技术领域technical field
本发明涉及一种显示面板及其制作方法，且特别涉及一种液晶显示面板及其制作方法。The invention relates to a display panel and a manufacturing method thereof, and in particular to a liquid crystal display panel and a manufacturing method thereof.
背景技术Background technique
随着数字时代的来临，液晶显示设备的技术亦快速成长，已成为不可或缺的电子产品，故对于液晶显示设备的技术及功能要求亦越来越高。其中薄膜晶体管(Thin Film Transistor，TFT)液晶显示设备，因其高亮度与大视角的特性，在高阶产品上更是广受欢迎。With the advent of the digital age, the technology of liquid crystal display devices has grown rapidly and has become an indispensable electronic product. Therefore, the technical and functional requirements for liquid crystal display devices are also getting higher and higher. Among them, thin film transistor (Thin Film Transistor, TFT) liquid crystal display device is very popular in high-end products because of its high brightness and large viewing angle.
薄膜晶体管(TFT)液晶显示设备主要包括液晶显示面板以及背光模块。其中液晶显示面板具有彩色滤光片基板、薄膜晶体管阵列基板以及夹设于两基板之间的液晶层。此外，彩色滤光片基板与薄膜晶体管阵列基板还通过框胶(Sealant)对组而相互结合，且框胶还可将液晶层密封于彩色滤光片基板与薄膜晶体管阵列基板之间。A thin film transistor (TFT) liquid crystal display device mainly includes a liquid crystal display panel and a backlight module. The liquid crystal display panel has a color filter substrate, a thin film transistor array substrate and a liquid crystal layer sandwiched between the two substrates. In addition, the color filter substrate and the thin film transistor array substrate are combined with each other through a sealant, and the sealant can also seal the liquid crystal layer between the color filter substrate and the thin film transistor array substrate.
在液晶显示面板的制作过程中，例如是通过液晶滴入法(One DropFilling，ODF)的制程。首先，在彩色滤光片基板的表面的周围涂上框胶(例如是UV胶)。紧接着在真空中，将液晶由涂有框胶的彩色滤光片基板的表面上方滴下，使得液晶分布于框胶所围成的区域范围内。然后将薄膜晶体管阵列基板与彩色滤光片基板相互对组，再通过光线的照射以固化框胶。而为了露出设置在薄膜电晶阵列基板上的外引脚接合(Outer Lead Bonding，OLB)区域，通常会对彩色滤光片基板进行半切割制程，也就是将部分的彩色滤光片基板进行切除，以露出薄膜电晶阵列基板上的外引脚接合(OLB)区域。In the manufacturing process of the liquid crystal display panel, for example, the liquid crystal drop filling method (One Drop Filling, ODF) process is used. Firstly, frame glue (such as UV glue) is coated around the surface of the color filter substrate. Then in vacuum, liquid crystal is dropped from above the surface of the color filter substrate coated with sealant, so that the liquid crystal is distributed in the area surrounded by the sealant. Then, the thin film transistor array substrate and the color filter substrate are assembled together, and then irradiated by light to cure the sealant. In order to expose the Outer Lead Bonding (OLB) area on the thin film transistor array substrate, the color filter substrate is usually subjected to a half-cutting process, that is, part of the color filter substrate is cut off. , to expose the outer lead bonding (OLB) area on the TFT array substrate.
