技术领域technical field
本发明涉及复合材料加工领域，具体是一种利用皮秒激光在碳化硅陶瓷基复合材料上加工孔的方法The invention relates to the field of composite material processing, in particular to a method for processing holes on silicon carbide ceramic matrix composite materials by using a picosecond laser
背景技术Background technique
连续纤维增韧碳化硅陶瓷基复合材料（CMC-SiC）是一种新型战略性高温结构材料。与钛合金、高温合金和金属间化合物相比，CMC-SiC材料热膨胀系数更低，抗高低周期疲劳和抗热震疲劳更优异；同时具有耐烧蚀，抗冲刷，动态和静态摩擦系数高且摩擦系数对湿度不敏感等一系列优异性能。此外，CMC-SiC材料可以有效提高发动机的工作温度和降低结构重量，在高推重比航空发动机具有广泛的应用前景。Continuous fiber toughened silicon carbide ceramic matrix composite (CMC-SiC) is a new strategic high-temperature structural material. Compared with titanium alloys, superalloys and intermetallic compounds, CMC-SiC materials have lower thermal expansion coefficients, better resistance to high and low cycle fatigue and thermal shock fatigue; at the same time, they have ablation resistance, erosion resistance, high dynamic and static friction coefficients and A series of excellent properties such as friction coefficient is not sensitive to humidity. In addition, CMC-SiC materials can effectively increase the operating temperature of the engine and reduce the structural weight, and have broad application prospects in high thrust-to-weight ratio aeroengines.
但是，由于CMC-SiC材料硬度高（SiC硬度仅次于金刚石和立方氮化硼），在使用中很难加工。目前采用特种金刚石刀具在制造过程中进行在线加工，解决了CMC-SiC材料切割、打磨、抛光等基本加工技术问题，但加工成本高，加工效率低。另外，在实际应用过程中，经常需要加工微小冷却孔（<Φ1.0mm）以进一步提高CMC-SiC材料的使用温度和可靠性，如航空涡扇发动机叶片等构件，然而目前尚无法在CMC-SiC材料上加工小于Φ2.0mm的孔，尤其是带角度的冷却孔，影响了CMC-SiC材料的应用效果。因此，迫切需要采用新型加工技术，解决CMC-SiC材料孔加工问题。However, due to the high hardness of CMC-SiC material (SiC hardness is second only to diamond and cubic boron nitride), it is difficult to process in use. At present, special diamond tools are used for online processing in the manufacturing process, which solves the basic processing technical problems such as cutting, grinding, and polishing of CMC-SiC materials, but the processing cost is high and the processing efficiency is low. In addition, in the actual application process, it is often necessary to process tiny cooling holes (<Φ1.0mm) to further improve the service temperature and reliability of CMC-SiC materials, such as aviation turbofan engine blades and other components, but it is not yet possible to use CMC-SiC The processing of holes smaller than Φ2.0mm on SiC materials, especially the angled cooling holes, affects the application effect of CMC-SiC materials. Therefore, it is urgent to adopt new processing technology to solve the hole processing problem of CMC-SiC material.
由于预制体是以纤维束的形式进行编制的，CVI制备的纤维增韧碳化硅陶瓷基复合材料具有显著的束结构显微特征(附图1)。研究表明，这种束结构特征使纤维增韧碳化硅陶瓷基复合材料表现出显著的非均匀复合材料效应，是纤维复合材料具有高性能的重要原因。Since the prefabricated body is woven in the form of fiber bundles, the fiber-reinforced silicon carbide ceramic matrix composites prepared by CVI have remarkable bundle structure microscopic characteristics (Fig. 1). Studies have shown that this bundle structure feature makes fiber-toughened silicon carbide ceramic matrix composites exhibit a significant heterogeneous composite effect, which is an important reason for the high performance of fiber composites.
