CN103307476A - Heat transfer substrate self-clamping type LED (light emitting diode) tubular lamp supported by lamp shade - Google Patents

Abstract

The invention discloses a heat transfer substrate self-clamping type LED (light emitting diode) tubular lamp supported by a lamp shade, and a heat radiator of the LED tubular lamp, and belongs to the technical fields of support, suspension or connecting devices of illumination devices. The heat radiator of the LED tubular lamp comprises a heat radiating main body (1) and a heat transfer substrate mounting part (2), wherein the cross section of the heat radiating main body (1) is in a hollow semi-cylinder shape. The heat radiator is characterized in that the heat transfer substrate mounting part (2) is connected with a heat transfer bottom surface (11) and is provided with bar-shaped clamping grooves (21), and the bar-shaped clamping grooves (21) are used for mounting a heat transfer substrate (3). The heat transfer substrate self-clamping type LED tubular lamp supported by the lamp shade has the advantages that as the heat transfer substrate mounting part is provided with the bar-shaped clamping grooves, the heat transfer substrate can be clamped in the bar clamping grooves, and the heat transfer substrate is fixedly arranged on the heat radiator without screws, so the assembling efficiency is high, and the requirement of automatic and quick production is met; the heat transfer substrate is clamped in the bar-shaped clamping grooves and is in contact with multiple surfaces of the bar-shaped clamping grooves, so the heat radiating efficiency is improved, and the heat deformation of the heat transfer substrate is avoided.

Description

The heat transfer substrate that lampshade supports is from clamping the LED spot

Technical field

The invention belongs to support, suspension or the jockey technical field of lighting device, more particularly belong to a kind of the LED spot is carried out the efficient fast device of assembly connection.

Background technology

Be widely used at present LED (light emitting diode) both at home and abroad as the novel energy-conserving light source, in domestic lighting, company's office room and outdoor decoration illumination, used in a large number the LED electricity-saving lamp, LED spot particularly, the LED spot of bar shaped replace the existing common incandescent spot trend that is inevitable.

The LED spot of bar shaped in the prior art comprises fluorescent tube and two end caps that link to each other with fluorescent tube, and end cap also is called lamp holder, and the fluorescent tube of the LED spot of bar shaped is generally fitted together by heat transfer substrate (also can be called light source board), radiator and semi-tubular lampshade.The same length of lampshade, heat transfer substrate and radiator, the cross section of radiator is semi-circular shape, the cross section of heat radiation main body is hollow semi-cylindrical, the outer surface of the semicircle main body of radiator has the fin of zigzag or rectangle, and the fin of these zigzag or rectangle is for increasing area of dissipation and improve radiating efficiency.

The LED luminescence chip is fitted on the heat transfer substrate, and the heat that the LED luminescence chip produces directly passes to heat transfer substrate; Heat transfer substrate has been realized the conversion of heat with heat heat loss through conduction device in the contact process of radiator and air.The heat transfer substrate normal operation aluminum alloy materials of the LED spot of bar shaped in the prior art is made, the heat transfer substrate that uses aluminum alloy materials to make has the advantages such as good heat conduction effect, and the heat transfer substrate of aluminum alloy materials has been widely used in the LED spot of bar shaped now.

Fig. 1 is the fluorescent tube assembling schematic diagram of the LED spot of bar shaped of the present invention, as seen from the figure because the length of the LED spot of bar shaped is generally all long, in order to guarantee that heat transfer substrate effectively contacts with radiator, need to heat transfer substrate be fastened on the bottom surface of radiator by several screws.

The LED spot of the bar shaped of prior art need to be fixed on heat transfer substrate on the radiator by screw in assembling process, and these work are all by manually finishing, so can not satisfy fast production in enormous quantities because operating efficiency is lower; Owing to using when manually finishing this work, need manually at first heat transfer substrate to be contained on the radiator, then tighten screw at corresponding screw hole, the course of work is consuming time very long.

Need to use heat-conducting glue in the assembling process of the LED spot of prior art bar shaped, heat-conducting glue is coated between the bottom surface of heat transfer substrate and radiator, and such assembly work can be used a lot of heat-conducting glue materials usually,

How to simplify the LED spot of bar shaped the technological process of production, reduce its production cost be the restriction the art a difficult problem.

Summary of the invention

The present invention has provided a kind of heat transfer substrate of lampshade support from clamping the LED spot in order to solve above technical problem.

A kind of radiator for the LED spot of the present invention comprises heat radiation main body, heat transfer substrate installation portion, and described heat transfer substrate installation portion links to each other with described heat radiation main body, described heat radiation main body be hollow half arc body; It is characterized in that: described heat transfer substrate installation portion has one the strip-shaped clamp groove that is used for installing heat transfer substrate, and the both sides of described heat transfer substrate installation portion also have two lampshade draw-in grooves that are used for installing lampshade.

According to above-described radiator for the LED spot, preferred: described strip-shaped clamp groove is formed by two T shape snap fits, heat transfer bottom surfaces of described heat transfer substrate installation portion.

According to above-described radiator for the LED spot, preferred: that a boss bottom surface is arranged on the described heat transfer bottom surface.

According to above-described radiator for the LED spot, preferred: two T shape snap fits of described heat transfer substrate installation portion are symmetricly set on the heat transfer bottom surface of described heat transfer substrate installation portion.

According to above-described radiator for the LED spot, preferred: the length of force side is greater than the length of pinching end on the described T shape snap fit.

According to above-described radiator for the LED spot, preferred: the boss bottom surface of described heat transfer substrate installation portion is parallel with the pinching end of two T shape snap fits of heat transfer substrate installation portion.

According to above-described radiator for the LED spot, preferred: the vertical range on the boss bottom surface of described heat transfer substrate installation portion and the heat transfer substrate installation portion between the pinching end of two T shape snap fits is greater than the thickness that is installed in heat transfer substrate in the strip-shaped clamp groove.

According to above-described radiator for the LED spot, preferred: the pinching end of described two T shape snap fits has angle with the boss bottom surface of described heat transfer substrate installation portion respectively.

