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CN102738011A - Chip pin adjusting device - Google Patents

Chip pin adjusting device
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Publication number
CN102738011A
CN102738011ACN2012102368926ACN201210236892ACN102738011ACN 102738011 ACN102738011 ACN 102738011ACN 2012102368926 ACN2012102368926 ACN 2012102368926ACN 201210236892 ACN201210236892 ACN 201210236892ACN 102738011 ACN102738011 ACN 102738011A
Authority
CN
China
Prior art keywords
chip
pin
adjusting device
draw
groove
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2012102368926A
Other languages
Chinese (zh)
Inventor
叶守银
王锦
叶阳平
刘军
郝丹丹
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sino IC Technology Co Ltd
Original Assignee
Sino IC Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sino IC Technology Co LtdfiledCriticalSino IC Technology Co Ltd
Priority to CN2012102368926ApriorityCriticalpatent/CN102738011A/en
Publication of CN102738011ApublicationCriticalpatent/CN102738011A/en
Pendinglegal-statusCriticalCurrent

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Abstract

The invention relates to a chip pin adjusting device. The chip pin adjusting device comprises a base for bearing at least one chip having a main body and pins; at least one slot located on the upper surface of the base; and a plurality of barriers located on the upper surface of the base and on the outer side of the slot, wherein the main body of the chip is clamped in the slot, and the pins of the chip extend outwards across the slot; and the gap of each barrier is used for placing the pins of the chip. The adjusting device provided by the invention can adjust the pins with left-right offset to the proper gap of the barrier by using the slot on the base to clamp the main body of the chip and by using the barriers corresponding to the pins of the chip, thereby effectively preventing chip pin breakage during adjusting, shortening the adjusting time, lowering the labor intensity and improving the adjusting efficiency.

