技术领域technical field
本主题一般涉及设计、操作并制造无线功率和/或数据发送和/或通信系统的方法、系统和设备，以及更具体地，涉及设计、操作并制造用于近场无线功率和/或数据发送和/或通信系统的高效结构。The subject matter relates generally to methods, systems and apparatus for designing, operating and manufacturing wireless power and/or data transmission and/or communication systems, and more particularly, to designing, operating and manufacturing wireless power and/or data transmission for near field and/or efficient structure of the communication system.
背景技术Background technique
近年来，采用近场无线功率和/或数据发送和/或通信系统的应用(如，商务电子、医疗系统、军事系统、高频变压器、包括纳米级功率和/或数据传递的微电子或其微机电系统(MEMS)、工业、科学、医疗(ISM)频带接收机、无线感测等)在获得优化性能方面受到限制，因为这些系统中使用的诸如天线(也称为谐振器)之类的无线技术组件具有相对较低的品质因数。In recent years, applications employing near-field wireless power and/or data transmission and/or communication systems (eg, commercial electronics, medical systems, military systems, high frequency transformers, microelectronics including nanoscale power and/or data transfer, or their Microelectromechanical systems (MEMS), industrial, scientific, medical (ISM) band receivers, wireless sensing, etc.) are limited in obtaining optimal performance because of the Wireless technology components have relatively low figures of merit.
这些无线技术组件的相对较低的品质因数主要由于被称为“趋肤效应”的现象所导致的较高电阻损耗。通常，趋肤效应是交变电流(AC)在导体内分布的趋势，使得电流密度在导体表面附近起主导作用，而其余导电体相对于电流‘未使用’。因为电流密度典型地随与导体表面相距的距离而衰减，所以其余导电体相对于电流‘未使用’。电流几乎全在表面附近流动，被称为“导体”的“趋肤”。电流距表面的深度被称为“趋肤深度(skin depth)”。“趋肤深度”定义了在发送和/或通信中活跃的电信号传导路径，而导体被定义为能够传导电信号的主体。The relatively low figure of merit of these wireless technology components is primarily due to higher resistive losses caused by a phenomenon known as the "skin effect". In general, the skin effect is the tendency of alternating current (AC) to be distributed within a conductor such that the current density dominates near the conductor surface, while the rest of the conductor is 'unused' relative to the current. Because the current density typically decays with distance from the conductor surface, the remaining conductors are 'unused' with respect to the current. The current flows almost entirely near the surface, known as the "skin" of the "conductor". The depth of the current from the surface is referred to as the "skin depth". "Skin depth" defines the electrical signal conduction paths that are active in transmission and/or communication, while a conductor is defined as a body capable of conducting electrical signals.
在采用无线功率和/或数据发送和/或通信的系统中，趋肤效应现象通常在电流流过在创建诸如天线、电路、集总元件(诸如电感器、电容器和电阻器之类)、或其任意组合的结构的过程中使用的引线(wire)时引起能量损耗。在高频的较高电阻损耗是大多数电子设备或装置面对的问题。趋肤效应在工作频率提高时变得更加普遍。随着频率变高，通常流经形成该结构的引线的整个横截面的电流变得局限于其表面。结果，引线的有效电阻与较细引线的有效电阻相类似，而不是与电流可以分布经过的实际直径的引线的有效电阻相类似。在低频针对有效性能表现出可容许电阻的引线在高频转变为具有不可接受的电阻的引线。从可容许电阻到不可接受的电阻的转变变换为低效的功率和/或数据发送和/或通信系统，无法传导在特定应用中所需要的电信号。因此，目前的无线系统和相关组件设计无法解决这些低效性，在一些情况下，加剧了其低效性。尽管不是穷举，受到当前的无线技术组件的限制的典型应用包括例如射频识别(RFID)、电池充电和再充电、遥感勘测、感测、通信、资产跟踪、患者监视、数据输入和/或检索等。这些系统组件过热、数据检索的速率和精度、能量传递的速率、发送距离约束和发送未对准限制是无线功率和/或数据发送和/或通信应用中的其他严峻问题。In systems employing wireless power and/or data transmission and/or communication, the skin effect phenomenon typically occurs when electrical current flows through the Energy loss is caused when wires are used in the process of any combination of structures. Higher resistive losses at high frequencies are a problem faced by most electronic devices or devices. The skin effect becomes more prevalent as the operating frequency increases. As the frequency becomes higher, the current typically flowing through the entire cross-section of the lead forming the structure becomes confined to its surface. As a result, the effective resistance of the lead is similar to that of a thinner lead, rather than to the effective resistance of a lead of the actual diameter through which the current can be distributed. Leads exhibiting acceptable resistance for effective performance at low frequencies transition to leads with unacceptable resistance at high frequencies. The transition from tolerable resistance to unacceptable resistance translates into an inefficient power and/or data transmission and/or communication system, unable to conduct the electrical signals required in a particular application. As a result, current wireless system and related component designs fail to address, and in some cases exacerbate, these inefficiencies. Although not exhaustive, typical applications limited by current wireless technology components include, for example, radio frequency identification (RFID), battery charging and recharging, telemetry, sensing, communications, asset tracking, patient monitoring, data entry and/or retrieval Wait. Overheating of these system components, rate and accuracy of data retrieval, rate of energy transfer, transmit distance constraints, and transmit misalignment limitations are other serious concerns in wireless power and/or data transmission and/or communications applications.
在植入医疗设备(IMD)的应用(如，起搏器、去纤颤器、神经调节或神经肌肉刺激设备)中，期望最小化电池再充电时间。例如，更快的电池再充电时间降低了患者不适、不便的持续时间和受伤的可能性。如果诸如包括集总元件的天线或电路之类的无线组件具有较少的电阻损耗，可以从相距更远的距离，并在不损害性能的情况下以对参与无线通信的设备的未对准或迷失方向更高的容许量实现电池再充电。已知难以实现精确定向和对准，尤其对于肥胖的患者。此外和/或可选地，如果可以在保持成功系统操作所需性能特性的同时设计并实际制造更小尺寸的结构，则可以减小IMD的整体尺寸。In implanted medical device (IMD) applications such as pacemakers, defibrillators, neuromodulation or neuromuscular stimulation devices, it is desirable to minimize battery recharge time. For example, faster battery recharge times reduce patient discomfort, duration of inconvenience and the potential for injury. If wireless components, such as antennas or circuits that include lumped elements, have less resistive losses, they can be used from longer distances without compromising performance due to misalignment or misalignment of devices participating in wireless communications. Higher tolerance for disorientation enables battery recharging. Accurate orientation and alignment is known to be difficult to achieve, especially for obese patients. Additionally and/or alternatively, the overall size of the IMD can be reduced if smaller sized structures can be designed and actually fabricated while maintaining the performance characteristics required for successful system operation.
在RFID应用(如，供应链管理、产品认证和资产跟踪)中，需要增大读取范围，提高读取速率，提高系统可靠性并提高系统精度。例如在高频，读取范围至多为三英尺，这对于货盘跟踪来说一般是不够的。超高频读取器实现了八到十英尺的更大的读取距离，然而它们引入了其他性能问题，如金属反射或水吸收信号、或显示不可读、在读取场中的盲点。增大的读取范围需要集中功率来促进反射回信号以获得更好的性能，因而更有效的结构会有助于解决这些问题。In RFID applications such as supply chain management, product authentication, and asset tracking, there is a need to increase read range, increase read rate, increase system reliability, and increase system accuracy. At high frequencies, for example, the read range is up to three feet, which is generally insufficient for pallet tracking. UHF readers enable greater read distances of eight to ten feet, however they introduce other performance issues, such as metal reflections or water absorbing signals, or display unreadable, blind spots in the read field. The increased read range requires concentrated power to facilitate reflected back signals for better performance, so more efficient structures would help address these issues.
在需要有效的低损耗线圈(需要在苛刻的条件下保持谐振)的应用中，传统的基于引线的组件会发生形变。公知的是，引线横截面的任何形变将会导致电特性(如，电感和可能的电阻)的改变，继而将会改变结构的谐振频率，并因而会增大整个系统的电阻。改进的制造减小危及形变的可能性的这些类型的结构的方法可以消除该问题。本教导包括制造包括精密引线结构设计和固定的灵活引线结构设计二者的方法。Traditional lead-based components are subject to deformation in applications that require efficient low-loss coils that maintain resonance under harsh conditions. It is well known that any deformation of the lead cross section will result in a change in electrical properties (eg inductance and possibly resistance) which in turn will change the resonant frequency of the structure and thus increase the resistance of the overall system. Improved methods of manufacturing these types of structures that reduce the likelihood of compromised deformation could eliminate this problem. The present teachings include methods of making flexible lead feature designs that include both precision lead feature designs and fixed lead feature designs.
在解决上述问题的尝试过程中，部分地发展了绞合线(Litz wire)。然而，绞合线一般不足以用于高频应用，因而在具有约3MHz以上工作频率的应用中一般不是很有用。绞合线是包括缠绕或编织成统一样式的多个单独的绝缘磁引线的引线，使得每股引线易于占据整个导体的横截面中的所有可能位置。该多股配置或绞合构造被设计用于最小化由于“趋肤效应”而导致的实心导体中表现的功率损耗。绞合线构造试图通过增大表面积的量而不显著增大导体尺寸来抵消该效应。然而，即使适合地构造，由于绞合成股的限制而导致绞合线仍表现出一些趋肤效应。意在用于较高频率范围的引线一般需要更多精细规格尺寸的股，而不是同样横截面面积但包括较少且较大股的绞合线。绞合线的提供商提供能够提高效率的配置的最高频率是大约3MHz。目前不存在针对工作频率在此3MHz最大频限以上的应用的解决方案。In an attempt to solve the above-mentioned problems, Litz wire was developed in part. However, stranded wire is generally not sufficient for high frequency applications and thus generally not very useful in applications with operating frequencies above about 3 MHz. A stranded wire is a lead that includes a plurality of individual insulated magnetic leads that are wound or braided in a uniform pattern such that each lead tends to occupy all possible positions throughout the conductor's cross-section. This stranded or twisted configuration is designed to minimize the power losses exhibited in solid conductors due to the "skin effect". Litz wire construction attempts to counteract this effect by increasing the amount of surface area without significantly increasing the conductor size. However, even properly constructed, the stranded wire exhibits some skin effect due to the limitation of twisting strands. Lead wires intended for higher frequency ranges generally require more fine gauge sized strands than stranded wire of the same cross-sectional area but comprising fewer and larger strands. The highest frequency at which providers of stranded wire offer configurations that improve efficiency is about 3MHz. There is currently no solution for applications operating above this 3MHz maximum frequency limit.
因而，需要改进的高效引线设计和减小引线自身和使用该引线创建的组件结构二者的本征电阻损耗、尤其在高频减小本征电阻损耗以实现高品质因数的制造方法。Thus, there is a need for improved high-efficiency lead designs and fabrication methods that reduce intrinsic resistive losses both in the leads themselves and in component structures created using the leads, especially at high frequencies to achieve high figures of merit.
发明内容SUMMARY OF THE INVENTION
这里的教导通过利用多层引线概念增大结构内的电导面积，缓解了导致较低品质因数的在高频的较高电阻损耗的一个或多个上述问题。多层引线配置是在一个或多个频率处减小承载时变电流的传导互连的电阻的基本构建块。这样，本发明的多层引线配置导致了导体损耗的减小和结构的品质因数的提高。本教导应用于针对近场能量传递、功率传递、数据传递或其组合的无线发送和/或通信。更具体地，本教导应用于针对近场能量网络、功率网络或数据网络(包括这些网络的任一和全部组合)的无线发送和/或通信。此外，本教导应用于针对近场能量应用的无线发送和/或通信的各种组件，其中在例如但不限于平面倒F天线(PIFA)及其衍生物、矩形微带天线或贴片天线及其衍生物、超宽带(UWB)结构、单极结构、蝶形天线等或其任意组合之类的任意结构中，针对电路中两点之间的互连、电路中的组件(例如但不限于电感器、电容器和电阻器或其任意组合)中使用的线圈、用于但不限于天线、谐振器等中的线圈，寻求能量损耗的降低。The teachings herein alleviate one or more of the above-described problems of higher resistive losses at high frequencies resulting in lower figures of merit by increasing the conductive area within the structure using the multi-layer lead concept. Multilayer lead configurations are fundamental building blocks for reducing the resistance of conductive interconnects carrying time-varying currents at one or more frequencies. Thus, the multilayer lead configuration of the present invention results in a reduction in conductor losses and an improvement in the quality factor of the structure. The present teachings apply to wireless transmission and/or communication for near-field energy transfer, power transfer, data transfer, or combinations thereof. More specifically, the present teachings apply to wireless transmission and/or communication for near-field energy networks, power networks, or data networks, including any and all combinations of these networks. Furthermore, the present teachings apply to various components for wireless transmission and/or communication for near-field energy applications, in applications such as, but not limited to, planar inverted-F antennas (PIFAs) and derivatives thereof, rectangular microstrip or patch antennas, and In any structure such as its derivatives, ultra-wideband (UWB) structure, monopole structure, butterfly antenna, etc., or any combination thereof, for the interconnection between two points in the circuit, the components in the circuit (such as but not limited to Coils used in inductors, capacitors and resistors, or any combination thereof), coils used in, but not limited to, antennas, resonators, etc., seek to reduce energy loss.
无线能量传递或无线功率发送是无需互连引线的、从功率源到电负载的电能发送。对于能量、功率或数据的无线发送，效率是重要参数，因为发送信号必须到达一个或多个接收机以实现系统应用。使用谐振磁感应跟随的直接感应来执行涉及能量、功率或数据传递的最常见形式的无线发送。目前所考虑的其他方法包括电磁辐射。Wireless energy transfer or wireless power transmission is the transmission of electrical energy from a power source to an electrical load without interconnecting leads. For wireless transmission of energy, power or data, efficiency is an important parameter because the transmitted signal must reach one or more receivers for system applications. The most common forms of wireless transmission involving energy, power or data transfer are performed using direct induction followed by resonant magnetic induction. Other methods currently under consideration include electromagnetic radiation.
此外，无线能量接收或无线功率接收是无需互连引线的、从功率源接收电能量。对于能量、功率或数据的无线接收，效率是重要参数，因为信号的接收必须从一个或多个发射机接收以实现系统应用。这样，可以使用直接感应、谐振磁感应以及电磁辐射来执行包括能量、功率或数据的形式的无线接收。Furthermore, wireless energy reception or wireless power reception is the receipt of electrical energy from a power source without interconnecting leads. Efficiency is an important parameter for wireless reception of energy, power or data, since the reception of signals must be received from one or more transmitters to achieve system applications. In this way, wireless reception in the form of energy, power or data can be performed using direct induction, resonant magnetic induction, and electromagnetic radiation.
此外，本发明的实施例能够无需引线进行电能、电功率和/或数据的无线通信。无线通信包括同步或独立的电能、电功率和/或数据的发送和/或接收。Furthermore, embodiments of the present invention enable wireless communication of electrical energy, electrical power, and/or data without the need for wires. Wireless communications include synchronized or independent transmission and/or reception of electrical energy, electrical power, and/or data.
本教导的一方面是一种用于无线功率和/或数据传递或接收的使用多层引线概念创建的谐振器，其中通过将引线横截面中的有用导体横截面面积最大化来将谐振器内的电阻损耗最小化。在一个实施例中，谐振器通过在其引线内引入非传导介电层，以产生包括传导(conducting)材料层与非传导材料层交替的结构，来减小不必要的高频趋肤效应。所述多层引线结构有效地提供了增大数量的表面，每个表面具有其特征趋肤深度，并且所有表面电连接。趋肤深度的范围可以是从导体深度(conductor depth)的近似一半到大约等于导体深度。导体深度的范围可以是趋肤深度到趋肤深度的两倍。然而，取决于可用技术、成本和应用，导体深度可以是趋肤深度的二十倍或更多倍。One aspect of the present teachings is a resonator for wireless power and/or data transfer or reception created using a multi-layer lead concept, wherein the internal resonator is created by maximizing the useful conductor cross-sectional area in the lead cross-section resistive losses are minimized. In one embodiment, the resonator reduces unwanted high frequency skin effect by introducing a non-conducting dielectric layer within its leads to create a structure comprising alternating layers of conducting and non-conducting material. The multilayer lead structure effectively provides an increased number of surfaces, each surface having its characteristic skin depth, and all of which are electrically connected. The skin depth may range from approximately half the conductor depth to approximately equal to the conductor depth. The conductor depth can range from skin depth to twice the skin depth. However, the conductor depth may be twenty or more times the skin depth, depending on available technology, cost and application.
谐振器包括具有至少一匝的引线线圈，其中引线线圈由多层引线构成。多层引线可以包括由绝缘材料层分离的第一和第二导电层。导电(conductive)层可以具有基本相同的厚度和/或深度，其中所述厚度和/或深度的范围可以是从趋肤深度到趋肤深度的两倍。然而，取决于可用技术、成本和应用，导体厚度和/或深度可以是趋肤深度的二十倍或更多倍。每个导电层可以使用至少一种互连方法(例如但不限于孔、焊料、接头、引线、引脚或铆钉)彼此电连接。The resonator includes a lead coil having at least one turn, wherein the lead coil is composed of multiple layers of lead. The multilayer lead may include first and second conductive layers separated by layers of insulating material. The conductive layers may have substantially the same thickness and/or depth, wherein the thickness and/or depth may range from skin depth to twice the skin depth. However, the conductor thickness and/or depth may be twenty or more times the skin depth, depending on available technology, cost, and application. Each conductive layer may be electrically connected to each other using at least one interconnection method such as, but not limited to, holes, solder, tabs, leads, pins, or rivets.
非传导层的一个目的是使两个不同的传导层绝缘。非传导层的最基本设计在理想情况下是与制造过程实际允许的一样薄，但仍提供足够的绝缘特性。例如，在PCB技术中，通过“芯材厚度”和“半固化片厚度”来指示层的厚度。在另一设计中，选择非传导层的厚度来修改结构的电气行为。One purpose of the non-conductive layer is to insulate two different conductive layers. The most basic design for a non-conductive layer is ideally as thin as the manufacturing process actually allows, but still provide adequate insulating properties. For example, in PCB technology, the thickness of a layer is indicated by "core thickness" and "prepreg thickness". In another design, the thickness of the non-conductive layer is chosen to modify the electrical behavior of the structure.
谐振器可以具有大于100的品质因数。优选地，品质因数大于300。更优选地，品质因数大于600。本领域技术人员将会显而易见的是，需要两个谐振器的系统可以具有有相等且甚至相似品质因数的谐振器。此外，本领域技术人员将会显而易见的是，需要两个谐振器的系统可以利用这样的谐振器，其中一个谐振器具有基本与另一个谐振器不同的品质因数。每个谐振器的品质因数选择将取决于应用、每个谐振器的设计规范和每个谐振器的意向使用。将会理解，传统电感耦合的系统利用具有品质因数大约30的谐振器。此外，本领域技术人员将会显而易见的是，谐振器的品质因数可以取决于所使用的环境，因而例如在空气中具有品质因数100的谐振器在植入人类或动物组织时可能仅具有50的品质因数。在任意给定环境中，这里描述的多层引线结构应优于传统谐振器。The resonator may have a quality factor greater than 100. Preferably, the figure of merit is greater than 300. More preferably, the figure of merit is greater than 600. It will be apparent to those skilled in the art that systems requiring two resonators may have resonators with equal and even similar quality factors. Furthermore, it will be apparent to those skilled in the art that systems requiring two resonators may utilize resonators, one of which has a substantially different quality factor than the other. The choice of quality factor for each resonator will depend on the application, the design specifications of each resonator, and the intended use of each resonator. It will be appreciated that conventional inductively coupled systems utilize resonators having a quality factor of about 30. Furthermore, it will be apparent to those skilled in the art that the quality factor of the resonator may depend on the environment in which it is used, so for example a resonator with a quality factor of 100 in air may only have a quality factor of 50 when implanted in human or animal tissue Quality factor. In any given environment, the multilayer lead structures described here should outperform conventional resonators.
因而，多层引线中损耗的降低和谐振器显著减小的内部电阻可以实现高效的、扩展范围的、消耗更少能量、具有更长运行时间并简化操作的紧凑无线系统，而不会产生诸如过热之类的危害事件。Thus, the reduction of losses in the multilayer leads and the significantly reduced internal resistance of the resonator can enable efficient, extended range, compact wireless systems that consume less energy, have longer runtimes, and simplify operation without creating problems such as Hazardous events such as overheating.
在一个示例中，公开了一种用于无线发送或无线接收的使用多层引线概念创建的结构。所述结构被设计用于无线发送和/或接收电能量、电磁能量和/或电功率。此外，所述结构能够实现电子数据发送。此外，所述结构能够一起发送和/或接收或分离地发送和/或接收电能量、电磁能量、电功率和电子数据的组合。In one example, a structure created using a multi-layer lead concept for wireless transmission or wireless reception is disclosed. The structure is designed to wirelessly transmit and/or receive electrical energy, electromagnetic energy and/or electrical power. Furthermore, the structure enables electronic data transmission. Furthermore, the structures are capable of transmitting and/or receiving electrical energy, electromagnetic energy, electrical power, and a combination of electronic data together or separately.
