The specific embodiment
The first mode of the present invention provides a kind of thermofin, possesses:
Matrix part, it has tabular surface;
The ring portion of tubular, it erects from described matrix part;
Open section, its from radial outside from the front end of described ring portion to described ring portion and expand at complete cycle;
Retreat section, it arrives at the end root that makes described ring portion take the described tabular surface of described matrix part during as datum level and is no more than the position of described datum level, and has from the end root of described ring portion and be the inclined plane of acute angle bending towards the front of described ring portion.
According to said structure, in the situation that the thermofin multi-disc is overlapping, the section of opening of a thermofin and the inclination plane-plane contact in section of retreating that is arranged on other thermofin of being overlapped in a thermofin.Thus, the contact area of a thermofin and other thermofin increases, thereby can improve the conductivity of heat from the ring portion of a thermofin to other thermofin.
In addition, open section from radial outside from the front end of ring portion to ring portion and be arranged on complete cycle.Thus, can be on the complete cycle of ring portion, the contact area of the ring portion of the ring portion of a thermofin and other thermofin is increased.
In addition, in the situation that take the tabular surface of matrix part as datum level, the end root of ring portion is outstanding and surpass datum level.That is, the section of retreating is outstanding and surpass the tabular surface of matrix part.Thus, in the situation that thermofin is lain on other object the tabular surface of matrix part and other object contact.Consequently, can prevent the section that retreats and other object collision and situation about deforming.
In addition, also can be not do not fill filler in the gap of the ring portion of the ring portion of a thermofin and other thermofin, the materials classification during heat exchanger discarded becomes easily, thereby can improve recirculation.
The second mode of the present invention is on the basis of the first mode, a kind of thermofin is provided, described open section with respect to the axial angle of inclination of described ring portion with described to retreat section identical or to retreat section little with respect to the axial angle of inclination of described ring portion than described with respect to the axial angle of inclination of described ring portion.According to such structure, in the situation that the thermofin multi-disc is overlapping, the section of opening of a thermofin contacts with the section that the retreats face of other thermofin that is overlapped in a thermofin.Thus, the contact area of a thermofin and other thermofin increases, thereby can improve the conductivity of heat from the ring portion of a thermofin to other thermofin.
Third Way of the present invention is on the basis of the first or second mode, and a kind of thermofin is provided, and the described section of opening is parallel with the described inclined plane that retreats section.According to such structure, the section of opening with respect to the axial angle of inclination of ring portion with to retreat section identical with respect to the axial angle of inclination of ring portion, therefore, in the situation that the thermofin multi-disc is overlapping, the section of opening of a thermofin contacts with the section that the retreats face of other thermofin that is overlapped in a thermofin.Thus, the contact area of a thermofin and other thermofin increases, thereby can improve the conductivity of heat from the ring portion of a thermofin to other thermofin.
Cubic formula of the present invention is on the basis of the arbitrary mode to the Third Way first, a kind of thermofin is provided, also possess the stage portion of the described section of retreating being lifted from described matrix part, described ring portion axially on described stage portion height C than described ring portion axially on the described backway D that retreats section large.According to such structure, the section of retreating is outstanding and surpass the tabular surface of matrix part.Thus, in the situation that thermofin is lain on other object the tabular surface of matrix part and other object contact.Consequently, can prevent the section that retreats and other object collision and situation about deforming.Thus, can prevent the situation of the shape inequality of thermofin, thereby the quality of thermofin is improved.
The 5th mode of the present invention provides a kind of fin tube heat exchanger, possesses:
Overlapping multi-disc thermofin;
Connect the heat-transfer pipe of described multi-disc thermofin,
Described thermofin possesses:
Matrix part, it has tabular surface;
The ring portion of tubular, it erects from described matrix part;
Open section, its from radial outside from the front end of described ring portion to described ring portion and expand at complete cycle;
Retreat section, it arrives at the end root that makes described ring portion take the described tabular surface of described matrix part during as datum level and is no more than the position of described datum level, and has from the end root of described ring portion and be the inclined plane of acute angle bending towards the front of described ring portion.
