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CN103809143A - Arrangement method of WAT (wafer acceptance test) head - Google Patents

Arrangement method of WAT (wafer acceptance test) head
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Publication number
CN103809143A
CN103809143ACN201310612743.XACN201310612743ACN103809143ACN 103809143 ACN103809143 ACN 103809143ACN 201310612743 ACN201310612743 ACN 201310612743ACN 103809143 ACN103809143 ACN 103809143A
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CN
China
Prior art keywords
wat
measuring head
hydraulic
fluid pressure
hydraulic driving
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201310612743.XA
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Chinese (zh)
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CN103809143B (en
Inventor
王靓
莫保章
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shanghai Huali Microelectronics Corp
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Shanghai Huali Microelectronics Corp
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Priority to CN201310612743.XApriorityCriticalpatent/CN103809143B/en
Publication of CN103809143ApublicationCriticalpatent/CN103809143A/en
Application grantedgrantedCritical
Publication of CN103809143BpublicationCriticalpatent/CN103809143B/en
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Abstract

The invention discloses an arrangement method of a WAT head. The method comprises a hydraulic driving device and a control device, wherein the hydraulic driving device comprises four hydraulic driving lifting rods, the upper surface of a probe machine table is fixedly provided with the four hydraulic driving lifting rods, and the four hydraulic driving lifting rods are fixedly connected to the four corners of the bottom surface of the test head; the control device is electrically connected with the hydraulic driving device. When the test head is maintained, a rotating type scheme is replaced by a test head lifting type scheme, so that space occupation can be reduced.

Description

A kind of method for arranging of WAT measuring head
Technical field
The present invention relates to semiconductor test field, relate in particular to a kind of method for arranging of novel WAT measuring head.
Background technology
WAT machine as shown in Figure 1, can acceptance test for current (WAT) wafer, board is by Tester(tester table) and Prober(probe board) two parts form, wherein Tester is divided into rack and measuring head: normal condition board floor area is about 6m^2.Wherein measuring head is turnover structure, hinge by Prober drives, can Rotate 180 degree by turning axle: in the time that service work is done to measuring head part by equipment or manufacturer, can need measuring head to turn over turnback, be used for measuring head part to do corresponding maintenance job.But after upset, laterally can take ground space more, take floor area more and be about 9m^2, have more 50% floor area.Along with the demand of production capacity is increasing, WAT board can constantly increase, and arranging of board is more and more tightr, and the floor area of each is more and more less like this, if when the floor area of every board is less than 9m^2, the upset scheme of measuring head just cannot realize because take up an area the reason in space.
Chinese patent WAT probe intelligent processing system and method (publication number CN103336256A) disclose a kind of WAT probe intelligent processing system and method, and this system comprises the steps: real time record and adds up probe pricking times; The accumulation pricking times of detector probe card; Judge whether the accumulative total pricking times of probe exceedes the upper limit of setting, if do not exceed, continue test, otherwise enter next step; Send information.But this invention is during for WAT upkeep operation, the particular location of measuring head gives technical scheme
Summary of the invention
The defect existing for technique scheme, the invention provides a kind of method for arranging of WAT measuring head, wherein, comprise: fluid pressure drive device, described fluid pressure drive device comprises four hydraulic-driven elevating levers, at fixing described four the hydraulic-driven elevating levers of upper surface of probe board, described four hydraulic-driven elevating levers are fixedly connected on respectively four drift angle places of described measuring head bottom surface; Also provide a control device, described control device and the electrical connection of described fluid pressure drive device.
The method for arranging of above-mentioned WAT measuring head, wherein, described fluid pressure drive device also comprises miniature hydraulic pump, described four driving elevating levers connect described miniature hydraulic pump.
The invention has the beneficial effects as follows in sum: in maintenance measuring head, the scheme of a use test lift replaces convertible scheme, is used for saving extra occupation of land space.
Accompanying drawing explanation
Fig. 1 is the schematic diagram that the jacking condition of hydraulic actuator changes;
Fig. 2 is the structural representation of the measuring head of Rotate 180 degree in prior art;
Fig. 3 is the layout schematic diagram of WAT measuring head;
Fig. 4 is the layout schematic diagram of WAT measuring head;
Fig. 5 be WAT measuring head overlook layout schematic diagram.
Embodiment
Below in conjunction with the drawings and specific embodiments, the invention will be further described, but not as limiting to the invention.
As shown in Figures 1 to 5, a kind of method for arranging of WAT measuring head, wherein, comprise: fluidpressure drive device 5, described fluidpressure drive device 5 comprises four hydraulic-drivenelevating levers 4, at fixing described four the hydraulic-drivenelevating levers 4 of upper surface ofprobe board 2, described four hydraulic-drivenelevating levers 4 are fixedly connected on respectively four drift angle places of described measuringhead 1 bottom surface; One control device (not in the accompanying drawings mark) is also provided, and described control device and described fluidpressure drive device 5 are electrically connected.
WAT machine comprises tester table 3 and Proberprobe board 2, at probe board 2(Prober board) 4hydraulic actuators 5 of increase, and be connected with measuringhead 1, when need to rising measuringhead 1, send instruction by control device,hydraulic actuator 5 is extended, reach to extend after maximum rating and stop; After measuring head maintenance finishes, send instruction by control device,hydraulic actuator 5 is shortened, stop after being reduced into original state, complete.
Preferably, described fluid pressure drive device also comprises miniature hydraulic pump (not in the accompanying drawings mark), and described four driving elevating levers connect described miniature hydraulic pump.
It should be appreciated by those skilled in the art that those skilled in the art can realize described variation example in conjunction with prior art and above-described embodiment, do not repeat them here.Such variation example does not affect flesh and blood of the present invention, does not repeat them here.
Above preferred embodiment of the present invention is described.It will be appreciated that, the present invention is not limited to above-mentioned specific implementations, the equipment of wherein not describing in detail to the greatest extent and structure are construed as and give any those of ordinary skill in the art of reality with the common mode in this area, do not departing from technical solution of the present invention scope situation, all can utilize method and the technology contents of above-mentioned announcement to make many possible variations and modification to technical solution of the present invention, or being revised as the equivalent embodiment of equivalent variations, this does not affect flesh and blood of the present invention.Therefore, every content that does not depart from technical solution of the present invention,, all still belongs in the scope of technical solution of the present invention protection any simple modification made for any of the above embodiments, equivalent variations and modification according to technical spirit of the present invention.

