技术领域technical field
本发明涉及一种发光装置。The invention relates to a light emitting device.
背景技术Background technique
近年来，高亮度、高功率的发光元件及小型发光装置被开发并应用于各种领域。这些发光装置凭借小型、低耗电、重量轻等特点，被利用于例如手机、液晶背光光源、各种仪表的光源、各种读取传感器等，为了进一步实现小型化和高亮度进行了各种尝试(如专利文献1、专利文献2等)。In recent years, high-brightness, high-power light-emitting elements and small light-emitting devices have been developed and used in various fields. Due to their small size, low power consumption, and light weight, these light-emitting devices are used in mobile phones, LCD backlights, light sources for various instruments, and various reading sensors. Try (such as Patent Document 1, Patent Document 2, etc.).
作为各种尝试的一个例子，提出了如下一种方案：例如，作为应用于引线框架的金属部件采用由银或银合金制成的金属部件，作为应用于引线接合的引线采用由银或银合金制成的引线，由此进一步抑制对来自发光元件的光的吸收，从而有效地反射光并取出光。As an example of various attempts, a proposal has been made in which, for example, a metal member made of silver or a silver alloy is used as a metal member applied to a lead frame, and a metal member made of silver or a silver alloy is used as a lead wire applied to a wire bonding. The fabricated lead thereby further suppresses the absorption of light from the light-emitting element, thereby effectively reflecting light and extracting light.
另外，为了防止这些银或银合金的硫化，对用于密封发光元件的树脂和封装体材料提出有各种方案(如专利文献3、专利文献4等)。In addition, in order to prevent the vulcanization of these silver or silver alloys, various proposals have been made for resins and package materials for sealing light-emitting elements (eg, Patent Document 3, Patent Document 4, etc.).
专利文献1：(日本)特开2011-249807号公报Patent Document 1: (Japanese) Unexamined Patent Publication No. 2011-249807
专利文献2：(日本)特开2008-153610号公报Patent Document 2: (Japanese) Unexamined Patent Publication No. 2008-153610
专利文献3：(日本)特开2011-256326号公报Patent Document 3: (Japanese) Unexamined Patent Publication No. 2011-256326
专利文献4：(日本)特开2011-178983号公报Patent Document 4: (Japanese) Unexamined Patent Publication No. 2011-178983
然而，一般情况下，如果将银或银合金用作引线框架及引线等的材料，则这些部件会发生硫化，伴随着硫化会引起对来自发光元件的光的吸收，结果出现阻碍光的有效反射的问题。However, in general, if silver or silver alloy is used as a material for lead frames, leads, etc., these parts will be vulcanized, and the vulcanization will cause absorption of light from the light-emitting element, resulting in the prevention of effective reflection of light The problem.
而且，现状是，即使使用组成为可以显著抑制银的硫化的树脂，气体和液体也能通过树脂和树脂或者树脂和引线框架等的极小的空隙侵入，由此硫化开始并扩大，结果不能有效地抑制硫化。Moreover, the current situation is that even if a resin whose composition can significantly suppress the vulcanization of silver is used, gas and liquid can invade through extremely small gaps such as resin and resin or resin and lead frame, thereby vulcanization starts and expands, and as a result, it cannot be effectively to inhibit vulcanization.
发明内容Contents of the invention
本发明是为解决上述课题提出的，其目的在于提供一种发光装置，该发光装置采用了不仅实现小型化和薄型化，而且能够有效地防止在发光装置中的树脂和树脂，树脂和引线框架、引线等之间产生空隙的结构，由此阻止了用于发光装置的含银的金属部件的硫化，并且与该结构相辅相成，更有效地取出由发光元件射出的光。The present invention is made to solve the above-mentioned problems, and its object is to provide a light-emitting device that not only achieves miniaturization and thinning, but also can effectively prevent resin and resin, resin and lead frame in the light-emitting device from , lead wires, etc., thereby preventing vulcanization of silver-containing metal parts used in light-emitting devices, and complementing this structure, it is more effective to extract light emitted from light-emitting elements.
本发明包括以下发明。The present invention includes the following inventions.
一种发光装置，其特征在于，包括：A light emitting device, characterized in that it comprises:
多个发光元件；Multiple light emitting elements;
多个搭载所述发光元件的引线框架；a plurality of lead frames carrying the light-emitting elements;
封装体，其由树脂形成并具有开口，所述引线框架的一部分埋设在所述封装体内部，且另一部分暴露在所述开口的底面；a package body formed of resin and having an opening, a part of the lead frame is buried inside the package body, and another part is exposed on a bottom surface of the opening;
在所述封装体的开口的底面存在暴露所述树脂的树脂底面；There is a resin bottom surface exposing the resin on the bottom surface of the opening of the package;
在所述开口内的所述发光元件之间具有从所述开口的底面突出的壁部；having a wall protruding from a bottom surface of the opening between the light emitting elements in the opening;
所述发光元件与跨过所述壁部的引线连接。The light emitting element is connected to a lead straddling the wall.
根据本发明，能够提供具备如下效果的发光装置，即在实现发光装置的小型化和薄型化的同时，还能够有效地防止在发光装置中的树脂和树脂，树脂和引线框架、引线等之间产生空隙，由此可靠地防止构成封装体的或者封装体内存在的金属部件的腐蚀和硫化，可以实现亮度进一步提高，品质进一步提高。According to the present invention, it is possible to provide a light-emitting device having the effect that, while achieving miniaturization and thinning of the light-emitting device, it is possible to effectively prevent the gap between resin and resin, resin and lead frame, lead wire, etc. in the light-emitting device. The generation of voids reliably prevents corrosion and vulcanization of metal components constituting the package or present in the package, and further improves brightness and quality.
附图说明Description of drawings
图1A是用于说明本发明的发光装置的从光取出面(光放射面)看的该发光装置的示意俯视图，图1B是图1的发光装置的A-A’线剖面图。Fig. 1A is a schematic plan view of the light emitting device viewed from the light extraction surface (light emission surface) for explaining the light emitting device of the present invention, and Fig. 1B is a cross-sectional view of the light emitting device of Fig. 1 along line A-A'.
图2A是图1的发光装置的侧视图，图2B是俯视图，图2C是仰视图，图2D是侧视图。FIG. 2A is a side view of the light emitting device of FIG. 1 , FIG. 2B is a top view, FIG. 2C is a bottom view, and FIG. 2D is a side view.
图3是用于说明本发明的壁部和开口短侧面的倾斜的发光装置的示意剖面图。Fig. 3 is a schematic cross-sectional view of a light-emitting device for explaining the slope of the wall portion and the short side of the opening according to the present invention.
图4A、图4B是用于说明本发明的发光装置中发光元件之间的引线连接状态的发光装置主要部分的示意剖面图。4A and 4B are schematic cross-sectional views of main parts of the light-emitting device for explaining the lead connection state between light-emitting elements in the light-emitting device of the present invention.
附图标记说明Explanation of reference signs
2 n侧焊盘电极2 n-side pad electrode
3 p侧焊盘电极3 p side pad electrode
10 发光装置10 light emitting device
11a，11b 发光元件11a, 11b Light emitting elements
12a，12b 引线框架12a, 12b lead frame
13 封装体13 packages
13a 开口13a opening
13b 壁部13b wall
13c 短侧面13c short side
13d 长侧面13d long profile
13e 树脂底面13e resin base
13f 凹部13f Concave
14 引线14 leads
具体实施方式detailed description
例如，如图1所示，本发明的发光装置主要由多个发光元件11a，11b、引线框架12a，12b及封装体13构成。作为这种发光装置，优选所谓的侧视型发光装置，即优选能够作为在与安装面大致垂直的方向上具有光放射面(光取出面，以下有时称作“上表面”)的发光装置安装的类型。For example, as shown in FIG. 1 , the light-emitting device of the present invention is mainly composed of a plurality of light-emitting elements 11a, 11b, lead frames 12a, 12b, and a package 13. As such a light-emitting device, a so-called side-view type light-emitting device is preferable, that is, it is preferably a light-emitting device that can be mounted as a light-emitting device having a light emitting surface (light extraction surface, hereinafter sometimes referred to as "upper surface") in a direction approximately perpendicular to the mounting surface. type.