通常当彩色滤光片基板与薄膜晶体管阵列基板的基板材质为玻璃时，进行半切割制程是通过例如渗透刀轮或圆盘刀轮使玻璃基板产生垂直裂纹，进而去除掉部分玻璃基板。但倘若彩色滤光片基板与薄膜晶体管阵列基板的基板材质是使用具有可挠性的塑料(如PI、PET、PEN等)，由于塑料基板具有柔软、延展的特性，因此在进行半切割制程时，使用渗透刀轮或圆盘刀轮会无法顺利将塑料基板切断而仅留下压痕。又由于彩色滤光片基板与薄膜晶体管阵列基板之间的间距仅有约4微米，在进行半切割制程时，塑料材质的彩色滤光片基板被刀具压迫产生形变，因而压迫到薄膜晶体管阵列基板上的外引脚接合(OLB)区域，进而使外引脚接合(OLB)区域内的金属导线受到损伤。此外，使用其它切割技术如雷射切割，虽然能够顺利将塑料裁质的基板切断，但其在切割过程所产生的热效应仍旧会对外引脚接合(OLB)区域内的金属导线产生伤害。Usually, when the color filter substrate and the thin film transistor array substrate are made of glass, the half-cutting process is to generate vertical cracks on the glass substrate by, for example, a penetrating cutter wheel or a disc cutter wheel, and then remove part of the glass substrate. However, if the color filter substrate and the thin film transistor array substrate are made of flexible plastics (such as PI, PET, PEN, etc.), since the plastic substrate is soft and stretchable, when performing the half-cutting process , using a penetrating cutter wheel or a disc cutter wheel will not be able to cut the plastic substrate smoothly and only leave indentations. And because the distance between the color filter substrate and the TFT array substrate is only about 4 microns, during the half-cutting process, the plastic color filter substrate is deformed by the cutter, thus pressing against the TFT array substrate. The outer lead bond (OLB) area on the chip, and the metal wires in the outer lead bond (OLB) area are damaged. In addition, although other cutting techniques such as laser cutting can successfully cut the plastic substrate, the thermal effect generated during the cutting process will still cause damage to the metal wires in the outer lead bonding (OLB) area.
发明内容Contents of the invention
本发明的目的之一就是提供一种显示面板及其制作方法，有效避免显示面板具有的外引脚接合区域内的金属导线在切割基板的过程中遭受到破坏，且通过本发明制作方法所完成的显示面板，合格率(良率)极高。One of the purposes of the present invention is to provide a display panel and its manufacturing method, which can effectively prevent the metal wires in the outer pin bonding area of the display panel from being damaged during the process of cutting the substrate, and can be completed by the manufacturing method of the present invention. The high-quality display panel has a very high pass rate (yield rate).
为实现上述优点，本发明一实施例提出一种显示面板，其包括第一基板、第二基板以及框胶。第二基板相对于第一基板设置。框胶设置于第一基板与第二基板之间，且框胶具有与第一基板相接的第一表面以及与第二基板相接的第二表面，其中框胶的部分第一表面露出于第一基板。In order to achieve the above advantages, an embodiment of the present invention provides a display panel, which includes a first substrate, a second substrate, and a sealant. The second substrate is arranged relative to the first substrate. The sealant is disposed between the first substrate and the second substrate, and the sealant has a first surface in contact with the first substrate and a second surface in contact with the second substrate, wherein part of the first surface of the sealant is exposed on the first substrate.
在本发明的一实施例中，上述的第二基板包括线路层，露出于第一基板之外，且框胶具有至少一与线路层相邻的块体，块体具有与第一基板相接的第三表面以及与第二基板相接的第四表面，其中第一表面包含第三表面，第二表面包含第四表面。In an embodiment of the present invention, the above-mentioned second substrate includes a circuit layer exposed outside the first substrate, and the sealant has at least one block adjacent to the circuit layer, and the block has a circuit layer connected to the first substrate. The third surface and the fourth surface in contact with the second substrate, wherein the first surface includes the third surface, and the second surface includes the fourth surface.
在本发明的一实施例中，上述的第一表面露出于第一基板的部分呈矩形，且具有长边与短边，短边的长度范围介于500微米至600微米之间。In an embodiment of the present invention, the portion of the first surface exposed on the first substrate is rectangular and has a long side and a short side, and the length of the short side ranges from 500 microns to 600 microns.
在本发明的一实施例中，上述的第一基板为对向基板，而第二基板为阵列基板。In an embodiment of the present invention, the above-mentioned first substrate is an opposite substrate, and the second substrate is an array substrate.
在本发明的一实施例中，上述的第一基板与第二基板分别为可挠性基板。In an embodiment of the present invention, the above-mentioned first substrate and the second substrate are respectively flexible substrates.
