技术领域technical field
本发明涉及一种可以收集射频能量进行无线充电并且采集传感器节点数据的新型无线传感器节点，尤其设计一种能够实时监测信号强度，能够进行能量管理、提高能量转换率的无线充电的传感器节点。The invention relates to a new type of wireless sensor node that can collect radio frequency energy for wireless charging and collect sensor node data, especially a wireless charging sensor node that can monitor signal strength in real time, perform energy management, and improve energy conversion rate.
背景技术Background technique
随着科技的发展和工业的需要，越来越多的无线传感器网络运用到生产生活中。但是由于节点数量庞大、节点的随机散布、节点所在环境恶劣、节点本身嵌入在固体结构中，采用传统的电池给节点供电会带来电池更换难度大、成本高等问题，严重缩短了节点的生命周期。此外，由于节点能量有限，不能够实时监测能量进行能量管理，也会严重影响节电寿命。采用收集射频能量并将其转换为直流能量的方法，可摆脱电池对节点的束缚。同时采用实时监测信号强度的方法，可以进行能量管理，提高能量转换效率，保证节点工作的可靠性。With the development of science and technology and the needs of industry, more and more wireless sensor networks are used in production and life. However, due to the large number of nodes, the random distribution of nodes, the harsh environment where nodes are located, and the nodes themselves embedded in solid structures, using traditional batteries to power nodes will bring problems such as difficult battery replacement and high cost, which seriously shortens the life cycle of nodes. . In addition, due to the limited energy of nodes, it is impossible to monitor energy in real time for energy management, which will seriously affect the power saving life. By harvesting RF energy and converting it to DC energy, the battery is not tied to the node. At the same time, the method of real-time monitoring of signal strength can be used to manage energy, improve energy conversion efficiency, and ensure the reliability of node work.
发明内容Contents of the invention
为了克服现有传感器节点需要电池供电，无线充电过程中捕捉的信号强度未知且能量转换率低，输出可用功率低的现状，本发明提供了一种实时监测信号强度的无线充电节点。该传感器节点不仅可以进行无线充电并将采集的各种传感器数据通过无线射频芯片发送出去，同时可以实时监测捕捉到的信号强度，进行能量管理，能量转换效率达到50%，输出可用功率达到15mw，大大提高了节点工作的可靠性，延长了节点的寿命。In order to overcome the current situation that existing sensor nodes need battery power supply, the signal strength captured during wireless charging is unknown, the energy conversion rate is low, and the available output power is low, the present invention provides a wireless charging node that monitors signal strength in real time. The sensor node can not only perform wireless charging and send various sensor data collected through the radio frequency chip, but also monitor the captured signal strength in real time and perform energy management. The energy conversion efficiency reaches 50%, and the available output power reaches 15mw. It greatly improves the reliability of node work and prolongs the life of nodes.
本发明解决其技术问题所采用的技术方案：The technical solution adopted by the present invention to solve its technical problems:
一种实时信号强度监测的无线充电的传感器节点。该节点主要由PCB天线、能量转换模块、微处理器模块、信号强度监测模块、传感器模块、无线射频模块组成；PCB天线与能量转换模块相连，能量转换模块通过稳压子模块与微处理器模块相连，微处理器模块通过IO端口与信号强度监测模块相连，实时监测信号强度，对能量转换模块进行能量管理，提高能量的转换率和利用率，微处理器模块通过IO端口与传感器模块相连，通过SPI接口与无线射频模块连接；该传感器节点不仅可以进行无线充电，同时可以采集各种传感器数据并且通过无线射频模块发送出去，还可以实时监测捕捉到的信号强度，能量转换效率达到50%，输出可用功率达到15mw。A wireless charging sensor node for real-time signal strength monitoring. The node is mainly composed of PCB antenna, energy conversion module, microprocessor module, signal strength monitoring module, sensor module, and radio frequency module; the PCB antenna is connected to the energy conversion module, and the energy conversion module is connected to the microprocessor module through the voltage regulator module Connected, the microprocessor module is connected to the signal strength monitoring module through the IO port, monitors the signal strength in real time, performs energy management on the energy conversion module, improves the conversion rate and utilization of energy, and the microprocessor module is connected to the sensor module through the IO port, Connect with the wireless radio frequency module through the SPI interface; the sensor node can not only perform wireless charging, but also collect various sensor data and send them out through the wireless radio frequency module, and can also monitor the captured signal strength in real time, and the energy conversion efficiency reaches 50%. The available output power reaches 15mw.
