The content of the invention
It is an object of the present invention to provide a kind of LED drive power large chip.It may be conveniently used different capacity willThe LED light machine module asked, can volume do it is less so that driving power supply can be put into bulb even ray machine mouldGroup is internal, is conducive to the standardization of LED illumination, large-scale popularization.
Technical scheme：LED drive power large chip, is characterized in：The second transparent of W is fixed as including widthSubstrate, the second transparency carrier are printed with silver paste circuit, are formed with interface lead on silver paste circuit, and interface lead has incoming end and defeatedGo out end；The width of incoming end and the width W of light machine template (43) wire incoming endGIt is identical or have the weldering being connected with electric connectorDisk；The interface lead for having N+1 bars parallel on the silver paste circuit of output end, spacing W of adjacent two interface leadsJGSubtract equal to W and connectMouth wire width is again divided by N (WJG=(W- interface lead width)/N)；Un-encapsulated power drives are pasted on second transparency carrier firstWafer stage chip and rectifier bridge wafer stage chip, then by un-encapsulated power drives wafer stage chip and rectifier bridge wafer scaleChip is welded on the second transparency carrier；Rectifier bridge wafer stage chip can be incorporated in power drives wafer stage chip；SecondTransparency carrier has the width at the interface lead end of output end identical with the width W of LED illumination large chip, is highly H2；LED drivesOn power supply large chip, the purposes of the interface lead of output end is for connection to the chip array on described LED illumination large chip's.N is the integer between 3 to 7.
In the LED light machine module that above-mentioned LED drive power large chip is set up, it sets up by the following method：In lightSilver paste circuit is printed in machine template, the silver paste circuit in light machine template is also formed with interface lead, and number and spacing are and LEDThe interface lead of driving power supply large chip is identical, and one side of the LED drive power large chip with silver paste circuit is attached to light machine templateOne side with silver paste circuit carries out butt welding；The one side of LED illumination large chip microarray strip is attached to into light machine template band silver paste electricity simultaneouslyThe one side on road carries out butt welding, and both interface leads mutually correspond to welding；So as to by LED illumination large chip and LED drive powerLarge chip is connected；Finally the gap around LED illumination large chip and driving power supply large chip is encapsulated with transparent adhesive tape.
In aforesaid LED light machine module, the LED illumination large chip includes that a width is also fixed as the first transparent of WSubstrate, transparent substrates are provided with the parallel interface lead of N+1 bars, and the first transparency carrier is provided with N LEDs chip and constitutes LED corePiece series connection group, is respectively positioned between two adjacent interface leads per LEDs chip, and the spacing of two adjacent interface leads is WJGSubtract interface lead width again divided by N (W equal to WJG=(W- interface lead width)/N), and often the both positive and negative polarity of LEDs chip respectively connectsIt is connected in two adjacent interface leads；And while multiple LED strip joint groups in parallel so that being formed on the first transparency carrier can be theThe LED chip array of the N row multirows extended on one transparency carrier length direction；N is the integer between 3 to 7；Setting up LED lightDuring machine module, according to power needs, LED illumination large chip is cut out, is cut into the LED illumination large chip tool of different lengthThere are different power；It is DC3.2V or the high voltage more than DC10V that described LED chip carries voltage.
In aforesaid LED light machine module, the formation side of the LED chip array and interface lead on the first transparency carrierMethod is：The slim epitaxial wafer of transition epitaxial layer formation is done using transparent substrate, epitaxial wafer is using ripe chip fabrication techniques pointLayer growth circuit and LED chip, it is then cleaved to form the LED illumination large chip that width is W, wherein the circuit for growing includesThe wire of the connection chip of interface lead and connection LED chip and interface lead, substrate is used as the first transparency carrier；Described coreTwo pole of piece can adopt transparency electrode, to increase the light-emitting area of chip due to welding；The ripe manufacture skill of described chipArt is：Carry out covering silicon, gluing, photoetching, etching, plated film, alloy and abrasive disc using the layering of Metalorganic chemical vapor deposition equipmentEtc. technique；Or LED chip array is mounted on the first transparency carrier for producing silver paste circuit using conventional art, and lead toCross face-down bonding or the welding of spun gold formal dress is connected with the silver paste circuit on the first transparency carrier, obtain LED illumination large chip, silver pasteBrush circuit includes the wire of interface lead and connection connection chip.