A kind of heat transfer substrate of the lampshade support of the above radiator that uses of the present invention clamps the LED spot certainly, and described LED spot comprises radiator, heat transfer substrate, lampshade and two end caps; Described heat transfer substrate is installed on the bottom surface of radiator; Described radiator, heat transfer substrate and lampshade form the body of LED spot; Described end cap is installed in respectively the two ends of LED spot; It is characterized in that: described heat transfer substrate relies on described lampshade to be fastened in the strip-shaped clamp groove by the elastic deformation force that described lampshade draw-in groove imposes on two T shape snap fits on the described heat transfer substrate installation portion.

The heat transfer substrate that supports according to above-described lampshade clamps the LED spot certainly, and preferred: the pinching end of two T shapes of the led chip mounting plane of described heat transfer substrate and heat transfer substrate installation portion snap fit clamps and contacts.

The heat transfer substrate that supports according to above-described lampshade is from clamping the LED spot, and is preferred: the heat transfer plane of described heat transfer substrate contacts with boss bottom surface face on the main body bottom surface of dispelling the heat.

The heat transfer substrate that supports according to above-described lampshade clamps the LED spot certainly, and preferred: the width of described strip-shaped clamp groove is greater than the width of heat transfer substrate.

The heat that produces in the LED luminescence chip luminescence process in the LED spot of the present invention conducts heat transfer substrate installation portion to radiator by heat transfer substrate, be heat by boss bottom surface, pinching end on the heat transfer substrate installation portion pass to the heat transfer substrate installation portion, then the heat on the heat transfer substrate installation portion conducts to the heat radiation main body, final heat is dispersed in the air by the extrados of heat radiation main body.Heat radiation main body and heat transfer substrate installation portion have consisted of whole radiator jointly, the contact-making surface of heat transfer substrate and boss bottom surface is maximum, therefore the boss bottom surface is maximum from the heat that heat transfer substrate absorbs, two pinching ends are few from the heat that heat transfer substrate absorbs from the relative boss of the heat bottom surface that heat transfer substrate absorbs.

When LED spot of the present invention is in confined state, two T shape snap fits can rely on the active force that applies thereon from lampshade to produce strain, has the elastic deformation force after two T shape snap fit generation strains, the elastic deformation force of two T shape snap fits can be clamped in heat transfer substrate in the strip-shaped clamp groove of heat transfer substrate installation portion tightly, realized the close contact between the boss bottom surface of heat transfer substrate and heat transfer substrate installation portion, and the close contact between two pinching ends of heat transfer substrate and heat transfer substrate installation portion, can guarantee that like this heat that led chip produces passes through the boss bottom surface from heat transfer substrate, two pinching ends are passed to radiator.The heat transfer substrate of LED spot of the present invention is fastened in the strip-shaped clamp groove of heat transfer substrate installation portion, heat transfer substrate two T shape snap fits to two pinching ends apply under the active force, heat transfer substrate realizes that with the boss bottom surface face contacts completely, can guarantee that like this heat transfer efficiency of L ED spot of the present invention is very high, avoid heat transfer substrate generation thermal deformation.

LED spot of the present invention is owing to being limited by the restriction of fluorescent tube length, the real area of the boss bottom surface of heat transfer substrate installation portion is less than the base area of strip-shaped clamp groove in the heat transfer substrate installation portion, the size that the boss bottom surface need to process can guarantee like this that less than the size of the base area of strip-shaped clamp groove the boss bottom surface that processes has higher flatness and linearity; The heat transfer substrate of LED spot of the present invention equally also has higher flatness and linearity, and heat transfer substrate and boss bottom surface can realization face contact, the boss bottom surface of heat transfer substrate installation portion and heat transfer substrate are in all the time closely that surface contact state is conducive to conduct heat.

The active force that radiator of the present invention relies on lampshade to apply is fixedly clamped heat transfer substrate in the above, and heat transfer substrate utilizes being fixedly clamped of radiator in the cell body of clamping action realization at radiator, and radiating effect is better.The heat transferred heat transfer substrate that the LED luminescence chip produces in the LED spot course of work of the present invention, the heat on the heat transfer substrate can directly conduct to radiator by contact-making surface, and radiator will be transmitted to dissipation of heat on it again in mobile air.The thermal conductive surface of the heat transfer substrate of LED spot of the present invention is fitted on the boss bottom surface of radiator all the time, and the heat dispersion of fluorescent tube is better, and heat transfer substrate can be realized three-dimensional heat radiation, and radiating efficiency is higher.

In the assembling process of heat transfer substrate of the present invention and radiator, can realize the automation assembling of heat transfer substrate and radiator, operating efficiency is very high.The present invention can use automation equipment to carry out the automation assembling, and is high doubly more a lot of than the efficient of Traditional Man mounting means.The present invention also can adopt the manual type assembling, and efficiency of assembling still exceeds doubly a lot than traditional approach.

The structure of fluorescent tube of the present invention is simpler, does not need to use screw that heat transfer substrate is fastened on the radiator in the fluorescent tube assembling process, has so greatly simplified assembly technology, and the suitable dress of fluorescent tube is very good, is conducive to the automation assembling.Efficiently solve heat transfer substrate and radiator in the prior art cause heat transfer substrate in Long contact time thermal deformation problem, can guarantee that heat transfer substrate and radiator are in all the time to contact fully, avoid the generation of heat transfer substrate thermal deformation, more be conducive to heat radiation.Heat transfer substrate of the present invention contacts with radiator all the time, and radiator plays clamping action to heat transfer substrate.

