Embodiment
The present invention provides several embodiments to illustrate the technical characteristic of the present invention, the content of embodiment and the schema of draftingOnly illustratively purposes of discussion, and be not used to limit the scope of the present invention.Inessential element may be omitted in schema, it is different specialSign may be not drawn to scale, and be merely to illustrate and be used.Disclosed content may use in different embodimentsThe component symbol repeated, not representing has association between different embodiments or schema.In addition, an element be formed at another element "Top ", " on ", " lower section " or " under " embodiment that directly contacts of two elements can be included, or can also include between two elementsIt is folded with the embodiment of other additional elements.Various elements may be shown with any different proportion so that illustrative clarity is succinct.
2A~2D figures are refer to, a series of profiles made for foundation one embodiment of the invention, to illustrate this hairThe flow of bright monolithic glass touch-control board manufacturing method.2A figures are refer to, first, there is provided substrate 410, and form plastic layer422 on substrate 410.The system of substrate 410 as the structure formed in subsequent step mechanicalness support, its can be one it is transparent orOpaque substrate, such as a glass substrate, but its material not limited to this.Plastic layer 422 has release ability, and it may include polyamidesImines（PI）, polypropylene（PP）, polystyrene（PS）, acrylonitrile butadiene styrene resin（ABS）, poly terephthalic acid secondDiester（PET）, polyvinyl chloride（PVC）, makrolon（PC）, polyethylene（PE）, polymethyl methacrylate（PMMA）, polytetrafluoroEthene（PTFE）Or foregoing combination.Plastic layer 422 can be single or multiple lift structure, also can be to have release ability by lower floorThe stacking structure that is formed of the material of material and upper strata without release ability.In this step, plastic layer 422 is made predeterminedThe bonding land M of engagement circuit board has first thickness H1, and in bonding land, M is with exterior domain（Disengaged area）With second thickness H2,And first thickness H1 is more than second thickness H2.First thickness H1 can be between about 0.5 micron to 15 microns, and second thickness H2 canBetween about 0.5 micron to about 10 microns.This step can use the method for printing, lithography, spraying to carry out.
Then, cushion 424 is formed on plastic layer 422, and cushion 424 is collectively formed positioned at substrate with plastic layer 422Bearing bed 420 on 410.In another embodiment, bearing bed 420 can only include plastic layer 422, i.e., do not form cushion 424.Cushion 424 can be formed by any transparent material.In one embodiment, cushion 424 uses silica, and chemical gas can be usedPhase depositing（Chemical Vapor Deposition, CVD）Or other proper methods are formed.In another embodiment, cushion424 can use the adhesion promoter (Adhesion Promoter) of the functional group comprising two kinds of different qualities, more specifically, shouldAdhesion promoter includes the functional group of organic-philic material and the functional group of the inorganic material of parent, wherein the functional group of organic-philic material can be amineBase, hydroxyl, epoxy radicals etc., the functional group of the inorganic material of parent can be sulfhydryl, amido, hydroxyl, phosphoric acid foundation etc., have both specialThe adhesion promoter of the functional group of property, has preferable tack, and then can ensure that cushion 424 for inorganic matter or organic matterIt is suitable for different plastic layer materials.
The thickness of cushion 424 can be between about 10 angstroms to about 3000 angstroms.Cushion 424 relative to plastic layer 422 have compared withHigh hardness, the cushion 424 of higher hardness is arranged in pairs or groups into bearing bed 420 that the good plastic layer 422 of ductility formed can be simultaneouslyWith good release ability and superior bearing capacity, with improve be subsequently formed in other components on bearing bed 420 canBy degree.In addition, by making plastic layer 422 and cushion 424 turn into composite film, it can obtain having concurrently good mechanical strength and releaseThe bearing bed 420 of ability.Due to only thickening the bonding land M thickness of bearing bed 420, the thickness of bearing bed 420 in disengaged area is not, can't when thickening, and the touch area of bonding land M and nonbody, therefore Trackpad subsequently being applied into touch control display apparatusInfluence the translucency of main body Trackpad.
Then, the step of carrying out 2B figures, forms conductive layer 430, and carry out figure to conductive layer 430 on bearing bed 420Caseization is handled to form sensing electrode 432.Conductive layer 430 is the conductive material that can be had an X-rayed, it may include tin indium oxide, aluminum oxideZinc, zinc oxide, tin-antiomony oxide, tin ash, indium oxide, nm silver, carbon nanotube or foregoing combination, physics can be used in itOr chemical gaseous phase depositing, printing, evaporation, spraying or other proper methods are formed.Above-mentioned patterning step can be by any appropriateMethod is carried out, such as a lithographic and etching step.In other embodiments, also figure can directly be formed with modes such as wire mark, sprayingsThe conductive layer 430 of case.Please refer to Fig. 3 A, Fig. 3 A depict a kind of patterned conductive layer 430 available for Fig. 2 B.ByThis patterned process step, sensing electrode 432 can be formed on bearing bed 420.In the present embodiment, sensing electrode 432 includesA plurality of strip shaped electric poles, but can also use other touch-control structures.