In aforesaid LED drive power large chip, the LED driving methods on the LED drive power large chip are：RectificationCivil power AC is converted into Rectified alternating current by the rectifier bridge on bridge wafer stage chip, and the voltage of Rectified alternating current is more than zero, less than etc.In the specified maximum working voltage V of Rectified alternating currentWR, N section LED loads are set on Rectified alternating current；N is whole between 3 to 7Number；Each section of LED load is cascaded to form LED load series block group, and multiple LED load series block groups form described LEDChip array, when the voltage of Rectified alternating current is raised, the hop count of power drives wafer stage chip control LED load series connection is step by stepIncrease, when the voltage of Rectified alternating current declines, the hop count for controlling LED load series connection reduces step by step, the hop count of LED load series connectionTo be actually connected into the LED load hop count of Rectified alternating current.Civil power AC becomes Rectified alternating current, example after rectifier bridge：AC220V,After the rectified bridge rectification of 50Hz alternating currents, wavy curve of the voltage for half period (180 degree), cycle pulsating direct current at 0 degreeVoltage is zero, and at 90 degree, pulsating dc voltage reaches maximum VWRFor highest DC311V, during 180 degree, voltage is reduced to zero again, weekAnd renew.
In aforesaid LED drive power large chip, the hop count of the LED load series connection is controlled by switch, is switchedControl node for voltage segmentation boundary, the number of fragments of the voltage is corresponding with the hop count that LED load is connected；It is describedThe control method of the hop count of LED load series connection is, by the negative pole direction of every section of LED load respectively by switching connection pulsating direct currentThe negative pole of electricity, then switches on-off to each according to the voltage change of Rectified alternating current and is controlled, using a few sections are openedThe mode on shut-off road realizes the change of the hop count of LED load series connection.LED load can be divided into 3～7 sections, and segmentation is few, and circuit is simple,But curent change is larger, easily low-order harmonic is produced in electrical network；Segmentation is more, then circuit structure is complicated.Typically take 4～6 sections to be preferred.
In aforesaid LED drive power large chip, pulsating direct current operating voltage V of Rectified alternating current is setWMore than VWmax'sPeriod, control is all to be switched off, and stops to all LED loads powering, and realizes overvoltage and surge protection to LED；Pass throughThe maximum allowable pulsating dc voltage V of adjustment Rectified alternating currentWmaxSize, so as to realize that the luminosity of LED is adjusted.
In aforesaid LED drive power large chip, effective operating current I in circuit is measured by arranging current sensorW,Work as IWMore than design load KIWRWhen, all switches are closed to realize current protection, switch on and need to reload voltage in next timeAfter recover, wherein K be regulation coefficient, IWRFor specified effective operating current.
In aforesaid LED drive power large chip, described switch is in pulsating dc voltage ascent stage time delay tmMillisecondAction, shifts to an earlier date t in the pulsating dc voltage decline stagemMillisecond action, to obtain relatively stable LED operation electric current.
In aforesaid LED drive power large chip, arrange each section of LED load being cascaded be with it is different mostThe big LED chip group for carrying magnitude of voltage, obtains can the LED load series block group that worked under switch control rule and be close to ideal sinusoidalThe operating current curve of ripple.