Description of drawings

Accompanyingdrawing 1 is the structural representation of prior art LED spot;

Accompanyingdrawing 2 is the first radiator views one of heat transfer substrate self-clamp type LED spot of the present invention;

Accompanyingdrawing 3 is the first radiator views two of heat transfer substrate self-clamp type LED spot of the present invention;

Accompanyingdrawing 4 is the first radiator stereograms of heat transfer substrate self-clamp type LED spot of the present invention;

Accompanying drawing 5 is structural representations of installing on the first radiator of heat transfer substrate self-clamp type LED spot of the present invention behind the heat transfer substrate;

Accompanying drawing 6 is the first light fixture schematic diagrames of heat transfer substrate self-clamp type LED spot of the present invention;

Accompanying drawing 7 is structural representations of installing on the first radiator of heat transfer substrate self-clamp type LED spot of the present invention behind heat transfer substrate and the lampshade;

The second radiator view one of accompanying drawing 8 heat transfer substrate self-clamp type LED spots of the present invention;

Accompanying drawing 9 is structural representations of installing on the second radiator of heat transfer substrate self-clamp type LED spot of the present invention behind the heat transfer substrate;

Accompanying drawing 10 is structural representations of installing on the second radiator of heat transfer substrate self-clamp type LED spot of the present invention behind heat transfer substrate and the lampshade;

The second radiator view two of accompanyingdrawing 11 heat transfer substrate self-clamp type LED spots of the present invention;

Accompanying drawing 12 is the second radiator stereograms of heat transfer substrate self-clamp type LED spot of the present invention;

Accompanying drawing 13 is lampshade structure schematic diagrames of heat transfer substrate self-clamp type LED spot of the present invention;

Accompanying drawing 14 is lampshade perspective view of heat transfer substrate self-clamp type LED spot of the present invention.

Description of reference numerals:

The 1-main body of dispelling the heat; 2-heat transfer substrate installation portion; The 21-strip-shaped clamp groove;

22-boss bottom surface; The 241-pinching end; 24-T shape snap fit;

The 243-support cylinder; The 242-force side; 27-lampshade draw-in groove;

The 3-heat transfer substrate; 31-LED chip mounting plane; 32-heat transfer end face;

The 4-lampshade; The 41-lampshade is installed projection;

The 5-end cap; 11-heat transfer bottom surface.

The specific embodiment

A kind ofpreferred embodiment 1

Fig. 2 is the first radiator view one of heat transfer substrate self-clamp type LED spot of the present invention; Fig. 3 is the structural representation of installing on the first radiator of heat transfer substrate self-clamp type LED spot of the present invention behind the heat transfer substrate; Fig. 4 is the first radiator view two of heat transfer substrate self-clamp type LED spot of the present invention; Fig. 5 is the first radiator stereogram of heat transfer substrate self-clamp type LED spot of the present invention; Fig. 7 is the structural representation of installing on the first radiator of heat transfer substrate self-clamp type LED spot of the present invention behind heat transfer substrate and the lampshade, and Figure 13 is the lampshade structure schematic diagram of heat transfer substrate self-clamp type LED spot of the present invention; Figure 14 is the lampshade perspective view of heat transfer substrate self-clamp type LED spot of the present invention.

The radiator that the present embodiment provides comprises heat radiationmain body 1 and the heat transfersubstrate installation portion 2 of strip, the heat radiationmain body 1 be arc body or the semicircular cylinder of hollow, heat transfersubstrate installation portion 2 is positioned on the bottom surface of heat radiationmain body 1, and heat transfersubstrate installation portion 2 has for the strip-shaped clamp groove 21 thatheat transfer substrate 3 is installed.The fin of zigzag or rectangle can be set on radiator heat radiationmain body 1 extrados of the present invention for the LED spot, heat transfersubstrate installation portion 2 links to each other with the bottom surface of heat radiationmain body 1, and heat transfersubstrate installation portion 2 has for the strip-shaped clamp groove 21 thatheat transfer substrate 3 is installed.Heat radiationmain body 1 is hollow structure, can alleviate the weight of radiator and can reduce material cost; The area of dissipation that zigzag on the extrados of heat radiationmain body 1 or the fin of rectangle can increase radiator, and can improve the radiating efficiency of radiator.The radiator that heat radiationmain body 1 and heat transfersubstrate installation portion 2 form can adopt aluminum alloy materials to be made, the radiator that adopts aluminum alloy materials to make is compared the radiator that uses Cu alloy material to make and is had lighter weight, and owing to aluminium alloy has good heat conductivility, can guarantee that radiator has higher radiating efficiency.

The strip-shaped clamp groove 21 of radiator heat transfersubstrate installation portion 2 mainly be by the medial surface of thesupport cylinder 243 of thepinching end 241 of two T shape snap fits 24, two Tshape snap fits 24, the heat radiationmain body 1 heattransfer bottom surface 11 form; The strip-shaped clamp groove 21 of radiator heat transfersubstrate installation portion 2 is used for installing heat transfer substrate 2.Strip-shaped clamp groove 21 be rectangular opening rectangle, namely the top of strip-shaped clamp groove 21 is equivalent to have two T shape snap fits 24 on the bottom surface of bottom surface (or heat radiationmain body 1 heat transfer bottom surface 11), strip-shaped clamp groove 21 of strip-shaped clamp groove 21.Heat transfer substrate 3 is installed between thepinching end 241 of the bottom surface of strip-shaped clamp groove 21 and two T shape snap fits 24, and the ledchip mounting plane 31 ofheat transfer substrate 3 contacts with thepinching end 241 of T shape snap fit 24, the heat transfer plane ofheat transfer substrate 3 32 is near the bottom surface of strip-shaped clamp groove 21.There are two side mouths at the two ends of strip-shaped clamp groove 21 in the heat transfersubstrate installation portion 2, and these two side mouths are used for insertingheat transfer substrate 3; The width of strip-shaped clamp groove 21 can be a bit larger tham the width that is installed inheat transfer substrate 3 in the strip-shaped clamp groove 21, to satisfy the morpheme dimensional requirement ofheat transfer substrate 3 assembling in the strip-shaped clamp groove 21.

Can be provided with aboss bottom surface 22 on the heattransfer bottom surface 11 of heat radiationmain body 1,boss bottom surface 22 is along the bar shaped boss on strip-shaped clamp groove 21 length directions.Thepinching end 241 of two Tshape snap fits 24 of heat transfersubstrate installation portion 2 is symmetrical arranged, and theboss bottom surface 22 of heat transfersubstrate installation portion 2 can be parallel with thepinching end 241 of two T shape snap fits 24 of heat transfer substrate installation portion 2.Ifboss bottom surface 22 is parallel withpinching end 241, then the vertical range between thepinching end 241 of two Tshape snap fits 24 can be installed in the strip-shaped clamp groove 21 with assuranceheat transfer substrate 3 greater than the thickness that is installed inheat transfer substrate 3 in the strip-shaped clamp groove 21 on theboss bottom surface 22 of heat transfersubstrate installation portion 2 and the heat transfersubstrate installation portion 2; Afterlampshade 4 is installed together with radiator,lampshade 4 can impose on that two T shape snap fit 24 active forces cause two T shape snap fits 24 that strains occur on the heat transfersubstrate installation portion 2,heat transfer substrate 3 relies on two T shape snap fit 24 elastic acting forces tightly to be fixed in the strip-shaped clamp groove 21.