According to such structure, in the situation that the thermofin multi-disc is overlapping, the section of opening of a thermofin and the inclination plane-plane contact in section of retreating that is arranged on other thermofin of being overlapped in a thermofin.Thus, the contact area of a thermofin and other thermofin increases, thereby can improve the conductivity of heat from the ring portion of a thermofin to other thermofin.
In addition, open section from radial outside from the front end of ring portion to ring portion and be arranged on complete cycle.Thus, can be on the complete cycle of ring portion, the contact area of the ring portion of the ring portion of a thermofin and other thermofin is increased.
In addition, in the situation that take the tabular surface of matrix part as datum level, the end root of ring portion is outstanding and surpass datum level.That is, the section of retreating is outstanding and surpass the tabular surface of matrix part.Thus, in the situation that thermofin is lain on other object the tabular surface of matrix part and other object contact.Consequently, can prevent the section that retreats and other object collision and situation about deforming.
In addition, also can be not do not fill filler in the gap of the ring portion of the ring portion of a thermofin and other thermofin, the materials classification during heat exchanger discarded becomes easily, thereby can improve recirculation.
The 6th mode of the present invention is on the basis of the 5th mode, a kind of fin tube heat exchanger is provided, and the described section of retreating of the thermofin in described overlapping thermofin enters in the space that is formed by the described section of opening that is overlapped in other thermofin on a described thermofin and with the described section of opening and contacts.According to such structure, in the situation that the thermofin multi-disc is overlapping, the section of retreating of a thermofin enters in the space that is formed by the section of opening that is overlapped in other thermofin on a thermofin and with the section face of opening and contacts.Thus, the contact area of a thermofin and other thermofin increases, thereby can improve the conductivity of heat from the ring portion of a thermofin to other thermofin.
In addition, need filler unlike prior art, therefore, the Sorting Materials during heat exchanger discarded is easy, can not make the deterioration of recirculation property.
The 7th mode of the present invention is on the basis of the 5th or the 6th mode, a kind of fin tube heat exchanger is provided, described open section with respect to the axial angle of inclination of described ring portion with described to retreat section identical or to retreat section little with respect to the axial angle of inclination of described ring portion than described with respect to the axial angle of inclination of described ring portion.According to such structure, in the situation that the thermofin multi-disc is overlapping, the section of opening of a thermofin contacts with the section that the retreats face of other thermofin that is overlapped in a thermofin.Thus, the contact area of a thermofin and other thermofin increases, thereby can improve the conductivity of heat from the ring portion of a thermofin to other thermofin.
Of the present invention the from all directions formula be on the basis of the arbitrary mode in the 5th to the 7th mode, a kind of fin tube heat exchanger is provided, the described section of opening is parallel with the described inclined plane that retreats section.According to such structure, the section of opening with respect to the axial angle of inclination of ring portion with to retreat section identical with respect to the axial angle of inclination of ring portion, therefore, in the situation that the thermofin multi-disc is overlapping, the section of opening of a thermofin contacts with the section that the retreats face of other thermofin that is overlapped in a thermofin.Thus, the contact area of a thermofin and other thermofin increases, thereby can improve the conductivity of heat from the ring portion of a thermofin to other thermofin.
The 9th mode of the present invention is the 5th to the from all directions on the basis of the arbitrary mode in formula, a kind of fin tube heat exchanger is provided, also possess the stage portion of the described section of retreating being lifted from described matrix part, described ring portion axially on described stage portion height C than described ring portion axially on the described backway D that retreats section large.According to such structure, the section of retreating is outstanding and surpass the tabular surface of matrix part.Thus, in the situation that thermofin is lain on other object the tabular surface of matrix part and other object contact.Consequently, can prevent the section that retreats and other object collision and situation about deforming.Thus, can prevent the situation of the shape inequality of thermofin, thereby the quality of thermofin is improved.