Description

The chip pin adjusting device
Technical field
The present invention relates to technical field of semiconductors, particularly a kind of chip pin adjusting device.
Background technology
Adopt the packing forms of the flat encapsulation technology of square (PQFP, Plastic Quad Flat Package) in the extensive or very lagre scale integrated circuit (VLSIC), distance is very little between the chip pin that this technology realizes, pin is very thin, and its number of pins is generally all more than 100.The chip of four side pin flat packaging, pin of chip are drawn from four sides and are gull wings (L) type.Yet the pin of chip of four side pin flat packaging often is bent (about skew or skew) up and down.
The said chip pin of adjustment adopts operating personnel to utilize the adjustment instrument from the rough more and more meticulousr adjustment that is registered in the prior art, adjusts one by one at last, and operation is pulled out pin crooked and distortion with tweezers usually; Carry out the adjustment of tiptoe and heel, smooth foot lever and coplanarity adjustment, however this chip pin method of adjustment wastes time and energy; And break chip pin easily, cause chip unavailable, along with increasing of chip pin; Spacing between the pin is more and more littler; Adjustment work is more and more difficult, and how a kind of chip pin adjusting device of simple and convenient is provided, and has become one of technical problem that those skilled in the art need to be resolved hurrily.
Summary of the invention
The purpose of this invention is to provide a kind of chip pin adjusting device, the easily broken problem of chip pin when avoiding adjusting, and shorten the adjustment time, and reduce labour intensity, improve adjustment efficient.
Technical solution of the present invention is a kind of chip pin adjusting device, comprising:
A base is used to carry the chip that at least one has body and pin;
At least one draw-in groove is positioned at said base upper surface, and the body of said chip is snapped in the said draw-in groove, and said pin of chip strides across said draw-in groove and stretches out;
A plurality of fence are positioned at said base upper surface and are positioned at the said draw-in groove outside, and the space of each fence are used to place said pin of chip.
As preferably: also comprise a hamper, said hamper is hollow form, and buckle closure and will be suppressed said pin of chip to base on said draw-in groove and chip.
As preferably: the sidewall of said hamper is between said draw-in groove and said fence.
As preferably: said fence comprises the interval between a plurality of barrier boards and the adjacent gate breast board.
As preferably: the width of said barrier board is less than or equal to the spacing between said chip two adjacent leads, and the interval between the said barrier board is more than or equal to the width of said pin of chip.
As preferably: the top side wall of said draw-in groove is curved, and the bend that is positioned at said chip pin root strides across draw-in groove and stretches out.
As preferably: the radian of the bend of said chip pin root is the 2-10 degree.
As preferably: the material of said draw-in groove is a metal.
As preferably: the material of said fence is a metal.
Compared with prior art; The present invention adopts chip pin adjusting device simple in structure; Said adjusting device adopt on body and the base of the draw-in groove buckle chip on the base with the corresponding fence of pin of chip with about the pin of skew adjust in the suitable space of fence the easily broken problem of chip pin when effectively avoiding adjusting, and shorten the adjustment time; Reduce labour intensity, improve adjustment efficient; The present invention also adopts a hamper to suppress said chip pin to base, and the chip that squints up and down is adjusted on the same horizontal plane.
Description of drawings
Fig. 1 is the structural representation of the chip pin adjusting device of the specific embodiment of the invention;
Fig. 2 is that the chip of the specific embodiment of the invention is placed on the structural representation in the said chip pin adjusting device;
Fig. 3 is the profile after the hamper of the specific embodiment of the invention is placed;
Fig. 4 is the chip pin partial schematic diagram of the specific embodiment of the invention.
Embodiment
The present invention below will combine accompanying drawing to do further to detail:
A lot of details have been set forth in the following description so that make much of the present invention.But the present invention can implement much to be different from alternate manner described here, and those skilled in the art can do similar popularization under the situation of intension of the present invention, so the present invention does not receive the restriction of following disclosed practical implementation.
