技术领域technical field
本发明涉及用于屏蔽印刷布线板等的屏蔽膜、使用该屏蔽膜的屏蔽印刷布线板以及屏蔽印刷布线板的制造方法，该印刷布线板等被用于计算机、通讯设备、打印机、便携式电话机、摄像机等装置。The present invention relates to a shielding film, a shielding printed wiring board using the shielding film, and a method of manufacturing a shielding printed wiring board used for computers, communication equipment, printers, mobile phones, etc., for shielding printed wiring boards, etc. , cameras and other devices.
背景技术Background technique
柔性印刷布线板（下文也称为“FPC”）构成为：在聚酰亚胺膜或聚酯膜等柔性绝缘膜的至少单面上通过粘合剂或不通过粘合剂形成有印刷电路，而且，按照需要在该印刷电路的顶面例如通过下述方法形成有表面保护层，即，通过粘合剂在该印刷电路的顶面上粘合有柔性绝缘膜且该柔性绝缘膜中与用于搭载电路部件的端子以及用于连接外部基板的端子的形成部位相对应地形成有开口，或者，通过涂布感光性绝缘树脂并进行干燥、曝光、显影、热处理等工序形成开口。在小型化、高性能化迅速发展的便携式电话机、摄像机、笔记本型个人计算机等电子设备中，为了将电路安装在复杂的结构中多使用FPC。而且，充分利用其优良的柔性，在打印头之类的可动部与控制部的连接中也使用柔性印刷布线板。在较多使用FPC的电子设备中，必需考虑电磁波屏蔽对策，在装置内使用的FPC中也开始采用实施了电磁波屏蔽对策的屏蔽柔性印刷布线板（下文称为“屏蔽FPC”）。A flexible printed wiring board (hereinafter also referred to as "FPC") is constituted by forming a printed circuit on at least one side of a flexible insulating film such as a polyimide film or a polyester film with or without an adhesive, Also, a surface protection layer is formed on the top surface of the printed circuit as needed, for example, by a method in which a flexible insulating film is adhered to the top surface of the printed circuit with an adhesive and the flexible insulating film is mixed with the Openings are formed corresponding to the terminals on which the circuit components are mounted and the terminals for connecting to the external substrate, or formed by applying a photosensitive insulating resin and performing steps such as drying, exposure, development, and heat treatment. In electronic devices such as mobile phones, video cameras, and notebook personal computers, which are rapidly becoming smaller in size and higher in performance, FPCs are often used in order to mount circuits in complex structures. Furthermore, taking full advantage of its excellent flexibility, flexible printed wiring boards are also used to connect movable parts such as print heads and control parts. In electronic equipment that frequently uses FPCs, it is necessary to consider electromagnetic wave shielding measures, and shielded flexible printed wiring boards (hereinafter referred to as "shielded FPCs") that implement electromagnetic wave shielding measures have also begun to be used in FPCs used in devices.
例如，专利文献1所公开的屏蔽FPC按如下制成，在离型膜的单面上隔着离型剂涂布树脂而形成覆盖膜（保护层），在该覆盖膜（保护层）的单面上粘贴屏蔽层而形成屏蔽膜，在FPC的至少单面侧使用导电性粘合剂，通过加热、加压粘贴屏蔽膜，并且将屏蔽层和设置在FPC中的接地电路通过导电性粘合剂电连接后，剥离离型膜，从而形成屏蔽印刷布线板。For example, the shielding FPC disclosed in Patent Document 1 is manufactured as follows. On one side of a release film, a resin is applied via a release agent to form a cover film (protective layer), and a single surface of the cover film (protective layer) is formed. Paste the shielding layer on one surface to form a shielding film, use a conductive adhesive on at least one side of the FPC, paste the shielding film by heating and pressing, and bond the shielding layer and the ground circuit provided in the FPC by conductive bonding After the agent is electrically connected, the release film is peeled off, thereby forming a shielded printed wiring board.
现有技术文献prior art literature
专利文献patent documents
专利文献1：日本特开2004-95566号公报Patent Document 1: Japanese Patent Laid-Open No. 2004-95566
发明内容Contents of the invention
但是，如上所述，当使用在离型膜的单面涂布了离型剂的覆盖膜（保护层）时，离型膜与覆盖膜（保护层）的粘合程度（剥离强度）依赖于离型剂的特性，难以控制其粘合程度（剥离强度）。因此，将离型膜从覆盖膜（保护层）剥离时，有时会出现由于粘合力过大而覆盖膜（保护层）本身破损的情况，或者出现离型膜由于粘合力过小而在制造过程中从覆盖膜（保护层）剥离的情况。However, as mentioned above, when using a cover film (protective layer) coated with a release agent on one side of the release film, the degree of adhesion (peel strength) between the release film and the cover film (protective layer) depends on The characteristics of the release agent make it difficult to control the degree of adhesion (peel strength). Therefore, when the release film is peeled from the cover film (protective layer), the cover film (protective layer) itself may be damaged due to excessive adhesive force, or the release film may be damaged due to too small adhesive force. The case of peeling from the cover film (protective layer) during the manufacturing process.
因此，本发明的目的在于提供一种可通过适当控制离型膜相对于保护层的粘合力来防止出现由于过大或过小的粘合力粘合所引起的不利情况的屏蔽膜、屏蔽印刷布线板及屏蔽印刷布线板的制造方法。Therefore, it is an object of the present invention to provide a shielding film, a shielding film, and a shielding film that can prevent adverse situations caused by excessive or too small adhesive force bonding by properly controlling the adhesive force of the release film with respect to the protective layer. A method for manufacturing a printed wiring board and a shielded printed wiring board.
本发明提供一种屏蔽膜，其中，在离型膜的整个单面上形成有凹凸部，在该离型膜的形成有该凹凸部的面上隔着离型剂涂布树脂从而形成保护层，并进一步在保护层上形成有电磁波屏蔽层，所述屏蔽膜的特征在于，将上述离型膜从上述保护层剥离后，上述保护层的表面粗糙度（Ra）为0.2μm-1.0μm。The present invention provides a shielding film, in which a concave-convex portion is formed on the entire single surface of a release film, and a protective layer is formed by coating a resin on the surface of the release film on which the concave-convex portion is formed via a release agent. , and an electromagnetic wave shielding layer is further formed on the protective layer, the shielding film is characterized in that after the release film is peeled off from the protective layer, the surface roughness (Ra) of the protective layer is 0.2 μm-1.0 μm.
根据上述结构，在离型膜与保护层之间隔着离型剂粘合在一起的状态下，由于离型膜表面的凹凸部及保护层表面的凹凸部所产生的锚固效应（anchor effect），使离型膜对保护层的粘合性提高到在以后的工序中将屏蔽膜浸渍在药液中之类的时候药液不会进入到保护层和离型膜之间从而可防止离型膜从保护层剥离的程度，上述保护层表面的凹凸部是通过转印离型膜表面的凹凸部而形成的，且该保护层的表面粗糙度（Ra）为0.2μm-1.0μm。另外，在对具有凹凸部的离型膜涂布离型剂的过程中离型剂处于自然地且大致均匀地扩散配置的状态后，再涂布保护层用的树脂，从而制成通过转印离型膜表面的凹凸部而形成的、表面粗糙度（Ra）为0.2μm-1.0μm的保护层。由此，能够将离型膜相对于保护层的粘合性控制在从保护层剥离离型膜时保护层本身不会由于过大的粘合力而破损的程度。这样，由于能够适当地控制离型膜对保护层的粘合力，因此能够防止以过大的粘合力或过小的粘合力粘合离型膜时所产生的问题。According to the above-mentioned structure, in the state where the release film and the protective layer are bonded through the release agent, due to the anchor effect (anchor effect) generated by the unevenness on the surface of the release film and the unevenness on the surface of the protective layer, Improve the adhesion of the release film to the protective layer so that when the shielding film is immersed in the chemical solution in the subsequent process, the chemical solution will not enter between the protective layer and the release film, thereby preventing the release film The degree of peeling from the protective layer, the unevenness on the surface of the protective layer is formed by transferring the unevenness on the surface of the release film, and the surface roughness (Ra) of the protective layer is 0.2 μm-1.0 μm. In addition, in the process of coating the release agent on the release film with concave and convex parts, after the release agent is naturally and approximately uniformly diffused and arranged, and then coated with a resin for the protective layer, it is made by transfer printing. A protective layer with a surface roughness (Ra) of 0.2μm-1.0μm formed by the unevenness of the release film surface. Accordingly, the adhesiveness of the release film to the protective layer can be controlled to such an extent that the protective layer itself is not damaged by excessive adhesive force when the release film is peeled off from the protective layer. In this way, since the adhesive force of the release film to the protective layer can be appropriately controlled, it is possible to prevent problems that arise when the release film is bonded with excessively high or low adhesive force.
另外，本发明的屏蔽膜还可以具有下述特征，即，上述离型膜相对于上述保护层的剥离强度为1N/50mm-20N/50mm。In addition, the masking film of the present invention may have a feature that the release film has a peel strength of 1N/50mm to 20N/50mm with respect to the protective layer.
根据上述结构，通过将离型膜相对于保护层的剥离强度设定为1N/50mm-20N/50mm，能够使离型膜相对于保护层的粘合力达到最佳。According to the above structure, by setting the peel strength of the release film to the protective layer at 1N/50mm-20N/50mm, the adhesive force of the release film to the protective layer can be optimized.
另外，本发明的屏蔽膜还可以具有下述特征，即，将上述屏蔽膜载置在印刷布线板上并进行加热、加压后，上述离型膜对于上述保护层的剥离强度是1N/50mm-10N/50mm。In addition, the masking film of the present invention may have a feature that, after the masking film is placed on a printed wiring board and heated and pressurized, the release film has a peel strength of 1 N/50 mm to the protective layer. -10N/50mm.
根据上述结构，通过将上述屏蔽膜载置在印刷布线板上并进行加热、加压后的上述离型膜对于上述保护层的剥离强度设定在1N/50mm-10N/50mm，能够使离型膜相对于保护层的粘合力达到最佳。According to the above structure, by setting the peeling strength of the above-mentioned release film to the above-mentioned protective layer at 1N/50mm-10N/50mm after placing the above-mentioned shielding film on the printed wiring board, heating and pressing, the release film can be made The adhesion of the film to the protective layer is optimal.
另外，本发明的屏蔽膜还可以具有下述特征，即，上述电磁波屏蔽层包含导电性粘合剂层。Moreover, the shielding film of this invention may have the characteristic that the said electromagnetic wave shielding layer contains a conductive adhesive layer.
根据上述结构，能够可靠地使印刷布线板的接地电路和电磁波屏蔽层电连接。According to the above configuration, the ground circuit of the printed wiring board and the electromagnetic wave shielding layer can be reliably electrically connected.
另外，本发明的屏蔽膜还可以具有下述特征，即，上述电磁波屏蔽层还包含金属层，上述导电性粘合剂层由各向异性导电性粘合剂层构成。In addition, the shielding film of the present invention may further have a feature that the electromagnetic wave shielding layer further includes a metal layer, and the conductive adhesive layer is composed of an anisotropic conductive adhesive layer.