Boss bottom surface 22 on strip-shaped clamp groove 21 bottom surfaces is used for theheat transfer plane 32 of buttheat transfer substrate 3, behind the interior installationheat transfer substrates 3 of the strip-shaped clamp groove 21 of heat transfersubstrate installation portion 2, two T shape snap fits 24 hold out against the two ends at the ledchip mounting plane 31 ofheat transfer substrate 3, theheat transfer plane 32 ofheat transfer substrate 3 holds out against onboss bottom surface 22, theheat transfer substrates 3 that are installed in the strip-shaped clamp groove 21 are installed in the strip-shaped clamp groove 21 tightly.By applying elasticity denaturation power for two Tshape snap fits 24, the ledchip mounting plane 31 ofheat transfer substrate 3 realizes that with thepinching end 241 of two T shape snap fits 24 face contacts closely, theheat transfer plane 32 ofheat transfer substrate 3 realizes that withboss bottom surface 22 face contacts closely, so that theheat transfer plane 32 ofheat transfer substrate 3 all realizes that with the strip-shaped clamp groove 21 ofheat transfer substrate 3 installation portions face contacts completely with ledchip mounting plane 31.

The led chip of installing on the led chip of the row's of being equipped with shape, the ledchip mounting plane 31 on the ledchip mounting plane 31 ofheat transfer substrate 3 is positioned at the place, axis of ledchip mounting plane 31, and it is maximum that the heat that led chip produces concentrates on the heat flow density at place, axis of midline along ledchip mounting plane 31 length, ledchip mounting plane 31 mostly.When LED spot of the present invention was in running order, the zone of heat flow density maximum contacted directly, can guarantee like this that the heat of led chip generation effectively passes to radiator byheat transfer substrate 3 in bar shapedboss bottom surface 22 and theheat transfer substrate 3.

Vertical range on theboss bottom surface 22 of heat transfersubstrate installation portion 2 and the heat transfersubstrate installation portion 2 between thepinching end 241 of two Tshape snap fits 24 is greater than the thickness that is installed inheat transfer substrate 3 in the strip-shaped clamp groove 21.When installingheat transfer substrate 3 in the strip-shaped clamp groove 21 of heat transfersubstrate installation portion 2, twomount pads 41 oflampshade 4 have and put on two active forces on the Tshape snap fit 24, strain can occur and contact withheat transfer substrate 3 in two T shape snap fits 24 under the effect of twomount pads 41 oflampshade 4,heat transfer substrate 3 is clamped in the strip-shaped clamp groove 21 by two Tshape snap fits 24.

Heat transfer substrate 3 under the acting in conjunction of the active force on two Tshape snap fits 24 andboss bottom surface 22 holding powers,heat transfer substrate 3 will produce micro-elastic distortion towardsboss bottom surface 22 directions with the contacted positions of two Tshape snap fits 24;Heat transfer substrate 3 is after the small strain that produces under the resilient force of two Tshape snap fits 24, theheat transfer plane 32 ofheat transfer substrate 3 can realize contacting fully withboss bottom surface 22, and the ledchip mounting plane 31 ofheat transfer substrate 3 can be realized clamping fully with two Tshape snap fits 24 and contact; After installingheat transfer substrate 3 in the strip-shaped clamp groove 21,heat transfer plane 32 is realized simultaneously clamping with thepinching end 241 of two Tshape snap fits 24 and is contacted withboss bottom surface 22, the ledchip mounting plane 31 of strip-shaped clamp groove 21.

The length offorce side 242 can be greater than the length ofpinching end 241 on the Tshape snap fit 24, thesupport cylinder 243 of Tshape snap fit 24,force side 242 andpinching end 241 are equivalent to a lever, and the length offorce side 242 and pinchingend 241 is equivalent to two arm of forces of lever, the fulcrum that supportcylinder 243 is equivalent to lever.The process thatheat transfer substrate 3 is installed in the strip-shaped clamp groove 21, twomount pads 41 oflampshade 4 apply in theforce side 242 of the T of both sides shape snap fit 24 respectively and after two smaller downward active forces, two Tshape snap fits 24 are subject to active force elastic deformation occur and causeheat transfer substrate 3 to be stuck in the strip-shaped clamp groove 21 by two Tshape snap fits 24.

The process thatheat transfer substrate 3 is installed in the strip-shaped clamp groove 21 is as follows:

The first step is for penetrating into the side mouth ofheat transfer substrate 3 from the strip-shapedclamp groove 21 of heat transfersubstrate installation portion 2 strip-shapedclamp groove 21 by robot apparatus or manual type;

Second step is thatlampshade 4 is inserted in the radiator, two lampshades oflampshade 4 are installedprojection 41 and are packed into behind the lampshade draw-ingroove 27, apply active force on theforce side 242 of two T shape snap fits 24 respectively and (namely apply the active force with themain body 1 bottom surface opposite direction that dispels the heat in theforce side 242 of two T shape snap fits 24, make two T shape snap fits 24 produce distortion), the pinchingend 241 of two T shape snap fits 24 is buckled in respectively on the ledchip mounting plane 31 ofheat transfer substrate 3;

The 3rd step realized withboss bottom surface 22 that complete face contacted, the two ends of the ledchip mounting plane 31 ofheat transfer substrate 3 are realized clamping with the pinchingend 241 of two T shape snap fits 24 respectively and contacted for theheat transfer plane 32 ofheat transfer substrate 3, contacted so that the upper and lower surface ofheat transfer substrate 3 all realizes clamping with strip-shapedclamp groove 21.