＜发光元件＞＜Light emitting element＞
作为发光元件，通常采用半导体发光元件，但只要是被称作发光二极管的元件，什么类型的发光元件均可以。例如举出在基板上由InN、AlN、GaN、InGaN、AlGaN、InGaAlN等氮化物半导体，Ⅲ-Ⅴ族化合物半导体，Ⅱ-Ⅵ族化合物半导体等各种半导体形成含有活性层的层叠结构的发光元件。作为半导体的结构，例如有MIS结、PIN结、PN结等同质结构，异质结或双异质结，另外，也可以是将半导体活性层形成为产生量子效果的薄膜的单量子阱结构、多量子阱结构。有时在活性层中也可以掺杂Si、Ge等施主杂质和/或Zn、Mg等受主杂质。得到的发光元件的发光波长随着半导体材料、混晶比、活性层的InGaN中的In含有量、掺杂在活性层中的杂质种类发生变化，可以从紫外区变化到红色区。As the light-emitting element, a semiconductor light-emitting element is generally used, but any type of light-emitting element may be used as long as it is an element called a light-emitting diode. For example, there are light-emitting devices in which a laminated structure including an active layer is formed on a substrate by various semiconductors such as nitride semiconductors such as InN, AlN, GaN, InGaN, AlGaN, and InGaAlN, III-V compound semiconductors, and II-VI compound semiconductors. . As the structure of the semiconductor, for example, there are homogeneous structures such as MIS junction, PIN junction, PN junction, heterojunction or double heterojunction. In addition, it can also be a single quantum well structure in which the semiconductor active layer is formed as a thin film that produces quantum effects, multiple quantum well structure. Donor impurities such as Si and Ge and/or acceptor impurities such as Zn and Mg may also be doped in the active layer. The emission wavelength of the obtained light-emitting element varies with the semiconductor material, the mixing ratio, the In content of InGaN in the active layer, and the type of impurity doped in the active layer, and can be changed from the ultraviolet region to the red region.
发光元件搭载在后述的引线框架上，为此使用了接合部件。例如，如果是发出蓝光及绿光的在蓝宝石基板上使氮化物半导体生长而形成的发光元件，可以使用环氧树脂、硅树脂等。另外，考虑到来自发光元件的光和热引起的劣化，可以对发光元件背面镀铝，也可以代替树脂而使用Au-Sn共晶等焊料或者低熔点金属等钎料。而且，如果是由GaAs等形成的发出红光的两面形成有电极的发光元件，也可以使用银、金、钯等导电膏等进行芯片接合。The light emitting element is mounted on a lead frame described later, and a bonding member is used for this. For example, epoxy resin, silicone resin, etc. can be used for a light emitting element formed by growing a nitride semiconductor on a sapphire substrate that emits blue light and green light. In addition, in consideration of deterioration due to light and heat from the light emitting element, the back surface of the light emitting element may be plated with aluminum, or solder such as Au-Sn eutectic or low melting point metal may be used instead of resin. Furthermore, in the case of a light-emitting element formed of GaAs or the like that emits red light and has electrodes formed on both sides, it is also possible to perform die bonding using a conductive paste such as silver, gold, or palladium.
在本发明的发光装置中，可以搭载两个以上的多个发光元件。在这种情况下，可以组合发出不同色光的发光元件，也可以组合发出相同色光的发光元件。例如，通过与RGB对应地组合发出不同色光的多个发光元件，可以提高彩色再现性。另外，通过组合发出相同色光的多个发光元件，可以提高光的强度。In the light-emitting device of the present invention, two or more light-emitting elements may be mounted. In this case, light emitting elements emitting light of different colors may be combined, or light emitting elements emitting light of the same color may be combined. For example, color reproducibility can be improved by combining a plurality of light emitting elements that emit light of different colors corresponding to RGB. In addition, by combining a plurality of light emitting elements that emit light of the same color, the intensity of light can be increased.
需要说明的是，发光元件通过面朝上安装、倒装芯片安装等搭载在发光装置上，然而优选面朝上安装，即相对发光元件的基板(或半导体层)，一对电极形成在同一面侧，将形成有电极的面面向光射出面而安装。It should be noted that the light-emitting element is mounted on the light-emitting device by face-up mounting, flip-chip mounting, etc., but it is preferably face-up mounting, that is, a pair of electrodes is formed on the same surface as the substrate (or semiconductor layer) of the light-emitting element. On the side, the surface on which the electrodes are formed faces the light emitting surface and mounted.
在这种情况下，发光元件通常与一对电极引线接合，因此发光元件形成有与这些电极对应的焊盘电极。优选一侧的焊盘电极接近发光元件的外周，而另一侧的焊盘电极位于向发光元件的内侧偏移的位置。通过这样的焊盘电极的配置，可以谋求将引线对发光元件射出的光的吸收抑制在最低限度的同时，对构成发光元件的半导体层均匀地供电。In this case, the light emitting element is usually wire-bonded to a pair of electrodes, so the light emitting element is formed with pad electrodes corresponding to these electrodes. Preferably, the pad electrode on one side is close to the outer periphery of the light emitting element, and the pad electrode on the other side is located at a position shifted toward the inner side of the light emitting element. Such an arrangement of the pad electrodes makes it possible to uniformly supply power to the semiconductor layers constituting the light emitting element while minimizing the absorption of light emitted from the light emitting element by the leads.
另外，考虑到与引线的可接合性，优选焊盘电极的最上表面由金、铂金、铝、铑、铱、钌、银或这些金属的合金等形成，更优选由金、铂金、铝或这些金属的合金形成。In addition, considering the bondability with the lead, it is preferable that the uppermost surface of the pad electrode is formed of gold, platinum, aluminum, rhodium, iridium, ruthenium, silver, or an alloy of these metals, and more preferably gold, platinum, aluminum, or these metals. Alloy formation of metals.
＜引线框架＞＜Lead frame＞
引线框架是用于搭载发光元件的部件，也起到与发光元件电连接的电极和引线端子的作用。为此，引线框架的一部分埋设并固定在后述的封装体内，另一部分搭载发光元件且为了进行电连接，暴露在封装体的开口内(其底面)，剩余部分从封装体内向外突出。通过使引线框架在开口底面的一部分表面暴露，能够使来自发光元件的光反射，有效地朝正面方向取出光。The lead frame is a member for mounting a light emitting element, and also functions as an electrode and a lead terminal electrically connected to the light emitting element. Therefore, a part of the lead frame is buried and fixed in a package described later, the other part mounts the light-emitting element and is exposed in the opening of the package (the bottom surface) for electrical connection, and the remaining part protrudes from the package. By exposing a part of the lead frame at the bottom of the opening, it is possible to reflect light from the light emitting element and efficiently extract light toward the front.
需要说明的是，如后文所述，在开口底面暴露的引线框架可以随开口的形状或者与开口的形状无关，其宽度可以不同。在这种情况下，优选在开口的末端侧宽度窄，随着越靠近中央部分宽度越宽。在此，宽度需要在能够确保电极及供电的引线端子的功能的范围内变动，例如，对最大宽度而言，可以在30％以内变动，优选在20％以内变动。It should be noted that, as described later, the width of the lead frame exposed at the bottom of the opening may vary with or regardless of the shape of the opening. In this case, it is preferable that the width is narrow at the end side of the opening and becomes wider as it approaches the central portion. Here, the width needs to be varied within a range in which the functions of electrodes and power supply lead terminals can be ensured. For example, the maximum width can be varied within 30%, preferably within 20%.
一个发光装置具有的引线框架的数量通常在两个以上，引线框架的数量可以在(发光元件的数量+1)个以上，或者也可以在发光元件数量的二倍以上。例如，在搭载有两个发光元件的情况下，在两个引线框架上各安装一个发光元件，一侧的发光元件通过一个电极与搭载它的一侧的引线框架电连接，且另一侧的发光元件通过一个电极与搭载它的另一侧的引线框架电连接，未与引线框架连接的发光元件的电极彼此相互电连接。A light-emitting device usually has more than two lead frames, and the number of lead frames may be more than (number of light-emitting elements+1), or more than twice the number of light-emitting elements. For example, when two light-emitting elements are mounted, one light-emitting element is mounted on each of the two lead frames, and the light-emitting element on one side is electrically connected to the lead frame on the side on which it is mounted via an electrode, and the The light-emitting element is electrically connected to the lead frame mounted on the other side through one electrode, and the electrodes of the light-emitting element not connected to the lead frame are electrically connected to each other.
需要说明的是，多个引线框架中除了与所述发光元件的电极电连接的引线框架以外的其他引线框架实质上电隔离地配置在封装体内。It should be noted that among the plurality of lead frames, the lead frames other than the lead frame electrically connected to the electrode of the light emitting element are arranged in the package substantially electrically isolated.
