技术领域technical field
本发明涉及电子技术领域，尤其涉及一种印刷电路板及其制作方法。The invention relates to the field of electronic technology, in particular to a printed circuit board and a manufacturing method thereof.
背景技术Background technique
印刷电路板上的过孔是实现印刷电路板的不同内层之间的导通。在印刷电路板的常规设计中，所述印刷电路板的上下表层均设有孔盘，以将所述内层与上下表层电连接。当用户对印刷电路板有特殊要求时，如用户要求印刷电路板的内层与上下表层之间不进行电连接时，则需要去除孔盘。业界普遍采用机械背钻的方式去除孔盘。所谓机械背钻，则是采用一种具备控深能力的特殊钻孔设备，在需要去除孔盘的位置，根据预设深度进行钻孔，从而实现去除孔盘。但是，在去除印刷电路板上的孔盘的同时，背钻孔周边基材也被钻掉。这就要求背钻孔在设计布局时需提前预留背钻空间，因此导致印刷电路板的布局密度降低及制作成本上升。The via hole on the printed circuit board is to realize the conduction between different inner layers of the printed circuit board. In a conventional design of a printed circuit board, the upper and lower surface layers of the printed circuit board are provided with hole plates to electrically connect the inner layer with the upper and lower surface layers. When the user has special requirements for the printed circuit board, such as the user requires no electrical connection between the inner layer of the printed circuit board and the upper and lower surface layers, the hole plate needs to be removed. The industry generally adopts mechanical back drilling to remove the orifice plate. The so-called mechanical back drilling is to use a special drilling equipment with depth control ability to drill holes according to the preset depth at the position where the hole plate needs to be removed, so as to realize the removal of the hole plate. However, at the same time as the hole pad is removed from the printed circuit board, the surrounding substrate of the backdrilled hole is also drilled. This requires that the back-drilling space should be reserved in advance when designing the layout of the back-drilling holes, which leads to a decrease in the layout density of the printed circuit board and an increase in the manufacturing cost.
发明内容Contents of the invention
本发明实施例所要解决的技术问题在于，提供一种印刷电路板及其制作方法，在满足用户对印刷电路板的特殊要求的同时提高印刷电路板的布局密度。The technical problem to be solved by the embodiments of the present invention is to provide a printed circuit board and a manufacturing method thereof, which can increase the layout density of the printed circuit board while meeting the special requirements of users for the printed circuit board.
为了解决上述技术问题，本发明提供了一种印刷电路板的制作方法，包括：In order to solve the above technical problems, the invention provides a method for manufacturing a printed circuit board, comprising:
提供覆铜基板，其中，所述覆铜基板包括依次叠覆设置的若干内层、贯穿所述内层的过孔及镀在所述内层顶面的第一铜覆层，其中，所述过孔内具有铜壁；A copper-clad substrate is provided, wherein the copper-clad substrate includes several inner layers stacked in sequence, via holes penetrating through the inner layers, and a first copper cladding layer plated on the top surface of the inner layers, wherein the There is a copper wall in the via hole;
在所述第一铜覆层上覆压感光膜；laminating a photosensitive film on the first copper cladding layer;
在所述感光膜上设置底片形成预备印刷电路板，其中，所述底片包括第一不透光部分，所述过孔对应所述第一不透光部分；A negative is provided on the photosensitive film to form a preliminary printed circuit board, wherein the negative includes a first opaque portion, and the via hole corresponds to the first opaque portion;
对所述预备印刷电路板进行曝光显影、图形电镀及去除感光膜从而形成半成印刷电路板；Exposing and developing the prepared printed circuit board, patterning electroplating and removing the photosensitive film to form a semi-finished printed circuit board;
对所述半成印刷电路板进行化学蚀刻使得所述铜壁的第一端部与所述内层顶面之间具有预设距离；chemically etching the semi-finished printed circuit board such that there is a predetermined distance between the first end of the copper wall and the top surface of the inner layer;
对化学蚀刻后的半成印刷电路板进行保护处理，从而形成成品印刷电路板，其中，所述成品印刷电路板包括层叠设置的若干内层及设置于内层顶面上的第一表层，所述第一表层形成有通槽，所述通槽与所述过孔连通，以阻断所述过孔的铜壁与所述第一表层的电连接。Protecting the semi-finished printed circuit board after chemical etching to form a finished printed circuit board, wherein the finished printed circuit board includes a plurality of inner layers stacked and a first surface layer arranged on the top surface of the inner layer, so A through groove is formed on the first surface layer, and the through groove communicates with the via hole so as to block the electrical connection between the copper wall of the via hole and the first surface layer.