所述结构可以包括：多个导体层；分离每个导体层的绝缘体层；以及连接两个或更多个导体层的至少一个连接体。多个导体层中的每一个可以具有至少一匝，并且还可以以平行朝向放置。可以由导电(electrically conductive)材料形成每个导体层。导电材料可以包括铜、钛、铂和铂/铱合金、钽、铌、锆、铪、镍钛合金(nitinol)、Co-Cr-Ni合金、不锈钢、金、金合金、钯、碳、银、贵金属、或生物相容材料及其任意组合。导体层可以具有例如但不限于圆形横截面、矩形横截面、方形横截面、三角形横截面或椭圆形横截面的横截面形状。连接导体层的连接体可以是但不限于孔、焊料、接头、引线、引脚或铆钉。The structure may include: a plurality of conductor layers; an insulator layer separating each conductor layer; and at least one connector connecting two or more conductor layers. Each of the plurality of conductor layers may have at least one turn, and may also be placed in a parallel orientation. Each conductor layer may be formed of an electrically conductive material. Conductive materials may include copper, titanium, platinum and platinum/iridium alloys, tantalum, niobium, zirconium, hafnium, nitinol, Co-Cr-Ni alloys, stainless steel, gold, gold alloys, palladium, carbon, silver, Precious metals, or biocompatible materials, and any combination thereof. The conductor layer may have a cross-sectional shape such as, but not limited to, a circular cross-section, a rectangular cross-section, a square cross-section, a triangular cross-section, or an oval cross-section. The connecting bodies connecting the conductor layers may be, but not limited to, holes, solders, joints, leads, pins or rivets.
所述结构可以具有例如但不限于圆形螺线管形配置、方形螺线管形配置、圆形螺旋形配置、方形螺旋形配置、矩形配置、三角形配置、圆形螺旋-螺线管形配置、方形螺旋-螺线管形配置和共形螺线管形配置的结构形状。其他配置可以用于修改该结构的电特性。The structures may have, for example, but not limited to, a circular solenoid configuration, a square solenoid configuration, a circular helical configuration, a square helical configuration, a rectangular configuration, a triangular configuration, a circular helical-solenoid configuration , Structural shapes for square helical-solenoid configurations and conformal solenoid configurations. Other configurations can be used to modify the electrical properties of the structure.
当在一频率上在谐振器中感生电信号时，可以减小结构中的电阻。可以从大约1MHz到10GHz的频率范围内选择该频率。此外，该频率可以是从大约1MHz到大约10GHz的频带或在大约1MHz到大约10GHz的范围内。电信号可以是电流、电压、数字数据信号或其任意组合。还可以从大约100kHz到大约10GHz的频率范围内选择该频率。此外，该频率可以是从大约100kHz到大约10GHz的频带或在大约100kHz到大约10GHz的范围内。When an electrical signal is induced in the resonator at a frequency, the resistance in the structure can be reduced. This frequency can be selected from a frequency range of approximately 1 MHz to 10 GHz. Furthermore, the frequency may be in the frequency band from about 1 MHz to about 10 GHz or in the range of about 1 MHz to about 10 GHz. The electrical signals can be currents, voltages, digital data signals, or any combination thereof. The frequency can also be selected from a frequency range of about 100 kHz to about 10 GHz. Furthermore, the frequency may be in the frequency band from about 100 kHz to about 10 GHz or in the range of about 100 kHz to about 10 GHz.
在另一示例中，公开了一种用于无线发送或无线接收的谐振器。使用多层引线概念设计所述谐振器，以无线发送和/或接收电能量、电磁能量和电功率。此外，所述谐振器能够实现电子数据的发送或接收。此外，所述谐振器能够一起发送和/或接收或分离地发送和/或接收电能量、电磁能量、电功率和电子数据的组合。In another example, a resonator for wireless transmission or wireless reception is disclosed. The resonator is designed using a multi-layer lead concept to wirelessly transmit and/or receive electrical energy, electromagnetic energy and electrical power. Furthermore, the resonator enables the transmission or reception of electronic data. Furthermore, the resonators are capable of transmitting and/or receiving together or separately transmitting and/or receiving a combination of electrical energy, electromagnetic energy, electrical power and electronic data.
所述谐振器可以包括多个导体，每个导体具有导体长度、导体高度、导体深度、和在特定工作频率具有特定趋肤深度的导电表面。趋肤深度的范围可以是从导体深度的近似一半到大约等于导体深度。导体深度的范围可以是趋肤深度到趋肤深度的两倍。然而，取决于可用技术、成本和应用，导体深度可以是趋肤深度的二十倍或更多倍。多个导体层可以具有至少一匝。此外，多个导体层中的每一个可以具有或可以不具有基本相同的导体长度、导体高度或导体深度。可以由导电材料形成导体层。导电材料可以包括铜、钛、铂和铂/铱合金、钽、铌、锆、铪、镍钛合金、Co-Cr-Ni合金、不锈钢、金、金合金、钯、碳、银、贵金属、或生物相容材料及其任意组合。The resonator may include a plurality of conductors, each conductor having a conductor length, a conductor height, a conductor depth, and a conductive surface having a particular skin depth at a particular operating frequency. The skin depth may range from approximately half the conductor depth to approximately equal to the conductor depth. The conductor depth can range from skin depth to twice the skin depth. However, the conductor depth may be twenty or more times the skin depth, depending on available technology, cost and application. The plurality of conductor layers may have at least one turn. Furthermore, each of the plurality of conductor layers may or may not have substantially the same conductor length, conductor height, or conductor depth. The conductor layer may be formed of a conductive material. Conductive materials may include copper, titanium, platinum and platinum/iridium alloys, tantalum, niobium, zirconium, hafnium, nitinol, Co-Cr-Ni alloys, stainless steel, gold, gold alloys, palladium, carbon, silver, precious metals, or Biocompatible materials and any combination thereof.
多个导体可以被布置为形成谐振器主体。谐振器主体可以具有谐振器主体长度、谐振器主体宽度和谐振器主体深度。当通过谐振器主体感生电信号时，电信号通过传导表面传播。电信号可以是电流、电压、数字数据信号或其任意组合。A plurality of conductors may be arranged to form the resonator body. The resonator body may have a resonator body length, a resonator body width, and a resonator body depth. When an electrical signal is induced through the resonator body, the electrical signal propagates through the conducting surface. The electrical signals can be currents, voltages, digital data signals, or any combination thereof.
谐振器中的多个导体可以包括通过绝缘体层分离的第一导体层和第二导体层，其中第一导体层通过至少一个连接体与第二导体层或更多导体层连接。导体可以具有例如但不限于圆形横截面、矩形横截面、方形横截面、三角形横截面或椭圆形横截面的横截面形状。所述谐振器可以具有例如但不限于圆形螺线管形、方形螺线管形配置、圆形螺旋形配置、方形螺旋形配置、矩形配置、三角形配置、圆形螺旋-螺线管形配置、方形螺旋-螺线管形配置或共形螺线管形配置的结构形状。The plurality of conductors in the resonator may include a first conductor layer and a second conductor layer separated by an insulator layer, wherein the first conductor layer is connected to the second conductor layer or more conductor layers by at least one connector. The conductors may have cross-sectional shapes such as, but not limited to, circular cross-sections, rectangular cross-sections, square cross-sections, triangular cross-sections, or elliptical cross-sections. The resonator may have, for example, but not limited to, a circular solenoid, a square solenoid configuration, a circular helical configuration, a square helical configuration, a rectangular configuration, a triangular configuration, a circular helix-solenoid configuration , a square helical-solenoid configuration or a structural shape of a conformal solenoid configuration.
还公开了一种用于无线发送或无线接收的使用多层引线概念创建的电路。所述电路被设计用于无线发送和/或接收电能量、电磁能量和/或电功率。此外，所述电路能够实现电子数据的发送。此外，所述电路能够一起发送和/或接收或分离地发送和/或接收电能量、电磁能量、电功率和电子数据的组合。Also disclosed is a circuit created using the multi-layer lead concept for wireless transmission or wireless reception. The circuit is designed to wirelessly transmit and/or receive electrical energy, electromagnetic energy and/or electrical power. Furthermore, the circuit enables the transmission of electronic data. Furthermore, the circuits are capable of transmitting and/or receiving together or separately a combination of electrical energy, electromagnetic energy, electrical power and electronic data.
处于高频的电路广泛地使用无源元件，如电感器、电容器等。这种电路配置的一些示例包括但不限于带通、高通和低通滤波器；混频器电路(例如，Gilbert单元)；诸如Colpitts、Pierce、Hartley和Clap之类的振荡器；以及诸如差分、推拉、反馈和射频(RF)之类的放大器。具体地，电感器作为源负反馈元件也用于低噪放电器(LNA)中的匹配和反馈。集总电感器也是RF电路和单片微波集成电路(MMIC)中的关键元件。集总电感器用于片上匹配网络，其中传输线结构可以具有过度的长度。通常，它们也用作RF扼流圈，允许将偏置电流提供给电路，同时在RF频率及以上提供宽带高阻抗。对于可重配置网络、天线和子系统来说是理想的RF MEMS开关、匹配网络和变容二极管也需要高Q电感器。注意，无源电路元件和诸如集总电感器之类的集总元件可以互换使用，无源电路元件是更广义的术语。无源电路元件可以是全部使用多层引线创建的电感器、电容器、电阻器，或无源电路元件可以只是多层引线。在几乎所有上述非限制性电路示例中，期望无源组件是最低损耗的。Circuits at high frequencies make extensive use of passive components such as inductors, capacitors, and the like. Some examples of such circuit configurations include, but are not limited to, bandpass, highpass, and lowpass filters; mixer circuits (eg, Gilbert cells); oscillators such as Colpitts, Pierce, Hartley, and Clap; Amplifiers such as push-pull, feedback, and radio frequency (RF). Specifically, inductors are also used as source degeneration elements for matching and feedback in low noise arresters (LNAs). Lumped inductors are also key components in RF circuits and monolithic microwave integrated circuits (MMICs). Lumped inductors are used for on-chip matching networks where transmission line structures can have excessive lengths. Often, they are also used as RF chokes, allowing bias current to be supplied to the circuit while providing broadband high impedance at RF frequencies and above. RF MEMS switches, matching networks and varactors that are ideal for reconfigurable networks, antennas and subsystems also require high-Q inductors. Note that passive circuit elements and lumped elements such as lumped inductors are used interchangeably, passive circuit element being a broader term. Passive circuit elements can be inductors, capacitors, resistors all created using multilayer leads, or passive circuit elements can be just multilayer leads. In almost all of the above non-limiting circuit examples, passive components are expected to be the lowest loss.
假定处于高频的电路过度地使用诸如电感器和电容器之类的无源元件，给出使用多层引线概念创建的电感器的实施例，但不限于此。具体地，考虑到电感器，引线结构设计应当使得获得最大Q，同时获得期望的电感值。换言之，需要最小化电感器中的电阻损耗。取决于工作频率、基板上的可用面积、应用和技术，电感器可以实现为TEM/传输线、导电环或多个形状(例如但不限于，圆形、矩形、椭圆形、方形或不规则配置)的螺旋形/螺线管形/组合结构，但不限于此。可以使用本发明中的多层结构来实现所有这些非限制性实施例。Given that circuits at high frequencies use excessively passive components such as inductors and capacitors, an example of an inductor created using the multi-layer lead concept is given, but not limited thereto. Specifically, considering the inductor, the lead structure design should be such that the maximum Q is obtained while obtaining the desired inductance value. In other words, resistive losses in the inductor need to be minimized. Depending on the operating frequency, available area on the substrate, application, and technology, inductors can be implemented as TEM/transmission lines, conductive loops, or multiple shapes (such as, but not limited to, circular, rectangular, oval, square, or irregular configurations) The helical/solenoid/combination structure, but not limited to this. All of these non-limiting embodiments can be implemented using the multilayer structures of the present invention.
在另一示例中，讨论使用多层引线概念创建的谐振器，作为更大电路的一部分。谐振器是在一个或多个特定频率或一个或多个频带(称为谐振频率)表现出谐振(即，振荡)的器件或系统。在一个或多个谐振频率或一个或多个频带处，存在振荡的最小阻抗。在电路的上下文中，在一个或多个谐振频率或一个或多个频带处存在最小电阻抗。本发明的多层引线结构在两个基本条件下可以用作谐振器：(1)当在其不具有任何附加电子组件的环境中设计多层引线结构以在一个或多个特定频率或一个或多个频带处谐振时；(2)当在其结合其他组件(例如但不限于，电容器、电容器组、电容器和/或电感器网络)的环境中设计多层引线结构以在一个或多个特定频率或一个或多个频带处谐振时。因此，谐振器可以是更大电路的一部分，谐振器行为可以被设计为在一个或多个频率或一个或多个频带处、或具有一个或多个特定带宽的一个或多个频率或一个或多个频带处发生。也可以添加传统的或使用多层引线概念创建的附加组件(例如，电阻器)以改变带宽。对于本领域技术人员显而易见的是，可以结合使用多层引线概念创建的无线技术组件，使用任一传统无线技术组件，以针对这些无线应用获得所需效率和性能。In another example, a resonator created using the multi-layer lead concept is discussed as part of a larger circuit. A resonator is a device or system that exhibits resonance (ie, oscillation) at one or more specific frequencies or one or more frequency bands (referred to as resonant frequencies). At one or more resonant frequencies or one or more frequency bands, there is a minimum impedance for oscillation. In the context of a circuit, a minimum electrical impedance exists at one or more resonant frequencies or one or more frequency bands. The multilayer lead structure of the present invention can be used as a resonator under two basic conditions: (1) when the multilayer lead structure is designed in an environment where it does not have any additional electronic components to operate at one or more specific frequencies or one or more When resonating at multiple frequency bands; (2) when designing a multilayer lead structure in its environment in combination with other components (such as, but not limited to, capacitors, capacitor banks, capacitors and/or inductor networks) to Resonance at a frequency or at one or more frequency bands. Thus, a resonator can be part of a larger circuit, and the resonator behavior can be designed to behave at one or more frequencies or one or more frequency bands, or at one or more frequencies or one or more specific bandwidths Occurs at multiple frequency bands. Additional components (eg, resistors), traditional or created using the multi-layer lead concept, can also be added to vary the bandwidth. It will be apparent to those skilled in the art that any conventional wireless technology component can be used in conjunction with wireless technology components created using the multi-layer lead concept to achieve the desired efficiency and performance for these wireless applications.
还公开了一种用于无线发送或无线接收的系统，其中使用多层引线概念创建系统的组件。所述系统被设计为无线发送和/或接收电能量、电磁能量和电功率。此外，所述系统能够实现电子数据的发送。此外，所述系统能够一起发送或分离地发送电能量、电磁能量、电功率和电子数据的组合。Also disclosed is a system for wireless transmission or wireless reception, wherein the components of the system are created using a multi-layer lead concept. The system is designed to wirelessly transmit and/or receive electrical energy, electromagnetic energy and electrical power. Furthermore, the system enables the transmission of electronic data. Furthermore, the system can transmit a combination of electrical energy, electromagnetic energy, electrical power, and electronic data together or separately.
所述系统可以包括：第一谐振器，所述第一谐振器包括多个第一导体，每个第一导体具有第一导体长度、第一导体高度、第一导体深度、和具有第一趋肤深度的第一导电表面。多个第一导体可以被布置以形成具有第一谐振器主体长度、第一谐振器主体宽度和第一谐振器主体深度的第一谐振器主体。所述系统还可以包括第二谐振器，所述第二谐振器包括多个第二导体，每个第二导体具有第二导体长度、第二导体高度、第二导体深度、和具有第二趋肤深度的第二导电表面。多个第二导体可以被布置以形成具有第二谐振器主体长度、第二谐振器主体宽度和第二谐振器主体深度的第二谐振器主体。第一趋肤深度和第二趋肤深度可以是导体深度的近似一半到大约等于导体深度。第一和第二导体可以具有至少一匝，多个第一和第二导体层中的每一个可以具有或可以不具有基本相同的导体长度、导体高度或导体深度。第一导体深度和第二导体深度的范围可以是趋肤深度到趋肤深度的两倍。然而，取决于可用技术、成本和应用，第一导体深度和第二导体深度可以是趋肤深度的二十倍或更多倍。可以由导电材料形成第一和第二导体层，导电材料是例如但不限于铜、钛、铂和铂/铱合金、钽、铌、锆、铪、镍钛合金、Co-Cr-Ni合金、不锈钢、金、金合金、钯、碳、银、贵金属、或生物相容材料及其任意组合。The system may include a first resonator including a plurality of first conductors, each first conductor having a first conductor length, a first conductor height, a first conductor depth, and a first tendency skin depth of the first conductive surface. The plurality of first conductors may be arranged to form a first resonator body having a first resonator body length, a first resonator body width, and a first resonator body depth. The system may also include a second resonator including a plurality of second conductors, each second conductor having a second conductor length, a second conductor height, a second conductor depth, and a second tendency. skin-depth second conductive surface. The plurality of second conductors may be arranged to form a second resonator body having a second resonator body length, a second resonator body width, and a second resonator body depth. The first skin depth and the second skin depth may be approximately half to approximately equal to the conductor depth. The first and second conductors may have at least one turn, and each of the plurality of first and second conductor layers may or may not have substantially the same conductor length, conductor height, or conductor depth. The first conductor depth and the second conductor depth may range from skin depth to twice the skin depth. However, the first conductor depth and the second conductor depth may be twenty or more times the skin depth, depending on available technology, cost, and application. The first and second conductor layers may be formed from conductive materials such as, but not limited to, copper, titanium, platinum and platinum/iridium alloys, tantalum, niobium, zirconium, hafnium, nickel titanium alloys, Co-Cr-Ni alloys, Stainless steel, gold, gold alloys, palladium, carbon, silver, precious metals, or biocompatible materials and any combination thereof.
当电信号传播通过第一谐振器主体时，电信号传播通过第一传导表面，还感生通过第二谐振器主体的电信号。感生的电信号传播通过第二传导表面。电信号可以是电流、电压和数字数据信号或其组合。When an electrical signal propagates through the first resonator body, the electrical signal propagates through the first conductive surface and also induces an electrical signal through the second resonator body. The induced electrical signal propagates through the second conductive surface. The electrical signals may be current, voltage and digital data signals or combinations thereof.
多个第一导体可以包括通过绝缘层分离的第一导体层和第二导体层，其中第一导体层通过至少一个连接体与第二导体层或更多导体层连接。连接导体层的连接体可以是例如但不限于孔、焊料、接头、引线、引脚或铆钉。第一导体可以具有第一横截面形状，以及第二导体可以具有第二横截面形状。第一和第二横截面形状是非限制性的，并且可以是圆形横截面、矩形横截面、方形横截面、三角形横截面或椭圆形横截面之一。The plurality of first conductors may include a first conductor layer and a second conductor layer separated by an insulating layer, wherein the first conductor layer is connected to the second conductor layer or more conductor layers by at least one connecting body. The connecting bodies connecting the conductor layers may be, for example but not limited to, holes, solders, joints, leads, pins or rivets. The first conductor may have a first cross-sectional shape, and the second conductor may have a second cross-sectional shape. The first and second cross-sectional shapes are non-limiting and can be one of a circular cross-section, a rectangular cross-section, a square cross-section, a triangular cross-section, or an oval cross-section.
第一谐振器可以具有第一结构形状，以及第二谐振器可以具有第二结构形状。第一和第二结构形状是非限制性的，并且可以是圆形螺线管形配置、方形螺线管形配置、圆形螺旋形配置、方形螺旋形配置、矩形配置、三角形配置、圆形螺旋-螺线管形配置、方形螺旋-螺线管形配置或共形螺线管形配置。The first resonator may have a first structural shape, and the second resonator may have a second structural shape. The first and second structural shapes are non-limiting and may be a circular solenoid configuration, a square solenoid configuration, a circular helical configuration, a square helical configuration, a rectangular configuration, a triangular configuration, a circular helix - Solenoid configuration, square helix - solenoid configuration or conformal solenoid configuration.
在另一示例中，公开了一种包括多个导体层的结构，包括将每个导体层分离的绝缘体层。当在一频率处电信号传播通过导体层时，电阻是可减小的。In another example, a structure is disclosed that includes a plurality of conductor layers, including an insulator layer separating each conductor layer. The resistance can be reduced when an electrical signal propagates through the conductor layer at a frequency.
可选地，导体层可以是导电引线、导电带、导电条或沉积金属。导体可以包括连接两个或更多个导体层的连接体。连接体可以是焊料、接头、引线、引脚和铆钉。Alternatively, the conductor layers may be conductive leads, tapes, strips or deposited metal. The conductors may include connectors connecting two or more conductor layers. Connectors can be solder, joints, leads, pins and rivets.
可选地，所述频率可以在大约100kHz到大约3MHz的范围内。频率还可以在大约3MHz到大约10GHz的范围内。所述频率可以在大约100kHz到大约3MHz范围内的频带中。所述频率可以在大约3MHz到大约10GHz范围内的频带中。所述频率还可以在大约100kHz到大约10GHz的频率范围内。所述频率还可以是在大约100kHz到大约10GHz范围内的频带。Alternatively, the frequency may be in the range of about 100 kHz to about 3 MHz. The frequency may also be in the range of about 3 MHz to about 10 GHz. The frequency may be in a frequency band in the range of about 100 kHz to about 3 MHz. The frequency may be in a frequency band in the range of about 3 MHz to about 10 GHz. The frequency may also be in the frequency range of about 100 kHz to about 10 GHz. The frequency may also be a frequency band in the range of about 100 kHz to about 10 GHz.
可选地，所述多个导体层可以以平行朝向放置。多个导体层可以并联电连接。并联电连接的多个导体层可以与并联电连接的第二多个导体层串联电连接。Optionally, the plurality of conductor layers may be placed in a parallel orientation. A plurality of conductor layers may be electrically connected in parallel. The plurality of conductor layers electrically connected in parallel may be electrically connected in series with the second plurality of conductor layers electrically connected in parallel.