引线框架实质上可以是板状，也可以是波形板状或者具有凹凸的板状。对材料没有特别的限定，只要是能够向发光元件提供适当电力的材料即可。另外，优选由导热系数较大的材料形成。通过由这样的材料形成，可以有效地散放发光元件产生的热量。优选例如导热系数在200W/(m·K)以上的材料、具有较大的机械强度的材料，或者容易进行冲压加工或者蚀刻加工等的材料。具体来说，可以举出铜、铝、金、银、钨、铁、镍等金属或者铁镍合金、磷青铜等合金等。另外，为了有效地取出来自搭载的发光元件的光，优选在引线框架的表面施以反射镀膜(例如，由银或银合金实施的镀膜)。根据希望得到的发光装置的大小、形状等，可以适当调整引线框架的大小、厚度、形状等。The lead frame may be substantially plate-like, or may be corrugated or uneven. The material is not particularly limited, as long as it is a material capable of supplying appropriate power to the light emitting element. In addition, it is preferably formed of a material having a high thermal conductivity. By being formed from such a material, heat generated by the light emitting element can be effectively dissipated. For example, a material having a thermal conductivity of 200 W/(m·K) or more, a material having high mechanical strength, or a material that is easy to press or etch is preferable. Specifically, metals such as copper, aluminum, gold, silver, tungsten, iron, and nickel, alloys such as iron-nickel alloys, and phosphor bronze, etc., may be mentioned. In addition, in order to efficiently extract light from the mounted light-emitting element, it is preferable to provide a reflective coating (for example, a coating made of silver or a silver alloy) on the surface of the lead frame. The size, thickness, shape, etc. of the lead frame can be appropriately adjusted according to the size, shape, etc. of the desired light emitting device.
根据搭载在发光装置的发光元件的散热性和发光装置的使用形态(配置空间、配置位置等)，可以适当调整引线框架的延伸到封装体外的部位(即引线端子)的形状、大小等。另外，根据与其他电子设备的位置关系等使用形态，可以适当地使引线端子弯曲、变形。Depending on the heat dissipation of the light-emitting element mounted on the light-emitting device and the usage of the light-emitting device (arrangement space, arrangement position, etc.), the shape, size, etc. of the parts of the lead frame extending outside the package (that is, lead terminals) can be appropriately adjusted. In addition, the lead terminal can be bent and deformed appropriately according to the use form such as the positional relationship with other electronic devices.
引线框架不仅可以不与发光元件电连接而搭载发光元件，也可以不搭载发光元件且不与发光元件电连接。这样的引线框架优选为例如其一端的表面积相比起到引线端子的作用的部分的表面积大。由此，可以起到将封装体内的发光元件所产生的热量传导到外部的散热路径的作用以及过电压保护的作用。The lead frame may not only mount the light-emitting element without being electrically connected to the light-emitting element, but also may not mount the light-emitting element and be electrically connected to the light-emitting element. Such a lead frame preferably has, for example, a larger surface area at one end than a portion that functions as a lead terminal. In this way, the heat dissipation path for conducting the heat generated by the light emitting element in the package to the outside and the function of overvoltage protection can be played.
〈封装体〉〈Package〉
封装体是用于保护发光元件的同时将引线框架整体固定并且对发光元件及引线框架保证绝缘性的部件。The package protects the light-emitting element, fixes the entire lead frame, and secures insulation between the light-emitting element and the lead frame.
因此，只要是能够确保以上功能的树脂均可以形成封装体。例如，热塑性树脂、热固性树脂等树脂、陶瓷等。具体可以举出聚酰亚胺(PI)、聚酰胺(PA)、聚碳酸酯树脂、聚苯硫醚(PPS)、液晶聚合物(LCP)、ABS树脂、环氧树脂、酚醛树脂、丙烯酸树脂、PBT树脂、在本领域被用作封装体材料的树脂(例如日本特开2011-256326号和日本特开2011-178983号等中记载的树脂)等。另外，也可以将各种染料或颜料等用作着色剂或光扩散剂混合在这些材料中。由此，可以将被封装体吸收的发光元件射出的光控制在最低限度，或者可以形成反射率高的白色封装体。作为着色剂，可以举出氧化铬(Cr2O3)、二氧化锰(MnO2)、三氧化二铁(Fe2O3)、碳黑等。作为光扩散剂，可以举出碳酸钙、铝氧化物、钛氧化物等。Therefore, any resin that can ensure the above functions can form the package. For example, resins such as thermoplastic resins and thermosetting resins, ceramics, and the like. Specifically, polyimide (PI), polyamide (PA), polycarbonate resin, polyphenylene sulfide (PPS), liquid crystal polymer (LCP), ABS resin, epoxy resin, phenolic resin, acrylic resin , PBT resin, resins used as package materials in this field (for example, resins described in JP-A-2011-256326 and JP-A-2011-178983, etc.), and the like. In addition, various dyes, pigments, etc. can also be mixed in these materials as a colorant or a light diffusing agent. Thereby, the light emitted from the light-emitting element absorbed by the package can be minimized, and a white package with high reflectance can be formed. Examples of the colorant include chromium oxide (Cr2 O3 ), manganese dioxide (MnO2 ), ferric oxide (Fe2 O3 ), carbon black, and the like. Calcium carbonate, aluminum oxide, titanium oxide, etc. are mentioned as a light-diffusion agent.
在封装体中，通常在后述的开口内通常埋设有透光性树脂，考虑到封装体和透光性树脂受到发光元件等产生的热量的影响而发生的密接性，优选使用两者的热膨胀系数差较小的材料。In the package, a light-transmitting resin is usually embedded in an opening described later. In consideration of the adhesion between the package and the light-transmitting resin due to the influence of heat generated by the light-emitting element, etc., it is preferable to use the thermal expansion of both. Materials with small coefficient differences.
对封装体的大小及形状没有特别的限定，其形状可以为当俯视时外形(平面形状)例如呈圆形、椭圆形、三角形、四边形、多边形或者与这些形状近似的形状等。其中，优选沿长度方向延伸的形状，特别优选沿长度方向延伸且俯视时四边形或者近似四边形的形状。The size and shape of the package are not particularly limited, and the shape may be a shape (planar shape) such as a circle, ellipse, triangle, quadrangle, polygon, or a shape similar to these shapes when viewed from above. Among them, a shape extending in the longitudinal direction is preferable, and a shape extending in the longitudinal direction and having a quadrangular or substantially quadrilateral shape in plan view is particularly preferable.
(开口)(opening)
在封装体表面形成有开口，该开口是为了搭载发光元件并取出来自发光元件的光而形成的。对开口的形状没有特别的限定，可以是圆形、椭圆形、三角形、四边形或者多角形柱、圆顶形、碗形等或者与这些形状近似的形状。其中，优选沿长度方向延伸的形状，特别优选沿长度方向延伸且俯视时呈四边形、近似四边形的多边形或者与这些形状近似的形状。An opening is formed on the surface of the package for mounting a light-emitting element and extracting light from the light-emitting element. The shape of the opening is not particularly limited, and may be circular, elliptical, triangular, quadrilateral, or polygonal column, dome, bowl, etc., or shapes similar to these shapes. Among them, a shape extending in the longitudinal direction is preferable, and a shape extending in the longitudinal direction and having a quadrilateral shape, a polygonal shape approximately quadrangular in plan view, or a shape similar to these shapes is particularly preferable.
另外，当沿着长度方向设置开口时，其在长度方向上的宽度可以不同，也可以大致相同。In addition, when openings are provided along the lengthwise direction, their widths in the lengthwise direction may be different or substantially the same.
优选开口至少具有一个或者一对沿长度方向设置的长侧面。而且，优选开口具有一个或者一对沿宽度方向设置的短侧面。具有这样的长侧面和/或短侧面的开口的侧面可以是垂直的，然而通常情况下，其一部分或者全部以越靠近底面开口的宽度越窄的方式倾斜。通过这样的倾斜，可以有效地将发光元件射出的光向取出面的方向(上表面方向)反射。这样的侧面可以根据其部位以不同的倾斜角度倾斜。例如，优选侧面的倾斜角度在长度方向的末端部(如短侧面)最小。当短侧面的倾斜角度(图3中短侧面13c的倾斜角度为α)比长侧面的倾斜角度小时，能够在安装的发光装置中将其高度设定在最小值，从而在长度方向的末端部有效地反射光，提高光的射出率。例如，相对于开口底面，短侧面的倾斜角度(图3中的α)优选30～70°左右，更优选40～60°左右。优选长侧面的倾斜角度比这个倾斜角度大，目的在于将发光装置所占的空间随着倾斜的增大抑制在最低限度。Preferably, the opening has at least one or a pair of long sides arranged along the length direction. Furthermore, it is preferable that the opening has one or a pair of short sides arranged in the width direction. The side surfaces of the opening having such a long side and/or short side may be vertical, but usually a part or the whole thereof is inclined such that the width of the opening becomes narrower toward the bottom. With such an inclination, the light emitted from the light-emitting element can be effectively reflected in the direction of the extraction surface (the direction of the upper surface). Such sides can be inclined at different inclination angles depending on their location. For example, it is preferable that the angle of inclination of the sides is smallest at the ends in the longitudinal direction (eg, the short sides). When the inclination angle of the short side (the inclination angle of the short side 13c in FIG. 3 is α) is smaller than the inclination angle of the long side, its height can be set at the minimum value in the installed light emitting device, so that the end portion in the length direction Effectively reflect light and improve light emission rate. For example, the inclination angle of the short side surface (α in FIG. 3 ) is preferably about 30° to 70°, more preferably about 40° to 60°, with respect to the bottom surface of the opening. Preferably, the inclination angle of the long side is larger than this inclination angle, in order to minimize the space occupied by the light emitting device as the inclination increases.
