Movatterモバイル変換


[0]ホーム

URL:


CN104004457A - Bonding method - Google Patents

Bonding method
Download PDF

Info

Publication number
CN104004457A
CN104004457ACN201410239821.0ACN201410239821ACN104004457ACN 104004457 ACN104004457 ACN 104004457ACN 201410239821 ACN201410239821 ACN 201410239821ACN 104004457 ACN104004457 ACN 104004457A
Authority
CN
China
Prior art keywords
adhesive
layer
adhesive tape
temperature resistant
glue
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201410239821.0A
Other languages
Chinese (zh)
Inventor
石东
刘岩
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Suzhou Tong Li Photoelectric Technology Services Co Ltd
Original Assignee
Suzhou Tong Li Photoelectric Technology Services Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Suzhou Tong Li Photoelectric Technology Services Co LtdfiledCriticalSuzhou Tong Li Photoelectric Technology Services Co Ltd
Priority to CN201410239821.0ApriorityCriticalpatent/CN104004457A/en
Publication of CN104004457ApublicationCriticalpatent/CN104004457A/en
Pendinglegal-statusCriticalCurrent

Links

Landscapes

Abstract

The invention discloses a bonding method comprising the following steps of firstly, enclosing on a to-be-glued surface of a first to-be-bonded part by using a high-temperature-resistant adhesive tape to form a closed bonding region; secondly, coating an adhesive solution to the bonding region to form an adhesive layer with uniform thickness in the bonding region, and enabling the thickness of the adhesive layer to be larger than the thickness of the high-temperature-resistant adhesive tape; thirdly, heating the adhesive layer to solidify the adhesive solution on the adhesive layer to obtain a solidified adhesive layer; and fourthly, tearing the high-temperature-resistant adhesive tape, and then, bonding a second to-be-bonded part with the first to-be-bonded part. According to the invention, the to-be-glued surface of the first to-be-bonded part is enclosed by using the high-temperature-resistant adhesive tape to form the closed bonding region, so that the adhesive coating range is limited, and furthermore, an adhesive is accurately and rapidly coated.