The tenth mode of the present invention provides a kind of heat pump assembly, possesses: compressor; Condenser; Throttling arrangement; Evaporimeter; For the refrigerant loop that cold-producing medium circulates in described compressor, described condenser, described throttling arrangement and described evaporimeter, at least one party in described condenser and described evaporimeter is the described fin tube heat exchanger of arbitrary mode in the 5th to the 9th mode.
(embodiment)
Below, about embodiments of the present invention, the limit describes with reference to the accompanying drawing limit.But, the present invention is limited by following embodiment.
Fig. 1~Fig. 3 represents the related fin tube heat exchanger of one embodiment of the present invention 1.Thisheat exchanger 1 possesses: overlappingmulti-disc thermofin 3; Be configured in the pair ofside plates 20 of the both sides ofthermofin 3; The heat-transfer pipe 2 thatthermofin 3 andside plate 20 is a plurality of U word shapes of wearing the ground perforation of string shape.
Eachthermofin 3 extends along specific direction, and the line part of each heat-transfer pipe 2 is arranged along the length direction ofthermofin 3 with the spacing of regulation.The both ends of each heat-transfer pipe 2 are from outstanding with theside plate 20 of return portion opposition side that line part is connected to each other, and the end of adjacent heat-transfer pipe 2 links by bend pipe 21 each other.
Heat-transfer pipe 2 is cylindric.As heat-transfer pipe 2, for example can adopt inner surface with the copper pipe of groove.
Eachthermofin 3 is for example with the stamping tabular structure that forms of thin aluminium sheet.Particularly, eachthermofin 3 comprises: to thematrix part 4 of expansion on every side of heat-transfer pipe 2; 2 ring portions cylindraceous 5 that erect frommatrix part 4 along heat-transfer pipe.Need to prove, in following content, for convenience of explanation, the direction that ringportion 5 is erected is called " top ", and the direction opposite with it is called " below ".
When assembledheat interchanger 1, the central shaft ofinvolutory ring portion 5 and pile upthermofin 3 inserts the external diameter heat-transfer pipe 2 less than the internal diameter ofring portion 5 to the inboard of ring portion 5.Afterwards, by heat-transfer pipe 2 is enlarged, and the outer peripheral face of heat-transfer pipe 2 and the inner peripheral surface ofring portion 5 are connected airtight.By this structure, thereby can carry out in the interior mobile fluid of heat-transfer pipe 2 (being the R410A cold-producing medium as an example) and heat exchange at the mobile fluid (being air as an example) of 4 of the matrix parts ofthermofin 3.
Herein, with the fintube heat exchanger 100 of prior art shown in Figure 8 as a reference, the details of phenomenon of Heat is described.Need to prove, heat-transfer path is by shown in dotted arrow.
As shown in dotted arrow B in Fig. 8, in the outer peripheral face conduction to heat-transfer pipe 110 of the heat of the interior mobile fluid of heat-transfer pipe 110, inner peripheral surface transmission from from the outer peripheral face of heat-transfer pipe 110 to ringportion 123, and 121 conduction fromring portion 123 to matrix part, and from the upper surface of the outer peripheral face ofring portion 123,matrix part 121 and lower surface in 121 mobile fluid transmission of matrix part.
At this moment, the thermal contact conductance when the heat of the inner peripheral surface from the outer peripheral face of heat-transfer pipe 110 to ringportion 123 is transmitted is defined by followingformula 1 usually.
[several 1](formula 1)
K: thermal contact conductance (W/m2K)
δ1: the surface roughness (μ m) of a side's of formation contact-making surface member
δ2: the surface roughness (μ m) of the opposing party's of formation contact-making surface member
δ0: contact equivalent length (=23 μ m)
λ1: the thermal conductivity (W/mK) of a side's of formation contact-making surface member
λ2: the thermal conductivity (W/mK) of the opposing party's of formation contact-making surface member
P: contact (MPa)
H: the hardness (Hb) of softness one side in the member of formation contact-making surface
λf: central fluid thermal conductivity (W/mK)
In addition, adopt the thermal contact conductance K that is obtained by above-mentionedformula 1, utilize followingformula 2 to obtain thermal contact resistance Rc.