Claims (2)

CN201310612743.XA2013-11-262013-11-26Arrangement method of WAT (wafer acceptance test) headActiveCN103809143B (en)

Priority Applications (1)

Application NumberPriority DateFiling DateTitle
CN201310612743.XACN103809143B (en)2013-11-262013-11-26Arrangement method of WAT (wafer acceptance test) head

Applications Claiming Priority (1)

Application NumberPriority DateFiling DateTitle
CN201310612743.XACN103809143B (en)2013-11-262013-11-26Arrangement method of WAT (wafer acceptance test) head

Publications (2)

Publication NumberPublication Date
CN103809143Atrue CN103809143A (en)2014-05-21
CN103809143B CN103809143B (en)2017-01-18

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CN201310612743.XAActiveCN103809143B (en)2013-11-262013-11-26Arrangement method of WAT (wafer acceptance test) head

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
CN111190091A (en)*2019-12-262020-05-22华虹半导体(无锡)有限公司Test head of WAT equipment and diagnosis and repair method thereof

Citations (6)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
JP2008170194A (en)*2007-01-092008-07-24Yamaha CorpTest method of electronic device, tester of electronic device, and test system of electronic device
CN101477961A (en)*2008-01-032009-07-08京元电子股份有限公司Wafer lifting table and wafer testing machine thereof
CN102539852A (en)*2012-03-142012-07-04中南大学Test head for automatically detecting wafer-level packaged chips and implementing method for test head
CN202423247U (en)*2011-12-212012-09-05上海华虹Nec电子有限公司Tray of probe table with changeable height
CN203019050U (en)*2012-11-222013-06-26天津滨海龙泰科技发展有限公司Lifting carrier roller
CN203266384U (en)*2013-05-312013-11-06鉅仑科技股份有限公司Wafer grinding machine

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
JP2008170194A (en)*2007-01-092008-07-24Yamaha CorpTest method of electronic device, tester of electronic device, and test system of electronic device
CN101477961A (en)*2008-01-032009-07-08京元电子股份有限公司Wafer lifting table and wafer testing machine thereof
CN202423247U (en)*2011-12-212012-09-05上海华虹Nec电子有限公司Tray of probe table with changeable height
CN102539852A (en)*2012-03-142012-07-04中南大学Test head for automatically detecting wafer-level packaged chips and implementing method for test head
CN203019050U (en)*2012-11-222013-06-26天津滨海龙泰科技发展有限公司Lifting carrier roller
CN203266384U (en)*2013-05-312013-11-06鉅仑科技股份有限公司Wafer grinding machine

Cited By (2)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
CN111190091A (en)*2019-12-262020-05-22华虹半导体(无锡)有限公司Test head of WAT equipment and diagnosis and repair method thereof
CN111190091B (en)*2019-12-262021-11-09华虹半导体(无锡)有限公司Test head of WAT equipment and diagnosis and repair method thereof

Also Published As

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