根据上述结构，由于导电性填料的含量少，因此能够制成柔性优良的屏蔽膜。According to the above structure, since the content of the conductive filler is small, it is possible to obtain a shielding film excellent in flexibility.
另外，本发明的屏蔽膜还可以具有下述特征，即，上述导电性粘合剂层由各向同性导电性粘合剂层构成。In addition, the shielding film of the present invention may further have a feature that the conductive adhesive layer is composed of an isotropic conductive adhesive layer.
根据上述结构，通过只设置导电性粘合剂层就能够实现对接地电路等的接地连接，并且能够使屏蔽膜具有电磁波屏蔽效果。According to the above configuration, the ground connection to the ground circuit and the like can be realized by merely providing the conductive adhesive layer, and the shielding film can have an electromagnetic wave shielding effect.
另外，本发明提供一种屏蔽印刷布线板，其中，基体包括一层以上的印刷电路，在该基体的至少单面上设置有屏蔽膜，该屏蔽膜构成为：在离型膜的整个单面上形成有凹凸部，在所述离型膜的形成有所述凹凸部的面上隔着离型剂涂布树脂从而形成保护层，并在该保护层上形成有电磁波屏蔽层，所述屏蔽印刷布线板的特征在于，将所述离型膜从所述保护层剥离后，所述保护层的表面粗糙度（Ra）为0.2μm-1.0μm。In addition, the present invention provides a shielded printed wiring board, wherein the substrate includes more than one layer of printed circuits, a shielding film is provided on at least one surface of the substrate, and the shielding film is formed by covering the entire single surface of the release film Concave-convex portions are formed on the surface of the release film, and a resin is coated with a release agent to form a protective layer on the surface of the release film on which the concavo-convex portions are formed, and an electromagnetic wave shielding layer is formed on the protective layer. The printed wiring board is characterized in that the protective layer has a surface roughness (Ra) of 0.2 μm to 1.0 μm after the release film is peeled off from the protective layer.
根据上述结构，基体的单面形成有电磁波屏蔽层和保护层的屏蔽印刷布线板在离型膜和保护层之间隔着离型剂粘合在一起的状态下，由于离型膜表面的凹凸部和保护层表面的凹凸部所产生的锚固效应，能够将离型膜相对于保护层的粘合性提高到在后续工序中将屏蔽膜浸渍在镀覆等药液中之类的时候药液不进入保护层和离型膜之间从而可防止离型膜从保护层脱离的程度，所述保护层表面的凹凸是通过转印离型膜表面的凹凸部而形成的，该保护层的表面粗糙度（Ra）为0.2μm-1.0μm。另外，通过设置离型膜表面的凹凸部和通过转印离型膜表面的凹凸部而形成的、表面粗糙度（Ra）为0.2μm-1.0μm的保护层表面的凹凸部，从而在向离型膜涂布离型剂的过程中离型剂被自然地扩散，因此能够使离型剂处于大致均匀地扩散配置的状态。由此，能够将离型膜相对于保护层的粘合性控制在离型膜从保护层被剥离时保护层本身不会由于过大的粘合力而破损的程度。这样，由于能够适当地控制离型膜相对于保护层的粘合力，因此能够防止以过大的粘合力或过小的粘合力粘合离型膜时所产生的问题。According to the above structure, the shielded printed wiring board with the electromagnetic wave shielding layer and the protective layer formed on one side of the base is bonded together through the release agent between the release film and the protective layer. The anchoring effect produced by the concavo-convex part on the surface of the protective layer can improve the adhesion of the release film to the protective layer to the extent that the chemical solution does not interfere when the shielding film is immersed in a chemical solution such as plating in a subsequent process. Enter between the protective layer and the release film so as to prevent the release film from the degree of detachment from the protective layer. The unevenness on the surface of the protective layer is formed by transferring the unevenness on the surface of the release film. The surface of the protective layer is rough The degree (Ra) is 0.2μm-1.0μm. In addition, by providing the concave-convex portion on the surface of the release film and the concave-convex portion on the surface of the protective layer formed by transferring the concave-convex portion on the surface of the release film with a surface roughness (Ra) of 0.2 μm to 1.0 μm, the Since the release agent is naturally diffused in the process of coating the release agent on the mold film, the release agent can be placed in a substantially uniformly diffused and arranged state. Accordingly, the adhesiveness of the release film to the protective layer can be controlled to such an extent that the protective layer itself is not damaged by excessive adhesive force when the release film is peeled from the protective layer. In this way, since the adhesive force of the release film with respect to the protective layer can be appropriately controlled, it is possible to prevent problems that arise when the release film is bonded with excessively high or low adhesive force.
另外，本发明的屏蔽印刷布线板还可以具有下述特征，即，包含上述印刷电路的基体由柔性印刷布线板构成。In addition, the shielded printed wiring board of the present invention may be characterized in that the base including the printed circuit is formed of a flexible printed wiring board.
根据上述结构，能够制成柔性优良的屏蔽印刷布线板。According to the above configuration, it is possible to obtain a shielded printed wiring board excellent in flexibility.
另外，本发明的屏蔽印刷布线板还可以具有下述特征，即，包括上述印刷电路的基体是带载封装用TAB带。In addition, the shielded printed wiring board of the present invention may have a feature that the substrate including the printed circuit is a TAB tape for tape carrier packaging.
根据上述结构，能够获得柔软且安装性优良的屏蔽印刷布线板。According to the above structure, it is possible to obtain a shielded printed wiring board which is flexible and excellent in mountability.
另外，本发明提供一种屏蔽印刷布线板的制造方法，其特征在于，包括：In addition, the present invention provides a method for manufacturing a shielded printed wiring board, which is characterized in that it includes:
在基体的至少单面上载置屏蔽膜，其中，所述基体包含一层以上的印刷电路，所述屏蔽膜构成为：离型膜的整个单面通过毛面处理形成为凹凸形状，在所述离型膜的形成为所述凹凸形状的面上至少层叠有离型剂、保护层和电磁波屏蔽层，A shielding film is placed on at least one side of the base body, wherein the base body includes more than one layer of printed circuits, and the shielding film is formed as follows: the entire single side of the release film is formed into a concave-convex shape by rough surface treatment, and the The release film is formed so that at least a release agent, a protective layer and an electromagnetic wave shielding layer are laminated on the surface of the concave-convex shape,
在层叠方向上对所述屏蔽膜和所述基体加热、加压后，将所述离型膜从所述保护层剥离，使所述保护层的表面粗糙度（Ra）为0.2μm-1.0μm。After heating and pressing the shielding film and the substrate in the stacking direction, the release film is peeled off from the protective layer so that the surface roughness (Ra) of the protective layer is 0.2 μm-1.0 μm .
根据上述方法，在离型膜与保护层之间隔着离型剂粘合在一起的状态下，由于离型膜表面的凹凸部和保护层表面的凹凸部所产生的锚固效应，能够将离型膜相对于保护层的粘合性提高到在后续工序中使屏蔽膜浸渍在镀覆等药液中之类的时候药液不会进入到保护层和离型膜之间从而可防止离型膜从保护层剥离的程度，上述保护层表面的凹凸部通过转印离型膜表面的凹凸部而形成，该保护层的表面粗糙度（Ra）为0.2μm-1.0μm。另外，通过设置离型膜表面的凹凸部和通过转印离型膜表面的凹凸部而形成的、表面粗糙度（Ra）为0.2μm-1.0μm的保护层表面的凹凸部，在向离型膜涂布离型剂的过程中离型剂被自然地分散，因此能够使离型剂处于大致均匀地分散配置的状态。由此，在将离型膜从保护层剥离时，能够将离型膜相对于保护层的粘合性控制在保护层不会由于过大的粘合力导致本身破损的程度。这样，由于能够适当地控制离型膜相对于保护层的粘合力，因此能够防止以过大的粘合力或过小的粘合力粘合离型膜时所发生的问题。According to the above method, in the state where the release film and the protective layer are bonded together through the release agent, due to the anchoring effect produced by the concave-convex portions on the surface of the release film and the concave-convex portions on the surface of the protective layer, the release film can be attached. The adhesiveness of the film relative to the protective layer is improved so that when the shielding film is immersed in a chemical solution such as plating in the subsequent process, the chemical solution will not enter between the protective layer and the release film, thereby preventing the release film. The surface roughness (Ra) of the protective layer is 0.2 μm to 1.0 μm, and the unevenness on the surface of the protective layer is formed by transferring the unevenness on the surface of the release film to the extent that it is peeled off from the protective layer. In addition, by providing the concave-convex portion on the surface of the release film and the concave-convex portion on the surface of the protective layer formed by transferring the concave-convex portion on the surface of the release film, the surface roughness (Ra) is 0.2μm-1.0μm. Since the release agent is naturally dispersed in the process of coating the release agent on the film, the release agent can be placed in a substantially uniformly dispersed and arranged state. Accordingly, when the release film is peeled from the protective layer, the adhesiveness of the release film to the protective layer can be controlled to such an extent that the protective layer itself is not damaged due to excessive adhesive force. In this way, since the adhesive force of the release film with respect to the protective layer can be appropriately controlled, it is possible to prevent problems that occur when the release film is bonded with excessively high or low adhesive force.
附图说明Description of drawings
图1是本实施方式的屏蔽FPC的制造方法的说明图，（a）表示在基体膜上载置屏蔽膜并通过压力机加热、加压的状态，（b）表示正在剥离离型膜的状态，（c）表示离型膜被剥离后的状态。Fig. 1 is an explanatory view of the manufacturing method of the shielded FPC according to this embodiment, (a) shows a state where a shielding film is placed on a base film and heated and pressurized by a press, (b) shows a state where a release film is being peeled off, (c) shows the state after the release film was peeled off.
图2是制造屏蔽FPC时所使用的屏蔽膜的横截面图，（a）是由粘合剂层和金属层形成电磁波屏蔽层的图，（b）是只由粘合剂层形成电磁波屏蔽层的图。Fig. 2 is a cross-sectional view of a shielding film used in the manufacture of a shielded FPC, (a) is a diagram in which an electromagnetic wave shielding layer is formed by an adhesive layer and a metal layer, and (b) is a diagram in which an electromagnetic wave shielding layer is formed by only an adhesive layer diagram.
图3是屏蔽FPC的横截面图中的屏蔽膜的局部放大图。3 is a partially enlarged view of a shielding film in a cross-sectional view of the shielding FPC.
图4是屏蔽FPC的横截面图，（b）、（c）是双面屏蔽的屏蔽FPC的横截面图。4 is a cross-sectional view of a shielded FPC, and (b) and (c) are cross-sectional views of a double-sided shielded FPC.
图5是构成屏蔽膜的保护层被制成单层构造时屏蔽FPC的横截面图。5 is a cross-sectional view of a shielding FPC when a protective layer constituting a shielding film is made into a single-layer configuration.
图6是总结了实施例和比较例的评价试验的结果的表格。FIG. 6 is a table summarizing the results of evaluation tests of Examples and Comparative Examples.