可选地，电信号可以是能量信号、功率信号和数据信号中的至少一个。电信号可以是电流、电压和数字数据信号中的至少一个。所述结构可以具有大于100的品质因数。Optionally, the electrical signal may be at least one of an energy signal, a power signal and a data signal. The electrical signal may be at least one of a current, a voltage, and a digital data signal. The structure may have a quality factor greater than 100.
可选地，所述结构可以具有包括圆形横截面、矩形横截面、方形横截面、三角形横截面和椭圆形横截面中的至少一个的横截面形状。所述结构可以具有包括圆形螺线管形配置、方形螺线管形配置、圆形螺旋形配置、方形螺旋形配置、矩形配置、三角形配置、圆形螺旋-螺线管形配置、方形螺旋-螺线管形配置和共形螺线管形配置中的至少一个的结构形状。多个导体层可以具有至少一匝。Alternatively, the structure may have a cross-sectional shape comprising at least one of a circular cross-section, a rectangular cross-section, a square cross-section, a triangular cross-section, and an oval cross-section. The structure may have a configuration including a circular solenoid, a square solenoid, a circular helical, a square helical, a rectangular configuration, a triangular configuration, a circular helix-solenoid, a square helix - the structural shape of at least one of a solenoid-shaped configuration and a conformal solenoid-shaped configuration. The plurality of conductor layers may have at least one turn.
可选地，可以由导电材料形成导体层。导电材料可以是铜、钛、铂和铂/铱合金、钽、铌、锆、铪、镍钛合金、Co-Cr-Ni合金、不锈钢、金、金合金、钯、碳、银、贵金属、或生物相容材料。Alternatively, the conductor layer may be formed of a conductive material. The conductive material may be copper, titanium, platinum and platinum/iridium alloys, tantalum, niobium, zirconium, hafnium, nitinol, Co-Cr-Ni alloys, stainless steel, gold, gold alloys, palladium, carbon, silver, precious metals, or Biocompatible material.
可选地，可以由电绝缘材料形成绝缘体层。电绝缘材料可以是空气、泡沫聚苯乙烯、二氧化硅、适合的生物相容陶瓷或具有低介电常数的任意类似电介质、具有高介电常数的非导电电介质或铁氧体材料。Alternatively, the insulator layer may be formed from an electrically insulating material. The electrically insulating material can be air, styrofoam, silica, a suitable biocompatible ceramic or any similar dielectric with a low dielectric constant, a non-conductive dielectric with a high dielectric constant, or a ferrite material.
可选地，所述结构可以包括在具有谐振器、天线、RFID标签、RFID应答器中的至少一个的设备和医疗设备中。Optionally, the structure may be included in devices and medical devices having at least one of resonators, antennas, RFID tags, RFID transponders.
在另一示例中，公开了一种包括多个导体的引线结构，每个导体具有导体长度、导体高度、导体深度、和具有趋肤深度的导电表面。多个绝缘体位于多个导体中的每一个之间，使得每个绝缘体位于多个导体中的相邻导体之间。形成所述引线结构，以能够使电信号通过导体表面的趋肤深度传播。In another example, a lead structure is disclosed that includes a plurality of conductors, each conductor having a conductor length, a conductor height, a conductor depth, and a conductive surface having a skin depth. A plurality of insulators are positioned between each of the plurality of conductors such that each insulator is positioned between adjacent conductors of the plurality of conductors. The lead structure is formed to enable electrical signal propagation through the skin depth of the conductor surface.
可选地，多个导体包括通过位于其间的绝缘体层分离的第一导体层和第二导体层，其中第一导体层通过至少一个连接体与第二导体层连接。第一和第二导体层中的至少一个包括至少一个导电带、导电条、和沉积金属。连接体可以是孔、焊料、接头、引线、引脚或铆钉中的至少一个。Optionally, the plurality of conductors includes a first conductor layer and a second conductor layer separated by an insulator layer therebetween, wherein the first conductor layer is connected to the second conductor layer by at least one connector. At least one of the first and second conductor layers includes at least one conductive strip, a conductive strip, and a deposited metal. The connector may be at least one of a hole, solder, tab, lead, pin, or rivet.
可选地，导体可以具有包括圆形横截面、矩形横截面、方形横截面、三角形横截面或椭圆形横截面中的至少一个的横截面形状。Alternatively, the conductor may have a cross-sectional shape comprising at least one of a circular cross-section, a rectangular cross-section, a square cross-section, a triangular cross-section, or an oval cross-section.
可选地，电信号可以包括能量信号、功率信号和数据信号中的至少一个。电信号可以是电流、电压和数字数据信号。Optionally, the electrical signal may include at least one of an energy signal, a power signal and a data signal. The electrical signals can be current, voltage and digital data signals.
可选地，趋肤深度的范围是从导体深度的近似一半到大约等于导体深度。导体深度的范围是趋肤深度到趋肤深度的两倍。导体深度大于趋肤深度的大约两倍。多个导体层具有至少一匝。Optionally, the skin depth ranges from approximately half the conductor depth to approximately equal to the conductor depth. Conductor depth ranges from skin depth to twice the skin depth. The conductor depth is greater than about twice the skin depth. The plurality of conductor layers have at least one turn.
可选地，多个导体层中的每一个具有基本相同的导体长度、导体宽度或导体深度。引线结构具有大于100的品质因数。Optionally, each of the plurality of conductor layers has substantially the same conductor length, conductor width or conductor depth. The lead structure has a quality factor greater than 100.
可选地，引线结构具有可以是圆形螺线管形配置、方形螺线管形配置、圆形螺旋形配置、方形螺旋形配置、矩形配置、三角形配置、圆形螺旋-螺线管形配置、方形螺旋-螺线管形配置或共形螺线管形配置的结构形状。Optionally, the lead structure has a configuration that may be a circular solenoid, a square solenoid, a circular helical, a square helical, a rectangular, a triangular, or a circular helix-solenoid. , a square helical-solenoid configuration or a structural shape of a conformal solenoid configuration.
可选地，可以由导电材料形成至少一个导体。导电材料包括铜、钛、铂和铂/铱合金、钽、铌、锆、铪、镍钛合金、Co-Cr-Ni合金、不锈钢、金、金合金、钯、碳、银、贵金属、和生物相容材料中的至少一个。可以由电绝缘材料形成绝缘体。Optionally, the at least one conductor may be formed from a conductive material. Conductive materials include copper, titanium, platinum and platinum/iridium alloys, tantalum, niobium, zirconium, hafnium, nitinol, Co-Cr-Ni alloys, stainless steel, gold, gold alloys, palladium, carbon, silver, precious metals, and biological at least one of the compatible materials. The insulator may be formed from an electrically insulating material.
可选地，电绝缘材料包括空气、泡沫聚苯乙烯、二氧化硅、适合的生物相容陶瓷或具有低介电常数的任意类似电介质、具有高介电常数的非导电电介质和铁氧体材料中的至少一个。Optionally, electrically insulating materials include air, styrofoam, silica, suitable biocompatible ceramics or any similar dielectric with a low dielectric constant, non-conductive dielectrics with a high dielectric constant, and ferrite materials at least one of the.
可选地，在至少一个频率处通过所述结构感生电信号。从大约100kHz到大约3MHz的范围内选择所述频率。可以从大约3MHz到大约10GHz的频率范围内选择该频率。所述频率是在大约100kHz到大约3MHz的范围内的频带。所述频率是在大约1MHz到大约10GHz的范围内的频带。Optionally, an electrical signal is induced by the structure at at least one frequency. The frequency is selected from a range of about 100 kHz to about 3 MHz. The frequency can be selected from a frequency range of about 3 MHz to about 10 GHz. The frequencies are bands in the range of about 100 kHz to about 3 MHz. The frequencies are bands in the range of about 1 MHz to about 10 GHz.
可选地，引线结构还包括从包括电阻器、电感器和电容器的组中选择的电路元件。引线结构可以包括在包括谐振器、天线、RFID标签、RFID应答器中的至少一个的设备和医疗设备内。Optionally, the lead structure further includes circuit elements selected from the group consisting of resistors, inductors, and capacitors. The lead structure can be included in devices and medical devices that include at least one of a resonator, an antenna, an RFID tag, an RFID transponder.
此外，公开了一种制造用于无线发送或无线接收的结构的方法，其中使用多层引线概念创建所述结构自身和/或所述结构的组件。用于制造的所述方法创建能够无线发送和/或接收电能量、电磁能量和电功率的结构。此外，所产生的结构能够实现电子数据的发送或接收。此外，所产生的结构能够一起发送和/或接收或分离地发送和/或接收电能量、电磁能量、电功率和电子数据的组合。Furthermore, a method of fabricating a structure for wireless transmission or wireless reception is disclosed, wherein the structure itself and/or components of the structure are created using a multi-layer lead concept. The method for manufacture creates a structure capable of wirelessly transmitting and/or receiving electrical energy, electromagnetic energy and electrical power. Furthermore, the resulting structure enables the transmission or reception of electronic data. Furthermore, the resulting structures are capable of transmitting and/or receiving together or separately a combination of electrical energy, electromagnetic energy, electrical power and electronic data.
所述方法可以包括步骤：创建多个导体层，在每个导体层之间具有绝缘体；以及在多个导体层的两个导体层之间形成至少一个连接。连接导体层的连接体可以是孔、焊料、接头、引线、引脚或铆钉，但不限于此。可以通过经过掩膜的沉积来创建导体层。创建多个导体层且在每个导体层之间具有绝缘体的步骤还可以包括以下步骤：在第二导电层的上面放置第一导电层，并利用第一绝缘体将第一导电层与第二导电层分离。此外，在多个导体中的两个导体之间形成至少一个连接的步骤可以包括以下步骤：连接导体层中的至少两个导体层，包括但不限于孔、焊料、接头、引线、引脚或铆钉。可以由导电材料形成导体层。导电材料可以包括铜、钛、铂和铂/铱合金、钽、铌、锆、铪、镍钛合金、Co-Cr-Ni合金、不锈钢、金、金合金、钯、碳、银、贵金属、或生物相容材料及其任意组合。The method may include the steps of: creating a plurality of conductor layers with an insulator between each conductor layer; and forming at least one connection between two conductor layers of the plurality of conductor layers. The connecting bodies connecting the conductor layers may be holes, solders, joints, leads, pins or rivets, but are not limited thereto. The conductor layer can be created by deposition through a mask. The step of creating a plurality of conductor layers with an insulator between each conductor layer may further include the steps of: placing a first conductive layer on top of the second conductive layer, and using the first insulator to connect the first conductive layer to the second conductive layer layer separation. Additionally, the step of forming at least one connection between two conductors of the plurality of conductors may include the step of connecting at least two conductor layers of the conductor layers, including but not limited to holes, solders, tabs, leads, pins, or rivet. The conductor layer may be formed of a conductive material. Conductive materials may include copper, titanium, platinum and platinum/iridium alloys, tantalum, niobium, zirconium, hafnium, nitinol, Co-Cr-Ni alloys, stainless steel, gold, gold alloys, palladium, carbon, silver, precious metals, or Biocompatible materials and any combination thereof.
还公开了一种用于操作结构以提供无线发送或无线接收的方法，其中使用多层引线概念创建所述结构自身和/或所述结构的组件。所述方法包括以下步骤：提供能够无线发送和/或无线接收电能量、电磁能量和/或电功率的结构。此外，所述方法提供以下步骤：提供能够实现电子数据发送或接收的结构。此外，所述方法提供以下步骤：提供能够一起发送和/或接收或分离地发送和/或接收电能量、电磁能量、电功率和电子数据的组合的结构。Also disclosed is a method for operating a structure to provide wireless transmission or wireless reception, wherein the structure itself and/or components of the structure are created using a multi-layer wire concept. The method includes the steps of providing a structure capable of wirelessly transmitting and/or wirelessly receiving electrical energy, electromagnetic energy and/or electrical power. Furthermore, the method provides the step of providing a structure that enables electronic data transmission or reception. Furthermore, the method provides the step of providing a structure capable of transmitting and/or receiving a combination of electrical energy, electromagnetic energy, electrical power and electronic data together or separately.
所述方法包括以下步骤：提供多个导体，每个导体具有导体长度、导体高度、导体深度、和具有趋肤深度的导电表面。导体深度的范围是趋肤深度到趋肤深度的两倍。然而，取决于可用技术、成本和应用，导体深度可以是趋肤深度的二十倍或更多倍。多个导体层可以被布置为形成谐振器主体，所述谐振器主体具有谐振器主体长度、谐振器主体宽度和谐振器主体深度；以及在多个导体的至少一个中感生电信号，使得电信号通过趋肤深度的传导表面传播。电信号可以是电流、电压、数字数据信号或其任意组合。The method includes the steps of providing a plurality of conductors, each conductor having a conductor length, a conductor height, a conductor depth, and a conductive surface having a skin depth. Conductor depth ranges from skin depth to twice the skin depth. However, the conductor depth may be twenty or more times the skin depth, depending on available technology, cost and application. The plurality of conductor layers may be arranged to form a resonator body having a resonator body length, a resonator body width, and a resonator body depth; and an electrical signal is induced in at least one of the plurality of conductors such that the electrical The signal propagates through the conducting surface at skin depth. The electrical signals can be currents, voltages, digital data signals, or any combination thereof.
所述方法还可以包括以下步骤：提供第二多个导体，每个第二导体具有第二导体长度、第二导体高度、第二导体深度、和具有第二趋肤深度的第二导电表面，其中多个第二导体被布置以形成第二谐振器主体，所述第二谐振器主体具有第二谐振器主体长度、第二谐振器主体宽度和第二谐振器主体深度。当电信号通过谐振器主体传播时，电信号传播通过趋肤深度的传导表面，还感生通过第二谐振器主体的电信号，以及感生电信号以第二趋肤深度传播通过第二传导表面。The method may further include the step of providing a second plurality of conductors, each second conductor having a second conductor length, a second conductor height, a second conductor depth, and a second conductive surface having a second skin depth, wherein the plurality of second conductors are arranged to form a second resonator body having a second resonator body length, a second resonator body width, and a second resonator body depth. When the electrical signal propagates through the resonator body, the electrical signal propagates through the conducting surface at the skin depth, also induces the electrical signal through the second resonator body, and induces the electrical signal to propagate through the second conduction at the second skin depth surface.
多个导体可以包括通过绝缘体层分离的第一导体层和第二导体层，其中第一导体层通过至少一个连接体与第二导体层连接。此外，连接导体层中的至少两个导体层的至少一个连接包括但不限于孔、焊料、接头、引线、引脚或铆钉。导体可以具有不限于圆形横截面、矩形横截面、方形横截面、三角形横截面和椭圆形横截面的横截面形状。多个导体层可以具有至少一匝，多个导体层中的每一个可以具有或可以不具有基本相同的导体长度、导体高度和导体深度。可以由导电材料形成导体层。导电材料可以包括铜、钛、铂和铂/铱合金、钽、铌、锆、铪、镍钛合金、Co-Cr-Ni合金、不锈钢、金、金合金、钯、碳、银、贵金属、或生物相容材料或其任意组合。The plurality of conductors may include a first conductor layer and a second conductor layer separated by an insulator layer, wherein the first conductor layer is connected to the second conductor layer by at least one connector. Additionally, at least one connection connecting at least two of the conductor layers includes, but is not limited to, holes, solders, joints, leads, pins, or rivets. The conductors may have cross-sectional shapes that are not limited to circular cross-sections, rectangular cross-sections, square cross-sections, triangular cross-sections, and elliptical cross-sections. The plurality of conductor layers may have at least one turn, and each of the plurality of conductor layers may or may not have substantially the same conductor length, conductor height, and conductor depth. The conductor layer may be formed of a conductive material. Conductive materials may include copper, titanium, platinum and platinum/iridium alloys, tantalum, niobium, zirconium, hafnium, nitinol, Co-Cr-Ni alloys, stainless steel, gold, gold alloys, palladium, carbon, silver, precious metals, or Biocompatible materials or any combination thereof.
谐振器可以具有不限于圆形螺线管形配置、方形螺线管形配置、圆形螺旋形配置、方形螺旋形配置、矩形配置、三角形配置、圆形螺旋-螺线管形配置、方形螺旋-螺线管形配置或共形螺线管形配置的结构形状。The resonator may have, without limitation, a circular solenoid configuration, a square solenoid configuration, a circular helical configuration, a square helical configuration, a rectangular configuration, a triangular configuration, a circular helix-solenoid configuration, a square helix - Structural shape of a solenoid-shaped configuration or a conformal solenoid-shaped configuration.
将在以下的描述中部分地提出其他优点和新特征，其部分将在检验以下内容及附图时对于本领域技术人员显而易见，并且可以通过示例的产生或操作获知。可以通过实践或使用在以下讨论的详细示例中提出的方法、手段和组合的各个方面来实现并获得本教导的优点。Other advantages and novel features will be set forth in part in the description that follows, parts of which will become apparent to those skilled in the art upon examination of the following and the accompanying drawings, and may be learned by the creation or operation of examples. The advantages of the present teachings can be realized and obtained by practicing or using the various aspects of the methods, instrumentalities and combinations set forth in the detailed examples discussed below.
附图说明Description of drawings
附图描述了根据仅作为示例而不意在限制的本教导的一个或多个实施方式。在附图中，类似的参考数字指示相同或类似的元件。The accompanying drawings depict one or more embodiments in accordance with the present teachings by way of example only and not limitation. In the drawings, like reference numerals designate the same or similar elements.
