connection lead 428 has a diameter that is approximately 1.0 times its height. - 2.0 times the bump diameter, depending on the total height or total thickness of the leadframe (substrate), non-conductive epoxy and interconnect 426 .
在第四实施例中，虽然在组成了芯片支撑区域414的相对侧，但是由于太阳能电池418和IC芯片424都被附着到引线416的近端，所以太阳能电池418的第一主表面418a的表面面积和IC芯片424的第一主表面424a的表面面积相同。In the fourth embodiment, although on the opposite side constituting the chip support region 414, since both the solar cell 418 and the IC chip 424 are attached to the proximal end of the lead 416, the surface of the first main surface 418a of the solar cell 418 The area is the same as the surface area of the first main surface 424 a of the IC chip 424 .
在根据本发明的实施例的器件110、210、310、410的情况下，IC芯片124、224、324、424的功率要求可以至少部分地被包含在器件110、210、310、410内的太阳能电池118、218、318、418所输出的功率来满足。因此，如果没有消除，也可以减少对于到外部电源的连接的需要。In the case of devices 110 , 210 , 310 , 410 according to embodiments of the invention, the power requirements of IC chips 124 , 224 , 324 , 424 may be at least partially contained by the solar energy The power output by the batteries 118, 218, 318, 418 is sufficient. Thus, the need for connections to external power sources may also be reduced, if not eliminated.
现在参照图5A1-5H，现在将描述根据本发明的第一实施例的用于装配自供电集成电路（IC）器件的示例性方法。Referring now to FIGS. 5A1-5H , an exemplary method for assembling a self-powered integrated circuit (IC) device according to a first embodiment of the present invention will now be described.
在图5A1中，太阳能电池晶圆50被提供有在其上形成的多个单独太阳能电池118。一片或多片密封剂132优选地被层压到太阳能电池晶圆50的第一主表面（未示出）。焊盘52和金属迹线54位于太阳能电池晶圆50的第二主表面50b上。图5A2示出了太阳能电池晶圆50的第一主表面50a优选地层压有一片或多片密封剂132。In FIG. 5A1 , a solar cell wafer 50 is provided with a plurality of individual solar cells 118 formed thereon. One or more sheets of encapsulant 132 are preferably laminated to the first major surface (not shown) of solar cell wafer 50 . Bonding pads 52 and metal traces 54 are located on second major surface 50 b of solar cell wafer 50 . FIG. 5A2 shows that the first major surface 50 a of the solar cell wafer 50 is preferably laminated with one or more sheets of encapsulant 132 .
在图5B中，在太阳能电池118准备好切割之后，太阳能电池晶圆50优选地安装到常规切割带56，其中太阳能电池晶圆50的第二主表面50b朝外。单独太阳能电池118然后优选地使用锯（未示出）与晶圆50分开以沿着虚线切割线58切断太阳能电池118。然而，也可使用其它切割方法，诸如冲床切割等等。在所示的实施例中，被切断的太阳能电池118各自包括分别充当正极和负极的两个焊盘52。In FIG. 5B , after the solar cells 118 are ready for dicing, the solar cell wafer 50 is preferably mounted to a conventional dicing tape 56 with the second major surface 50b of the solar cell wafer 50 facing outward. Individual solar cells 118 are then separated from wafer 50 , preferably using a saw (not shown) to sever solar cells 118 along dashed dicing lines 58 . However, other cutting methods may also be used, such as punch cutting or the like. In the illustrated embodiment, the severed solar cells 118 each include two pads 52 that serve as positive and negative terminals, respectively.
参照图5C，至少一个引线框112设置具有朝上的相对的第一主表面112a和第二主表面（未示出）、芯片支撑区域114和围绕芯片支撑区域114的多个引线116。Referring to FIG. 5C , at least one lead frame 112 is provided having upwardly facing opposite first and second major surfaces 112 a and second major surfaces (not shown), a chip support area 114 and a plurality of leads 116 surrounding the chip support area 114 .
在图5D中，切割的太阳能电池118被安装到引线框112，其中太阳能电池118的第一主表面118a朝上以及太阳能电池118的第二主表面（未示出）被附着到引线框112的第一主表面112a的芯片支撑区域114。如图1所示，太阳能电池118优选地利用非导电环氧树脂120附着到引线框112，以避免使太阳能电池118的第二主表面（图5A1中所示的50b）上的金属迹线（图5A1中所示的54）短路。In FIG. 5D , the diced solar cell 118 is mounted to the lead frame 112 with the first major surface 118 a of the solar cell 118 facing up and the second major surface (not shown) of the solar cell 118 is attached to the lead frame 112 . The chip support region 114 of the first major surface 112a. As shown in FIG. 1 , the solar cell 118 is preferably attached to the lead frame 112 using a non-conductive epoxy 120 to avoid making metal traces ( 54) shown in Figure 5A1 is shorted.