开口的大小及深度等可以根据搭载的发光元件的数量和接合方法等适当地调整。例如，优选深度是所述发光元件的厚度的1.5～10倍左右，更优选1.5～5倍左右或者2～5倍左右。具体而言，深度为0.1～1mm左右或者0.2～0.6mm左右，更优选0.25～0.35mm左右。优选经过压纹处理或等离子处理等增加开口的底面和/或侧面的接触面积，提高与后述的透光性树脂的密接性。The size, depth, and the like of the opening can be appropriately adjusted according to the number of light emitting elements to be mounted, the bonding method, and the like. For example, the depth is preferably about 1.5 to 10 times the thickness of the light emitting element, more preferably about 1.5 to 5 times or about 2 to 5 times. Specifically, the depth is about 0.1 to 1 mm or about 0.2 to 0.6 mm, more preferably about 0.25 to 0.35 mm. It is preferable to increase the contact area of the bottom surface and/or the side surface of the opening by embossing treatment or plasma treatment to improve the adhesion with the translucent resin described later.
(开口内的壁部)(Wall inside the opening)
封装体在开口内且在搭载的发光元件之间，具有从开口的底面突出的壁部。与发光元件的数量相对应，壁部的数量可以是一个或多个。由于开口具有壁部，构成开口的空间被分隔，如后文所述，通常被埋入开口内的透光性树脂的热膨胀或者热收缩更有效地被抑制在更狭小的空间内。The package has a wall protruding from the bottom surface of the opening between the mounted light-emitting elements in the opening. Corresponding to the number of light emitting elements, the number of wall parts may be one or more. Since the opening has a wall portion, the space constituting the opening is partitioned, and thermal expansion or thermal contraction of the translucent resin buried in the opening is more effectively suppressed in a narrower space as will be described later.
优选壁部的高度等于或者小于搭载的发光元件的高度。这样可以不仅不使开口的深度增大且稳定地形成引线，还可以容易分隔构成开口的空间。Preferably, the height of the wall portion is equal to or smaller than the height of the mounted light emitting element. In this way, not only the leads can be stably formed without increasing the depth of the opening, but also the space constituting the opening can be easily partitioned.
优选壁部配置在引线框架之间(参照图1B的壁部13b)，换言之，优选利用壁部使引线框架实质地电隔离。需要说明的是，壁部只要存在于引线框架之间，其一部分可以延伸到引线框架上(参照图1B的壁部13b)。壁部的一部分延伸到引线框架上时，可以提高构成封装体的树脂与引线框架的密接性，使引线框架在封装体中的固定更加牢固。The wall portion is preferably arranged between the lead frames (see wall portion 13b in FIG. 1B ), in other words, the lead frame is preferably substantially electrically isolated by the wall portion. It should be noted that as long as the wall portion exists between the lead frames, a part thereof may extend to the lead frame (see wall portion 13b in FIG. 1B ). When a part of the wall extends to the lead frame, the adhesiveness between the resin constituting the package and the lead frame can be improved, so that the lead frame can be fixed more firmly in the package.
优选壁部与一对长侧面都连接，该一对长侧面沿着配置在向长度方向延伸的封装体内的开口的长度方向设置。这样，通过壁部与长侧面的连接，构成开口的空间被分隔，可以将通常被埋入开口内的透光性树脂的热膨胀或者热收缩更有效地抑制在更狭小的空间内。Preferably, both of the wall portions are connected to a pair of long side surfaces provided along the longitudinal direction of the opening arranged in the package extending in the longitudinal direction. In this way, the space constituting the opening is divided by the connection of the wall portion and the long side, and thermal expansion or thermal contraction of the translucent resin normally embedded in the opening can be more effectively suppressed in a narrower space.
另外，优选壁部越靠近底面宽度越宽。在此，所谓“宽度越宽”，如前文所述，优选指壁部与长侧面连接时在长度方向上宽度变宽。需要说明的是，优选壁部在其高度方向上的全部与长侧面连接，但也可以在开口的底面及其附近或者在壁部高度方向的下方部分与长侧面连接。在这种情况下，越靠近底面，相对于将一对长侧面连接的方向(例如与长侧面的延伸方向交叉的方向)，壁部的宽度可以越宽。In addition, it is preferable that the width of the wall portion becomes wider as it gets closer to the bottom surface. Here, "the wider the width", as described above, preferably means that the width becomes wider in the longitudinal direction when the wall portion is connected to the long side. It should be noted that the entire height direction of the wall is preferably connected to the long side, but it may also be connected to the long side at the bottom of the opening and its vicinity or at a lower portion in the height direction of the wall. In this case, the width of the wall portion may be wider with respect to a direction connecting the pair of long sides (for example, a direction intersecting the extending direction of the long sides) closer to the bottom surface.
壁部在长度方向上宽度变宽的程度，例如相对于开口底面，壁部侧面的倾斜角度(图3中壁部13b的倾斜角度β)优选40～70°左右，更优选50～60°。通过设置成这样的倾斜角度，可以有效地将照射到壁部的来自发光元件的光向取出方向反射。需要说明的是，优选壁部侧面的倾斜角度(图3中的β)比长度方向的末端部侧面(短侧面13c)的倾斜角度(图3中的α)大。The extent to which the wall becomes wider in the longitudinal direction is, for example, an inclination angle of the side of the wall (inclination angle β of the wall 13b in FIG. 3 ) with respect to the bottom surface of the opening, preferably about 40-70°, more preferably 50-60°. By providing such an inclination angle, the light from the light emitting element irradiated on the wall can be effectively reflected in the extraction direction. It should be noted that the inclination angle (β in FIG. 3 ) of the side surface of the wall is preferably larger than the inclination angle (α in FIG. 3 ) of the side surface (short side surface 13 c ) of the end portion in the longitudinal direction.
壁部的大小可以根据所使用的发光装置的大小等适当地调整，例如，在上面部宽度为0.05～0.2mm左右，在底面部宽度为0.3～0.5mm左右，高度为0.1～0.17mm左右。The size of the wall can be appropriately adjusted according to the size of the light-emitting device used, for example, the width of the upper part is about 0.05-0.2 mm, the width of the bottom part is about 0.3-0.5 mm, and the height is about 0.1-0.17 mm.
(开口底面)(Open Bottom)
开口底面除了具有引线框架的一部分表面外，还具有暴露树脂的树脂底面。优选树脂底面与长侧面邻接或者沿着长侧面配置。树脂底面的长度可以是长侧面长度的30～100％左右，优选40～90％左右，更优选50～80％左右。通过配置这样的树脂底面，可以使封装体树脂与后述的透光性树脂更好地密接。特别是，树脂暴露到开口底面时，由于在边缘部分不存在构成封装体的树脂、引线框架和后述的透光性树脂三者的边界，因此，即使在构成封装体的树脂和透光性树脂之间产生了剥离或者形成了微小的空隙，也可以有效地防止通过这些微小的空隙侵入的水分、气体、垃圾与引线框架接触，从而可以十分有效地防止银的硫化。The opening bottom surface has a resin bottom surface where the resin is exposed, in addition to a part of the surface of the lead frame. Preferably, the resin bottom surface is adjacent to the long side or arranged along the long side. The length of the resin bottom surface may be about 30-100% of the length of the long side, preferably about 40-90%, more preferably about 50-80%. By arranging such a resin bottom surface, the package resin and the translucent resin to be described later can be more closely adhered to each other. In particular, when the resin is exposed to the bottom surface of the opening, since there is no boundary between the resin constituting the package, the lead frame, and the translucent resin described later in the edge portion, even if the resin constituting the package and the translucent resin The separation between the resins or the formation of tiny gaps can also effectively prevent moisture, gas, and garbage intruding through these tiny gaps from contacting the lead frame, thereby preventing silver vulcanization very effectively.