Fig. 6 is the light fixture schematic diagram of heat transfer substrate self-clamp type LED spot of the present invention, and the LED spot that the present embodiment provides comprises radiator,heat transfer substrate 3, end cap 5 and lampshade 4.Heat transfer substrate 3 is fastened in the strip-shapedclamp groove 21 of radiator,lampshade 4 is located on theheat transfer substrate 3, end cap 5 is coated on the two ends of the fluorescent tube that is comprised of radiator,heat transfer substrate 3 andlampshade 4, and twomount pads 41 oflampshade 4 can be fastened in the lampshade draw-ingroove 27 of radiator.The strain chucking power that heattransfer substrate 3 relies on twomount pads 41 oflampshade 4 to act on two T shape snap fits 24 on the heat transfersubstrate installation portion 2 is fixed in the strip-shapedclamp groove 21.

Two end caps 5 are installed in the LED spot two ends that are comprised of heat radiationmain body 1, heat transfersubstrate installation portion 2,heat transfer substrate 3 andlampshade 4, and led chip provides dc source to the conducting terminal on two end caps 5 onheat transfer substrate 3 to being installed in series respectively; There is the wire that connects led chip the inside ofheat transfer substrate 3, and the conducting terminal on two end caps 5 links to each other with the conducting terminal ofheat transfer substrate 3 respectively, and the conducting terminal on two end caps 5 is distinguished and linked to each other with dc source again.

The pinchingend 241 of 2 two T shapes of the ledchip mounting plane 31 ofheat transfer substrate 3 and heat transfer substrate installation portion snap fit 24 clamps and contacts.Theheat transfer plane 32 ofheat transfer substrate 3 contacts with 22 of boss bottom surfaces on heat radiationmain body 1 bottom surface.

In the LED spot use procedure of the present embodiment, after the energising of the led chip on theheat transfer substrate 3, the pinchingend 241 of the heat that led chip produces byboss bottom surface 22 and two T shape snap fits 24 passes to the fin on the heat radiationmain body 1, the fin on the heat radiationmain body 1 again with dissipation of heat in air.

The radiator that the present embodiment provides, owing to being provided with strip-shapedclamp groove 21 at heat transfersubstrate installation portion 2,heat transfer substrate 3 can be fastened in the strip-shapedclamp groove 21, no longer need by screwheat transfer substrate 3 to be fixed on the radiator, thereby efficiency of assembling is high, can satisfy the requirement that automation is produced fast, and heattransfer substrate card 3 is located in the strip-shapedclamp groove 21 and contact with a plurality of of strip-shapedclamp groove 21, thereby can improve radiating efficiency, avoidheat transfer substrate 3 that thermal deformation occurs.

The LED light fixture that the present embodiment provides, owing to being provided with strip-shapedclamp groove 21 at heat transfersubstrate installation portion 2,heat transfer substrate 3 can be fastened in the strip-shapedclamp groove 21, no longer need by screwheat transfer substrate 3 to be fixed on the radiator, thereby efficiency of assembling high energy satisfies the requirement that automation is produced fast,heat transfer substrate 3 is fastened in the strip-shapedclamp groove 21 and contact with a plurality of of strip-shapedclamp groove 21, thereby can improve radiating efficiency, avoidsheat transfer substrate 3 that thermal deformations occur.

The heat that comes fromheat transfer substrate 3 can be dispersed into the air by the fin thatmain body 1 extrados that dispels the heat arranges zigzag or rectangle by the heat passing to heat radiationmain body 1 with heat radiationmain body 1 close-connected three faces (boss bottom surface 22, two pinching ends 241), come from heat transfer substrate 3.Because heat radiationmain body 1 and heat transfersubstrate installation portion 2 have consisted of whole radiator jointly,boss bottom surface 22 is maximum from the heat that heattransfer substrate 3 absorbs, two pinching ends 241 are few from the heat that heattransfer substrate 3 absorbs from the relative boss of theheat bottom surface 22 thatheat transfer substrate 3 absorbs.

When heat transfer substrate self-clamp type LED spot of the present invention is in confined state, two T shape snap fits 24 of heat transfersubstrate installation portion 2 can rely on the elastic deformation force of himself thatheat transfer substrate 3 is only stepped up in the strip-shapedclamp groove 21 of heat transfersubstrate installation portion 2, have realized thatheat transfer substrate 3 contacts with theboss bottom surface 22 of heat transfersubstrate installation portion 2, two pinchingend 241 complete faces.

Because theheat transfer substrate 3 of heat transfer substrate self-clamp type LED spot of the present invention is fastened on the strip-shapedclamp groove interior 21 of heat transfersubstrate installation portion 2 and realizes that withboss bottom surface 22 and 241 3 faces of two pinching ends of heat transfersubstrate installation portion 2 clamping contacts, thereby heat transfer substrate self-clamp type LED spot of the present invention can improve heat transfer efficiency, avoidsheat transfer substrate 3 that thermal deformations occur.

The length of heat transfer substrate self-clamp type LED spot of the present invention is generally 1.2 meters, for theboss bottom surface 22 that guarantees heat transfersubstrate installation portion 2 is in close contact all the time withheat transfer substrate 3, the real area of theboss bottom surface 22 of heat transfersubstrate installation portion 2 is less than the bottom surface of the strip-shapedclamp groove 21 of heat transfer substrate installation portion 2.The area ofboss bottom surface 22 is less than the base area of strip-shapedclamp groove 21, can guaranteeboss bottom surface 22 processing effects so thatboss bottom surface 22 obtains higher flatness and linearity.Heat transfer substrate 3 is carried out also can making it have higher flatness and linearity after the fine finishining, the cooperation of high-precisionboss bottom surface 22 and high-precisionheat transfer substrate 3 can guarantee that theboss bottom surface 22 of heat transfersubstrate installation portion 2 is in close contact all the time withheat transfer substrate 3.

A kind ofpreferred embodiment 2

The second radiator view one of Fig. 8 heat transfer substrate self-clamp type of the present invention LED spot; Fig. 9 is the structural representation of installing on the second radiator of heat transfer substrate self-clamp type LED spot of the present invention behind the heat transfer substrate; Figure 10 is the structural representation of installing on the second radiator of heat transfer substrate self-clamp type LED spot of the present invention behind heat transfer substrate and the lampshade; The second radiator view two of Figure 11 heat transfer substrate self-clamp type of the present invention LED spot; Figure 12 is the second radiator stereogram of heat transfer substrate self-clamp type LED spot of the present invention, and Figure 13 is the lampshade structure schematic diagram of heat transfer substrate self-clamp type LED spot of the present invention; Figure 14 is the lampshade perspective view of heat transfer substrate self-clamp type LED spot of the present invention.

