CN102820262A - Glass through hole manufacturing and interconnecting method - Google Patents

Abstract

The invention discloses a glass through hole manufacturing and interconnecting method. The method comprises the following steps of: binding and linking a plurality of glass substrates in a laminated manner through a polymer; manufacturing through holes which are vertical with the surfaces of the laminated glass substrates; metallically filling the through holes of the laminated glass; and unlinking the laminated glass. The method provided by the invention has the advantages that the though holes are simultaneously manufactured in a plurality of the layers of the glass substrates by using a glass substrate laminated linking method, so that the problems of low manufacturing efficiency, expensive cost, low yield and the like caused by the traditional method for manufacturing the through hole by using a single substrate can be solved.

Description

Method for manufacturing and interconnecting glass through holes

Technical Field

The invention relates to a method for manufacturing and interconnecting glass through holes, and belongs to the technical field of microelectronic packaging.

Background

With the development of the demand of electronic products toward miniaturization, multifunction, environmental protection, etc., people strive to make electronic systems smaller and higher in integration and function more and more, thereby generating many new technologies, new materials and new designs, wherein the technologies of the stacked chip Package and the System-in-Package (SiP) are typical representatives of the technologies.

The three-dimensional packaging technology refers to a packaging technology of stacking more than two chips in the same package in a vertical direction without changing the size of the package, and the three-dimensional packaging technology is derived from the laminated packaging of a flash memory (NOR/NAND) and an SDRAM (synchronous dynamic random access memory). Through Silicon Vias (TSV) is one of the key technologies in realizing three-dimensional packaging. This is due to the fact that the TSV can achieve full silicon packaging, is compatible with semiconductor CMOS technology, can increase component density in equal proportion, reduces interconnection delay problems, and achieves high-speed interconnection compared with a traditional interconnection mode.

Compared with a common substrate, the silicon substrate TSV has the advantages that: 1) the aperture of the through hole of the silicon substrate is far smaller than that of the through hole of the printed circuit board; 2) the depth-to-width ratio of the through hole of the silicon substrate is far greater than that of the through hole of the printed circuit board; 3) the density of through-holes of the silicon substrate is much greater than that of through-holes of the printed circuit board. Based on the above characteristics, research thereof plays an extremely important role in the development of MEMS and semiconductor processes.

The Glass substrate TGV (through Glass Via) has the advantages compared with the common silicon substrate: 1) the cost is low; 2) the sealing performance is excellent; 3) the insulativity is better; 4) the high-frequency loss is low; 5) a high modulus; 6) transparent and shows excellent optical performance.

The traditional manufacturing process for TGV pore-forming of the single glass substrate comprises the following steps: 1) drilling holes by ultrasonic waves; 2) a sand blasting method; 3) wet etching; 4) dry etching; 5) laser etching; 6) and (6) mechanically drilling.

However, since the processes used are based on a single glass substrate, there is an impact on the price of the final product, and even many processes still have many problems, where high aspect ratio via fabrication is a key issue. Reliability studies for vias continue. For the through hole manufacturing of the single glass substrate, the manufacturing cost is high and the efficiency is low.

Due to various adverse factors of these single-chip conventional manufacturing methods, the yield and reliability of the product, as well as the final shipping price, are greatly affected. Various new process methods are gradually proposed and discussed, but the methods are all performed on the basis of a single-chip manufacturing process, and have the defects of low manufacturing efficiency, high cost and the like.

Disclosure of Invention

The invention aims to overcome the defects in the prior art and provide a method for manufacturing and interconnecting glass through holes, which is used for laminating and bonding multiple layers of glass substrates together and realizing the glass through holes in a mechanical, laser, sand blasting or etching mode and the like so as to effectively finish an interconnection structure adopting a TGV technology in three-dimensional packaging or MEMS packaging.

The technical scheme adopted by the invention comprises a manufacturing method of glass through holes and a manufacturing method of interconnection of the glass through holes.

The manufacturing method of the glass through hole comprises the following steps:

1) laminating and bonding a plurality of glass substrates together by a hot pressing method to form a laminated bonding structure of the multilayer glass substrates;

2) manufacturing a through hole structure vertical to the surface of the laminated glass substrate on the bonded laminated glass substrate;

3) and debonding the laminated glass substrate to separate the glass substrate.

Afterstep 3, each individual glass substrate is cleaned to remove the adhesive, so as to facilitate the subsequent interconnection manufacturing process.

