





技术领域technical field
本发明涉及一种基板,尤其涉及一种电容阵列基板。The invention relates to a substrate, in particular to a capacitance array substrate.
背景技术Background technique
图1是一种现有电容阵列基板的示意图。请参照图1,在现有电容阵列基板100中,排成阵列的电容110是由水平方向的走线120与垂直方向的走线130连接。由于走线120与走线130分别平行于电容阵列基板100的两个侧边,若要在同一侧进行所有的信号传输,则需在电容阵列基板100的侧边布设用于走线120的信号线140。如此一来,就大幅增加了电容阵列基板100的侧边的宽度,不仅增加电容阵列基板100的成本,过长的信号线140也容易导致信号品质下降。FIG. 1 is a schematic diagram of a conventional capacitor array substrate. Referring to FIG. 1 , in a conventional
发明内容Contents of the invention
本发明提供一种电容阵列基板,具有精简的尺寸。The invention provides a capacitor array substrate with compact size.
本发明的电容阵列基板包括一基板、多条第一走线、多条第二走线、多个电容器、多条连接线以及多条信号线。基板具有一第一侧、一第二侧与一第三侧。第一侧连接第二侧。第一侧连接第三侧。第一走线互相平行地配置于基板。各第一走线不垂直也不平行第一侧。第二走线互相平行地配置于基板。电容器配置于基板,位于第一走线与第二走线的交会处,且连接第一走线与第二走线。连接线配置于基板的第二侧与第三侧,每条连接线连接一条第一走线与一条第二走线。信号线配置于基板。每条信号线连接一条第一走线或一条第二走线,并从第一侧传输信号。The capacitor array substrate of the present invention includes a substrate, a plurality of first wirings, a plurality of second wirings, a plurality of capacitors, a plurality of connection lines and a plurality of signal lines. The substrate has a first side, a second side and a third side. The first side connects to the second side. The first side connects to the third side. The first traces are arranged on the substrate parallel to each other. Each first trace is neither perpendicular nor parallel to the first side. The second wires are arranged parallel to each other on the substrate. The capacitor is arranged on the substrate, located at the intersection of the first wiring and the second wiring, and connected to the first wiring and the second wiring. The connecting wires are arranged on the second side and the third side of the substrate, and each connecting wire connects a first routing and a second routing. The signal line is configured on the substrate. Each signal line is connected to a first trace or a second trace, and transmits signals from the first side.
在本发明的一实施例中,第一走线垂直第二走线。In an embodiment of the present invention, the first trace is perpendicular to the second trace.
在本发明的一实施例中,第一走线与第一侧的夹角为45度。In an embodiment of the present invention, the angle between the first trace and the first side is 45 degrees.
在本发明的一实施例中,连接线未交会。In an embodiment of the invention, the connecting lines do not intersect.
在本发明的一实施例中,连接线相交会。In an embodiment of the present invention, the connecting lines intersect.
在本发明的一实施例中,第一侧垂直第二侧。In an embodiment of the invention, the first side is perpendicular to the second side.
基于上述,在本发明的电容阵列基板中,连接电容器的走线都倾斜于基板的侧边,再搭配连接线,即可缩小布线所需面积。Based on the above, in the capacitor array substrate of the present invention, the traces connecting the capacitors are all inclined to the side of the substrate, and the connecting wires are combined to reduce the area required for the wiring.
为让本发明的上述特征和优点能更明显易懂,下文特举实施例,并配合附图作详细说明如下。In order to make the above-mentioned features and advantages of the present invention more comprehensible, the following specific embodiments are described in detail with reference to the accompanying drawings.
附图说明Description of drawings
图1是一种现有电容阵列基板的示意图。FIG. 1 is a schematic diagram of a conventional capacitor array substrate.
图2是本发明一实施例的电容阵列基板的示意图。FIG. 2 is a schematic diagram of a capacitor array substrate according to an embodiment of the present invention.
图3是本发明另一实施例的电容阵列基板的示意图。FIG. 3 is a schematic diagram of a capacitor array substrate according to another embodiment of the present invention.
图4是本发明另一实施例的电容阵列基板的示意图。FIG. 4 is a schematic diagram of a capacitor array substrate according to another embodiment of the present invention.