图7是实施例和比较例的评价试验的试验方法的说明图。Fig. 7 is an explanatory diagram of a test method of an evaluation test of Examples and Comparative Examples.
具体实施方式Detailed ways
下面，根据附图说明本发明的屏蔽FPC的实施方式的一个例子。图1是本实施方式的屏蔽FPC的制造方法的说明图，图2是制造该屏蔽FPC时所使用的屏蔽膜的横截面图。图1（a）表示在基体膜5上载置屏蔽膜1后用压力机P（PA、PB）加热h并加压p的状态。其中，基体膜5构成为：包括基底膜2、印刷电路3和绝缘膜4，印刷电路3由信号电路3a和接地电路3b组成并形成在基底膜2上，印刷电路3除去其中接地电路3b的至少一部分（非绝缘部）3c后由绝缘膜4予以覆盖。另外，图3是屏蔽FPC的横截面图中屏蔽膜的局部放大图。Next, an example of embodiment of the shielded FPC of the present invention will be described with reference to the drawings. FIG. 1 is an explanatory diagram of a method of manufacturing a shielded FPC according to the present embodiment, and FIG. 2 is a cross-sectional view of a shielding film used when manufacturing the shielded FPC. FIG. 1( a ) shows a state in which the masking film 1 is placed on the base film 5 and then heated h and pressurized by a press P (PA, PB). Wherein, the base film 5 is constituted as follows: including a base film 2, a printed circuit 3 and an insulating film 4, the printed circuit 3 is composed of a signal circuit 3a and a ground circuit 3b and is formed on the base film 2, and the printed circuit 3 removes the ground circuit 3b. At least a part (non-insulating portion) 3 c is then covered with an insulating film 4 . In addition, FIG. 3 is a partial enlarged view of the shielding film in a cross-sectional view of the shielding FPC.
这里，基底膜2和印刷电路3之间可以用粘合剂粘合，也可以不使用粘合剂而与所谓的无粘合剂型覆铜层叠板同样地接合。另外，绝缘膜4既可以使用粘合剂粘合柔性绝缘膜，也可以通过感光性绝缘树脂的涂布、干燥、曝光、显影、热处理等一系列方法形成。另外，基体膜5可以通过适当选择下述结构予以实施，即：只在基底膜的单面具有印刷电路的单面型FPC、在基底膜的双面具有印刷电路的双面型FPC、将上述FPC（柔性印刷布线板）多层层叠而成的多层型FPC、具有多层部件搭载部和电缆部的柔性板（フレクスボード：日本国注册商标）、构成多层部的材料为硬质材料的刚挠性基板、或者用于带载封装的TAB带等。Here, the base film 2 and the printed circuit 3 may be adhered with an adhesive, or may be bonded in the same manner as a so-called adhesiveless type copper-clad laminate without using an adhesive. In addition, the insulating film 4 may be bonded to a flexible insulating film using an adhesive, or may be formed by a series of methods such as coating of a photosensitive insulating resin, drying, exposure, development, and heat treatment. In addition, the base film 5 can be implemented by appropriately selecting the following structures: a single-sided FPC having a printed circuit on only one side of the base film, a double-sided FPC having a printed circuit on both sides of the base film, or combining the above-mentioned Multilayer FPC (Flexible Printed Wiring Board) laminated with multiple layers, a flexible board with a multilayer component mounting part and a cable part (Flex board: a registered trademark in Japan), and a hard material constituting the multilayer part Rigid-flex substrates, or TAB tapes for tape-carrying packages, etc.
在本发明中，屏蔽膜1使用图2（a）所示的结构。如图2（a）所示，屏蔽膜1具有离型膜6a、离型剂层6b以及屏蔽膜主体9。屏蔽膜主体9具有保护层7和粘合剂层8a，保护层7通过在离型剂层6b上依次涂布硬质层7a和软质层7b而形成，该硬质层7a由耐磨损性、抗粘连性优良的树脂构成，该软质层7b由缓冲性优良的树脂构成，上述粘合剂层8a隔着金属层8b设置在保护层7的与离型剂层6b所接触的面相反一侧的面上。这里，电磁波屏蔽层8由粘合剂层8a和金属层8b形成，该粘合剂层8a由导电性粘合剂构成。在该电磁波屏蔽层8中，通过加热h而变软后的粘合剂8a’通过加压p如箭头方向流入到绝缘去除部4a中（参考图1（a））。In the present invention, the structure shown in FIG. 2( a ) is used for the shielding film 1 . As shown in FIG. 2( a ), the shielding film 1 has a release film 6 a, a release agent layer 6 b, and a shielding film main body 9 . The shielding film main body 9 has a protective layer 7 and an adhesive layer 8a, and the protective layer 7 is formed by coating a hard layer 7a and a soft layer 7b successively on the release agent layer 6b, and the hard layer 7a is made of wear-resistant The soft layer 7b is made of a resin with excellent cushioning properties, and the above-mentioned adhesive layer 8a is provided on the surface of the protective layer 7 that is in contact with the release agent layer 6b via the metal layer 8b. on the opposite side. Here, the electromagnetic wave shielding layer 8 is formed of an adhesive layer 8a made of a conductive adhesive and a metal layer 8b. In this electromagnetic wave shielding layer 8, the adhesive 8a' softened by heating h flows into the insulation-removed portion 4a in the direction of the arrow by pressing p (see FIG. 1(a)).
另外，保护层7也可以不是具有硬质层7a和软质层7b的双层构造，而是如图5所示的单层构造。当采用该单层构造时，作为构成保护层7的树脂可以使用热固化性树脂、热塑性树脂以及电子射线固化树脂等。In addition, the protective layer 7 may not have a two-layer structure having a hard layer 7a and a soft layer 7b, but may have a single-layer structure as shown in FIG. 5 . When this single-layer structure is employed, thermosetting resins, thermoplastic resins, electron beam curable resins, and the like can be used as the resin constituting the protective layer 7 .
另外，如图3所示，对离型膜6a在保护层7一侧的表面实施了毛面（mat）处理。具体而言，通过在离型膜6a的单面喷射细砂而对表面赋予凹凸部61（凸部61a、凹部61b），将离型膜6a的单面制成凹凸形状来增加表面积。另外，作为毛面处理可以例举喷砂毛面处理、腐蚀毛面处理、涂布毛面处理、化学毛面处理以及揉搓毛面处理等。In addition, as shown in FIG. 3 , the surface of the release film 6 a on the protective layer 7 side was subjected to matting. Specifically, by spraying fine sand on one surface of the release film 6a to give the surface unevenness 61 (convex portion 61a, concave portion 61b), the surface area is increased by making one surface of the release film 6a uneven. In addition, the roughening treatment may, for example, be sandblasting roughening, etching roughening, coating roughening, chemical roughening, rubbing roughening, or the like.
另外，如图3所示，在构成保护层7的硬质层7a在离型膜6a一侧的表面上，在该表面的整面形成有多个凹凸形状的凹凸部71。该凹凸部71由相邻的凹部71b和凸部71a的组合构成。在离型膜6a的单面涂布离型剂层6b后，沿着凹凸部61涂布硬质层7a而形成凹凸部71（参考图3的放大图），该凹凸部61通过对离型膜6a的单面进行毛面处理而形成，该凹凸部71被形成在硬质层7a上。另外，在离型膜被剥离后硬质层7a的设置有凹凸部71的表面的表面粗糙度（Ra）优选为0.2μm-1.0μm，更优选为0.2μm-0.6μm。In addition, as shown in FIG. 3 , on the surface of the hard layer 7 a constituting the protective layer 7 on the release film 6 a side, a plurality of concavo-convex portions 71 are formed over the entire surface. This concavo-convex part 71 is comprised by the combination of the adjacent recessed part 71b and the convex part 71a. After the release agent layer 6b is coated on one side of the release film 6a, the hard layer 7a is coated along the concave-convex portion 61 to form a concave-convex portion 71 (refer to the enlarged view of FIG. 3 ). One surface of the film 6a is roughened, and the concavo-convex portion 71 is formed on the hard layer 7a. In addition, the surface roughness (Ra) of the surface of the hard layer 7 a provided with the unevenness 71 after the release film is peeled is preferably 0.2 μm to 1.0 μm, more preferably 0.2 μm to 0.6 μm.
另外，构成保护层7的硬质层7a由具有耐磨损性的树脂构成，软质层7b由弹性率为30亿帕斯卡以下的树脂构成。硬质层7a的树脂的耐磨损性具体为下述，即：根据JIS L0849规定的学振型摩擦试验机所进行的摩擦试验方法，设定摩擦块的质量为500克，使试验台以每分钟往复30次的速度在120mm距离进行水平往复运动时，即使往复运动1000次也不会产生摩擦损伤。软质层7b的树脂的弹性率是根据JIS K7244-4规定的动态机械特性的试验方法，在频率1Hz、测定温度范围-50℃至150℃、升温速度每分钟5℃条件下测量的。由于在后续工序中需要将离型膜6a从保护层7剥离，因此，在离型膜6被剥离后，耐磨损性优良的硬质层7a起到保护层的作用，能够防止保护层7磨损。另外，由于硬质层7a抗粘连性优良，所以，在电路部件搭载工序中的回流焊工序等需要加热的工序中，也不会与用于搭载电路板进行传送的传送用夹具、传送带等其它物体粘在一起。由于构成底层的保护层7借助硬质层7a优良的硬度和软质层7b的缓冲效应，所以，即使对保护层7的软质层7b上所设置的金属层8b加热、加压也不会产生龟裂、断裂等破坏。另外，将屏蔽膜1载置在包含印刷电路3的基体膜5上，使用压力机P（PA、PB）加热h并加压p时，通过软质层7b的缓冲效应而缓和向硬质层7a传递的压力，因此能够防止高硬度的硬质层7a破裂。作为硬质层、软质层的树脂可以使用热固化性树脂、热塑性树脂以及电子射线固化树脂等。In addition, the hard layer 7a constituting the protective layer 7 is made of a resin having abrasion resistance, and the soft layer 7b is made of a resin with an elastic modulus of 3 billion pascals or less. The wear resistance of the resin of the hard layer 7a is specifically as follows, that is, according to the friction test method carried out by the Gakushin type friction tester specified in JIS L0849, the mass of the friction block is set to 500 grams, and the test bench is set to 500 grams. When reciprocating horizontally at a speed of 30 times per minute at a distance of 120mm, no friction damage will occur even if the reciprocating movement is 1000 times. The elastic modulus of the resin of the soft layer 7b is measured under the conditions of a frequency of 1 Hz, a measurement temperature range of -50°C to 150°C, and a temperature increase rate of 5°C per minute in accordance with the test method of dynamic mechanical properties specified in JIS K7244-4. Since the release film 6a needs to be peeled off from the protective layer 7 in the subsequent process, after the release film 6 is peeled off, the hard layer 7a with excellent abrasion resistance acts as a protective layer, preventing the protective layer 7 from wear and tear. In addition, since the hard layer 7a has excellent anti-blocking properties, it does not interfere with other components such as jigs and conveyor belts used for mounting and transporting circuit boards in processes that require heating, such as the reflow process in the circuit component mounting process. Objects stick together. Since the protective layer 7 constituting the bottom layer relies on the excellent hardness of the hard layer 7a and the cushioning effect of the soft layer 7b, even if the metal layer 8b provided on the soft layer 7b of the protective layer 7 is heated and pressed, it will not Damage such as cracks and fractures occurs. In addition, when the masking film 1 is placed on the base film 5 including the printed circuit 3, and when the press P (PA, PB) is used to heat h and pressurize p, the soft layer 7b cushions the hard layer to relax. The pressure transmitted by 7a can prevent the high-hardness hard layer 7a from cracking. As resins for the hard layer and the soft layer, thermosetting resins, thermoplastic resins, electron beam curable resins, and the like can be used.