In aforesaid LED drive power large chip, the method for adjustment of the maximum carrying voltage of each section of LED load is：1. with pulsating dc voltage as ordinate, the pulsating direct current cycle be abscissa mapping；2. a pure resistor load, its power are assumedThe sinusoidal graphics area formed in pulsating direct current half-wave is 1, mapping；3. the load power of LED load series block group is set as pureThe 120% of ohmic load, makees the rectangle echo that an area is 1.2, and the ordinate value as series block group of rectangle shade is totalIt is maximum to carry magnitude of voltage；4. in the same manner, it is known that LED load is carried under voltage condition, can be mapped and be drawn the graphics area of LED load,The area sum of checking LED load is more than the pulsating direct current sine wave area under the control node of switch paragraph by paragraph；5. choose LED to bearThe carrying magnitude of voltage of each section of LED load in series block group is carried, being added the maximum carrying magnitude of voltage total more than or equal to series block group isCan；Wherein, the higher LED load of magnitude of voltage is carried near positive terminal, carry the relatively low LED load of magnitude of voltage near negative pole end.
In aforesaid LED light machine module, the material of the light machine template is thin slice transparent non-metallic material (such as SiO2,Al2O3Deng), it is that slim sheet material is warmed to nearly material softening point, stamping forming using pressing equipment using mould.(materialIt is brittle and hardness is higher.So can only cutting mode when being processed into light machine template shape, it is relatively costly.)
The method that LED illumination core component is set up using aforesaid LED light machine module：Arrange soft on LED light machine moduleLoad the inner cover with fluorescent material after property circuit；Inner cover with fluorescent material be by containing fluorescent material injection particulate material with do not contain it is glimmeringThe transparent injected-moulded particulate material of light powder is mixed；Mixed proportion is configured as needed, is then obtained final product by injection mo(u)lding；It is wherein described to containThe injection particulate material of fluorescent material is to mix 20～30% fluorescent powders and 70～80% transparent injected-moulded particulate materials, after hot melt againMake injection particulate material；Fluorescent material is more than the fluorescent material of 8ms from persistence.
Compared with prior art, LED illumination large chip of the invention can meet LED illumination application such as driving, light modulation, mistakeThe various primary demands of voltage and surge protection, overload etc., and can volume do it is less so that can be by driving power supplyIt is put into bulb even ray machine module internal.This has very important significance to LED illumination low cost, miniaturization.So as toDeveloping towards integrated direction for LED chip can be promoted, has made the appearance of illumination large chip become a reality.The two makes jointlyWith the fast development for further being promoted LED illumination industry.
The ray machine module of the present invention goes for all kinds of bulb patents of the present inventor's earlier application, replacement bulb Central PlainsSome ray machine modules.The ray machine module of the present invention in structure can be with built-in power and LED illumination chip, and small volume, easilyIn realization standardization.The present invention can change the existing industry structure centered on LED chip, the LED light machine of the present inventionModule can be to realize that under the pattern of replaceable light source light source (bulb) is standardized, such that it is able to reduce the industry of illuminating productComplexity and the industrial concentration for reducing illuminating product.
In addition, civil power is converted into Rectified alternating current by rectifier bridge by the present invention, while the voltage in each cycle is pressedPhase division is multistage, and using the different characteristic of voltage in multistage, using switch to concatenating the LED load into working conditionHop count is adjusted, so that LED load enters intelligentized operational mode, the operational mode can meet LED chip and power,And this LED type of drive of the present invention can greatly reduce the complexity of driving power supply, so that LED light machine moduleBuilt-in driving power supply is possibly realized, for LED bulb, this realizes that bigger versatility and interchangeability are significant.
Embodiment.LED drive power large chip：Second transparency carrier 413 of W, the second transparent base are fixed as including widthPlate 413 is printed with silver paste circuit, and interface lead is formed with silver paste circuit, and interface lead has incoming end and output end；Incoming endWidth and 43 wire incoming end of light machine template width WGIt is identical or have the pad being connected with electric connector；The silver of output endThe interface lead for having N+1 bars parallel on slurry circuit, spacing W of adjacent two interface leadsJGEqual to W subtract interface lead width again divided byN(WJG=(W- interface lead width)/N)；Un-encapsulated power drives wafer stage chip is pasted on second transparency carrier 413 first411 and rectifier bridge wafer stage chip 412, then by un-encapsulated power drives wafer stage chip 411 and rectifier bridge wafer scaleChip 412 is welded on the second transparency carrier 413；Rectifier bridge wafer stage chip 412 can be incorporated in power drives wafer scale coreIn piece 411；Second transparency carrier 413 has the width at the interface lead end of output end identical with the width W of LED illumination large chip,Highly it is H2；On LED drive power large chip, the purposes of the interface lead of output end is for connection to the described big core of LED illuminationChip array on piece.
