CN104053335B - Heat radiator for electronic equipment - Google Patents
Heat radiator for electronic equipmentDownload PDFInfo
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- CN104053335B CN104053335BCN201310080229.6ACN201310080229ACN104053335BCN 104053335 BCN104053335 BCN 104053335BCN 201310080229 ACN201310080229 ACN 201310080229ACN 104053335 BCN104053335 BCN 104053335B
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
Technical Field
The present invention relates to the field of electronic communications, and in particular, to a heat dissipation device for an electronic device.
Background
At present, light and thin products generally dissipate heat through the heat conduction of product shells or heat diffusion materials. Along with the development trend of miniaturization and multi-functionalization of electronic products, more and more heat is generated in unit volume of the products, the effective heat dissipation area is gradually reduced, and the requirement on heat dissipation performance is higher and higher. However, the heat conductivity of the housing or the thermal diffusion material is limited, and the heat dissipation efficiency is low, so that the improvement of the power of chips such as CPUs of products is limited.
Disclosure of Invention
In view of this, the present invention provides a heat dissipation device for an electronic device, and aims to solve the problem of low heat dissipation efficiency of the conventional electronic device.
A heat dissipation device for an electronic device, comprising: the heat conduction layer, the mounting layer and the filling layer;
the edges of the heat conduction layer and the mounting layer are sealed to form a closed cavity, and the filling layer is filled in the closed cavity;
the heat conduction layer is made of a high-heat-conductivity metal material and is used for absorbing heat generated by the electronic equipment;
the mounting layer is made of high-strength metal materials and is used for being fixedly connected with the electronic equipment; one surface of the mounting layer, which is in contact with the filling layer, is plated with a metal plating layer made of the same material as the heat conduction layer;
the filling layer includes a liquid heat transfer medium.
Preferably, the high thermal conductive metal material is copper.
Preferably, the high-strength metal material is stainless steel or magnesium aluminum alloy or aluminum alloy.
Preferably, the mounting layer is specifically a housing or a metal middle frame of the electronic device.
Preferably, a surface of the mounting layer contacting the filling layer is provided with a protrusion for supporting the heat conducting layer.
Preferably, the filling layer further comprises a capillary structure layer, and the liquid heat-conducting medium is filled in the space of the capillary structure layer.
Preferably, the edge sealing of the heat conductive layer and the mounting layer comprises conventional welding, gluing, ultrasonic welding and vapor deposition welding.
According to the technical scheme, the heat dissipation device of the electronic equipment comprises the heat conduction layer, the installation layer and the filling layer, wherein the heat conduction layer is made of the high-heat-conductivity metal material, the filling layer comprises the liquid heat conduction medium, heat generated by the electronic equipment can be quickly absorbed, and the heat dissipation efficiency of the electronic equipment is improved. Meanwhile, the mounting layer is made of high-strength metal materials, so that the heat dissipation device is conveniently and fixedly connected with the electronic equipment, the phenomenon that the whole thickness of the heat dissipation device is increased due to bending deformation of the heat dissipation device is avoided, and the heat dissipation device can be well adapted to the current situation that the internal space of the electronic equipment is small.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a cross-sectional structure diagram of a heat dissipation device of an electronic apparatus according to an embodiment of the present invention;
fig. 2 is a cross-sectional structure diagram of a heat dissipation device of an electronic apparatus according to a second embodiment of the present invention;
fig. 3 is a cross-sectional structure diagram of a heat dissipation device of an electronic apparatus according to a third embodiment of the present invention;
FIG. 4 is a schematic cross-sectional view of a cuboid-shaped protrusion disposed on a mounting layer according to an embodiment of the invention;
fig. 5 is a schematic cross-sectional view of a cylindrical protrusion disposed on a mounting layer according to an embodiment of the invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The invention aims to provide a heat dissipation device of electronic equipment, which solves the problem of low heat dissipation efficiency of the existing heat dissipation mode of the electronic equipment.