The radiator that the present embodiment provides comprises heat radiationmain body 1 and the heat transfersubstrate installation portion 2 of bar shaped, the cross section of heat radiationmain body 1 is the arc radiating surface, heat transfersubstrate installation portion 2 is positioned on the bottom surface of heat radiationmain body 1, and heat transfersubstrate installation portion 2 has for the strip-shapedclamp groove 21 thatheat transfer substrate 3 is installed.Radiator for the LED spot of the present invention, comprise heat radiationmain body 1, heat transfersubstrate installation portion 2, the cross section of heat radiationmain body 1 is similar hollow semi-cylindrical, the extrados of heat radiationmain body 1 is smooth arcwall face, heat transfersubstrate installation portion 2 links to each other with the bottom surface of heat radiationmain body 1, and heat transfersubstrate installation portion 2 has for the strip-shapedclamp groove 21 thatheat transfer substrate 3 is installed.Heat radiationmain body 1 is hollow structure, can alleviate the weight of radiator and can reduce material usage; The arcwall face of the extrados Smooth of heat radiationmain body 1 can increasing heat radiation area and has been improved radiating efficiency.

The radiator that is comprised of heat radiationmain body 1 and heat transfersubstrate installation portion 2 can adopt aluminum alloy materials to be made, the radiator that adopts aluminum alloy materials to make can alleviate the weight of himself, and can improve radiating efficiency in the radiator course of work simultaneously because aluminium alloy has good heat conductivility.

Strip-shaped clamp groove 21 in the heat transfer substrate installation portion 2 is that the bottom surface by the support cylinder 243 of the pinching end 241 of two T shape snap fits 24, two T shape snap fits 24, heat radiation main body 1 forms, and the strip-shaped clamp groove of radiator heat transfer substrate installation portion 2 21 is used for installation heat transfer substrate 2.The cross section of strip-shaped clamp groove 21 can be the opening elongated rectangular shape, and namely the non-peristome of strip-shaped clamp groove 21 is equivalent to have two T shape snap fits 24 on the bottom surface of bottom surface, strip-shaped clamp groove 21 of strip-shaped clamp groove 21.Heat transfer substrate 3 is installed between the pinching end 241 of the bottom surface of strip-shaped clamp groove 21 and two T shape snap fits 24, and the led chip mounting plane 31 of heat transfer substrate 3 contacts with the pinching end 241 of T shape snap fit 24, the heat transfer plane of heat transfer substrate 3 32 is near the bottom surface of strip-shaped clamp groove 21; The width of strip-shaped clamp groove 21 is greater than the width that is installed in heat transfer substrate 3 in the strip-shaped clamp groove 21, satisfies the morpheme dimensional requirement of heat transfer substrate 3 assembling in the strip-shaped clamp groove 21.

Oneboss bottom surface 22 can be arranged on the bottom surface of strip-shapedclamp groove 21, andboss bottom surface 22 is along the bar shaped boss on strip-shapedclamp groove 21 length directions.The pinchingend 241 of two T shape snap fits 24 of heat transfersubstrate installation portion 2 is symmetrical arranged, and theboss bottom surface 22 of heat transfersubstrate installation portion 2 is parallel with the pinchingend 241 of two T shape snap fits 24 of heat transfersubstrate installation portion 2.

Lampshade 4 after being inserted in the strip-shaped clamp groove 21, is installed heat transfer substrate 3, the lampshade installation projection 41 of lampshade 4 is applied elasticity sex change power for two T shape snap fits 24 and makes two T shape snap fits, 24 generation strains, the led chip mounting plane 31 of heat transfer substrate 3 is realized contacting closely with the pinching end 241 of two T shape snap fits 24, the heat transfer plane 32 of heat transfer substrate 3 realizes that with boss bottom surface 22 face contacts closely, so that the heat transfer plane 32 of heat transfer substrate 3 all realizes contacting completely with the strip-shaped clamp groove 21 of heat transfer substrate 3 installation portions with led chip mounting plane 31.Boss bottom surface 22 on strip-shaped clamp groove 21 bottom surfaces is used for the heat transfer plane 32 of butt heat transfer substrate 3, behind the interior installation heat transfer substrates 3 of the strip-shaped clamp groove 21 of heat transfer substrate installation portion 2, two T shape snap fits 24 hold out against the two ends at the led chip mounting plane 31 of heat transfer substrate 3, the heat transfer plane 32 of heat transfer substrate 3 holds out against on boss bottom surface 22, heat transfer substrate 3 is installed in the strip-shaped clamp groove 21 tightly.

The led chip of installing on the ledchip mounting plane 31 ofheat transfer substrate 3 is positioned at the place, axis of ledchip mounting plane 31, and the heat that led chip produces concentrates on along the midline of ledchip mounting plane 31 length, herein heat flow density maximum mostly.When radiator was in running order, the zone of heat flow density maximum contacted directly, can guarantee like this that the heat of led chip generation effectively passes to radiator byheat transfer substrate 3 in bar shapedboss bottom surface 22 and theheat transfer substrate 3.

Vertical range on theboss bottom surface 22 of heat transfersubstrate installation portion 2 and the heat transfersubstrate installation portion 2 between the pinchingend 241 of two T shape snap fits 24 can be greater than the thickness that is installed inheat transfer substrate 3 in the strip-shapedclamp groove 21, and the pinchingend 241 ofboss bottom surface 22 and two T shape snap fits 24 is in parastate or near parastate simultaneously; Can guarantee like this volume of strip-shapedclamp groove 21 greater than the volume ofheat transfer substrate 3,heat transfer substrate 3 can be from the side mouth of the strip-shapedclamp groove 21 heat transfersubstrate installation portion 2 of packing into.