Its typical sizes be L=12.4mm, h4=5mm (large-scale) or L=12.4mm, h4=97mm (medium and small), total thicknessDegree is less than 1mm, referring to Fig. 1 and Fig. 2.For anti-oxidation and damage wafer stage chip, in wafer stage chip surface local, dispensing is protectedShield.
LED drive power large chip 410 with LED illumination large chip 420 in be input into road identical width W and interface and leadDistance between centers of tracks WJG；Width W and interface lead spacing WJGIt is that the LED illumination large chip 420 of different manufacturers is driven with the LED of different manufacturersGeneral connecting interface between dynamic power supply large chip 410.The width W of output circuit is that LED strip joins length * interface lead spacing WJG+ conductor width.
As LED drive power large chip 410 can directly adopt mains-supplied, using 410 structure of LED drive power large chipThe characteristics of ray machine module 4 built has small volume, ultra-thin and whole clearing, referring to Fig. 1 and Fig. 2.
In order to LED power driving chip 411 provides a more stable working power, can be in LED drive power large chip410 backs are provided with resistance 416, are easy to adjust internal reference voltage, referring to Fig. 3.
The LED light machine module set up using LED drive power large chip, it sets up by the following method：In ray machine mouldSilver paste circuit 414 is printed on plate 43, the silver paste circuit 414 in light machine template 43 is also formed with interface lead, and number and spacingIt is identical with the interface lead of LED drive power large chip 410, by one side of the LED drive power large chip 410 with silver paste circuitBeing attached to one side of the light machine template 43 with silver paste circuit 414 carries out butt welding；Simultaneously by the one side of 420 microarray strip of LED illumination large chipBeing attached to one side of the light machine template 43 with silver paste circuit 414 carries out butt welding, and both interface leads mutually correspond to welding；So as to incite somebody to actionLED illumination large chip 420 is connected with LED drive power large chip 410；Finally with 420 He of transparent adhesive tape encapsulation LED illumination large chipGap around driving power supply large chip 410.Referring to Fig. 4 and Fig. 5；Light machine template 43 can adopt transparent template, and LED can be made to lightWhen light upward LED drive power large chip 410 can be passed through when by reflecting and blocking for light is reduced.
The LED illumination large chip 420, as shown in fig. 6, first transparency carrier of W is also fixed as including a width421, transparent substrates are provided with the parallel interface lead of N+1 bars, and the first transparency carrier 421 is provided with N LEDs chip 41 and constitutesLED chip series connection group, is respectively positioned between two adjacent interface leads per LEDs chip 41, two adjacent interface leadsSpacing is WJGSubtract interface lead width again divided by N (W equal to WJG=(W- interface lead width)/N), and per the positive and negative of LEDs chip 41Pole is respectively connected in two adjacent interface leads；And while multiple LED strip joint groups in parallel so that the first transparency carrierThe LED chip array of the N row multirows that can extend on 421 length direction of the first transparency carrier is formed on 421；N is between 3 to 7Integer；When LED light machine module is set up, according to power needs, LED illumination large chip 420 is cut out, difference is cut intoThe LED illumination large chip 420 of length has different power
The forming method of the LED chip array and interface lead on the first transparency carrier 421 is：Using transparent liningThe slim epitaxial wafer of transition epitaxial layer formation is done at bottom, and epitaxial wafer is using ripe chip fabrication techniques multi ANN circuit and LED corePiece, it is then cleaved to form the LED illumination large chip that width is W, wherein the circuit for growing includes interface lead and connection LEDThe wire of the connection chip of chip and interface lead, substrate is used as the first transparency carrier；Described two pole of chip is not due to needingWelding, can adopt transparency electrode, to increase the light-emitting area of chip；Described chip maturation manufacturing technology is：Using organic goldCategory chemical vapor depsotition equipment layering carries out covering the techniques such as silicon, gluing, photoetching, etching, plated film, alloy and abrasive disc；Or adoptLED chip array is mounted on the first transparency carrier 421 for producing silver paste circuit 414 by conventional art, and passes through flip chip bondingConnect or the welding of spun gold formal dress is connected with the silver paste circuit 414 on the first transparency carrier 421, obtain LED illumination large chip, silver paste brushCircuit 414 includes the wire of interface lead and connection chip.