At present, a flat plate type heat pipe generally adopts an upper copper layer and a lower copper layer to form a space structure, structures such as a metal mesh tube core, a foamed metal material, a powder sintered tube core, a groove tube core and the like are filled between the upper copper layer and the lower copper layer to form an internal capillary structure layer, fluid such as water, methanol and the like are filled in a space with the capillary structure layer, and a higher vacuum degree is kept for the space. The two copper structures are jointed at the outer edge by welding or gluing and the like and maintain air tightness. However, the conventional flat plate heat pipe has a sandwich structure of two copper layers and an intermediate interlayer, so that the thickness is relatively thick, generally greater than 0.8mm, and the heat pipe is difficult to be installed in a large space in an ultrathin product. In addition, the copper has low hardness and a hollow structure, so that the traditional heat pipe is very soft as a whole, difficult to mount and fix and easy to bend and deform to cause performance reduction and even failure.
Referring to fig. 1, a heat dissipation device for an electronic device according to a first embodiment of the present invention includes a heatconductive layer 101, amounting layer 102, and afilling layer 103; themounting layer 102 may be circular, rectangular, or any regular or irregular shape, and may be selected according to the actual application requirements; the shape of theheat conduction layer 101 is adapted to themounting layer 102, so that the edges of theheat conduction layer 101 and themounting layer 102 are sealed, the air tightness between the two is kept, a closed cavity is formed in the space between the two, thefilling layer 103 is filled in the closed cavity, and the surface of themounting layer 102, which is in contact with thefilling layer 103, is plated with ametal plating layer 104 which is made of the same material as theheat conduction layer 101.
Specifically, the heat conductinglayer 101 is made of a high heat conducting metal material and is in direct contact with heat generating components of the electronic equipment, and heat generated by the electronic equipment can be quickly absorbed by utilizing the characteristic of high heat conducting efficiency of the high heat conducting metal; the filling layer 3 is a liquid heat-conducting medium, and the heat absorbed by the heat-conducting layer is quickly absorbed by using the characteristic of high liquid heat-conducting efficiency, so that the heat-conducting layer can continuously absorb the heat generated by the electronic equipment.
Themounting layer 102 is made of a high-strength metal material and is fixedly connected with the electronic equipment, and the heat dissipation device can be easily fixed on the electronic equipment by utilizing the characteristic of high strength of the high-strength metal; since the high-strength mounting layer 102 is not easily bent, the overall thickness of the heat sink is not easily changed. The connection mode between themounting layer 102 and the electronic device is various, for example, a protrusion is arranged on themounting layer 102, a groove is arranged at a corresponding position of the electronic device, and the protrusion is embedded into the groove to realize the connection between the heat dissipation device and the electronic device; if themounting layer 102 can be directly welded to the electronic device by conventional welding, gluing, ultrasonic welding, vapor deposition welding, and the like, the heat dissipation device can be fixedly connected to the electronic device.
Themetal coating 104 which is made of the same material as theheat conduction layer 101 is arranged on the surface, in contact with thefilling layer 103, of themounting layer 102, so that the potential difference between two different metals which form theheat conduction layer 101 and themounting layer 102 under the influence of the conductive medium of thefilling layer 103 can be avoided, the loss of the heat dissipation device is reduced, and the performance of the heat dissipation device is ensured.
In addition, the heat conductinglayer 101 and themounting layer 102 are both metal plates made of corresponding materials, so that the whole heat dissipation device is flat, and test data prove that the whole thickness of the heat dissipation device with the structure is only about 0.4mm, so that the applicability of the heat dissipation device in light and thin electronic equipment with small internal space is improved.
The heat dissipation device of the electronic equipment comprises the heat conduction layer, the installation layer and the filling layer, wherein the heat conduction layer is made of high-heat-conductivity metal materials, the filling layer comprises liquid heat-conducting media, heat generated by the electronic equipment can be quickly absorbed, the heat dissipation efficiency of the electronic equipment is improved, and the heat dissipation device is more beneficial to improving the performance and the power of chips such as a CPU (central processing unit) of the electronic equipment. Meanwhile, the mounting layer is made of high-strength metal materials, so that the heat dissipation device is conveniently and fixedly connected with the electronic equipment, the bending deformation of the heat dissipation device is avoided, and the heat dissipation device can be well adapted to the current situation that the internal space of the electronic equipment is small. In addition, the whole thickness of the heat dissipation device is kept about 0.4mm, and the applicability of the heat dissipation device in light and thin electronic equipment with small internal space is further improved.
Specifically, the high thermal conductive metal material for preparing the thermal conductive layer in the above embodiments may be copper. Correspondingly, the metal coating is a copper coating. The high-strength metal material for preparing the mounting layer can be alloy, such as stainless steel, magnesium-aluminum alloy, aluminum alloy and the like.
