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CN103188917A - Heat dissipation structure of heat dissipation device - Google Patents

Heat dissipation structure of heat dissipation device
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Publication number
CN103188917A
CN103188917ACN2011104555937ACN201110455593ACN103188917ACN 103188917 ACN103188917 ACN 103188917ACN 2011104555937 ACN2011104555937 ACN 2011104555937ACN 201110455593 ACN201110455593 ACN 201110455593ACN 103188917 ACN103188917 ACN 103188917A
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China
Prior art keywords
heat abstractor
section
chamber
radiator structure
heat
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Granted
Application number
CN2011104555937A
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Chinese (zh)
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CN103188917B (en
Inventor
杨修维
林志晔
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Asia Vital Components Co Ltd
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Asia Vital Components Co Ltd
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Priority to CN201110455593.7ApriorityCriticalpatent/CN103188917B/en
Publication of CN103188917ApublicationCriticalpatent/CN103188917A/en
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Abstract

The embodiment of the invention discloses a heat dissipation structure of a heat dissipation device, which comprises: a heat dissipation device body having a chamber, wherein the chamber is provided with at least one Whisker structure layer and a working fluid, the Whisker structure layer is disposed on the inner wall of the chamber, and the Whisker structure layer is disposed in the chamber to greatly increase the capillary phenomenon, thereby enhancing the vapor-liquid circulation efficiency of the working fluid in the heat dissipation device to enhance the heat transfer efficiency.