本发明通过印制板天线接收、转换中心频率为915MHz的射频能量，能量转换模块将接受到的射频能量转换成直流信号，存储在大容量低漏电电流的存储电容中，输出的直流电压经过低功耗的稳压芯片整流得到稳定的直流电压，给整个节点供电。能量转换模块和信号强度监测模块以及微控制器模块相连接，可以通过实时监测能量转换模块的模拟电压值得到信号强度的数据，并进行能量管理，减小能耗。能量转换模块的能量转换率高，得到的可用能量高。微控制器利用通用IO口与传感器模块相连，同时微处理器的IO 口给传感器模块提供电源，并读取传感器节点ID，微控制器通过SPI 接口与无线射频模块连接。The invention receives and converts radio frequency energy with a center frequency of 915MHz through a printed board antenna, and the energy conversion module converts the received radio frequency energy into a DC signal, stores it in a storage capacitor with a large capacity and low leakage current, and outputs the DC voltage through a low The power consumption regulator chip rectifies to obtain a stable DC voltage, which supplies power to the entire node. The energy conversion module is connected with the signal strength monitoring module and the microcontroller module, and the signal strength data can be obtained by monitoring the analog voltage value of the energy conversion module in real time, and energy management can be performed to reduce energy consumption. The energy conversion rate of the energy conversion module is high, and the available energy obtained is high. The microcontroller uses the general IO port to connect to the sensor module, and the IO port of the microprocessor provides power to the sensor module and reads the sensor node ID. The microcontroller is connected to the radio frequency module through the SPI interface.
本节点采用的微控制器芯片可以选择MICROCHIP公司的PIC24F16KA102，但不限于此。其中第10、25引脚接供电电压VDD，第6引脚连接传感器的电源引脚，第7、8、9引脚控制能量转换模块，进行能量的管理，第3、27引脚通过运算放大器U4进行数据处理，实时监测信号强度，第2、4、28引脚作为ADC模拟输入通道连接光强传感器、温度传感器和湿度传感器的模拟量输出，第7、8、9引脚连接能量转换模块，第13、14、15引脚连接选择器S1，读取传感器的ID，第16、18、19、21引脚是微控制器的SPI接口，连接无线射频芯片U4，第17、22、23引脚连接无线射频芯片U4。通信保持自主性。The microcontroller chip used in this node can choose PIC24F16KA102 from MICROCHIP Company, but it is not limited to this. Among them, the 10th and 25th pins are connected to the power supply voltage VDD, the 6th pin is connected to the power supply pin of the sensor, the 7th, 8th, and 9th pins control the energy conversion module for energy management, and the 3rd and 27th pins pass through the operational amplifier. U4 performs data processing and monitors the signal strength in real time. The 2nd, 4th, and 28th pins are used as ADC analog input channels to connect the analog output of the light intensity sensor, temperature sensor and humidity sensor, and the 7th, 8th, and 9th pins are connected to the energy conversion module. , the 13th, 14th, and 15th pins are connected to the selector S1 to read the ID of the sensor, the 16th, 18th, 19th, and 21st pins are the SPI interface of the microcontroller, connected to the wireless radio frequency chip U4, and the 17th, 22nd, and 23rd pins are the SPI interface of the microcontroller. The pin is connected to the wireless radio frequency chip U4. Communication remains autonomous.
所述的无线射频芯片可以采用MICROCHIP的MRF24J40MA，但不限于此。第10电压引脚连接供电电压VDD，第5、6、7、8引脚连接微控制器的SPI接口，第2、3、4引脚连接微控制器。The wireless radio frequency chip can be MRF24J40MA of MICROCHIP, but is not limited thereto. The 10th voltage pin is connected to the power supply voltage VDD, the 5th, 6th, 7th, and 8th pins are connected to the SPI interface of the microcontroller, and the 2nd, 3rd, and 4th pins are connected to the microcontroller.
传感器模块中采用了温度传感器，湿度传感器，光强传感器，并使用了接插件，可扩展其他的传感器。The sensor module uses a temperature sensor, a humidity sensor, and a light intensity sensor, and uses a connector to expand other sensors.