Referring to fig. 2, the heat dissipation device for electronic equipment according to the second embodiment of the present invention is composed of aheat conduction layer 201, amounting layer 202, and afilling layer 203, and is flat as a whole, wherein edges of theheat conduction layer 201 and themounting layer 202 are sealed to form a sealed cavity, thefilling layer 203 is located in the sealed cavity, and ametal plating layer 204 made of the same material as theheat conduction layer 201 is plated on a surface of themounting layer 202 contacting thefilling layer 203.
The heat conductinglayer 201 is a high heat conducting metal plate and is in direct contact with a heat generating component of the electronic device; thefilling layer 203 comprises a liquid heat-conducting medium, and both the heat-conductinglayer 201 and thefilling layer 203 have the characteristic of high heat-conducting efficiency, so that heat generated by the electronic equipment can be quickly absorbed, and the heat-radiating efficiency of the electronic equipment is improved.
In this embodiment, themounting layer 202 directly selects one of the inherent components such as the metal middle frame and the casing of the electronic device, and when the heat dissipation device of the electronic device needs to be mounted, only the inherent components such as the metal middle frame and the casing of themounting layer 202 need to be mounted at the corresponding positions of the electronic device. In addition, the heat dissipation device of the electronic device disclosed in the embodiment only uses the inherent components of the electronic device as the mounting layer, so that the space occupation of the device can be reduced.
Moreover, themetal plating layer 204 and the heat conductinglayer 201 are made of the same material, so that a potential difference between the heat conductinglayer 201 and themounting layer 202 can be avoided, the loss of the heat dissipation device is reduced, and the performance of the heat dissipation device is ensured.
According to the structure, the heat dissipation device provided by the embodiment of the invention directly selects the inherent part of the electronic equipment as the mounting layer, so that the space occupation of the heat dissipation device is greatly reduced, and the heat dissipation device is well suitable for the current situation that the internal space of the electronic equipment is small.
Referring to fig. 3, a heat dissipation device for an electronic device according to a third embodiment of the present invention is composed of aheat conduction layer 301, amounting layer 302, and afilling layer 303, and is flat as a whole; the edges of theheat conduction layer 301 and themounting layer 302 are sealed to form a closed cavity, thefilling layer 303 is located in the closed cavity, and the surface of themounting layer 302, which is in contact with thefilling layer 303, is plated with ametal plating layer 304 which is made of the same material as theheat conduction layer 301 and is provided with aprotrusion 305.
Theheat conduction layer 301 is made of a high heat conduction metal plate, such as copper; thepacked layer 303 is primarily a liquid medium; the heat dissipation efficiency of the electronic equipment can be greatly improved by utilizing the characteristics of high heat conduction efficiency of the high heat conduction metal material and the liquid medium. Themounting layer 302 is fixedly connected to the electronic device, and specifically, a high-strength metal plate such as an alloy plate, for example, a stainless steel plate, a magnesium aluminum alloy plate, an aluminum alloy plate, or the like may be used; themounting layer 302 can also be directly selected from one of the inherent components of the metal middle frame, the shell and the like of the electronic device, so as to further reduce the space occupation of the device. Themetal plating layer 304 is made of the same material as theheat conduction layer 301, so that the potential difference between theheat conduction layer 301 and themounting layer 302 can be avoided, the loss of the heat dissipation device is reduced, and the performance of the heat dissipation device is ensured.
Theprotrusion 305 is arranged on the surface, in contact with thefilling layer 303, of themounting layer 302, one end of theprotrusion 305 is fixedly connected with themounting layer 302, and the other end of the protrusion is in contact with theheat conduction layer 301, so that theheat conduction layer 301 can be supported, theheat conduction layer 301 with low strength is prevented from bending and deforming, and the whole thickness of the heat dissipation device is prevented from being increased.
Specifically, theprotrusion 305 may be provided in the shape of a cylinder, a rectangular parallelepiped, or the like, as shown in fig. 4, which is a schematic cross-sectional view of a rectangular parallelepiped protrusion, and in fig. 5, which is a schematic cross-sectional view of a cylindrical protrusion.