图1示出了低效系统中的能量损耗；Figure 1 shows the energy loss in an inefficient system;
图2示出了通过同质导体的稳态单向电流的AC电流分布；Figure 2 shows the AC current distribution for steady state unidirectional current through a homogeneous conductor;
图3示出了由于趋肤效应导致的在提高的频率处的AC电流分布；Figure 3 shows the AC current distribution at elevated frequencies due to the skin effect;
图4是趋肤深度相对频率的图示；Figure 4 is a graphical representation of skin depth versus frequency;
图5示出了在提高的频率处通过多层引线的AC电流分布；Figure 5 shows the AC current distribution through the multilayer leads at elevated frequencies;
图6示出了用于无线通信的引线结构的高级图示；6 shows a high-level illustration of a lead structure for wireless communication;
图7A示出了圆形螺线管形配置中的引线的示例；Figure 7A shows an example of a lead in a circular solenoid configuration;
图7B示出了方形螺线管形配置中的引线的示例；Figure 7B shows an example of a lead in a square solenoid configuration;
图7C示出了圆形螺旋形配置中的引线的示例；Figure 7C shows an example of a lead in a circular helical configuration;
图7D示出了方形螺旋形配置中的引线的示例；Figure 7D shows an example of a lead in a square helical configuration;
图7E示出了多层方形螺旋形配置中的引线的示例；Figure 7E shows an example of a lead in a multilayer square helical configuration;
图7F示出了圆形螺旋-螺线管形配置中的引线的示例；Figure 7F shows an example of a lead in a circular helical-solenoid configuration;
图7G示出了方形螺旋-螺线管形配置中的引线的示例；Figure 7G shows an example of a lead in a square helical-solenoid configuration;
图7H示出了共形螺线管形配置中的引线的示例；Figure 7H shows an example of a lead in a conformal solenoid configuration;
图8A示出了具有N层的单匝圆形线圈的示例；Figure 8A shows an example of a single-turn circular coil with N layers;
图8B示出了N层双匝圆形螺旋-螺线管形线圈的示例；Figure 8B shows an example of an N-layer two-turn circular helical-solenoid coil;
图9A示出了具有圆形横截面的多层引线的示例；Figure 9A shows an example of a multi-layer lead with a circular cross-section;
图9B示出了具有矩形横截面的多层引线的示例；Figure 9B shows an example of a multilayer lead with a rectangular cross-section;
图9C示出了具有方形横截面的多层引线的示例；Figure 9C shows an example of a multi-layer lead with a square cross-section;
图9D示出了具有三角形横截面的多层引线的示例；Figure 9D shows an example of a multilayer lead with a triangular cross-section;
图9E示出了具有椭圆形横截面的多层引线的示例；Figure 9E shows an example of a multilayer lead with an oval cross-section;
图9F示出了多层引线的矩形横截面；Figure 9F shows a rectangular cross-section of a multilayer lead;
图10A示出了具有圆形横截面的多层引线；Figure 10A shows a multi-layer lead with a circular cross-section;
图10B示出了具有矩形横截面的多层引线；Figure 10B shows a multilayer lead with a rectangular cross-section;
图11A示出了具有1层的单匝MLMT结构；Figure 11A shows a single-turn MLMT structure with 1 layer;
图11B示出了具有11层的单匝MLMT结构；Figure 11B shows a single-turn MLMT structure with 11 layers;
图11C示出了具有20层的单匝MLMT结构；Figure 11C shows a single-turn MLMT structure with 20 layers;
图11D示出了具有26层的单匝MLMT结构；Figure 11D shows a single-turn MLMT structure with 26 layers;
图12是示出了随频率变化的品质因数值的图示；FIG. 12 is a graph showing figure of merit values as a function of frequency;
图13A是示出了电阻和电感随层数的相对改变的图示；FIG. 13A is a graph showing the relative changes in resistance and inductance with the number of layers;
图13B是示出了针对给定的层数、在10MHz所产生的品质因数的图示；13B is a graph showing the resulting figure of merit at 10 MHz for a given number of layers;
图14A是示出了随频率变化的品质因数的图示；14A is a graph showing figure of merit as a function of frequency;
图14B是示出了随频率变化的关于16层线圈的电感的图示；14B is a graph showing the inductance for a 16-layer coil as a function of frequency;
图14C是示出了随频率变化的关于16层线圈的电阻的图示；FIG. 14C is a graph showing resistance as a function of frequency for a 16-layer coil;
图15A是示出了随频率变化的品质因数的图示；15A is a graph showing figure of merit as a function of frequency;
图15B是示出了随频率变化的电感的图示；15B is a graph showing inductance as a function of frequency;
图15C是示出了随频率变化的电阻的图示；Figure 15C is a graph showing resistance as a function of frequency;
图16A是示出了随频率变化的具有1mm金属条带宽度(metal strip width)的线圈的品质因数的图示；16A is a graph showing the figure of merit of a coil with a 1 mm metal strip width as a function of frequency;
图16B是示出了具有1.5mm金属宽度的线圈的品质因数的相对增大的图示；16B is a graph showing the relative increase in quality factor for a coil having a metal width of 1.5 mm;
图16C是示出了具有2mm金属宽度的线圈的品质因数的相对增大的图示；Figure 16C is a graph showing the relative increase in quality factor for a coil with a 2mm metal width;
图17示出了近场能量网络的高级框图；Figure 17 shows a high-level block diagram of a near-field energy network;
图18A示出了接收单元和发送单元具有相同谐振频率、且波段窄的情形的图示；18A shows a diagram of a situation where the receiving unit and the transmitting unit have the same resonant frequency and a narrow band;
图18B示出了接收单元和发送单元具有不同谐振频率、且波段窄的情形的图示；FIG. 18B shows a diagram of a situation in which the receiving unit and the transmitting unit have different resonance frequencies and a narrow band;
图18C示出了接收单元和发送单元具有不同谐振频率、且具有宽谐振的情形的图示；18C shows a diagram of a situation where the receiving unit and the transmitting unit have different resonance frequencies and have a wide resonance;
图18D示出了接收单元和发送单元具有不同谐振频率且发送设备有损的情形的图示；18D shows a diagram of a situation where the receiving unit and the transmitting unit have different resonant frequencies and the transmitting device is damaged;
图18E示出了接收单元和发送单元具有相距很远的谐振频率且发送单元和接收单元均有损的情形的图示；18E shows a diagram of a situation where the receiving unit and the transmitting unit have resonant frequencies that are far apart and both the transmitting unit and the receiving unit are lossy;
图18F示出了接收单元和发送单元具有接近的谐振频率且发送单元和接收单元均有损的情形的图示；18F shows a diagram of a situation where the receiving unit and the transmitting unit have close resonant frequencies and both the transmitting unit and the receiving unit are lossy;
图19示出了具有中继器的近场能量网络的高级框图；Figure 19 shows a high-level block diagram of a near-field energy network with repeaters;
图20示出了典型的PCB层叠；Figure 20 shows a typical PCB stack-up;
图21是从所确立的PCB制造商获得的6层PCB板的制作层叠表；Figure 21 is a build-up table of 6-layer PCB boards obtained from established PCB manufacturers;
图22示出了使用多层引线创建的任意MLMT结构的等效电路图；Figure 22 shows an equivalent circuit diagram of an arbitrary MLMT structure created using multiple layers of leads;
图23示出了使用多层引线创建的、作为电感器操作(条件1)的MLMT结构的等效电路图；Figure 23 shows an equivalent circuit diagram of an MLMT structure created using multiple layers of leads, operating as an inductor (Condition 1);
图24A示出了使用多层引线创建的、作为电路中的自谐振器操作(类型1)的MLMT结构的等效电路图；24A shows an equivalent circuit diagram of an MLMT structure operating as a self-resonator in circuit (Type 1) created using multiple layers of leads;
图24B示出了使用多层引线创建的、作为单独自谐振器操作(类型1)的MLMT结构的等效电路图；24B shows an equivalent circuit diagram of an MLMT structure created using multiple layers of leads, operating as a single self-resonator (Type 1);
图25A示出了使用多层引线创建的MLMT结构的、显示串联电容器添加的等效电路图；Figure 25A shows an equivalent circuit diagram of an MLMT structure created using multiple layers of leads, showing the addition of series capacitors;
图25B示出了使用多层引线创建的MLMT结构的、显示并联电容器添加的等效电路图；25B shows an equivalent circuit diagram of an MLMT structure created using multiple layers of leads, showing the addition of parallel capacitors;
图26A示出了使用多层引线创建的、作为电路中的谐振器操作的MLMT结构的等效电路图，其中通过添加并联电容器实现谐振；26A shows an equivalent circuit diagram of an MLMT structure created using multiple layers of leads, operating as a resonator in a circuit, where resonance is achieved by adding parallel capacitors;
图26B示出了使用多层引线创建的作为单独谐振器操作的MLMT结构的等效电路图，其中通过向电路添加串联电容器实现谐振；26B shows an equivalent circuit diagram of an MLMT structure operating as a single resonator created using multiple layers of leads, where resonance is achieved by adding series capacitors to the circuit;
图26C示出了使用多层引线创建的作为单独谐振器操作的MLMT结构的等效电路图，其中通过向电路添加并联电容器实现谐振。26C shows an equivalent circuit diagram of an MLMT structure operating as a separate resonator created using multiple layers of leads, where resonance is achieved by adding parallel capacitors to the circuit.
具体实施方式Detailed ways
在以下描述中，通过示例提出各种特定细节，以提供对相关教导的透彻理解。然而，对于本领域技术人员显而易见的是，可以无需这些细节而实践本教导。在其他实例中，以相对高层而无需其细节地描述了公知的方法、过程、组件和/或电路，以避免不必要地模糊本教导的各方面。In the following description, various specific details are set forth by way of example in order to provide a thorough understanding of the related teachings. However, it will be apparent to those skilled in the art that the present teachings may be practiced without these details. In other instances, well-known methods, procedures, components and/or circuits have been described at a relatively high level without their detail in order to avoid unnecessarily obscuring aspects of the present teachings.
这里公开的各种技术一般涉及设计、操作并制造无线发送和/或无线接收系统的方法、系统和设备，以及更具体地，涉及设计、操作并制造用于近场无线功率和/或数据发送和/或通信系统的高效结构。The various techniques disclosed herein relate generally to methods, systems and apparatus for designing, operating and manufacturing wireless transmission and/or wireless receiving systems, and more particularly, to designing, operating and manufacturing for near-field wireless power and/or data transmission and/or efficient structure of the communication system.
无线发送可以包括电能量、电磁能量和电功率的无线发送，例如实施例。此外，无线发送可以包括数字数据和信息的发送。在另一实施例中，可以一起发送或分离地发送电能量、电磁能量、电功率、电子数据和信息的组合，如在能量网络中讨论的实施例。还预想，这种无线发送可以同时发生或在时间间隔时段上发生。以下部分讨论在能量网络、功率网络、数据网络和近场功率和数据传递系统中的无线发送的实施例。Wireless transmission may include wireless transmission of electrical energy, electromagnetic energy, and electrical power, such as embodiments. Additionally, wireless transmission may include the transmission of digital data and information. In another embodiment, a combination of electrical energy, electromagnetic energy, electrical power, electronic data, and information may be sent together or separately, as in the embodiments discussed in Energy Networks. It is also envisioned that such wireless transmissions may occur simultaneously or over time interval periods. The following sections discuss embodiments of wireless transmission in energy networks, power networks, data networks, and near field power and data transfer systems.
无线接收可以包括电能量、电磁能量和电功率的无线接收，例如实施例。此外，无线接收可以包括数字数据和信息的接收。在另一实施例中，可以一起接收或分离地接收电能量、电磁能量、电功率、电子数据和信息的组合，如在能量网络中讨论的实施例。还预想，这种无线接收可以同时发生或在时间间隔时段上发生。以下部分讨论在能量网络、功率网络、数据网络和近场功率和数据传递系统中的无线接收的实施例。Wireless reception may include wireless reception of electrical energy, electromagnetic energy, and electrical power, such as embodiments. Additionally, wireless reception may include the reception of digital data and information. In another embodiment, a combination of electrical energy, electromagnetic energy, electrical power, electronic data, and information may be received together or separately, as in the embodiments discussed in Energy Networks. It is also envisioned that such wireless reception may occur simultaneously or over time interval periods. The following sections discuss embodiments of wireless reception in energy networks, power networks, data networks and near field power and data transfer systems.
无线通信可以包括电能量、电磁能量和电功率的无线发送和接收，例如实施例。此外，无线通信可以包括数字数据和信息的发送和接收。在另一实施例中，可以一起发送和接收或分离地发送和接收电能量、电磁能量、电功率、电子数据和信息的组合，如在能量网络中讨论的实施例。还预想，这种无线发送和接收可以同时发生或在时间间隔时段上发生。以下部分讨论在能量网络、功率网络、数据网络和近场功率和数据传递系统中的无线通信的实施例。Wireless communications may include wireless transmission and reception of electrical energy, electromagnetic energy, and electrical power, such as embodiments. Additionally, wireless communications may include the transmission and reception of digital data and information. In another embodiment, a combination of electrical energy, electromagnetic energy, electrical power, electronic data, and information may be sent and received together or separately, as in the embodiments discussed in Energy Networks. It is also envisioned that such wireless transmission and reception may occur simultaneously or over time intervals. The following sections discuss embodiments of wireless communication in energy networks, power networks, data networks, and near field power and data transfer systems.
系统效率被定义为输出与输入之比。在电系统中，由于固有电阻和阻抗，输出通常小于输入。对于无线系统，在通过空气传递能量时出现典型的损耗。然而，在电流流经系统电路及其相关元件(如，电感器、电容器和电阻器)并流经诸如天线、谐振器之类的系统组件时，还会损耗能量。图1示出了低效系统中能量损耗的图示。System efficiency is defined as the ratio of output to input. In electrical systems, the output is usually smaller than the input due to inherent resistance and impedance. For wireless systems, typical losses occur when energy is transferred through the air. However, energy is also dissipated as current flows through the system circuit and its associated elements (eg, inductors, capacitors, and resistors) and through system components such as antennas, resonators, and the like. Figure 1 shows a graphical representation of energy losses in an inefficient system.
天线一般是通过其发出或接收电磁波的导体。天线可以包括但不限于引线或引线集合。谐振器一般是发生谐振的任意器件或材料，包括发生谐振的任意系统。谐振器可以是用于通过谐振检测特定频率出现的手段，还可以是具有该频率特征的任意电路。此外，谐振器可以是按照周期性电振荡会达到最大幅值的方式组合电容和电感的电子电路。如本领域技术人员将会理解，天线通常在例如自谐振时或在与诸如电容器之类的另一电抗元件耦合以实现谐振时充当谐振器。这样，术语天线和谐振器在此通常互换使用，并且一般被称为结构(例如，多层多匝结构)。An antenna is generally a conductor through which electromagnetic waves are emitted or received. Antennas may include, but are not limited to, leads or sets of leads. A resonator is generally any device or material that resonates, including any system that resonates. A resonator can be a means for detecting the presence of a specific frequency through resonance, or can be any circuit characteristic of that frequency. Furthermore, the resonator may be an electronic circuit that combines capacitance and inductance in such a way that periodic electrical oscillations will reach their maximum amplitude. As those skilled in the art will appreciate, an antenna typically acts as a resonator, eg, when self-resonating or when coupled with another reactive element, such as a capacitor, to achieve resonance. As such, the terms antenna and resonator are often used interchangeably herein, and are generally referred to as structures (eg, multilayer multi-turn structures).
“趋肤效应”一般是交变电流集中在导体外部或“皮肤”附近的趋势。如图2所示，针对通过同质导体的稳态单向电流，电流分布在横截面上一般是均匀的；也就是说，电流密度在横截面上的所有点是相同的。The "skin effect" is generally the tendency of the alternating current to concentrate outside or near the "skin" of a conductor. As shown in Figure 2, for steady-state unidirectional current flow through a homogeneous conductor, the current distribution is generally uniform across the cross-section; that is, the current density is the same at all points on the cross-section.
在使用交变电流的情况下，随着频率增加，越来越多的电流移动到表面。该电流没有有效地利用导体的全部横截面。因此，导体的有效横截面减小，所以与针对均匀分布的电流的值相比，电阻和能量耗散增大。换言之，如图3所示，由于趋肤效应，电流密度在导体表面(也称为“皮肤”)附近最大，并向横截面中心指数衰减。In the case of using alternating current, as the frequency increases, more and more current moves to the surface. This current does not effectively utilize the full cross-section of the conductor. Consequently, the effective cross-section of the conductor is reduced, so the resistance and energy dissipation are increased compared to the value for a uniformly distributed current. In other words, as shown in Figure 3, due to the skin effect, the current density is greatest near the conductor surface (also referred to as the "skin") and decays exponentially towards the center of the cross-section.
对于任何引线，该引线的有效电阻随频率显著提高。这是因为电流仅流经全部引线横截面的一部分。这里的电阻指欧姆电阻。具有圆形横截面的引线环的欧姆电阻的公式为：For any lead, the effective resistance of that lead increases significantly with frequency. This is because current flows only through a portion of the total lead cross section. The resistance here refers to ohmic resistance. The formula for the ohmic resistance of a lead loop with a circular cross section is:
针对DC：R＝(ρL)/AFor DC: R=(ρL)/A
其中ρ是电阻系数，L是引线总长，以及A是引线横截面。where ρ is the resistivity, L is the overall lead length, and A is the lead cross section.
针对AC，包括趋肤效应其中N是引线环的匝数，r是环半径，a是引线半径。A＝πa2及L＝2πNr。For AC, including skin effect where N is the number of turns of the lead loop, r is the loop radius, and a is the lead radius. A=πa2 and L=2πNr.
对于引线横截面，创建更多当前路径导致引线净电阻的减小。本发明描述了包括多层的引线。每个导电层可以包括但不限于导电带、传导条、沉积金属等。每个导电层可以通过某种绝缘材料与其他导电层分离。绝缘材料可以是泡沫聚苯乙烯、二氧化硅、适合的生物相容陶瓷或具有低介电常数的任意类似电介质、具有高介电常数的非导电电介质、铁氧体材料或其任意组合或空气，但不限于此。该“分层引线”可以具有一匝或多匝，以创建多匝结构。这里被称为多层引线的“分层引线”用于创建在此被称为多层多匝(MLMT)结构的完整结构。MLMT结构可以是天线、谐振器、线圈、集总元件或其任意组合，但不限于此。集总元件可以是电感器、电容器、电阻器或其任意组合，但不限于此。多层引线是需要可减小电阻的任意结构的基本构建块。多层引线还可以用于在任一导电迹线中获得可减小电阻，无论它是否只是电路中两点间的互连、用作电路中的集总元件(例如但不限于电感器、电容器、电阻器或其任意组合)的线圈、滤波器中的诸如电感器、电容器、电阻器或其任意组合之类的微型元件、用作用于无线通信的天线或谐振器(但不限于此)的线圈、或类似于PIFA及其衍生物、矩形微带天线或贴片天线及其衍生物、超宽带(UWB)结构、单极结构、蝶形结构等的任意结构、或其任意组合。For lead cross sections, creating more current paths results in a reduction in the net resistance of the lead. The present invention describes leads that include multiple layers. Each conductive layer may include, but is not limited to, conductive strips, conductive strips, deposited metals, and the like. Each conductive layer can be separated from the other conductive layers by some insulating material. The insulating material may be styrofoam, silica, a suitable biocompatible ceramic or any similar dielectric with a low dielectric constant, a non-conductive dielectric with a high dielectric constant, a ferrite material or any combination thereof or air , but not limited to this. This "layered lead" can have one or more turns to create a multi-turn structure. "Layered leads", referred to herein as multi-layer leads, are used to create complete structures referred to herein as multi-layer multi-turn (MLMT) structures. The MLMT structure may be, but is not limited to, antennas, resonators, coils, lumped elements, or any combination thereof. The lumped elements may be, but not limited to, inductors, capacitors, resistors, or any combination thereof. Multilayer leads are the basic building block for any structure that requires reduced electrical resistance. Multilayer leads can also be used to obtain reduced resistance in any conductive trace, whether it is just an interconnection between two points in a circuit, used as lumped elements in a circuit (such as but not limited to inductors, capacitors, Coils of resistors or any combination thereof, miniature components such as inductors, capacitors, resistors or any combination thereof in filters, coils used as (but not limited to) antennas or resonators for wireless communications , or any structure similar to PIFA and its derivatives, rectangular microstrip antenna or patch antenna and its derivatives, ultra-wideband (UWB) structure, monopole structure, butterfly structure, etc., or any combination thereof.
例如，对于1mm(0.04英寸)直径的铜引线，1MHz频率的电阻至多是dc值的四倍。“趋肤深度”或“穿透深度”δ频繁用于评估趋肤效应的结果。通常接受电流密度减小为其在表面处的值的大约1/e(大约37％)的导体表面以下的深度。术语“趋肤深度”因而被描述为电流密度下降到最大值的大约37％的横截面内的深度。该概念应用于平面实体，但是可以扩展到导体表面的曲率半径略大于δ的其他形状。例如，在60Hz频率处，铜中的穿透深度是8.5mm(0.33英寸)；在10GHz处仅为6.6×10-7m。趋肤深度是频率的强函数，随频率增加而减小。该现象在图4所示的图示中显示。For example, for a 1 mm (0.04 inch) diameter copper lead, the resistance at a frequency of 1 MHz is at most four times the dc value. The "skin depth" or "penetration depth" delta is frequently used to evaluate the results of the skin effect. The depth below the conductor surface where the current density is generally reduced to about 1/e (about 37%) of its value at the surface is accepted. The term "skin depth" is thus described as the depth within the cross-section at which the current density falls to approximately 37% of the maximum value. The concept applies to planar solids, but can be extended to other shapes where the radius of curvature of the conductor surface is slightly larger than δ. For example, at 60Hz the penetration depth in copper is 8.5mm (0.33 inches); at 10GHz it is only 6.6 x10-7 m. Skin depth is a strong function of frequency and decreases with increasing frequency. This phenomenon is shown in the diagram shown in FIG. 4 .
多层引线的基本概念是最大化整个引线横截面上的可用电流密度，从而减小引线的本征电阻。多层化影响了结构在一个或多个频率处的活跃传导能力，同时将由于趋肤效应而导致的未使用的可传导材料最小化，因而消除了浪费的结构空间。图5示出了多层引线概念。The basic concept of multilayer leads is to maximize the available current density across the entire lead cross-section, thereby reducing the lead's intrinsic resistance. Multilayering affects the active conduction capability of the structure at one or more frequencies, while minimizing unused conductive material due to the skin effect, thereby eliminating wasted construction space. Figure 5 shows the multi-layer lead concept.
通过使用其厚度约为趋肤深度的两倍的导电层，确保了引线中所有点的电流密度大于或等于最大可能电流密度(在表面处)的～37％。通过使用其他层厚度，将会获得不同的基础电流密度。例如，通过使用大约趋肤深度4倍的层厚度，将会确保电流密度大于或等于最大可能电流密度(在表面处)的～14％。类似地，对于大约趋肤深度6倍的导体深度，电流密度大于或等于5％。By using a conductive layer whose thickness is approximately twice the skin depth, the current density at all points in the lead is ensured to be greater than or equal to -37% of the maximum possible current density (at the surface). By using other layer thicknesses, different base current densities will be obtained. For example, by using a layer thickness of about 4 times the skin depth, a current density greater than or equal to -14% of the maximum possible current density (at the surface) will be ensured. Similarly, for conductor depths approximately 6 times the skin depth, the current density is greater than or equal to 5%.
再次参照所给出的60Hz处的示例，大约8.5mm的导体趋肤深度将会导致大约17mm的层厚度。给定这些尺寸，大多数应用典型地将会使用具有比一层厚度的横截面尺寸小的横截面尺寸的引线。在如5GHz的较高频率处，大约1μm的导体趋肤深度将会导致大约2μm的层厚度。在较高频率处，可能禁止包括其关联成本的实际制作。本发明的多层引线是使用标准生产过程(例如但不限于PCB技术)制造的，因而本发明的多层引线提供了基于显著减小结构的内部电阻的能力实现高效无线通信的实践能力。Referring again to the example given at 60 Hz, a conductor skin depth of about 8.5 mm would result in a layer thickness of about 17 mm. Given these dimensions, most applications will typically use leads with a cross-sectional dimension smaller than that of one layer thickness. At higher frequencies like 5GHz, a conductor skin depth of about 1 μm would result in a layer thickness of about 2 μm. At higher frequencies, actual production including its associated costs may be prohibited. The multilayer leads of the present invention are fabricated using standard production processes such as, but not limited to, PCB technology, and thus provide the practical ability to achieve efficient wireless communications based on the ability to significantly reduce the internal resistance of the structure.
尽管在导电层保持高电流密度非常重要，但是同时，未使用的横截面面积(即，绝缘层)整体尽可能小也非常重要。使用上述理论，多层引线的理想建议配置包括厚度/深度大约为趋肤深度两倍的导电层和技术上尽可能薄的绝缘层。While it is important to maintain a high current density in the conductive layer, at the same time it is also important that the unused cross-sectional area (ie, the insulating layer) as a whole be as small as possible. Using the above theory, the ideal proposed configuration for a multi-layer lead includes a conductive layer with a thickness/depth of approximately twice the skin depth and an insulating layer that is technically as thin as possible.
因此，在微波频率上使用的波导和谐振腔内表面通常覆盖有高导电性材料(如，银)，以减小能量损耗，因为几乎所有电流都集中在表面。假设覆盖材料与δ相比是厚的，导体与涂覆材料的实心导体一样好。“品质因数”一般被接受为测量诸如天线、电路或谐振器之类的装置的效率的指标(测量数字)。孔在此被定义为从一层到另一层的导电连接。Therefore, the inner surfaces of waveguides and resonators used at microwave frequencies are often covered with highly conductive materials (eg, silver) to reduce energy losses, since nearly all current is concentrated at the surface. Assuming that the cover material is thick compared to delta, the conductor is as good as a solid conductor of the coated material. "Quality factor" is generally accepted as a measure of the efficiency of a device such as an antenna, circuit or resonator (measurement number). A hole is defined herein as a conductive connection from one layer to another.