本发明具有的有益效果是：The beneficial effects that the present invention has are:
1、能量转换模块将无线射频信号转换成直流能量，摆脱了传统节点对电池的依赖，并易于通过外围的电容电阻以及微控制器芯片对其输出电压进行调试。采用集成芯片便于产片封装，微处理器模块实时监视能量转换模块收集到的信号强度，进行能量管理，大大提高了能量的转换效率，保证节点的可靠工作。1. The energy conversion module converts radio frequency signals into DC energy, frees traditional nodes from relying on batteries, and is easy to debug its output voltage through peripheral capacitors and resistors and microcontroller chips. The use of integrated chips facilitates chip production and packaging. The microprocessor module monitors the signal strength collected by the energy conversion module in real time and performs energy management, which greatly improves the energy conversion efficiency and ensures the reliable operation of the nodes.
2、微处理器模块可根据能量管理的结果选用合适的低功耗模式，有效降低整个节点对能量的消耗。2. The microprocessor module can select an appropriate low power consumption mode according to the result of energy management, effectively reducing the energy consumption of the entire node.
3、信号强度监测模块实时监测系统接收到的信号强度，进行能量管理，提高能量的转换率和利用率，大大增强了可用功率，延长了节点的寿命。3. The signal strength monitoring module monitors the signal strength received by the system in real time, performs energy management, improves the conversion rate and utilization rate of energy, greatly enhances the available power, and prolongs the life of the node.
4、传感器模块灵活性高，采用了外部接插件，便于扩展。4. The sensor module has high flexibility and uses external connectors for easy expansion.
附图说明Description of drawings
图1是本发明的整体结构框架；Fig. 1 is the overall structural framework of the present invention;
图2是本发明的程序流程图；Fig. 2 is a program flow chart of the present invention;
图3是本发明的能量转换模块电路原理图；Fig. 3 is the circuit principle diagram of the energy conversion module of the present invention;
图4是本发明的微处理器模块和无线射频模块电路原理图；Fig. 4 is a circuit schematic diagram of a microprocessor module and a wireless radio frequency module of the present invention;
图5是本发明的信号强度监测模块电路原理图；Fig. 5 is a circuit schematic diagram of the signal strength monitoring module of the present invention;
图6是本发明的传感器模块电路原理图。Fig. 6 is a circuit schematic diagram of the sensor module of the present invention.
具体实施方式Detailed ways
下面结合附图和实施例对本发明作进一步说明。The present invention will be further described below in conjunction with drawings and embodiments.
如图1所示，描述了该新型节点的整体结构组成：它主要由PCB天线、能量转换模块、微处理器模块、传感器模块、无线射频模块和信号强度监测模块组成。PCB天线和能量转换模块相连，能量转换模块为微处理器模块和无线射频模块供电，微处理器模块通过IO端口与传感器模块和信号强度监测模块相连，通过SPI接口与无线射频模块连接。As shown in Figure 1, the overall structure of the new node is described: it is mainly composed of PCB antenna, energy conversion module, microprocessor module, sensor module, wireless radio frequency module and signal strength monitoring module. The PCB antenna is connected to the energy conversion module, and the energy conversion module supplies power to the microprocessor module and the radio frequency module. The microprocessor module is connected to the sensor module and the signal strength monitoring module through the IO port, and connected to the radio frequency module through the SPI interface.
PCB天线收集射频能量并传输到能量转换模块中，能量转换模块将输入的射频信号转换成直流存储在大电容中，输出的直流电压经过稳压子模块的整流，输出稳定的直流电压，给整个节点供电。通过微处理器模块和信号强度监测模块对能量转换模块接收到的信号强度的实时监测，可以对能量进行管理，提高能量的转换率和利用率，最大化可用能量并合理利用。微处理器模块除了监测信号强度以外，也控制传感器模块的数据采集，微处理器模块将传感器模块采集到的温度、光强、湿度参数以及信号强度监测模块采集到的信号强度参数等等进行处理，通过无线射频模块将这些数据发送给上位机并和上位机进行通信。微处理器模块负责整个节点的控制工作。The PCB antenna collects radio frequency energy and transmits it to the energy conversion module. The energy conversion module converts the input radio frequency signal into DC and stores it in a large capacitor. The node is powered. Through the real-time monitoring of the signal strength received by the energy conversion module by the microprocessor module and the signal strength monitoring module, the energy can be managed, the conversion rate and utilization rate of the energy can be improved, and the available energy can be maximized and rationally utilized. In addition to monitoring the signal strength, the microprocessor module also controls the data collection of the sensor module. The microprocessor module processes the temperature, light intensity, humidity parameters collected by the sensor module and the signal strength parameters collected by the signal strength monitoring module, etc. , send these data to the host computer through the radio frequency module and communicate with the host computer. The microprocessor module is responsible for the control work of the whole node.