在图5E中，引线框112被翻转，其中引线框112的第二主表面112b朝上并被放置到载体（未示出）上。如图5E所示，引线框112的芯片支撑区域114的中心区域被打开以暴露太阳能电池118的带有焊盘52和金属迹线54的第二主表面118b。然后，IC芯片124的第一主表面（未示出）优选地使用非导电环氧树脂（未示出）被附着到太阳能电池118的第二主表面118b以避免使金属迹线54短路。In FIG. 5E , the leadframe 112 is turned over with the second major surface 112b of the leadframe 112 facing upwards and placed onto a carrier (not shown). As shown in FIG. 5E , a central region of the chip support region 114 of the lead frame 112 is opened to expose the second major surface 118 b of the solar cell 118 with the pad 52 and the metal trace 54 . A first major surface (not shown) of IC chip 124 is then attached to second major surface 118b of solar cell 118 preferably using a non-conductive epoxy (not shown) to avoid shorting metal traces 54 .
图5F-5H是图示在装配自供电IC器件110的其余步骤的一系列放大的截面图。5F-5H are a series of enlarged cross-sectional views illustrating the remaining steps in assembling the self-powered IC device 110 .
图5F示出了被放置在载体60上的部分装配的IC器件110，其中引线框112的第二主表面112b朝上。然后，引线框112的引线116利用至少一个第一电互连器126被电连接到IC芯片124。优选的是，至少第一电互连器126包括多个接合线。此外，在太阳能电池118的第二主表面118b上的焊盘52利用多个第二电互连器128电耦合到IC芯片124的第一主表面124a。在优选实施例中，第二电互连器128包括接合线。焊盘52分别充当太阳能电池118的正极和负极。FIG. 5F shows the partially assembled IC device 110 placed on the carrier 60 with the second major surface 112b of the lead frame 112 facing upward. Leads 116 of lead frame 112 are then electrically connected to IC chip 124 using at least one first electrical interconnect 126 . Preferably, at least the first electrical interconnect 126 includes a plurality of bond wires. Additionally, pads 52 on second major surface 118b of solar cell 118 are electrically coupled to first major surface 124a of IC chip 124 using a plurality of second electrical interconnects 128 . In a preferred embodiment, the second electrical interconnect 128 includes bond wires. The pads 52 serve as the positive and negative terminals of the solar cell 118, respectively.
如图5G所示，如常规已知的，第一密封剂130封装了IC芯片124、至少一个第一电互连器126。第一密封剂130进一步封装部署在引线框112上的至少一部分太阳能电池118，并且至少一部分密封剂132穿过第一密封剂130暴露。第一密封剂130可由陶瓷材料、聚合物材料等等制成。As shown in FIG. 5G , a first encapsulant 130 encapsulates the IC chip 124 , at least one first electrical interconnect 126 , as is conventionally known. The first encapsulant 130 further encapsulates at least a portion of the solar cell 118 disposed on the lead frame 112 , and at least a portion of the encapsulant 132 is exposed through the first encapsulant 130 . The first sealant 130 may be made of ceramic material, polymer material, or the like.
在图5H中，一旦第一密封剂130被设置，则器件110可如图1中所示被完成，太阳能电池118的第一主表面118a的至少一部分被配置成从外部源122接收光，太阳能电池118将接收的光的能量转换成电能。In FIG. 5H, once the first encapsulant 130 is provided, the device 110 may be completed as shown in FIG. The battery 118 converts the energy of the received light into electrical energy.
显然，该方法的某些步骤可被改变和/或移除以形成器件的其它实施例。如图2中所示的第二实施例，在塑封材料对于光的波长透明的地方，可以省略太阳能电池晶圆的层压步骤。Obviously, certain steps of the method may be altered and/or removed to form other embodiments of the device. In a second embodiment as shown in Fig. 2, where the molding compound is transparent to the wavelength of light, the lamination step of the solar cell wafer can be omitted.
类似地，如果引线框的芯片支撑区域的中心区域被部分开口以暴露太阳能电池的带有焊盘的第二主表面，则如图3的第三实施例所示，IC芯片的第一主表面被附着在引线框的第二主表面而不是太阳能电池的第二主表面。Similarly, if the central area of the chip supporting area of the lead frame is partially opened to expose the second main surface of the solar cell with the bonding pad, as shown in the third embodiment of FIG. 3, the first main surface of the IC chip is attached to the second major surface of the lead frame instead of the second major surface of the solar cell.