Description

The radiator structure of heat abstractor
Technical field
The present invention relates to a kind of radiator structure of heat abstractor, refer to a kind of radiator structure that promotes the heat abstractor of heat sink interior working fluid vapour-liquid cycle efficieny especially.
Background technology
Existing electronic equipment internal selects thermal transmission elements such as heat pipe, temperature-uniforming plate, loop circuit heat pipe, heat exchanger to carry out hot conduction work for stressing high cooling efficiency in a large number.
And its pyroconductivity of these thermal transmission elements is about several times to tens times of metals such as copper, aluminium and therefore suitable excellence is that quilt is applied to various hot countermeasure correlation machines with element as cooling.From shape, heat pipe can be divided into the heat pipe of heat pipe, flat pattern and the D type shape of round tube shape.In order to cool off CPU or other because carrying out the part to be cooled of e-machine that computing or work produce the electronic component etc. of heat, based on being installed on part to be cooled easily and can obtaining the viewpoint of broad contact area, also adopt temperature-uniforming plate or platypelloid type heat pipe or slim heat exchanger to dispel the heat.Along with miniaturization, the save spaceization of cooling body, in the situation of the cooling body that uses heat pipe, necessity of the utmost point slimming of being strict with this heat pipe is arranged more.
Described these thermal transmission element internal work fluids desire to carry out the vapour-liquid circulation time, its inner capillary structure (groove, metal grill body structure, sintering structure etc.) that needs setting to have capillary force makes to make working fluid be able to carry out in this thermal transmission element smoothly the work of vapour-liquid circulation.
If these thermal transmission elements need be used in comparatively narrow part, then certainly will make slimming, capillary structure that should inside then will be except the thickness problem of thermal transmission element own, makes this thermal transmission element can't make the main problem of slimming.
Moreover the capillary structure of making after the slimming then can be because its capillary force after the slimming also descends, influence within this thermal transmission element working fluid vapour-liquid cycle efficieny and then make heat conduction efficiency significantly reduce, so known techniques has following shortcoming:
1, hot transfer efficiency is not good;
2, the thermal transmission element slimming is limited.
Summary of the invention
Therefore, for effectively solving the above problems, main purpose of the present invention is that a kind of radiator structure that promotes the heat abstractor of heat conduction and radiating efficiency is provided.
Another purpose of the present invention system provides a kind of radiator structure of heat abstractor of its internal work fluid vapour-liquid circulation of heat abstractor that promotes slimming.
For reaching above-mentioned purpose, the present invention system provides the radiator structure of a heat abstractor, system comprises: a heat abstractor body has a chamber, and described chamber is provided with at least one palpus crystal structure layer and a working fluid, and brilliant (Whisker) structure sheaf of this palpus extends is located at this chamber inner wall.
It is wherein arbitrary that described heat abstractor body series can be heat pipe and loop circuit heat pipe and flat plate heat tube and temperature-uniforming plate and heat exchanger.
Described palpus crystal structure series of strata can significantly promote the efficient of the vapour-liquid circulation of this heat abstractor body interior working fluid, and because of its structure careful, still can keep its capillary force when making this heat abstractor slimming, make the smooth vapour-liquid circulation of heat abstractor body interior working fluid.
Description of drawings
In order to be illustrated more clearly in the embodiment of the invention or technical scheme of the prior art, to do to introduce simply to the accompanying drawing of required use in embodiment or the description of the Prior Art below, apparently, accompanying drawing in describing below only is some embodiments of the present invention, for those of ordinary skills, under the prerequisite of not paying creative work, can also obtain other accompanying drawing according to these accompanying drawings.
Fig. 1 is the stereogram of radiator structure first embodiment of the heat abstractor of the embodiment of the invention;
Fig. 2 is the A-A cutaway view of radiator structure first embodiment of the heat abstractor of the embodiment of the invention;
Fig. 2 A is the enlarged drawing of 2A portion among Fig. 2;
Fig. 3 is the cutaway view of radiator structure second embodiment of the heat abstractor of the embodiment of the invention;
Fig. 4 is the cutaway view of radiator structure the 3rd embodiment of the heat abstractor of the embodiment of the invention;
Fig. 5 is the cutaway view of radiator structure the 4th embodiment of the heat abstractor of the embodiment of the invention;
Fig. 6 is the cutaway view of radiator structure the 5th embodiment of the heat abstractor of the embodiment of the invention;
Fig. 7 is the cutaway view of radiator structure the 6th embodiment of the heat abstractor of the embodiment of the invention;
Fig. 8 is the cutaway view of radiator structure the 7th embodiment of the heat abstractor of the embodiment of the invention;
Fig. 9 is the cutaway view of radiator structure the 8th embodiment of the heat abstractor of the embodiment of the invention;
Figure 10 is the cutaway view of radiator structure the 9th embodiment of the heat abstractor of the embodiment of the invention;
Figure 11 A-11D is the striograph of the palpuscrystal structure layer 111 scanning type electron microscope of the embodiment of the invention.
[primary clustering symbol description]
Heatabstractor body 1
Chamber 11
Mustcrystal structure layer 111
Workingfluid 112
First section 113
Second section 114
The3rd section 115
Platedfilm 2
Capillary structure 3
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the invention, the technical scheme in the embodiment of the invention is clearly and completely described, obviously, described embodiment is the present invention's part embodiment, rather than whole embodiment.Based on the embodiment among the present invention, those of ordinary skills belong to the scope of protection of the invention not making the every other embodiment that obtains under the creative work prerequisite.
See also Fig. 1, Fig. 2, shown in Fig. 2 A, be solid and the A-A cutaway view of radiator structure first embodiment of the present invention's heat abstractor, the radiator structure of described heat abstractor, system comprises: one has theheat abstractor body 1 of achamber 11, describedchamber 11 is provided with at least one palpuscrystal structure layer 111 and a workingfluid 112, this palpuscrystal structure layer 111 is that complete or local extension is arranged in thischamber 11 inwalls, this palpuscrystal structure layer 111 must be made of by brilliant monomer plural number, one of brilliant monomer of this palpus end is that fixed end is arranged on thesechamber 11 inwalls, its other end extends to form free end towardschamber 11 inside, and this free end is sharp shape person.