美国专利（US5656186，US8171937）和欧洲专利（US2012196454）等已经发明了材料皮秒激光的加工方法，其通过选择合适的激光系统和加工参数对半导体材料和生物材料等进行加工，可以减少熔融区、热损伤及微裂纹的产生。但是，该方法不能完全适用于碳化硅陶瓷基复合材料的孔加工。Wenqian Hu等研究人员在Journal ofManufacturing Science and Engineering,132,011009(2010)中发表的论文“Micromachining of metals,alloys,and ceramics by picosecond laser ablation”中对皮秒激光孔加工SiC/SiC复合材料进行了简单的介绍。公开在Applied Physics A,(2012)的文章“Ultra-short pulse laser deep drilling of C/SiC composites in air”中对超短脉冲孔加工C/SiC复合材料加工效果进行了简单分析。但是，两篇文章中均未涉及到具体的加工方式。US patents (US5656186, US8171937) and European patents (US2012196454) have invented picosecond laser processing methods for materials, which can reduce melting zones, thermal damage and micro-cracks. However, this method cannot be fully applied to the hole machining of SiC ceramic matrix composites. In the paper "Micromachining of metals, alloys, and ceramics by picosecond laser ablation" published by Wenqian Hu and other researchers in Journal of Manufacturing Science and Engineering, 132, 011009 (2010), the picosecond laser hole processing of SiC/SiC composite materials was carried out. brief introduction. In the article "Ultra-short pulse laser deep drilling of C/SiC composites in air" published in Applied Physics A, (2012), a simple analysis was made on the processing effect of ultra-short pulse hole processing C/SiC composites. However, the specific processing methods are not involved in the two articles.
发明内容Contents of the invention
为克服现有技术中存在的尚无法在CMC-SiC材料上加工小于Φ2.0mm的孔，尤其是带角度的冷却孔，影响了CMC-SiC材料的应用效果的不足，本发明提出了一种利用皮秒激光加工孔的方法，In order to overcome the disadvantages existing in the prior art that holes smaller than Φ2.0mm cannot be processed on CMC-SiC materials, especially cooling holes with angles, which affect the application effect of CMC-SiC materials, the present invention proposes a The method of processing holes by picosecond laser,
步骤1，试样表面清洗。将碳化硅陶瓷基复合材料切割为块状试样；在酒精浸泡下超声清洗试样15min；干燥后得到清洗后的碳化硅陶瓷基复合材料试样。Step 1, the surface of the sample is cleaned. The silicon carbide ceramic matrix composite material was cut into block samples; the sample was ultrasonically cleaned for 15 minutes under alcohol immersion; and the cleaned silicon carbide ceramic matrix composite material sample was obtained after drying.
步骤2，加工孔。所述的孔是圆形孔或方形孔；通过皮秒激光对碳化硅陶瓷基复合材料试样进行微加工。微加工中，皮秒激光波长为355～532nm，脉冲宽度为1～10ps，激光输出功率根据微加工的过程变化，其激光输出功率的变化范围为20mw～20w，激光重复频率根据微加工的过程变化，其激光重复频率的变化范围为1～600kHz。对试样采用逐层去除方式进行加工，加工头转速为1000转/秒。Step 2, machining holes. The hole is a circular hole or a square hole; the silicon carbide ceramic matrix composite material sample is micromachined by a picosecond laser. In micromachining, the wavelength of the picosecond laser is 355-532nm, the pulse width is 1-10ps, the laser output power varies according to the micromachining process, and the laser output power ranges from 20mw to 20w, and the laser repetition rate depends on the micromachining process The laser repetition frequency ranges from 1 to 600kHz. The sample is processed by layer-by-layer removal, and the speed of the processing head is 1000 rpm.
加工孔的具体过程是：使皮秒激光束通过物镜聚焦在碳化硅陶瓷基复合材料试样表面上待加工孔的中心处，焦距为100mm。The specific process of processing the hole is as follows: the picosecond laser beam is focused on the center of the hole to be processed on the surface of the silicon carbide ceramic matrix composite material sample through the objective lens, and the focal length is 100mm.
对试样进行加工。所述加工过程分为三步：Process the sample. The process is divided into three steps:
第一步，预成形孔。所述预成形孔的孔径为成形孔孔径的85～90%，采用逐层切除方式加工，直至贯通。In the first step, the holes are preformed. The diameter of the pre-formed hole is 85-90% of the diameter of the formed hole, and it is processed by layer-by-layer cutting until it penetrates.
