CN103246913A - Method for producing integrated circuit (IC) smart card - Google Patents

Abstract

The invention discloses a method for producing an integrated circuit (IC) smart card. According to the IC smart card produced by the method, a height difference between the surface of an IC module and a card body is the thickness of a first surface layer material, and in addition, the first surface layer materials of the same type is low in thickness deviation, so that the sunken depth of the IC module is controllable and slight in deviation. The problem of height inconsistency of the IC module in the card body is solved, and the problem of incapability of ensuring that the surface of the IC module is lower than that of the card body in batch production is solved.

Description

A kind of method of producing the IC smart card

Technical field

The present invention relates to areas of information technology, relate in particular to a kind of method of the IC of production smart card.

Background technology

At present, the production method of production contact IC smart card and two interface I C smart cards has two kinds, and a kind of is the groove milling method, and a kind of is laminating.

The groove milling method is at first good with IC intelligent card matrix lamination, mill out the IC module slot at the card primary surface with slotter then, the back side being posted the IC module of hot melt adhesive film puts into wherein, then by hot pressing, the hot melt adhesive film at the IC module back side is melted, IC module and card base is bonded together, finally obtains contact IC smart card or two interface I C smart card.Wherein two interface I C modules are before putting into, the pad on the IC module also should with card matrix material on metal antenna weld together.

Laminating is at first to block on some layer materials of base at composition, all goes out IC module hole, and is stapled one by one in order then, and with in the IC module embedded hole, carries out lamination again and dash card, obtains contact IC smart card or two interface I C smart card at last.Wherein two interface I C modules are before lamination, also should with card matrix material on metal antenna weld together.

The cup depth control of IC module in smart card is denounced by the people always.How keeping the cup depth unanimity of IC module in smart card aborning, is a problem that is difficult to solution, sees Fig. 7.The IC modular structure of a depression, can avoid the IC module since in consumer's hand by repeated friction, and the surface contact that causes is impaired or stain, and the contact is impaired or stain the phenomenon of bringing loose contact when using; And can prolong the life-span of IC smart card.

The groove milling method is by milling out the IC module slot at the card base, then the IC module being embedded method wherein.But owing to two reasons cause the cup depth of IC module wayward, the one, because the precision of slotter does not reach requirement, the 2nd, the temperature and pressure of each hot pressing is all out of contior very accurate, cause the variable thickness after the hot melt adhesive film hot pressing at the module back side, finally cause the depression deviation of IC module very big.

Laminating is to have the first surface layer in IC module hole to be enclosed within on the IC module with dashing, and surface layer and IC module keep a height, carry out lamination then.Like this, though can make the surface of the IC module height same with the maintenance of card primary surface, and can guarantee the consistance of the two difference in height in the high volume production process, can not satisfy the low requirement of IC module surface ratio card primary surface.

Summary of the invention

At the problems referred to above, order of the present invention is the inconsistent problem of IC module cup depth that has now in the IC smart card in order to solve, and can adjust this cup depth very easily.

To achieve these goals, technical scheme of the present invention is as follows:

A kind of method of producing the IC smart card is characterized in that, may further comprise the steps,

A, go out the protection hole in positive printed layers, be used for being enclosed within the top of T type IC module;

B, go out IC module protection glue hole at IC module protection layer, be used for entangling T type IC module bottom protection glue;

C, positive printed layers, IC module protection layer, back up layer and second surface layer material is stapled in order, protect hole, IC module protection glue hole to constitute IC module hole this moment; Then T type IC module is inserted in the IC module hole and also fixed, keep T type IC module surface equal with positive printed layers surface;

D, first surface layer material are according to the size of T type IC module front surface, go out the pierced pattern corresponding with IC module hole, this pierced pattern comprises not the cladding material part of fracture fully, described cladding material part only keeps some tie points, and the cladding material part is connected by the remainder of this tie point with the first surface layer material;

E, the first surface layer material is covered the card primary surface, and make pierced pattern corresponding with the IC module;

F, carry out hot pressing and dash card then, obtain individual IC smart card;

G, with pierced pattern not fully the tie point of the cladding material part of fracture block; The cladding material of the pierced pattern that T type IC module top is residual is partly removed, and forms hollow hole, thereby exposes the front surface of T type IC module.

In steps A, positive printed layers can be superimposed together for two-layer or some layer materials, and is identical with the thickness of the first half of IC module with the degree of depth that guarantees the protection hole.

In step B, IC module protection layer is the IC module protection layer of being made up of some layer materials, its thickness and IC module bottom protection glue consistency of thickness.