在本发明另一实施例中提出一种显示面板制作方法，包括下列步骤：提供待裁切显示面板，待裁切显示面板包括第一基板、第二基板以及第一框胶，其中第一框胶具有与第一基板相接的第一表面以及与第二基板相接的第二表面；以及以第一基板与第一框胶相互重叠处为切割位置对第一基板进行切割，以切除部分第一基板而使得第一框胶的部分第一表面露出于第一基板。In another embodiment of the present invention, a display panel manufacturing method is provided, which includes the following steps: providing a display panel to be cut, the display panel to be cut includes a first substrate, a second substrate and a first frame glue, wherein the first frame The adhesive has a first surface in contact with the first substrate and a second surface in contact with the second substrate; and the first substrate is cut at the overlapping position of the first substrate and the first glue frame as the cutting position to cut off part The first substrate exposes part of the first surface of the first sealant to the first substrate.
具体地，本发明提出一种显示面板制作方法，包括下列步骤：提供一待裁切显示面板，该待裁切显示面板包括一第一基板、一第二基板、一第一框胶以及一第二框胶，其中该第一框胶具有至少一块体、与该第一基板相接的一第一表面以及与该第二基板相接的一第二表面，而该第二基板包括一线路层，该线路层相邻于该至少一块体，该第二框胶形成于该第一基板与该第二基板之间并围绕该第一框胶与该线路层；以及以该第一基板与该第一框胶相互重叠处为一切割位置对该第一基板进行切割，以切除部分该第一基板而使得该第一框胶的部分该第一表面露出于该第一基板，并且当对该第一基板进行切割而去除部分该第一基板后，该线路层露出于该第一基板；以及在切割该第一基板前，还包括下列步骤：以该第二框胶与该第一框胶之间具有的一间距为另一切割位置对该第一基板与该第二基板进行切割，以去除部分该第一基板与该第二基板。Specifically, the present invention proposes a method for manufacturing a display panel, which includes the following steps: providing a display panel to be cut, the display panel to be cut includes a first substrate, a second substrate, a first frame glue and a first Two frame glues, wherein the first frame glue has at least one body, a first surface connected to the first substrate and a second surface connected to the second substrate, and the second substrate includes a circuit layer , the circuit layer is adjacent to the at least one body, the second sealant is formed between the first substrate and the second substrate and surrounds the first sealant and the circuit layer; and the first substrate and the first substrate Where the first sealant overlaps with each other is a cutting position to cut the first substrate to cut off part of the first substrate so that part of the first surface of the first sealant is exposed to the first substrate, and when the first sealant is exposed to the first substrate, After the first substrate is cut to remove part of the first substrate, the circuit layer is exposed on the first substrate; and before cutting the first substrate, the following steps are further included: using the second sealant and the first sealant A distance therebetween is another cutting position for cutting the first substrate and the second substrate, so as to remove part of the first substrate and the second substrate.
在本发明的另一实施例中，如上所述对第一基板进行切割时，对第一基板的切割深度为第一基板的厚度的70％至90％。In another embodiment of the present invention, when cutting the first substrate as described above, the cutting depth of the first substrate is 70% to 90% of the thickness of the first substrate.
在本发明的另一实施例中，上述的第一表面露出第一基板的部分呈矩形，且具有长边与短边，短边的长度范围介于500微米至600微米之间。In another embodiment of the present invention, the portion of the above-mentioned first surface exposed to the first substrate is rectangular and has a long side and a short side, and the length of the short side ranges from 500 microns to 600 microns.
在本发明的另一实施例中，上述的待裁切显示面板的第一基板与第二基板分别为可挠性基板。In another embodiment of the present invention, the above-mentioned first substrate and second substrate of the display panel to be cut are respectively flexible substrates.
在本发明的另一实施例中，上述的第一框胶具有至少一块体，而第二基板包括线路层，相邻于至少一块体，当对第一基板进行切割而去除部分第一基板后，线路层露出于第一基板。In another embodiment of the present invention, the above-mentioned first sealant has at least one body, and the second substrate includes a circuit layer, which is adjacent to at least one body. After cutting the first substrate and removing part of the first substrate , the circuit layer is exposed on the first substrate.