如图2所示，描述了该系统的工作过程。当微控制器监测到能量充足时，采集传感器的数据，并进行通讯，完成后延时10s，再次监测能量。As shown in Figure 2, the working process of the system is described. When the microcontroller detects that the energy is sufficient, it collects the data of the sensor and communicates. After the completion of the delay of 10s, the energy is monitored again.
如图3所示，是能量转换模块的电路图。能量转换模块主要由天线Antenna、能量转换芯片U1、稳压芯片U2、可变电阻R1、R2、电阻R3-R5、电容C1-C7、接插件J1组成。其中U1可选择POWERCAST公司的P2110芯片，但不限于此，U2可以选择ON Semiconductor公司的稳压器NCP698SQ30，不限于此。能量转换芯片U1的模拟地引脚（2脚、4脚、11脚）接地，能量转换芯片U1的射频输入引脚（3脚）与PCB天线相接，能量转换芯片U1的模拟输入引脚（5脚，DSET）与接插件J1的一端相连，接插件J1的另一端与电阻R3的一端相连，电阻R3的另一端与能量转换芯片U1的直流电压（12脚）输出引脚相连，复位输入引脚（7脚）也与电容C2的一端相连，电容C2的另一端接地；电压存储引脚（8脚）与电容C3的一端相接，电容C3的另一端接地；输出电压控制引脚（10脚）与可变电阻R1和电阻R2的一端相连，可变电阻R2的另一端接地，可变电阻R1的另一端与能量转换芯片U1的电压输出引脚（12脚，VOUT）、电容C1、电阻R4的一端相接，电容C1的另一端接地，电阻R4的另一端与电容C4的一端、稳压芯片U2的输入电压引脚（2脚）、使能引脚（4脚）、电阻R5的一端相接，电容C4的另一端接地，稳压芯片U2的稳压电压输出引脚（3脚）与电阻R5的另一端相接，也与电容C5的一端相接，C5的另一端接地，稳压芯片的稳压电压输出引脚（3脚）输出稳定的直流电压VDD。在能量转换模块中，U1将射频输入引脚（3脚）输入的射频信号转变为直流存储在电容C3中，能量转换芯片U1的电压输出引脚（12脚）输出直流，经过稳压芯片稳压，稳压芯片U2的稳压电压输出引脚（3脚）输出稳定电压VDD，给传感器节点供电。As shown in Figure 3, it is a circuit diagram of the energy conversion module. The energy conversion module is mainly composed of antenna Antenna, energy conversion chip U1, voltage regulator chip U2, variable resistors R1, R2, resistors R3-R5, capacitors C1-C7, and connector J1. Among them, U1 can choose the P2110 chip of POWERCAST company, but not limited to this, and U2 can choose the voltage regulator NCP698SQ30 of ON Semiconductor company, but not limited to this. The analog ground pins (pins 2, 4, and 11) of the energy conversion chip U1 are grounded, the RF input pin (pin 3) of the energy conversion chip U1 is connected to the PCB antenna, and the analog input pins of the energy conversion chip U1 ( 5 pins, DSET) is connected to one end of connector J1, the other end of connector J1 is connected to one end of resistor R3, the other end of resistor R3 is connected to the output pin of DC voltage (12 pins) of energy conversion chip U1, reset input The pin (pin 7) is also connected to one end of capacitor C2, and the other end of capacitor C2 is grounded; the voltage storage pin (pin 8) is connected to one end of capacitor C3, and the other end of capacitor C3 is grounded; the output voltage control pin ( 10 pins) connected to one end of the variable resistor R1 and resistor R2, the other end of the variable resistor R2 is grounded, the other end of the variable resistor R1 is connected to the voltage output pin (12 pins, VOUT) of the energy conversion chip U1, capacitor C1 , one end of the resistor R4 is connected, the other end of the capacitor C1 is grounded, the other end of the resistor R4 is connected to one end of the capacitor C4, the input voltage pin (pin 2) of the voltage regulator chip U2, the enable pin (pin 4), the resistor One end of R5 is connected, the other end of capacitor C4 is grounded, the voltage regulator chip U2’s voltage output pin (pin 3) is connected to the other end of resistor R5, and also connected to one end of capacitor C5, and the other end of C5 Grounded, the regulated voltage output pin (pin 3) of the voltage regulator chip outputs a stable DC voltage VDD. In the energy conversion module, U1 converts the RF signal input by the RF input pin (pin 3) into DC and stores it in capacitor C3, and the voltage output pin (pin 12) of the energy conversion chip U1 outputs DC, which is stabilized by the voltage regulator chip. The regulated voltage output pin (pin 3) of the voltage regulator chip U2 outputs a stable voltage VDD to supply power to the sensor nodes.