In the present invention, if the IC module be two interface module, then before step e, also need the pad on the IC module is electrically connected with antenna on blocking base.

In the present invention, pierced pattern comprise the hollow out gap of interruption and by the hollow out gap around the cladding material part that defines; The physical dimension in this hollow out gap is more than or equal to the IC module size, and inner dimensions is less than the size of IC module.

In the present invention, the tie point method for cutting of described pierced pattern cladding material part can be that laser ablation, milling cutter mill disconnected or the cutting knife cutting.

IC module of the present invention surface is the thickness of first surface layer material with the difference in height of card surface, simultaneously because the thickness deviation of the first surface layer material of same model is very little, so the cup depth of IC module be controlled, deviation is very little.

The cup depth of IC module can be adjusted by the thickness of first surface layer material, and the first surface layer material of different-thickness can be produced the different IC smart card of IC module cup depth.

The invention solves the height inconsistent problem of IC module in the card body, solved in the batch process, can not guarantee that the IC module is than the low problem in card surface.

Characteristics of the present invention can be consulted the detailed description of the graphic and following better embodiment of this case and be obtained to be well understood to.

Description of drawings

Fig. 1 punches out synoptic diagram behind the hollow hole for first surface layer material in the example of the present invention;

Fig. 2 is the synoptic diagram of pierced pattern in the example of the present invention;

Fig. 3 is each layer bookbinding sequential schematic in the example of the present invention;

Fig. 4 is individual embodiment in the example of the present invention, and the first surface layer does not cut the synoptic diagram of openwork part as yet;

Fig. 5 is individual embodiment in the example of the present invention, the synoptic diagram behind the cutting of first surface layer and rejecting openwork part;

Fig. 6 is IC module position section (not cutting as yet and the openwork part of draining) synoptic diagram in the example of the present invention.

Fig. 7 is example IC module position section of the present invention (having cut and the openwork part of draining) synoptic diagram.

The number in the figure explanation:

10. firstsurface layer material 11. secondsurface layer materials 12. positive printed layers 13.ICmodule protection layer 14. back uplayer 20. piercedpattern 21.tie points 22. hollow out gaps 23. cladding material parts, 24. hollow out gap outward flanges, 25. hollow out gap inward flange 30.IC modules, 40.card bases 50. are protected 51. IC module protection glue holes, hole

Embodiment

For technological means, creation characteristic that the present invention is realized, reach purpose and effect is easy to understand, further set forth the present invention below in conjunction with specific embodiment.

Referring to Fig. 7, a kind of IC smart card comprisescard base 40, Ttype IC module 30 and firstsurface layer material 10,card base 40 is provided with IC module hole, and the IC module size is corresponding with this IC module hole, and after the IC module was arranged in the IC module hole,IC module surface 10 was equal with the card primary surface.The first surface layer material is covered on the card primary surface, and the first surface layer material is provided with the hollow hole corresponding with the IC module.The thickness of first surface layer material is not more than 0.15mm.The cup depth of IC module can be adjusted by the thickness of first surface layer material, and the first surface layer material of different-thickness can be produced the different IC smart card of IC module cup depth.

In the present embodiment, the card base comprises positive printedlayers 12, ICmodule protection layer 13, back uplayer 14, secondsurface layer material 11.

Referring to Fig. 1-6, the production method of this IC smart card may further comprise the steps:

Step 1: go out the protection hole in positive printedlayers 12, be used for being enclosed within the top of IC module (T shape), and the consistency of thickness on the thickness of positive printed layers and IC module top.

Step 2: go out IC module protection glue hole at ICmodule protection layer 13, be used for entangling IC module bottom protection glue; The thickness of IC module protection layer and IC module bottom protection glue consistency of thickness.

Step 3: on firstsurface layer material 10, according to the size of IC module, go out the pierced pattern corresponding withhollow hole 20, as shown in Figure 1.The first surface layer material is selected the transparent PVC film of 0.05mm thickness.Pierced pattern comprise the hollow outgap 22 of interruption and by the hollow out gap around the cladding material part 23 that defines; 23 of cladding material parts keep sometie points 21, and the cladding material part is connected by the remainder of this tie point with the first surface layer material.The size of hollow out gap outwardflange 24 is more than or equal to the IC module size, and the size of hollow out gap outwardflange 25 is less than the size of IC module.