第二步，消除预成形孔中的锥度。采用沿所述预成形孔轴线方向逐层切除的方式消除预成形孔中的锥度，并通过消除预成形孔中的锥度，使预成形孔的孔径达到成形孔孔径的95～98%。In the second step, the taper in the preformed hole is eliminated. The taper in the pre-formed hole is eliminated by layer-by-layer cutting along the axial direction of the pre-formed hole, and the aperture of the pre-formed hole reaches 95-98% of the aperture of the formed hole by eliminating the taper in the pre-formed hole.
第三步，成孔。对所述消除锥度的预成形孔表面进行逐层加工，并消除所述消除锥度的预成形孔壁上的氧化层，得到成孔。The third step is to form a hole. The surface of the preformed hole whose taper is eliminated is processed layer by layer, and the oxide layer on the wall of the preformed hole whose taper is eliminated is eliminated to obtain a hole.
加工中，相邻皮秒激光路径之间的间距为0.01～0.1mm；每层的加工深度为5～20μm。During processing, the distance between adjacent picosecond laser paths is 0.01-0.1 mm; the processing depth of each layer is 5-20 μm.
步骤3，清洗：将得到的皮秒激光微加工成形的圆孔置于酒精中超声清洗试样15min，清除表面及孔壁残存碎屑。Step 3, cleaning: put the obtained circular hole formed by picosecond laser micromachining into alcohol and ultrasonically clean the sample for 15 minutes to remove residual debris on the surface and hole wall.
当加工圆孔时，以螺旋状路径逐层加工。When processing a round hole, it is processed layer by layer in a spiral path.
当加工方孔时，以线性扫描路径逐层加工。When processing a square hole, it is processed layer by layer with a linear scanning path.
本发明根据纤维复合材料的特点，结合皮秒激光极高的峰值功率使其对材料无选择性的加工特征，在CMC-SiC材料上实现孔加工。According to the characteristics of the fiber composite material, the invention realizes hole processing on the CMC-SiC material in combination with the extremely high peak power of the picosecond laser making it non-selective to the material.
本发明的主要优点是：（1）适用于高深径比微孔的加工，成形质量好，加工成形后经过简单清洗后表面较光滑，无需其他的后续处理。附图2为本发明所成形的2DCVI C/SiC复合材料圆孔的SEM照片及所成形孔的纵向截面图，其中图2a为所成形孔的入口，图2b为所成形孔的出口，图2c为成形孔的纵向截面图。该孔的孔径为650μm，深度为3mm。从图2中能够看出，所成形的孔入口圆度为100%，出口圆度为94%。经清洗后，加工孔入口边缘无烧蚀。从图2c中可知，加工孔深度方向为较为规则柱形孔，孔内壁较光滑。（2）试样放置在加工平台上进行加工。加工可设计性好，可根据需要对微加工形状及尺寸设计和加工，更适用于加工孔径小于1.0mm的圆形孔和边长小于1.0mm方形孔。（3）复合材料表现出显著的非均匀复合材料效应加工。不用考虑微小裂纹的影响，稳定性较好，尤其适用于大批量重复性微孔加工。The main advantages of the present invention are: (1) It is suitable for the processing of micropores with high depth-to-diameter ratio, and the forming quality is good. Accompanying drawing 2 is the SEM photo of the formed 2DCVI C/SiC composite material circular hole of the present invention and the longitudinal sectional view of the formed hole, wherein Fig. 2a is the entrance of the formed hole, Fig. 2b is the outlet of the formed hole, and Fig. 2c Longitudinal cross-sectional view of the shaped hole. The hole has a diameter of 650 μm and a depth of 3 mm. It can be seen from Figure 2 that the roundness of the formed hole entrance is 100%, and the exit roundness is 94%. After cleaning, there is no ablation at the entrance edge of the machined hole. It can be seen from Figure 2c that the depth direction of the processed hole is a relatively regular cylindrical hole, and the inner wall of the hole is relatively smooth. (2) The sample is placed on the processing platform for processing. The processing can be designed well, and the micro-machining shape and size can be designed and processed according to the needs. It is more suitable for processing circular holes with a diameter of less than 1.0mm and square holes with a side length of less than 1.0mm. (3) Composite materials exhibit significant inhomogeneous composite effect processing. It does not need to consider the influence of tiny cracks, and has good stability, especially suitable for large-scale repetitive micro-hole processing.
本发明能够对CMC-SiC材料进行圆孔或方形孔加工，具有加工工艺稳定性好、可设计性强、精度高等优点。The invention can process round holes or square holes on the CMC-SiC material, and has the advantages of good processing technology stability, strong designability, high precision and the like.