本发明还提供一种印刷电路板，包括依次叠覆设置的若干内层、设置于所述内层顶面上的第一表层、贯穿所述内层的过孔，其中，所述过孔内具有铜壁，其中，所述第一表层形成有第一通槽，所述第一通槽对应所述过孔，并与所述过孔连通，所述铜壁的第一端部与所述内层顶面具有第一预设距离，从而阻断所述过孔的铜壁与所述第一表层的电连接。The present invention also provides a printed circuit board, comprising several inner layers stacked in sequence, a first surface layer arranged on the top surface of the inner layers, and a via hole penetrating the inner layer, wherein the via hole It has a copper wall, wherein the first surface layer is formed with a first through groove, the first through groove corresponds to the via hole and communicates with the via hole, the first end of the copper wall is connected to the The top surface of the inner layer has a first preset distance, so as to block the electrical connection between the copper wall of the via hole and the first surface layer.
实施本发明实施例，具有如下有益效果：Implementing the embodiment of the present invention has the following beneficial effects:
实施本发明的实施例，在所述印刷电路板的制作方法采用底片的第一不透光部分对应所述过孔。并通过化学蚀刻的方式使得所述铜壁的第一端部与所述内层顶面之间具有预设距离，同时，采用上述的制作方法制作的成品印刷电路板的第一表层形成有通槽。所述通槽与所述过孔连通，从而阻断所述过孔的铜壁与所述第一表层的电连接，而无需通过机械背钻的方式来去除现有印刷电路板中的孔盘来满足用户对印刷电路板的特殊要求，进而提高了印刷电路板的布局密度并降低了制作成本。In an embodiment of the present invention, in the manufacturing method of the printed circuit board, the first opaque portion of the negative is used to correspond to the via hole. And by means of chemical etching, there is a preset distance between the first end of the copper wall and the top surface of the inner layer. groove. The through groove communicates with the via hole, thereby blocking the electrical connection between the copper wall of the via hole and the first surface layer, without removing the hole plate in the existing printed circuit board by means of mechanical back drilling To meet the special requirements of users for printed circuit boards, thereby improving the layout density of printed circuit boards and reducing production costs.
附图说明Description of drawings
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings that need to be used in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description are only These are some embodiments of the present invention. Those skilled in the art can also obtain other drawings based on these drawings without creative work.
图1是本发明较佳实施方式提供的一种印刷电路板的制作方法的流程图；Fig. 1 is a flow chart of a method for manufacturing a printed circuit board provided in a preferred embodiment of the present invention;
图2是本发明第一较佳实施方式提供的一种印刷电路板的部分纵截面示意图；Fig. 2 is a partial longitudinal sectional view of a printed circuit board provided in the first preferred embodiment of the present invention;
图3是本发明第二较佳实施方式提供的一种印刷电路板的部分纵截面示意图；Fig. 3 is a partial longitudinal sectional view of a printed circuit board provided in a second preferred embodiment of the present invention;
图4是图3中的印刷电路板的第一通孔与过孔的投影图；Fig. 4 is a projection view of the first through hole and the via hole of the printed circuit board in Fig. 3;
图5是本发明第三较佳实施方式提供的一种印刷电路板的纵截面示意图；Fig. 5 is a schematic longitudinal sectional view of a printed circuit board provided in a third preferred embodiment of the present invention;
图6是本发明第四较佳实施方式提供的一种印刷电路板的纵截面示意图；Fig. 6 is a schematic longitudinal sectional view of a printed circuit board provided in a fourth preferred embodiment of the present invention;
图7是图6中的印刷电路板的第二通孔与过孔的投影图。FIG. 7 is a projected view of the second through hole and the via hole of the printed circuit board in FIG. 6 .
具体实施方式detailed description
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.