在本发明的另一实施例中，上述的待裁切显示面板还包括第二框胶，形成于第一基板与第二基板之间并围绕第一框胶与线路层，而在切割第一基板前，还包括下列步骤：以第二框胶与第一框胶之间具有的间距为另一切割位置，对第一基板与第二基板进行切割，以去除部分第一基板与第二基板。In another embodiment of the present invention, the above-mentioned display panel to be cut further includes a second sealant formed between the first substrate and the second substrate and surrounding the first sealant and the circuit layer. Before the substrate, the following steps are also included: using the distance between the second sealant and the first sealant as another cutting position, cutting the first substrate and the second substrate to remove part of the first substrate and the second substrate .
在本发明的另一实施例中，上述的切割第一基板与第二基板为通过切割刀具来进行切割，切割刀具包括基部与切削部，基部具有相对的第一侧面与第二侧面，切削部具有第一切削面与第二切削面，第一切削面与第二切削面、第一侧面相接，第二切削面与第二侧面相接，第一切削面与第一侧面位于同一平面，第一切削面与第二切削面之间夹有锐角。In another embodiment of the present invention, the above-mentioned cutting of the first substrate and the second substrate is performed by a cutting tool. The cutting tool includes a base and a cutting portion. The base has opposite first and second sides. The cutting portion It has a first cutting surface and a second cutting surface, the first cutting surface is connected to the second cutting surface and the first side surface, the second cutting surface is connected to the second side surface, the first cutting surface and the first side surface are located on the same plane, There is an acute angle between the first cutting surface and the second cutting surface.
本发明所述的显示面板制作方法，在进行半切割制程时，以第一基板与第一框胶相互重叠处为切割位置来对第一基板进行切割，以切除部分第一基板而使得第一框胶的部分第一表面露出于第一基板。由于第一框胶具有弹性的材料特性，因此，在切割第一基板的过程中，框胶可以吸收刀具在切割时所产生的剪切应力，进而达到保护位于第二基板的线路层的功效。In the display panel manufacturing method of the present invention, when performing the half-cutting process, the first substrate is cut at the overlapping position of the first substrate and the first sealant as the cutting position, so as to cut off part of the first substrate so that the first Part of the first surface of the sealant is exposed on the first substrate. Since the first sealant has elastic material properties, during the process of cutting the first substrate, the sealant can absorb the shear stress generated by the cutter during cutting, thereby achieving the effect of protecting the circuit layer on the second substrate.
为让本发明的上述和其他目的、特征和优点能更明显易懂，下文特举较佳实施例，并配合附图，作详细说明如下。In order to make the above and other objects, features and advantages of the present invention more comprehensible, preferred embodiments are specifically cited below and described in detail with accompanying drawings.
附图说明Description of drawings
图1为本发明一实施例所述的显示面板剖面示意图。FIG. 1 is a schematic cross-sectional view of a display panel according to an embodiment of the present invention.
图2为图1所示的显示面板的俯视示意图。FIG. 2 is a schematic top view of the display panel shown in FIG. 1 .
图3A至图3C为本发明一实施例所述的显示面板制作方法示意图。3A to 3C are schematic diagrams of a method for manufacturing a display panel according to an embodiment of the present invention.
图4为图3A所示的待切割的显示面板的俯视示意图。FIG. 4 is a schematic top view of the display panel to be cut shown in FIG. 3A .
图5为图3C所示的显示面板的俯视示意图。FIG. 5 is a schematic top view of the display panel shown in FIG. 3C .
图6为本发明另一实施例所述的显示面板俯视示意图。FIG. 6 is a schematic top view of a display panel according to another embodiment of the present invention.
图7为图3B与图3C中进行全切割制程与半切割制程所使用的切割刀具示意图。FIG. 7 is a schematic diagram of cutting tools used in the full-cut process and the half-cut process in FIG. 3B and FIG. 3C .