附图说明Description of drawings
附图1是CVI制备纤维编织体碳化硅陶瓷基复合材料的微结构特征。Accompanying drawing 1 is the microstructural characteristic of fiber braid silicon carbide ceramic matrix composite material prepared by CVI.
附图2是实施例1中加工的圆孔的微结构特征，其中，图2a是孔的入口；图2b是孔的出口，图2c是圆孔的轴向截面图。Accompanying drawing 2 is the microstructural feature of the circular hole processed in embodiment 1, wherein, Fig. 2 a is the inlet of hole; Fig. 2 b is the outlet of hole, and Fig. 2 c is the axial sectional view of circular hole.
附图3是实施例2中加工方孔的微结构特征。Accompanying drawing 3 is the microstructural characteristic of processing square hole in embodiment 2.
附图4是本发明的流程图。Accompanying drawing 4 is flow chart of the present invention.
具体实施方式Detailed ways
实施例1Example 1
本实施例提出的成形圆孔的方法适用于碳化硅陶瓷基复合材料，本实施例中仅以C/SiC复合材料试样为例说明。所成形孔的直径为650μm。The method for forming round holes proposed in this embodiment is suitable for silicon carbide ceramic matrix composite materials, and in this embodiment only a C/SiC composite material sample is used as an example for illustration. The diameter of the formed pores was 650 μm.
本实施例中，所使用的皮秒激光器采用立陶宛Light Conversion公司的Nd：YAG皮秒激光器。In this embodiment, the picosecond laser used is an Nd:YAG picosecond laser from Light Conversion Company of Lithuania.
本实施例的具体过程是：The concrete process of this embodiment is:
步骤1，试样表面清洗。将2D CVI C/SiC复合材料切割为20mm×10mm×3mm的矩形块状试样，然后在酒精浸泡下超声清洗试样15min去除表面灰尘油污等杂质，最后用烘干箱进行干燥，得到清洗后的试样。Step 1, the surface of the sample is cleaned. Cut the 2D CVI C/SiC composite material into a rectangular block sample of 20mm×10mm×3mm, then ultrasonically clean the sample for 15 minutes under alcohol immersion to remove surface dust, oil and other impurities, and finally dry it in a drying oven to obtain of samples.
步骤2，加工孔。通过皮秒激光对2D CVI C/SiC复合材料试样进行微加工。加工中，皮秒激光波长为355～532nm，脉冲宽度为1～10ps，激光输出功率根据微加工的过程变化，其激光输出功率的变化范围为20mw～20w，激光重复频率根据微加工的过程变化，其激光重复频率的变化范围为1～600kHz。对试样采用逐层去除方式进行旋切圆孔加工，加工头转速为1000转/秒。本实施例中，皮秒激光波长为532nm，脉冲宽度为6.8ps，激光输出功率的变化范围为311mw～19.5w，激光重复频率的变化范围为32～400kHz。Step 2, machining holes. Micromachining of 2D CVI C/SiC composite samples by picosecond laser. During processing, the wavelength of the picosecond laser is 355-532nm, the pulse width is 1-10ps, the laser output power varies according to the process of micro-processing, and the range of the laser output power is 20mw-20w, and the laser repetition rate changes according to the process of micro-processing , the range of the laser repetition frequency is 1 ~ 600kHz. The sample is processed by rotary cutting circular hole by layer-by-layer removal method, and the processing head speed is 1000 rpm. In this embodiment, the wavelength of the picosecond laser is 532 nm, the pulse width is 6.8 ps, the laser output power ranges from 311 mw to 19.5 w, and the laser repetition frequency ranges from 32 to 400 kHz.
具体过程是：将清洗后的试样放置在所使用的皮秒激光器对应的加工平台上，并使皮秒激光束通过物镜聚焦在C/SiC复合材料试样表面上待加工孔的中心处，焦距为100mm。The specific process is: place the cleaned sample on the processing platform corresponding to the picosecond laser used, and focus the picosecond laser beam on the center of the hole to be processed on the surface of the C/SiC composite sample through the objective lens, The focal length is 100mm.