The manufacturing method of the glass through hole interconnection comprises the following steps:

1) laminating and bonding a plurality of glass substrates together by a hot pressing method to form a laminated bonding structure of the multilayer glass substrates;

2) manufacturing a through hole structure vertical to the surface of the laminated glass substrate on the bonded laminated glass substrate;

3) manufacturing an adhesion layer on the side wall of the through hole by adopting a physical deposition or chemical deposition method;

4) filling the through hole of the laminated glass substrate with metallization;

5) and debonding the laminated glass substrate to separate the glass substrate.

Beforestep 3, the laminated glass substrate with the through hole structure is also cleaned to remove the adhesive.

Beforestep 5, chemical mechanical polishing is used to remove the metal on the upper surface of the laminated glass substrate after the metallization filling.

Afterstep 5, each individual glass substrate is thinned to a desired thickness by cleaning and surface planarization polishing.

The material of the adhesion layer is at least one of Ni, Ta, Ti, Pt, Pd, AlN and TiN.

The through hole metallization filling of the laminated glass substrate is realized by means of electroplating, electroless plating, physical deposition or liquid metal filling. The metallization filling adopts one of Cu, Sn, W, Ti, Pt, Pd, Ni and Au as a filling material.

The glass substrate lamination bonding instep 1 of the two methods is realized by a polymer material bonding method, wherein the polymer material is one of Polyimide, SU8 and BCB, and a lamination structure of a multilayer glass substrate and the Polyimide, SU8 or BCB is formed. The through hole is manufactured by adopting one method of mechanical processing, laser processing, sand blasting and drilling or etching. The aperture range of the through hole is 5um-500 um.

In the two methods, the purpose of separating the glass substrate is achieved by dissolving the polymer by using a chemical solution; or the laminated glass substrate is split by using electric sparks, wire cutting, blade cutting and other modes.

The two methods can also comprise a procedure of manufacturing a pattern required by the through hole on the surface of one side of the laminated glass plate substrate before thestep 2.

The invention has the advantages that: the method comprises the steps of realizing lamination bonding of the multilayer glass substrate, manufacturing a vertical through hole structure on the bonded multilayer glass substrate by adopting a mechanical processing method, a laser processing method, a sand blasting drilling method or an etching method, completing through hole metallization filling of the multilayer glass substrate by electroplating, chemical plating, physical deposition and liquid metal filling, and realizing through hole metallization filling of the multilayer glass substrate at one time. The method can greatly shorten the manufacturing time of the glass through hole and greatly reduce the production cost.

Drawings

FIGS. 1(a) - (d) are process flow diagrams of examples of through-glass vias according to the present invention. Wherein,

FIG. 1(a) is a first step of a glass via fabrication method and a glass via interconnect fabrication method;

FIG. 1(b) is a second step of the glass via fabrication method and the glass via interconnect fabrication method;

FIG. 1(c) shows step three of the glass via fabrication method;

fig. 1(d) shows a fourth step of the glass via hole formation method.

Fig. 2(a) - (d) are process flow diagrams of an example of a glass via interconnect of the present invention. Wherein,

FIG. 2(a) shows steps four and five of the method for fabricating a glass via interconnect;

FIG. 2(b) is step six of the glass via interconnect fabrication method;

FIG. 2(c) shows step eight of the glass via interconnect fabrication method;

fig. 2(d) shows a ninth step of the method for fabricating a glass via interconnect.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail below with reference to specific embodiments and fig. 1 and 2.

A method for manufacturing a glass through hole comprises the following steps:

firstly, the method comprises the following steps: the glass substrate is 200 um glass, and the bonding material is Polyimide. Bonding the multiple layers of glass substrates together by adopting a hot pressing mode to form a laminated structure of the multiple layers of glass substrates andPolyimide 2, as shown in figure 1 (a);

II, secondly: making a pattern required by thethrough hole 3 on the surface of the glass substrate, and making a vertical throughhole 3 structure on the bondedmultilayer glass substrate 1 by using a mechanical processing, laser processing, sand blasting and drilling or etching method, as shown in fig. 1 (b);

thirdly, the method comprises the following steps: cutting and separating the laminated glass substrate along the middle part of the Polyimide by adopting methods such as chemistry, electric spark, wire cutting or blade cutting and the like to form acutting path 4 shown in figure 1 (c);

fourthly, the method comprises the following steps: each individual glass substrate is cleaned for subsequent processing to make interconnections. As shown in fig. 1 (d).