Description

A kind of applying method
Technical field
The present invention relates to a kind of applying method; be particularly related to full attaching process between a kind of liquid crystal panel or liquid crystal module and cover sheet; or/and the full attaching process between cover sheet and touch sensor, or/and the full attaching process between liquid crystal panel or liquid crystal module and touch sensor.
Background technology
The use range of the product such as touch-screen mobile phone, panel computer is more and more extensive.In the structure of the product such as touch-screen mobile phone, panel computer, generally comprise cover sheet, liquid crystal panel (or liquid crystal module) and touch sensor, the general mode that adopts the tackiness agent of high-clarity to fit that interfixes between them.For example: publication No. is CN102622146, name is called the Chinese invention patent application of " a kind of capacitive touch screen and production method thereof ", announce a kind of capacitive touch screen structure, this capacitive touch screen has capacitive touch sensors, bonding layer, glass cover-plate and flexible printed circuit board, and it utilizes tackiness agent (bonding layer) by relative with glass cover-plate capacitive touch sensors fixing.Granted publication number is CN203232402, name is called the Chinese utility model patent of " a kind of OPS entirely fit capacitance plate ", a kind of OPS capacitance plate of entirely fitting is disclosed, comprise the touch-control module (touch sensor), tack coat and the liquid-crystal display module that are cascading, tack coat is glue or solid-state OCA optical cement.Touch-control module is seamless applying by tack coat and liquid-crystal display module.
When laminating, the solid-state glue laminating of the general OCA of employing or the liquid glue of LOCA are fitted.For example: publication No. is CN103660511, the Chinese invention patent application that name is called " applying method of capacitive touch screen " discloses a kind of applying method of capacitive touch screen, comprise between protection armourplate glass (cover plate) and touch pad (touch sensor), and/or applying method between touch pad and LCD MODULE, comprise the following steps: 1) according to the laminating size between protection armourplate glass and touch pad, formulate printing area; 2) determine web plate and the glue material of the printing of plastic emitting, require gel quantity even, glue mobility is even; 3) particularly at edge part, design the glue amount that remaining glue flows again, prevent that glue from overflowing at periphery; 4) binding face to protection armourplate glass, or the binding face of touch pad, or the binding face of LCD MODULE carries out brush coating; 5) control gel quantity, control rubber quality thickness; 6) laminating, vacuum pressed, UV light irradiation; 7) after sclerosis, complete printing attaching process.The shortcoming of the method is: production efficiency is general, and binding yield is poor, is generally 75%~90%, and cannot heavy industry, is only applicable to the laminating of small-medium size product, can not meet the demand of the full laminating of large size product.
Summary of the invention
The object of the invention is to provide the full applying method of a kind of liquid crystal module.
For achieving the above object, the technical solution used in the present invention is: a kind of applying method, comprises the following steps:
The first step: the high temperature resistant adhesive tape of glue-coated surface for the treatment of at the first parts to be fit encloses the closed stickup district of formation;
Second step: by glue-coating to described stickup district to form the adhesive-layer of an even thickness in described stickup district, and make the thickness of described adhesive-layer be greater than the thickness of described high temperature resistant adhesive tape;
The 3rd step: described adhesive-layer is heated so that the glue of described adhesive-layer solidifies and obtains solidifying adhesive-layer;
The 4th step: described high temperature resistant adhesive tape is removed, then by described the second parts to be fit and described the first parts laminating to be fit.
Preferred technical scheme is: in second step, after described adhesive-layer forms, described adhesive-layer is struck off, and unnecessary glue is scraped to described high temperature resistant adhesive tape.
Preferred technical scheme is: after described high temperature resistant adhesive tape is removed, and adhesive coating outside described curing adhesive-layer scope.
Because technique scheme is used, the present invention compared with prior art has following advantages and effect:
1, the present invention encloses the closed stickup district of formation at the high temperature resistant adhesive tape of glue-coated surface for the treatment of of the first parts to be fit, to limit gluing scope, thereby makes gluing accurate, and speed is fast;
2, the thickness of adhesive-layer of the present invention is greater than the thickness of high temperature resistant adhesive tape, thereby can adjust easily the thickness of adhesive-layer;
3, the unnecessary glue of adhesive-layer of the present invention is scraped to high temperature resistant adhesive tape, thereby removes easily unnecessary glue;
4, the present invention's adhesive coating again outside curing adhesive-layer scope, thus make the first parts to be fit and the second parts to be fit bond strength between the two higher.
Brief description of the drawings
Accompanying drawing 1 is the first block diagram to be fit.
Accompanying drawing 2 is adhesive-layer formation schematic diagram.
Accompanying drawing 3 is fit-state schematic diagram.
In above accompanying drawing, 1, the first parts to be fit; 2, paste district; 3, high temperature resistant adhesive tape; 4, adhesive-layer; 5, the second parts to be fit.
Embodiment
Below in conjunction with drawings and Examples, the invention will be further described:
Embodiment: a kind of applying method
Shown in accompanying drawing 1~3, a kind of applying method, comprises the following steps:
The first step: at the first parts 1(glass cover-plate to be fit) treat that the high temperature resistant adhesive tape 3 of glue-coated surface encloses and form closed stickup district 2;
Second step: by glue-coating to described stickup district 2 with in described stickup district 2, described glue is struck off, and unnecessary glue is scraped to described high temperature resistant adhesive tape, form like this adhesive-layer 4 of an even thickness, and make the thickness of described adhesive-layer 4 be greater than the thickness of described high temperature resistant adhesive tape 3;
The 3rd step: described adhesive-layer 4 is heated so that the glue of described adhesive-layer 4 solidifies and obtains solidifying adhesive-layer; Specifically by the first parts 1(glass cover-plate to be fit) move to baking oven, then heat so that glue solidifies, because there is the existence of heating steps, therefore need adhesive tape to have high temperature resistant.Because the temperature that glue is heating and curing is very wide, the temperature resistant range of high temperature resistant adhesive tape is very wide, can the using of 50 DEG C~150 DEG C of temperature resistant ranges.Can use publication number to be: CN103589362, name is called disclosed adhesive tape in " a kind of high temperature resistant adhesive tape ".
The 4th step: described high temperature resistant adhesive tape 3 is removed, then by described the second parts 5(liquid crystal panel to be fit) fit with described the first parts 1 to be fit.
Be preferred embodiment: after described high temperature resistant adhesive tape is removed, adhesive coating outside described curing adhesive-layer scope.
In other embodiments, the first parts 1 to be fit are liquid crystal panel, and the second parts 5 to be fit are cover sheet, and mode of the present invention can be used for cover sheet and the touch sensor of fitting, and also can be used for liquid crystal module and the touch sensor of fitting.Or fit successively cover sheet, touch sensor and liquid crystal module, to realize the full laminating of product.
Above-described embodiment is only explanation technical conceive of the present invention and feature, and its object is to allow person skilled in the art can understand content of the present invention and implement according to this, can not limit the scope of the invention with this.All equivalences that spirit is done according to the present invention change or modify, within all should being encompassed in protection scope of the present invention.