其中，附图标记说明如下：Wherein, the reference signs are explained as follows:
1：显示面板1: display panel
11、21：第一基板11, 21: The first substrate
12、22：第二基板12, 22: Second substrate
13：框胶(胶框)13: Frame glue (plastic frame)
14：液晶层14: Liquid crystal layer
120、220、220a：线路层120, 220, 220a: line layer
131、231：第一表面131, 231: first surface
132、232：第二表面132, 232: second surface
1301、1302、1303、1304、2301、2302、2303、2304：块体1301, 1302, 1303, 1304, 2301, 2302, 2303, 2304: blocks
2、2a、2b、2c：显示面板2, 2a, 2b, 2c: display panel
23：第一框胶23: First frame glue
24：第二框胶24: The second frame glue
25：液晶层25: Liquid crystal layer
D1：间距D1: Spacing
D2：重叠处D2: Overlap
C1、C2、C3、C4、C5、C6：切割线C1, C2, C3, C4, C5, C6: cutting lines
L1：长边L1: Long side
L2：短边L2: short side
3：切割刀具3: Cutting knife
31：基部31: base
32：切削部32: cutting part
311：第一侧面311: First Side
312：第二侧面312: second side
321：第一切削面321: first cutting surface
322：第二切削面322: second cutting surface
θ：锐角θ: acute angle
具体实施方式Detailed ways
请参照图1，其为本发明一实施例所述的显示面板剖面示意图。如图1所示，本实施例所述的显示面板1包括第一基板11、第二基板12以及框胶13。第二基板12相对于第一基板11进行设置。框胶13设置于第一基板11与第二基板12之间，且框胶13具有与第一基板11相接的第一表面131以及与第二基板12相接的第二表面132，其中框胶13的部分第一表面131露出于第一基板11。Please refer to FIG. 1 , which is a schematic cross-sectional view of a display panel according to an embodiment of the present invention. As shown in FIG. 1 , the display panel 1 described in this embodiment includes a first substrate 11 , a second substrate 12 and a sealant 13 . The second substrate 12 is arranged relative to the first substrate 11 . The sealant 13 is disposed between the first substrate 11 and the second substrate 12, and the sealant 13 has a first surface 131 connected to the first substrate 11 and a second surface 132 connected to the second substrate 12, wherein the frame Part of the first surface 131 of the glue 13 is exposed on the first substrate 11 .
请继续参照图1，本实施例所述的显示面板1还包括有液晶层14，其设置于第一基板11与第二基板12之间，且液晶层14位于框胶13所环绕出的范围之内，框胶13主要是将液晶层14密封于第一基板11与第二基板12之间。此外，第二基板12包括线路层120，其露出于第一基板11外，此线路层120主要电性连接于外部的驱动电路板(在本图中未示出)，用以驱动液晶层14进行显示的动作，而详细的显示驱动方式为所属领域中的通常知识，在此将不详述。Please continue to refer to FIG. 1, the display panel 1 described in this embodiment further includes a liquid crystal layer 14, which is disposed between the first substrate 11 and the second substrate 12, and the liquid crystal layer 14 is located in the area surrounded by the sealant 13. Inside, the sealant 13 mainly seals the liquid crystal layer 14 between the first substrate 11 and the second substrate 12 . In addition, the second substrate 12 includes a circuit layer 120, which is exposed outside the first substrate 11. The circuit layer 120 is mainly electrically connected to an external driving circuit board (not shown in this figure) for driving the liquid crystal layer 14. The operation of performing display, and the detailed display driving method is common knowledge in the field, and will not be described in detail here.
上述第一基板11例如是彩色滤光片基板，而第二基板12例如是薄膜晶体管阵列基板，但本发明不以此为限。此外，第一基板11与第二基板12例如分别为可挠性基板，而可挠性基板的材质包括一聚邻苯二甲酸酯(polyethylene naphthalate，PEN)、一环烃烯聚合物(cyclic olefin copolymer，COC)、一聚亚酰胺(polyimide)、一聚醚石风(polyethersulfone，PES)与一聚乙烯对苯二甲酸酯(polyethylene terephthalate，PET)，但本发明不以此为限。The above-mentioned first substrate 11 is, for example, a color filter substrate, and the second substrate 12 is, for example, a thin film transistor array substrate, but the present invention is not limited thereto. In addition, the first substrate 11 and the second substrate 12 are, for example, flexible substrates respectively, and the material of the flexible substrate includes a polyphthalate (polyethylene naphthalate, PEN), a cycloolefin polymer (cyclic Olefin copolymer, COC), a polyimide (polyimide), a polyethersulfone (PES) and a polyethylene terephthalate (polyethylene terephthalate, PET), but the present invention is not limited thereto.