Referring to 2C figures and Fig. 3 B, after the formation of sensing electrode 432, signal conductor is formed.The electricity of signal conductor 440Property be connected to sensing electrode 432, and converge to an at least bonding land M, bonding land M is located at least one outside of sensing electrode 432Side.It should be noted that bonding land M position and quantity can adjust according to specific electrode structure, the position of diagram is not limited toAnd quantity.The system of signal conductor 440 by signal caused by sensing electrode 432 being sent to external circuit.Signal conductor 440Material may include copper, aluminium, silver, gold, molybdenum aluminium molybdenum alloys, tin indium oxide（ITO）Or foregoing combination.
Then an engagement step is carried out, circuit board 470 is electrically connected to sensing electrode 432.The one end of circuit board 470 canBonding land M signal conductor 440 is bonded to by conducting resinl 460, then sensing electrode 432 is electrically connected to by signal conductor 440,The other end can then connect a control chip（Do not illustrate）, and it is connected to an external circuit by this control wafer electrical（Do not paintShow）, such as a printed circuit board (PCB).In this embodiment, circuit board 470 can be a flexible circuit board（Flexible PrintedCircuits, FPC）, anisotropic conductive adhesive paste can be used in conducting resinl 460（Anisotropic Conductive Film, ACF）.ByBy circuit board 470, the signal of change produced by sensing electrode 432 can be sent to external circuit, sentenced by IC computings and systemThe coordinate of position of touch is can obtain after reading.The sensing electrode 432 that is formed on bearing bed 420, signal conductor 440, circuit board 470Constitute the touch-control structure of main body.
Then, engagement glue 450 is attached by the top of sensing electrode 432.Because bonding land M is formed with conducting resinl 460 and circuitPlate 470, M relatively other regions in the bonding land are compared with out-of-flatness, in bonding land during to seek binding yield and avoid attaching engagement glue 450M domains produce bubble, therefore can avoid bonding land, i.e., are covered positioned at the not engaged glue 450 of bonding land M.Glue 450 is engaged to can be selected thoroughlyThe preferable material of photosensitiveness, such as solid state optics glue（Solid Optical Clear Adhesive）Or liquid optical cement（LiquidOptical Clear Adhesive）.Engagement glue 450 may include lucite, such as acryl（Acrylic）.EngagementThe hot pressing processing procedure of temperature-pressure can be used to fit in the top of sensing electrode 432 for glue 450, and glue 450 is engaged after the completion of hot pressing to be consolidatedAbove sensing electrode 432, therefore also can further lift the bulk strength of touch-control structure.In one embodiment, can be bondedAll are carried out after the step of engaging glue 450 and cuts step, and the plural touch-control structure that will be formed on same large-size substrate is carried outSeparation, the cutting step can be by the way of break bar cuttings or radium-shine cutting.In another embodiment, engagement glue can first be attached450, rejoin circuit board 470.
Finally in the step of 2D schemes, cover plate 480 is attached above touch-control structure, and by the substrate 410 in 2C figuresRemoved from bearing bed 420（It is release）.For the system of cover plate 480 to protect touch-control structure, it may include the transparent materials such as glass.In this realityApply in example, before attaching cover plate 480, light shield layer 490 can be formed in the edge of cover plate 480, more specifically, light shield layer 490 is located atThe side that cover plate 480 engages with touch-control structure.In another embodiment, light shield layer 490 can be located at relative with composition surface anotherSide.Light shield layer 490, to mask signal wire 440, it is ensured that monolithic glass Trackpad using process signal wire 440 not byUser sees, influences visual appearance.The material of light shield layer 490 can be colored ink or coloured photoresistance.Substrate 410 is carried certainly420 release method of layer can be solution immersion, heat treatment, cold treatment, external force stripping or foregoing combination.More specifically, usingWhen solution soaks, solution used can be water, alcohol, propylene glycol methyl ether acetate (PGMEA) solution, polyvinylidene fluoride（NMP）Solution etc.；It is that substrate 410 is heated or cooled using heat treatment and cold treatment, utilizes bearing bed 420 and substrate 410Coefficient of thermal expansion is different to be produced stress and then facilitates release.Also, the order that above-mentioned cover plate attaches, substrate removes can be transferred, and it is unlimitedIn said sequence.