Rc=1/ (K * S) ... (formula 2)
Rc: thermal contact resistance (K/W)
S: contact area (m2)
Thereby, in order to reduce thermal contact resistance Rc, exist make thermal contact conductance K become large method and make contact area S become large method.
In order to make thermal contact conductance K become large, for example asJapanese documentation 2 record, existence is to the method for filling filler in thegap 130 of 123 of the ring portions of heat-transfer pipe 110.In the method, usually will change to filler as the central fluid of air, thereby can improve central fluid thermal conductivity λfSo that thermal contact conductance K becomes large.
But, in the situation that adopted filler, also mix the raw material that filler is arranged except the raw material of the raw material ofthermofin 120 and heat-transfer pipe 110 in consisting of the material ofheat exchanger 100, cause being difficult to carrying out the classification for the every kind of raw material that recycles when product abandonment.Consequently, the increase of the energy of needs the etc. when deterioration of recirculation property causes the reduction of recirculation rate or recirculation, thus cause the environmental loads increase.
At present, reduce as household electrical appliances recirculation method representative the measure of the load of earth environment is implemented by Government-Leading, owing to there being in the future the trend that enlarges the object commodity, therefore recirculation property becomes the key element that can't ignore.
In addition, except above-mentioned method, as making thermal contact conductance K become large method, also there is the surface roughness δ that makes contact-making surface1, δ2The method that reduces, make the method that contact P improves, the thermal conductivity λ that makes heat-transfer pipe 110 andthermofin 1201, λ2The method that improves, make the method for the hardness H step-down of softness one side in heat-transfer pipe 110 or thermofin 120.The present invention is conceived to make contact area S to become large method.
As can be known, increase by making heat-transfer pipe 110 and the contact area S ofring portion 123 from above-mentionedformula 2, even if thermal contact conductance K does not change, also can reduce thermal contact resistance Rc.If can reduce thermal contact resistance Rc, 120 conductivity of heat is improved, thereby the heat exchanger effectiveness as heat exchanger is improved.
Return to Fig. 2 and Fig. 3, in the present embodiment, be provided with the section of opening 6 that enlarges from the front end of ring portion 5 to radial outside above ring portion 5, but be not provided with end root below ring portion 5.As an alternative, around ring portion 5 with and ring portion 5 between be formed with depression mode be provided with the section that retreats 7 that retreats towards the end of ring portion 5 root.More specifically, as shown in Figure 4, matrix part 4 has tabular surface 4a.Tabular surface 4a is the face on the lower surface that is arranged on matrix part 4 (face of the opposite direction side that erects with ring portion 5).Take the tabular surface 4a of matrix part 4 during as datum level, the end root of ring portion 5 arrives the position that surpasses this datum level.That is, the end root of ring portion 5 is positioned at the position more top than datum level.The end root of ring portion 5 is for example than the distance more than 25% of the thickness of the top matrix part 4 of datum level.Retreating section 7 has from the end root of ring portion 5 and is the inclined plane of acute angle bending towards the front of ring portion 5.Open section 6 from radial outside from the front end of ring portion 5 to ring portion 5 and expand at complete cycle.And in adjacent thermofin 3, the section that retreats 7 of a side thermofin 3 enters in the space that the section of opening 6 by the opposing party's thermofin 3 forms and opens section 6 with this and contacts.By retreating section 7 and open section's 6 butts, thereby limit spacing of fin (arrangement pitch of matrix part 4) by ring portion 5.