另外，在离型膜6a的单面上涂布离型剂层6b后，离型剂层6b处于自然地大致均匀地分散配置的状态，涂布保护层7的硬质层7a，将离型膜6a的凹凸部61转印到硬质层7a而形成表面粗糙度（Ra）为0.2μm-1.0μm的保护层7（参考图3的放大图）。In addition, after the release agent layer 6b is coated on one side of the release film 6a, the release agent layer 6b is in a state of being dispersed and arranged approximately uniformly naturally, and the hard layer 7a of the protective layer 7 is coated to release the release agent layer 6b. The concavo-convex portion 61 of the film 6 a is transferred to the hard layer 7 a to form the protective layer 7 having a surface roughness (Ra) of 0.2 μm to 1.0 μm (see the enlarged view of FIG. 3 ).
另外，只要离型剂层6b相对保护层7为具有剥离性的层，则没有特别的限定，例如可以使用涂布了硅类或非硅类的三聚氰胺离型剂或丙烯酸离型剂后的PET膜。另外，离型剂层6b厚度的最大值优选比对离型膜6a的表面进行毛面处理而形成的凹凸的高度薄（因为当离型剂层6b的厚度超过凹凸的高度时，实质上凹凸消失，离型膜6a相对于保护层7的剥离强度变得难以控制）。另外，作为在离型膜6a的单面上形成硬质层7a和软质层7b的方法，优选采用涂布法，但是也可以使用层压、挤压以及浸渍等除涂布法以外的形成层的方法。In addition, the release agent layer 6b is not particularly limited as long as it is a peelable layer with respect to the protective layer 7. For example, PET coated with a silicon-based or non-silicon-based melamine release agent or an acrylic release agent can be used. membrane. In addition, the maximum value of the thickness of the release agent layer 6b is preferably thinner than the height of the unevenness formed by matte treatment on the surface of the release film 6a (because when the thickness of the release agent layer 6b exceeds the height of the unevenness, the unevenness is substantially reduced. disappear, the peel strength of the release film 6a relative to the protective layer 7 becomes difficult to control). In addition, as a method of forming the hard layer 7a and the soft layer 7b on one side of the release film 6a, a coating method is preferably used, but a method other than the coating method such as lamination, extrusion, and dipping may also be used. layer method.
另外，将离型膜6a从保护层7的硬质层7a剥离时离型膜6a相对于保护层7（硬质层7a）的剥离强度，在加热h、加压p前的状态下优选设定为1N/50mm-20N/50mm。另外，离型膜6a相对于保护层7（硬质层7a）的剥离强度在加热h、加压p后的状态下优选设定为1N/50mm-10N/50mm，更优选设定为1N/50mm-4N/50mm。In addition, when the release film 6a is peeled from the hard layer 7a of the protective layer 7, the peel strength of the release film 6a with respect to the protective layer 7 (hard layer 7a) is preferably set in the state before heating h and pressing p. Set at 1N/50mm-20N/50mm. In addition, the peel strength of the release film 6a relative to the protective layer 7 (hard layer 7a) is preferably set to 1N/50mm-10N/50mm, more preferably 1N/50mm in the state after heating h and pressing p. 50mm-4N/50mm.
按照使用目的在制造阶段改变由凹凸部61（凸部61a、凹部61b）构成的表面粗糙度或离型剂的种类、数量，能够增大离型膜6a相对于保护层7的粘合强度（剥离强度）的幅度，并能够使粘合强度的控制（调整）变得容易，上述凹凸部61（凸部61a、凹部61b）是通过对离型膜6a进行上述毛面处理而形成的。According to the purpose of use, changing the surface roughness of the uneven part 61 (convex part 61a, concave part 61b) or the type and quantity of the release agent at the manufacturing stage can increase the adhesive strength of the release film 6a relative to the protective layer 7 ( Peel strength), and can facilitate the control (adjustment) of the adhesive strength, the uneven portion 61 (convex portion 61a, concave portion 61b) is formed by subjecting the release film 6a to the aforementioned matte treatment.
而且，粘合剂8a’与接地电路3b的非绝缘部3c和绝缘部4充分粘合后，如图1（b）所示，从压力机P中取出所形成的屏蔽柔性印刷布线板10，当将屏蔽膜1的离型膜6a和离型剂层6b一起剥离f时，得到图1（c）所示的在硬质层7a的表面设置了凹凸部71的屏蔽FPC10’。Then, after the adhesive 8a' is sufficiently bonded to the non-insulated portion 3c and the insulating portion 4 of the ground circuit 3b, as shown in FIG. When the release film 6 a of the shield film 1 is peeled off together with the release agent layer 6 b , a shield FPC 10 ′ in which unevenness 71 is provided on the surface of the hard layer 7 a shown in FIG. 1( c ) is obtained.
如图2（a）所示，由于屏蔽膜1的厚度与屏蔽膜主体9相比仅增加了离型膜6a的厚度，所以易于冲压成预定的尺寸，并能够整齐地裁断，相对于基体膜5的定位也容易。另外，加热、加压时，缓冲效应通过离型膜6a而增大，延缓了压力的传递，因此粘合剂8a’容易流入到绝缘去除部4a中。因此，由于粘合剂8a’与接地电路3b的非绝缘部3c的表面充分粘合，所以连接的导电性优良。另外，如果将离型膜6a和离型剂层6b一同剥离，则能够简单地得到薄且具有柔性的屏蔽FPC10’。另外，屏蔽膜1也可以用于刚性电路板。As shown in Figure 2(a), since the thickness of the shielding film 1 is only increased by the thickness of the release film 6a compared with the shielding film main body 9, it is easy to punch into a predetermined size and can be cut neatly. The positioning of 5 is also easy. In addition, when heating and pressing, the cushioning effect is increased by the release film 6a, and the transmission of pressure is delayed, so the adhesive 8a' easily flows into the insulation removal part 4a. Therefore, since the adhesive 8a' adheres sufficiently to the surface of the non-insulating portion 3c of the ground circuit 3b, the electrical conductivity of the connection is excellent. In addition, if the release film 6a and the release agent layer 6b are peeled together, a thin and flexible shield FPC 10' can be easily obtained. In addition, the shielding film 1 can also be used for rigid circuit boards.
基底膜2和绝缘膜4都由工程塑料构成。例如，可以例举聚丙烯、交联聚乙烯、聚酯、聚苯并咪唑、聚酰亚胺、聚酰亚胺酰胺、聚醚酰亚胺、聚苯硫醚（PPS）等树脂。当对耐热性不太要求时，优选使用廉价的聚酯膜，在要求耐燃性时，可以使用聚苯硫醚膜，在进一步要求耐热性时优选使用聚酰亚胺膜。Both the base film 2 and the insulating film 4 are made of engineering plastics. For example, resins such as polypropylene, cross-linked polyethylene, polyester, polybenzimidazole, polyimide, polyimide amide, polyetherimide, and polyphenylene sulfide (PPS) may be mentioned. When less heat resistance is required, an inexpensive polyester film is preferably used, when flame resistance is required, a polyphenylene sulfide film is used, and when heat resistance is further required, a polyimide film is preferably used.
离型膜6a可以使用与基底膜2、绝缘膜4以及保护层7同样的工程塑料，但是由于它在制造过程中被去除，所以优选使用廉价的聚酯膜。另外，作为离型剂层6b可以使用以公知的方法形成的硅膜。The release film 6a can be made of the same engineering plastic as the base film 2, the insulating film 4, and the protective layer 7, but an inexpensive polyester film is preferably used because it is removed during the manufacturing process. In addition, a silicon film formed by a known method can be used as the release agent layer 6b.
粘合剂层8a作为粘合性树脂由聚苯乙烯类、醋酸乙烯类、聚酯类、聚乙烯类、聚丙烯类、聚酰胺类、橡胶类以及丙烯类等热塑性树脂，或者苯酚类、环氧类、尿烷类、三聚氰胺类、醇酸类等热固性树脂构成。另外，也可以使用在这些粘合性树脂中混入金属、碳等导电性填料而具有导电性的导电性粘合剂。这样，通过使用导电性粘合剂能够可靠地将接地电路3b和金属层8b电连接。另外，作为导电性粘合剂也可以使用减少导电性填料含量的各向异性导电性粘合剂。这样，作为导电性粘合剂使用各向异性导电性粘合剂时，与各向同性导电性粘合剂相比更容易形成薄的膜，由于导电性填料含量少，因此能够制成柔性优良的屏蔽膜。另外，也可以使用各向同性导电性粘合剂作为导电性粘合剂。这样，当使用各向同性导电性粘合剂作为导电性粘合剂时，只设置由各向同性导电性粘合剂形成的导电性粘合剂层，以便能够进行针对接地电路3b等的接地连接，并具有电磁波屏蔽效果。另外，当对耐热性没有特别要求时，优选使用不受保管条件等制约的聚酯类的热塑性树脂，而在要求耐热性或要求更优良的柔性时，优选使用形成电磁波屏蔽层8后可靠性高的环氧类热固化性树脂。另外，不言而喻，上述任一树脂优选采用在任一条件下加热、加压时渗出（树脂流动）量小的树脂。The adhesive layer 8a is made of thermoplastic resins such as polystyrenes, vinyl acetates, polyesters, polyethylenes, polypropylenes, polyamides, rubbers, and acrylics as adhesive resins, or phenols, cyclic resins, etc. Oxygen, urethane, melamine, alkyd and other thermosetting resins. In addition, conductive adhesives having conductivity obtained by mixing conductive fillers such as metal and carbon into these adhesive resins can also be used. In this way, the ground circuit 3b and the metal layer 8b can be reliably electrically connected by using the conductive adhesive. In addition, an anisotropic conductive adhesive having a reduced content of the conductive filler can also be used as the conductive adhesive. In this way, when an anisotropic conductive adhesive is used as a conductive adhesive, it is easier to form a thinner film than an isotropic conductive adhesive, and since the conductive filler content is small, it can be made into a plastic film with excellent flexibility. shielding film. In addition, an isotropic conductive adhesive can also be used as the conductive adhesive. In this way, when an isotropic conductive adhesive is used as the conductive adhesive, only the conductive adhesive layer formed of the isotropic conductive adhesive is provided so that grounding for the ground circuit 3b and the like can be performed. connection, and has an electromagnetic wave shielding effect. In addition, when heat resistance is not particularly required, it is preferable to use a polyester-based thermoplastic resin that is not restricted by storage conditions, etc., and when heat resistance or better flexibility is required, it is preferable to use a resin after forming the electromagnetic wave shielding layer 8. Highly reliable epoxy-based thermosetting resin. In addition, it goes without saying that it is preferable to use a resin with a small amount of exudation (resin flow) when heated and pressurized under any of the above-mentioned resins.