LED driving methods on the LED light machine module are：Rectifier bridge on rectifier bridge wafer stage chip 412 is by civil powerAC is converted into Rectified alternating current, and the voltage of Rectified alternating current is more than zero, less than or equal to the specified maximum working voltage of Rectified alternating currentVWR, 3～7 sections of LED loads are set on Rectified alternating current, each section of LED load is cascaded to form LED load series block group,Multiple LED load series block groups form described LED chip array, and when the voltage of Rectified alternating current is raised, power drives are brilliantCircle level chip 411 controls the hop count of LED load series connection to be increased step by step, when the voltage of Rectified alternating current declines, controls LED loadThe hop count of series connection reduces step by step, and the hop count of LED load series connection is the LED load hop count for being actually connected into Rectified alternating current.
The hop count of the LED load series connection is controlled by switch, and the control node of switch is the segmentation boundary of voltage,The hop count that the number of fragments of the voltage is connected with LED load is corresponding；The control method of the hop count of the LED load series connectionIt is, by the negative pole direction of every section of LED load respectively by switching the negative pole for connecting Rectified alternating current, then according to Rectified alternating currentVoltage change each switched on-off be controlled, realize that LED load is connected using by the modes of a few sections of switch open circuitsHop count change.
Pulsating direct current operating voltage V of setting Rectified alternating currentWMore than VWmaxPeriod, control it is all switches off, stopPower to all LED loads, realize the overvoltage and surge protection to LED；By the maximum allowable arteries and veins for adjusting Rectified alternating currentDynamic DC voltage VWmaxSize, so as to realize that the luminosity of LED is adjusted.
Effective operating current I in circuit is measured by arranging current sensorW, work as IWMore than design load KIWRWhen, close instituteHave switch to realize current protection, switch on and need to recover after voltage is reloaded next time, wherein K be regulation coefficient, IWRFor specified effective operating current.
Described switch is in pulsating dc voltage ascent stage time delay tmMillisecond action, in the pulsating dc voltage decline stageT in advancemMillisecond action, to obtain relatively stable LED operation electric current.
The each section of LED load that setting is cascaded is the LED chip group with different maximum carrying magnitudes of voltage, canThe LED load series block group worked under switch control rule is made to obtain the operating current curve for being close to ideal sine wave.
The method of adjustment that each section of LED load be maximum to carry voltage is：1. with pulsating dc voltage as ordinate, arteries and veinsThe dynamic direct current cycle maps for abscissa；2. a pure resistor load, the sinogram that its power is formed in pulsating direct current half-wave are assumedShape area is 1, mapping；3. the load power of LED load series block group is set as the 120% of pure resistor load, making an area is1.2 rectangle echo, the ordinate value of rectangle shade are the total maximum carrying magnitude of voltage of series block group；4. in the same manner, it is known thatLED load is carried under voltage condition, can be mapped and be drawn the graphics area of LED load, the area sum of LED load is verified paragraph by paragraphMore than the pulsating direct current sine wave area under the control node of switch；5. choose each section of LED load in LED load series block groupMagnitude of voltage is carried, the maximum carrying magnitude of voltage total more than or equal to series block group is added；Wherein, carry magnitude of voltage higherLED load carries the relatively low LED load of magnitude of voltage near negative pole end near positive terminal.