在2D CVI C/SiC复合材料试样上加工孔。所述加工过程分为三步：Machining holes in 2D CVI C/SiC composite specimens. The process is divided into three steps:
第一步，预成形孔。所述预成形孔的孔径为成形孔孔径的85%，采用沿所述预成形孔轴线方向逐层切除方式加工。加工第一层时，以待成形孔中心为激光束起点，通过皮秒激光将C/SiC复合材料试样表面切除，并以螺旋状路径将切除的试样表面逐渐扩大至预定的孔径。将激光束移至待成形孔的中心，继续以螺旋状路径加工第二层，直至第二层逐渐扩大至预定的孔径。重复上述过程，直至形成预成形的通孔。所成形孔具有锥度，这是由于皮秒激光能量高斯分布的特征及微孔直径内碎屑对激光的反作用能力所决定的。In the first step, the holes are preformed. The aperture of the preformed hole is 85% of the aperture of the formed hole, which is processed by layer-by-layer cutting along the axial direction of the preformed hole. When processing the first layer, the center of the hole to be formed is used as the starting point of the laser beam, and the surface of the C/SiC composite sample is excised by a picosecond laser, and the surface of the excised sample is gradually enlarged to the predetermined aperture in a spiral path. Move the laser beam to the center of the hole to be formed, and continue to process the second layer in a helical path until the second layer gradually expands to the predetermined hole diameter. The above process is repeated until a preformed through hole is formed. The formed hole has a taper, which is determined by the characteristics of the Gaussian distribution of the picosecond laser energy and the reaction ability of the debris in the diameter of the microhole to the laser.
预成形中，激光输出功率为19.5w，重复频率为400kHz；当激光束螺旋状路径加工时，相邻螺旋线之间的间距为0.05mm；在逐层加工中，每层的加工深度为20μm。In preforming, the laser output power is 19.5w, and the repetition frequency is 400kHz; when the laser beam is processed in a spiral path, the distance between adjacent spiral lines is 0.05mm; in layer-by-layer processing, the processing depth of each layer is 20μm .
第二步，消除预成形孔中的锥度。通过消除预成形孔中的锥度，使预成形孔的孔径达到成形孔孔径的95%。采用沿所述预成形孔轴线方向逐层切除的方式消除预成形孔中的锥度。在消除预成形孔中的锥度时，激光束自所述预成形孔孔口处的内表面开始，以螺旋状路径切除的所述预成形孔孔口处的内表面，使预成形孔的孔径达到成形孔孔径的95%，完成第一层加工。将激光束移至预成形孔内表面，继续以螺旋状路径加工第二层，直至第二层逐渐扩大至预定的孔径。重复上述过程，直至消除预成形孔中的锥度，并使预成形孔的孔径达到成形孔孔径的95%。在消除预成形孔中的锥度中，在预成形孔的孔壁形成氧化层，本实施例中，所述氧化层厚度为20～30μm。In the second step, the taper in the preformed hole is eliminated. By eliminating the taper in the preformed hole, the preformed hole diameter reaches 95% of the formed hole diameter. The taper in the pre-formed hole is eliminated by layer-by-layer cutting along the axial direction of the pre-formed hole. When eliminating the taper in the preformed hole, the laser beam starts from the inner surface at the orifice of the preformed hole, cuts off the inner surface at the orifice of the preformed hole with a helical path, and makes the aperture of the preformed hole Reach 95% of the forming hole diameter and complete the first layer of processing. Move the laser beam to the inner surface of the preformed hole and continue to process the second layer in a helical path until the second layer gradually expands to the predetermined hole diameter. Repeat the above process until the taper in the pre-formed hole is eliminated and the diameter of the pre-formed hole reaches 95% of the diameter of the formed hole. In eliminating the taper in the preformed hole, an oxide layer is formed on the wall of the preformed hole, and in this embodiment, the thickness of the oxide layer is 20-30 μm.
在消除预成形孔中的锥度时，激光输出功率17.5w，重复频率400kHz；当激光束螺旋状路径径向加工时，相邻螺旋线之间的间距为0.05mm；在逐层加工中，每层的加工深度为18μm。When eliminating the taper in the pre-formed hole, the laser output power is 17.5w, and the repetition frequency is 400kHz; when the laser beam is processed radially in a helical path, the distance between adjacent helixes is 0.05mm; in layer-by-layer processing, each The processing depth of the layer is 18 μm.