请参见图1，本发明较佳实施方式提供的一种印刷电路板的制作方法的流程图；该方法可以包括以下步骤：Please refer to Fig. 1, the flow chart of a kind of manufacturing method of printed circuit board that the preferred embodiment of the present invention provides; The method may comprise the following steps:
步骤101、提供覆铜基板，其中，所述覆铜基板包括依次叠覆设置的若干内层、贯穿所述内层的过孔及镀在所述内层顶面的第一铜覆层，其中，所述过孔内具有铜壁。Step 101, providing a copper-clad substrate, wherein the copper-clad substrate includes several inner layers stacked in sequence, via holes penetrating through the inner layers, and a first copper cladding layer plated on the top surface of the inner layers, wherein , the via hole has a copper wall.
其中，所述铜壁的第一端部与所述第一铜覆层在同一水平面上。Wherein, the first end of the copper wall is on the same level as the first copper coating.
步骤102、在所述第一铜覆层上覆压感光膜。Step 102 , laminating a photosensitive film on the first copper cladding layer.
其中，所述感光膜是在紫外光线照射下会发生结构变化的一层有机薄膜。Wherein, the photosensitive film is an organic thin film whose structure changes under the irradiation of ultraviolet light.
步骤103、在所述感光膜上设置底片形成预备印刷电路板，其中，所述底片包括第一不透光部分，所述过孔对应所述第一不透光部分。Step 103 , setting a negative on the photosensitive film to form a preparatory printed circuit board, wherein the negative includes a first opaque portion, and the via hole corresponds to the first opaque portion.
其中，图形转移是利用没有被紫外线照射的感光膜溶于弱碱，而被紫外线照射后的感光膜不溶于部分强酸强碱的特性。Among them, the pattern transfer is based on the property that the photosensitive film that is not irradiated by ultraviolet rays is soluble in weak alkali, but the photosensitive film that is irradiated by ultraviolet rays is insoluble in some strong acids and strong alkalis.
在本实施方式中，所述过孔的横截面为圆形，所述第一不透光部分为圆形。所述过孔的横截面的圆心与所述第一不透光部分的圆心重叠。In this implementation manner, the via hole has a circular cross section, and the first opaque portion is circular. A circle center of a cross section of the via hole overlaps with a circle center of the first opaque portion.
进一步地，所述底片还可以包括第一透光部分，所述第一透光部分与所述第一不透光部分相邻接，并包围所述第一不透光部分。所述第一透光部分呈圆环状。所述第一透光部分的圆心与所述过孔的横截面的圆心重叠。Further, the negative sheet may further include a first light-transmitting portion, and the first light-transmitting portion is adjacent to the first light-impermeable portion and surrounds the first light-impermeable portion. The first transparent part is in the shape of a ring. A center of a circle of the first transparent portion overlaps with a center of a cross section of the via hole.
在其他实施方式中，所述过孔的横截面、所述第一不透光部分及所述第一透光部分的形状可以根据实际需要进行改变。所述过孔的横截面的圆心与所述第一不透光部分的圆心可以不重叠。所述过孔的横截面的圆心与所述第一透光部分的圆心可以不重叠。In other implementation manners, the cross-section of the via hole, the shapes of the first opaque portion and the first transparent portion may be changed according to actual needs. A center of a cross section of the via hole may not overlap with a center of a circle of the first opaque portion. The center of the cross-section of the via hole may not overlap with the center of the first transparent portion.
步骤104、对所述预备印刷电路板进行曝光显影、图形电镀及去除感光膜从而形成半成印刷电路板。Step 104 , performing exposure and development, pattern plating, and removal of the photosensitive film on the preliminary printed circuit board to form a semi-finished printed circuit board.
其中，将曝光后的预备印刷电路板溶于弱碱溶液（如碳酸钠溶液）中，对应所述第一不透光部分的感光膜被溶解，即与所述过孔对应的感光膜被溶解。对应所述底片的第一透光部分的感光膜不被溶解。图形电镀是对所述第一铜覆层上对应被溶解的感光膜的位置进行电镀，从而提高所述第一铜覆层的通流能力，并在铜表面上镀锡，从而对铜表面起到保护作用。去除感光膜是将镀有铜及锡的预备印刷电路板溶于强碱溶液（如氢氧化钠溶液）中，则对应所述第一不透光部分的感光膜被溶解，从而形成半成印刷电路板。Wherein, the pre-exposed printed circuit board is dissolved in a weak alkali solution (such as sodium carbonate solution), and the photosensitive film corresponding to the first opaque part is dissolved, that is, the photosensitive film corresponding to the via hole is dissolved. . The photosensitive film corresponding to the first light-transmitting portion of the negative is not dissolved. Pattern electroplating is to electroplate the position corresponding to the dissolved photosensitive film on the first copper coating, thereby improving the flow capacity of the first copper coating, and plating tin on the copper surface, thereby protecting the copper surface. to the protective effect. Removing the photosensitive film is to dissolve the preparatory printed circuit board coated with copper and tin in a strong alkali solution (such as sodium hydroxide solution), and then the photosensitive film corresponding to the first opaque part is dissolved, thereby forming a semi-finished printed circuit board. circuit board.