According to such structure, in the situation that thermofin 3 multi-discs are overlapping, the inclination plane-plane contact in the section of opening 6 of a thermofin 3 and the section that retreats 7 that is arranged on other thermofin 3 that is overlapped in a thermofin 3.And then in the situation that thermofin 3 multi-discs are overlapping, the section that retreats 7 of a thermofin 3 enters in the space that the section of opening 6 by other thermofin 3 that is overlapped in a thermofin 3 forms, and contacts with 6, the section of opening.Thus, a thermofin 3 increases with the contact area of other thermofin 3, thereby can improve the conductivity of heat from the ring portion 5 of a thermofin 3 to other thermofin 3.In addition, open section 6 from radial outside from the front end of ring portion 5 to ring portion 5 and be arranged on complete cycle, therefore, can be on the complete cycle of ring portion 5, the ring portion 5 that make a thermofin 3 increases with the contact area of the ring portion 5 of other thermofin 3.And then in the situation that take the tabular surface 4a of matrix part 4 as datum level, the end root of ring portion 5 is outstanding and surpass datum level.That is, retreat section 7 outstanding and surpass the tabular surface 4a of matrix part 4.Thus, in the situation that thermofin 3 is lain on other object, due to the tabular surface 4a of matrix part 4 and other object contact, thereby can prevent the situation that the section that retreats 7 deforms with other object collision.
Need to prove,matrix part 4 can be both flat condition as present embodiment, also can be for having the waveform in a plurality of mountain valleys.In the situation thatmatrix part 4 is made as waveform, preferably retreatsection 7 around be provided with the annulus of flat condition.
In the present embodiment, open section 6 parallel with the inclined plane that retreats section 7, the lateral surface 7a that retreats section 7 contacts with the medial surface 6a face of the section of opening 6.In order to realize this structure, when assembled heat interchanger 1, as shown in Figure 4, also can pile up the section of opening 6 thermofin 3 identical with respect to the axial tilt angle alpha of ring portion 5 with retreating section 7 with respect to the axial inclination angle beta of ring portion 5.Perhaps, as shown in Figure 5, also can accumulation open section 6 with respect to the axial inclination angle beta of ring portion 5 than after retreating section 7 thermofin 3 little with respect to the axial tilt angle alpha of ring portion 5, these thermofins 3 are compressed along axially the carrying out punching press of ring portion 5.Thus, open section 6 and retreated section's 7 compandings and open, finally they become and are parallel to each other and the face contact.According to such structure, in the situation that thermofin 3 multi-discs are overlapping, the section of opening 6 of one thermofin 3 contacts with 7, the section that retreats of other thermofin 3 that is overlapped in a thermofin 3, therefore, one thermofin 3 increases with the contact area of other thermofin 3, thereby can improve the conductivity of heat from the ring portion 5 of a thermofin 3 to other thermofin 3.
As mentioned above, by the section of retreating 7 is entered by the section ofopening 6 in the space that forms, can reduce to be formed on the gap 9 (the first effect) between a side the end root ofring portion 5 ofadjacent thermofin 3 and the opposing party's the front end ofring portion 5 when overlapping thermofin 3.In other words, can reduce the area that heat-transfer pipe 2 does not contact withring portion 5, thereby the contact area of heat-transfer pipe and ring portion is increased.
But, for example, as shown in the left figure of Fig. 5, constituting by retreating duringsection 7 limits the imaginary heat exchanger of spacing of fin with the upper end butt that openssection 6, the gap 9 that is formed on 5 of ring portions becomes large to a certain extent.Relative with it, in the present embodiment, by the section ofopening 6 around the space inretreat section 7 and contact with the section ofopening 6, therefore, can make the gap 9 of 5 of ring portions become very little, thereby can make heat-transfer pipe 2 and the imaginary heat exchanger of the contact area rate ofring portion 5 large (the second effect).
By two above effects, can reduce thermal contact resistance and 3 conductivity of heat is improved, therefore can improve the heat exchanger effectiveness of heat exchanger 1.The classification duringheat exchanger 1 discarded in addition, as the structure that be used for to obtain this effect, do not need the material beyond heat-transfer pipe 2 andthermofin 3, therefore easily and not can make the deterioration of recirculation property.