第三步，成孔。对消除锥度的预成形孔中进行成孔的皮秒激光微加工，并消除所述消除锥度的预成形孔壁上的氧化层。在成孔中，激光束对所述消除锥度的预成形孔表面进行逐层加工，光束自所述预成形孔孔口处内壁的氧化层表面开始，采用环形方式切除孔壁，并去除所述预成形孔孔口处内壁的氧化层，使所述预成形孔的孔径达到成孔的要求，完成第一层加工。激光束沿所述预成形孔的轴向下移5μm，继续采用环形方式切除孔壁，并去除所述预成形孔内壁上的氧化层，完成第二层加工。重复上述过程，直至将所述预成形孔的孔径达到成孔的要求，得到皮秒激光微加工成形的圆孔。The third step is to form a hole. Carry out picosecond laser micromachining for hole formation in the pre-formed hole that eliminates the taper, and eliminate the oxide layer on the wall of the pre-formed hole that eliminates the taper. In hole forming, the laser beam processes the surface of the pre-formed hole that eliminates the taper layer by layer. The beam starts from the surface of the oxide layer on the inner wall of the pre-formed hole, cuts off the hole wall in a circular manner, and removes the The oxide layer on the inner wall at the opening of the preformed hole makes the aperture of the preformed hole meet the requirement of hole formation, and completes the first layer of processing. The laser beam moves down 5 μm along the axial direction of the preformed hole, continues to cut off the hole wall in a circular manner, and removes the oxide layer on the inner wall of the preformed hole to complete the second layer of processing. The above process is repeated until the diameter of the pre-formed hole meets the requirement for hole formation, and a circular hole formed by picosecond laser micromachining is obtained.
成孔加工中，激光输出功率为311mw，重复频率为32kHz；在逐层加工中，每层的加工深度为5μm。In the hole-forming process, the laser output power is 311mw, and the repetition frequency is 32kHz; in the layer-by-layer processing, the processing depth of each layer is 5μm.
步骤3，清洗。将得到的皮秒激光加工成形的圆孔置于酒精中超声清洗试样15min，去除表面及孔壁残存碎屑。Step 3, cleaning. Place the obtained picosecond laser-processed circular hole in alcohol to ultrasonically clean the sample for 15 minutes to remove residual debris on the surface and hole wall.
实施例2Example 2
本实施例提出的成形方孔的方法适用于碳化硅陶瓷基复合材料，本实施例中仅以SiC/SiC复合材料试样为例说明。所成形孔的平面尺寸为：650μm*650μm。The method for forming square holes proposed in this embodiment is suitable for silicon carbide ceramic matrix composite materials, and this embodiment only uses SiC/SiC composite material samples as an example for illustration. The plane size of the formed hole is: 650μm*650μm.
本实施例中，所使用的皮秒激光器采用立陶宛Light Conversion公司的Nd：YAG皮秒激光器。In this embodiment, the picosecond laser used is an Nd:YAG picosecond laser from Light Conversion Company of Lithuania.
本实施例的具体过程是：The concrete process of this embodiment is:
步骤1，试样表面清洗。将2D CVI C/SiC复合材料切割为20mm×10mm×3mm的矩形块状试样，然后在酒精浸泡下超声清洗试样15min去除表面灰尘油污等杂质，最后用烘干箱进行干燥，得到清洗后的试样。Step 1, the surface of the sample is cleaned. Cut the 2D CVI C/SiC composite material into a rectangular block sample of 20mm×10mm×3mm, then ultrasonically clean the sample for 15 minutes under alcohol immersion to remove surface dust, oil and other impurities, and finally dry it in a drying oven to obtain of samples.
