A kind of manufacture method of contact intelligent cardTechnical field
The present invention relates to a kind of manufacture method of smart card, especially relate to a kind of manufacture method of contact intelligent card.
Background technology
Various smart cards dissimilar, difference in functionality are used widely in each large field at present, but card is of a great variety, related process is old, the situations such as the serviceable life of having caused smart card is short, security that the more important thing is card is inadequate, therefore the contact intelligent card that has high security is applied, and is extensively promoted in finance, the contour security fields of social security by it.
Summary of the invention
Purpose of the present invention is exactly to provide a kind of raising to produce effect for the defective that overcomes above-mentioned prior art existence
The manufacture method of the contact intelligent card of rate, reduction cost and rejection rate.
Purpose of the present invention can be achieved through the following technical solutions:
A kind of manufacture method of contact intelligent card is characterized in that, may further comprise the steps:
1) printing;
2) compound;
3) lamination;
4) die-cut;
5) chip gum;
6) Xi Cao;
7) chip package.
Described printing may further comprise the steps:
Mode with front printing or mirror image printing is printed on required printing surface on the packing general-purpose plastics material.
Described general-purpose plastics material is PET or PETG.
Described compound may further comprise the steps:
If adopt the front mode of printing, compound tense printing surface surface respectively is covered with the wear-resisting film of layer of transparent, is filled with one to three layer of encapsulant layer between two-layer printing surface;
If adopt the mirror image mode of printing, compound tense is directly filled one to three layer of packed layer material between two-layer printing surface.
Described lamination may further comprise the steps:
Base card after compound is sent into laminating apparatus carry out lamination, set temperature, appropriateness, the pressure of the bonding needs of different materials, opened into greatly card.
Described die-cut may further comprise the steps:
The large card of opening into of lamination gained is sent into die cutting device, punch out standard compliant card, obtain white card.
Described chip gum may further comprise the steps:
Every row encapsulates a plurality of chips on the chip carrier band, and simultaneously, the chip back is provided with package adhesive tape, impact the pad pasting that to meet die size by cross cutting corresponding chip back position on adhesive tape, by abutted equipment, pad pasting is sticked in the chip back simultaneously, finish chip and on carrier band, encapsulate gum.
Described Xi Cao may further comprise the steps:
The white card of die-cut gained is put into Xi Cao equipment, and the physical parameter of corresponding chip polish dead slot.
Described chip package may further comprise the steps:
Chip behind the gum is put into the dead slot of white card by sealed in unit, and through hot pressing with cold pressing, encapsulation is firm.
Compared with prior art, the present invention has the production automation that can realize the type smart card, enhances productivity, and reduces cost and rejection rate.
Embodiment
The present invention is described in detail below in conjunction with specific embodiment.
Embodiment
A kind of manufacture method of contact intelligent card may further comprise the steps:
The first step, printing surface is determined in printing, required printing surface is printed on the materials such as PET or PETG in the mode of front printing or mirror image printing, every material is applicable to about area that becomes card more than 24;
Second step, compound, adopt the described positive material that prints, skin at two-layer printing surface respectively covers the hyaline membrane that one deck has the high abrasion characteristic, for the protection of printing surface, for reaching the card integral thickness, between two-layer printing surface, be filled with according to actual needs one to three layer of encapsulant layer;
Adopt the material of described minute surface printing, between two-layer printing surface, be filled with one to three layer of packed layer material, be used for filling the printing surface bottom, and the integral thickness of reaching the card actual demand;
In the 3rd step, lamination with described compound substance, is sent into laminating apparatus and is carried out lamination, sets temperature, appropriateness, the pressure of the bonding needs of different materials, and gained is partly for opening into greatly card material;
The 4th step, die-cut, the large card of opening into of lamination gained is sent into die cutting device, punch out the card that meets standard or actual demand, gained is white card;
The 5th step, the chip gum, every row is packaged with a plurality of chips on the chip carrier band, simultaneously, the chip back is provided with package adhesive tape, impacts the pad pasting that to meet die size by cross cutting corresponding chip back position on adhesive tape, passes through simultaneously abutted equipment, pad pasting is sticked in the chip back, finish chip and on carrier band, encapsulate gum;
The 6th step ， Xi Cao puts into Xi Cao equipment with the white card of die-cut gained, and the physical parameter of corresponding chip polish dead slot;
In the 7th step, chip package by sealed in unit, is put into described dead slot with the chip of contact, and through hot pressing with cold pressing, encapsulation is firm.
Wherein ， Xi Cao and chip package stage, can pass through reforming equipment, increase the production line of working simultaneously, enhance productivity.