例如，树脂底面的宽度优选开口的最大宽度的1～30％左右，更优选2～20％左右。而且，优选树脂底面在长度方向上的宽度不同。在长度方向上宽度的变化优选在所述范围内，特别是，树脂底面的最小宽度优选树脂底面的最大宽度的10～50％左右，更优选20～40％左右。For example, the width of the resin bottom surface is preferably about 1 to 30% of the maximum width of the opening, more preferably about 2 to 20%. Furthermore, it is preferable that the width of the resin bottom surface varies in the longitudinal direction. The change in width in the longitudinal direction is preferably within the above range. In particular, the minimum width of the resin bottom surface is preferably about 10-50% of the maximum width of the resin bottom surface, and more preferably about 20-40%.
特别是，树脂底面的宽度优选从长度方向的末端部位开始到后述的从开口底面突出的壁部不同，更优选越靠近壁部宽度越窄。In particular, the width of the resin bottom surface is preferably different from the end portion in the longitudinal direction to a wall protruding from the bottom surface of the opening described later, and is more preferably narrower toward the wall portion.
需要说明的是，如前文所述，在封装体的开口内形成了从底面突出的壁部的情况下，即使是与长侧面邻接或者沿长侧面的部位，在壁部及与其邻接的底面部位，也可以不存在树脂底面。换言之，优选与壁部邻接的开口底面的部位被引线框架的暴露面占据。It should be noted that, as described above, in the case where the wall portion protruding from the bottom surface is formed in the opening of the package, even if it is adjacent to the long side surface or along the long side surface, the wall portion and the adjacent bottom surface portion , and there may be no resin bottom surface. In other words, it is preferable that the portion of the bottom surface of the opening adjacent to the wall portion is occupied by the exposed surface of the lead frame.
与长侧面邻接或者沿长侧面的树脂底面在长度方向上可以被分隔成两段以上。这样，由于壁部的存在，在壁部附近可以有效地防止构成封装体的树脂与透光性树脂的剥离。即，如后文所述，透光性树脂一般比构成封装体的树脂更容易热膨胀或者热收缩，但在壁部附近，从三个方向限定所述的透光性树脂，从而可以抑制能引起剥离的热膨胀或者热收缩。The resin bottom surface adjacent to the long side or along the long side may be divided into two or more sections in the longitudinal direction. In this way, due to the presence of the wall portion, separation of the resin constituting the package and the light-transmitting resin can be effectively prevented in the vicinity of the wall portion. That is, as described later, the translucent resin is generally easier to thermally expand or contract than the resin constituting the package, but in the vicinity of the wall, the translucent resin is restricted from three directions, thereby preventing the occurrence of Thermal expansion or contraction of peeling.
(外壁)(outer wall)
优选在封装体外表面的一部分形成有凹部。该凹部可以形成为延伸到封装体壁的内表面(开口)，在内表面(开口)形成凸部。通过这样的凹部，可以更有效地利用发光装置内存在的空间(例如死角)，从而可以进一步实现发光装置的小型化。Preferably, a concave portion is formed on a part of the outer surface of the package. The concave portion may be formed to extend to the inner surface (opening) of the package wall, and the inner surface (opening) forms the convex portion. Through such a concave portion, the space existing in the light-emitting device (for example, a dead space) can be more effectively used, thereby further reducing the size of the light-emitting device.
例如，只要确保将突出到封装体外部的引线框架的一部分收容到该凹部内，对凹部的大小及形状没有特别的限定，优选确保将引线框架的一部分收容到凹部内，其表面的一部分与封装体壁的外表面同处于一面左右的空间。在此，“同处于一面”的意思是平坦，使得仅通过载置在电路基板等安装基板上，就能够使引线端子与电路基板电连接，并牢固地固定。“将引线框架的一部分收容到凹部内的形态”可以举出如图1A及图2所示的在封装体13的所谓角落形成切口状的凹部13f，并将引线框架的一部分配置在该凹部13f内。For example, the size and shape of the recess are not particularly limited as long as a part of the lead frame protruding outside the package is accommodated in the recess. The outer surface of the body wall is in the space of one side and the other side. Here, "on the same surface" means flat enough that the lead terminals can be electrically connected to the circuit board and firmly fixed just by being placed on a mounting board such as a circuit board. The "form of accommodating a part of the lead frame in the recess" includes forming a notch-shaped recess 13f at a so-called corner of the package 13 as shown in FIGS. 1A and 2 , and disposing a part of the lead frame in the recess 13f. Inside.
在本发明的发光装置内，除了发光元件以外，还可以搭载保护元件。保护元件可以是一个，也可以是两个以上的多个。在此，保护元件没有特别的限定，搭载在发光装置上的公知的元件均可以。具体举出用于防止过热、过电压、过电流、静电的元件以及保护电路等。In the light-emitting device of the present invention, a protective element may be mounted in addition to the light-emitting element. There can be one protective element, or there can be more than two. Here, the protective element is not particularly limited, and any known element mounted on the light emitting device may be used. Specifically, elements and protective circuits for preventing overheating, overvoltage, overcurrent, and static electricity are mentioned.
(透光性树脂)(translucent resin)
在本发明的发光装置中，优选在载置发光元件的开口内埋设有透光性树脂。In the light-emitting device of the present invention, it is preferable that a translucent resin is embedded in the opening in which the light-emitting element is mounted.
透光性树脂是将发光元件、引线和导电部件的一部分密封，保护其不受垃圾、水分和外力等的影响的部件。透光性树脂的主要材料优选由可以使发光元件射出的光透射的材料(透射率优选70％以上)形成。Translucent resin seals light-emitting elements, lead wires, and part of conductive parts to protect them from dust, moisture, and external forces. The main material of the light-transmitting resin is preferably formed of a material that can transmit light emitted from the light-emitting element (transmittance is preferably 70% or more).
具体可以举出加成型或缩合型硅树脂、环氧树脂、酚醛树脂、聚碳酸酯树脂、丙烯酸树脂、ABS树脂、聚对苯二甲酸丁二醇酯树脂、聚邻苯二甲酰胺树脂、聚苯硫醚树脂、液晶聚合物或者含有这些树脂中的一种以上的混合树脂。Specifically, addition type or condensation type silicone resin, epoxy resin, phenolic resin, polycarbonate resin, acrylic resin, ABS resin, polybutylene terephthalate resin, polyphthalamide resin, poly A phenylene sulfide resin, a liquid crystal polymer, or a mixed resin containing one or more of these resins.
该透光性树脂除了上述主要材料以外，优选还含有含锌的金属盐和/或金属络合物。通过含有锌，可以特别有效地捕获含硫原子的气体，从而可以抑制银的硫化。The translucent resin preferably contains a zinc-containing metal salt and/or metal complex in addition to the above-mentioned main materials. By containing zinc, gas containing sulfur atoms can be captured particularly effectively, and sulfidation of silver can be suppressed.
例如，可以举出含有磷酸酯或磷酸锌盐、磷酸酯或磷酸锌盐的含有酸或者酯配体的锌络合物的透光性树脂。For example, light-transmitting resins containing phosphoric acid esters or zinc phosphate salts, and zinc complexes containing acid or ester ligands of phosphoric acid esters or zinc phosphate salts are mentioned.
具体来说，优选含有双(乙酰丙酮根)合锌，双(2-乙基己酸)锌、甲基丙烯酸锌、新癸酸锌等羧酸盐，氧化锌，锡酸锌等。Specifically, it is preferable to contain carboxylate salts such as bis(acetylacetonate)zinc, bis(2-ethylhexanoate)zinc, zinc methacrylate, zinc neodecanoate, zinc oxide, zinc stannate, and the like.
通过使用这样的透光性树脂，可以显著地抑制含硫气体接触到引线框架或者引线框架表面的镀金或者用作引线的银或者银合金导致的硫化。By using such a light-transmitting resin, it is possible to remarkably suppress sulfidation caused by sulfur-containing gas coming into contact with the lead frame or the gold plating on the surface of the lead frame, or the silver or silver alloy used as the lead.
作为透光性树脂，可以使用例如日本特开2011-256326、日本特开2011-137140、日本特开2011-178983等中记载的树脂。As the translucent resin, resins described in, for example, JP 2011-256326, JP 2011-137140, JP 2011-178983 and the like can be used.