Secondly, the present invention utilizes sketch map to be described in detail, when the embodiment of the invention is detailed; For ease of explanation; The profile of expression device architecture can be disobeyed general ratio and done local the amplification, and said sketch map is instance, and it should not limit the scope of the present invention's protection at this.The three dimensions size that in actual fabrication, should comprise in addition, length, width and the degree of depth.
Fig. 1 shows the structural representation of the chip pin adjusting device of one embodiment of the invention.
See also Fig. 1, Fig. 2, Fig. 3 and shown in Figure 4, the present invention provides a kind of chip pin adjusting device, comprising:
Abase 1 is used to carry the chip that at least one comprises body and pin;
At least one draw-ingroove 2 is positioned at the upper surface ofbase 1, and the material of said draw-in groove is metal, for example stainless steel.Thebody 41 of said chip is snapped in the said draw-ingroove 2; Said pin ofchip 42 strides across said draw-ingroove 2 and stretches out, and as shown in Figure 3, the top side wall of said draw-ingroove 2 is curved; Because draw-ingroove 2 sidewall tops are curved; When the bend of said pin ofchip 42 roots strides across said draw-ingroove 2 sidewall tops, can adjust the root ofchip pin 42 and guarantee it in same plane, the radian A of the bend of said chip pin root is the 2-10 degree;
A plurality offence 3; Be positioned atbase 1 upper surface and be positioned at the outside of said draw-ingroove 2; The material of said fence is a metal; Stainless steel for example, said fence comprises the space 31 between a plurality of barrier boards and the adjacent gate breast board, the space 31 between the said two adjacent gate breast boards is used to place said pin ofchip 42; The width w1 of wherein saidbarrier board 3 is less than or equal to the spacing d1 between said chip two adjacent leads, and the spacing d2 between the said two adjacent gate breast boards is more than or equal to thewidth W 2 of said pin of chip.
Said chip pin adjusting device also comprises a hamper 5, and said hamper is hollow form, and said hamper lower surface matches withbase 1, and buckle closure and will be suppressed said pin ofchip 42 tobase 1 on said draw-ingroove 2 and chip.When hamper 5 was positioned atbase 1 upper surface, the inwall of said hamper 5 was positioned at the outside of said draw-ingroove 2, and the outer wall of said hamper is positioned at the inboard of saidfence 3, and promptly the sidewall of hamper 5 is between draw-ingroove 2 andfence 3.
The use of chip pin adjusting device of the present invention is following:
At first place chip 4 and will wait to adjust the draw-ingroove 2 that thebody 41 of the chip of pin is put intobase 1 upper surface; Pin ofchip 42 extends outwardly intofence 3 places; Pin ofchip 42 is arranged in the space 31 of two adjacent gate breast boards; Because draw-in groove sidewall top is curved, when the bend of said pin of chip root strides across said draw-in groove sidewall top, can adjust the root ofchip pin 42 and guarantee that it is in same plane;
And then whether each pin of observing chip all be arranged in the space 31 of two adjacent gate breast boards, and the pin of chip that squints about adjustment all is arranged in the space 31 of two adjacent gate breast boards until each pin, and the spacing d1 between the adjacent leads is consistent;
And then hamper 5 is placed on thebase 1; Because the inwall of said hamper 5 is positioned at the outside of said draw-ingroove 2; The outer wall of said hamper 5 is positioned at the inboard of saidfence 3; All pin ofchip 42 all are compressed onbase 1 upper surface by hamper 5, thereby have adjusted the pin of chip of skew up and down, make said pin of chip on same horizontal plane; Take away hamper 5 after adjustment finishes, take out chip 4.
In sum; The present invention adopts chip pin adjusting device simple in structure; Said adjusting device adopt on draw-in groove buckle chip body and the base on the base with the corresponding fence of chip pin with about the pin of skew adjust in the suitable space of fence the easily broken problem of chip pin when effectively avoiding adjusting, and shorten the adjustment time; Reduce labour intensity, improve adjustment efficient; The present invention also adopts a hamper to suppress the chip that said chip pin will squint up and down to the base and is adjusted on the same horizontal plane.
The above is merely preferred embodiment of the present invention, and all equalizations of being done according to claim scope of the present invention change and modify, and all should belong to the covering scope of claim of the present invention.