另外，在上述实施方式中，作为电磁波屏蔽层8使用金属层8b和粘合剂层8a，但是如上所述在使用各向同性导电性粘合剂作为粘合剂层8a时，也可以为省略金属层8b的结构。In addition, in the above-mentioned embodiment, the metal layer 8b and the adhesive layer 8a are used as the electromagnetic wave shielding layer 8, but when an isotropic conductive adhesive is used as the adhesive layer 8a as described above, it may be omitted. The structure of the metal layer 8b.
作为导电性填料可以使用碳、银、铜、镍、焊锡、铝、在铜粉上镀银的银包铜填料，以及在树脂球或玻璃球等上镀金属后的填料，或这些填料的混合物。由于银的价格高，铜在耐热可靠性方面不足、铝在耐湿可靠性方面不足，并且焊锡难以获得足够的导电性，因此优选地使用比较廉价且具有优良的导电性的并且可靠性高的银包铜填料或者镍。As conductive fillers, carbon, silver, copper, nickel, solder, aluminum, silver-coated copper fillers coated with silver on copper powder, fillers coated with metal on resin balls or glass balls, or a mixture of these fillers can be used. . Since the price of silver is high, copper is insufficient in heat-resistant reliability, aluminum is insufficient in moisture-resistant reliability, and it is difficult to obtain sufficient electrical conductivity of solder, so it is preferable to use relatively cheap and excellent electrical conductivity and high reliability. Silver clad copper filler or nickel.
金属填料等导电性填料对粘合性树脂的配合比例也受填料的形状等影响，但是在使用银包铜填料时，相对于粘合性树脂100重量份，优选使用10-400重量份的银包铜填料，更优选使用20-150重量份的银包铜填料。当超过400重量份时，对接地电路（铜箔）3b的粘合性降低，屏蔽FPC10’的柔性变差。另外，当小于10重量份时导电性显著降低。另外，在使用镍填料时，相对于粘合性树脂100重量份，优选使用40-400重量份的镍填料，更优选地使用100-350重量份的镍填料。当超过400重量份时，对接地电路（铜箔）3b的粘合性降低，屏蔽FPC10’的柔性变差。另外，当小于40重量份时导电性显著降低。金属填料等导电性填料的形状可以是球状、针状、纤维状、薄片状或树枝状中的任一种形状。The mixing ratio of conductive fillers such as metal fillers to the adhesive resin is also affected by the shape of the filler, but when using silver-coated copper filler, it is preferable to use 10 to 400 parts by weight of silver per 100 parts by weight of the adhesive resin. The copper-clad filler is more preferably 20-150 parts by weight of silver-clad copper filler. When it exceeds 400 parts by weight, the adhesion to the ground circuit (copper foil) 3b decreases, and the flexibility of the shield FPC 10' deteriorates. In addition, the conductivity significantly decreases when it is less than 10 parts by weight. Moreover, when using a nickel filler, it is preferable to use 40-400 weight part of nickel fillers with respect to 100 weight part of adhesive resins, and it is more preferable to use 100-350 weight parts of nickel fillers. When it exceeds 400 parts by weight, the adhesion to the ground circuit (copper foil) 3b decreases, and the flexibility of the shield FPC 10' deteriorates. In addition, when it is less than 40 parts by weight, the conductivity is significantly lowered. The shape of conductive fillers such as metal fillers may be spherical, needle-like, fibrous, flake-like or dendritic.
如前所述，当混合了金属填料等导电性填料时，粘合剂层8a的厚度为3μm-25μm左右。另外，当不混合导电性填料时，粘合剂层8a的厚度是1μm-10μm。因此，能够降低电磁波屏蔽层8的厚度，并能够制成薄的屏蔽FPC10’。As mentioned above, when a conductive filler such as a metal filler is mixed, the thickness of the adhesive layer 8 a is about 3 μm to 25 μm. In addition, when the conductive filler is not mixed, the thickness of the adhesive layer 8a is 1 μm to 10 μm. Therefore, the thickness of the electromagnetic wave shielding layer 8 can be reduced, and the shielding FPC 10' can be made thin.
作为形成金属层8b的金属材料可以例举铝、铜、银、金等。也可以根据所要求的屏蔽特性适当地选择金属材料，但是由于铜存在与空气接触时容易氧化的问题，金的价格昂贵，优选使用廉价的铝或可靠性高的银。根据所要求的屏蔽特性和柔性适当地选择膜厚，但是一般优选设定膜厚为0.01μm-1.0μm。当膜厚小于0.01μm时屏蔽效果不充分，反之，当膜厚超过1.0μm时柔性变差。作为金属层8b的形成方法有真空蒸镀、溅射、CVD法、MO（金属有机物）以及镀覆等，但是如果考虑批量生产性则优选使用真空蒸镀，能够得到廉价且稳定的金属膜。另外，金属层不限于金属膜，也可以使用金属箔。Aluminum, copper, silver, gold, etc. are mentioned as a metal material which forms the metal layer 8b. Metal materials can also be appropriately selected according to the required shielding properties. However, since copper is easily oxidized when in contact with air, and gold is expensive, it is preferable to use cheap aluminum or highly reliable silver. The film thickness is appropriately selected depending on the required shielding properties and flexibility, but generally it is preferable to set the film thickness to 0.01 μm to 1.0 μm. When the film thickness is less than 0.01 μm, the shielding effect is insufficient, and conversely, when the film thickness exceeds 1.0 μm, flexibility deteriorates. Methods for forming the metal layer 8b include vacuum deposition, sputtering, CVD, MO (metal organic), and plating. However, in consideration of mass productivity, vacuum deposition is preferably used because an inexpensive and stable metal film can be obtained. In addition, the metal layer is not limited to a metal film, and a metal foil may also be used.
图2（b）表示的屏蔽膜1’与图2（a）中屏蔽膜1的不同点在于，在图2（b）表示的屏蔽膜1’中，在保护层7的单面设置只由粘合剂层8a构成的电磁波屏蔽层8’从而形成薄膜主体9’，该粘合剂层8a由混合了导电性填料的导电性粘合剂形成。由于与粘合剂层8a相比金属层8b的导电率高，因此在如图2（a）那样设置了金属层8b的情况下，使用各向同性导电性粘合剂的必要性低，因此，能够降低电磁波屏蔽层8的厚度。另外，电磁波屏蔽层8的构造不限于此，优选地使用导电性和柔性良好的材料。The shielding film 1' shown in FIG. 2(b) differs from the shielding film 1 in FIG. 2(a) in that in the shielding film 1' shown in FIG. The electromagnetic wave shielding layer 8' constituted by the adhesive layer 8a formed of a conductive adhesive mixed with a conductive filler thus forms a film main body 9'. Since the electrical conductivity of the metal layer 8b is higher than that of the adhesive layer 8a, when the metal layer 8b is provided as shown in FIG. 2(a), it is less necessary to use an isotropic conductive adhesive. , the thickness of the electromagnetic wave shielding layer 8 can be reduced. In addition, the structure of the electromagnetic wave shielding layer 8 is not limited thereto, and it is preferable to use a material having good conductivity and flexibility.
图4是按上述方式得到的屏蔽FPC的横截面图。本发明的屏蔽FPC当然也包括屏蔽膜主体9’，其代替了图1（c）的屏蔽膜主体9，按照图2（b）那样仅由导电性粘合剂形成的粘合剂层8a形成电磁波屏蔽层8’。另外，构成屏蔽膜主体9’的各种材料或形成方法如上所述也包含各种形式。Fig. 4 is a cross-sectional view of the shielded FPC obtained in the above manner. Of course, the shielding FPC of the present invention also includes a shielding film main body 9', which replaces the shielding film main body 9 of FIG. Electromagnetic wave shielding layer 8'. In addition, various materials and forming methods constituting the shielding film main body 9' also include various forms as described above.
另外，不限于单面FPC，也包括图4（b）和图4（c）之类的双面FPC。在图4（b）的双面屏蔽FPC10A中，为实现粘合剂层8a和接地电路3b之间的连接，而在接地电路3b上下的绝缘膜4和基底膜2’分别设置有绝缘去除部4a和绝缘去除部2a’，在接地电路3b的上下表面的非绝缘部3c与粘合剂层8a连接。这里，基底膜2’、印刷电路3（信号电路3a和接地电路3b）以及绝缘膜4构成基体膜5’。In addition, it is not limited to single-sided FPC, but also includes double-sided FPC such as Fig. 4(b) and Fig. 4(c). In the double-sided shielded FPC 10A of FIG. 4(b), in order to realize the connection between the adhesive layer 8a and the ground circuit 3b, the insulation film 4 and the base film 2' above and below the ground circuit 3b are respectively provided with insulation removal parts. 4a and the insulation removed portion 2a' are connected to the adhesive layer 8a at the non-insulated portion 3c on the upper and lower surfaces of the ground circuit 3b. Here, base film 2', printed circuit 3 (signal circuit 3a and ground circuit 3b), and insulating film 4 constitute base film 5'.
图4（c）的双面屏蔽FPC10B与图4（b）的例子同样，在接地电路3b上下的绝缘膜4和基底膜2’分别设置有绝缘去除部4a和绝缘去除部2a’，而且在接地电路3b中设置有贯通孔3d’，并作为接地电路3b’，粘合剂层8a从两面进入到该贯通孔3d’中，在界面S处汇合。而且，接地电路3b’在其顶面的非绝缘部3c和贯通孔内表面3c’与粘合剂层8a连接。这里，基底膜2’、印刷电路3’（信号电路3a’和接地电路3b’）以及绝缘膜4构成基体膜5’’。The double-sided shielded FPC 10B of FIG. 4(c) is the same as the example of FIG. 4(b), and the insulation film 4 and the base film 2' above and below the ground circuit 3b are respectively provided with an insulation removal part 4a and an insulation removal part 2a', and in the A through-hole 3d' is provided in the ground circuit 3b as the ground circuit 3b', and the adhesive layer 8a enters the through-hole 3d' from both sides and joins at the interface S. Furthermore, the ground circuit 3b' is connected to the adhesive layer 8a at the non-insulated portion 3c of the top surface and the inner surface 3c' of the through-hole. Here, base film 2', printed circuit 3' (signal circuit 3a' and ground circuit 3b'), and insulating film 4 constitute base film 5''.
实施例Example
接着，与比较例一起说明对本发明的实施例进行的评价实验的结果。Next, the results of evaluation experiments performed on Examples of the present invention will be described together with Comparative Examples.