The material of the light machine template 43 be thin slice transparent non-metallic material, such as SiO2, Al2O3Deng it is by slim sheet materialNearly material softening point is warmed to, it is stamping forming using pressing equipment using mould.As material is brittle and hardness is higher, thereforeCan only cutting mode when being processed into light machine template shape, it is relatively costly.
The method that LED illumination core component is set up using aforesaid LED light machine module, as shown in fig. 7, in LED light machine mouldLoad the inner cover 61 with fluorescent material after flexible circuit 44 is set in group；Inner cover 61 with fluorescent material is by the note containing fluorescent materialModeling particulate material is mixed with the transparent injected-moulded particulate material without fluorescent material；Mixed proportion is configured as needed, then by being molded intoType is obtained final product；The wherein described injection particulate material containing fluorescent material is by 20～30% fluorescent powders and 70～80% transparent injected-moulded particlesMaterial is mixed, and injection particulate material is made again after hot melt；Fluorescent material is more than the fluorescent material of 8ms from persistence.
It is hereafter the operation principle of the present invention by taking 6 groups of LED loads as an example.I.e. n values are 6.
First, alternating current AC becomes Rectified alternating current, example after rectifier bridge：The rectified bridge of AC220V, 50Hz alternating currentAfter rectification, referring to Fig. 8, wavy curve of the voltage for half period (180 degree), cycle pulsating dc voltage at 0 degree is zero,When 90 degree, pulsating dc voltage reaches maximum VWRFor highest DC311V, during 180 degree, voltage is reduced to zero again, goes round and begins again.
The job requirement of the present invention, in pulsating dc voltage more than zero and less than or equal to VWRBetween, 3～7 sections are arranged altogether bearsCarrying, series system being formed between each section of load, raised with voltage, load (i.e. LED load) series connection hop count increases step by step, load voltageLoaded by switch control rule, referring to Fig. 8 and Figure 11, voltage switch node is that voltage is segmented boundary.
Power supply management operational mode：Not design current control device of the invention, the keying of switches at different levels are only dependent upon VW'sChange, referring to Fig. 8, Figure 11 and Figure 12.
During 0～90 degree of cycle：
1st section：Work original state, the i.e. cycle is initial from 0, circuit breaker in middle K1～K6In opening (ON), electric currentMain warp knuckle point J1By switching K1Path is formed, it is 1V to load by rated voltageWRThe LED compositions of/6 tandem workings；
2nd section：Work as VWMore than or equal to 1VWRWhen/6, switch K1 closes (OFF), and the main warp knuckle point J2 of electric current is by switching K2Path is formed, it is 2V to load by rated voltageWRThe LED compositions of/6 tandem workings；
3rd section：Work as VWMore than or equal to 2VWRWhen/6, switch K1 is in OFF, and switch K2 closes (OFF), the main warp knuckle of electric currentPoint J3 forms path by switching K3, and it is 3V to load by rated voltageWRThe LED compositions of/6 tandem workings；
4th section：Work as VWMore than or equal to 3VWRWhen/6, switch K1～K2 is in OFF, and switch K3 closes (OFF), and electric current is mainWarp knuckle point J4 forms path by switching K4, and it is 4V to load by rated voltageWRThe LED compositions of/6 tandem workings；
5th section：Work as VWMore than or equal to 4VWRWhen/6, switch K1～K3 is in OFF, and switch K4 closes (OFF), and electric current is mainWarp knuckle point J5 forms path by switching K5, and it is 5V to load by rated voltageWRThe LED compositions of/6 tandem workings；
6th section：Work as VWMore than or equal to 5VWRWhen/6, switch K1～K4 is in OFF, and switch K5 closes (OFF), electric current warp knucklePoint J6 forms path by switching K6, and it is 6V to load by rated voltageWRThe LED compositions of/6 tandem workings；
The method for closing of time delay 0.1ms when switch K1～K6 is closed, can be adopted, relatively stable electric current can be obtained.