步骤2，加工孔。通过皮秒激光在2D CVI C/SiC复合材料试样上加工孔。加工中，皮秒激光波长为355～532nm，脉冲宽度为1～10ps，激光输出功率根据孔加工的过程变化，其激光输出功率的变化范围为20mw～20w，激光重复频率根据孔加工的过程变化，其激光重复频率的变化范围为1～600kHz。对试样采用逐层去除方式进行线性扫描方形孔加工，扫描速度为1000mm/s。本实施例中，皮秒激光波长为532nm，脉冲宽度为6.8ps，激光输出功率的变化范围为100mw～10w，激光重复频率的变化范围为32～200kHz。Step 2, machining holes. Holes are machined on 2D CVI C/SiC composite samples by picosecond laser. During processing, the wavelength of the picosecond laser is 355-532nm, the pulse width is 1-10ps, the laser output power varies according to the hole processing process, and the laser output power ranges from 20mw to 20w, and the laser repetition frequency varies according to the hole processing process , the range of the laser repetition frequency is 1 ~ 600kHz. The sample is processed by linear scanning square hole by layer-by-layer removal method, and the scanning speed is 1000mm/s. In this embodiment, the wavelength of the picosecond laser is 532 nm, the pulse width is 6.8 ps, the laser output power ranges from 100 mw to 10 w, and the laser repetition frequency ranges from 32 to 200 kHz.
具体过程是：将清洗后的试样放置在所使用的皮秒激光器对应的加工平台上，并使皮秒激光束通过物镜聚焦在C/SiC复合材料试样表面上待加工孔的任意一个角上，焦距为80mm。The specific process is: place the cleaned sample on the processing platform corresponding to the picosecond laser used, and focus the picosecond laser beam on any corner of the hole to be processed on the surface of the C/SiC composite sample through the objective lens Above, the focal length is 80mm.
在2D CVI C/SiC复合材料试样上加工孔。所述加工过程分为三步：Machining holes in 2D CVI C/SiC composite specimens. The process is divided into three steps:
第一步，预成形孔。所述预成形孔的孔径为成形方孔尺寸的90%，采用沿所述预成形孔轴线方向逐层切除方式加工。加工第一层时，以待成形孔的任意一个角为激光束起点，通过皮秒激光将C/SiC复合材料试样表面切除，并以线性扫描路径将切除的试样表面逐渐扩大至预定的方形孔尺寸。将激光束移至激光束起点，继续以线性扫描路径加工第二层，直至第二层逐渐扩大至预定的方孔尺寸。重复上述过程，直至形成预成形的通孔。所成形孔具有锥度，这是由于皮秒激光能量高斯分布的特征及方形孔内碎屑对激光的反作用能力所决定的。In the first step, the holes are preformed. The diameter of the pre-formed hole is 90% of the size of the formed square hole, and it is processed by layer-by-layer cutting along the axial direction of the pre-formed hole. When processing the first layer, any corner of the hole to be formed is used as the starting point of the laser beam, and the surface of the C/SiC composite sample is excised by the picosecond laser, and the excised sample surface is gradually enlarged to the predetermined Square hole size. Move the laser beam to the starting point of the laser beam, and continue to process the second layer with a linear scanning path until the second layer gradually expands to the predetermined square hole size. The above process is repeated until a preformed through hole is formed. The formed hole has a taper, which is determined by the characteristics of the Gaussian distribution of the picosecond laser energy and the reaction ability of the debris in the square hole to the laser.
预成形中，激光输出功率为8w，重复频率为100kHz；当激光束以线性扫描路径加工时，相邻直线之间的间距为0.01mm；在逐层加工中，每层的加工深度为10μm。In preforming, the laser output power is 8w, and the repetition frequency is 100kHz; when the laser beam is processed in a linear scanning path, the distance between adjacent straight lines is 0.01mm; in layer-by-layer processing, the processing depth of each layer is 10μm.
第二步，消除预成形孔中的锥度。通过消除预成形孔中的锥度，使预成形孔的孔径达到成形孔孔径的98%。采用沿所述预成形孔轴线方向逐层切除的方式消除预成形孔中的锥度。在消除预成形方孔中的锥度时，激光束自所述预成形方孔孔口处的内表面开始，以线性扫描路径加工所述预成形方孔孔口处的内表面，使预成形方孔的尺寸达到成形孔尺寸的98%，完成第一层加工。将激光束移至预成形方形孔内表面，继续以线性扫描路径加工第二层，直至第二层逐渐扩大至预定的尺寸。重复上述过程，直至消除预成形孔中的锥度，并使预成形方孔的孔径达到成形方孔孔径的98%。在消除预成形方孔中的锥度中，在预成形孔的孔壁形成氧化层，本实施例中，所述氧化层厚度为10～15μm。In the second step, the taper in the preformed hole is eliminated. By eliminating the taper in the preformed hole, the preformed hole diameter reaches 98% of the formed hole diameter. The taper in the pre-formed hole is eliminated by layer-by-layer cutting along the axial direction of the pre-formed hole. When eliminating the taper in the preformed square hole, the laser beam starts from the inner surface of the preformed square hole orifice, and processes the inner surface of the preformed square hole orifice with a linear scanning path, so that the preformed square The size of the hole reaches 98% of the size of the formed hole, and the first layer of processing is completed. Move the laser beam to the inner surface of the preformed square hole, and continue to process the second layer in a linear scanning path until the second layer gradually expands to the predetermined size. Repeat the above process until the taper in the pre-formed hole is eliminated, and the aperture of the pre-formed square hole reaches 98% of the aperture of the formed square hole. In eliminating the taper in the preformed square hole, an oxide layer is formed on the wall of the preformed hole. In this embodiment, the thickness of the oxide layer is 10-15 μm.