步骤105、对所述半成印刷电路板进行化学蚀刻使得所述铜壁的第一端部与所述内层顶面之间具有预设距离。Step 105 , performing chemical etching on the semi-finished printed circuit board so that there is a preset distance between the first end of the copper wall and the top surface of the inner layer.
步骤106，对化学蚀刻后的半成印刷电路板退锡并进行铜面保护处理，从而形成成品印刷电路板。其中，所述成品印刷电路板包括层叠设置的若干内层及设置于内层顶面上的第一表层，所述第一表层形成有通槽。所述通槽与所述过孔连通，以阻断所述过孔的铜壁与所述第一表层的电连接。Step 106 , removing tin from the chemically etched semi-finished printed circuit board and performing copper surface protection treatment, thereby forming a finished printed circuit board. Wherein, the finished printed circuit board includes a plurality of inner layers stacked and a first surface layer arranged on the top surface of the inner layers, and the first surface layer is formed with through grooves. The through groove communicates with the via hole, so as to block the electrical connection between the copper wall of the via hole and the first surface layer.
具体地，所述通槽沿第一方向的投影为第一投影，所述过孔沿所述第一方向的投影为第二投影，其中，所述第二投影与所述第一投影重叠或在所述第一投影范围内。所述第一方向为垂直于所述成品印刷电路板。所述保护处理包括对化学蚀刻后的半成印刷电路板进行退锡、绿油及表面处理的保护工序。Specifically, the projection of the through groove along the first direction is a first projection, and the projection of the via hole along the first direction is a second projection, wherein the second projection overlaps with the first projection or within the first projection range. The first direction is perpendicular to the finished printed circuit board. The protection treatment includes the protection procedures of tin stripping, green oiling and surface treatment on the chemically etched semi-finished printed circuit board.
在本实施方式中，利用所述印刷电路板的制作方法可以形成所述成品印刷电路板。在所述成品印刷电路板中，所述铜壁的第一端部与所述内层顶面之间具有预设距离，且所述成品印刷电路板的第一表层形成有通槽。同时，所述通槽与所述过孔连通，从而阻断所述过孔的铜壁与所述第一表层的电连接，而无需通过机械背钻的方式来去除现有印刷电路板中的孔盘来满足用户对印刷电路板的特殊要求（即使所述过孔不与所述第一表层电连接），进而提高了印刷电路板的布局密度并降低了制作成本。In this embodiment, the finished printed circuit board can be formed by using the method for manufacturing the printed circuit board. In the finished printed circuit board, there is a predetermined distance between the first end of the copper wall and the top surface of the inner layer, and a through groove is formed on the first surface of the finished printed circuit board. At the same time, the through groove communicates with the via hole, thereby blocking the electrical connection between the copper wall of the via hole and the first surface layer, without removing the copper in the existing printed circuit board through mechanical back drilling. The hole plate is used to meet the user's special requirements on the printed circuit board (even if the via hole is not electrically connected to the first surface layer), thereby increasing the layout density of the printed circuit board and reducing the manufacturing cost.
请参考图2，为本发明较佳实施例提供的一种印刷电路板100。所述印刷电路板100包括依次叠覆设置的若干内层10、设置于所述内层顶面上的第一表层20及贯穿所述内层20的过孔30。其中，所述过孔30内具有铜壁40。所述第一表层20形成有第一通槽21。所述第一通槽21对应所述过孔30，并与所述过孔30连通。所述铜壁40的第一端部41与所述内层10的顶面11具有第一预设距离I1，从而阻断所述过孔30的铜壁40与所述第一表层20的电连接。Please refer to FIG. 2 , which shows a printed circuit board 100 provided by a preferred embodiment of the present invention. The printed circuit board 100 includes a plurality of inner layers 10 stacked in sequence, a first surface layer 20 disposed on the top surface of the inner layers, and a via hole 30 penetrating through the inner layers 20 . Wherein, the via hole 30 has a copper wall 40 inside. The first surface layer 20 is formed with a first through groove 21 . The first through groove 21 corresponds to the via hole 30 and communicates with the via hole 30 . The first end 41 of the copper wall 40 has a first predetermined distance I1 from the top surface 11 of the inner layer 10 , thereby blocking the electrical connection between the copper wall 40 of the via hole 30 and the first surface layer 20 . connect.