如图4所示，描述了微处理模块和无线射频模块的电路连接情况。微处理器模块主要由微处理器U3、二极管D1、开关S1、电阻R6，电容C6、C7组成，无线射频模块主要由无线射频芯片U5、电阻R18组成，其中微处理器U3可以选用MICROCHIP公司的PIC24F16KA102芯片，但不限于此，无线射频芯片U5可选择Microchip公司的MRF24J40MA芯片，不限于此。微处理器的U3的模拟地引脚（5脚、24脚）分别接地，微处理器U3的第7引脚与能量收集模块U1的模拟输入引脚（5脚，DSET）相连，微处理器U3的第8引脚与能量收集模块U1的复位引脚（7脚）相连、微处理器U3的第9引脚与能量收集模块U1的中断输入引脚（6脚）相连，微处理器U3的电源引脚（10脚、25脚）输入稳定电压VDD，并与电容C7的一端相连，电容C7的另一端接地，微处理器U3的I/O引脚（13脚、14脚、15脚）分别于开关S1的第1、2、3引脚相连，S1的4、5、6引脚分别接地，微处理器的U3的SPI引脚（16脚、21脚、18脚、19脚）分别与无线射频芯片U5的第8、5、7、6引脚相连，微处理器的U3的中断引脚（22脚）与无线射频芯片U5的第4引脚相连，微处理器的U3的第17引脚、第23引脚分别与无线射频芯片U5的第2引脚、第3引脚相连，无线射频芯片U5的 I/O引脚（2脚）与电阻R18的一端相接，电阻R18的另一端接地，微处理器的U3的清除输入引脚（26脚）与二极管D1的负端相连，二极管D1的正端与电阻R6、电容C6的一端相连，电阻R6的另一端与VDD相连，电容C6的另一端接地。微处理器芯片是整个节点的核心，控制了整个节点的工作：能量的监测和管理、节点数据的采集、数据的处理以及通过无线射频芯片将数据收发，其中开关S1可以设定无线传感器节点的ID。As shown in Figure 4, it describes the circuit connection of the micro-processing module and the wireless radio frequency module. The microprocessor module is mainly composed of microprocessor U3, diode D1, switch S1, resistor R6, and capacitors C6 and C7. The radio frequency module is mainly composed of radio frequency chip U5 and resistor R18. The microprocessor U3 can be selected from MICROCHIP company PIC24F16KA102 chip, but not limited to this, the wireless radio frequency chip U5 can choose MRF24J40MA chip of Microchip Company, but not limited to this. The analog ground pins (5 pins, 24 pins) of the microprocessor U3 are respectively grounded, the 7th pin of the microprocessor U3 is connected to the analog input pin (5 pins, DSET) of the energy harvesting module U1, and the microprocessor The 8th pin of U3 is connected with the reset pin (7 pins) of the energy harvesting module U1, the 9th pin of the microprocessor U3 is connected with the interrupt input pin (6 pins) of the energy harvesting module U1, and the microprocessor U3 The power supply pins (10 pins, 25 pins) input the stable voltage VDD, and connected to one end of the capacitor C7, the other end of the capacitor C7 is grounded, the I/O pins (13 pins, 14 pins, 15 pins) of the microprocessor U3 ) are connected to pins 1, 2, and 3 of switch S1 respectively, pins 4, 5, and 6 of S1 are grounded respectively, and SPI pins of U3 of the microprocessor (pins 16, 21, 18, and 19) Connect to the 8th, 5th, 7th, 6th pins of the wireless radio frequency chip U5, the interrupt pin (22 pins) of the microprocessor U3 is connected to the 4th pin of the wireless radio frequency chip U5, and the U3 pin of the microprocessor The 17th pin and the 23rd pin are respectively connected with the 2nd pin and the 3rd pin of the wireless radio frequency chip U5, and the I/O pin (2 pin) of the wireless radio frequency chip U5 is connected with one end of the resistor R18, and the resistor The other end of R18 is grounded, the clear input pin (pin 26) of U3 of the microprocessor is connected to the negative end of diode D1, the positive end of diode D1 is connected to resistor R6 and one end of capacitor C6, and the other end of resistor R6 is connected to VDD connected, and the other end of capacitor C6 is grounded. The microprocessor chip is the core of the entire node, controlling the work of the entire node: energy monitoring and management, node data collection, data processing, and data transmission and reception through the wireless radio frequency chip, in which the switch S1 can set the wireless sensor node ID.