图5是本发明另一实施例的电容阵列基板的示意图。FIG. 5 is a schematic diagram of a capacitor array substrate according to another embodiment of the present invention.
图6是本发明另一实施例的电容阵列基板的示意图。FIG. 6 is a schematic diagram of a capacitor array substrate according to another embodiment of the present invention.
附图标记:Reference signs:
100:电容阵列基板100: capacitor array substrate
110:电容110: capacitance
120、130:走线120, 130: wiring
140:信号线140: signal line
200、300、400、500、600:电容阵列基板200, 300, 400, 500, 600: capacitor array substrate
210、610:基板210, 610: Substrate
212、412、512、612:第一侧212, 412, 512, 612: first side
214、414、514:第二侧214, 414, 514: second side
216、416、516、616:第三侧216, 416, 516, 616: third side
220、320、620:第一走线220, 320, 620: the first routing
230、330、630:第二走线230, 330, 630: the second routing
240:电容器240: Capacitor
250、350、550:连接线250, 350, 550: connection line
260、360、660:信号线260, 360, 660: signal line
具体实施方式Detailed ways
图2是本发明一实施例的电容阵列基板的示意图。请参照图2,本实施例的电容阵列基板200包括一基板210、多条第一走线220、多条第二走线230、多个电容器240、多条连接线250以及多条信号线260。基板210具有一第一侧212、一第二侧214与一第三侧216。第一侧212连接第二侧214,而第一侧212也可垂直第二侧214。第一侧212连接第三侧216,但第一侧212可垂直或不垂直第三侧216。基板210通常呈矩形,但不限于此。各条第一走线220互相平行地配置于基板210,且各条第一走线220不垂直也不平行第一侧212。换言之,若第一侧212的边缘为水平的,则第一走线220不会呈垂直或水平状态。各条第二走线230互相平行地配置于基板210。FIG. 2 is a schematic diagram of a capacitor array substrate according to an embodiment of the present invention. Please refer to FIG. 2, the
在此,“垂直”与“平行”都是指概略的状态,并不局限需非常精准,可容许因制程误差或刻意变化而造成的近似垂直与近似平行。Here, "perpendicular" and "parallel" both refer to a rough state, and are not limited to be very precise, and approximately vertical and approximately parallel due to process errors or deliberate changes can be tolerated.
电容器240配置于基板210。每个电容器240位于一条第一走线220与一条第二走线230的交会处,且连接一条第一走线220与一条第二走线230。连接线250配置于基板210的第二侧214与第三侧216。每条连接线250连接一条第一走线220与一条第二走线230。信号线260配置于基板210。每条信号线260连接一条第一走线220或一条第二走线230,并从第一侧212传输信号。The
依据此配置方式,每个电容器240都可经由两条信号线260而被控制,每个电容器240的电容值变化也可由两条信号线260而被感知。而且,基板210的第二侧214与第三侧216只要保留少许空间就可供配置连接线250。因此,本实施例的电容阵列基板200在精简的尺寸下,就可达成单侧传输信号的目的,大幅降低了整体成本。另外,信号线260与连接线250的长度也可被控制在较短的状态,以提升信号的传输品质。According to this configuration, each
本实施例的第一走线220垂直第二走线230。此外,本实施例的第一走线220与第一侧212的夹角为45度。另外,本实施例的各条连接线250之间未交会,亦即各条连接线250是连接最靠近自己的第一走线220与第二走线230。The first wiring 220 in this embodiment is perpendicular to the
图3是本发明另一实施例的电容阵列基板的示意图。请参照图3,本实施例的电容阵列基板300与图2的电容阵列基板200相似,差异在于本实施例的连接线350与其他连接线350相交会,甚至连接线350也可能与信号线360相交会。换言之,连接线350并非连接最靠近自己的第一走线320与第二走线330。这种设计方式可优化电容器阵列的电位分布,进而提升电容阵列基板300的效能。FIG. 3 is a schematic diagram of a capacitor array substrate according to another embodiment of the present invention. Please refer to FIG. 3, the
图4是本发明另一实施例的电容阵列基板的示意图。请参照图4,本实施例的电容阵列基板400与图2的电容阵列基板200相似,差异在于本实施例的电容阵列基板400的第一侧412的长度大于第二侧414与第三侧416的长度。由本实施例可知,本发明也可应用在呈长方形的电容阵列基板400。FIG. 4 is a schematic diagram of a capacitor array substrate according to another embodiment of the present invention. Please refer to FIG. 4, the
图5是本发明另一实施例的电容阵列基板的示意图。请参照图5,本实施例的电容阵列基板500与图2的电容阵列基板200相似,差异在于本实施例的电容阵列基板500的第一侧512的长度小于第二侧514与第三侧516的长度。由本实施例可知,本发明也可应用在呈长方形且以短边为信号传输侧的电容阵列基板500。另外,在电容阵列基板500的第二侧514或第三侧516,也可取消部分靠近第一侧512的连接线550而取代为直接连接信号侧的信号线。FIG. 5 is a schematic diagram of a capacitor array substrate according to another embodiment of the present invention. Please refer to FIG. 5, the