During 90～180 degree of cycle：
6th section：Work original state, voltage are reduced by maximum downwards, and circuit breaker in middle K1～K5 is closed(OFF), switch K6 and be in opening, electric current warp knuckle point J6 forms path by switching K6, it is 6V to load by rated voltageWR/6The LED compositions of tandem working；
5th section：Work as VWLess than or equal to 5VWRWhen/6, switch K5～K6 opens (ON), and the main warp knuckle point J5 of electric current is by switchK5 forms path, and it is 5V to load by rated voltageWRThe LED compositions of/6 tandem workings；
4th section：Work as VWLess than or equal to 4VWRWhen/6, switch K4～K6 opens (ON), and the main warp knuckle point J4 of electric current is by switchK4 forms path, and it is 4V to load by rated voltageWRThe LED compositions of/6 tandem workings；
3rd section：Work as VWLess than or equal to 3VWRWhen/6, switch K3～K6 opens (ON), and the main warp knuckle point J3 of electric current is by switchK3 forms path, and it is 3V to load by rated voltageWRThe LED compositions of/6 tandem workings；
2nd section：Work as VWLess than or equal to 2VWRWhen/6, switch K2～K6 opens (ON), and the main warp knuckle point J2 of electric current is by switchK2 forms path, and it is 2V to load by rated voltageWRThe LED compositions of/6 tandem workings；
1st section：Work as VWLess than or equal to 1VWRWhen/6, switch K1～K6 opens (ON), and the main warp knuckle point J1 of electric current is by switchK1 forms path, and it is 1V to load by rated voltageWRThe LED compositions of/6 tandem workings.
The open method of 0.1ms in advance when switch K1～K6 is opened, can be adopted, relatively stable electric current can be obtained.
Light modulation operational mode：During outside one given voltage VT=0 of setting, VWmaxCorrespondence CVWR, external voltage gives VT=5VWhen, VWmaxCorrespondence 0V, arranges 0≤VWmax≤CVWR, C regulation coefficients are the multiple of rated voltage, such as C=1.12.VWMore than VWmaxPeriod, correspondence each section switch will close (OFF), stop powering to the load.Which act as a kind of dimming arrangement.Referring to figure10th, Figure 11 and Figure 12, adjusts VWmaxLess than VWR, in figure, yl moiety will increase, and the power for being input to load will be reduced, so as to reachTo the purpose of light modulation.Example：When LED in AC220V civil power normal works is, when adjusting the voltage of alternating current voltage to AC180V, figureIn dash area be VWFormation power projection figure part higher than 254V, from about 55.5 degree to 124.5 degree of cycle, due toIn this time, in (OFF) is closed, the power consumption of dash area is (equivalent to pulsating direct current under normal civil power half for corresponding switch KxRipple loading power 57.0%) will be disallowable, this part power consumption be not loaded into load on, make the luminance-reduction of load.WhenVWmaxDuring equal to 0, all switches will cut out (OFF), and load supplying amount is zero.Stepless dimming can be accomplished, without there is energyAmount is consumed.
Voltage protection operational mode：V is setWmax=CVWR。VWMore than VWmaxPeriod, correspondence each section switch will close(OFF), stop powering to the load.Referring to Fig. 9, Figure 11 and Figure 12, example：When civil power reaches the high voltage of 270V, the moon in figureShadow part is VWFormation power projection figure part higher than 348V, from about 66 degree to 114 degree of cycle, due in this time, in (OFF) is closed, the power consumption of dash area is (equivalent to the loading power of pulsating direct current half-wave under normal civil power for K1～K6 switches50.2%) will be disallowable, this part power consumption be not loaded into load on, load is not burnt because of overvoltage.
Overcurrent protection operational mode：The present invention has overcurrent protection, and referring to Figure 12, current sensor is measured in circuit effectivelyOperating current IWMore than design load KIWR, K is regulation coefficient, example：Setting IWR=275mA, K=1.2, logic switch controller willAll switches K1～K6 (OFF) are closed, switch (ON) K1～K6 is opened and need to be recovered after power supply pressure is reloaded next time.