请参照图2，其为图1所示的显示面板的俯视示意图。在本图中，为了便于说明而将第一基板11进行省略。如图2所示，本实施例所述的框胶13具有四个块体1301、1302、1303、1304，而第二基板12上的线路层120与框胶13的至少一块体相邻，在本图中，框胶13的块体1301与块体1302分别与线路层120相邻。Please refer to FIG. 2 , which is a schematic top view of the display panel shown in FIG. 1 . In this figure, the first substrate 11 is omitted for convenience of description. As shown in FIG. 2, the sealant 13 in this embodiment has four blocks 1301, 1302, 1303, 1304, and the circuit layer 120 on the second substrate 12 is adjacent to at least one block of the sealant 13. In this figure, the blocks 1301 and 1302 of the sealant 13 are respectively adjacent to the circuit layer 120 .
请参照图3A至图3C，其为本发明一实施例所述的显示面板制作方法示意图。首先，如图3A所示，提供待裁切的显示面板2，此显示面板2包括第一基板21、第二基板22、第一框胶23、第二框胶24以及液晶层25。其中第一框胶23具有与第一基板21相接的第一表面231以及与第二基板22相接的第二表面232。而第二基板22包括线路层220。而第一基板21与第二基板22例如分别是可挠性基板。Please refer to FIG. 3A to FIG. 3C , which are schematic diagrams of a method for manufacturing a display panel according to an embodiment of the present invention. First, as shown in FIG. 3A , a display panel 2 to be cut is provided, and the display panel 2 includes a first substrate 21 , a second substrate 22 , a first sealant 23 , a second sealant 24 and a liquid crystal layer 25 . The first sealant 23 has a first surface 231 connected to the first substrate 21 and a second surface 232 connected to the second substrate 22 . The second substrate 22 includes a circuit layer 220 . The first substrate 21 and the second substrate 22 are, for example, flexible substrates respectively.
接着，以待裁切的显示面板2的第一框胶23与第二框胶24之间具有的间距D1为切割位置对第一基板21与第二基板22进行切割，以去除掉部分的第一基板21与第二基板22。而部分第一基板21与第二基板22被去除后的显示面板2a如图3B所示。从图3B中可以清楚看出，由于第二框胶24仅为在待裁切的显示面板2中做为固定以及防止第一基板21与第二基板22收缩变形之用，因此，当部分第一基板21与第二基板22被去除后，第二框胶24也会一并被去除。在图3B这个步骤中，去除部分第一基板21与第二基板22的切割制程一般称为全切割(Full Cutting)制程。Next, the first substrate 21 and the second substrate 22 are cut with the distance D1 between the first sealant 23 and the second sealant 24 of the display panel 2 to be cut as the cutting position, so as to remove part of the first substrate 21 and the second substrate 22. A substrate 21 and a second substrate 22 . The display panel 2 a after part of the first substrate 21 and the second substrate 22 are removed is shown in FIG. 3B . It can be clearly seen from FIG. 3B that since the second sealant 24 is only used for fixing and preventing shrinkage and deformation of the first substrate 21 and the second substrate 22 in the display panel 2 to be cut, when part of the first substrate 21 and the second substrate 22 are After the first substrate 21 and the second substrate 22 are removed, the second sealant 24 is also removed. In the step of FIG. 3B , the cutting process of removing part of the first substrate 21 and the second substrate 22 is generally called a full cutting (Full Cutting) process.