（关于试验片）(About test piece)
使用图6所示的比较例1、2以及具有实施例1-18中所记载的特征的屏蔽膜1（离型膜6a、离型剂层6b、保护层7、电磁波屏蔽层8（导电性粘合剂层8a、金属层8b）），另外，每个试验片为长度200mm、宽度50mm的长方形形状。Use comparative examples 1 and 2 shown in Fig. 6 and shielding film 1 (release film 6a, release agent layer 6b, protective layer 7, electromagnetic wave shielding layer 8 (conductivity) with the characteristics described in Examples 1-18 Adhesive layer 8a, metal layer 8b)), and each test piece has a rectangular shape with a length of 200 mm and a width of 50 mm.
对实施例1-18中的离型膜6a的PET实施毛面处理，在实施例1-12中使用喷砂毛面处理，在实施例13和实施例16中使用腐蚀毛面处理，在实施例14和实施例17中使用涂布毛面处理，在实施例15和实施例18中使用揉搓毛面处理。另外，设定比较例1、2中离型膜6a的PET是未经毛面处理的透明型。The PET of the release film 6a in embodiment 1-18 is implemented rough surface treatment, uses sandblasting rough surface treatment in embodiment 1-12, uses corrosion rough surface treatment in embodiment 13 and embodiment 16, in implementing In Example 14 and Example 17, a coated matte finish was used, and in Example 15 and Example 18, a rubbed matte finish was used. In addition, the PET of the release film 6a in Comparative Examples 1 and 2 was assumed to be a transparent type without matte treatment.
另外，使用触针式表面粗糙度测量仪测量在比较例1、2以及实施例1-18中的表面粗糙度（Ra（μm））。该方法通过探针在物体表面滑动并随着物体表面的凹凸上下移动，测量该探针的移动，由此测量出物体表面的粗糙度。In addition, the surface roughness (Ra (μm)) in Comparative Examples 1, 2 and Examples 1-18 was measured using a stylus-type surface roughness meter. In this method, the probe slides on the surface of the object and moves up and down with the unevenness of the surface of the object, and measures the movement of the probe, thereby measuring the roughness of the surface of the object.
另外，关于离型剂6b的种类，比较例1、实施例1-8以及实施例13-15中使用三聚氰胺离型剂（A类型），比较例2、实施例9-12以及实施例16-18中使用丙烯酸离型剂（B类型），将粘合量分别统一为1.2g/m2。另外，该离型剂层的粘合量的测量方法如下：首先使用红外线水分仪测量离型剂的固态含量浓度；接着，在涂布离型剂之后，用离型剂使用量除以加工量m2，求出Wet粘合量。然后，通过Wet粘合量和离型剂的固态含量浓度求出Dry粘合量，将该Dry粘合量作为本实验中的离型剂的粘合量。In addition, regarding the type of release agent 6b, melamine release agent (type A) was used in Comparative Example 1, Examples 1-8 and Examples 13-15, Comparative Example 2, Examples 9-12 and Examples 16- In 18, an acrylic release agent (type B) was used, and the adhesion amount was unified to 1.2 g/m2 . In addition, the measurement method of the adhesion amount of the release agent layer is as follows: first use an infrared moisture meter to measure the solid content concentration of the release agent; then, after the release agent is coated, divide the amount of release agent used by the processing amount m2 , to obtain the Wet adhesion amount. Then, the Dry adhesion amount was obtained from the Wet adhesion amount and the solid content concentration of the release agent, and this Dry adhesion amount was used as the adhesion amount of the release agent in this experiment.
（1）将离型膜从保护层剥离的剥离试验(1) Peeling test in which the release film is peeled off from the protective layer
（试验方法）(experiment method)
在冲压前（加热、加压前）的剥离强度测量中，在比较例1、2以及实施例1-18的屏蔽膜1的导电性粘合剂层8a的表面上贴上双面胶带，将该双面胶带的单面与试验机（PALMEK制PFT-50S剥离强度测试仪）底座粘合在一起固定屏蔽膜1。然后，如图7所示，将屏蔽膜1的离型膜6a的端部设置在试验机的卡盘上，测量离型膜6a相对于保护层7的剥离强度。这里，如图7所示，作为剥离条件，剥离角度设定为170°，设定由卡盘产生的离型膜6a的剥离速度为1000mm/min。而且，进行5次试验，计算各次所得的剥离强度值的最小值的平均值作为剥离强度的值（N/50mm）。In the peel strength measurement before stamping (before heating and pressurization), a double-sided adhesive tape was pasted on the surface of the conductive adhesive layer 8a of the shielding film 1 of Comparative Examples 1, 2 and Examples 1-18, and the One side of the double-sided tape was bonded to the base of a testing machine (PFT-50S peel strength tester manufactured by PALMEK) to fix the shielding film 1 . Then, as shown in FIG. 7 , the end of the release film 6 a of the masking film 1 was set on the chuck of the testing machine, and the peel strength of the release film 6 a with respect to the protective layer 7 was measured. Here, as shown in FIG. 7 , as peeling conditions, the peeling angle was set to 170°, and the peeling speed of the release film 6 a by the chuck was set to 1000 mm/min. And the test was performed 5 times, and the average value of the minimum value of the peeling strength value obtained each time was calculated as the value (N/50mm) of peeling strength.
另一方面，在冲压后（加热、加压后）的剥离强度测量中，使用压力机将比较例1、2以及实施例1-18的屏蔽膜1的导电性粘合剂层8a的表面热压接在具有聚酰亚胺表面和铜箔表面的覆铜层叠板的聚酰亚胺表面侧。作为此时压力机中的热压接条件优选设定压力为2-5MPa，温度为140-180℃，时间为3-60分钟。在本次测量中，以170℃作为设定温度，通过在0.5MPa下载重60秒，之后，在3MPa下载重180秒进行热压接。On the other hand, in the peel strength measurement after punching (after heating and pressing), the surface of the conductive adhesive layer 8a of the shielding film 1 of Comparative Examples 1 and 2 and Examples 1-18 was heated using a press. Crimped on the polyimide surface side of a copper clad laminate having a polyimide surface and a copper foil surface. As thermocompression bonding conditions in the press at this time, it is preferable to set a pressure of 2-5 MPa, a temperature of 140-180° C., and a time of 3-60 minutes. In this measurement, 170° C. was used as a set temperature, and thermocompression bonding was performed by weighing under a load of 0.5 MPa for 60 seconds and then weighing under a load of 3 MPa for 180 seconds.
然后，在热压接了屏蔽膜1后的覆铜层叠板的铜箔表面侧粘贴双面胶带，如图7所示，将该双面胶带的单面与试验机台（PALMEK制PFT-50S剥离强度测试仪）粘合在一起固定屏蔽膜1。之后以与上述冲压前的剥离强度测量所说明过的试验方法相同的方式计算剥离强度值（N/50mm）。Next, a double-sided tape was attached to the copper foil surface side of the copper-clad laminate to which the shielding film 1 was bonded by thermocompression. As shown in FIG. Peel strength tester) bonded together to fix the shielding film 1. The peel strength value (N/50mm) was then calculated in the same manner as the test method described above for the peel strength measurement before punching.
（2）评价方法(2) Evaluation method
说明将离型膜从上述保护层剥离的剥离试验的评价方法。在离型膜的剥离试验中，当冲压前的剥离强度值小于1N/50mm时，评价为“×”。如果冲压前的剥离强度值为1-20N/50mm，并且冲压后的剥离强度的值为1-10N/50mm，则评价为“○（单圈）”。这里，作为“○”评价的条件，之所以将冲压前的剥离强度值设定为1-20N/50mm，是因为如果剥离强度值小于1N/50mm，则当屏蔽膜1浸渍在药液中时离型膜会从保护层上剥离，另一方面，如果剥离强度的值大于20N/50mm，则离型膜相对于保护层的粘合力过强，在将离型膜剥离时甚至会连保护层一起剥下致使保护层破损。另外，作为“○”评价的条件，之所以将冲压后的剥离强度值设定为1-10N/50mm，是因为如果剥离强度值小于1N/50mm，则冲压后有时离型膜会从保护膜上自然地剥离，另一方面，如果剥离强度值大于10N/50mm，则由人或制造装置将离型膜从保护层剥离时的操作性变差（将离型膜从保护层剥离时，不使用更多的力量则无法顺利地剥离）。进而，在评价“○”的条件的基础上，在冲压后的屏蔽膜中，如果冲压后的剥离强度值为1-4N/50mm，则评价为“◎（双圈）”，能够更顺利地剥下离型膜。The evaluation method of the peeling test which peels a release film from the said protective layer is demonstrated. In the peel test of the release film, when the peel strength value before punching was less than 1 N/50 mm, it was evaluated as "x". If the value of the peel strength before punching was 1-20 N/50 mm, and the value of the peel strength after punching was 1-10 N/50 mm, it was evaluated as "◯ (single turn)". Here, as the evaluation condition of "○", the reason why the peel strength value before punching is set to 1-20N/50mm is because if the peel strength value is less than 1N/50mm, when the shielding film 1 is immersed in the chemical solution, The release film will be peeled from the protective layer. On the other hand, if the peel strength value is greater than 20N/50mm, the adhesion of the release film to the protective layer is too strong, and even the protective layer will be damaged when the release film is peeled off. The layers are peeled off together causing damage to the protective layer. In addition, as the evaluation condition of "○", the reason why the peel strength value after punching is set to 1-10N/50mm is because if the peel strength value is less than 1N/50mm, sometimes the release film will peel off from the protective film after punching. On the other hand, if the peel strength value is greater than 10N/50mm, the operability when peeling the release film from the protective layer by people or manufacturing equipment will deteriorate (when the release film is peeled from the protective layer, it will not cannot be peeled off smoothly with more force). Furthermore, on the basis of evaluating the conditions of "○", in the masking film after punching, if the peel strength value after punching is 1-4N/50mm, it is evaluated as "◎ (double circle)", which can be more smoothly Peel off the release film.
图6中示出了上述说明过的比较例1、2以及实施例1-18的试验结果、判定。FIG. 6 shows the test results and judgments of Comparative Examples 1 and 2 and Examples 1-18 described above.