Claims (9)

CN2012102368926A2012-07-092012-07-09Chip pin adjusting devicePendingCN102738011A (en)

Priority Applications (1)

Application NumberPriority DateFiling DateTitle
CN2012102368926ACN102738011A (en)2012-07-092012-07-09Chip pin adjusting device

Applications Claiming Priority (1)

Application NumberPriority DateFiling DateTitle
CN2012102368926ACN102738011A (en)2012-07-092012-07-09Chip pin adjusting device

Publications (1)

Publication NumberPublication Date
CN102738011Atrue CN102738011A (en)2012-10-17

Family

ID=46993269

Family Applications (1)

Application NumberTitlePriority DateFiling Date
CN2012102368926APendingCN102738011A (en)2012-07-092012-07-09Chip pin adjusting device

Country Status (1)

CountryLink
CN (1)CN102738011A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
CN109494171A (en)*2017-09-122019-03-19中国科学院长春光学精密机械与物理研究所A kind of leads of IC forming device

Citations (15)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US4329642A (en)*1979-03-091982-05-11Siliconix, IncorporatedCarrier and test socket for leadless integrated circuit
JPH01143348A (en)*1987-11-301989-06-05Toshiba CorpRepairing method for ic device
JPH01179441A (en)*1988-01-061989-07-17Toshiba CorpLead correcting jig for circuit component
DE4021791A1 (en)*1990-07-091992-01-16Deutsche BundespostContact pin aligning rule for semiconductor integrated circuit - has rows of aligned notches along longitudinal side edges to straighten contact pins
US5271147A (en)*1991-06-101993-12-21Fujitsu LimitedOuter bonding tool for tape carrier and method of producing semiconductor device
JPH06196610A (en)*1992-12-241994-07-15Hitachi LtdSubpackage and mounting method for semiconductor device using subpackage
JPH06295968A (en)*1991-12-021994-10-21Meiritsu Kikai Kogyo:KkMethod and equipment for correcting arrangement of lead of digital element
JPH08111488A (en)*1994-10-071996-04-30Towa Kk Method and apparatus for correcting lead pitch of semiconductor device
CN1125897A (en)*1994-12-281996-07-03三菱电机株式会社 IC lead wire straightening method and straightening device
JPH09102570A (en)*1995-10-041997-04-15Apic Yamada KkMolding die device for correcting external lead of semiconductor device
JPH10144841A (en)*1996-11-141998-05-29Sony CorpMethod for forming lead and apparatus for correcting shape of lead
JPH1187592A (en)*1997-09-021999-03-30Oki Electric Ind Co LtdMethod and jig for correcting lead of ic package
JP2000266809A (en)*1999-03-192000-09-29Oita Nippon Denki KkDevice and method for modifying location of ic lead
JP2002246525A (en)*2001-02-142002-08-30Hioki Ee Corp Jig for aligning semiconductor package connection terminals
US20120011914A1 (en)*2010-07-152012-01-19Renesas Electronics CorporationLead processing apparatus, method for manufacturing semiconductor device, and lead processing die set

Patent Citations (15)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US4329642A (en)*1979-03-091982-05-11Siliconix, IncorporatedCarrier and test socket for leadless integrated circuit
JPH01143348A (en)*1987-11-301989-06-05Toshiba CorpRepairing method for ic device
JPH01179441A (en)*1988-01-061989-07-17Toshiba CorpLead correcting jig for circuit component
DE4021791A1 (en)*1990-07-091992-01-16Deutsche BundespostContact pin aligning rule for semiconductor integrated circuit - has rows of aligned notches along longitudinal side edges to straighten contact pins
US5271147A (en)*1991-06-101993-12-21Fujitsu LimitedOuter bonding tool for tape carrier and method of producing semiconductor device
JPH06295968A (en)*1991-12-021994-10-21Meiritsu Kikai Kogyo:KkMethod and equipment for correcting arrangement of lead of digital element
JPH06196610A (en)*1992-12-241994-07-15Hitachi LtdSubpackage and mounting method for semiconductor device using subpackage
JPH08111488A (en)*1994-10-071996-04-30Towa Kk Method and apparatus for correcting lead pitch of semiconductor device
CN1125897A (en)*1994-12-281996-07-03三菱电机株式会社 IC lead wire straightening method and straightening device
JPH09102570A (en)*1995-10-041997-04-15Apic Yamada KkMolding die device for correcting external lead of semiconductor device
JPH10144841A (en)*1996-11-141998-05-29Sony CorpMethod for forming lead and apparatus for correcting shape of lead
JPH1187592A (en)*1997-09-021999-03-30Oki Electric Ind Co LtdMethod and jig for correcting lead of ic package
JP2000266809A (en)*1999-03-192000-09-29Oita Nippon Denki KkDevice and method for modifying location of ic lead
JP2002246525A (en)*2001-02-142002-08-30Hioki Ee Corp Jig for aligning semiconductor package connection terminals
US20120011914A1 (en)*2010-07-152012-01-19Renesas Electronics CorporationLead processing apparatus, method for manufacturing semiconductor device, and lead processing die set

Cited By (2)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
CN109494171A (en)*2017-09-122019-03-19中国科学院长春光学精密机械与物理研究所A kind of leads of IC forming device
CN109494171B (en)*2017-09-122022-08-19中国科学院长春光学精密机械与物理研究所 An integrated circuit lead forming device

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Legal Events

DateCodeTitleDescription
C06Publication
PB01Publication
C10Entry into substantive examination
SE01Entry into force of request for substantive examination
C02Deemed withdrawal of patent application after publication (patent law 2001)
WD01Invention patent application deemed withdrawn after publication

Application publication date:20121017


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