CN103249278A - Heat dissipation device - Google Patents

Abstract

The invention discloses a heat dissipation device, which can be used for cooling an electronic component inside an electronic product. The heat dissipating device comprises a base jointed with the electronic component and a plurality of heat dissipation hairs which are arranged on the base and can swing together with the micro air flow inside the electronic product. According to the invention, the heat dissipation hairs can swing together with the micro air flow inside the electronic product to reinforce the convection heat dissipation ability, so that the heat emitted by the electronic component can be dissipated to the interior of the electronic product quickly, and is further transmitted to the casing of the electronic product, and accordingly, the temperature inside the electronic product is reduced.

Description

Heat abstractor

Technical field

The present invention relates to a kind of heat abstractor, particularly the heat abstractor that heat-generating electronic elements is dispelled the heat.

Background technology

Along with the trend of various consumer electronic product towards the Portable development, electronic product has lot of challenges such as weight is lighter, volume is littler, function is more various.With a electronic product, as panel computer, under the prerequisite that adopts the same circuits design, functional more strong, its internal heat generation amount is more high, gives people's temperature sensation then more poor.For this reason, industry uses the heat-generating electronic elements in graphite flake, sheet metal heat conducting elements such as (copper/aluminium foils) and the panel computer to be sticked usually, and the spread heat that heat-generating electronic elements is produced is in panel computer and then be passed to shell to reduce the temperature of heat-generating electronic elements.Yet when no fan existed in electronic product, the heat conduction velocity of heat conducting element in closed system was lower, thereby influenced distributing of heat-generating electronic elements heat.And because the heat-generating electronic elements height in the same electronic product differs, heat conducting element such as graphite flake, sheet metal belongs to hard material, flexibility is poor, does not fit into simultaneously the heat-generating electronic elements heat radiation to differing heights usually, and then makes the versatility of heat conducting element not good.

Summary of the invention

In view of this, be necessary to provide a kind of can be simultaneously to the heat abstractor of the electronic element radiating of differing heights in light, the thin electronic installation.

A kind of heat abstractor is used for the electronic element radiating to electronic product inside, and described heat abstractor comprises a base that is sticked with electronic component and is arranged on the base, can sends out with some heat radiations of little air-flow swing of electronic product inside.

Among the present invention, the heat loss through convection ability that can swing to increase self with little air-flow of electronic product inside is sent out in heat radiation, thereby the heat that electronic component is distributed is dispersed into electronic product inside fast, and then conducts on the housing of electronic product, thereby reduces the electronic product temperature inside.

Description of drawings

Fig. 1 is the three-dimensional combination figure of the heat abstractor of first embodiment of the invention, and wherein heat abstractor is positioned at the circuit board top.

Fig. 2 is the use view after heat abstractor shown in Figure 1 is attached at circuit board.

Fig. 3 is the three-dimensional combination figure of the heat abstractor of second embodiment of the invention.

The main element symbol description

Heat abstractor	1
		Base	10
Heat radiation is sent out	30、30a
		Circuit board
	50
		Electronic component	51

Following embodiment will further specify the present invention in conjunction with above-mentioned accompanying drawing.

Embodiment

See also Fig. 1 and Fig. 2, some heat radiations thatheat abstractor 1 of the present invention comprises abase 10 and is arranged atbase 10 middle parts send out 30.

Thisbase 10 is made by the good material of heat conductivility, is discoid thin slice, thus be used forcircuit board 50 onelectronic component 51 directly be sticked and absorb the heat thatelectronic component 51 distributes.In the present embodiment, thisbase 10 is made by flexible material, theelectronic component 51 of differing heights that can be sticked simultaneously, thus increased the versatility of heat abstractor 1.Be appreciated that ground, in other embodiments,base 10 also can be arranged to required shape, is not limited to the concrete form that present embodiment is showed.

Heat radiation sends out 30 can be fixed onbase 10 middle parts by vapour deposition, welding or mode such as bonding.Each heat radiation is sent out 30 and is made by the good material of heat dispersion, and is that an end is fixed on the flexible strip on the base 10.30 end spaces that are fixed onbase 10 are sent out in adjacent two heat radiations.30 thickness is sent out in each heat radiation, and to be no more than 0.2 millimeter and weight very light, in light, the slim electronic product inside that no fan arranges, after it absorbs the heat ofbase 10, can be along with arbitrarily swing because of the air-flow of the faint variation ofelectronic component 51 heatings electronic product inside, increase the heat loss through convection ability of self, thereby the heat that heat-generatingelectronic elements 51 is distributed is dispersed into electronic product inside fast, and then conducts on the housing of electronic product, thereby reduces the electronic product temperature inside.

See also Fig. 3, the heat abstractor 1a that present embodiment is showed and the difference of first embodiment form of sending out 30a that is to dispel the heat is different.In the present embodiment, it is ultra-thin flexible lamellar body that 30a is sent out in heat radiation, and the one end is fixed on thebase 10.

Be appreciated that ground, heat radiation sends out 30 can be other any required shapes, as long as its weight surface area enough light, that contact with air is enough big, in the process with little air-flow swing, can get final product by quick heat radiating.

Claims (7)

1. heat abstractor is used for the electronic element radiating to electronic product inside, it is characterized in that: described heat abstractor comprises a base that is sticked with electronic component and is arranged on the base, can sends out with some heat radiations of little air-flow swing of electronic product inside.

2. heat abstractor as claimed in claim 1 is characterized in that: described base is the flexible bottom of the electronic component of the differing heights that can be sticked simultaneously.

3. heat abstractor as claimed in claim 1, it is characterized in that: the thickness that described heat radiation is sent out is no more than 0.2 millimeter.

4. heat abstractor as claimed in claim 1, it is characterized in that: described heat radiation is sent out by the good material of heat dispersion and is made.

5. heat abstractor as claimed in claim 1 is characterized in that: described heat radiation is sent out by vapour deposition, welding or bonding mode and is fixed on the base middle part.

6. heat abstractor as claimed in claim 1 is characterized in that: it is that an end is fixed on the flexible strip on the base that each heat radiation is sent out.

7. heat abstractor as claimed in claim 1 is characterized in that: it is one section flexible lamellar body that is fixed on the base that each heat radiation is sent out.

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