最后，以进行全切割制程过后的显示面板2a的第一基板21与第一框胶23相互重叠处D2为切割位置，来对第一基板21进行切割，以去除部分第一基板21，使得第一框胶23的部分第一表面231露出于第一基板21，而对第一基板21进行切割时，其切割深度例如是第一基板21的厚度的70％至90％。部分第一基板21被去除后的显示面板2b如图3C所示。从图3C中可以清楚看出，当显示面板2b的部分第一基板21被去除后，位于第二基板22上的线路层220会露出于第一基板21外。在图3C这个步骤中，去除部分第一基板21的切割制程一般称为半切割(Half Cutting)制程。而图3C所示的显示面板2b类似于图1所示的显示面板1，也就是图1所示的显示面板1同样可以通过如图3A至图3C的制作方法来制作。Finally, the first substrate 21 is cut by taking the overlapping position D2 of the first substrate 21 of the display panel 2a after the full cutting process and the first sealant 23 as the cutting position, so as to remove part of the first substrate 21, so that the second A portion of the first surface 231 of the sealant 23 is exposed on the first substrate 21 , and when cutting the first substrate 21 , the cutting depth is, for example, 70% to 90% of the thickness of the first substrate 21 . The display panel 2 b after part of the first substrate 21 is removed is shown in FIG. 3C . It can be clearly seen from FIG. 3C that when part of the first substrate 21 of the display panel 2 b is removed, the circuit layer 220 on the second substrate 22 will be exposed outside the first substrate 21 . In the step of FIG. 3C , the cutting process of removing part of the first substrate 21 is generally called a half cutting (Half Cutting) process. The display panel 2 b shown in FIG. 3C is similar to the display panel 1 shown in FIG. 1 , that is, the display panel 1 shown in FIG. 1 can also be manufactured by the manufacturing methods shown in FIGS. 3A to 3C .
请参照图4，其为图3A所示的待切割的显示面板2的俯视示意图。在本图中，为了便于说明而将第一基板21进行省略。如图4所示，待裁切的显示面板2的第二框胶24环绕于第一框胶23，在图3B的步骤中，当待切割显示面板2的部分第一基板21与第二基板22被去除后，第二框胶24会一并被去除。也就是说，在进行全切割制程时，较具体的切割位置例如是图4所示的切割线C1、C2、C3、C4。而第一框胶23具有块体2301、2302、2303、2304，位于第二基板22上的线路层220会与块体2301与块体2302相邻。因此，切割线C1、C2、C3、C4的位置会避免位于线路层220的区域范围之内。此外，在图3C的步骤中，由于进行半切割制程的目的在于将位于第二基板22a上的线路层220露出，因此，根据上述线路层220与块体2301、2302的位置关系，在进行半切割制程时，较具体的切割位置例如是图4所示的切割线C5、C6。Please refer to FIG. 4 , which is a schematic top view of the display panel 2 to be cut as shown in FIG. 3A . In this figure, the first substrate 21 is omitted for convenience of description. As shown in FIG. 4, the second sealant 24 of the display panel 2 to be cut is surrounded by the first sealant 23. In the step of FIG. 3B, when the first substrate 21 and the second substrate of the display panel 2 to be cut are After 22 is removed, the second sealant 24 will also be removed. That is to say, when performing the full cutting process, the more specific cutting positions are, for example, the cutting lines C1 , C2 , C3 , and C4 shown in FIG. 4 . The first sealant 23 has blocks 2301 , 2302 , 2303 , 2304 , and the circuit layer 220 on the second substrate 22 is adjacent to the blocks 2301 and 2302 . Therefore, the positions of the cutting lines C1 , C2 , C3 , and C4 are avoided from being within the area of the circuit layer 220 . In addition, in the step of FIG. 3C , since the purpose of the half-cutting process is to expose the circuit layer 220 on the second substrate 22a, according to the positional relationship between the circuit layer 220 and the blocks 2301 and 2302, the half-cut During the cutting process, the more specific cutting positions are, for example, the cutting lines C5 and C6 shown in FIG. 4 .