如图5所示，是信号强度监测模块的电路原理图。信号强度监测模块主要由运算放大器U4、场效应管Q1-Q2、电阻R7-R17、电容C8-C10组成，其中运算放大器U4可选择MICROCHIP公司的MCP6L04，但不限于此，场效应管Q1、Q2可以选择ON Semiconductor公司的NTA4153N芯片，不限于此。信号强度监测模块中运算放大器U4的正偏置引脚（4脚）与VDD相连，运算放大器U4的第一输出引脚（1脚）与运算放大器U4的第二正相输入引脚（5脚）、电阻R11的一端相连，电阻R11的另一端与电阻R10、运算放大器U4的第一负相输入引脚（2脚）一端相连，电阻R10的另一端和电容C8和电阻R9的一端相连，运算放大器U4的第一正相输入引脚（3脚）、负偏置引脚（11脚）与电阻R8、R9、R12、R15、电容C9、C10、场效应管Q2的栅极（3脚）一端相连，电阻R8的另一端与电容C8、场效应管Q1的源极（2脚）、电阻R7、微处理器芯片U3的第27引脚一端相连，电阻R7的另一端与场效应管Q1的栅极（3脚）和能量转换芯片U1的模拟输出引脚（13脚，DOUT）一端相连，场效应管Q2的门极（1脚）与场效应管Q1的门极（1脚）、能量转换芯片U1的模拟输入（5脚,DSET）一端相连，场效应Q2的源极（2脚）接地，电阻R12的另一端与运算放大器U4的第二负相输入引脚（6脚）、电阻R13的一端相连，电阻R13的另一端与运算放大器U4的第二输出（7脚）、电阻R16的一端相连，电阻R15的另一端与运算放大器U4的第三负相输入引脚（10脚）、电阻R14的一端相连，电阻R14另一端与电源VDD相连，电容C9、C10的另一端分别接VDD，电阻R16的另一端与运算放大器U4的第三正相输入引脚（9脚）、电阻R17的一端相连，电阻R17的另一端与运算放大器U4的第三输出引脚（8脚）、微处理器U3的第3引脚相连。信号强度监测模块中通过控制DSET引脚可以来对能量转换模块中U1的模拟输出引脚（13脚，DOUT）和微处理器模块U3的第27引脚的信号进行解调放大，运算放大器U4的第三输出（8脚）经过解调放大的信号给微处理器模块U3的第3引脚，实现信号强度的实时监测，这对能量管理利用提供了很大的方便，大大提高了能量的转换率和利用率。As shown in Figure 5, it is a circuit schematic diagram of the signal strength monitoring module. The signal strength monitoring module is mainly composed of operational amplifier U4, field effect transistors Q1-Q2, resistors R7-R17, and capacitors C8-C10. Among them, the operational amplifier U4 can choose MCP6L04 from MICROCHIP Company, but not limited to this. Field effect transistors Q1 and Q2 The NTA4153N chip of ON Semiconductor can be selected, but is not limited to this. The positive bias pin (pin 4) of the operational amplifier U4 in the signal strength monitoring module is connected to VDD, the first output pin (pin 1) of the operational amplifier U4 is connected to the second non-inverting input pin (pin 5) of the operational amplifier U4 ), one end of resistor R11 is connected, the other end of resistor R11 is connected with resistor R10 and one end of the first negative input pin (pin 2) of operational amplifier U4, the other end of resistor R10 is connected with capacitor C8 and one end of resistor R9, The first positive phase input pin (pin 3) and negative bias pin (pin 11) of the operational amplifier U4 are connected to resistors R8, R9, R12, R15, capacitors C9, C10, and the gate of field effect transistor Q2 (pin 3). ) is connected to one end, the other end of the resistor R8 is connected to the capacitor C8, the source (pin 2) of the FET Q1, the resistor R7, and the 27th pin of the microprocessor chip U3, and the other end of the resistor R7 is connected to the FET The gate (pin 3) of Q1 is connected to the analog output pin (pin 13, DOUT) of the energy conversion chip U1, and the gate (pin 1) of the field effect transistor Q2 is connected to the gate (pin 1) of the field effect transistor Q1. 1. One end of the analog input (pin 5, DSET) of the energy conversion chip U1 is connected, the source (pin 2) of the field effect Q2 is grounded, and the other end of the resistor R12 is connected to the second negative input pin (pin 6) of the operational amplifier U4 1. One end of the resistor R13 is connected, the other end of the resistor R13 is connected with the second output (pin 7) of the operational amplifier U4, one end of the resistor R16 is connected, and the other end of the resistor R15 is connected with the third negative input pin of the operational amplifier U4 (10 Pin), one end of the resistor R14 is connected, the other end of the resistor R14 is connected to the power supply VDD, the other end of the capacitors C9 and C10 are respectively connected to VDD, and the other end of the resistor R16 is connected to the third non-inverting input pin (pin 9) of the operational