The pinchingend 241 of T shape snap fit 24 also can have an angle with theboss bottom surface 22 of heat transfersubstrate installation portion 2, angle between pinchingend 241 and theboss bottom surface 22 is very little, protect the volume of positive strip-shapedclamp groove 21 greater than the volume ofheat transfer substrate 3,heat transfer substrate 3 can be from the side mouth of the strip-shapedclamp groove 21 heat transfersubstrate installation portion 2 of packing into.

After in the strip-shapedclamp groove 21 of heat transfersubstrate installation portion 2heat transfer substrate 3 being installed, under the acting in conjunction of two T shape snap fit 24 pressure andboss bottom surface 22 holding powers,heat transfer substrate 3 will small strain occur producing towardsboss bottom surface 22 directions with two T shape snap fits, 24 contacted end positions places;Heat transfer substrate 3 is after the small strain that produces under two T shape snap fit 24 pressure-actings, theheat transfer plane 32 ofheat transfer substrate 3 can realize that withboss bottom surface 22 complete face contacts, and the ledchip mounting plane 31 ofheat transfer substrate 3 can be realized clamping with the pinchingend 241 of two T shape snap fits 24 and contact; Strip-shapedclamp groove 21 installsheat transfer substrate 3, andheat transfer plane 32 is realized simultaneously clamping with the pinchingend 241 of two T shape snap fits 24 with strip-shapedclamp groove 21 boss bottom surfaces 22, ledchip mounting plane 31 and contacted.

The length offorce side 242 can be greater than the length of pinchingend 241 on the T shape snap fit 24, thesupport cylinder 243 of T shape snap fit 24,force side 242 and pinchingend 241 are equivalent to a lever, and the length offorce side 242 and pinchingend 241 is equivalent to two arm of forces of lever, the fulcrum that supportcylinder 243 is equivalent to lever.The process that heattransfer substrate 3 is installed in the strip-shapedclamp groove 21 applies respectively two smaller upwards active forces, can cause two T shape snap fits 24 that small elastic deformation occurs causing the real space of strip-shapedclamp groove 21 to increase to holdheat transfer substrate 3 on theforce side 242 of the T of both sides shapesnap fit 24.

The process that heattransfer substrate 3 is installed in the strip-shapedclamp groove 21 is as follows:

The first step is for penetrating into the side mouth ofheat transfer substrate 3 from the strip-shapedclamp groove 21 of heat transfersubstrate installation portion 2 strip-shapedclamp groove 21 by robot apparatus or manual type;

Second step is thatlampshade 4 is inserted in the radiator, twomount pads 41 oflampshade 4 apply active force on theforce side 242 of two T shape snap fits 24 respectively and (namely apply the active force with themain body 1 bottom surface opposite direction that dispels the heat in theforce side 242 of two T shape snap fits 24, make two T shape snap fits 24 produce distortion), two T shape snap fits 24 are buckled on the ledchip mounting plane 31 ofheat transfer substrate 3;

The 3rd step contacted so that the upper and lower surface ofheat transfer substrate 3 all realizes clamping with strip-shapedclamp groove 21 for theheat transfer plane 32 ofheat transfer substrate 3 contacts withboss bottom surface 22 realization faces, the two ends of the ledchip mounting plane 31 ofheat transfer substrate 3 are realized clamping with the pinchingend 241 of two T shape snap fits 24 respectively and contacted.

The LED light fixture that the present embodiment provides comprises radiator,heat transfer substrate 3, end cap 5 and lampshade 4.Heat transfer substrate 3 is fastened in the strip-shapedclamp groove 21 of radiator, andlampshade 4 is located on theheat transfer substrate 3, and end cap 5 is coated on the two ends of the fluorescent tube that is comprised ofradiator 2,heat transfer substrate 3 andlampshade 4, andlampshade 4 can be fastened on theradiator 2 two ends draw-in grooves.

The heat transfer substrate that lampshade of the present invention supports comprises heat radiationmain body 1, heat transfersubstrate installation portion 2,heat transfer substrate 3,lampshade 4 and end cap 5 from clamping the LED spot; Two end caps 5 are installed in the lamp tube ends that is comprised of heat radiationmain body 1, heat transfersubstrate installation portion 2,heat transfer substrate 3 andlampshade 4;Heat transfer substrate 3 relies on the elastic deformation force of 2 two T shapes of heat transfer substrate installation portion snap fit 24 to be fixed in the strip-shapedclamp groove 21.

241 of the pinching ends of 2 two T shapes of the ledchip mounting plane 31 ofheat transfer substrate 3 and heat transfer substrate installation portion snap fit 24 contact.Theheat transfer plane 32 ofheat transfer substrate 3 contacts with 22 of boss bottom surfaces on heat radiationmain body 1 bottom surface.

In actual applications, after the energising of the led chip on theheat transfer substrate 3, the pinchingend 241 of the heat that led chip produces byboss bottom surface 22 and two T shape snap fits 24 passes to the fin on the heat radiationmain body 1, the fin on the heat radiationmain body 1 again with dissipation of heat in air.

The radiator that the present embodiment provides, owing to being provided with strip-shapedclamp groove 21 at heat transfersubstrate installation portion 2,heat transfer substrate 3 can be fastened in the strip-shapedclamp groove 21, no longer need by screwheat transfer substrate 3 to be fixed on the radiator, thereby efficiency of assembling is high, can satisfy the requirement that automation is produced fast, and heattransfer substrate card 3 is located in the strip-shapedclamp groove 21 and contact with a plurality of of strip-shapedclamp groove 21, thereby can improve radiating efficiency, avoidheat transfer substrate 3 that thermal deformation occurs.

The LED light fixture that the present embodiment provides is similar to the technical scheme in thepreferred embodiment 1, owing to being provided with strip-shapedclamp groove 21 at heat transfersubstrate installation portion 2,heat transfer substrate 3 can be fastened in the strip-shapedclamp groove 21, no longer need by screwheat transfer substrate 3 to be fixed on the radiator, thereby efficiency of assembling high energy satisfies the requirement that automation is produced fast,heat transfer substrate 3 is fastened in the strip-shapedclamp groove 21 and contact with a plurality of of strip-shapedclamp groove 21, thereby can improve radiating efficiency, avoidheat transfer substrate 3 that thermal deformation occurs.