Describedheat abstractor body 1 is that temperature-uniforming plate and flat plate heat tube and loop circuit heat pipe and heat exchanger are wherein arbitrary, this creation system with flat plate heat tube as an illustration but do not regard it as and be limited, and describedchamber 11 inwalls are level and smooth wall.
See also shown in Figure 3, it is the cutaway view of radiator structure second embodiment of the present invention's heat abstractor, present embodimentheat abstractor body 1 is that this palpuscrystal structure layer 111 extends axiallychamber 11 inwalls of being located at this heat pipe with heat pipe as an illustration but do not regard it as and be limited.
See also shown in Figure 4, it is the cutaway view of radiator structure the 3rd embodiment of the present invention's heat abstractor, as shown in the figure, present embodimentheat abstractor body 1 is with heat pipe as an illustration but do not regard it as and be limited, describedchamber 11 has more at least onefirst section 113 and onesecond section 114 and one the3rd section 115, described first, two, three sections 113,114,115 interconnect, described mustcrystal structure layer 111 be to select to be arranged at describedfirst section 113,second section 114 and the3rd section 115 are wherein arbitrary, present embodiment system must only be arranged at thissecond section 114 bycrystal structure layer 111, is not limited but do not regard it as.
See also shown in Figure 5, it is the cutaway view of radiator structure the 4th embodiment of the present invention's heat abstractor, present embodiment system is identical with aforementioned the 3rd embodiment part-structure, so will repeat no more at this, only not existing together of present embodiment and aforementioned the 3rd embodiment is that describedchamber 11 is more established and had a plated film 2 (characteristic with Superhydrophilic and super-hydrophobicity), thisplated film 2 is that to select to be arranged at describedfirst section 113 andsecond section 114 and the3rd section 115 wherein arbitrary, and this platedfilm 2 of present embodiment is to be arranged at the3rd section 115.
See also shown in Figure 6, it is the cutaway view of radiator structure the 5th embodiment of the present invention's heat abstractor, present embodiment system is identical with aforementioned the 4th embodiment part-structure, so will repeat no more at this, only present embodiment and not existing together of aforementioned the 4th embodiment are that describedchamber 11 has more aplated film 2, and thisplated film 2 is arranged at describedfirst section 113 and the3rd section 115 or wherein arbitrary simultaneously.
See also shown in Figure 7, it is the cutaway view of radiator structure the 6th embodiment of the present invention's heat abstractor, present embodiment system is identical with the aforementioned first embodiment part-structure, so will repeat no more at this, only present embodiment and not existing together of aforementioned first embodiment are that describedchamber 11 inwalls and this 111 on palpus crystal structure layer have more acapillary structure 3, describedcapillary structure 3 is wherein arbitrary or its addition group in twos of sintered powder and grid body and corpus fibrosum and cellular structure body and groove, present embodiment system with groove as an illustration but do not regard it as and be limited, described groove is arranged with in thischamber 11 inwalls, and this palpuscrystal structure layer 111 drapes over one's shoulders simultaneously and invests this groove andchamber 11 inwalls.
See also shown in Figure 8, it is the cutaway view of radiator structure the 7th embodiment of the present invention's heat abstractor, present embodiment system is identical with the aforementioned first embodiment part-structure, so will repeat no more at this, only present embodiment and not existing together of aforementioned first embodiment are that describedchamber 11 inwalls and this 111 on palpus crystal structure layer have more aplated film 2.
See also shown in Figure 9, it is the cutaway view of radiator structure the 8th embodiment of the present invention's heat abstractor, present embodiment system is identical with the aforementioned first embodiment part-structure, so will repeat no more at this, only present embodiment and not existing together of aforementioned first embodiment are that describedchamber 11 has more at least onefirst section 113 and onesecond section 114 and one the3rd section 115, described first, second and third section 113,114,115 interconnects, and the palpuscrystal structure layer 111 on described second section is that distribution is closeer.
See also shown in Figure 10, it is the cutaway view of radiator structure the 9th embodiment of the present invention's heat abstractor, present embodiment system is identical with the aforementioned first embodiment part-structure, so will repeat no more at this, only present embodiment and not existing together of aforementioned first embodiment are that describedchamber 11 has more at least onefirst section 113 and onesecond section 114 and one the3rd section 115, described first, two, three sections 113,114,115 interconnect, and described first, threesections 113, palpuscrystal structure layer 111 on 115 be closeer or first and three sections of distribution wherein the palpuscrystal structure layer 111 on arbitrary section be the closeer person of distribution.In this heat pipe and temperature-uniforming plate and flat plate heat tube and loop circuit heat pipe its inside being arranged mustcrystal structure layer 111, this palpuscrystal structure layer 111 is can change this workingfluid 112 in the surface tension of its inside, accelerate back-flow velocity and have splendid vapour-liquid cycle efficieny, use and significantly promote heat biography effect able one, described mustcrystal structure layer 111 be to consult shown in Figure 11 A-Figure 11 D, be the striograph of palpuscrystal structure layer 111 scanning type electron microscope, described mustcrystal structure layer 111 be can drape over one's shoulders to invest on another capillary structure.
Through the above description of the embodiments, those skilled in the art can be well understood to the present invention and can realize by hardware, also can realize by the mode that software adds necessary general hardware platform, based on such understanding, technical scheme of the present invention can embody with the form of software product, it (can be CD-ROM that this software product can be stored in a non-volatile memory medium, USB flash disk, portable hard drive etc.) in, comprise that some instructions are with so that a computer equipment (can be personal computer, server, the perhaps network equipment etc.) carry out the described method of each embodiment of the present invention.
In a word, the above is preferred embodiment of the present invention only, is not for limiting protection scope of the present invention.Within the spirit and principles in the present invention all, any modification of doing, be equal to replacement, improvement etc., all should be included within protection scope of the present invention.