绞合线一般是由以缠绕和编织长度的统一样式束或编在一起的单独的膜绝缘引线构成的引线。Litz wire is generally a lead consisting of individual film insulated leads bundled or braided together in a uniform pattern of twisted and braided lengths.
现在详细参考在附图中示出且在下面讨论的示例。图6示出了用于无线通信的组件的引线结构的高级图示。该引线结构包括具有多层引线101的线圈100。线圈100的形状可以是圆形、矩形、三角形、一些其它多边形或共形，以装配在受限的体积内。图6示出了具有圆形线圈100的形状的线圈的一个示例性配置。线圈100的配置可以是螺线管形的、螺旋形的或者螺旋-螺线管形的。螺线管形线圈遵循螺旋曲线，该螺旋曲线具有多匝，每一匝具有相同的半径。螺旋形线圈配置可以具有多匝，所述多匝具有逐渐增加或减小的半径。螺旋-螺线管形线圈配置是螺旋形和螺线管形配置的组合。也可以使用本领域技术人员已知的其它配置来形成该线圈。Reference will now be made in detail to the examples shown in the accompanying drawings and discussed below. 6 shows a high-level illustration of the lead structure of a component for wireless communication. The lead structure includes a coil 100 having multiple layers of leads 101 . The shape of the coil 100 may be circular, rectangular, triangular, some other polygonal or conformal to fit within a confined volume. FIG. 6 shows one exemplary configuration of a coil having the shape of a circular coil 100 . The configuration of the coil 100 may be solenoidal, helical, or helical-solenoid. A solenoidal coil follows a helical curve with multiple turns, each turn having the same radius. The helical coil configuration may have multiple turns with gradually increasing or decreasing radii. The helical-solenoid coil configuration is a combination of helical and solenoidal configurations. The coil may also be formed using other configurations known to those skilled in the art.
图7A-7H示出了可以使用的不同引线配置的示例。图7A示出了电路螺线管形配置102中引线的示例。图7B示出了方形螺线管形配置103中引线的示例。图7C示出了圆形螺旋形配置104中引线的示例。图7D示出了方形螺旋形配置105中引线的示例。可以理解，还可以使用其他螺旋形配置，例如矩形或三角形形状。图7E示出了多层方形螺旋形配置106中引线的示例。应该注意，尽管图7E仅示出了两层，可以理解，可以使用任意数目的层。如下面将描述的，当使用多个引线层时，可以使用但不局限于孔(via)、焊料、接头(tab)、引线、引脚或铆钉来连接多个引线层。这些连接体至少用于以下两个目的：(1)连接体连接多层引线的引线层；以及(2)连接体将多层引线的一匝连接到多层引线的第二匝。例如，对于两匝引线结构，从第一匝到第二匝至少存在一个孔。连接体还可以用于其它目的。7A-7H show examples of different lead configurations that can be used. FIG. 7A shows an example of leads in a circuit solenoid configuration 102 . FIG. 7B shows an example of the leads in the square solenoid configuration 103 . FIG. 7C shows an example of leads in a circular helical configuration 104 . FIG. 7D shows an example of leads in a square helical configuration 105 . It will be appreciated that other helical configurations may also be used, such as rectangular or triangular shapes. FIG. 7E shows an example of leads in the multilayer square spiral configuration 106 . It should be noted that although Figure 7E shows only two layers, it will be appreciated that any number of layers may be used. As will be described below, when multiple lead layers are used, vias, solders, tabs, leads, pins, or rivets may be used to connect the multiple lead layers, but are not limited to. These connectors serve at least two purposes: (1) the connectors connect the lead layers of the multi-layer lead; and (2) the connectors connect one turn of the multi-layer lead to the second turn of the multi-layer lead. For example, for a two-turn lead structure, there is at least one hole from the first turn to the second turn. Linkers can also be used for other purposes.
对于每个引线结构，存在连接体的最佳数目以及对于每个连接体的最佳位置。由于对此没有闭式解析解法，所以最佳位置最好通过迭代建模来获得。然而，在此给出用于优化的基本准则：For each lead structure, there is an optimal number of connectors and an optimal location for each connector. Since there is no closed-form analytical solution to this, the optimal position is best obtained through iterative modeling. However, here are the basic guidelines for optimization:
·优选地，存在连接形成单个导体的所有引线层的至少2个连接体。在理想情况下，这两个连接体是多层引线的两端(多层引线的输入端和输出端)。• Preferably, there are at least 2 connectors connecting all lead layers forming a single conductor. Ideally, these two connectors are the two ends of the multilayer lead (input and output ends of the multilayer lead).
·优选地，应该与特定应用的需求相当地，来选择连接体的总数。多于最佳数目的连接体将增加电流路径，而这会导致电容增加、电阻增加、品质因数降低和带宽变高。还应该注意，当连接体的总长度(高度、深度)大于特定工作频率处的最佳值时，寄生效应会变得更加突出。连接体的长度大体上为连接体的高度，并且应该将其保持为小于大约(有效波长)/20，尽管根据应用，将其保持在波长/10也可以导致可工作的实施例。这些限制的原因在于，增加的连接体长度将在所使用的多层引线的不同层之间引入显著的相位差。不同层之间的这些相位差将引起有害的电容效应，而这将在实际上降低自谐振频率并增加损耗。应该提及，对于不使用附加组件(例如，电容器)并且引线结构被用作自谐振谐振器的实施例，可以将深度大于(有效波长)/10的连接体(例如但不局限于孔)并入到引线结构的设计中。• Preferably, the total number of linkers should be chosen commensurate with the needs of the particular application. More than the optimal number of connections will increase the current path, which results in increased capacitance, increased resistance, lower quality factor, and higher bandwidth. It should also be noted that parasitic effects become more prominent when the overall length of the connector (height, depth) is greater than the optimum at a particular operating frequency. The length of the linker is generally the height of the linker, and should be kept less than about (effective wavelength)/20, although depending on the application, keeping it at wavelength/10 may also result in a workable embodiment. The reason for these limitations is that the increased connector length will introduce significant phase differences between the different layers of the multilayer leads used. These phase differences between the different layers will cause detrimental capacitive effects, which will actually reduce the self-resonant frequency and increase losses. It should be mentioned that for embodiments where no additional components (eg, capacitors) are used and the lead structure is used as a self-resonant resonator, a connection body (eg, but not limited to, a hole) with a depth greater than (effective wavelength)/10 may be incorporated and into the design of the lead structure.
孔可以具有在印刷电路板(PCB)技术中通常使用的形式(例如，通孔、埋孔、盲孔)或在半导体或MEMS技术中使用的形式。备选地，孔可以是但不局限于激光熔合、熔合、印刷、焊接、铜焊、溅射沉积、引线接合等的任意导电材料，以便至少电连接任意两个层和/或所有层。The holes may be in the form commonly used in printed circuit board (PCB) technology (eg, through holes, buried holes, blind holes) or in semiconductor or MEMS technology. Alternatively, the holes may be, but are not limited to, any conductive material of laser fusing, fusing, printing, welding, brazing, sputter deposition, wire bonding, etc. to electrically connect at least any two and/or all layers.
图7F示出了圆形螺旋-螺线管形配置107中引线的示例。图7G示出了方形螺旋-螺线管形配置108中引线的示例。图7H示出了共形螺线管形配置109中引线的示例。共形配置中的引线可以具有但不局限于圆形或矩形螺线管形的形状或圆形或矩形螺旋形的形状。本系统可以使用图7A-7H中示出的任意引线配置。FIG. 7F shows an example of a lead in a circular helical-solenoid configuration 107 . FIG. 7G shows an example of leads in a square helical-solenoid configuration 108 . FIG. 7H shows an example of a lead in a conformal solenoid configuration 109 . The leads in the conformal configuration may have, but are not limited to, a circular or rectangular solenoid shape or a circular or rectangular helical shape. The present system can use any of the lead configurations shown in Figures 7A-7H.
图6的线圈100可以具有多匝110。匝可以是但不局限于引线中的弯曲、折叠或弧线，使得引线围绕线圈111的中心轴点完成旋转。匝可以具有与线圈配置相同或类似的形状，例如但不局限于圆形、矩形、三角形、一些其它多边形或共形，以装配在受限的体积内。图8A示出了具有N层的单匝圆形引线线圈，其中“N”是等于或大于1的数。图8B示出了N层的双匝圆形螺线管形引线线圈。The coil 100 of FIG. 6 may have multiple turns 110 . The turns may be, but are not limited to, bends, folds, or arcs in the lead such that the lead completes a rotation about the central axis point of the coil 111 . The turns may have the same or similar shape as the coil configuration, such as but not limited to circular, rectangular, triangular, some other polygonal or conformal, to fit within a confined volume. 8A shows a single-turn circular lead coil with N layers, where "N" is a number equal to or greater than one. Figure 8B shows an N-layer two-turn circular solenoid lead coil.
通常，对于任意感应引线，电感按照Tx增加，而电阻按照Ty增加，其中T是匝数。在理想的导体中，x和y分别是2和1。存在影响电感和电阻(因此影响品质因数)的其他因素，使得x和y分别小于2和1。参考图15，给出了三种性能示例。图形将32层-2匝天线与均使用本发明的多层引线所创建的32层-1匝天线以及64层-1匝天线进行比较。在频率范围1MHz-200MHz中，32层-2匝天线的电感和电阻相对于32层-1匝天线分别增加3-3.5和1.7-3倍。该增加与根据简化解析关系所预计的值非常接近，在简化解析关系中，电阻近似T，电感近似T2。Generally, for any sense lead, the inductance increases by Tx and the resistance increases byTy , where Tis the number of turns. In an ideal conductor, x and y are 2 and 1, respectively. There are other factors that affect inductance and resistance (and thus quality factor) such that x and y are less than 2 and 1, respectively. Referring to Figure 15, three performance examples are given. The graph compares a 32-layer-2-turn antenna to a 32-layer-1-turn antenna and a 64-layer-1-turn antenna, both created using the multilayer leads of the present invention. In the frequency range 1MHz-200MHz, the inductance and resistance of the 32-layer-2-turn antenna are increased by 3-3.5 and 1.7-3 times, respectively, relative to the 32-layer-1-turn antenna. This increase is very close to what would be expected from a simplified analytical relationship where the resistance is approximately T and the inductance is approximately T2 .
图6中的多层引线101可以具有但不局限于圆形、矩形、方形或三角形横截面形状。此外，也可以使用本领域技术人员已知的其它形状。图9A-9E示出了在MLMT结构的设计中可以使用的引线横截面的示例。图9A示出了具有圆形横截面401的多层引线的示例。图9B示出了具有矩形横截面402的多层引线的示例。图9C示出了具有方形横截面403的多层引线的示例。图9D示出了具有三角形横截面404的多层引线的示例。图9E示出了具有椭圆形横截面405的多层引线的示例。图9F示出了具有第一导电层410和第二导电层420的多层引线的矩形横截面。绝缘材料430将第一层410与第二层420分离。第一层410和第二层420通过横穿绝缘材料430的孔440连接。导电层410、420可以是导电的带/条/片/叶片或沉积金属的层，具有金属厚度和金属条带宽度。第一层410的金属厚度由线A-A标识，第一层410的金属条带宽度由线B-B标识。在一个示例中，引线层的金属厚度可以近似为趋肤深度的两倍。趋肤深度在从导体深度的近似一半至大约等于导体深度的范围中。匝中的每一层具有几乎相同的金属厚度和金属条带宽度。The multilayer leads 101 in FIG. 6 may have, but are not limited to, circular, rectangular, square or triangular cross-sectional shapes. In addition, other shapes known to those skilled in the art may also be used. 9A-9E show examples of lead cross sections that can be used in the design of MLMT structures. FIG. 9A shows an example of a multilayer lead having a circular cross-section 401 . FIG. 9B shows an example of a multilayer lead having a rectangular cross-section 402 . FIG. 9C shows an example of a multilayer lead having a square cross-section 403 . FIG. 9D shows an example of a multilayer lead having a triangular cross-section 404 . FIG. 9E shows an example of a multilayer lead having an oval cross-section 405 . FIG. 9F shows a rectangular cross-section of a multilayer lead with a first conductive layer 410 and a second conductive layer 420 . The insulating material 430 separates the first layer 410 from the second layer 420 . The first layer 410 and the second layer 420 are connected by holes 440 that traverse the insulating material 430 . The conductive layers 410, 420 may be conductive tapes/strips/sheets/blade or layers of deposited metal, having a metal thickness and a metal strip width. The metal thickness of the first layer 410 is identified by the line A-A, and the metal strip width of the first layer 410 is identified by the line B-B. In one example, the metal thickness of the lead layer may be approximately twice the skin depth. The skin depth is in the range from approximately half the conductor depth to approximately equal to the conductor depth. Each layer in a turn has nearly the same metal thickness and metal strip width.
绝缘材料的厚度可以是足以满足应用的需求，或者等于可用制造技术所可能的最小厚度。此外，整体结构可行性取决于工作的频率(如图4的图形所示)、相关成本和所使用的制造技术。通常，在PCB技术中，层的厚度由“芯材厚度(core thickness)”和半固化片(pre-preg)厚度规定。在其它设计中，选择非导电层的厚度以修改结构的电气行为。The thickness of the insulating material may be sufficient to meet the needs of the application, or equal to the minimum thickness possible with available manufacturing techniques. Furthermore, the overall structural feasibility depends on the frequency of work (as shown in the graph of Figure 4), the associated costs and the fabrication techniques used. Typically, in PCB technology, the thickness of a layer is dictated by the "core thickness" and the pre-preg thickness. In other designs, the thickness of the non-conductive layer is chosen to modify the electrical behavior of the structure.
典型PCB层叠包括芯材和半固化片的交替层。芯材通常包括铜箔接合在两侧的薄的电介质。芯材电介质通常是固化的玻璃纤维-环氧树脂。半固化片通常是未固化的玻璃纤维-环氧树脂。半固化片在加热和压制时固化(即，变硬)。最外层通常是铜箔接合在外侧(表面箔)的半固化片。如图20所示，层叠通常是关于板子的中心、沿着垂直轴对称的，以避免在热循环下在板子中的机械应力。A typical PCB stack-up includes alternating layers of core material and prepreg. The core material typically consists of a thin dielectric with copper foils bonded on both sides. The core dielectric is usually cured fiberglass-epoxy. Prepregs are usually uncured fiberglass-epoxy. The prepreg cures (ie, hardens) when heated and pressed. The outermost layer is usually a prepreg with copper foil bonded to the outside (surface foil). As shown in Figure 20, the stack is typically symmetric about the center of the board, along a vertical axis, to avoid mechanical stress in the board under thermal cycling.
针对13.56MHz处的应用，给出导体和绝缘层厚度等于可用制造技术所可能的最小厚度的一个实施例。在13.56MHz处，趋肤深度大约为17.8微米。在理想情况下，导体深度应该大约为35.6微米，绝缘厚度应该尽可能小。然而，如图21所示，在实际上，使用利用标准的、已制定的低成本技术的PCB制造方法，针对6层PCB板所获得的制造层叠为大约71微米，近似为趋肤深度的4倍。此外，绝缘层大于导电层的3倍。先进PCB技术(明显更高的成本)可能允许较小的导体和绝缘深度。例如，目前处于研究阶段的PCB技术可以允许低至5微米的导电材料(例如，铜)以及大约39微米的绝缘电介质。诸如半导体制造和MEMS制造技术的其他技术可以允许更薄的层厚度，得到更接近理想的性能。如果使用半导体或MEMS制造，则导电层和绝缘层的厚度可以薄至几百纳米，或者更薄。在优选实施例中，电介质层厚度小于200微米，并且优选地尽可能地绝缘，具有小于10的介电常数。For applications at 13.56 MHz, an example is given where the conductor and insulating layer thicknesses are equal to the minimum thicknesses possible with available fabrication techniques. At 13.56MHz, the skin depth is approximately 17.8 microns. Ideally, the conductor depth should be approximately 35.6 microns and the insulation thickness should be as small as possible. However, as shown in Figure 21, in practice, using PCB fabrication methods utilizing standard, established, low-cost technologies, the obtained fabrication stack-up for a 6-layer PCB board is approximately 71 microns, approximately 4 of the skin depth. times. In addition, the insulating layer is 3 times larger than the conductive layer. Advanced PCB technology (significantly higher cost) may allow for smaller conductors and insulation depths. For example, PCB technology currently in the research stage can allow conductive materials (eg, copper) down to 5 microns and insulating dielectrics around 39 microns. Other techniques, such as semiconductor fabrication and MEMS fabrication techniques, may allow for thinner layer thicknesses, resulting in closer to ideal performance. If fabricated using semiconductor or MEMS, the thickness of the conductive and insulating layers can be as thin as a few hundred nanometers, or even thinner. In a preferred embodiment, the dielectric layer is less than 200 microns thick, and is preferably as insulating as possible, with a dielectric constant of less than 10.
类似地，电介质层可以由几种材料制成，并且可以具有各种配置。例如，一些应用可能需要极低的寄生电容。在这些情况下，具有可能的最小介电常数的非导电电介质是优选的。此外，可能希望增加绝缘层厚度以最小化寄生效应。另一示例可以是针对可能需要铁氧体材料以增加电感和/或增加磁屏蔽的应用。在这种情况下，电介质层可以由铁氧体膜/块或类似属性的配置/材料替换。Similarly, the dielectric layers can be made of several materials and can have various configurations. For example, some applications may require extremely low parasitic capacitance. In these cases, a non-conductive dielectric with the smallest possible dielectric constant is preferred. Additionally, it may be desirable to increase the insulating layer thickness to minimize parasitic effects. Another example may be for applications that may require ferrite materials to increase inductance and/or increase magnetic shielding. In this case, the dielectric layer may be replaced by a ferrite film/bulk or a configuration/material of similar properties.
因此，对于本领域技术人员显而易见的是，绝缘材料可以具有一厚度，该厚度在用于制造该谐振器的制造技术的实际能力内，并且与该谐振器所针对的应用的效率需求兼容。Accordingly, it will be apparent to those skilled in the art that the insulating material may have a thickness that is within the practical capabilities of the fabrication techniques used to fabricate the resonator and that is compatible with the efficiency requirements of the application for which the resonator is intended.
导电层的材料可以是铜或金，然而，其他材料也是可以的。为了增强导电性，也可以使用具有一层沉积银的铜或金。在天线被植入并且可能暴露于体液的情况下，应该使用通常已知的生物相容的材料，包括用于增强导电性的添加剂。这些材料可以包括但不局限于选自包括以下各项的组的导电材料：钛、铂和铂/铱合金、钽、铌、锆、铪、镍钛合金、Co-Cr-Ni合金(例如MP35N、)、不锈钢、金及其各种合金、钯、碳或任意其它贵金属。取决于应用，绝缘材料可以是(i)空气，(ii)具有低介电常数的电介质(例如，泡沫聚苯乙烯、二氧化硅或任意适当的生物相容的陶瓷)，(iii)具有高介电常数的非导电电介质，(iv)铁氧体材料，或(v)上面所列材料的组合。材料的选择或材料的组合可以根据诸如制造过程、成本和技术需要的因数。例如，如果需要高电容效应来影响天线的低自谐振频率，高介电常数电介质可能是优选的，或者包括铁氧体膜或铁氧体块的材料的组合可能是优选的，以便增加天线的自感。此外，可以使用铁氧体芯材来提供提升的性能。The material of the conductive layer can be copper or gold, however, other materials are possible. To enhance conductivity, copper or gold with a layer of deposited silver can also be used. Where the antenna is implanted and may be exposed to body fluids, commonly known biocompatible materials should be used, including additives to enhance conductivity. These materials may include, but are not limited to, conductive materials selected from the group consisting of titanium, platinum and platinum/iridium alloys, tantalum, niobium, zirconium, hafnium, nitinol, Co-Cr-Ni alloys (eg MP35N , ), stainless steel, gold and its various alloys, palladium, carbon or any other precious metal. Depending on the application, the insulating material can be (i) air, (ii) a dielectric with a low dielectric constant (eg, styrofoam, silica, or any suitable biocompatible ceramic), (iii) a high dielectric constant A non-conductive dielectric of dielectric constant, (iv) a ferrite material, or (v) a combination of the materials listed above. The choice of material or combination of materials may depend on factors such as manufacturing process, cost and technical requirements. For example, if a high capacitive effect is required to affect the low self-resonant frequency of the antenna, a high permittivity dielectric may be preferred, or a combination of materials including ferrite films or ferrite blocks may be preferred in order to increase the antenna's self-awareness. Additionally, ferrite core materials can be used to provide enhanced performance.