Step 4: positive printedlayers 12, ICmodule protection layer 13, back uplayer 14 and secondsurface layer material 11 is stapled in order, the IC module is inserted in the IC module hole, and preliminary fixing.Keep T type IC module surface equal with positive printed layers surface.If the IC module is two interface module, then also need the pad on theIC module 30, be electrically connected with antenna on the ICmodule protection layer 13.

Step 5: the first surface layer material is covered the card primary surface, make that pierced pattern andIC module 30 can be corresponding one by one, as shown in Figure 4.

Step 6: stapled material is put into laminating machine heating pressurization, and the big card matrix material of opening that obtains dashes card again, obtains individual IC smart card.

Step 7: by etching laser machining (also can adopt milling cutter to mill disconnected or the cutting knife cutting), the pierced pattern claddingmaterial tie point 21 partly of first surface layer material is blown; And the use vacuum withdraw device, the pierced pattern cladding material part 23 that IC module top is residual is removed, and forms hollow hole, thereby exposes the IC module.

So far, contact IC smart card or the production of two interface I C smart card finish.

Certainly, the card base also can be the good monoblock type card base of hot pressing, process IC module hole at this card base, and the IC module is fixed in IC module hole, the IC module is inserted in the IC module hole then, and preliminary fixing, the first surface layer material that processes is covered the surface of positive printed layers, and make pierced pattern corresponding with the IC module; And then carry out hot pressing, obtain individual IC smart card; The cladding material that does not rupture the fully tie point partly of pierced pattern is blocked; The cladding material of the pierced pattern that IC module top is residual is partly removed, and forms hollow hole, thereby exposes the IC module.

In the present invention, IC module surface is the thickness of first surface layer material with the difference in height of card surface, be a fixed value comparatively speaking, when producing the IC smart card of same model, because the thickness deviation of the first surface layer material of same model is very little, thus the cup depth of IC module be controlled, deviation is very little.

More than show and described ultimate principle of the present invention, principal character and advantage of the present invention.The technician of the industry should understand; the present invention is not restricted to the described embodiments; what describe in above-described embodiment and the instructions is principle of the present invention; the present invention also has various changes and modifications without departing from the spirit and scope of the present invention, and these changes and improvements all fall in the claimed scope of the present invention.The protection domain that the present invention requires is defined by appending claims and equivalent thereof.

Claims (6)

1. a method of producing the IC smart card is characterized in that, may further comprise the steps,

A, go out the protection hole in positive printed layers, be used for being enclosed within the top of T type IC module;

B, go out IC module protection glue hole at IC module protection layer, be used for entangling T type IC module bottom protection glue;

C, positive printed layers, IC module protection layer, back up layer and second surface layer material is stapled in order, protect hole, IC module protection glue hole to constitute IC module hole this moment; Then T type IC module is inserted in the IC module hole and also fixed, keep T type IC module surface equal with positive printed layers surface;

D, first surface layer material are according to the size of T type IC module front surface, go out the pierced pattern corresponding with IC module hole, this pierced pattern comprises not the cladding material part of fracture fully, described cladding material part only keeps some tie points, and the cladding material part is connected by the remainder of this tie point with the first surface layer material;

E, the first surface layer material is covered the card primary surface, and make pierced pattern corresponding with the IC module;

F, carry out hot pressing and dash card then, obtain individual IC smart card;

G, with pierced pattern not fully the tie point of the cladding material part of fracture block; The cladding material of the pierced pattern that T type IC module top is residual is partly removed, and forms hollow hole, thereby exposes the front surface of T type IC module.

2. the method for production according to claim 1 IC smart card is characterized in that, if the IC module be two interface module, then before step e, also needs the pad on the IC module is electrically connected with antenna on blocking base.

3. the method for production according to claim 1 IC smart card is characterized in that, pierced pattern comprise the hollow out gap of interruption and by the hollow out gap around the cladding material part that defines; The physical dimension in this hollow out gap is more than or equal to the IC module size, and inner dimensions is less than the size of IC module.

4. the method for production IC smart card according to claim 1 is characterized in that, the tie point method for cutting of described pierced pattern cladding material part can be that laser ablation, milling cutter mill disconnected or the cutting knife cutting.

5. the method for production IC smart card according to claim 1 is characterized in that in steps A, positive printed layers can be superimposed together for two-layer or some layer materials, and is identical with the thickness of the first half of IC module with the degree of depth that guarantees the protection hole.

6. the method for production IC smart card according to claim 1 is characterized in that in step B, IC module protection layer is the IC module protection layer of being made up of some layer materials, its thickness and IC module bottom protection glue consistency of thickness.

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