透光性树脂可以含有扩散剂或荧光物质。扩散剂是使光扩散的物质，可以缓和来自发光元件的光的指向性来增大视角。荧光物质是变换来自发光元件的光的物质，可以变换从发光元件射出到封装体外部的光的波长。当发光元件发出的光是能量高、波长短的可视光时，适合使用有机荧光体的二萘嵌苯系衍生物，或者ZnCdS：Cu、YAG：Ce、由Eu和/或Cr激活的含氮CaO-Al2O3-SiO2等无机荧光体等。在本发明中，当要得到白光时，特别是使用YAG：Ce荧光体，根据其含有量，不仅可以发出来自蓝色发光元件的蓝光，还可以吸收一部分蓝光发出其互补色的黄色系光，从而相对简单可靠地形成白色系光。同样地，当使用由Eu和/或Cr激活的含氮CaO-Al2O3-SiO2荧光体时，根据其含有量，不仅可以发出来自蓝色发光元件的蓝光，还可以吸收一部分蓝光发出其互补色的红色系光，从而相对简单可靠地形成白色系光。另外，通过完全沉淀荧光体并除去气泡，可以降低色彩的不均匀。The translucent resin may contain a diffusing agent or a fluorescent substance. The diffusing agent is a substance that diffuses light, and can relax the directivity of light from the light-emitting element to increase the viewing angle. The fluorescent substance is a substance that converts light from a light emitting element, and can convert the wavelength of light emitted from the light emitting element to the outside of the package. When the light emitted by the light-emitting element is visible light with high energy and short wavelength, it is suitable to use perylene derivatives of organic phosphors, or ZnCdS: Cu, YAG: Ce, Eu and/or Cr activated containing Nitrogen CaO-Al2 O3 -SiO2 and other inorganic phosphors. In the present invention, when white light is to be obtained, especially YAG:Ce phosphor is used, and depending on its content, not only can emit blue light from a blue light-emitting element, but can also absorb a part of blue light and emit yellowish light of its complementary color, Thus, white light can be formed relatively simply and reliably. Similarly, when using a nitrogen-containing CaO-Al2 O3 -SiO2 phosphor activated by Eu and/or Cr, depending on its content, not only can emit blue light from a blue light-emitting element, but also absorb a part of the blue light to emit The red-based light of its complementary color can form white-based light relatively simply and reliably. In addition, color unevenness can be reduced by completely precipitating the phosphor and removing air bubbles.
特别是，透光性树脂的弹性模量优选小于10MPa，例如，更优选0.1～10MPa或者0.2～5MPa等。在此，弹性模量是根据JIS K 6911或JIS K 6249的方法测定的值。通过设定成这样的弹性模量，可以防止开口内，特别是开口的长度方向上的末端部的剥离，同时还能缓和施加在引线等的应力。In particular, the elastic modulus of the translucent resin is preferably less than 10 MPa, for example, more preferably 0.1 to 10 MPa or 0.2 to 5 MPa. Here, the modulus of elasticity is a value measured according to the method of JIS K 6911 or JIS K 6249. By setting such a modulus of elasticity, it is possible to prevent peeling of the end portion in the opening, particularly in the longitudinal direction of the opening, and to relax stress applied to the lead wire and the like.
在本发明的发光装置中，在用透光性树脂密封之前，可以在引线、发光元件、引线框架的表面上覆盖保护膜。为了将对发光元件射出的光的吸收抑制在最低限度，优选保护膜由对发光元件射出的波长的光吸收性低的材料形成，且有一定的厚度。作为氧化物膜，例如举出有Al2O3、SiO2、SiN、HfO、TiO2、SiOxNy等，作为氮化物膜，例如举出SiN、TiN等，可以使所述的单层膜或者层积膜。其中，优选氧化铝、二氧化硅或者含这些化合物的氧化物膜材料等。另外，膜的厚度优选在3nm左右以上、1μm左右以下。可以通过本领域公知的方法来形成保护膜，但是，优选使用例如原子层沉积法(ALD：atomic layer deposition)。In the light-emitting device of the present invention, before sealing with a light-transmitting resin, a protective film may be covered on the surface of the leads, the light-emitting element, and the lead frame. In order to minimize the absorption of light emitted from the light emitting element, it is preferable that the protective film is formed of a material with low light absorption at the wavelength emitted from the light emitting element and has a certain thickness. Examples of oxide films include Al2 O3 , SiO2 , SiN, HfO, TiO2 , SiOx Ny and the like, and examples of nitride films include SiN and TiN. film or laminated film. Among them, alumina, silica, or oxide film materials containing these compounds are preferable. In addition, the thickness of the film is preferably not less than about 3 nm and not more than about 1 μm. The protective film can be formed by a method known in the art, but, for example, atomic layer deposition (ALD: atomic layer deposition) is preferably used.
〈引线〉<lead>
在本发明的发光装置中，为了使形成在发光元件上的一对电极向发光元件供电，通过引线使该一对电极与引线框架和/或邻接的发光元件的电极电连接。In the light-emitting device of the present invention, in order for the pair of electrodes formed on the light-emitting element to supply power to the light-emitting element, the pair of electrodes is electrically connected to the lead frame and/or the electrodes of the adjacent light-emitting element through the lead wire.
对引线的材料和直径等没有特别的限定，可以使用本领域中常用的材料。特别是，优选和发光元件电极的欧姆接触特性良好、机械连接性良好且导电性及导热性良好的材料。The material and diameter of the lead are not particularly limited, and materials commonly used in this field can be used. In particular, a material having good ohmic contact properties with the electrodes of the light-emitting element, good mechanical connectivity, and good electrical and thermal conductivity is preferable.
引线可以使用例如金、铜、铂金、铝、银等金属及其合金材料，或者在表面覆盖有银或银合金的材料等。其中，作为反射率高的材料，优选银、铜、铅、铝、铂金或者这些金属的合金，更优选银或银合金。例如可以使用市场上销售的银占87.7体积％、金占8.7体积％、钯占3.6体积％的引线(商品名：SEA，田中贵金属社制造)Metals such as gold, copper, platinum, aluminum, silver and alloy materials thereof, or materials covered with silver or silver alloy on the surface can be used for the lead wires. Among them, silver, copper, lead, aluminum, platinum, or alloys of these metals are preferable as materials with high reflectance, and silver or silver alloys are more preferable. For example, commercially available lead wires having 87.7% by volume of silver, 8.7% by volume of gold, and 3.6% by volume of palladium (trade name: SEA, manufactured by Tanaka Kikinzoku Co., Ltd.) can be used.
对引线的直径没有特别的限定，但可以是10μm～70μm左右，优选15～50μm左右，更优选18～30μm左右。The diameter of the lead wire is not particularly limited, but may be about 10 μm to 70 μm, preferably about 15 to 50 μm, and more preferably about 18 to 30 μm.
引线的导热系数优选在0.01cal/S·cm2·℃/cm左右以上，更优选在0.5cal/S·cm2·℃/cm。The thermal conductivity of the lead wire is preferably at least about 0.01 cal/S·cm2 ·°C/cm, more preferably 0.5 cal/S·cm2 ·°C/cm.
根据引线接合方法，引线通常在发光装置中可以采用各种形态。在本发明中，优选引线跨过配置在所述开口内的壁部连接发光元件之间。由于使引线在开口内的被认为所述用于密封的透光性树脂热膨胀或者热收缩程度最大的部位跨过壁部，因此，通过壁部的占据，可以抑制热膨胀或者热收缩，从而缓和对引线施加的应力。Depending on the wire bonding method, wires can generally take various forms in light-emitting devices. In the present invention, it is preferable that the lead wire connects between the light-emitting elements across a wall portion arranged in the opening. Since the portion of the lead wire in the opening where the thermal expansion or thermal contraction of the translucent resin used for sealing is considered to be the most thermally expanded or thermally contracted over the wall portion, the occupation of the wall portion can suppress thermal expansion or thermal contraction, thereby relieving the pressure on the wall portion. Stress exerted by the leads.
另外，在发光元件的电极之间或者发光元件的电极和引线框架之间，即在它们的引线接合点之间的连接中，优选使引线的最高部位偏向一侧的引线接合点。在发光元件的电极之间的接合中，优选使引线的最高部位偏向一侧的发光元件侧。In connection between electrodes of the light-emitting element or between electrodes of the light-emitting element and the lead frame, that is, between the wire bonding points, it is preferable to use a wire bonding point in which the highest portion of the lead is shifted to one side. In the connection between the electrodes of the light-emitting element, it is preferable that the highest portion of the lead is deviated toward one side of the light-emitting element.