amplifier U4 1. One end of the resistor R17 is connected, and the other end of the resistor R17 is connected with the third output pin (pin 8) of the operational amplifier U4 and the third pin of the microprocessor U3. In the signal strength monitoring module, by controlling the DSET pin, the signal of the analog output pin (13 pin, DOUT) of U1 in the energy conversion module and the 27th pin of the microprocessor module U3 can be demodulated and amplified, and the operational amplifier U4 The demodulated and amplified signal of the third output (pin 8) is sent to the third pin of the microprocessor module U3 to realize real-time monitoring of signal strength, which provides great convenience for energy management and utilization, and greatly improves energy efficiency. Conversion and utilization.
如图6所示，是传感器模块的电路原理图。传感器模块主要有温度传感器、湿度传感器、光强传感器和扩展传感器、传感器电压控制组成。温度传感器主要由温度传感器R20、电阻R19、电容C12组成，其中温度传感器R20可选择Murata公司的NCP18XH103F03RB热敏电阻但不限于此。温度传感器R20与电阻R19 、电容C12、微处理器U3的第4引脚的一端相连，电阻R19的另一端与接插件J2的第2引脚相连，温度传感器R20和电容C12的另一端分别接地。湿度传感器主要由湿度传感器U6、电阻R21、电容C13、C14组成，其中湿度传感器U6可选择Honeywell公司的HIH-5030芯片，但不限于此。湿度传感器子模块中湿度传感器U6的负相输入引脚（1脚）接地，湿度传感器U6的湿度输出引脚（3脚）与电阻R21、电容C14、微控制器U3的第28引脚的一端相连，电阻R21与电容C14的另一端分别接地，湿度传感器U6的正相输入引脚（3脚）与电容C13、接插件J2的第6引脚相接，电容C13的另一端接地。光强传感器主要由光强传感器U7、电阻R22、电容C15组成，其中光强传感器U7可选择Vishay公司的TEMT6000X01，但不限于此，光强传感器U7的光强输出引脚（1脚）与微处理器第2引脚、电容C15、电阻R22的一端相连，电容C15的另一端接地，电阻R22的另一端与接插件J2的第4引脚相连，光强传感器的地引脚（3脚）接地。扩展传感器主要由接插件J3和电容C16组成，其中接插件J3的第1引脚与接插件J2的第8引脚相连，接插件J3的第2引脚与微处理器模块的U3的第1引脚、电容C16的一端相连，电容C16的另一端接地，接插件J3的第3引脚接地。传感器电压控制主要由接插件J2，场效应管Q3，电阻R23，电容C11组成，其中芯片场效应管Q3可以选择ON Semiconductor公司的NTA4151PT1G芯片，但不限于此。接插件J2的第1、3、5、7引脚与电容C11、场效应管Q3的第3引脚一端相连，电容C11的另一端接地，场效应管Q3第2引脚与VDD相连，场效应管Q3第1引脚与电阻R23、微处理器U3第6引脚的一端相接，电阻R23的另一端接VDD。通过接插件J2可以控制温度、湿度、光强传感器的选择使用，其中接插件J3是用于传感器的扩展，灵活方便。As shown in Figure 6, it is a schematic circuit diagram of the sensor module. The sensor module mainly consists of temperature sensor, humidity sensor, light intensity sensor, extended sensor, and sensor voltage control. The temperature sensor is mainly composed of a temperature sensor R20, a resistor R19, and a capacitor C12. The temperature sensor R20 can be selected from Murata's NCP18XH103F03RB thermistor, but is not limited thereto. The temperature sensor R20 is connected to the resistor R19, the capacitor C12, and one end of the fourth pin of the microprocessor U3, the other end of the resistor R19 is connected to the second pin of the connector J2, and the other end of the temperature sensor R20 and the capacitor C12 are respectively grounded . The humidity sensor is mainly composed of a humidity sensor U6, a resistor R21, and capacitors C13 and C14. The humidity sensor U6 can choose the HIH-5030 chip of Honeywell, but is not limited thereto. The negative phase input pin (pin 1) of the humidity sensor U6 in the humidity sensor sub-module is grounded, the humidity output pin (pin 3) of the humidity sensor U6 is connected to one end of the resistor R21, the capacitor C14, and the 28th pin of the microcontroller U3 Connected, the resistor R21 and the other end of the capacitor C14 are respectively grounded, the non-inverting input pin (pin 3) of the humidity sensor U6 is connected to the capacitor C13 and the sixth pin of the connector J2, and the other end of the capacitor C13 is grounded. The light intensity sensor is mainly composed of light intensity sensor U7, resistor R22, and capacitor C15. The light intensity sensor U7 can choose Vishay’s TEMT6000X01, but it is not limited to this. The light intensity output pin (pin 1) of the light intensity sensor U7 is connected