图10A-图10B示出了不同多层引线横截面配置的示例。图10A示出了具有圆形横截面510的多层引线。图10B示出了具有矩形横截面520的多层引线。在图10B中，连接导电层540的孔530位于作为引线的开端的端口或输入端550处。根据特定的应用，连接导电层的孔530的定位会影响MLMT结构的性能。例如，不够的孔可能导致不同层之间的相位差。相反，充足的孔可能导致附加的循环电流路径，而这会增加电阻损耗。孔可以位于引线的开端(例如，端口、输入端等)处，或者位于沿着引线的一个或多个位置处。此外，包括两个或多个导电层的一个集合之间的孔可以位于与包括两个或多个导电层的另一个集合不同的位置处。应该理解，根据应用和系统设计，多种变型是可能的。可以使用对于MLMT结构的制造所使用的技术而言标准的技术来制造孔。在其它情况下，可以使用焊接技术来实现孔，例如，通过使用电焊、熔合接头、激光熔合定位焊或其他公知电连接技术，在孔的位置处连接多个层。10A-10B illustrate examples of different multilayer lead cross-sectional configurations. FIG. 10A shows a multilayer lead having a circular cross-section 510 . FIG. 10B shows a multi-layer lead with a rectangular cross-section 520 . In FIG. 10B, the hole 530 connecting the conductive layer 540 is located at the port or input 550 which is the beginning of the lead. Depending on the particular application, the positioning of the holes 530 connecting the conductive layers can affect the performance of the MLMT structure. For example, insufficient holes can lead to phase differences between different layers. Conversely, sufficient holes may lead to additional circulating current paths, which increase resistive losses. Apertures may be located at the beginning of the lead (eg, port, input, etc.), or at one or more locations along the lead. Furthermore, the holes between one set of two or more conductive layers may be located at different locations than another set of two or more conductive layers. It should be understood that many variations are possible depending on the application and system design. The holes can be made using techniques standard for those used for the fabrication of MLMT structures. In other cases, the holes may be realized using welding techniques, eg, by connecting multiple layers at the location of the holes by using electric welding, fusion joints, laser fusion tack welding, or other well-known electrical connection techniques.
如本文所述，优选地利用高品质因数(QF)的多层引线来设计MLMT结构，以实现功率的有效传递，降低高频处的MLMT结构的本征电阻损耗。品质因数是设备所存储的能量与如图1所给出的、设备损耗的能量之比。因此，MLMT结构的QF是MLMT结构的能量损耗与存储的能量之比。承载时变电流的源设备(例如，天线)具有可以划分为三个分量的能量：1)电阻能量(Wres)，2)辐射能量(Wrad)，以及3)电抗能量(Wrea)。在天线的情况下，所存储的能量是电抗能量，损耗的能量是电阻和辐射能量，其中，天线的品质因数由等式Q＝Wrea/(Wres+Wrad)表示。As described herein, the MLMT structure is preferably designed with high quality factor (QF) multilayer leads to enable efficient transfer of power and reduce intrinsic resistive losses of the MLMT structure at high frequencies. The figure of merit is the ratio of the energy stored by the device to the energy dissipated by the device as given in Figure 1. Therefore, the QF of an MLMT structure is the ratio of the energy loss to the stored energy of the MLMT structure. A source device (eg, an antenna) carrying a time-varying current has energy that can be divided into three components: 1) resistive energy (Wres ), 2) radiated energy (Wrad ), and 3) reactive energy (Wrea ). In the case of an antenna, the stored energy is reactive energy and the dissipated energy is resistive and radiated energy, where the quality factor of the antenna is represented by the equation Q=Wrea /(Wres +Wrad ).
在近场通信中，设备(在这种情况下，是天线)向周围环境释放辐射和电阻能量。当必须在具有有限功率存储器的设备(例如，具有尺寸约束的电池供电的设备)之间传递能量时，过多的功率损耗会极大地降低设备的性能效力。因此，近场通信设备被设计为最小化电阻和辐射能量，同时最大化电抗能量。换言之，近场通信受益于最大化Q。In near field communication, a device (in this case, an antenna) releases radiated and resistive energy into the surrounding environment. When energy must be transferred between devices with limited power storage (eg, battery-operated devices with size constraints), excessive power dissipation can greatly reduce the performance effectiveness of the devices. Therefore, near field communication devices are designed to minimize resistance and radiated energy while maximizing reactive energy. In other words, near field communication benefits from maximizing Q.
例如，在电感耦合的系统中的设备之间的能量和/或数据传递的效率是基于发送机中天线的品质因数(Q1)、接收机中天线的品质因数(Q2)以及两个天线之间的耦合系数(κ)。能量传递的效率根据以下关系而变：eff∝κ2·Q1Q2。更高的品质因数指示天线的能量损耗与所存储的能量之比较低。相反，较低的品质因数指示天线的能量损耗与所存储的能量之比较高。耦合系数(κ)表示在两个天线之间存在的耦合程度。For example, the efficiency of energy and/or data transfer between devices in an inductively coupled system is based on the quality factor (Q1) of the antenna in the transmitter, the quality factor (Q2) of the antenna in the receiver, and the difference between the two antennas. The coupling coefficient (κ) of . The efficiency of energy transfer varies according to the relationship: eff∝κ2 ·Q1 Q2 . A higher figure of merit indicates that the ratio of the energy loss of the antenna to the stored energy is low. Conversely, a lower figure of merit indicates a higher ratio of energy loss to the stored energy of the antenna. The coupling coefficient (κ) represents the degree of coupling that exists between the two antennas.
此外，例如，感应天线的品质因数根据以下关系而变：其中f是工作频率，L是电感，R是总电阻(欧姆+辐射)。由于QF与电阻成反比，所以较高的电阻转变为较低的品质因数。Furthermore, for example, the quality factor of an inductive antenna varies according to the following relationship: where f is the operating frequency, L is the inductance, and R is the total resistance (ohms + radiation). Since QF is inversely proportional to resistance, higher resistance translates into lower figure of merit.
可以针对单匝线圈使用多层引线中的多层来实现较高的品质因数。还可以使用增加线圈中的匝数来增加结构的品质因数。针对恒定频率处的设计，可能存在最佳的层数，以达到最大品质因数。一旦达到该最大值，则随着增加更多的层，品质因数随之降低。可以用于多层引线的设计变量包括：Higher figures of merit can be achieved using multiple layers in a multiple layer lead for a single turn coil. Increasing the number of turns in the coil can also be used to increase the quality factor of the structure. For designs at constant frequency, there may be an optimal number of layers to achieve the maximum quality factor. Once this maximum value is reached, the figure of merit decreases as more layers are added. Design variables that can be used for multilayer leads include:
a.金属条带宽度wn(例如，w1：第一导电层的宽度，wk：第k导电层的宽度。)也称为金属宽度或条带宽度a. Metal strip widthwn (eg, w1 : width of first conductive layer, wk : width of kth conductive layer.) Also known as metal width or strip width
b.每匝的导电层的数目Nn(例如，第一匝中的层数N1)b. The number of conductive layers Nn per turn (eg, the number of layers in the first turn N1 )
c.每个导电层的厚度dn(例如，d1：第一层的厚度，dk：第k层的厚度)c. Thicknessdn of each conductive layer (eg, d1 : thickness of the first layer, dk : thickness of the kth layer)
d.绝缘厚度din(例如，di1：第一层之下的绝缘厚度)，dik：第k层之下的绝缘厚度)d. Insulation thicknessdin (eg, di1 : insulation thickness under the first layer), dik : insulation thickness under the kth layer)
e.匝数Te. Number of turns T
f.连接每一匝中不同导电层的孔的数目f. Number of holes connecting different conductive layers in each turn
g.连接每一匝中不同导电层的孔的位置g. Location of holes connecting different conductive layers in each turn
h.形状(圆形、矩形、某种多边形；取决于应用；例如，可以是共形的，以恰好装配在某个设备或组件外或内)h. Shape (circular, rectangular, some kind of polygon; depending on the application; for example, can be conformal to fit just outside or inside a device or component)
i.配置(螺线管形、螺旋形、螺旋-螺线管形等)i. Configuration (solenoid, helical, helical-solenoid, etc.)
j.维度(长度、宽度、内径、外径、对角线等)j. Dimensions (length, width, inner diameter, outer diameter, diagonal, etc.)
下面，描述基于上述参数的示例性多层引线设计。Below, exemplary multilayer lead designs based on the above parameters are described.
在一个示例中，使用多层引线创建的MLMT结构可以是单匝圆形线圈，如图11A-11D所示。单匝线圈包括单匝，并且可以包括近似1.75mm的金属条带宽度、近似0.03mm的金属厚度、近似0.015mm的绝缘层和近似5mm的外径。引线可以具有在5至60之间的层，例如5、11、20、26、41或60层。例如，图11A示出了具有1层的单匝MLMT结构，图11B示出了具有11层的单匝MLMT结构，图11C示出了具有20层的单匝MLMT结构，且图11D示出了具有26层的单匝MLMT结构。尽管图11A-11D示出了特定示例，但是应该理解，引线可以具有少于5层或多于60层，以便实现高品质因数。针对5至60层范围的对应线圈厚度可以在近似0.2mm至3mm之间，例如分别为0.2、0.5、1、1.25、2.05、或3mm。如上所述，可以理解，通过改变引线中的层数、匝数、金属厚度以及金属条带宽度，可以获得更高的品质因数。例如，对于具有0.03mm金属厚度和1.75mm的金属条带宽度的1层单匝线圈，10MHz处的品质因数近似为80。将层数从1增加至11并保持0.03mm的金属厚度以及1.75mm的金属条带宽度，品质因数增加为近似210。通常，每匝的层数的增加导致品质因数的增加，直到达到最大值，然后，品质因数开始降低。这种降低可能会在MLMT结构的总高度变为与其半径相当时出现。对于电子组件，由于寄生效应(例如，电容和邻近效应)极大地增加而开始劣化，而寄生效应增加是由于多层导致的。在本示例中，将层增加至20、26、41和60分别导致近似212、220、218和188的品质因数。In one example, an MLMT structure created using multiple layers of leads may be a single-turn circular coil, as shown in Figures 11A-11D. A single turn coil includes a single turn, and may include a metal strip width of approximately 1.75mm, a metal thickness of approximately 0.03mm, an insulating layer of approximately 0.015mm, and an outer diameter of approximately 5mm. The leads may have between 5 and 60 layers, eg 5, 11, 20, 26, 41 or 60 layers. For example, FIG. 11A shows a single-turn MLMT structure with 1 layer, FIG. 11B shows a single-turn MLMT structure with 11 layers, FIG. 11C shows a single-turn MLMT structure with 20 layers, and FIG. 11D shows a A single-turn MLMT structure with 26 layers. 11A-11D show specific examples, it should be understood that the leads may have fewer than 5 layers or more than 60 layers in order to achieve a high figure of merit. The corresponding coil thickness for the range of 5 to 60 layers may be between approximately 0.2 mm to 3 mm, eg 0.2, 0.5, 1, 1.25, 2.05, or 3 mm, respectively. As mentioned above, it will be appreciated that by varying the number of layers in the lead, the number of turns, the thickness of the metal, and the width of the metal strips, higher figures of merit can be obtained. For example, for a 1-layer, single-turn coil with a metal thickness of 0.03 mm and a metal strip width of 1.75 mm, the figure of merit at 10 MHz is approximately 80. Increasing the number of layers from 1 to 11 and maintaining a metal thickness of 0.03 mm and a metal strip width of 1.75 mm increases the figure of merit to approximately 210. Generally, an increase in the number of layers per turn results in an increase in the figure of merit until a maximum value is reached, after which the figure of merit begins to decrease. This reduction may occur when the overall height of the MLMT structure becomes comparable to its radius. For electronic components, degradation begins due to a large increase in parasitic effects (eg, capacitance and proximity effects) due to multiple layers. In this example, increasing the layers to 20, 26, 41, and 60 resulted in figures of merit of approximately 212, 220, 218, and 188, respectively.
为了展示本教导相对于现有技术方案的益处，形成本教导的模型，以与已知线圈进行比较。假定使用实心引线(solid wire)来做出现有技术模型。对于具有半径r、引线半径a、匝N的圆形线圈，电感(L)和电阻(R欧姆和R辐射)由以下等式给出：To demonstrate the benefits of the present teachings over prior art solutions, models of the present teachings were developed for comparison with known coils. The prior art model is assumed to be made using solid wire. For a circular coil with radius r, lead radius a, and turns N, the inductance (L) and resistance (Rohm and Rradiation) are given by the following equations:
考虑两种天线配置，在下面的表1和表2中提供了其细节。结果指示，本教导允许远高于实心引线的QF。在使用其它已知构造方法时，本文所示的性能改进也适用。Consider two antenna configurations, details of which are provided in Tables 1 and 2 below. The results indicate that the present teachings allow much higher QF than solid leads. The performance improvements shown herein also apply when using other known construction methods.
表1Table 1
表2Table 2
还应该理解，可以增加金属条带宽度以实现更高的品质因数。图12提供了随频率而变的品质因数的值的图。图13A是示出了电阻和电感随着层数的相对改变的图示。图13B示出了10MHz处得到的品质因数。应该注意，对于图13A-B，图上的数据点对应如下：数据点1针对1层，数据点2针对11层，数据点3针对20层，数据点4针对26层，数据点5针对41层，数据点6针对60层。为了确保信号流过结构的所有层，优选地，针对任意多层引线和/或结构，包括至少两个孔。优选地，这两个孔位于引线/结构的端口处。从图12和13A-B可见，针对具有26层和1匝的天线配置，实现了针对10MHz的最佳性能。对于该天线配置，在35MHz附近获得了峰值品质因数，并且峰值品质因数近似为1100。It should also be understood that the metal strip width can be increased to achieve higher figures of merit. Figure 12 provides a graph of the value of the figure of merit as a function of frequency. 13A is a graph showing relative changes in resistance and inductance with the number of layers. Figure 13B shows the figure of merit obtained at 10 MHz. It should be noted that for Figures 13A-B, the data points on the graph correspond as follows: data point 1 for layer 1, data point 2 for layer 11, data point 3 for layer 20, data point 4 for layer 26, and data point 5 for layer 41 layer, data point 6 is for 60 layers. To ensure signal flow through all layers of the structure, preferably, for any multilayer lead and/or structure, at least two holes are included. Preferably, these two holes are located at the ports of the leads/structures. As can be seen from Figures 12 and 13A-B, the best performance for 10 MHz is achieved for the antenna configuration with 26 layers and 1 turn. For this antenna configuration, a peak figure of merit is obtained around 35 MHz and is approximately 1100.
在另一示例中，天线可以是多层引线的单匝圆形线圈，并且可以具有近似1mm的金属条带宽度、近似0.01mm的金属厚度、近似0.005mm的绝缘层以及近似5mm的外径。引线可以具有在16与128之间的层，例如16、32、64或128层。然而，可以理解，引线可以具有少于16层或多于128层，以便实现高品质因数。针对16至128层范围的对应线圈厚度可以在近似0.25mm至2mm之间，例如分别为0.25、0.5、1或2mm。在该示例中，品质因数随着层数的增加而改善，在较高频率处实现较大的品质因数。例如，在10MHz的频率处，针对16、32、64和128层的品质因数分别为近似127、135、140和185。在这些设计参数下，峰值品质因数在近似450MHz处增加至接近2900。相对电阻可能在导体厚度为大约趋肤深度两倍的频率处最低。在该示例中，该频率是160MHz。In another example, the antenna may be a single-turn circular coil of multi-layer leads, and may have a metal strip width of approximately 1 mm, a metal thickness of approximately 0.01 mm, an insulating layer of approximately 0.005 mm, and an outer diameter of approximately 5 mm. The leads may have between 16 and 128 layers, eg 16, 32, 64 or 128 layers. However, it is understood that the leads may have fewer than 16 layers or more than 128 layers in order to achieve a high quality factor. The corresponding coil thickness for the 16 to 128 layer range may be between approximately 0.25mm to 2mm, eg 0.25, 0.5, 1 or 2mm, respectively. In this example, the figure of merit improves as the number of layers increases, achieving a larger figure of merit at higher frequencies. For example, at a frequency of 10 MHz, the figures of merit for layers 16, 32, 64 and 128 are approximately 127, 135, 140 and 185, respectively. At these design parameters, the crest figure of merit increases to nearly 2900 at approximately 450MHz. Relative resistance may be lowest at frequencies where the conductor thickness is approximately twice the skin depth. In this example, the frequency is 160MHz.
图14A-C是示出了性能参数和趋势的图示。图14A是示出了随频率而变的品质因数的图。图14B是示出了随频率而变的关于16层线圈的电感的图示。图14C是示出了随频率而变的关于16层线圈的电阻的图示。从图14A可见，品质因数随着层数增加而改善，在较高频率处具有相对更大的品质因数。这在图14B-C中进一步示出了，其中示出了电感随着频率相对恒定(与16层1匝线圈相比)，而电阻随着频率增加而降低，如图14C中100MHz附近的凹处所示。峰值品质因数在450MHz附近上升至近似2900。14A-C are graphs showing performance parameters and trends. FIG. 14A is a graph showing the figure of merit as a function of frequency. 14B is a graph showing the inductance for a 16-layer coil as a function of frequency. Figure 14C is a graph showing resistance as a function of frequency for a 16-layer coil. As can be seen from Figure 14A, the figure of merit improves as the number of layers increases, with a relatively larger figure of merit at higher frequencies. This is further illustrated in Figures 14B-C, which show that the inductance is relatively constant with frequency (compared to a 16-layer 1-turn coil), while the resistance decreases with increasing frequency, as shown in Figure 14C for a concave near 100MHz shown here. The peak figure of merit rises to approximately 2900 around 450MHz.
在另一示例中，除了匝数翻倍之外，所有设计参数与针对32层引线的前一示例相同，得到双匝圆形线圈。在1MHz至200MHz的频率范围中，该32层、双匝天线的电感和电阻相对于32层单匝天线分别增加为3-3.5倍和1.7-3倍。图15A-C是示出了与前一示例中的32和64层单匝天线相比，该32层、双匝天线的性能参数和趋势的图示。图15A是示出了随频率而变的品质因数的图示。图15B是示出了随频率而变的电感的图示。图15C是示出了随频率而变的电阻的图示。从图15A-C可见，对于在大约200MHz之下的频率处的32层、双匝天线，电感几乎恒定，电阻遵循与单匝天线类似的趋势。在高于200MHz的频率处，由于寄生电容的贡献，电感和电阻均快速上升(下面进行解释)。即使品质因数在高于200MHz的频率处保持较高，由于寄生效应，也可能存在显著的电场，而这在一些应用中可能是不可接受的。In another example, all design parameters are the same as the previous example for a 32-layer lead, except that the number of turns is doubled, resulting in a two-turn circular coil. In the frequency range of 1 MHz to 200 MHz, the inductance and resistance of the 32-layer, double-turn antenna are increased by 3-3.5 times and 1.7-3 times, respectively, relative to the 32-layer single-turn antenna. 15A-C are graphs showing performance parameters and trends for the 32-layer, dual-turn antenna compared to the 32- and 64-layer single-turn antennas in the previous example. FIG. 15A is a graph showing figure of merit as a function of frequency. FIG. 15B is a graph showing inductance as a function of frequency. Figure 15C is a graph showing resistance as a function of frequency. It can be seen from Figures 15A-C that for the 32-layer, dual-turn antenna at frequencies below about 200 MHz, the inductance is nearly constant and the resistance follows a similar trend to the single-turn antenna. At frequencies above 200MHz, both inductance and resistance rise rapidly due to parasitic capacitance contributions (explained below). Even if the figure of merit remains high at frequencies above 200MHz, there may be significant electric fields due to parasitic effects, which may not be acceptable in some applications.
如上所述，天线可能显示出寄生效应。与天线相关联的寄生电容是频率相关的，并且其对总阻抗的贡献随着频率而增加。作为寄生电容的结果，存在针对天线的自谐振频率，在超出自谐振频率的频率处，天线就向电容器一样工作。为了避免寄生电容的出现，可以设计天线，使得电感在工作频率附近几乎不变。优选地，电抗相对频率的曲线的斜率是几乎线性的(在工作频率附近)，具有斜率：(其中，X是电抗，L是所设计的电感)。以这种方式操作天线确保了通过电场的寄生耦合保持为最小。可以理解，由于其他效应，例如电流拥挤、临近和趋肤效应，X相对ω可能不是完全线性的。As mentioned above, the antenna may exhibit parasitic effects. The parasitic capacitance associated with the antenna is frequency dependent and its contribution to the overall impedance increases with frequency. As a result of the parasitic capacitance, there is a self-resonant frequency for the antenna, at frequencies beyond which the antenna behaves like a capacitor. To avoid parasitic capacitance, the antenna can be designed so that the inductance is almost constant around the operating frequency. Preferably, the slope of the reactance versus frequency curve is nearly linear (around the operating frequency), with a slope of: (where X is the reactance and L is the designed inductance). Operating the antenna in this way ensures that parasitic coupling through the electric field is kept to a minimum. It will be appreciated that X may not be perfectly linear with respect to ω due to other effects such as current crowding, proximity and skin effects.
还可以想到，其他设计可以用于天线，以实现较高的品质因数。例如，对于可能具有16和128之间的层(例如，16、32、64或128层)的多层引线的单匝圆形线圈，线圈可以包括近似1mm的金属条带宽度、近似0.01mm的金属厚度、近似0.01mm的绝缘层以及近似10mm的外径。增加金属的宽度降低了电阻和电感，得到更高的品质因数。由于天线的整体大尺寸(外径～10mm)，宽度(w)的较小增加不会降低电感。应该注意，对于较小天线，例如具有近似5mm外径的天线，金属宽度的相同增加会得到更大的电感的降低。图16A-C是示出了针对金属条带宽度分别为近似1mm、1.5mm和2mm的该示例的、随频率而变的品质因数的图示。在该示例中，379MHz处的品质因数对于1mm的金属条带宽度近似为1425。金属条带宽度增加至1.5mm和2mm则使品质因数分别增加至近似1560和1486。It is also contemplated that other designs can be used for the antenna to achieve higher figures of merit. For example, for a single-turn circular coil of multi-layer leads that may have between 16 and 128 layers (eg, 16, 32, 64, or 128 layers), the coil may include approximately 1 mm of metal strip width, approximately 0.01 mm of Metal thickness, insulation layer approximately 0.01mm, and outer diameter approximately 10mm. Increasing the width of the metal reduces resistance and inductance, resulting in a higher quality factor. Due to the overall large size of the antenna (~10mm outer diameter), small increases in width (w) do not reduce inductance. It should be noted that for smaller antennas, such as antennas with an outer diameter of approximately 5mm, the same increase in metal width results in a greater reduction in inductance. 16A-C are graphs showing figure of merit as a function of frequency for this example with metal strip widths of approximately 1 mm, 1.5 mm, and 2 mm, respectively. In this example, the figure of merit at 379 MHz is approximately 1425 for a metal strip width of 1 mm. Increasing the metal strip width to 1.5mm and 2mm increases the figure of merit to approximately 1560 and 1486, respectively.