例如，在图4A中，n侧焊盘电极2靠近发光元件11a，11b的外周，p侧焊盘电极3位于发光元件11a，11b的发光区域上且向发光元件11a，11b的内侧偏移的位置。向一侧发光元件11b的外周靠近设置的n侧焊盘电极2(即第一引线接合点)与形成在开口内的壁部13b相邻，并横跨该壁部13b与向另一侧发光元件11a的内侧偏移设置的p侧焊盘电极3(即第二引线接合点)进行引线结合。而且，引线14的最高部位位于向与靠近外周设置的n侧焊盘电极2接合的一侧发光元件11b侧偏移的位置。通过采用这样的引线的形态，能够稳定地形成从n侧焊盘电极2立起的立起部(向上方延伸的部位)。该立起部是容易被断线的部位，但是，通过将该立起部配置在壁部13b附近(在图4A中距离m较短)，能够利用壁部降低透光性树脂在该周边的热膨胀或者热收缩，从而能够有效地防止引线的立起部被断线。For example, in FIG. 4A, the n-side pad electrode 2 is close to the outer periphery of the light-emitting elements 11a, 11b, and the p-side pad electrode 3 is located on the light-emitting area of the light-emitting elements 11a, 11b and is offset to the inside of the light-emitting elements 11a, 11b. Location. The n-side pad electrode 2 (that is, the first wire bonding point) disposed close to the outer periphery of the light-emitting element 11b on one side is adjacent to the wall portion 13b formed in the opening, and emits light across the wall portion 13b and to the other side. The p-side pad electrode 3 (that is, the second wire bonding point) arranged offset on the inner side of the element 11a is wire-bonded. Furthermore, the highest portion of the lead wire 14 is located at a position shifted toward the light emitting element 11 b side of the side that is bonded to the n-side pad electrode 2 provided near the outer periphery. By employing such a form of the lead, it is possible to stably form the raised portion (portion extending upward) raised from the n-side pad electrode 2 . This standing portion is a site that is easily broken, but by arranging this standing portion near the wall portion 13b (the distance m is shorter in FIG. 4A ), the wall portion can reduce the distance between the light-transmitting resin and the surrounding area. Thermal expansion or thermal contraction can effectively prevent the rising portion of the lead wire from being disconnected.
另外，在图4B中表示了与图4相同的发光元件和壁部的配置，在该配置中连接发光元件之间的引线14的最高部位位于向与设置在内侧的p侧焊盘电极3接合的一侧发光元件11a侧偏移的位置。通过这样的引线形态，当使用发射性引线时，在p侧焊盘电极3的立起部(向上方延伸的部位)即配置在发光区域上方的引线能够防止光的吸收，利用引线的反射(参照图4B中的q)能够进一步提高光取出效率。通常，光难以透射焊盘电极，但是，通过使发射性的引线向该焊盘电极的上方延伸(即在p侧焊盘电极3侧配置立起部)，增加在焊盘电极上引线所占有的比例，利用光在引线的反射相抵光在焊盘电极的透射率的降低，从而能够实现实质上均匀的分布。In addition, FIG. 4B shows the same arrangement of light-emitting elements and walls as in FIG. 4 . In this arrangement, the highest part of the lead wire 14 connecting the light-emitting elements is positioned to be connected to the p-side pad electrode 3 provided on the inner side. The side of the side of the light-emitting element 11a is shifted in position. With such a lead form, when an emissive lead is used, the lead arranged above the light-emitting region at the upright portion (the portion extending upward) of the p-side pad electrode 3 can prevent absorption of light and utilize the reflection of the lead ( Referring to q) in FIG. 4B, the light extraction efficiency can be further improved. Generally, it is difficult for light to penetrate the pad electrode, but by extending the emissive lead wire to the top of the pad electrode (that is, the p-side pad electrode 3 side is provided with a standing portion), the occupation of the lead wire on the pad electrode is increased. The ratio of the light on the lead wire is used to offset the reduction of the transmittance of the light on the pad electrode, so that a substantially uniform distribution can be realized.
以下，根据附图详细说明本发明的发光装置的实施例。Hereinafter, embodiments of the light emitting device of the present invention will be described in detail with reference to the drawings.
实施方式Implementation
如图1A、1B及图2所示，本实施方式的发光装置10主要由多个发光元件11a，11b、引线框架12a，12b和封装体13构成，且构成为侧视型。As shown in FIGS. 1A, 1B and 2 , the light emitting device 10 of this embodiment is mainly composed of a plurality of light emitting elements 11a, 11b, lead frames 12a, 12b, and a package 13, and is configured as a side view type.
发光元件11a，11b例如在基板上依次配置n型半导体层、发光层及p型半导体层，使n型半导体层的局部表面暴露，在该表面上形成n电极，并具有配置在该n电极上的n焊盘电极。另外，在p型半导体层的大约整个表面上形成p电极，且具有配置在该p电极上的p焊盘电极，该发光元件11a，11b面朝上安装在引线框架12a，12b上。The light-emitting elements 11a, 11b, for example, sequentially arrange an n-type semiconductor layer, a light-emitting layer, and a p-type semiconductor layer on a substrate, expose a part of the surface of the n-type semiconductor layer, form an n-electrode on the surface, and have an electrode disposed on the n-electrode. the n-pad electrode. In addition, a p-electrode is formed on substantially the entire surface of the p-type semiconductor layer, and a p-pad electrode is arranged on the p-electrode, and the light-emitting elements 11a, 11b are mounted on the lead frames 12a, 12b facing upward.
引线框架12a，12b具有搭载发光元件且与发光元件电连接的区域、埋设且固定在封装体13内的区域以及从该埋设且固定的区域突出到封装体外部且作为引线端子起作用的区域。引线框架12a，12b由板状体形成，该板状体由含铁的铜合金制成，为了有效地取出来自搭载的发光元件的光，对引线框架12a的表面实施镀银。The lead frames 12a and 12b have a region where the light emitting element is mounted and electrically connected to the light emitting element, a region that is embedded and fixed in the package 13 , and a region that protrudes from the embedded and fixed region to the outside of the package and functions as a lead terminal. The lead frames 12a and 12b are formed of a plate-shaped body made of copper alloy containing iron, and the surface of the lead frame 12a is plated with silver in order to efficiently extract light from the mounted light-emitting element.
作为引线端子起作用的引线框架12a，12b被弯曲加工，以便在封装体外部收容在存在于封装体的长度方向的末端的凹部13f内。The lead frames 12a and 12b functioning as lead terminals are bent so as to be housed in recessed portions 13f present at ends in the longitudinal direction of the package outside the package.
引线框架12a，12b分别通过构成封装体的树脂被后述的壁部分离。The lead frames 12a, 12b are respectively separated by a wall portion described later through the resin constituting the package.
封装体13沿长度方向延伸而大致呈长方体形状，在其光取出面(即上表面)具有沿长度方向延长的开口13a、沿长度方向延伸的一对长侧面13d和沿宽度方向延伸的一对短侧面13c。The package body 13 extends in the longitudinal direction and has a substantially rectangular parallelepiped shape, and has an opening 13a extending in the longitudinal direction, a pair of long side surfaces 13d extending in the longitudinal direction, and a pair of long side surfaces 13d extending in the width direction on its light extraction surface (that is, the upper surface). Short side 13c.
另外，开口13c具有从其底面突出的壁部13b。In addition, the opening 13c has a wall portion 13b protruding from the bottom surface thereof.
例如，开口13c的深度是0.32～0.35mm左右，壁部13b的高度是0.12～0.15mm左右。For example, the depth of the opening 13c is about 0.32 to 0.35 mm, and the height of the wall portion 13b is about 0.12 to 0.15 mm.
在开口13c的长侧面13d的大致中央附近，壁部13b与一对长侧面13d连接。壁部13b在长度方向上越靠近底面宽度越宽(如图1B及图3的13b)。例如，壁部13b的上表面的宽度被设定为0.1mm左右，底面的宽度被设定为0.4mm左右。The wall portion 13b is connected to the pair of long side surfaces 13d in the vicinity of the substantially center of the long side surfaces 13d of the opening 13c. The width of the wall portion 13b becomes wider as it gets closer to the bottom surface in the length direction (as shown in FIG. 1B and 13b in FIG. 3 ). For example, the width of the upper surface of the wall portion 13 b is set to about 0.1 mm, and the width of the bottom surface is set to about 0.4 mm.
在开口13c的底面，引线框架12a，12b暴露，且配置有树脂底面13e，该树脂底面13e与开口13c的长度方向上的长侧面13d邻接且沿长度方向延伸。Lead frames 12a, 12b are exposed on the bottom of opening 13c, and resin bottom 13e is disposed adjacent to long side 13d in the longitudinal direction of opening 13c and extends in the longitudinal direction.
