技术领域technical field
本发明涉及电路板领域，特别是一种适用于较软材质电路板阻焊双面印刷方法和装置。The invention relates to the field of circuit boards, in particular to a method and device for double-sided printing of solder resistance on soft material circuit boards.
背景技术Background technique
目前电路板阻焊双面印刷主要采用钉床印刷，在丝印机床上布置探针形成钉床，探针位置避开待印刷电路板线路图形区域并可起到制成作用。在印刷时，将已经印刷好一面的电路板翻转后放置在钉床上，由于钉床的支撑作用，电路板已印刷好的一面不会接触丝印机台面。然后，由于钉床的探针与待印刷电路板的接触面积很小，支撑作用有限，仅能实现较硬材质的电路板的双面印刷，对于较软材质的电路板，无法起到支撑且不让电路板接触丝印机台面的作用，同时因钢质的支撑钉会受力压到电路板上形成凹陷，导致产品报废，因此现有技术无法解决较软材质电路板阻焊双面印刷的问题。At present, the double-sided printing of circuit board solder mask mainly adopts nail bed printing. Probes are arranged on the screen printing machine to form a nail bed. The position of the probes avoids the area of the printed circuit board circuit pattern and can play a role in manufacturing. When printing, the circuit board that has been printed on one side is turned over and placed on the nail bed. Due to the support of the nail bed, the printed side of the circuit board will not touch the screen printing machine table. Then, because the contact area between the probe of the nail bed and the printed circuit board to be printed is very small, the supporting effect is limited, and only the double-sided printing of the hard material circuit board can be realized. For the softer material circuit board, it cannot support and The role of keeping the circuit board from touching the table of the screen printing machine, and because the steel support nails will be pressed against the circuit board to form a depression, resulting in product scrapping, so the existing technology cannot solve the problem of solder mask double-sided printing on softer material circuit boards question.
发明内容Contents of the invention
为了解决上述问题，本发明提供一种适用于较软材质的电路板阻焊双面印刷方法和装置。In order to solve the above problems, the present invention provides a solder mask double-sided printing method and device suitable for softer materials.
一种电路板阻焊双面印刷方法，包括如下步骤：提供垫板；在所述垫板上钻定位孔；根据待印刷电路板实际阻焊印刷有效区域在所述垫板上对应掏空并形成开口区域，并且在所述开口区域两侧形成用于支撑所述待印刷电路板的支撑位，其中所述开口区域两侧的支撑位分别具有朝向所述开口区域延伸的三角形延伸部；固定所述垫板；在所述垫板上设置丝印挂钉；将待印刷电路板放置在所述垫板上并进行印刷。A circuit board solder mask double-sided printing method, comprising the following steps: providing a backing plate; drilling positioning holes on the backing plate; correspondingly hollowing out the backing plate according to the actual solder mask printing effective area of the printed circuit board and An opening area is formed, and support positions for supporting the printed circuit board to be printed are formed on both sides of the opening area, wherein the support positions on both sides of the opening area respectively have triangular extensions extending toward the opening area; fixing the backing plate; setting silk screen pegs on the backing plate; placing the printed circuit board to be printed on the backing plate and printing.
优选的，所述垫板厚度为1毫米至3毫米，所述垫板尺寸比待印刷电路板尺寸单边大20毫米。Preferably, the thickness of the backing plate is 1 mm to 3 mm, and the size of the backing plate is 20 mm larger than the size of the printed circuit board on one side.
优选的所述定位孔位于四周，与待印刷电路板内有效区域距离大于5毫米。Preferably, the positioning holes are located around, and the distance between them and the effective area in the printed circuit board is greater than 5 mm.
优选的，所述定位孔和待印刷电路板固定孔对应设置。Preferably, the positioning holes are set correspondingly to the fixing holes of the printed circuit board.
优选的，所述开口区域通过模具冲压或者数控铣掏空形成。Preferably, the opening area is hollowed out by die stamping or numerical control milling.
优选的，所述垫板在所述开口区域之间形成条状或块状的支撑位。Preferably, the backing plate forms strip-shaped or block-shaped support positions between the opening areas.
优选的，所述丝印挂钉对应所述垫板定位孔设置。Preferably, the silk screen pegs are set corresponding to the positioning holes of the backing plate.
优选的，所述垫板是FR-4基板或金属基板。Preferably, the backing plate is an FR-4 substrate or a metal substrate.
一种电路板阻焊双面印刷装置，适用于如上所述的电路板阻焊双面印刷方法，所述电路板阻焊双面印刷装置包括垫板，所述垫板具有定位孔和多个开口区域，所述多个开口区域形成多个条状或块状支撑位，所述开口区域是将所述垫板对应电路板实际阻焊印刷有效区域的部分掏空得到。A circuit board solder mask double-sided printing device, suitable for the circuit board solder mask double-sided printing method described above, the circuit board solder mask double-sided printing device includes a backing plate, the backing plate has positioning holes and a plurality of The opening area, the plurality of opening areas form a plurality of strip-shaped or block-shaped support positions, and the opening area is obtained by hollowing out the part of the backing plate corresponding to the effective area of the actual solder resist printing of the circuit board.