And then, in the present embodiment,open section 6 and to retreatsection 7 parallel, and thelateral surface 7a that retreatssection 7 contacts with themedial surface 6a face of the section ofopening 6.
In theheat exchanger 100 of prior art shown in Figure 8, the front end that openssection 124 contacts withmatrix part 121 lines.The part that contacts by line and the heat that transmitted by heat is very little, therefore, in theheat exchanger 100 of prior art, as shown in dotted arrow B in Fig. 8,123 heats that transmit only conduct to thematrix part 121 of thethermofin 120 identical with thisring portion 123 from heat-transfer pipe 110 to ring portion.That is, 121 heat conduction path is only a path viaend root 122 fromring portion 123 to matrix part.
Relative with it, in the present embodiment, thelateral surface 7a that retreatssection 7 contacts with themedial surface 6a face of the section ofopening 6, therefore, as shown in dotted arrow A in Fig. 3,5 heats that transmit are not only tomatrix part 4 conduction of the thermofin identical with thisring portion 5 from heat-transfer pipe 2 to ring portion, and tomatrix part 4 conduction of thethermofin 3 of adjacency.That is, as 4 the heat conduction path fromring portion 5 to matrix part, can guarantee to have these two paths, path via the section that retreats 7 handing-over of the path that retreatssection 7 and thethermofin 3 from the section ofopening 6 to institute's adjacency.Thus, compare with theheat exchanger 100 of prior art, can efficient well tomatrix part 4 transferring heats.Thereby 3 conductivity of heat further improves from heat-transfer pipe 2 to thermofin, thereby heat exchanger effectiveness is improved more.
And then, in the present embodiment, as shown in Figure 4, be provided with between section 7 and matrix part 4 with respect to the lower surface of matrix part 4 and the stage portion 8 that the section of retreating 7 is lifted retreating.That is, ring portion 5 axially on stage portion 8 height C than ring portion 5 axially on the backway D of the section that retreats 7 large.Ring portion 5 axially on the height C of stage portion 8 be height till from the tabular surface 4a of matrix part 4 to the upper surface (upper surface of planar portions 81 described later) of stage portion 8.The backway D that retreats section 7 for from ring portion 5 axially on the distance of upper surface (upper surface of planar portions 81) till the lower surface that retreats section 7 of stage portion 8.According to such structure, retreat the not outstanding tabular surface 4a that surpasses matrix part 4 of section 7, therefore, in the situation that thermofin 3 is lain on other object the tabular surface 4a of matrix part 4 and other object contact.Consequently, can prevent the situation that the section that retreats 7 deforms with other object collision.Thus, prevent the situation of the shape inequality of thermofin 3, thereby can improve the quality of thermofin 3.Need to prove, in the present embodiment, stage portion 8 is made of the planar portions 81 of the ring-type that is connected with the upper end that retreats section 7 to radially inner side with the 4 wall sections that erect 82 and upper end from wall section 82 around the mode that retreats section 7 from matrix part.But, planar portions 81 can be omitted.
In the situation that there is nostage portion 8,retreat section 7 outstanding from the lower surface ofmatrix part 4, therefore, and such as the manufacturing ofthermofin 3 time etc., the possibility that exists the section that retreats 7 to deform with other object collision.Relative with it, if be provided withstage portion 8 as present embodiment,retreat section 7 not outstanding from the lower surface (tabular surface 4a) ofmatrix part 4, therefore can prevent the situation that the section that retreats 7 deforms with other object collision.The good thermofin ofquality 3 thus, can reduce the inequality of the shape ofthermofin 3, therefore can be provided.
Then, with reference to figure 7, theroom air conditioner 10 as an example of the heat pump assembly that has adopted above-mentionedheat exchanger 1 is described.