Claims (12)

CN201110455593.7A2011-12-302011-12-30 Heat dissipation structure of heat dissipation deviceActiveCN103188917B (en)

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CN201110455593.7ACN103188917B (en)2011-12-302011-12-30 Heat dissipation structure of heat dissipation device

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Application NumberPriority DateFiling DateTitle
CN201110455593.7ACN103188917B (en)2011-12-302011-12-30 Heat dissipation structure of heat dissipation device

Publications (2)

Publication NumberPublication Date
CN103188917Atrue CN103188917A (en)2013-07-03
CN103188917B CN103188917B (en)2017-03-01

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Citations (9)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US3842474A (en)*1972-11-211974-10-22H SchladitzHeat transfer between solids and fluids utilizing polycrystalline metal whiskers
US4015659A (en)*1974-06-101977-04-05Schladitz Hermann JHeat pipe
CN1707783A (en)*2004-06-072005-12-14鸿富锦精密工业(深圳)有限公司 A kind of heat pipe and its manufacturing method
CN1834569A (en)*2005-03-192006-09-20富准精密工业(深圳)有限公司Heat pipe, heat pipe multiporous structure and its mfg. method
JP2006348346A (en)*2005-06-162006-12-28Nissan Motor Co Ltd Water-absorbing material, heat conducting member, and manufacturing method thereof
TW200702622A (en)*2005-07-072007-01-16Ind Tech Res InstA heat pipe element with a capillary structure of different-sized holes in multiple stages
CN101410685A (en)*2006-03-032009-04-15伊路米耐克斯公司Heat pipe with nanotstructured wicking material
CN101684988A (en)*2008-09-262010-03-31和硕联合科技股份有限公司Temperature-equalizing plate with shoveled fin structure and manufacturing method thereof
CN202565639U (en)*2011-12-302012-11-28奇鋐科技股份有限公司 Heat dissipation structure of heat dissipation device

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US3842474A (en)*1972-11-211974-10-22H SchladitzHeat transfer between solids and fluids utilizing polycrystalline metal whiskers
US4015659A (en)*1974-06-101977-04-05Schladitz Hermann JHeat pipe
CN1707783A (en)*2004-06-072005-12-14鸿富锦精密工业(深圳)有限公司 A kind of heat pipe and its manufacturing method
CN1834569A (en)*2005-03-192006-09-20富准精密工业(深圳)有限公司Heat pipe, heat pipe multiporous structure and its mfg. method
JP2006348346A (en)*2005-06-162006-12-28Nissan Motor Co Ltd Water-absorbing material, heat conducting member, and manufacturing method thereof
TW200702622A (en)*2005-07-072007-01-16Ind Tech Res InstA heat pipe element with a capillary structure of different-sized holes in multiple stages
CN101410685A (en)*2006-03-032009-04-15伊路米耐克斯公司Heat pipe with nanotstructured wicking material
CN101684988A (en)*2008-09-262010-03-31和硕联合科技股份有限公司Temperature-equalizing plate with shoveled fin structure and manufacturing method thereof
CN202565639U (en)*2011-12-302012-11-28奇鋐科技股份有限公司 Heat dissipation structure of heat dissipation device

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