根据图6所示的屏蔽膜的剥离试验的结果、判定可知，对于使用比较例1、2中的未经毛面处理的PET透明型的屏蔽膜1来说，由于冲压前、冲压后的剥离强度都比1N/50mm小，所以即使改变离型剂的种类（比较例1使用三聚氰胺离型剂，比较例2使用丙烯酸离型剂），当屏蔽膜1浸渍在药液中时离型膜6a有可能从保护层7上剥离或者在冲压后离型膜6a有可能从保护层7上自然地剥离，与此相对，对于在实施例1-18中对PET进行了毛面处理（实施例1-12是喷砂毛面处理，实施例13和实施例16是腐蚀毛面处理，实施例14和实施例17是涂布毛面处理，实施例15和实施例18是揉搓毛面处理）后的屏蔽膜1来说，由于在冲压前的剥离强度为1-20N/50mm，冲压后的剥离强度为1-10N/50mm，所以即使改变离型剂的种类（实施例1-8和实施例13-15使用三聚氰胺离型剂，实施例9-12和实施例16-18使用丙烯酸离型剂），在屏蔽膜1浸渍在药液中时或者冲压后离型膜6a都不从保护层7上剥离。换言之，可知即使改变离型剂的种类将其涂布在未经毛面处理的离型膜6a上也不能控制剥离强度，在屏蔽膜1浸渍在药液中时药液会浸入到离型膜6a和保护层7之间。According to the results and judgments of the peeling test of the masking film shown in FIG. 6, it can be seen that for the PET transparent masking film 1 without matte treatment in Comparative Examples 1 and 2, due to the peeling before and after punching, The strength is smaller than 1N/50mm, so even if the type of release agent is changed (melamine release agent is used in comparative example 1, and acrylic release agent is used in comparative example 2), when the shielding film 1 is immersed in the chemical solution, the release film 6a It is possible to peel off from the protective layer 7 or the release film 6a may be naturally peeled off from the protective layer 7 after punching. In contrast, for the PET that has been matted in Examples 1-18 (Example 1 -12 is sandblasting rough surface treatment, embodiment 13 and embodiment 16 are corrosion rough surface treatment, embodiment 14 and embodiment 17 are coating rough surface treatment, embodiment 15 and embodiment 18 are after rubbing rough surface treatment) For the shielding film 1, since the peel strength before stamping is 1-20N/50mm, the peel strength after stamping is 1-10N/50mm, so even if the type of release agent is changed (embodiment 1-8 and embodiment 13-15 use a melamine release agent, and Examples 9-12 and Examples 16-18 use an acrylic release agent), when the shielding film 1 is immersed in the liquid medicine or after punching, the release film 6a does not come out from the protective layer 7 Peel off. In other words, it can be seen that even if the type of release agent is changed and coated on the release film 6a without matte treatment, the peel strength cannot be controlled, and when the masking film 1 is immersed in the chemical solution, the chemical solution will penetrate into the release film. 6a and the protective layer 7.
另外，根据实施例1-8的剥离强度值可知，通过改变毛面处理的粗糙度，即，1.00μm→0.853μm→0.679μm→0.489μm→0.352μm→0.308μm→0.253μm→0.200μm，剥离强度按以下方式减小，即，冲压前：19.87N/50mm（冲压后9.92N/50mm）→冲压前：9.48N/50mm（冲压后5.67N/50mm）→冲压前：7.12N/50mm（冲压后4.89N/50mm）→冲压前：4.97N/50mm（冲压后3.50N/50mm）→冲压前：3.42N/50mm（冲压后2.78N/50mm）→冲压前：2.18N/50mm（冲压后1.52N/50mm）→冲压前：1.55N/50mm（冲压后1.15N/50mm）→冲压前：1.12N/50mm（冲压后1.00N/50mm）。由此可知，通过改变毛面处理的粗糙度，能够控制剥离强度。另外，参见改变了离型剂种类的实施例9-12的结果也得出同样结论（通过减小毛面处理的粗糙度值减小剥离强度值）。In addition, according to the peel strength values of Examples 1-8, it can be seen that by changing the roughness of the rough surface treatment, that is, 1.00 μm → 0.853 μm → 0.679 μm → 0.489 μm → 0.352 μm → 0.308 μm → 0.253 μm → 0.200 μm, peeling The strength is reduced as follows, that is, before stamping: 19.87N/50mm (9.92N/50mm after stamping) → before stamping: 9.48N/50mm (5.67N/50mm after stamping) → before stamping: 7.12N/50mm (stamping After 4.89N/50mm) → before stamping: 4.97N/50mm (after stamping 3.50N/50mm) → before stamping: 3.42N/50mm (after stamping 2.78N/50mm) → before stamping: 2.18N/50mm (after stamping 1.52 N/50mm) → before stamping: 1.55N/50mm (after stamping 1.15N/50mm) → before stamping: 1.12N/50mm (after stamping 1.00N/50mm). From this, it can be seen that the peel strength can be controlled by changing the roughness of the matte treatment. In addition, referring to the results of Examples 9-12 in which the type of release agent was changed, the same conclusion was drawn (the peeling strength value was reduced by reducing the roughness value of the matte surface treatment).
另外，参见采用三聚氰胺离型剂的实施例1-8和采用丙烯酸离型剂的实施例9-12可知，与采用三聚氰胺离型剂的情况相比，在采用丙烯酸离型剂的情况下，冲压前的剥离强度值及冲压后的剥离强度值高。另外，参见实施例13（使用腐蚀毛面处理、表面粗糙度0.418μm、三聚氰胺离型剂）与实施例16（使用腐蚀毛面处理、表面粗糙度0.418μm、丙烯酸离型剂）比较，实施例14（使用涂布毛面处理、表面粗糙度0.362μm、三聚氰胺离型剂）与实施例17（使用涂布毛面处理、表面粗糙度0.362μm、丙烯酸离型剂）比较，实施例15（使用揉搓毛面处理、表面粗糙度0.245μm、三聚氰胺离型剂）与实施例18（使用揉搓毛面处理、表面粗糙度0.245μm、丙烯酸离型剂）比较，均可知与采用三聚氰胺离型剂的情况相比，在采用丙烯离型剂的情况下，冲压前的剥离强度值和冲压后的剥离强度值高。由此可知，通过改变离型剂的种类也能够控制剥离强度值。In addition, referring to Examples 1-8 using melamine release agent and Examples 9-12 using acrylic release agent, it can be seen that compared with the case of using a melamine release agent, in the case of using an acrylic release agent, the stamping The peel strength value before and the peel strength value after stamping are high. In addition, see the comparison of Example 13 (use of corrosion rough surface treatment, surface roughness of 0.418 μm, melamine release agent) and Example 16 (use of corrosion rough surface treatment, surface roughness of 0.418 μm, acrylic release agent), Example 14 (using matte coating treatment, surface roughness of 0.362 μm, melamine release agent) compared with Example 17 (using matte coating treatment, surface roughness of 0.362 μm, acrylic release agent), and Example 15 (using Rubbing rough surface treatment, surface roughness 0.245 μm, melamine release agent) compared with Example 18 (using rubbing rough surface treatment, surface roughness 0.245 μm, acrylic release agent), it can be known that it is the same as the situation of using melamine release agent In contrast, in the case of using the propylene release agent, the peel strength value before punching and the peel strength value after punching are high. From this, it can be seen that the peel strength value can also be controlled by changing the type of release agent.
另外，参见实施例1-18，可知当表面粗糙度的范围在0.2μm-1μm范围内时，在判定中评价为“○”。这是因为，当表面粗糙度值小于0.2μm时，在保护层（硬质层）的表面不能形成足以发挥锚固效应程度的凹凸，不能控制离型膜相对于保护层的剥离强度。另一方面，当表面粗糙度的值大于1.0μm时，由于保护层（硬质层）表面的凹凸所实现的锚固效应强（粘合力变强），将离型膜从保护层剥离时，甚至出现连保护层都剥下的问题。In addition, referring to Examples 1-18, it can be seen that when the range of the surface roughness is within the range of 0.2 μm to 1 μm, it is evaluated as “◯” in the judgment. This is because, when the surface roughness value is less than 0.2 μm, the surface of the protective layer (hard layer) cannot form unevenness enough to exert the anchoring effect, and the peel strength of the release film relative to the protective layer cannot be controlled. On the other hand, when the value of the surface roughness is greater than 1.0 μm, the anchoring effect (adhesion becomes stronger) achieved by the unevenness of the surface of the protective layer (hard layer) is strong, and when the release film is peeled off from the protective layer, There is even a problem of peeling off the protective layer.
另外，对于实施例1-18的屏蔽膜1，在将离型膜6a从保护层7剥离时，能够不损坏保护层自身地剥离离型膜6a，也就意味着不使用多余的力就能够顺利地剥离离型膜6a。In addition, for the shielding film 1 of Examples 1-18, when the release film 6a is peeled from the protective layer 7, the release film 6a can be peeled without damaging the protective layer itself, which means that the release film 6a can be peeled off without using excessive force. The release film 6a is smoothly peeled off.
另外，在实施例4-8、实施例12-18中，在判定中评价为“◎”。由此，可知当冲压后的剥离强度值在1-4N/50mm之间的情况下，当从保护层剥离离型膜时，能够更顺利地剥下离型膜。In addition, in Examples 4-8 and Examples 12-18, the evaluation was "⊚" in the judgment. From this, it can be seen that when the peel strength value after punching is between 1-4N/50mm, when peeling the release film from the protective layer, the release film can be peeled off more smoothly.
如上所述，在本实施方式的屏蔽膜1中，在离型膜6a的整个单面上形成有凹凸部61，通过在该离型膜6a的形成有凹凸部61的面上隔着离型剂层6b涂布树脂从而形成保护层7，并在该保护层7上形成有电磁波屏蔽层8，从保护层7上剥离了离型膜6a时，保护层7（硬质层7a）的表面粗糙度（Ra）为0.2μm-1.0μm。根据上述构造，在离型膜6a通过离型剂层6b粘合在保护层7上的状态下，由于离型膜6a表面的凹凸部61和保护层7（硬质层7a）表面的凹凸部71所产生的锚固效应，将离型膜6a相对于保护层7的粘合性提高到在后续工序中将屏蔽膜1浸渍在药液中之类的时候药液不会进入保护层7和离型膜6a之间从而防止离型膜6a从保护层7剥离的程度，上述保护层7表面的凹凸部71是通过转印离型膜6a表面的凹凸部61而形成的，保护层7的表面粗糙度（Ra）为0.2μm-1.0μm。另外，通过设置离型膜6a表面的凹凸部61和保护层7（硬质层7a）表面的凹凸部71，在向离型膜6a涂布离型剂的过程中被涂布在具有凹凸部61的离型膜6a上的离型剂自然地分散，因此能够形成使离型剂大致均匀地分散配置的状态的离型剂层6b，该保护层7表面的凹凸部71通过转印离型膜6a表面的凹凸部61而形成，该保护层7的表面粗糙度（Ra）为0.2μm-1.0μm。由此，能够将离型膜6a相对于保护层7的粘合性控制在将离型膜6a从保护层7剥离时不会由于过大的粘合力使保护层7本身破损的程度。这样，由于能够适当地控制离型膜相对于保护层7的粘合力，因此能够防止以过大的粘合力或过小的粘合力粘合离型膜6a时所产生的问题。As described above, in the masking film 1 of the present embodiment, the concave-convex portion 61 is formed on the entire single surface of the release film 6a, and the surface of the release film 6a on which the concave-convex portion 61 is formed The agent layer 6b is coated with resin to form a protective layer 7, and an electromagnetic wave shielding layer 8 is formed on the protective layer 7. When the release film 6a is peeled off from the protective layer 7, the surface of the protective layer 7 (hard layer 7a) The roughness (Ra) is 0.2μm-1.0μm. According to the above configuration, in the state where the release film 6a is adhered to the protective layer 7 through the release agent layer 6b, due to the unevenness 61 on the surface of the release film 6a and the unevenness on the surface of the protective layer 7 (hard layer 7a) The anchoring effect produced by 71 improves the adhesiveness of the release film 6a relative to the protective layer 7 so that when the shielding film 1 is immersed in the chemical solution in the subsequent process, the chemical solution will not enter the protective layer 7 and the release film. The degree of peeling of the release film 6a from the protective layer 7 is prevented between the type films 6a. The concave-convex portion 71 on the surface of the protective layer 7 is formed by transferring the concave-convex portion 61 on the surface of the release film 6a. The surface of the protective layer 7 The roughness (Ra) is 0.2μm-1.0μm. In addition, by providing the concave-convex portion 61 on the surface of the release film 6a and the concave-convex portion 71 on the surface of the protective layer 7 (hard layer 7a), in the process of applying the release agent to the release film 6a, it is coated on the surface having the concave-convex portion. The release agent on the release film 6a of 61 is naturally dispersed, so it is possible to form the release agent layer 6b in a state where the release agent is substantially evenly dispersed and configured, and the unevenness 71 on the surface of the protective layer 7 is released by transfer. The surface roughness (Ra) of the protective layer 7 is 0.2 μm-1.0 μm. Thus, the adhesiveness of the release film 6a to the protective layer 7 can be controlled to such an extent that the protective layer 7 itself will not be damaged due to excessive adhesive force when the release film 6a is peeled from the protective layer 7 . In this way, since the adhesive force of the release film to the protective layer 7 can be properly controlled, it is possible to prevent the problem that occurs when the release film 6a is adhered with excessively large adhesive force or too small adhesive force.
