CN102790849A - Image sensor module - Google Patents

Abstract

An image sensor module comprises a lens group and an image sensing chip. The lens group includes a plurality of secondary lens groups, each secondary lens group includes at least one lens, the plurality of secondary lens groups are arranged in an array mode to form the lens group, the plurality of secondary lens groups are wafer-level lens groups, and the image sensing chip is used for sensing outside images from the plurality of secondary lens groups so as to output at least one group of image data to a rear end circuit which is located outside the image sensing chip.

Description

Image sensor module

Technical field

The present invention relates to a kind of image sensor module, refer to a kind of image sensor module especially with array camera lens.

Background technology

Along with present mobile phone and intelligent mobile phone more and more are particular about lightweight, the thickness of mobile phone and intelligent mobile phone also need significantly reduce with weight reduction as much as possible, so that the user is easy to carry.Yet, because all having, present mobile phone and intelligent mobile phone take pictures and camera function, therefore, its thickness can be subject to the size of present image sensor module, and can't significantly reduce thickness.

In addition and since at present mobile phone and intelligent mobile phone to the resolution of taking pictures and photographing require increasingly highly, therefore, the camera lens in the image sensor module partly need use thicker lens, to reach high-resolution demand.Thus, the thickness of image sensor module just can increase, and the thickness of present mobile phone and intelligent mobile phone also can't significantly reduce.

Summary of the invention

Therefore, one of the object of the invention is to provide a kind of image sensor module, and it has the array camera lens of thinner thickness, to solve the above problems.

According to one embodiment of the invention, a kind of image sensor module includes lens group and image sensing chip.This lens group includes lens group a plurality of times, and wherein each time lens group comprises at least one lens, and these a plurality of lens group become this lens group with arranged in array mode, and these a plurality of lens group are the wafer-level lens group; This image sensing chip is used for sensing from the external image of these a plurality of lens group, to export the back-end circuit of at least one view data to this image sensing chip.

Description of drawings

Fig. 1 is the sketch map according to the image sensor module of first embodiment of the invention;

Fig. 2 is the sketch map according to the image sensor module of second embodiment of the invention;

Fig. 3 is incident to the sketch map of pel array via a plurality of lens group for external image light;

Fig. 4 only carries out the sketch map of image processing to the sensing output of part for peripheral circuit.

Embodiment

Please refer to Fig. 1, Fig. 1 is the sketch map according to theimage sensor module 100 of first embodiment of the invention.As shown in Figure 1;Image sensor module 100 includes lens group 110 andimage sensing chip 120; Wherein lens group 110 includes a plurality of lens group (is four lens group 112,114,116,118 in present embodiment), and wherein each time lens group 112,114,116,118 comprises at least one lens (comprising three lens in each time of present embodiment lens group);Image sensing chip 120 includes a plurality of independently pel arrays 122,124,126,128 and peripheral circuit 129.In addition, inferior lens group 112,114,116,118 is the wafer-level lens group.

In present embodiment;Image sensor module 100 is designed to have high-resolution image sensor module, and each time lens group 112,114,116,118 and each pel array 122,124,126,128 are designed to have the inferior lens group and the pel array of low resolution respectively.For instance; The resolution ofimage sensor module 100 is a mega pixel (1M); Each time lens group 112,114,116,118 then is to adopt the inferior lens group of 300,000 pixels, and pel array 122,124,126,128 also is designed to the pel array of 300,000 pixels.

In the operation ofimage sensor module 100; At first; Pel array 122,124,126,128 respectively the external image of self-corresponding lens group of sensing producing many sensings outputs respectively, that is 122 sensings of pel array from 124 sensings of external image, pel array ofinferior lens group 112 from 126 sensings of external image, pel array of inferior lens group 114 from the external image ofinferior lens group 116 and 128 sensings of pel array external image frominferior lens group 118; Then; Sensing output to pel array 122,124,126,128;Peripheral circuit 129 respectively to the sensing of pel array 122,124,126,128 output carry out image processing producing many view data respectively, and export this many view data to image sensingchip 120 back-end circuit 130 outward respectively.

Back-end circuit 130 these received many view data are the sensing output that comes from pel array 122,124,126,128 respectively; And the output of these sensings all only has lower resolution (300,000 for example above-mentioned pixels), inserts in back-end circuit 130 is then carried out received view data and waits image manipulation to reach the pixel quality of high-resolution (for example above-mentioned 1,000,000 or more than).

As stated; Since each time lens group the 112,114,116, the 118th, the inferior lens group of employing low resolution (for example 300,000 pixels); Therefore, each time lens group 112,114,116,118 can the thin lens of used thickness, and make the camera lens total height TTL of lens group 110 to shorten; And then reach the purpose that shortensimage sensor module 100 thickness, and can keep high-resolution quality originally.

Please refer to Fig. 2, Fig. 2 is the sketch map according to theimage sensor module 200 of second embodiment of the invention.As shown in Figure 2;Image sensor module 200 includeslens group 210 andimage sensing chip 220; Whereinlens group 210 includes a plurality of lens group (is four lens group 212,214,216,218 in present embodiment), and wherein each time lens group 212,214,216,218 comprises at least one lens (comprising three lens in each time of present embodiment lens group);Image sensing chip 220 includessingle pel array 222 andperipheral circuit 229.