With reference to Fig. 2 D and Fig. 3 B, the monolithic glass Trackpad 400 formed via above-mentioned technique includes：Cover plate 480；HoldCarrier layer 420, on bearing bed 420 formed with：The conductive layer of patterning, include a sensing electrode 432；Signal conductor 440, electrically connectsBe connected to the sensing electrode, and the signal conductor 440 converges to an at least bonding land M, and bonding land M be located at sensing electrode 432 toFew outer side edges, wherein bonding land M bearing bed thickness are more than the bearing bed thickness in disengaged area；Circuit board 470, electrical side connectIn bonding land M signal conductor 440；And engagement glue 450, it is arranged between the cover plate 480 and the bearing bed 420, toEngage the cover plate 480 and the bearing bed 420.Wherein, bearing bed 420 includes plastic layer 422 and cushion 424.Plastic layer 422In bonding land, M has first thickness H1, has second thickness H2 beyond the M of bonding land, first thickness H1 systems between 0.5 micron extremelyBetween 15 microns, second thickness H2 can be between about 0.5 micron to about 10 microns.The edge of cover plate 480 is formed with light shield layer490, to mask signal wire 440, it is ensured that monolithic glass Trackpad 400 is using the person of being not used of process signal wire 440See, influence visual appearance.It has been described in detail in other characteristic formation process of 400 each component of monolithic glass Trackpad, herein no longerRepeat.
By making bonding land M plastic layer 422 that there is thicker thickness H1, reach the thickness for thickening bonding land M bearing beds 420The purpose of degree so that when removing substrate 410, the effect of stress suffered by the bonding land M of bearing bed 420 can be buffered, therefore canReduce the possibility that bonding land M circuit board 470 comes off or damaged.On the other hand, due to bearing bed 420 disengaged area notNeed to correspond to and thicken, thus the translucency of overall monolithic glass Trackpad can't be influenceed.And bonding land M signal conductor 440It will subsequently be covered by light shield layer 490, i.e. the touch area of bonding land M and nonbody, therefore Trackpad is subsequently applied to touch-controlDuring display device, the translucency of main body Trackpad can't be influenceed.
Additionally referring to Fig. 4 A and Fig. 4 B, the primary clustering and system of monolithic glass Trackpad 500 and monolithic glass Trackpad 400It is substantially similar to make method, difference is, the present embodiment is strengthened step and further included in bonding land M interior circuit boards 570 and bearing bedThe step of solid 551 are filled in space between 520.By adding solid 551, it can further strengthen bonding land M and peel offStability during substrate 510 during bearing bed 520, reduce the possibility that Jie Ming area M circuit board 570 comes off or damaged.This is extraThe solid 551 of addition can use the materials such as solid state optics glue, liquid optical cement.
In previously described embodiments of the present invention, sensing electrode, can be with except being arranged as in addition to the list structure shown in Fig. 3 AFor other aspects.Illustrate the aspect of another sensing electrode by taking the sensing electrode 432 shown in first embodiment as an example, refer to figure5A to Fig. 5 C, sensing electrode 432 include a plurality of first electrode block 432a arranged in the first direction, plural article of connection adjacent theOne electrode block 432a the first wire 432c, and a plurality of second electrode block 432b arranged in a second direction, each second electricityPole block 432b is distributed in the first wire 432c both sides.It is preferred that first direction is mutually perpendicular to second direction.
As shown in Figure 5 B, after Fig. 5 A sensing array electrode sensing electrode 432 is formed, further in each first wireCollets P is formed on 432c.Collets P's uses the insulating materials such as epoxy resin.
As shown in Figure 5 C, after the collets P shown in Fig. 5 B is formed, connection is further formed on each collets PAdjacent second electrode block 432b the second wire 433, and signal conductor 440.Second wire 433 and signal conductor 440 can be sameWhen formed, also can successively be formed.Second wire 433 can use with the identical material of signal conductor 440, such as copper, aluminium, silver, gold, molybdenumAluminium molybdenum alloys, tin indium oxide（ITO）Or foregoing combination.Second wire 433 can also use the material differed with signal conductor 440Material.Sensing electrode 432 is identical with previous embodiment with other characteristics of signal conductor 440, and here is omitted.
Using the preparation method of monolithic glass Trackpad of the present invention, by thickening the thickness of bonding land bearing bed, base is removedDuring plate, the effect of stress can be buffered suffered by the bearing bed of bonding land, thus can mitigate the group of bonding land bearing bed fringe regionThe problem of part easily falls off or damaged, separately due to only thickening the thickness of bonding land bearing bed, disengaged area carrier layer is not madeThicken, and bonding land will subsequently be covered by light shield layer, i.e. bonding land and the touch area of nonbody, therefore subsequently by Trackpad applicationWhen touch control display apparatus, the translucency of main body Trackpad can't be influenceed.
Although the present invention is disclosed above with several preferred embodiments, so it is not limited to the present invention, any affiliatedHave usually intellectual in technical field, without departing from the spirit and scope of the present invention, arbitrarily change and retouch when that can make,Therefore protection scope of the present invention is worked as and is defined depending on appended claims institute defender.