With the above structure, the heat dissipation device provided by the embodiment of the invention has the advantages that the protrusion is arranged on the surface of the mounting layer, which is in contact with the filling layer, so that the bending deformation of the heat conduction layer caused by factors such as external force is avoided, the increase of the overall thickness of the heat dissipation device is avoided, the damage of the bending deformation to the heat dissipation device is reduced, and the service life of the heat dissipation device is prolonged.
Further, the filling layer in all the above embodiments further includes a capillary structure layer, and the liquid heat conducting medium is filled in a space of the capillary structure layer. The capillary structure layer can be foam metal, metal mesh tube core, etc. directly filled in the closed cavity formed by the heat conduction layer and the installation layer, or powder sintered tube core, groove tube core, etc. arranged on the surface of the heat conduction layer contacting with the filling layer. Filling the liquid heat-conducting medium in the space of the capillary structure layer to form a filling layer, so that the liquid heat-conducting medium is uniformly distributed in the filling layer, which is equivalent to the increased surface area of the filling layer; therefore, the heat dissipation efficiency of the heat dissipation device is further improved, the defect of poor heat conduction performance of the mounting layer is overcome, and the heat dissipation efficiency of the heat dissipation device is further improved.
The heat dissipation device provided by the invention is combined with structures such as a metal middle frame and a shell of a product, the problem that the traditional flat plate type heat pipe is difficult to install and fix is solved, and the actual occupied space is saved by about 50%. Due to the fact that the structural strength of the installation layer is greatly increased, the problem of bending deformation of the flat plate type hot plate is solved, the phenomenon that the performance of the flat plate type hot plate is reduced and even loses efficacy is avoided, and the application of the heat dissipation device in ultrathin electronic equipment becomes possible.
In particular, the edge sealing of the heat conductive layer and the mounting layer in all of the above embodiments includes conventional welding, gluing, ultrasonic welding and vapor deposition welding.
The embodiments are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same or similar parts among the embodiments are referred to each other.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (6)
1. A heat dissipation device for an electronic device, comprising: the heat conduction layer, the mounting layer and the filling layer;
the edges of the heat conduction layer and the mounting layer are sealed to form a closed cavity, and the filling layer is filled in the closed cavity; the heat conduction layer and the mounting layer are made of two different metals;
the heat conduction layer is made of a high-heat-conductivity metal material and is used for absorbing heat generated by the electronic equipment;
the mounting layer is made of high-strength metal materials and is used for being fixedly connected with the electronic equipment; one surface of the mounting layer, which is in contact with the filling layer, is plated with a metal plating layer made of the same material as the heat conduction layer;
the filling layer comprises a liquid heat-conducting medium;
the filling layer further comprises a capillary structure layer, and the liquid heat-conducting medium is filled in the space of the capillary structure layer.
2. The heat sink according to claim 1, wherein the high thermal conductivity metal material is copper.
3. The heat sink as claimed in claim 1, wherein the high strength metallic material is in particular stainless steel or a magnesium aluminum alloy or an aluminum alloy.
4. The heat dissipation device of claim 1, wherein the mounting layer is embodied as a housing or a metal bezel of the electronic device.
5. The heat dissipating device of claim 1, wherein a surface of the mounting layer in contact with the filler layer is provided with protrusions for supporting the heat conductive layer.
6. The heat sink of claim 1, wherein the edge sealing of the thermally conductive layer and the mounting layer comprises conventional welding, gluing, ultrasonic welding, and vapor deposition welding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310080229.6ACN104053335B (en) | 2013-03-13 | 2013-03-13 | Heat radiator for electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310080229.6ACN104053335B (en) | 2013-03-13 | 2013-03-13 | Heat radiator for electronic equipment |
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| Publication Number | Publication Date |
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| CN104053335A CN104053335A (en) | 2014-09-17 |
| CN104053335Btrue CN104053335B (en) | 2020-08-25 |
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| CN201310080229.6AActiveCN104053335B (en) | 2013-03-13 | 2013-03-13 | Heat radiator for electronic equipment |
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| EP4203636A4 (en)* | 2020-11-23 | 2024-02-28 | Samsung Electronics Co., Ltd. | HEAT DIFFUSION STRUCTURE AND ELECTRONIC DEVICE COMPRISING IT |
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| CN106941769B (en)* | 2016-11-16 | 2019-12-27 | 林进东 | Heat dissipation structural part with good comprehensive performance and preparation process thereof |
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| CN104053335A (en) | 2014-09-17 |
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