Claims (3)

CN201410239821.0A2014-06-032014-06-03Bonding methodPendingCN104004457A (en)

Priority Applications (1)

Application NumberPriority DateFiling DateTitle
CN201410239821.0ACN104004457A (en)2014-06-032014-06-03Bonding method

Applications Claiming Priority (1)

Application NumberPriority DateFiling DateTitle
CN201410239821.0ACN104004457A (en)2014-06-032014-06-03Bonding method

Publications (1)

Publication NumberPublication Date
CN104004457Atrue CN104004457A (en)2014-08-27

Family

ID=51365370

Family Applications (1)

Application NumberTitlePriority DateFiling Date
CN201410239821.0APendingCN104004457A (en)2014-06-032014-06-03Bonding method

Country Status (1)

CountryLink
CN (1)CN104004457A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
CN111303781A (en)*2020-04-032020-06-19南昌欧菲生物识别技术有限公司Bonding module and manufacturing method thereof
CN112454921A (en)*2020-10-302021-03-09南通华阁汽车配件有限公司Compound automobile sound insulation foam laminating adhesive laminating process
CN113820875A (en)*2021-09-012021-12-21滁州桐友显示科技有限公司Bonding method and display module
CN113970862A (en)*2021-11-122022-01-25越达光电科技(浙江)有限公司Display screen full-lamination method
CN118385099A (en)*2024-05-222024-07-26深圳清大电子科技有限公司Gluing pretreatment process and device for oversized screen manufacturing
CN119828373A (en)*2023-10-082025-04-15广州视源电子科技股份有限公司Method for manufacturing display device

Citations (3)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
CN103294241A (en)*2012-03-052013-09-11冠伟科技股份有限公司Method for bonding substrates
JP2013199041A (en)*2012-03-232013-10-03Tohoku Pioneer Eg CorpMethod and apparatus for laminating substrates
TW201346678A (en)*2012-03-232013-11-16Tohoku Pioneer Eg CorpLaminating method and laminating device of substrate

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
CN103294241A (en)*2012-03-052013-09-11冠伟科技股份有限公司Method for bonding substrates
JP2013199041A (en)*2012-03-232013-10-03Tohoku Pioneer Eg CorpMethod and apparatus for laminating substrates
TW201346678A (en)*2012-03-232013-11-16Tohoku Pioneer Eg CorpLaminating method and laminating device of substrate