The lamp body of heat transfer substrate self-clamp type LED spot of the present invention conducts heat, and the heat of adopting fromheat transfer substrate 3 can be dispersed into the air by the fin thatmain body 1 extrados that dispels the heat arranges zigzag or rectangle by the heat passing to heat radiationmain body 1 with heat radiationmain body 1 close-connected three faces (boss bottom surface 22, two pinching ends 241), come from heat transfer substrate 3.Because heat radiationmain body 1 and heat transfersubstrate installation portion 2 have consisted of whole radiator jointly,boss bottom surface 22 is maximum from the heat that heattransfer substrate 3 absorbs, two pinching ends 241 are few from the heat that heattransfer substrate 3 absorbs from the relative boss of theheat bottom surface 22 thatheat transfer substrate 3 absorbs.

When heat transfer substrate self-clamp type LED spot of the present invention is in confined state, two T shape snap fits 24 of heat transfersubstrate installation portion 2 can rely on the elastic deformation force of himself thatheat transfer substrate 3 is stepped up tightly in the strip-shapedclamp groove 21 of heat transfersubstrate installation portion 2, have realized thatheat transfer substrate 3 contacts with theboss bottom surface 22 of heat transfersubstrate installation portion 2, two pinchingend 241 complete faces.

Because theheat transfer substrate 3 of heat transfer substrate self-clamp type LED spot of the present invention is fastened on the strip-shapedclamp groove interior 21 of heat transfersubstrate installation portion 2 and realizes that with 241 3 faces inboss bottom surface 22 and two pinching ends of heat transfersubstrate installation portion 2 face contacts completely, thereby heat transfer substrate self-clamp type LED spot of the present invention can improve heat transfer efficiency, avoidsheat transfer substrate 3 that thermal deformations occur.

The length of heat transfer substrate self-clamp type LED spot of the present invention is generally 1.2 meters, for theboss bottom surface 22 that guarantees heat transfersubstrate installation portion 2 is in close contact all the time withheat transfer substrate 3, the real area of theboss bottom surface 22 of heat transfersubstrate installation portion 2 is less than the bottom surface of the strip-shapedclamp groove 21 of heat transfer substrate installation portion 2.The area ofboss bottom surface 22 is less than the base area of strip-shapedclamp groove 21, can guaranteeboss bottom surface 22 processing effects so thatboss bottom surface 22 obtains higher flatness and linearity.Heat transfer substrate 3 is carried out also can making it have higher flatness and linearity after the fine finishining, the cooperation of high-precisionboss bottom surface 22 and high-precisionheat transfer substrate 3 can guarantee that theboss bottom surface 22 of heat transfersubstrate installation portion 2 is in close contact all the time withheat transfer substrate 3.

Claims (12)

1. radiator that is used for the LED spot, comprise heat radiation main body (1), heat transfer substrate installation portion (2), described heat transfer substrate installation portion (2) links to each other with described heat radiation main body (1), described heat radiation main body (1) be hollow half arc body; It is characterized in that: described heat transfer substrate installation portion (2) has one the strip-shaped clamp groove (21) that is used for installing heat transfer substrate (3), and the both sides of described heat transfer substrate installation portion (2) also have two lampshade draw-in grooves (27) that are used for installing lampshade (4).

2. the radiator for the LED spot according to claim 1, it is characterized in that: described strip-shaped clamp groove (21) is formed by two T shape snap fits (24) of described heat transfer substrate installation portion (2), the heat transfer bottom surface (11) of described heat transfer substrate installation portion (2).

3. the radiator for the LED spot according to claim 1 is characterized in that: a boss bottom surface (22) is arranged on the described heat transfer bottom surface (11).

4. the radiator for the LED spot according to claim 1, it is characterized in that: two T shape snap fits (24) of described heat transfer substrate installation portion (2) are symmetricly set on the heat transfer bottom surface (11) of described heat transfer substrate installation portion (2).

5. described radiator for the LED spot according to claim 1-4 is characterized in that: the length of the upper force side (242) of described T shape snap fit (24) is greater than the length of pinching end (241).

6. described radiator for the LED spot according to claim 1-4, it is characterized in that: the boss bottom surface (22) of described heat transfer substrate installation portion (2) is parallel with the pinching end (241) of two T shape snap fits (24) of heat transfer substrate installation portion (2).

7. the radiator for the LED spot according to claim 6 is characterized in that: the vertical range between the boss bottom surface (22) of described heat transfer substrate installation portion (2) and the pinching end (241) of upper two the T shape snap fits of heat transfer substrate installation portion (2) (24) is greater than the thickness that is installed in heat transfer substrate (3) in the strip-shaped clamp groove (21).

8. described radiator for the LED spot according to claim 1-4 is characterized in that: the pinching end (241) of described two T shape snap fits (24) has angle with the boss bottom surface (22) of described heat transfer substrate installation portion (2) respectively.

9. a right to use requires the heat transfer substrate of the lampshade support of the described radiator of 1-8 certainly to clamp the LED spot, and described LED spot comprises radiator, heat transfer substrate (3), lampshade (4) and two end caps (5); Described heat transfer substrate (3) is installed on the bottom surface of radiator; Described radiator, heat transfer substrate (3) and lampshade (4) form the body of LED spot; Described end cap (5) is installed in respectively the two ends of LED spot; It is characterized in that: described heat transfer substrate (3) relies on described lampshade (4) to be fastened in the strip-shaped clamp groove (21) by the elastic deformation force that described lampshade draw-in groove (27) imposes on upper two the T shape snap fits of described heat transfer substrate installation portion (2) (24).

10. the heat transfer substrate of lampshade support according to claim 9 is characterized in that from clamping the LED spot: the led chip mounting plane (31) of described heat transfer substrate (3) clamps with the pinching end (241) of (2) two T shape snap fits of heat transfer substrate installation portion (24) and contacts.

11. the heat transfer substrate that lampshade according to claim 9 supports is characterized in that from clamping the LED spot: the heat transfer plane (32) of described heat transfer substrate (3) contacts with boss bottom surface (22) face on main body (1) bottom surface of dispelling the heat.

12. the heat transfer substrate that lampshade according to claim 9 supports is from clamping the LED spot, it is characterized in that: the width of described strip-shaped clamp groove (21) is greater than the width of heat transfer substrate (3).

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