与现有技术相比较，本发明电路板阻焊双面印刷方法和装置采用垫板并在垫板上对应电路板有效区域掏空形成开口区域，从而在双面印刷时不会影响已经印刷好的一面。另外，由于具有多个支撑位，所述垫板能够提供较好的支撑能力，因此可以支持较软材质的电路板进行双面印刷。Compared with the prior art, the method and device for double-sided printing of circuit board solder resist of the present invention adopts a backing plate and hollows out the corresponding effective area of the circuit board on the backing plate to form an opening area, so that the double-sided printing will not affect the already printed side. In addition, due to having multiple supporting positions, the backing plate can provide better supporting capacity, so it can support the circuit board made of softer material for double-sided printing.
附图说明Description of drawings
为了更清楚地说明本发明实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其它的附图，其中：In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings that need to be used in the description of the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, other drawings can also be obtained based on these drawings without creative work, wherein:
图1是本发明电路板阻焊双面印刷方法的一个较佳实施方式的流程示意图；Fig. 1 is a schematic flow sheet of a preferred embodiment of the solder mask double-sided printing method for circuit boards of the present invention;
图2是本发明电路板阻焊双面印刷装置的较佳实施方式示意图。Fig. 2 is a schematic diagram of a preferred embodiment of a solder mask double-sided printing device for a circuit board according to the present invention.
具体实施方式Detailed ways
下面将对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅是本发明的一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其它实施例，都属于本发明保护的范围。The following will clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
请参阅图1，是本发明电路板阻焊双面印刷方法的一个较佳实施方式的流程示意图。在所述实施方式中，所述电路板阻焊双面印刷方法包括：Please refer to FIG. 1 , which is a flow diagram of a preferred embodiment of the method for double-sided printing of circuit board solder resist according to the present invention. In the embodiment, the double-sided printing method of the circuit board solder mask includes:
步骤S1，提供垫板；其中，所述垫板可以是FR-4基板或金属基板，所述垫板厚度为1mm(毫米)～3mm。所述垫板尺寸比待印刷的电路板尺寸单边大20mm以上。Step S1, providing a backing plate; wherein, the backing plate can be an FR-4 substrate or a metal substrate, and the thickness of the backing plate is 1 mm (millimeter) to 3 mm. The size of the backing board is larger than the size of the circuit board to be printed by more than 20 mm on one side.
步骤S2，在所述垫板上钻定位孔；其中，所述定位孔距离待印刷电路板内有效区域距离不小于5mm。所述定位孔与电路板固定孔对应设置。Step S2, drilling a positioning hole on the backing plate; wherein, the distance between the positioning hole and the effective area in the printed circuit board is not less than 5mm. The positioning holes are set corresponding to the fixing holes of the circuit board.
步骤S3，在所述垫板上设置开口区域；其中，根据待印刷电路板实际阻焊印刷有效区域在所述垫板上对应掏空并形成所述开口区域，且使得所述开口区域的位置和大小和待印刷电路板的阻焊印刷区域的位置和大小相一致。所述开口区域可以通过模具冲压或者数控铣掏空形成。所述垫板在所述开口区域之间形成条状或块状的支撑位，可用于支撑待印刷电路板。Step S3, setting an opening area on the backing plate; wherein, according to the actual solder resist printing effective area of the printed circuit board to be printed, the backing plate is correspondingly hollowed out and the opening area is formed, and the position of the opening area is made And the size is consistent with the position and size of the solder resist printing area of the printed circuit board. The opening area can be hollowed out by die stamping or CNC milling. The backing plate forms strip-like or block-like support positions between the opening areas, which can be used to support the printed circuit board.
步骤S4，固定所述垫板；将所述垫板固定在丝印机床上。Step S4, fixing the backing plate; fixing the backing plate on the screen printing machine.
步骤S5，在所述垫板上设置丝印挂钉；其中，所述丝印挂钉的位置与所述垫板的定位孔一致。Step S5, setting silk screen pegs on the backing plate; wherein, the positions of the silk screen pegs are consistent with the positioning holes of the backing plate.
步骤S6，将待印刷电路板放置在所述垫板上并进行印刷；所述挂钉起到固定和对位作用，电路板的固定孔刚好能够套入所述挂钉。所述电路板印刷完一面后，将印刷好的一面面对所述垫板放置，并对另一面进行印刷。Step S6, placing the printed circuit board to be printed on the backing plate and printing; the pegs play a role of fixing and alignment, and the fixing holes of the circuit board can just fit into the pegs. After one side of the circuit board is printed, the printed side is placed facing the backing plate, and the other side is printed.