Cited By (9)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
CN111303781A (en)*2020-04-032020-06-19南昌欧菲生物识别技术有限公司Bonding module and manufacturing method thereof
CN112454921A (en)*2020-10-302021-03-09南通华阁汽车配件有限公司Compound automobile sound insulation foam laminating adhesive laminating process
CN112454921B (en)*2020-10-302022-07-05南通华阁汽车配件有限公司Compound automobile sound insulation foam laminating adhesive laminating process
CN113820875A (en)*2021-09-012021-12-21滁州桐友显示科技有限公司Bonding method and display module
CN113820875B (en)*2021-09-012024-05-07滁州桐友显示科技有限公司Bonding method and display module
CN113970862A (en)*2021-11-122022-01-25越达光电科技(浙江)有限公司Display screen full-lamination method
CN113970862B (en)*2021-11-122023-11-10越达光电科技(浙江)有限公司Full-lamination method for display screen
CN119828373A (en)*2023-10-082025-04-15广州视源电子科技股份有限公司Method for manufacturing display device
CN118385099A (en)*2024-05-222024-07-26深圳清大电子科技有限公司Gluing pretreatment process and device for oversized screen manufacturing

Similar Documents

PublicationPublication DateTitle
CN104004457A (en)Bonding method
CN102184049B (en)Glue-overflow-preventing stitching structure and method for flexible circuit board for touch screen
CN106379023B (en)The method and one screen that a kind of curve screens and plane display module are bonded entirely
CN102999200A (en)Touch display device and manufacturing method thereof
CN104656999B (en)One kind bending touching display screen and its manufacturing process
CN102501560A (en)Binding method for capacitive touch screen
CN205788138U (en)A kind of display device and liquid optical cement thereof
CN104309267B (en)A kind of method for bonding substrate, touch display substrate, display device
CN104461203B (en)Cover plate and the film adhered method of touch-control sensing and touch-screen
CN204155237U (en)A kind of New Solid optics double faced adhesive tape and touch-screen thereof and touch-control display module
WO2009054168A1 (en)Display device and method for production thereof
CN103085437A (en)Bonding structure, electronic device with bonding structure and bonding method
CN101738774A (en)Ultrathin flexible liquid crystal display and manufacturing method thereof
CN104360762A (en)ON CELL solid-state full lamination module processing method
CN104898883A (en)Processing method of ON CELL surface fitting module
CN105315910A (en) A kind of AB double-sided adhesive with fluorescence and anti-blue light effect and preparation method thereof
CN106155431A (en)Thin film touch sensing assembly, capacitance touch screen and attaching process thereof
CN203038244U (en) Touch screen display produced by frame bonding method of touch screen and display screen
CN107290877A (en)A kind of processing method device of LCDs
CN103294241A (en)Method for bonding substrates
CN104007877A (en)High adhesive force laminating structure for touch control display equipment
CN202344994U (en)Fitting structure and electronic device with same
CN107678583A (en)A kind of preparation technology of 3D textures handset touch panel
CN109634463A (en)Touch control display apparatus and preparation method thereof
CN105629536A (en)Hard-to-hard liquid crystal screen binding method

Legal Events

DateCodeTitleDescription
C06Publication
PB01Publication
C53Correction of patent of invention or patent application
CB03Change of inventor or designer information

Inventor after:Shi Dong

Inventor before:Shi Dong

Inventor before:Liu Yan

CORChange of bibliographic data

Free format text:CORRECT: INVENTOR; FROM: SHI DONG LIU YAN TO: SHI DONG

C10Entry into substantive examination
SE01Entry into force of request for substantive examination
C02Deemed withdrawal of patent application after publication (patent law 2001)
WD01Invention patent application deemed withdrawn after publication

Application publication date:20140827

RA01Restoration of patent right

Former decision:deemed withdrawal of patent application after publication

Former decision publication date:20161116

RA01Restoration of patent right
RJ01Rejection of invention patent application after publication
RJ01Rejection of invention patent application after publication

Application publication date:20140827


[8]ページ先頭

©2009-2025 Movatter.jp