另外，在本实施方式的屏蔽膜1中，设离型膜6a相对于保护层7的剥离强度为1N/50mm-20N/50mm的范围。由此能够使离型膜6a相对于保护层7的粘合力更合适。Moreover, in the masking film 1 of this embodiment, the peeling strength of the release film 6a with respect to the protective layer 7 is set to the range of 1N/50mm-20N/50mm. Thereby, the adhesive force of the release film 6a with respect to the protective layer 7 can be made more suitable.
另外，本实施方式的屏蔽膜1，设对基体膜5加热、加压后离型膜6a相对于保护层7的剥离强度为1N/50mm-10N/50mm的范围。由此能够使离型膜6a相对于保护层7的粘合力更合适。In addition, in the masking film 1 of the present embodiment, the peel strength of the release film 6a with respect to the protective layer 7 after heating and pressing the base film 5 is set to be in the range of 1N/50mm-10N/50mm. Thereby, the adhesive force of the release film 6a with respect to the protective layer 7 can be made more suitable.
另外，在本实施方式的屏蔽膜1中，通过在电磁波屏蔽层8中包含导电性粘合剂层8a，能够可靠地使接地电路3b和电磁波屏蔽层8电连接。Moreover, in the shielding film 1 of this embodiment, by including the electroconductive adhesive layer 8a in the electromagnetic wave shielding layer 8, the ground circuit 3b and the electromagnetic wave shielding layer 8 can be electrically connected reliably.
另外，在本实施方式的屏蔽膜1中，通过在电磁波屏蔽层8中还包含金属层8b，并在导电性粘合剂层8a中使用各向异性导电性粘合剂，能够减少导电性填料的含量，制成柔性优良的屏蔽膜。In addition, in the shielding film 1 of the present embodiment, by further including the metal layer 8b in the electromagnetic wave shielding layer 8 and using an anisotropic conductive adhesive in the conductive adhesive layer 8a, the amount of conductive filler can be reduced. The content of the film is made into a flexible and excellent shielding film.
另外，在本实施方式的屏蔽膜1中，通过在导电性粘合剂层8a中使用各向同性导电性粘合剂，从而只设置导电性粘合剂层8a就能够进行对接地电路3b的接地连接，并且能够保持电磁波屏蔽效果。In addition, in the shielding film 1 of the present embodiment, by using an isotropic conductive adhesive for the conductive adhesive layer 8a, only the conductive adhesive layer 8a can be used to connect the ground circuit 3b. ground connection, and can maintain the electromagnetic wave shielding effect.
另外，在本实施方式中，屏蔽印刷布线板10构成为：基体膜5包含一层以上的印刷电路3，在基体膜5的至少单面上设置有屏蔽膜1，在从保护层7上剥离了离型膜6a时，保护层7（硬质层7a）的表面粗糙度（Ra）为0.2μm-1.0μm的范围内。其中，屏蔽膜1构成为：在离型膜6a的整个单面上形成有凹凸部61，通过在该离型膜6a的形成有凹凸部61的面上隔着离型剂层6b涂布树脂形成保护层7，并在该保护层7上形成电磁波屏蔽层8。由此，对于在基体膜5的单面上具有电磁波屏蔽层8和保护层7的屏蔽柔性印刷布线板10，由于能够适当地控制离型膜6a相对于保护层7的粘合力，因此能够防止以过大的粘合力或过小的粘合力粘合离型膜6a时所产生的问题。In addition, in this embodiment, the shielded printed wiring board 10 is configured such that the base film 5 includes more than one printed circuit 3, the shielding film 1 is provided on at least one side of the base film 5, and the shielding film 1 is peeled off from the protective layer 7. When the release film 6 a is used, the surface roughness (Ra) of the protective layer 7 (hard layer 7 a ) is within the range of 0.2 μm to 1.0 μm. Among them, the masking film 1 is constituted by forming the concave-convex portion 61 on the entire single surface of the release film 6a, and coating the resin on the surface of the release film 6a on which the concave-convex portion 61 is formed via the release agent layer 6b. A protective layer 7 is formed, and an electromagnetic wave shielding layer 8 is formed on the protective layer 7 . Thus, for the shielded flexible printed wiring board 10 having the electromagnetic wave shielding layer 8 and the protective layer 7 on one side of the base film 5, since the adhesive force of the release film 6a with respect to the protective layer 7 can be appropriately controlled, it is possible to Problems arising when the release film 6a is adhered with excessively large adhesive force or too small adhesive force are prevented.
另外，本实施方式的屏蔽柔性印刷布线板10，由于包含印刷电路3的基体膜5由柔性印刷布线板构成，所以能够制成柔性优良的屏蔽柔性印刷布线板10。In addition, since the shielded flexible printed wiring board 10 of the present embodiment is formed of a flexible printed wiring board including the base film 5 including the printed circuit 3 , it is possible to provide a shielded flexible printed wiring board 10 excellent in flexibility.
另外，本实施方式的屏蔽柔性印刷布线板10，由于包含印刷电路3的基体膜5能够作为带载封装用TAB带，因此能够获得柔软且安装性优良的屏蔽印刷布线板10。In addition, in the shielded flexible printed wiring board 10 of this embodiment, since the base film 5 including the printed circuit 3 can be used as a TAB tape for tape mount packaging, a shielded printed wiring board 10 that is flexible and excellent in mountability can be obtained.
另外，在本实施方式的屏蔽柔性印刷布线板10的制造方法中，在包含一层以上的印刷电路3的基体膜5的至少单面上配置屏蔽膜1，该屏蔽膜1通过在离型膜6a的形成有凹凸部61的表面上至少层叠了离型剂层6b、保护层7和电磁波屏蔽层8而形成，上述离型膜6a通过毛面处理在整个单面上形成有凹凸部61；在层叠方向上对屏蔽膜1和基体膜5加热、加压后，将离型膜6a从保护层7上剥离，使保护层7的表面粗糙度（Ra）为0.2μm-1.0μm。根据上述方法，由于能够适当地控制离型膜6a相对于保护层7的粘合力，因此能够防止由于过大的粘合力或过小的粘合力粘合离型膜6a时所产生的问题。In addition, in the manufacturing method of the shielded flexible printed wiring board 10 of the present embodiment, the shielding film 1 is disposed on at least one surface of the base film 5 including the printed circuit 3 of one or more layers, and the shielding film 1 is formed on a release film. 6a is formed with at least a release agent layer 6b, a protective layer 7 and an electromagnetic wave shielding layer 8 on the surface where the concave-convex portion 61 is formed, and the above-mentioned release film 6a is formed with the concave-convex portion 61 on the entire single surface by rough surface treatment; After heating and pressing the shielding film 1 and the base film 5 in the stacking direction, the release film 6 a is peeled off from the protective layer 7 so that the surface roughness (Ra) of the protective layer 7 is 0.2 μm-1.0 μm. According to the above method, since the adhesive force of the release film 6a with respect to the protective layer 7 can be properly controlled, it is possible to prevent the damage caused when the release film 6a is bonded due to excessive adhesive force or too small adhesive force. question.
附图标记说明Explanation of reference signs
1、1’：屏蔽膜；1, 1': shielding film;
2、2’：基底膜；2, 2': basement membrane;
2a’：绝缘去除部2a': Insulation removal part
3、3’：印刷电路；3, 3': printed circuit;
3a、3a’：信号电路；3a, 3a': signal circuit;
3b、3b’：接地电路；3b, 3b': grounding circuit;
3c、3c’：非绝缘部；3c, 3c': non-insulated part;
3d’：贯通孔；3d': through hole;
4：绝缘膜；4: insulating film;
4a：绝缘去除部；4a: insulation removal part;
5，5’，5’’：基体膜；5, 5', 5'': base film;
6a：离型膜；6a: release film;
6b：离型剂层；6b: release agent layer;
7：保护层；7: protective layer;
7a：硬质层；7a: hard layer;
7b：软质层；7b: soft layer;
8，8’：电磁波屏蔽层；8, 8': Electromagnetic wave shielding layer;
8a：粘合剂层；8a: adhesive layer;
8a’：粘合剂；8a': adhesive;
8b：金属层；8b: metal layer;
9，9’：屏蔽膜主体；9, 9': shielding film body;
10：屏蔽柔性印刷布线板；10: Shielded flexible printed wiring board;
10’：屏蔽FPC；10': shielded FPC;
10A：双面屏蔽FPC；10A: double-sided shielded FPC;
10B：双面屏蔽FPC；10B: double-sided shielded FPC;
11：金属箔；11: metal foil;
12：粘合性树脂层；12: Adhesive resin layer;
71：凹凸部；71: concavo-convex part;
71a：凸部；71a: convex portion;
71b：凹部；71b: concave portion;
s：界面s: interface
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012259458AJP2014112576A (en) | 2012-11-28 | 2012-11-28 | Shield film |
| JP2012-259458 | 2012-11-28 |
| Publication Number | Publication Date |
|---|---|
| CN103857268A CN103857268A (en) | 2014-06-11 |
| CN103857268Btrue CN103857268B (en) | 2018-04-06 |
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310624903.2AActiveCN103857268B (en) | 2012-11-28 | 2013-11-28 | Screened film, shielding printed wiring board and the manufacture method for shielding printed wiring board |
| Country | Link |
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| JP (1) | JP2014112576A (en) |
| KR (2) | KR101961234B1 (en) |
| CN (1) | CN103857268B (en) |
| TW (1) | TWI535340B (en) |
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| TW201422066A (en) | 2014-06-01 |
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| Date | Code | Title | Description |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
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| GR01 | Patent grant |