请参照图5，其为图3C所示的显示面板2b的俯视示意图。如图5所示，第一框胶23的第一表面231露出于第一基板21的部分呈矩形，此矩形具有长边L1与短边L2，其中矩形短边L2的长度范围例如是介于500微米至600微米之间。也就是说在进行半切割制程时，矩形短边L2的长度范围所对应于第一基板21的位置皆可作为切割时的下刀位置。Please refer to FIG. 5 , which is a schematic top view of the display panel 2 b shown in FIG. 3C . As shown in FIG. 5 , the part of the first surface 231 of the first sealant 23 exposed to the first substrate 21 is rectangular, and the rectangle has a long side L1 and a short side L2, wherein the length of the short side L2 of the rectangle is, for example, between Between 500 microns and 600 microns. That is to say, when the half-cutting process is performed, the position corresponding to the length range of the short side L2 of the rectangle can be used as the position of the lower knife during cutting.
请参照图6，其为本发明另一实施例所述的显示面板俯视示意图。图6所示的显示面板2c与图5所示的显示面板2b类似，不同点在于，图6所示的显示面板2c，其位于第二基板22上的线路层220a仅与第一框胶23的块体2301相邻。因此，根据图6所示的线路层220a与块体2301的位置关系，在进行半切割制程时，仅需沿如图4所示的切割线C5进行切割即可。请参照图7，其为图3B与图3C中进行全切割制程与半切割制程所使用的切割刀具示意图。如图7所示，切割刀具3包括基部31与切削部32。基部31具有相对的第一侧面311与第二侧面312。切削部32具有第一切削面321与第二切削面322。其中第一切削面321与第二切削面322、第一侧面311相接，第二切削面322与第二侧面312相接。第一切削面321与第一侧面312位于同一平面，第一切削面321与第二切削面322之间夹有锐角θ，此锐角的角度例如是30度，但本发明不以此为限。Please refer to FIG. 6 , which is a schematic top view of a display panel according to another embodiment of the present invention. The display panel 2c shown in FIG. 6 is similar to the display panel 2b shown in FIG. 5, the difference is that in the display panel 2c shown in FIG. The blocks 2301 are adjacent. Therefore, according to the positional relationship between the circuit layer 220a and the block body 2301 shown in FIG. 6 , only cutting along the cutting line C5 shown in FIG. 4 is required when performing the half-cutting process. Please refer to FIG. 7 , which is a schematic diagram of cutting tools used in the full-cutting process and the half-cutting process in FIG. 3B and FIG. 3C . As shown in FIG. 7 , the cutting tool 3 includes a base portion 31 and a cutting portion 32 . The base 31 has a first side 311 and a second side 312 opposite to each other. The cutting portion 32 has a first cutting surface 321 and a second cutting surface 322 . The first cutting surface 321 is in contact with the second cutting surface 322 and the first side surface 311 , and the second cutting surface 322 is in contact with the second side surface 312 . The first cutting surface 321 and the first side surface 312 are located on the same plane, and there is an acute angle θ between the first cutting surface 321 and the second cutting surface 322 . The acute angle is, for example, 30 degrees, but the present invention is not limited thereto.
综上所述，本发明所述的显示面板制作方法，在进行半切割制程时，以第一基板与第一框胶相互重叠处为切割位置来对第一基板进行切割，以切除部分第一基板而使得第一框胶的部分第一表面露出于第一基板。由于第一框胶具有弹性的材料特性，因此，在切割第一基板的过程中，框胶可以吸收刀具在切割时所产生的剪切应力，进而达到保护位于第二基板的线路层的功效。To sum up, in the display panel manufacturing method of the present invention, when the half-cutting process is performed, the first substrate is cut at the overlapping position of the first substrate and the first sealant as the cutting position, so as to cut off part of the first The substrate so that part of the first surface of the first sealant is exposed to the first substrate. Since the first sealant has elastic material properties, during the process of cutting the first substrate, the sealant can absorb the shear stress generated by the cutter during cutting, thereby achieving the effect of protecting the circuit layer on the second substrate.
虽然本发明已通过较佳实施例做出如上说明，然其并非用以限定本发明，任何本领域技术人员，在不脱离本发明的精神和范围内，当可作些许的更动与润饰，因此本发明的保护范围当视所附的权利要求书所界定者为准。Although the present invention has been described above through preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art may make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention should be defined by the appended claims.
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| TW101112661 | 2012-04-10 | ||
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