In present embodiment,image sensor module 200 is designed to have high-resolution image sensor module, and each time lens group 212,214,216,218 is designed to have the inferior lens group of low resolution respectively.For instance, the resolution ofimage sensor module 200 is two mega pixels (2M), the resolution ofpel array 222 also be 2M or more than, each time lens group 212,214,216,218 then is to adopt 300,000 pixels (0.3M, inferior lens group VGA).

In the operation ofimage sensor module 200, at first,pel array 222 sensing is simultaneously exported to produce sensing from the external image of inferior lens group 212,214,216,218; Then, the output of 129 pairs of these sensings of peripheral circuit is carried out image processing producing a view data, and exports this view data to image sensingchip 220 outer back-end circuit 230.

As stated; Since each time lens group the 212,214,216, the 218th, the inferior lens group of employing low resolution (for example 300,000 pixels); Therefore, each time lens group 212,214,216,218 can the thin lens of used thickness, and make the camera lens total height TTL oflens group 210 to shorten; And then reach the purpose that shortensimage sensor module 200 thickness, and can keep high-resolution quality originally.

In addition, please refer to Fig. 3, Fig. 3 is incident to the sketch map ofpel array 222 via inferior lens group 212,214,216,218 for external image light.As shown in Figure 3; Image circle (image circle) 312,314,316,318 is respectively external image light is incident topel array 222 via inferior lens group 212,214,216,218 effective coverage; Because the image circle of optical lens usually can be less than Lens; So image circle can't be contained pixels all in thepel array 222 usually, and cause the middle section (like the 3rd (A), 3 (B) figure) and the cross part (like the 3rd (B) figure) ofpel array 222 in fact not to have view data.

Therefore; For fear ofperipheral circuit 229 with the middle section ofpel array 222 or the sensing output of cross part is regarded as normal sensing output; And the wrong or complexity that the increase successive image is handled that causes successive image to handle;Peripheral circuit 229 can be given up the sensing output of the middle section ofpel array 222 when image processing is carried out in the sensing output ofpel array 222, and only image processing is carried out in the sensing output of part.For instance, please refer to Fig. 4, Fig. 4 only carries out the sketch map of image processing to the sensing output of part for peripheral circuit 229.As shown in Figure 4; The resolution of supposingpel array 222 is 1600*1200; The then only sensing output in the zone 412,414,416,418 ofselected pixels array 222 ofperipheral circuit 229; Give up the output of other regional sensing, and with operation such as sensing output the carrying out image interpolation reduction in zone 412,414,416,418 and formation resolution is the view data of 1280*800.In other words, that isperipheral circuit 229 resolution of having sacrificed part with avoid that successive image handles wrong or increase the complexity that successive image is handled.

In addition, be noted that the quantity of time lens group and arrangement mode are merely the example explanation inimage sensor module 100 shown in Figure 1 and theimage sensor module 200 shown in Figure 2, and are not as restriction of the present invention.That is in other embodiments of the invention, the quantity of time lens group can adjust according to designer's demand in the image sensor module, and inferior lens group also is not necessarily symmetry on arranging, and the variation in these designs all should be under the jurisdiction of category of the present invention.

Concise and to the point conclusion the present invention in image sensor module of the present invention, adopts a plurality of inferior lens group with low resolution to form a lens group.Inferior lens group can be wafer-level lens or conventional lenses.The volume of wafer-level lens is littler than conventional lenses; Therefore preferably be suitable for this image sensor module; So that have the thickness that can reduce image sensor module under the situation of same resolution, and further reduce the thickness of mobile phone and intelligent mobile phone.

The above is merely the preferred embodiments of the present invention, and all equalizations of doing according to claim of the present invention change and modify, and all should belong to covering scope of the present invention.

Claims (7)

1. image sensor module includes:

Lens group includes lens group a plurality of times, and wherein each time lens group comprises at least one lens, and said a plurality of lens group become said lens group with arranged in array mode; And

Image sensing chip is used for sensing from the external image of said a plurality of lens group, to export the outer back-end circuit of at least one view data to said image sensing chip.

2. image sensor module as claimed in claim 1, wherein said image sensing chip includes:

A plurality of pel arrays, wherein said a plurality of pel arrays correspond to said a plurality of lens group respectively, and said a plurality of pel array be used for respectively sensing from the external image of said a plurality of lens group to produce many sensings outputs respectively; And

Peripheral circuit is coupled to said a plurality of pel array, is used for respectively said many sensings output is carried out image processing producing many view data respectively, and exports said many view data to said image sensing chip back-end circuit outward respectively.

3. image sensor module as claimed in claim 1, wherein said image sensing chip includes:

Single pel array, be used for sensing simultaneously from the external image of said a plurality of lens group to produce sensing output; And

Peripheral circuit is coupled to said pel array, is used for to said sensing output to carry out image processing producing said view data, and exports said view data to said image sensing chip outer back-end circuit.

4. image sensor module as claimed in claim 3, wherein said peripheral circuit are given up partial data in the said sensing output, and the remaining data of only said sensing being exported carries out image processing to produce said view data.

5. image sensor module as claimed in claim 4, the data of being given up in the wherein said sensing output comprise the sensing output of the middle section of said pel array.

6. image sensor module as claimed in claim 4, the remaining data of wherein said sensing output are the sensing output of a plurality of zoness of different of said pel array, and said a plurality of zoness of different of said pel array are not adjacent to each other.

7. image sensor module as claimed in claim 1, wherein said a plurality of lens group are the wafer-level lens group.

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