应该注意，上面针对电感所述的所有QF值是在自由空间中的(电导率＝0，相对介电常数＝1)。预计现实世界环境的存在将影响QF。例如，在自由空间中具有QF～400的天线当被放置在靠近人体时，QF可能改变为大约200-300。此外，如果天线被放置在人体内，具有很少或几乎没有绝缘覆盖，则QF可能进一步改变为低于200。在放置在人体内之前施加足够厚的盖子或包围在足够大的封装内可能减小天线的QF改变。预计QF特性的类似改变将出现在任何介质中，并且在任何材料的附近，与自由空间的偏离取决于材料/介质的电气属性和与之的距离。It should be noted that all QF values described above for inductance are in free space (conductivity=0, relative permittivity=1). The presence of real-world environments is expected to affect QF. For example, an antenna with QF-400 in free space may change the QF to about 200-300 when placed close to the human body. Furthermore, if the antenna is placed inside the human body with little or no insulating coverage, the QF may further change to below 200. Applying a sufficiently thick cover or enclosing within a sufficiently large package prior to placement in the human body may reduce the QF change of the antenna. Similar changes in QF properties are expected to occur in any medium, and in the vicinity of any material, the deviation from free space depends on the electrical properties of the material/medium and the distance from it.
如本文所讨论的，针对无线发送/接收使用近场通信适用于能量、功率或数据网络。As discussed herein, the use of near field communication for wireless transmission/reception is applicable to energy, power or data networks.
能量网络energy network
可以根据本教导来形成能量传递网络。图17示出了近场能量网络10的高级框图。网络10包括多个设备11a-d(统称为设备11)。每个设备11可以包括收发机。收发机可以包括发送单元12a-d和接收单元14a-d，用于无线通信。尽管每个收发机可以包括发送单元12和接收单元14，但是可以理解，收发机可以进包括发送单元12或仅包括接收单元14。此外，可以理解，收发机中的发送单元12和接收单元14可以共享某些或所有电路单元，或者可以具有分离且不同的电路单元。此外，发送单元和/或接收单元14可以与负载16耦合。负载16可以包括设备11内的组件、设备11外的组件、或者设备11内和外的组件的组合。Energy transfer networks can be formed in accordance with the present teachings. FIG. 17 shows a high-level block diagram of the near field energy network 10 . The network 10 includes a plurality of devices 11ad (collectively referred to as devices 11). Each device 11 may include a transceiver. The transceiver may comprise a transmitting unit 12ad and a receiving unit 14ad for wireless communication. Although each transceiver may include a transmit unit 12 and a receive unit 14, it will be appreciated that a transceiver may further include the transmit unit 12 or only the receive unit 14. Furthermore, it is understood that the transmitting unit 12 and the receiving unit 14 in the transceiver may share some or all circuit units, or may have separate and different circuit units. Furthermore, the transmitting unit and/or the receiving unit 14 may be coupled to the load 16 . Load 16 may include components within equipment 11 , components outside equipment 11 , or a combination of components within and outside equipment 11 .
每个发送单元12包括发送天线13。发送天线13具有谐振频率ω，并且优选地具有最小电阻和辐射损耗。负载16可以包括驱动器电路，用于产生信号来驱动发送天线13。根据接收信号，发送天线13可以产生所有方向上(全方向上)的近场，或者产生目标朝向特定方向(定向)的近场。可以通过屏蔽，例如通过铁氧体材料来产生目标近场。当然，本领域技术人员可以理解，可以使用其它材料来提供目标近场。Each transmission unit 12 includes a transmission antenna 13 . The transmitting antenna 13 has a resonant frequency ω, and preferably has minimal resistance and radiation losses. Load 16 may include driver circuitry for generating signals to drive transmit antenna 13 . Depending on the received signal, the transmit antenna 13 can generate a near field in all directions (omnidirectional), or a near field in which the target is directed toward a specific direction (direction). The target near field can be generated by shielding, for example by a ferrite material. Of course, those skilled in the art will appreciate that other materials may be used to provide the target near field.
每个接收单元14包括接收天线15。单根天线可以用于接收天线15和发送天线13二者，或者可以针对接收天线15和发送天线13使用分离的天线。每个天线13、15具有谐振频率(称为ωa-ωd)。如果使用分离的发送和接收天线，则优选地，接收天线15的谐振频率等于发送天线13的谐振频率。Each receiving unit 14 includes a receiving antenna 15 . A single antenna may be used for both receive antenna 15 and transmit antenna 13 , or separate antennas may be used for receive antenna 15 and transmit antenna 13 . Each antenna 13, 15 has a resonant frequency (called ωa - ωd ). If separate transmit and receive antennas are used, the resonant frequency of the receive antenna 15 is preferably equal to the resonant frequency of the transmit antenna 13 .
当一个设备11的接收单元14(例如，设备11b的接收单元14b)被放置在另一设备11的发送天线12(例如，设备11a的发送天线12a)的近场中时，发送天线12a所产生的电磁场将与接收单元14b交互。如果接收单元14(例如，具有谐振频率ωb的设备11b的接收单元14b)的谐振频率与发送单元12(例如，具有谐振频率ωa的设备11a的发送单元14a)的谐振频率相同，则发送单元11a的电抗电磁场将在接收单元14b中感生交变电流。所感生的电流可以用于向负载16b提供功率或转送数据。结果，设备11b能够从设备11a吸收能量。可以理解，任意数目的具有与发送设备的谐振频率(例如，ωb)相等的谐振频率的设备可以添加到近场能量网络，并且从发送设备汲取能量，只要发送单元12a的谐振频率不会由于所添加设备的负载效应而显著改变。When the receiving unit 14 of one device 11 (eg, the receiving unit 14b of the device 11 b) is placed in the near field of the transmitting antenna 12 of the other device 11 (eg, the transmitting antenna 12a of the device 11a ), the transmission The electromagnetic field generated by the antenna12a will interact with the receiving unit14b . If the resonant frequency of the receiving unit 14 (eg the receiving unit 14b of the device 11b having the resonant frequency ωb ) is the same as the resonant frequency of the transmitting unit 12 (eg the transmitting unit 14a of the device 11a having the resonant frequency ωa ) In the same way, the reactive electromagnetic field of the transmitting unit11a will inducean alternating current in the receiving unit 14b. The induced current may be used to provide power to the load16b or to transfer data. Asa result, the device11b is able to absorb energy from the device 11a. It will be appreciated that any number of devices havinga resonant frequency equal to the resonant frequency of the transmitting device (eg, ωb ) can be added to the near-field energy network and draw energy from the transmitting device, as long as the resonant frequency of the transmitting unit 12a does not Significantly changed due to loading effects of added equipment.
如果接收单元14(例如，具有谐振频率ωc的设备11c的接收单元14c)的谐振频率与发送单元12(例如，具有谐振频率ωa的设备11a的发送单元12a)的谐振频率不同，则接收单元14c对于发送单元12a将具有高阻抗，并且从发送单元12a汲取较少的能量。If the resonant frequency of the receiving unit 14 (eg the receiving unit 14c of the device 11c with the resonant frequency ωc ) is the same as the resonant frequency of the transmitting unit 12 (eg the transmitting unit 12a of the device 11a with the resonant frequency ωa ) different, then the receiving unit14c will havea high impedance to the transmitting unit12a and draw less energy from the transmitting unit 12a.
可以理解，从发送单元12a传递到接收单元14c的能量的量取决于多种因素，包括发送单元12a和接收单元14c中的本征损耗以及至其他设备(例如，接收单元14b)的能量的传递。每个设备中ωa与ωc的临近和谐振波段的宽度也是显著的。图18A-F示意了示出各种因素如何影响能量的传递的图示。It will be appreciated that the amount of energy transferred from transmit unit 12a to receive unit14c depends ona variety of factors, including intrinsic losses in transmit unit12a and receive unit14c and to other devices (eg, receive unit 14b) . ) energy transfer. The proximity of ωa and ωc in each device and the width of the resonance bands are also significant. 18A-F illustrate diagrams showing how various factors affect the transfer of energy.
图18A示出了ωa和ωc相同且波段窄的情形。这表示理想的场景以及最大功率传递效率的情况。图18B示出了ωa和ωc不同且波段窄的情形。在该场景中没有能量传递。图18C示出了ωa和ωc不同且接收单元14c具有宽谐振的情形。较宽的谐振波段出现在天线具有较高电阻和辐射损耗时。接收单元14c针对ωa具有高于图18B所示情形中的阻抗，但是仍然能够从发送设备11a吸收一些能量。图18D示出了ωa和ωc不同且发送设备11a是有损的情形。发送设备11a中的电阻和辐射损耗导致宽的谐振波段。天线能量的较小部分可用于传递至接收单元14c。图18E示出了ωa和ωc远离且发送单元12a和接收单元14c均为有损的情形。因此，没有能量从发送单元12a传递到接收单元14c。图18F示出了ωa和ωc靠近且发送单元12a和接收单元14c均为有损的情形。能量在发送单元12a和接收单元14c之间传递，但是由于高损耗，系统是低效的。FIG. 18A shows the case where ωa and ωc are the same and the band is narrow. This represents the ideal scenario and the situation of maximum power transfer efficiency. FIG. 18B shows the case where ωa and ωc are different and the band is narrow. There is no energy transfer in this scene. FIG. 18C shows the case where ωa and ωc are different and the receiving unit 14c has a broad resonance. A wider resonance band occurs when the antenna has higher resistance and radiation losses. The receiving unit14c hasa higher impedance for ωa than in the situation shown in Fig. 18B, but is still able to absorb some energy from the transmitting device11a . FIG. 18D shows the case where ωa and ωc are different and the transmitting device 11a is lossy. Resistance and radiation losses in the transmission device 11a result ina broad resonance band. A smaller fraction of the antenna energy is available for transfer to the receiving unit14c . FIG. 18E shows the case where ωa and ωc are far away and both transmitting unit 12a and receiving unit 14c are lossy. Therefore, no energy is transferred from the transmitting unit12a to the receiving unit 14c. FIG. 18F shows the situation where ωa and ωc are close together and both transmitting unit 12a and receiving unit 14c are lossy. Energy is transferred between the transmitting unit12a and the receiving unit14c , but the system is inefficient due to high losses.
多数日常物体是导电的(例如，钢柜和汽车)，并且具有与图*18C中接收单元14c类似的频率响应(但是由于更大的电阻损耗而更宽)。这些物体因此能够从发送单元12a吸收一些能量，并且构成系统中的损耗。然而，至此，仅讨论了一般化的能量传递，能量的使用会根据应用而改变，而且广泛而言，可以是功率的传递或数据的传递。Most everyday objects are conductive (eg, steel cabinets and cars) and have a similar frequency response to receiver unit 14c in Figure *18C (but wider due to greater resistive losses). These objects are thus able to absorb some energy from the transmission unit12a and constitute losses in the system. However, so far, only generalized energy transfer has been discussed, the use of energy may vary depending on the application, and may be, broadly speaking, the transfer of power or the transfer of data.
功率网络power network
可以根据本教导来形成功率传递网络。当接收单元14b被放置在发送单元12a的近场内且接收单元14b的谐振频率(即，ωb)近似等于发送单元12a的谐振频率(ωa)时，能量从发送单元12a传递到接收单元14b。如果都具有等于发送单元12a的谐振频率(即，ωa)的谐振频率的多个接收设备(例如，11b-11d)被放置在近场中，则每个接收设备(例如，11b-11d)将以交变电流的形式从发送单元12a吸收能量。接收设备11a-11d可以包括换能器，换能器可以使用感生的交变电流将能量存储在功率存储设备(例如，电池或电容)中。备选地，换能器可以使用感生的交变电流，直接对接收设备内或耦合到接收设备(例如，11b-11d)的电子组件供电。Power transfer networks may be formed in accordance with the present teachings. When the receiving unit14b is placed within the near field of the transmitting unit 12a and the resonant frequency (ie,ωb) of the receiving unit14b is approximately equal to the resonant frequency (ωa) of the transmitting unit 12a, energy is released from the transmitting unit 12a.a is passed to the receiving unit14b . If multiple receiving devices (eg, 11b - 11d ) all having a resonant frequency equal to that of the transmitting unit 12a (ie, ωa ) are placed in the near field, then each receiving device (eg, 11b - 11d ) will absorb energy from the transmission unit 12a in the form of an alternating current. The receiving devices11a -11d may include transducers that may store energy in a power storage device (eg, a battery or capacitor) using the induced alternating current. Alternatively, the transducer may use an induced alternating current to directly power electronic components within or coupled to the receiving device (eg, 11b - 11d ).
可以理解，不可能将所有发送和接收设备(例如，11b-11d)都放置在发送单元12a的近场内。如图19所示，为了向近场外的接收设备11(例如，接收设备11e)传递能量，可以使用一个或多个中继器18。一个或多个中继器18可以包含调谐到ωa的天线20。中继器18可以经由天线20，以感生电流的形式从发送单元12汲取能量。一个或多个中继器18可以使用感生电流，以使用天线20来产生第二能量场。备选地，可以使用第二天线(未示出)来产生第二能量场。第二能量场可以用于在接收单元14e中感生交变电流。接收单元14e可以包括换能器，换能器可以使用感生的交变电流，在功率存储设备(例如，电池或电容)中存储能量。备选地，换能器可以使用感生的交变电流，对接收单元14e内的电子组件供电。可以理解，天线20或第二天线(未示出)可以产生所有方向上(全方向上)的近场，或者产生目标朝向特定方向(定向)的近场。It will be appreciated that it is not possible to place all transmitting and receiving devices (eg, 11b - 11d ) within the near field of the transmitting unit 12a . As shown in Figure 19, in order to deliver energy to a receiving device 11 outside the near field (eg, receiving device 11e ), one or more repeaters 18 may be used. One or more repeaters 18 may include antennas 20 tuned to ωa . The repeater 18 may draw energy from the transmitting unit 12 in the form of an induced current via the antenna 20 . One or more of the repeaters 18 may use the induced current to generate the second energy field using the antenna 20 . Alternatively, a second antenna (not shown) may be used to generate the second energy field. The second energy field may be used to induce an alternating current in the receiving unit14e . The receiving unit14e may include a transducer that may store energy in a power storage device (eg, a battery or capacitor) using the induced alternating current. Alternatively, the transducer may use an induced alternating current to power electronic components within the receiving unit14e . It will be appreciated that the antenna 20 or a second antenna (not shown) may generate a near field in all directions (omnidirectional), or a near field in which the target is directed towards a specific direction (direction).
数据网络data network
可以根据本教导来形成数据传递网络。除了网络中发送设备所发送的信号可以是承载数据的调制时变信号之外，针对数据传递所设计的网络可以与先前描述的功率网络类似。针对数据网络，存在多种可能的一般布局。Data delivery networks may be formed in accordance with the present teachings. The network designed for data transfer may be similar to the previously described power network, except that the signals sent by the transmitting devices in the network may be modulated time-varying signals carrying data. There are a number of possible general layouts for data networks.
数据网络布局的一个示例包括一个或多个接收单元(14b-d)放置在发送单元12a的近场内。每个接收单元(14b-d)能够与发送单元12a和/或其他接收单元14通信。可以理解，可以按照上述方式，使用一个或多个中继器18到达在发送单元12的近场之外的接收单元。在另一示例中，接收单元14可以放置在发送单元12的远场，并且使用发送单元12的辐射场来通信。以与本领域技术人员已知的近场通信技术类似的方式实现这种近场通信。An example ofa data network topology includes one or more receiving units (14bd ) placed within the near field of the transmitting unit 12a. Each receiving unit ( 14bd ) is capable of communicating with the transmitting unit 12a and/or the other receiving units 14 . It will be appreciated that one or more repeaters 18 may be used to reach receiving units outside the near field of the transmitting unit 12 in the manner described above. In another example, the receiving unit 14 may be placed in the far field of the transmitting unit 12 and communicate using the radiation field of the transmitting unit 12 . This near field communication is accomplished in a similar manner to near field communication techniques known to those skilled in the art.
网络内的设备11可以被设计为以多种方式处理数据传递。例如，设备11及其天线13、15可以被设计为(1)仅接收数据；(2)仅发送数据；或者(3)接收且发送数据，针对接收和发送使用共享天线，或针对接收和发送使用分离且专用的天线。此外，设备11可以被设计为处理数据和功率传递。在这种情况下，每个设备11可以被设计为：(1)仅传递数据；(2)仅传递功率；(3)传递数据和功率，其中每个设备11可以使用发送/接收数据和发送/接收功率的任意组合，每个设备11具有用于数据传递和功率传递的共享天线，或者每个设备11具有用于数据传递和功率传递的分离的专用天线。The devices 11 within the network can be designed to handle data transfer in a variety of ways. For example, the device 11 and its antennas 13, 15 may be designed to (1) only receive data; (2) only transmit data; or (3) receive and transmit data, using a shared antenna for reception and transmission, or for both reception and transmission Use separate and dedicated antennas. Furthermore, the device 11 may be designed to handle data and power transfer. In this case, each device 11 can be designed to: (1) transfer only data; (2) transfer only power; (3) transfer data and power, wherein each device 11 can use transmit/receive data and transmit / Any combination of received power, with each device 11 having a shared antenna for data transfer and power transfer, or each device 11 having separate dedicated antennas for data transfer and power transfer.
每个接收单元14可以具有对于网络10上的该接收单元14唯一的电子标识(ID)。ID用作网络上的特定接收单元14的标识符，并且允许网络上的接收单元14识别网络10上的其他接收单元14以便通信。为了发起数据传递会话，发送设备利用ID来识别接收设备，并使用发起指令来开始通信。使用特定调制方案，将产生数据传递。可以使用安全协议来确保设备传递的数据和设备存储的数据是安全的，并且所设计网络10中未出现的未授权设备无法访问该数据。Each receiving unit 14 may have an electronic identification (ID) unique to that receiving unit 14 on the network 10 . The ID serves as an identifier for a particular receiving unit 14 on the network and allows the receiving unit 14 on the network to identify other receiving units 14 on the network 10 for communication. To initiate a data transfer session, the sending device uses the ID to identify the receiving device and initiates the communication using an initiation command. Using a specific modulation scheme, a data transfer will result. Security protocols may be used to ensure that data communicated by devices and data stored by devices is secure and cannot be accessed by unauthorized devices not present in the designed network 10 .
周期性数据通信可能发生在发送单元12和一个或多个接收单元14之间，或者在接收单元14和一个或多个其他接收单元14之间。在发送单元-接收单元的通信中，发送单元12可以根据ID来识别特定的接收单元14，并发起通信会话。备选地，接收单元14可以根据ID来识别发送单元12，并发起通信会话。通信会话可以由发送单元12或者接收单元14终止。Periodic data communication may take place between the sending unit 12 and one or more receiving units 14, or between the receiving unit 14 and one or more other receiving units 14. In the sending unit-receiving unit communication, the sending unit 12 can identify a specific receiving unit 14 according to the ID, and initiate a communication session. Alternatively, the receiving unit 14 may identify the sending unit 12 according to the ID and initiate a communication session. The communication session may be terminated by the sending unit 12 or the receiving unit 14 .
在接收单元-接收单元的通信中，两个接收单元14可以在直连通信中直接彼此连接。备选地，两个接收单元14可以使用发送单元12作为媒介，彼此连接。在这种情况下，每个接收单元14可以与发送单元12相连，并且发送单元12将从一个接收单元14接收信息并将信息发送至另一接收单元14。在另一备选实施例中，两个接收单元14可以使用一个或多个中继器18来通信，其中，一个或多个中继器18从接收单元14接收信号并将信号发送至另一接收单元14。一个或多个中继器18可以是一个或多个孤立的谐振天线，或者可以与任意电路无关。In receiving unit-to-receiving unit communication, the two receiving units 14 may be directly connected to each other in direct communication. Alternatively, the two receiving units 14 may be connected to each other using the transmitting unit 12 as an intermediary. In this case, each receiving unit 14 may be connected to a transmitting unit 12 and the transmitting unit 12 will receive information from one receiving unit 14 and transmit information to the other receiving unit 14 . In another alternative embodiment, the two receiving units 14 may communicate using one or more repeaters 18, wherein one or more repeaters 18 receive signals from the receiving units 14 and transmit signals to the other receiving unit 14 . The one or more repeaters 18 may be one or more isolated resonant antennas, or may be independent of any circuit.
可以在各种应用中使用图17和图19中所示的用于有效地在两个或多个设备之间传递能量的系统和方法，以便操作：家用电器，例如真空吸尘器、熨斗、电视、计算机外围设备、移动设备；军事应用，例如侦查设备、夜视设备、传感器节点和设备；交通运输应用，例如设计用于监视汽车或火车性能和安全的传感器；航空应用，例如控制机翼、方向舵或起落装置；太空技术；海事应用，例如对无人船只供电的应用；交通控制应用，例如路面嵌入式传感器；工业应用；机器人网络；以及医疗设备。The systems and methods shown in Figures 17 and 19 for efficiently transferring energy between two or more devices can be used in a variety of applications to operate: household appliances such as vacuum cleaners, irons, televisions, Computer peripherals, mobile devices; Military applications such as reconnaissance equipment, night vision equipment, sensor nodes and devices; Transportation applications such as sensors designed to monitor the performance and safety of cars or trains; Aerospace applications such as control wings, rudders or landing gear; space technology; maritime applications, such as those that power unmanned vessels; traffic control applications, such as road-embedded sensors; industrial applications; robotic networks; and medical devices.