According to principle same as described above, mode of loading can be divided into 3～7 sections, and segmentation is few, and circuit is simple, but curent changeIt is larger, easily low-order harmonic is produced in electrical network, referring to Figure 13；Segmentation is more, then circuit structure is complicated.Typically take 4～6 sections to be preferred.
Note：VW- pulsating direct current operating voltage (1.4142* alternating voltages)；VWRThe specified maximum working voltage of-pulsating direct current(1.4142* alternating voltages)；VWmax- maximum allowable pulsating dc voltage (1.4142* alternating voltages)；IW- effectively work is electricStream.IWR- specified effective operating current.
If civil power is AC220, the voltage after rectification is DC311V, so that every group of LED load is as single chip as an example, then perChip bears DC52V；Such as AC110, then chip bears DC26V.If the loading power area of pulsating direct current half-wave is 1, referring to figure14, in figure, each LED load (LED modules 1 to 6) is loaded power difference than larger, and LED modules 1 reach pulsating direct current half-waveLoading power area 20.68% (for chip nominal output 84.4%)；And LED modules 6 only 5.11% (are chip volumeMake power 19.2%), the about a quarter power of module 1, through actual measurement checking, the intrinsic brilliance of module 6 is very low；EntirelyThe power being averagely loaded of chipset for chip nominal output 52.4%, the utilization rate of chip is relatively low；And the volume of chipsetMake power (dotted line frame area) for pulsating direct current half-wave loading power area 159%.Due to chip redundancy amount it is excessive, not onlyChip is wasted, and also results in that driving power supply is excessive and wastes, while increased the difficulty on arranging.Therefore, under Constant Direct Current stateThe method of chip voltage is selected to there are some problems under pulsating direct current state, how in the premise for ensureing chip secure workUnder, the utilization rate for improving chip becomes a problem to be solved.
The nominal output of the LED chip array of 6 series connection of setting is turned down by 1.59 times that pulsating direct current half-wave loads powerTo 1.2 times (occur in view of small grids civil power and be not less than 1.2 times of fluctuations), referring to Figure 15, if LED chip array chip holdsLoad power (hatched area in figure) loads 1.2 times of power (pulsating direct current half-wave part area) for pulsating direct current half-waveWhen, the carrying voltage that can extrapolate chip array when civil power is AC220V by Figure 15 mappings is DC236V；
Referring to Figure 16, different magnitudes of voltage are respectively provided with to module 6 to LED modules 1, different bearer magnitude of voltage can be obtainedUnder chip loading power area (dash area in figure)；
Using 2*52V+4*35V high voltage chips, (model VES-AADBHV45 of module 1 and module 2, module 3 arrive mouldGroup 6 is ES-AADBHF40) composition serial array, then the carrying Voltage Cortrol of chip array is DC244V；Make Figure 17, acquisitionChip array is loaded 96.67% that power area is pulsating direct current half-wave power area, and the power that chip array is loaded connectsNearly 1 is perfect condition；The power that now LED chip array is loaded is chip array nominal output 77.6%；Experimental verification withEstimated value is close.
The module loading power checking of each voltage section：If the loading power area of pulsating direct current half-wave is 1, voltage is vertical seatTimestamp, it is 26.52% to calculate DC52V chips nominal output easily by Figure 16, and in the same manner, the nominal output of DC35V chips is17.89%；Figure 17 be then civil power be AC220V when, the power situation being loaded of each module of LED chip array；Table 1 is chipWhen the power that array is loaded is pulsating direct current half-wave power area 1, line voltage is respectively AC220V, AV246V, AC270VEach module is loaded the situation of power, as can be seen that only module 3 is slightly transshipped in DC311V and DC348V in table, but due toModule 1 and module 2 have margin of power, and experiment proves that module 3 can pass through.
When civil power is 110V, optimal way is carried out with reference to above-mentioned.
Ideally the checking computations of chip bearing power are as shown in the table：