在消除预成形孔中的锥度时，激光输出功率7w，重复频率100kHz；当激光束螺旋状路径径向加工时，相邻螺旋线之间的间距为0.01mm；在逐层加工中，每层的加工深度为8μm。When eliminating the taper in the pre-formed hole, the laser output power is 7w, and the repetition frequency is 100kHz; when the laser beam is processed radially in a helical path, the distance between adjacent helical lines is 0.01mm; in layer-by-layer processing, each layer The processing depth is 8 μm.
第三步，成孔。对消除锥度的预成形方孔中进行成孔的皮秒激光加工，并消除所述消除锥度的预成形方孔孔壁上的氧化层。在成孔中，激光束对所述消除锥度的预成形孔表面进行逐层加工，光束自所述预成形方孔孔口处内壁的氧化层表面开始，采用线性方形路径切除孔壁，并去除所述预成形孔孔口处内壁的氧化层，使所述预成形孔的孔径达到成孔的要求，完成第一层加工。激光束沿所述预成形孔的轴向下移5μm，继续采用线性方形路径切除孔壁，并去除所述预成形孔内壁上的氧化层，完成第二层加工。重复上述过程，直至将所述预成形方孔的尺寸达到成孔的要求，得到皮秒激光加工成形的方孔。The third step is to form a hole. Picosecond laser processing is performed on the preformed square hole with the taper eliminated, and the oxide layer on the wall of the preformed square hole with the taper eliminated is eliminated. In hole forming, the laser beam processes the surface of the pre-formed hole that eliminates the taper layer by layer. The beam starts from the surface of the oxide layer on the inner wall of the pre-formed square hole, adopts a linear square path to cut off the hole wall, and removes The oxide layer on the inner wall at the opening of the preformed hole makes the diameter of the preformed hole meet the requirement of hole formation, and completes the first layer of processing. The laser beam moves down 5 μm along the axial direction of the preformed hole, continues to use a linear square path to cut off the hole wall, and removes the oxide layer on the inner wall of the preformed hole to complete the second layer of processing. Repeat the above process until the size of the pre-formed square hole meets the hole-forming requirements, and obtain a square hole formed by picosecond laser processing.
成孔加工中，激光输出功率为311mw，重复频率为32kHz；在逐层加工中，每层的加工深度为5μm。In the hole-forming process, the laser output power is 311mw, and the repetition frequency is 32kHz; in the layer-by-layer processing, the processing depth of each layer is 5μm.
步骤3，清洗。将得到的方孔置于酒精中超声清洗试样15min，去除表面及孔壁残存碎屑。Step 3, cleaning. Place the obtained square hole in alcohol and ultrasonically clean the sample for 15 minutes to remove residual debris on the surface and hole wall.
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310075471.4ACN103143841B (en) | 2013-03-08 | 2013-03-08 | Method for hole machining with picosecond laser |
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310075471.4ACN103143841B (en) | 2013-03-08 | 2013-03-08 | Method for hole machining with picosecond laser |
| Publication Number | Publication Date |
|---|---|
| CN103143841A CN103143841A (en) | 2013-06-12 |
| CN103143841Btrue CN103143841B (en) | 2014-11-26 |
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310075471.4AActiveCN103143841B (en) | 2013-03-08 | 2013-03-08 | Method for hole machining with picosecond laser |
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| CN (1) | CN103143841B (en) |
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