上述实施方式中，由于所述垫板被掏空的开口区域对应电路板阻焊印刷有效区域，因此所述垫板不会接触到已经印刷好的一面的电路板有效区域。而且，所述垫板包括多个支撑位，所述垫板和电路板的接触面积较钉床较大，所述垫板的支撑能力也相应增大，因此能够支撑较软材质的电路板，如聚四氟乙烯板或高频板，使较软材质电路板在双面印刷时不会接触丝印机床台面，实现较软材质电路板的双面印刷。In the above embodiment, since the hollowed-out opening area of the backing board corresponds to the effective area of the printed circuit board solder mask, the backing board will not touch the printed effective area of the circuit board. Moreover, the backing plate includes a plurality of supporting positions, the contact area between the backing plate and the circuit board is larger than that of the nail bed, and the supporting capacity of the backing plate is correspondingly increased, so it can support the circuit board made of softer material, Such as polytetrafluoroethylene board or high-frequency board, so that the softer material circuit board will not touch the screen printing machine table during double-sided printing, and realize the double-sided printing of the softer material circuit board.
请参阅图2，是本发明电路板阻焊双面印刷装置的较佳实施方式示意图。所述电路板阻焊双面印刷装置包括垫板10，所述垫板10具有定位孔11和多个开口区域12，所述多个开口区域12形成多个条状或块状支撑位13。所述开口区域12是将所述垫板10对应电路板实际阻焊印刷有效区域的部分掏空得到。Please refer to FIG. 2 , which is a schematic diagram of a preferred embodiment of a double-sided printing device for solder mask of a circuit board according to the present invention. The circuit board solder resist double-sided printing device includes a backing plate 10 , the backing plate 10 has a positioning hole 11 and a plurality of opening areas 12 , and the plurality of opening areas 12 form a plurality of strip-like or block-like supporting positions 13 . The opening area 12 is obtained by hollowing out the part of the backing plate 10 corresponding to the effective area of the actual solder resist printing of the circuit board.
在所述实施方式中，所述垫板10厚度为1mm～3mm。所述垫板尺寸比待印刷的电路板尺寸单边大20mm以上。所述垫板10具有3个定位孔11，所述定位孔11距离电路板距离不小于5mm。所述开口区域12可以通过模具冲压或者数控铣实现。所述开口区域12对应待印刷电路板阻焊印刷的有效单元区域。In the embodiment, the backing plate 10 has a thickness of 1mm˜3mm. The size of the backing board is larger than the size of the circuit board to be printed by more than 20 mm on one side. The backing plate 10 has three positioning holes 11, and the distance between the positioning holes 11 and the circuit board is not less than 5mm. The opening area 12 can be realized by die stamping or CNC milling. The opening area 12 corresponds to an effective unit area to be solder resist printed on the printed circuit board.
与现有技术相比较，本发明电路板阻焊双面印刷方法和装置采用垫板并在垫板上对应电路板有效区域掏空形成开口区域，从而在双面印刷时不会影响已经印刷好的一面。另外，由于具有多个支撑位，所述垫板能够提供较好的支撑能力，因此可以支持较软材质的电路板进行双面印刷。采用本发明电路板阻焊双面印刷方法和装置在印刷完一面后可以直接翻转电路板继续印刷另一面，减少了预烘干操作，简化了操作，节省了制造成本，缩短了产品制作周期。Compared with the prior art, the method and device for double-sided printing of circuit board solder resist of the present invention adopts a backing plate and hollows out the corresponding effective area of the circuit board on the backing plate to form an opening area, so that the double-sided printing will not affect the already printed side. In addition, due to having multiple supporting positions, the backing plate can provide better supporting capacity, so it can support the circuit board made of softer material for double-sided printing. By adopting the method and device for double-sided printing of circuit board solder resist of the present invention, after printing one side, the circuit board can be directly turned over to continue printing the other side, which reduces the pre-drying operation, simplifies operation, saves manufacturing cost, and shortens the product production cycle.
以上所述仅为本发明的实施例，并非因此限制本发明的专利范围，凡是利用本发明说明书内容所作的等效结构或等效流程变换，或直接或间接运用在其它相关的技术领域，均同理包括在本发明的专利保护范围内。The above descriptions are only examples of the present invention, and are not intended to limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made by using the content of the description of the present invention, or directly or indirectly used in other related technical fields, shall be The same reasoning is included in the patent protection scope of the present invention.
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310278431.XACN103373050B (en) | 2013-07-04 | 2013-07-04 | Soldermask double-surfaced printing method and device for circuit board |
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310278431.XACN103373050B (en) | 2013-07-04 | 2013-07-04 | Soldermask double-surfaced printing method and device for circuit board |
| Publication Number | Publication Date |
|---|---|
| CN103373050A CN103373050A (en) | 2013-10-30 |
| CN103373050Btrue CN103373050B (en) | 2015-05-27 |
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310278431.XAExpired - Fee RelatedCN103373050B (en) | 2013-07-04 | 2013-07-04 | Soldermask double-surfaced printing method and device for circuit board |
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| CN (1) | CN103373050B (en) |
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