具体地，所述第一通槽21沿第一方向的投影为第一投影。所述过孔30沿所述第一方向的投影为第二投影。其中，所述第二投影与所述第一投影重叠。所述第一方向垂直于所述印刷电路板100。Specifically, the projection of the first through groove 21 along the first direction is the first projection. A projection of the via hole 30 along the first direction is a second projection. Wherein, the second projection overlaps with the first projection. The first direction is perpendicular to the printed circuit board 100 .
请继续参考图3及图4，本发明第二较佳实施方式提供一种印刷电路板200。所述第二较佳实施方式提供的印刷电路板200与第一较佳实施方式提供的印刷电路板100相似，其区别在于：在第二较佳实施方式中，所述第一通槽210沿第一方向的投影为第三投影D3。所述过孔30沿所述第一方向的投影为第二投影D2。所述第二投影D2在所述第三投影D3范围内。Please continue to refer to FIG. 3 and FIG. 4 , the second preferred embodiment of the present invention provides a printed circuit board 200 . The printed circuit board 200 provided by the second preferred embodiment is similar to the printed circuit board 100 provided by the first preferred embodiment, the difference is that in the second preferred embodiment, the first through groove 210 is along the The projection in the first direction is the third projection D3. The projection of the via hole 30 along the first direction is a second projection D2. The second projection D2 is within the range of the third projection D3.
请继续参考图5，本发明第三较佳实施方式提供一种印刷电路板300。所述第三较佳实施方式提供的印刷电路板300与第二较佳实施方式提供的印刷电路板200相似，其区别在于：在第三较佳实施方式中，所述印刷电路板300还可以包括第二表层310。所述第二表层310设置于所述内层10的底面12上。所述第二表层310形成有第二通槽320。所述第二通槽320对应所述过孔30，并与所述过孔30连通。所述铜壁40的第二端部42与所述内层10的底面12具有第二预设距离I2，从而阻断所述过孔30的铜壁40与所述第二表层310的电连接。Please continue to refer to FIG. 5 , the third preferred embodiment of the present invention provides a printed circuit board 300 . The printed circuit board 300 provided by the third preferred embodiment is similar to the printed circuit board 200 provided by the second preferred embodiment, the difference is that in the third preferred embodiment, the printed circuit board 300 can also be A second surface layer 310 is included. The second surface layer 310 is disposed on the bottom surface 12 of the inner layer 10 . The second surface layer 310 is formed with a second through groove 320 . The second through groove 320 corresponds to the via hole 30 and communicates with the via hole 30 . The second end 42 of the copper wall 40 has a second predetermined distance I2 from the bottom surface 12 of the inner layer 10 , thereby blocking the electrical connection between the copper wall 40 of the via hole 30 and the second surface layer 310 .
具体地，所述第二通槽320沿第一方向的投影为第四投影。所述第二投影与所述第四投影重叠。Specifically, the projection of the second through groove 320 along the first direction is the fourth projection. The second projection overlaps with the fourth projection.
请继续参考图6及图7，本发明第四较佳实施方式提供一种印刷电路板400。所述第四较佳实施方式提供的印刷电路板400与第三较佳实施方式提供的印刷电路板100相似，其区别在于：在第四较佳实施方式中，所述第二通槽410沿第一方向的投影为第五投影D5。所述第二投影D2在所述第五投影D5范围内。Please continue to refer to FIG. 6 and FIG. 7 , the fourth preferred embodiment of the present invention provides a printed circuit board 400 . The printed circuit board 400 provided by the fourth preferred embodiment is similar to the printed circuit board 100 provided by the third preferred embodiment, the difference is that in the fourth preferred embodiment, the second through groove 410 is along the The projection in the first direction is the fifth projection D5. Said second projection D2 is within said fifth projection D5.