Inroom air conditioner 10, acrossindoor unit 10A andoutdoor unit 10B and consist of refrigerant loop 10C.Dispose compressor 11 (being rotary compressor as an example),cross valve 12,outdoor heat converter 13, throttling arrangement 14 (being expansion valve as an example) inoutdoor unit 10B, disposeindoor heat converter 15 in indoor unit 10A.In addition, be provided withoutdoor fan 16 tooutdoor heat converter 13 conveying chamber outer air (as an example inoutdoor unit 10B, be aerofoil fan), be provided with indoor fan 17 (as an example, being cross flow fan) from room air toindoor heat converter 15 that carry atindoor unit 10A.
In room air conditioner 10, by cross valve 12, will be guided to indoor heat converter 15 when warming operation by the cold-producing medium of the HTHP after compressor 11 compressions, guide to outdoor heat converter 13 when cooling operation.When warming operation, indoor heat converter 15 becomes condenser, and 15 carry high temperature refrigerant from cross valve 12 to indoor heat converter.The heat of the high temperature refrigerant that indoor heat converter 15 will flow carries out heat exchange with the heat of the room air of being carried by indoor fan 17, and the heat of cold-producing medium is emitted to air, thereby makes condensation of refrigerant liquefaction.The cold-producing medium that has liquefied is by the heat insulation expansion of throttling arrangement 14, and the cold-producing medium that becomes thus low-temp low-pressure is carried to outdoor heat converter 13.Outdoor heat converter 13 becomes evaporimeter, the heat of the heat of the low-temperature refrigerant of gas-liquid two-phase state and the outdoor air of being carried by outdoor fan 16 is carried out heat exchange, and the heat of air is absorbed heat by cold-producing medium, thereby make cold-producing medium evaporation gasification.Low pressure gasifying cold-producing medium after evaporation is compressed in compressor 11 again.By repeatedly carrying out continuously this circulation, room air is warmed and heat.When cooling operation, by switching cross valve 12, cold-producing medium is flowed round about, room air is turned cold and freeze.That is, in warming operation and these both sides of cooling operation, the cold-producing medium that circulates in refrigerant loop 10C is successively by compressor 11, condenser, throttling arrangement 14 and evaporimeter.
Inroom air conditioner 10 as described above or heat pump assembly in addition, by at least one party in condenser and evaporimeter being made as theheat exchanger 1 of present embodiment, thereby can improve the heat exchanger effectiveness of condenser and/or evaporimeter.Consequently, can improve the COP (coefficient of performance: coefficient of performance) of heat pump assembly.
(variation)
For the section ofopening 6 and retreat forsection 7, ifretreat section 7 and the section ofopening 6 by the section ofopening 6 around the space in contact, might not be cone-shaped.For example, as shown in Figure 6,retreat section 7 and also can not be linearity, but the limit curved edges retreats towards the end ofring portion 5 root.Perhaps, diagram is omitted, and also can the limit curved edges enlarge to radial outside butopen section 6.
In thethermofin 3 that is configured as shape as shown in Figure 6, when thermofin 3 is piled up, even if the central shaft axle each other ofring portion 5 has occured inadjacent thermofin 3 to be departed from, contact with themedial surface 6a of the section ofopening 6 of cone-shaped by retreatingsection 7, can depart from the effect that is suppressed such to axle thereby also have.Thus, except heat-transfer pipe 2 easily being insertedring portion 5, also can limit the relative position that the footpath of heat-transfer pipe 2 and thering portion 5 of overlappingthermofin 3 makes progress, can not make heat-transfer pipe 2 uneven with the contact area ofring portion 5, thereby can improve the good fin tube heat exchanger of quality.Need to prove, in the situation that formthermofin 3 in the section ofopening 6 mode parallel with retreatingsection 7, can obtain this effect too.
The utilizability of aspect [industry]
Fin tube heat exchanger of the present invention can be preferably used in room air conditioner or the heat pump assemblies such as hot water supply device, heat supplier.