引线框架12a，12b在与壁部13b邻接的部位，以与开口13a的底面宽度相同的宽度暴露，其宽度从壁部13b开始朝向长度方向的末端部具有两种不同的宽度，即朝向长度方向的末端部宽度变窄。例如，宽度从0.4mm变窄为0.37mm，进而变窄为0.3mm。The lead frames 12a, 12b are exposed at the portion adjacent to the wall portion 13b with the same width as the width of the bottom surface of the opening 13a, and have two different widths from the wall portion 13b toward the end portion in the longitudinal direction, that is, in the longitudinal direction The width of the end part is narrowed. For example, the width narrows from 0.4mm to 0.37mm, and then narrows to 0.3mm.
另一方面，树脂底面13e的宽度从长度方向的末端部开始朝向壁部13b，不同，即朝向壁部13b宽度越窄，在接近壁部13b的开口13c的底面，树脂底面13e不存在，仅有引线框架12a，12b暴露。例如，宽度从0.05mm左右变窄为0.015mm左右。On the other hand, the width of the resin bottom surface 13e is different from the end portion in the longitudinal direction toward the wall portion 13b, that is, the narrower the width toward the wall portion 13b, the resin bottom surface 13e does not exist on the bottom surface of the opening 13c close to the wall portion 13b, and only There are lead frames 12a, 12b exposed. For example, the width narrows from about 0.05 mm to about 0.015 mm.
在开口13c内，在暴露于开口底面的引线框架12a，12b上分别载置发光元件11a，11b，引线框架12a，12b作为电极通过引线与发光元件的一侧电极连接。另外，发光元件11a，11b由跨过壁部13b的引线14电连接。Inside the opening 13c, the light-emitting elements 11a, 11b are respectively placed on the lead frames 12a, 12b exposed to the bottom of the opening. The lead frames 12a, 12b serve as electrodes and are connected to one side electrode of the light-emitting element through a lead. In addition, the light emitting elements 11a, 11b are electrically connected by the lead wire 14 straddling the wall part 13b.
引线14是直径18～30μm左右的由银合金制成的引线，特别是，在发光元件11a，11b的电极之间的接合中，引线14的最高部位偏向一侧的发光元件侧(参照图4A和图4B中的14)。特别是，在此所使用的发光元件的成为接合点的一侧的焊盘电极接近发光元件的外周设置，而另一侧的焊盘电极偏向发光元件的内侧设置，因此，接近发光元件11b外周的焊盘电极与偏向发光元件11a内侧的焊盘电极之间被引线接合。由此，引线14被引线接合后其形状相当于三角形的两边的形状，引线14的最高部位偏向被接合在接近外周设置的焊盘电极上的发光元件11b侧。The lead wire 14 is a lead wire made of a silver alloy with a diameter of about 18 to 30 μm. In particular, in the bonding between the electrodes of the light emitting elements 11a and 11b, the highest part of the lead wire 14 is biased toward the light emitting element side on one side (refer to FIG. 4A and 14) in Figure 4B. In particular, in the light-emitting element used here, the pad electrode on one side of the joint point is disposed close to the outer periphery of the light-emitting element, while the pad electrode on the other side is disposed inwardly of the light-emitting element, so it is close to the outer periphery of the light-emitting element 11b. The pad electrodes of the light-emitting element 11a are wire-bonded to the pad electrodes inwardly of the light-emitting element 11a. Thus, the shape of the lead wire 14 after wire bonding corresponds to the shape of both sides of a triangle, and the highest portion of the lead wire 14 is biased towards the side of the light emitting element 11b bonded to the pad electrode provided near the outer periphery.
虽然没有图示，但是该发光装置10具有保护元件，该保护元件与封装体13内的引线框架12a，12b电连接。保护元件可以是例如齐纳二极管，可以配置在搭载发光元件的引线框架12a，12b的一面的相反侧的面上。另外，优选与保护元件连接的引线配置在引线框架12a和引线框架12b之间的封装体内部。特别是，在壁部从引线框架之间配置到引线框架上的情况下，通过这样的配置，可以缩短与齐纳二极管连接的引线，且可以抑制引线被断开。此外，不易受到透光性树脂的热膨胀的影响，能够更好地防止齐纳二极管的剥离和弹性。Although not shown, this light emitting device 10 has a protection element electrically connected to the lead frames 12 a and 12 b inside the package 13 . The protection element may be, for example, a Zener diode, and may be arranged on the surface opposite to the surface of the lead frames 12a, 12b on which the light emitting element is mounted. In addition, it is preferable that the lead wires connected to the protection element are arranged inside the package between the lead frame 12a and the lead frame 12b. In particular, when the wall portion is arranged on the lead frame from between the lead frames, the lead wire connected to the Zener diode can be shortened and the lead wire can be prevented from being disconnected by such an arrangement. In addition, it is less likely to be affected by thermal expansion of the translucent resin, and it is possible to better prevent peeling and elasticity of the Zener diode.
在该发光装置中，在封装体的开口底面，引线框架的暴露部位和树脂的暴露部位以特定的宽度配置在特定的位置，如上所述，在开口侧面，封装体树脂和透光性树脂之间即使产生了剥离或者空隙，在它们的界面上不存在含银的金属部件，因此，金属部件不会暴露于从该空隙侵入的外部空气和水分等，可以有效地防止硫化。因此，可以避免金属部件的硫化导致的对来自发光元件的光的吸收，可以提供高亮度的发光装置。In this light-emitting device, on the bottom of the opening of the package, the exposed portion of the lead frame and the exposed portion of the resin are arranged at specific positions with a specific width. Even if peeling or voids occur between them, there is no silver-containing metal part on their interface, so the metal part will not be exposed to external air, moisture, etc. that intrude from the gap, and sulfidation can be effectively prevented. Therefore, absorption of light from the light-emitting element due to vulcanization of the metal member can be avoided, and a high-luminance light-emitting device can be provided.
另外，通过在开口内设置壁部，可以将开口内的空间分隔，因此，可以有效地缓和埋设在开口内的透光性树脂的热膨胀或者热收缩等引起对引线或发光元件等施加的应力。In addition, by providing the wall portion in the opening, the space in the opening can be partitioned, so the stress applied to the lead wire or light emitting element due to thermal expansion or thermal contraction of the translucent resin embedded in the opening can be effectively relieved.
换言之，该发光装置具有能够有效地防止在树脂和树脂，树脂和引线框架、引线等之间产生空隙的结构，因此可以阻止用于发光装置的含银金属部件的硫化，并且与该结构及作用相辅相成，能够得到更加有效地取出从发光元件射出的光的高亮度的发光装置。此外，由于这种发光装置实现了小型化和薄型化，因此提高了与其他电子设备的组合的自由度。In other words, the light-emitting device has a structure capable of effectively preventing gaps between resin and resin, resin and lead frame, lead wire, etc., and thus can prevent vulcanization of silver-containing metal parts used in the light-emitting device, and is compatible with the structure and effect Complementing each other, it is possible to obtain a high-brightness light-emitting device that more efficiently extracts light emitted from the light-emitting element. In addition, since such a light-emitting device is miniaturized and thinned, the degree of freedom in combination with other electronic equipment is improved.
工业实用性Industrial Applicability
本发明的发光装置作为发光元件搭载了例如发光二级管芯片，因此，作为从封装体侧面朝向侧面方向发光的类型的表面安装型发光装置，不仅可以应用于传真机、复印机、手持式扫描仪等中的图像读取装置的照明装置，还能够应用于照明用光源，LED显示器、便携式电话等的背光光源，红绿灯、照明开关、车载停车灯、各种传感器、各种指示灯等的各种照明装置。The light-emitting device of the present invention is equipped with, for example, a light-emitting diode chip as a light-emitting element. Therefore, as a surface-mounted light-emitting device that emits light from the side of the package toward the side, it can be applied not only to facsimile machines, copiers, and hand-held scanners. The lighting device of the image reading device among others, can also be applied to the light source for lighting, the backlight light source of LED display, mobile phone, etc., traffic lights, light switches, vehicle parking lights, various sensors, various indicator lights, etc. lighting fixtures.
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012-018763 | 2012-01-31 | ||
| JP2012018763 | 2012-01-31 |
| Publication Number | Publication Date |
|---|---|
| CN103227264A CN103227264A (en) | 2013-07-31 |
| CN103227264Btrue CN103227264B (en) | 2017-07-14 |
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310038443.5AActiveCN103227264B (en) | 2012-01-31 | 2013-01-31 | Light-emitting device |
| Country | Link |
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| CN (1) | CN103227264B (en) |
| DE (1) | DE102013201363A1 (en) |
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