to the micro The second pin of the processor, the capacitor C15, and one end of the resistor R22 are connected, the other end of the capacitor C15 is grounded, the other end of the resistor R22 is connected to the fourth pin of the connector J2, and the ground pin of the light sensor (pin 3) grounded. The extended sensor is mainly composed of connector J3 and capacitor C16, wherein the first pin of connector J3 is connected with the eighth pin of connector J2, and the second pin of connector J3 is connected with the first pin of U3 of the microprocessor module. pin, one end of capacitor C16 is connected, the other end of capacitor C16 is grounded, and the third pin of connector J3 is grounded. The sensor voltage control is mainly composed of connector J2, field effect transistor Q3, resistor R23, and capacitor C11. Among them, the chip field effect transistor Q3 can choose the NTA4151PT1G chip of ON Semiconductor, but is not limited to this. The 1st, 3rd, 5th, and 7th pins of the connector J2 are connected to the capacitor C11 and one end of the third pin of the field effect transistor Q3, the other end of the capacitor C11 is grounded, and the second pin of the field effect transistor Q3 is connected to VDD. The first pin of the effect tube Q3 is connected to the resistor R23 and one end of the sixth pin of the microprocessor U3, and the other end of the resistor R23 is connected to VDD. The selection and use of temperature, humidity and light intensity sensors can be controlled through the connector J2, and the connector J3 is used for sensor expansion, which is flexible and convenient.
上述实施例用来解释说明本发明，而不是对本发明进行限制，在本发明的精神和权利求的保护范围内，对本发明做出的任何修改和改变，都落入本发明的保护范围。The above-mentioned embodiments are used to explain the present invention, rather than to limit the present invention. Within the spirit of the present invention and the protection scope of the claims, any modification and change made to the present invention will fall into the protection scope of the present invention.
| Application Number | Priority Date | Filing Date | Title |
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| CN201210455900.6ACN102938897B (en) | 2012-11-14 | 2012-11-14 | Wireless charging node capable of monitoring signal strength in real time |
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| CN201210455900.6ACN102938897B (en) | 2012-11-14 | 2012-11-14 | Wireless charging node capable of monitoring signal strength in real time |
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| CN102938897A CN102938897A (en) | 2013-02-20 |
| CN102938897Btrue CN102938897B (en) | 2015-04-15 |
| Application Number | Title | Priority Date | Filing Date |
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| CN201210455900.6AActiveCN102938897B (en) | 2012-11-14 | 2012-11-14 | Wireless charging node capable of monitoring signal strength in real time |
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| CN102013737A (en)* | 2010-10-12 | 2011-04-13 | 浙江大学 | Wirelessly charged sensor node |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101902062A (en)* | 2010-08-06 | 2010-12-01 | 武汉中原电子集团有限公司 | Vehicle-mounted wireless charging device |
| CN102013737A (en)* | 2010-10-12 | 2011-04-13 | 浙江大学 | Wirelessly charged sensor node |
| CN102005828A (en)* | 2010-11-30 | 2011-04-06 | 电子科技大学 | Wireless sensor network node wireless charging system and method based on time reflection |
| Publication number | Publication date |
|---|---|
| CN102938897A (en) | 2013-02-20 |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
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