A method for manufacturing glass through hole interconnection comprises the following steps:

firstly, the method comprises the following steps: the glass substrate is 200 um glass, and the bonding material is SU 8. Bonding the multiple glass substrates together by adopting a hot pressing mode to form a laminated structure of the multiple glass substrates and SU 87, as shown in figure 1 (a);

II, secondly: making a pattern required by the throughhole 3 on the surface of the glass substrate, and making a vertical throughhole 3 structure on the bondedmultilayer glass substrate 1 by using a mechanical processing, laser processing, sand blasting and drilling or etching method, as shown in fig. 1 (b);

thirdly, the method comprises the following steps: using SC1 (NH)₄+H₂O₂+H₂O) cleaning the multilayer glass substrate with the manufactured throughhole 3 structure to ensure that the surface cleanliness of the throughhole 3 is more suitable for metal deposition;

fourthly, the method comprises the following steps: depositing an adhesion layer such as 200 nm Ti on the sidewall, as shown in FIG. 2 (a);

fifthly: depositing a layer of 1 um Cu as a seed layer on the surface of the adhesion layer, wherein the deposited adhesion layer and theseed layer 5 are shown in figure 2 (a);

sixthly, the method comprises the following steps: filling the throughholes 3 of the laminated glass substrate withmetal Cu 6 by electroplating, chemical plating or physical deposition, as shown in FIG. 2 (b);

seventhly, the method comprises the following steps: removing redundant Cu on the upper surface of the laminated glass substrate by adopting chemical mechanical polishing;

eighthly: cutting and separating the laminated glass substrate along the middle part of SU 87 by adopting methods such as electric spark, wire cutting or blade cutting, and the like to form a cuttingchannel 4 shown in figure 2 (c);

nine: each individual glass substrate was thinned to the desired thickness of 200 um using a cleaning and surface planarization polishing process, as shown in fig. 2 (d).

Claims (14)

1. A manufacturing method of a glass through hole is characterized by comprising the following steps:

1) laminating and bonding a plurality of glass substrates together by a hot pressing method to form a laminated bonding structure of the multilayer glass substrates;

2) manufacturing a through hole structure vertical to the surface of the laminated glass substrate on the bonded laminated glass substrate;

3) and debonding the laminated glass substrate to separate the glass substrate.

2. The method for forming a glass via according to claim 1, wherein the glass substrate is bonded by a polymer material bonding method, wherein the polymer material is one of Polyimide, SU8 and BCB, and a multi-layer glass substrate and a laminate of Polyimide, SU8 or BCB are formed.

3. The method for forming a glass via according to claim 1, further comprising a step of forming a desired pattern of the via on the surface of one side of the laminated glass substrate before the step 2.

4. The method of claim 1, wherein the through-glass via is formed by one of machining, laser machining, sand blasting, or etching.

5. The method for forming a glass via according to claim 1, wherein the diameter of the via is in the range of 5um to 500 um.

6. The method for forming a glass via according to claim 1, wherein the step 3 comprises dissolving the polymer in a chemical solution to separate the glass substrate; or the laminated glass substrate is split by using electric sparks, wire cutting, blade cutting and other modes.

7. The method for forming a glass via of claim 1 wherein after step 3, each individual glass substrate is cleaned for subsequent interconnection formation.

8. A manufacturing method of glass through hole interconnection is characterized by comprising the following steps:

1) laminating and bonding a plurality of glass substrates together by a hot pressing method to form a laminated bonding structure of the multilayer glass substrates;

2) manufacturing a through hole structure vertical to the surface of the laminated glass substrate on the bonded laminated glass substrate;

3) manufacturing an adhesion layer on the side wall of the through hole by adopting a physical deposition or chemical deposition method;

4) filling the through hole of the laminated glass substrate with metallization;

5) and debonding the laminated glass substrate to separate the glass substrate.

9. The method for forming a glass via interconnection of claim 8, wherein the laminated glass substrate having the via structure is cleaned before the step 3.

10. The method of claim 8, wherein said adhesion layer is at least one of Ni, Ta, Ti, Pt, Pd, AlN and TiN.

11. The method of claim 8, wherein the via metallization filling of the laminated glass substrate is performed by electroplating, electroless plating, physical deposition, or liquid metal filling.

12. The method of claim 8, wherein the metallization fill is one of Cu, Sn, W, Ti, Pt, Pd, Ni, and Au.

13. The method of claim 8, wherein prior to step 5, chemical mechanical polishing is used to remove metal from the top surface of the glass substrate after the metallization fill.

14. The method of claim 8, wherein after step 5, each individual glass substrate is thinned to a desired thickness by cleaning and surface planarization polishing.

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