通用近场功率和数据传递系统Universal near-field power and data transfer system
如本教导所认识的，近场功率和数据传递是从相同的物理原理中导出的。当一起使用时，近场功率和数据传递提供了创建各种系统的机会。以下描述针对近场功率和数据传递的通用系统。As recognized by the present teachings, near-field power and data transfer are derived from the same physical principles. When used together, near-field power and data transfer offer the opportunity to create a variety of systems. A general system for near-field power and data transfer is described below.
近场功率和数据网络(在此也称为“NF-PDAT”)可以包括多个发送和接收单元。为了简单性，考虑包括单个发送单元12和单个接收单元14的更简单的网络。以下描述遵循从发送单元12至接收单元14并至与接收单元14耦合的负载的能量路径。A near-field power and data network (also referred to herein as "NF-PDAT") may include multiple transmit and receive units. For simplicity, a simpler network comprising a single sending unit 12 and a single receiving unit 14 is considered. The following description follows the energy path from the transmitting unit 12 to the receiving unit 14 and to the load coupled to the receiving unit 14 .
最初，必须从原始源获得导出PDAT网络所需的能量。原始源可以是主50/60Mz壁上插座、标准电池、可与壁上插座相连的可再充电电池、或具有间接再充电的可再充电电池。壁上插座是获得能量的一种优选方法，因为这种形式的原始源非常充足。在设备无法与壁上插座相连的情况向卡，或者需要便携性的情况下，可以使用电池。此外，可以使用可再充电电池。当可再充电电池的存储能量下降到低于一容量时，可以对可再充电电池进行补充。已知再充电使得电池可以用在以下设备中：该设备非常快地消耗电池，具有对于适当大小的电池而言太小的空间，或者更换电池受限。在可再充电电池中可以使用原始功率源，例如壁上插座或另一电池，来补充电池寿命。在多数设备中，典型地通过将电池连接到壁上插座一小段时间(例如，膝上型电脑或蜂窝电话)来实现再充电。在一些应用中(例如，植入的医疗设备)，直接附着到电源线是不可能的。在这种情形下，使用间接再充电方法，例如与外部电源电感耦合。可以理解，可以通过其他方法来实现再充电。例如，如果在能量源和设备之间存在清楚的视线，则可以使用光链路、激光或高度定向射频波束来传递能量。Initially, the energy required to derive the PDAT network must be obtained from the original source. The original source can be a main 50/60Mz wall outlet, a standard battery, a rechargeable battery connectable to a wall outlet, or a rechargeable battery with indirect recharging. A wall outlet is a preferred method of obtaining energy, as this form of primary source is abundant. Batteries can be used in situations where the device cannot be connected to a wall outlet, or where portability is required. Also, rechargeable batteries can be used. The rechargeable battery can be replenished when the stored energy of the rechargeable battery falls below a capacity. Recharging is known to allow batteries to be used in devices that drain the battery very quickly, have too little space for a properly sized battery, or have limited battery replacement. A primary power source, such as a wall outlet or another battery, can be used in a rechargeable battery to supplement battery life. In most devices, recharging is typically accomplished by connecting the battery to a wall outlet for a short period of time (eg, a laptop or cell phone). In some applications (eg, implanted medical devices), direct attachment to the power cord is not possible. In this case, indirect recharging methods are used, such as inductive coupling with an external power supply. It will be appreciated that recharging may be accomplished by other methods. For example, if there is a clear line of sight between the energy source and the device, the energy can be delivered using optical links, lasers or highly directional radio frequency beams.
可以使用备选的能量源来对系统供电，或者给系统内的组件提供能量(例如，对电池再充电)。这些备选的能量源可包括将一种形式的能量转换为电能。一个这种示例是将动能转换为电能。这可以通过将运动转换为能量来实现。例如，附着到主体的设备可以使用主体运动来旋转电机，使得发电机产生交变电流。另一示例是将光能转换为电能。例如，放置在外的光伏电池可以将太阳光或周围的室内光转换为能量。在另一示例中，可以将压力的改变转换为电能。例如，可以使用适当放置在设备上的压电体，将压力改变(例如，气压改变或通过接触的定向压力)转换为电流。在另一示例中，可以将热梯度转换为电能。例如，可以使用放置在设备内的热电发电机(TEG)，将设备上的温度梯度转换为电能。这种TEG在操作期间产生热的设备中是有用的，例如，可以将热能的一部分转换为电能。Alternative energy sources may be used to power the system, or to power components within the system (eg, to recharge a battery). These alternative energy sources may include converting a form of energy into electrical energy. One such example is the conversion of kinetic energy into electrical energy. This can be achieved by converting motion into energy. For example, a device attached to the body may use the body motion to spin a motor such that the generator produces an alternating current. Another example is converting light energy into electrical energy. For example, photovoltaic cells placed outside can convert sunlight or ambient indoor light into energy. In another example, the change in pressure can be converted into electrical energy. For example, pressure changes (eg, changes in air pressure or directional pressure through contacts) can be converted into electrical current using piezoelectrics appropriately placed on the device. In another example, the thermal gradient can be converted into electrical energy. For example, thermoelectric generators (TEGs) placed within the device can be used to convert temperature gradients across the device into electrical energy. Such TEGs are useful in devices that generate heat during operation, for example, to convert a portion of thermal energy into electrical energy.
本教导还包括一种用在高效无线功率和数据遥感勘测系统中的设计多层引线的方法。假定特定操作频率，可以遵循以下步骤中的一个或多个步骤来设计专用多层引线和/或MLMT结构：The present teachings also include a method of designing multi-layer leads for use in efficient wireless power and data telemetry systems. Assuming a specific operating frequency, one or more of the following steps can be followed to design a dedicated multilayer lead and/or MLMT structure:
1.执行解析计算和系统级仿真，以获得针对足够耦合系数的最小所需电感1. Perform analytical calculations and system-level simulations to obtain the minimum required inductance for sufficient coupling coefficients
2.根据解析计算(例如，针对耦合系数、感生电压等)，选择适当电感所需的匝数2. Select the number of turns required for the appropriate inductance based on analytical calculations (eg, for coupling coefficients, induced voltages, etc.)
3.选择导体层厚度为：约趋肤深度的2倍、或者根据制造技术可允许的最小值；二者中高的那个。3. Select the thickness of the conductor layer as: about 2 times the skin depth, or the minimum allowable according to the manufacturing technology; whichever is higher.
4.选择绝缘厚度为：制造技术可允许的最小值，或者较大的厚度，以实现所需的性能。4. Select the insulation thickness as the minimum value allowed by the manufacturing technology, or a larger thickness to achieve the desired performance.
5.选择可行的最大表面积(取决于应用)。该面积不需要是方形或圆形的。可以是遵照整体系统的任意形状，且可以绕其他组件蜿蜒。5. Select the maximum surface area available (application dependent). The area need not be square or circular. Can be any shape that follows the overall system and can meander around other components.
6.选择基于制造技术和应用可行的最大的层数。6. Select the largest number of layers that is feasible based on manufacturing technology and application.
7.在数值建模工具(例如，根据MoM或FDTD或FEM或MLFMM或其它工具或这些工具的组合)，利用步骤1和2的匝数，设计多层引线和/或MLMT结构，并优化(步骤3-6)层数和其他参数。7. In a numerical modeling tool (e.g., based on MoM or FDTD or FEM or MLFMM or other tools or a combination of these), using the number of turns from steps 1 and 2, design the multilayer lead and/or MLMT structure, and optimize ( Step 3-6) Layers and other parameters.
a.确保在所选频率所在之处获得品质因数峰值a. Make sure you get the peak quality factor at the selected frequency
b.确保针对该品质因数的电感大于或等于(根据系统级约束)可允许的最小值b. Ensure that the inductance for this figure of merit is greater than or equal to the minimum allowable (according to system level constraints)
c.如果需要，通过保持寄生电容效应较低来确保最小化E场(参见前面的部分)c. If desired, ensure that the E-field is minimized by keeping parasitic capacitance effects low (see previous section)
本教导还包括一种在设计了多层引线之后制造多层引线的方法。多层引线使用金属条带，可以通过在例如但不局限于PCB/陶瓷/金属印刷过程或在半导体铸造中的特殊掩膜(mask)来沉积金属条带。备选的制造多层引线的方法可以使用导电的带/条/片/叶片，有一个或多个带/条/片/叶片放置在彼此的上面，由绝缘层分离，并且通过在指定的孔位置处焊料来使多个条带短路。另一制造多层引线的方法是从导电片或“叶片(leaf)”(针对，例如金或铜叶片)剪裁出特定形状，以及与针对导电带/条类似的后续步骤。除了金属沉积过程，例如物理气相沉积、薄膜沉积、厚膜沉积等，还可以使用三维印刷过程(例如Eoplex技术所提供的过程)。The present teachings also include a method of fabricating a multilayer lead after the multilayer lead has been designed. Multilayer leads use metal strips that can be deposited by special masks such as, but not limited to, PCB/ceramic/metal printing processes or in semiconductor foundry. An alternative method of making multilayer leads may use conductive tapes/strips/sheets/blades, with one or more tapes/strips/sheets/blades placed on top of each other, separated by insulating layers, and passed through designated holes. place solder to short out multiple strips. Another method of making multilayer leads is to cut a specific shape from a conductive sheet or "leaf" (for, eg, gold or copper leaves), with subsequent steps similar to those for conductive tapes/strips. In addition to metal deposition processes, such as physical vapor deposition, thin film deposition, thick film deposition, etc., three-dimensional printing processes (such as those provided by Eoplex technology) can also be used.
本教导适合于并入当前的针对多层印刷接线板、印刷电路板的制造技术和具有多层互连的半导体制造技术。随着制造技术的进步，预计多层引线可能极大地受益于这种改进。这种与传统制造技术的兼容性使得相对容易地将这些多层引线并入传统的电路板中。这种进步还可以提供精确的可重复性以及小的形体尺寸(即，高分辨率)。The present teachings are suitable for incorporation into current fabrication techniques for multi-layer printed wiring boards, printed circuit boards, and semiconductor fabrication techniques with multi-layer interconnects. As manufacturing technology advances, it is expected that multilayer leads may benefit greatly from this improvement. This compatibility with conventional manufacturing techniques makes it relatively easy to incorporate these multilayer leads into conventional circuit boards. This advancement can also provide accurate repeatability and small feature size (ie, high resolution).
如上所述，本系统的设计和结构允许扩展的范围(即，发送和接收无线结构之间的分离距离)。范围的增加使得在更大的距离上传递功率，允许发送机进一步远离接收机。例如，在诸如RFID的应用中，针对高频询问器的标签读取范围不大于3英尺，对于某些应用(例如，货盘轨迹)，3英尺是不够的。利用本系统的多层引线所创建的无线结构通过传递特定应用需要用于促进反射更好的扩展读取范围性能所需的询问器信号的集中功率，提供了针对经由RFID的货盘轨迹的改进。在其他应用(例如军事系统)中，本发明所提供的扩展范围能够向在难以到达的位置的设备或者向在荒芜的环境中的设备传递功率。在消费电子产品中，扩展范围允许用户从更方便的位置向设备充电或传递能量。As mentioned above, the design and structure of the present system allows for extended range (ie, separation distance between transmit and receive radio structures). The increase in range allows power to be delivered over greater distances, allowing the transmitter to move further away from the receiver. For example, in applications such as RFID, the tag read range for a high frequency interrogator is no greater than 3 feet, and for some applications (eg, pallet tracking), 3 feet is not sufficient. The wireless structure created with the multi-layer leads of the present system provides an improvement over pallet tracking via RFID by delivering the concentrated power of the interrogator signal needed for specific applications to facilitate reflection for better extended read range performance . In other applications, such as military systems, the extended range provided by the present invention can deliver power to equipment in hard-to-reach locations or to equipment in barren environments. In consumer electronics, extended range allows users to charge or transfer energy to a device from a more convenient location.
本系统还能够实现源自单个设计概念(即用于创建MLMT结构的多层引线)的多个操作需求。本系统可以用作接收机天线、源天线、收发机(充当源和接收机)、以及中继器天线。备选地，该设计可仅用于电感器设计，作为电路中(例如，在RF滤波电路中、RF匹配电路中)的集总元件。The present system is also capable of fulfilling multiple operational requirements derived from a single design concept (ie, the multilayer leads used to create the MLMT structure). The present system can function as receiver antenna, source antenna, transceiver (acting as source and receiver), and repeater antenna. Alternatively, this design can be used for inductor design only, as lumped elements in circuits (eg, in RF filter circuits, RF matching circuits).
本发明的多层引线结构可以体现在各种电路设计实施例中。图22给出了使用多层引线创建的MLMT天线的等效电路图。其包括以下参数：The multilayer lead structures of the present invention may be embodied in various circuit design embodiments. Figure 22 presents an equivalent circuit diagram of an MLMT antenna created using multiple layers of leads. It includes the following parameters:
LM＝本征电感LM = intrinsic inductance
CM＝本征电容CM = intrinsic capacitance
RM＝本征电阻RM = intrinsic resistance
使用多层引线创建的MLMT天线实施例的特性取决于LM、RM和CM的设计值、工作中心频率和放置在端子1和端子2上的附加组件。The characteristics of theMLMT antenna embodiments created using multilayer leads depend on the design values of LM,RM , andCM , the operating center frequency, and the additional components placed on Terminal 1 and Terminal 2.
假定工作的角频率为ω。则MLMT天线实施例的输入阻抗Zinput由基于1(a)和1(b)的等式1(c)概括地给出。The angular frequency of operation is assumed to be ω. Then the input impedanceZinput of the MLMT antenna embodiment is given in general terms by Equation 1(c) based on 1(a) and 1(b).
等式1(a) Equation 1(a)
Z2＝RM+j·ω·LM 等式1(b)Z2=RM +j·ω·LM Equation 1(b)
等式1(c) Equation 1(c)
使用本发明的多层引线创建的MLMT天线结构可以体现在各种电路设计实施例中。例如，使用多层引线创建的MLMT天线结构可以工作在三种模式下：MLMT antenna structures created using the multilayer leads of the present invention can be embodied in various circuit design embodiments. For example, an MLMT antenna structure created using multiple layers of leads can operate in three modes:
模式1：当满足等式2(a)给出的条件1时，作为电感器，例如体现在集总电路单元中，得到等式2(b)。图23给出了等效电路图。Mode 1: When the condition 1 given by Equation 2(a) is satisfied, as an inductor, eg embodied in a lumped circuit unit, Equation 2(b) is obtained. Figure 23 shows the equivalent circuit diagram.
Z1＞＞Z2 等式2(a)Z1>>Z2 Equation 2(a)
Zinput≈Z2 等式2(b)Zinput ≈ Z2 Equation 2(b)
模式2：作为谐振器，例如体现在独立储能电路中或体现在HF和/或RF电路中，其中，谐振器是两种类型之一：Mode 2: As a resonator, eg embodied in a stand-alone tank circuit or in an HF and/or RF circuit, where the resonator is one of two types:
类型1：当满足等式3所给出的条件2时，作为自谐振器。图24A和24B给出了等效电路图。Type 1: As a self-resonator when condition 2 given by Equation 3 is satisfied. 24A and 24B show equivalent circuit diagrams.
ω2·LM·CM≈1 等式3ω2 ·LM ·CM ≈1 Equation 3
类型2：作为谐振器，其中通过串联或并联添加电容器CADDED来实现谐振。图25A和25B给出了示出串联和并联电容器添加的等效电路图。图26A、26B和26C给出了模式2类型2的电路图。Type 2: As a resonator, where resonance is achieved by adding capacitors CADDED in series or in parallel. Figures 25A and 25B present equivalent circuit diagrams showing the addition of series and parallel capacitors. Figures 26A, 26B and 26C show circuit diagrams for Mode 2 Type 2.
在类型1和类型2中，LPickup和Lfeed分别指代拾取电感器和反馈电感器。这些是电感小于使用多层引线创建的MLMT结构的电感值的线圈，并且具有至MLMT结构的某种耦合。耦合可变，以实现从MLMT结构向系统的其余部分传递功率或从系统的其余部分向MLMT结构传递功率的所需匹配条件。为了简单并验证概念，本文描述的实施例提供了单个电容器CADDED以实现谐振的示例，用于示意的目的。在实际电路中，可以使用包括多个电容器和/或电感器和/或电阻器的更复杂电路。可以在系统的发送机侧和/或接收机侧使用图22和24中所示的所有实施例。In Type 1 and Type 2, LPickup and Lfeed refer to the pickup inductor and the feedback inductor, respectively. These are coils with an inductance less than the inductance value of the MLMT structure created using multiple layers of leads, and have some coupling to the MLMT structure. The coupling is variable to achieve the desired matching conditions for power transfer from the MLMT structure to the rest of the system or from the rest of the system to the MLMT structure. For simplicity and proof of concept, the embodiments described herein provide an example of a single capacitor CADDED to achieve resonance for illustrative purposes. In actual circuits, more complex circuits including multiple capacitors and/or inductors and/or resistors may be used. All of the embodiments shown in Figures 22 and 24 can be used on the transmitter side and/or receiver side of the system.
模式3：当满足等式4给出的条件3时，作为电容器Mode 3: When Condition 3 given in Equation 4 is met, as a capacitor
ω2·LM·CM＞1 等式4ω2 ·LM ·CM >1 Equation 4
与现有设计技术相比，本系统中的独特的层的布置和定制的引线分段在类似且更小的封装体积方面表现了改进的系统性能，如比现有技术所实现的品质因数高2倍的品质因数所示。通过将材料与特定属性相结合，指定形状、长度和厚度并定义层的顺序，本系统允许将电感和品质因数与特定应用配对，以最佳地实现所希望的响应，包括但不局限于无线组织仿真、无线遥感勘测技术、无线组件再充电、无线非破坏性测试、无线感测以及无线能量或功率管理。The unique arrangement of layers and customized lead segments in the present system demonstrate improved system performance in a similar and smaller package volume compared to existing design techniques, such as a higher figure of merit than achieved by the prior art 2x figure of merit is shown. By combining materials with specific properties, specifying shape, length and thickness, and defining the order of layers, the present system allows inductance and figure of merit to be paired with specific applications to optimally achieve the desired response, including but not limited to wireless Tissue simulation, wireless telemetry, wireless component recharging, wireless non-destructive testing, wireless sensing, and wireless energy or power management.
本系统的另一特定优点在于其能够通过降低与增加的频率相关联的导体损耗(由于称为趋肤效应的现象)，针对等同或更小设计体积中的功率和/或数据传递，提供近场磁耦合(NFMC)的更有效手段。所提出的系统还提供了一种解决方案，该解决方案可以通过现有制造技术(例如多层印刷接线板)来相对容易地实现，并且因此可以与其他电路组件(例如，IC、电阻器、电容器、表面安装组件等)集成。本系统的其他优点包括降低功耗，从而得到更长的电池寿命(在适用的情况下)，减少天线的Joule加热，降低设施/设备的环境资源的消耗，以及从更有效的能量设备导出的任意其它益处。Another particular advantage of the present system is its ability to provide close to power and/or data transfer in an equivalent or smaller design volume by reducing conductor losses associated with increased frequency (due to a phenomenon known as the skin effect) More efficient means of Field Magnetic Coupling (NFMC). The proposed system also provides a solution that can be implemented relatively easily with existing manufacturing techniques (eg multilayer printed wiring boards) and thus can be integrated with other circuit components (eg ICs, resistors, capacitors, surface mount components, etc.) integration. Other advantages of the present system include reduced power consumption, resulting in longer battery life (where applicable), reduced Joule heating of the antenna, reduced consumption of environmental resources of the facility/equipment, and derived from more efficient energy equipment any other benefits.
可以受益于这些无线系统的其它应用包括但不局限于医疗可植入、医疗不可植入的、商业、军事、航天、工业和其他电子设备或器件应用中的地理感测、石油勘探、故障检验、便携式电子装置、军事防御和医疗设备。可以理解，本发明的范围不仅涵盖受益于效率增加的任意应用，而且涵盖可能需要使用电感单元的任意应用。Other applications that can benefit from these wireless systems include, but are not limited to, medical implantable, medical non-implantable, commercial, military, aerospace, industrial, and other electronic equipment or device applications, geosensing, oil exploration, troubleshooting , portable electronic devices, military defense and medical equipment. It will be appreciated that the scope of the present invention covers not only any application that benefits from increased efficiency, but also any application that may require the use of an inductive unit.
尽管以上描述了最佳模式和/或其他示例，可以理解，可以进行各种修改，并且可以以各种形式和示例来实现本文所公开的主题，并且可以在各种应用中应用教导，本文仅公开了其中的一些教导。意在由所付权利要求来保护落入本教导的真实范围内的任意和所有应用、修改和变型。Although the best mode and/or other examples have been described above, it will be appreciated that various modifications may be made and the subject matter disclosed herein may be implemented in various forms and examples and the teachings may be applied in various applications, only Some of these teachings are disclosed. Any and all applications, modifications and variations that fall within the true scope of the present teachings are intended to be protected by the appended claims.
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| CN201310075086.XACN104037494B (en) | 2013-03-08 | 2013-03-08 | Multilayer lead structures for efficient wireless communication |
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| CN201910508728.8AActiveCN110137676B (en) | 2013-03-08 | 2013-03-08 | Multilayer lead structure for efficient wireless communication |
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