在上述较佳实施方式中，所述第一及第二通槽21及320为呈圆形。所述过孔30的横截面为圆形。所述第一及第二通槽21及320的圆心与所述过孔30的横截面的圆心重叠。In the above preferred implementation manner, the first and second through grooves 21 and 320 are circular. The cross section of the via hole 30 is circular. The circle centers of the first and second through grooves 21 and 320 overlap with the circle centers of the cross-section of the via hole 30 .
在本发明中，所述第一表层20形成有第一通槽21。所述第一通槽21对应所述过孔30，并与所述过孔30连通。所述铜壁40的第一端部41与所述内层10的顶面11具有第一预设距离I1，从而阻断所述过孔30的铜壁40与所述第一表层20的电连接，而无需通过机械背钻的方式来去除现有印刷电路板中的孔盘来满足用户对印刷电路板的特殊要求，进而提高了印刷电路板100-400的布局密度并降低了制作成本。In the present invention, the first surface layer 20 is formed with a first through groove 21 . The first through groove 21 corresponds to the via hole 30 and communicates with the via hole 30 . The first end 41 of the copper wall 40 has a first predetermined distance I1 from the top surface 11 of the inner layer 10 , thereby blocking the electrical connection between the copper wall 40 of the via hole 30 and the first surface layer 20 . connection without removing the hole plate in the existing printed circuit board through mechanical back drilling to meet the special requirements of the user for the printed circuit board, thereby improving the layout density of the printed circuit board 100-400 and reducing the manufacturing cost.
以上所揭露的仅为本发明一种较佳实施例而已，当然不能以此来限定本发明之权利范围，本领域普通技术人员可以理解实现上述实施例的全部或部分流程，并依本发明权利要求所作的等同变化，仍属于发明所涵盖的范围。What is disclosed above is only a preferred embodiment of the present invention, and of course it cannot limit the scope of rights of the present invention. Those of ordinary skill in the art can understand all or part of the process of realizing the above embodiments, and according to the rights of the present invention The equivalent changes required still belong to the scope covered by the invention.
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310196561.9ACN103298251B (en) | 2013-05-23 | 2013-05-23 | A kind of printed circuit board (PCB) and preparation method thereof |
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310196561.9ACN103298251B (en) | 2013-05-23 | 2013-05-23 | A kind of printed circuit board (PCB) and preparation method thereof |
| Publication Number | Publication Date |
|---|---|
| CN103298251A CN103298251A (en) | 2013-09-11 |
| CN103298251Btrue CN103298251B (en) | 2016-05-25 |
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310196561.9AActiveCN103298251B (en) | 2013-05-23 | 2013-05-23 | A kind of printed circuit board (PCB) and preparation method thereof |
| Country | Link |
|---|---|
| CN (1) | CN103298251B (en) |
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| CN103442530A (en)* | 2013-09-18 | 2013-12-11 | 胜华电子（惠阳）有限公司 | Manufacturing method for PCB unilateral annular ring |
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| CN102548243A (en)* | 2010-12-08 | 2012-07-04 | 北大方正集团有限公司 | Method and system for manufacturing bumps on circuit boards and circuit board utilizing same |
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| CN1329812A (en)* | 1998-12-02 | 2002-01-02 | 泰拉丁公司 | Printed circuit board and method for fabricating such board |
| US7337537B1 (en)* | 2003-09-22 | 2008-03-04 | Alcatel Lucent | Method for forming a back-drilled plated through hole in a printed circuit board and the resulting printed circuit board |
| CN1852633A (en)* | 2005-11-21 | 2006-10-25 | 华为技术有限公司 | Printed circuit board capable of realizing high-speed signal transmission and making method |
| CN101442884A (en)* | 2007-11-22 | 2009-05-27 | 比亚迪股份有限公司 | Method for processing on-state hole of multilayer printed circuit board |
| CN102835196A (en)* | 2010-03-31 | 2012-12-19 | 弗莱克斯电子有限责任公司 | Improved backdrilling of multilayer printed circuit boards |
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| CN103298251A (en) | 2013-09-11 |
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| TR01 | Transfer of patent right | Effective date of registration:20211221 Address after:450046 Floor 9, building 1, Zhengshang Boya Plaza, Longzihu wisdom Island, Zhengdong New Area, Zhengzhou City, Henan Province Patentee after:xFusion Digital Technologies Co., Ltd. Address before:518129 Bantian HUAWEI headquarters office building, Longgang District, Guangdong, Shenzhen Patentee before:HUAWEI TECHNOLOGIES Co.,Ltd. | |
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