此外，电连接太阳能电池或引线框的引线的步骤可以涉及锡球附着和回流工艺以实现如图4第四实施例所示的配置，而不是引线接合工艺。Furthermore, the step of electrically connecting the leads of the solar cell or lead frame may involve a solder ball attach and reflow process to achieve the configuration as shown in the fourth embodiment of FIG. 4 instead of a wire bonding process.
在前面的说明中，参照本发明实施例的特定例子已对本发明进行了描述。然而，将明显的是，各种修改和变化可在不脱离附属权利要求中所陈述的本发明的宽范围精神及范围的情况下被做出。In the foregoing specification, the invention has been described with reference to specific examples of embodiments of the invention. It will, however, be evident that various modifications and changes may be made without departing from the broader spirit and scope of the invention as set forth in the appended claims.
本领域所属技术人员将认识到上述描述的操作之间的界限只是说明性的。多个操作可组合成单一的操作，单一的操作可分布在附加操作中，并且操作可至少在时间上部分重叠被执行。而且，替代实施例可包括特定操作的多个实例，并且操作的顺序在各种其它实施例中会改变。Those skilled in the art will recognize that the boundaries between the above-described operations are illustrative only. Multiple operations may be combined into a single operation, a single operation may be distributed among additional operations, and operations may be performed at least partially overlapping in time. Also, alternative embodiments may include multiple instances of a particular operation, and the order of operations may be varied in various other embodiments.
在说明书和权利要求书中的术语“前面”、“后面”、“顶部”、“底部”、“上面”、“下面”等等，如果有的话，是用于描述性的目的并且不一定用于描述永久性的相对位置。应了解，术语的这种用法在适当的情况下是可以互换的使得本发明所描述的实施例例如能够在其它方向而不是本发明所说明的或在其它方面进行操作。The terms "front", "rear", "top", "bottom", "above", "below", etc., in the specification and claims, if any, are used for descriptive purposes and do not necessarily Used to describe permanent relative positions. It is to be understood that such uses of the terms are interchangeable under appropriate circumstances such that the described embodiments of the invention are, for example, capable of operation in other orientations than those illustrated or in other respects.
在权利要求中，词语“包括”或“含有”不排除其它元件或权利要求中列出的步骤的存在。此外，如在此使用的词语“一”或“一个”被定义为一个或不止一个。而且，即使当同一权利要求包括介绍性短语“一个或多个”或“至少一个”以及诸如“一”或“一个”的不定冠词时，在权利要求中诸如“至少一个”以及“一个或多个”的介绍性短语的使用也不应该被解释成暗示通过不定冠词“一”或“一个”引入的其它权利要求元素将包括这样介绍的权利要求元素的任何特定权利要求限制成仅包含这样的元素的发明。对于定冠词的使用也是如此。除非另有说明，使用诸如“第一”以及“第二”的术语来任意地区分这样的术语描述的元素。因此，这些术语不一定旨在指示这样的元素的时间或其它优先次序。在相互不同的权利要求中记载某些措施的事实并不指示这些措施的组合不能被用于获取优势。In the claims, the word "comprises" or "comprising" does not exclude the presence of other elements or steps listed in the claims. Furthermore, the words "a" or "an" as used herein are defined as one or more than one. Moreover, even when the same claim includes the introductory phrase "one or more" or "at least one" and an indefinite article such as "a" or "an", in a claim such as "at least one" and "one or Neither should the use of the introductory phrase "a" be construed to imply that other claim elements introduced by the indefinite article "a" or "an" limit any particular claim including such introduced claim elements to include only Invention of such elements. The same is true for the use of definite articles. Unless stated otherwise, terms such as "first" and "second" are used to arbitrarily distinguish between the elements such terms describe. Accordingly, these terms are not necessarily intended to indicate temporal or other prioritization of such elements. The mere fact that certain measures are recited in mutually different claims does not indicate that a combination of these measures cannot be used to advantage.
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/849,543 | 2013-03-24 | ||
| US13/849,543US8778704B1 (en) | 2013-02-13 | 2013-03-24 | Solar powered IC chip |
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| CN104064612A CN104064612A (en) | 2014-09-24 |
| CN104064612Btrue CN104064612B (en) | 2017-06-20 |
| Application Number | Title | Priority Date | Filing Date |
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| CN201410112304.7AActiveCN104064612B (en) | 2013-03-24 | 2014-03-24 | Solar powered IC chip |
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