图6是本发明另一实施例的电容阵列基板的示意图。请参照图6,本实施例的电容阵列基板600与图5的电容阵列基板500相似,差异在于本实施例的信号线660并不是仅连接最靠近第一侧612的第一走线620与第二走线630,位于第三侧616的部分信号线660会朝基板610内部延伸而连接基板610内部的第一走线620或第二走线630。FIG. 6 is a schematic diagram of a capacitor array substrate according to another embodiment of the present invention. Please refer to FIG. 6, the
综上所述,在本发明的电容阵列基板中,连接电容器的走线都倾斜于基板的侧边,易于由同一侧进行信号的传输。另外,再搭配连接线,即可在保有大尺寸的可工作面积下缩小布线所占面积,进而降低成本。To sum up, in the capacitor array substrate of the present invention, the wires connecting the capacitors are all inclined to the side of the substrate, and it is easy to transmit signals from the same side. In addition, with connecting wires, the area occupied by wiring can be reduced while maintaining a large workable area, thereby reducing costs.
虽然本发明已以实施例揭示如上,然其并非用以限定本发明,任何所属技术领域的普通技术人员,当可作些许更动与润饰,而不脱离本发明的精神和范围。Although the present invention has been disclosed above with the embodiments, it is not intended to limit the present invention, and any person of ordinary skill in the art may make some changes and modifications without departing from the spirit and scope of the present invention.
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011101621458ACN102832209A (en) | 2011-06-16 | 2011-06-16 | Capacitor array substrate |
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011101621458ACN102832209A (en) | 2011-06-16 | 2011-06-16 | Capacitor array substrate |
| Publication Number | Publication Date |
|---|---|
| CN102832209Atrue CN102832209A (en) | 2012-12-19 |
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011101621458APendingCN102832209A (en) | 2011-06-16 | 2011-06-16 | Capacitor array substrate |
| Country | Link |
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| CN (1) | CN102832209A (en) |
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| CN106486500A (en)* | 2016-12-28 | 2017-03-08 | 京东方科技集团股份有限公司 | Flexible array substrate and its manufacture method, flexible display panels and display device |
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| JP3139495U (en)* | 2007-11-22 | 2008-02-21 | 洋華光電股▲ふん▼有限公司 | Capacitor induction touch induction device |
| CN201166842Y (en)* | 2008-03-26 | 2008-12-17 | 南京华睿川电子科技有限公司 | Interior surface capacitance touch screen capable of multi-point touch control |
| TW200944877A (en)* | 2008-04-30 | 2009-11-01 | Tpo Displays Corp | Display device having touch sensor input device |
| CN201741138U (en)* | 2010-03-10 | 2011-02-09 | 深圳宝明精工有限公司 | Elliptic bridging type capacitive touch screen |
| CN201638191U (en)* | 2010-04-22 | 2010-11-17 | 厦门万德宏光电科技有限公司 | Capacitive touch screen |
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106486500A (en)* | 2016-12-28 | 2017-03-08 | 京东方科技集团股份有限公司 | Flexible array substrate and its manufacture method, flexible display panels and display device |
| CN106486500B (en)* | 2016-12-28 | 2018-11-16 | 京东方科技集团股份有限公司 | Flexible array substrate and its manufacturing method, flexible display panels and display device |
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