CN102690045A - Packaging device and packaging method - Google Patents
Packaging device and packaging methodDownload PDFInfo
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- CN102690045A CN102690045ACN2011100680891ACN201110068089ACN102690045ACN 102690045 ACN102690045 ACN 102690045ACN 2011100680891 ACN2011100680891 ACN 2011100680891ACN 201110068089 ACN201110068089 ACN 201110068089ACN 102690045 ACN102690045 ACN 102690045A
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
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Abstract
Description
Technical field
The present invention relates to the ME field of flat-panel monitor, relate in particular to a kind of controllable spray fluid pressing system and use this system to accomplish the method for laser glass material encapsulation.
Background technology
Flat-panel monitor (Flat Panel Display) began to develop rapidly from the nineties in 20th century, and progressively moved to maturity, and was widely used in household electrical appliance, computer and the communication product.Flat-panel monitor is divided into active illuminating and passive luminous two types.The former refers to show that medium itself is luminous and the display device of visible radiation is provided, and comprises plasma display (PDP), vacuum fluorescent display (VFD), Field Emission Display (FED), electroluminescent display (LED) and organic light emitting diode display (OLED) etc.The latter refers to that itself is not luminous; But after utilizing the demonstration medium by the electrical signal modulation; Its optical characteristics changes; Light to surround lighting and additional power source (backlight, projection light source) send is modulated, and the device that in image display or screen, shows comprises liquid-crystal display (LCD), mems display (DMD) and e-inks (EL) indicating meter etc.
And say from the output value; Main at present is three big pillars of FPD with LCD, PDP, OLED, and wherein LCD and PDP are ripe relatively, and OLED is as technique of display of future generation; All have a clear superiority in compared to LCD and PDP aspect the leading indicators such as, response speed frivolous in colour gamut, visual angle, energy consumption, profile; In addition, OLED also has the special property that can be made into flexible display device, thereby OLED display device future prospects for development is boundless.
But from present stage, because material and technological reason, also there is the short problem of working life in the OLED device, and the industrialization process technological to OLED caused bigger obstruction with using.Except the early stage luminous organic material life-span itself is not ideal enough; Prior reason is luminous organic material extremely sensitive to oxygen and steam; The infiltration of steam and oxygen; Can cause effects such as the oxidation of OLED device inner cathode, demoulding, organic layer crystallization, cause device aging in advance and even damage, the common phenomenons such as stain, pixel shrinkage and light intensity attenuation that have occur.According to the commercialization requirement of products, the OLED device reached working life 10,000 hours and storage life 50,000 hours at least, and water vapor permeable rate (WVTR) is less than 10-6G/m2/ day, oxygen permeability (OTR) is less than 10-5Cc/bar/m2/ day, for the real permeability of water oxygen apparently higher than LCD.
The major technique that is applied to the OLED device package at present has the sealing of UV glue capping formula and two kinds of technology of diaphragm seal; The former is owing to use macromolecular epoxide resin material; There are many minute apertures in the material; Still can't stop steam and the infiltration of oxygen in the environment fully, so utilize the technological packaged device life-span of this kind desirable not enough; Further innovative approach is in sealing member, to preset drying material, improves product life, so just brings problems such as process procedure, cost and equipment purchasing, and its life-span raising degree is limited; And thin-film package adopts multiple inorganic or organic film to be deposited on the sealing coat that forms steam and oxygen on the OLED luminous organic material; But the practical manifestation of associated materials also adds the method for siccative not as good as the sealing of traditional U V glue lid formula far away, so also need packaged material research and development and the improvement of long period.
In fact; Glass powder with low melting point is as a kind of advanced person's welding material; Have lower temperature of fusion and sealing temperature, good thermotolerance and chemicalstability, very high physical strength; Can realize the mutual sealing-in between glass, pottery, metal, semi-conductor, thereby be widely used in various fields such as vacuum and microelectronics, laser and infrared technique, high energy physics, the energy, aerospace, automobile.The US6998776 proposition utilizes the method for lasing source irradiation melting material to be applied to the glass capsulation of OLED device, adopts the benefit of laser package to be local contactless heating, and is little to OLED equitemperature susceptible device susceptor heat-affected zone; Owing to be homogeneity encapsulation, can obtain the closely knit package strength of making peace, isolated well steam and oxygen reach than better, the life-span effect more of a specified duration of UV glue lid formula encapsulation performance; In addition, the width and the thickness of packaging line can be very little, and the frivolous and wide ken of device is had obvious benefit.
The main processes of laser glass powder encapsulation is that watery fusion glass powder is processed paste, utilizes spray glue or method for printing screen to be coated on the packaging line of cap glass substrate, then the cap glass substrate is put into the vacuum crucible and carries out presintering.Overlay on the OLED glass substrate after the encapsulation cover plate contraposition accurately of completion presintering, utilize the laser scanning packaging line again, the frit after the fusion can bond going up lower glass substrate securely once more, can form encapsulating structure after the cooling.Yet laser package is very sensitive to the gap of sealing-in place, needs to keep the welding process intermediate gap not change a lot, and the typical maximum weld gap that allows is not more than 0.1 times of material thickness.And it is current in OLED laser glass powder encapsulation process; Exist pointed like US2010/0118912; On the cap glass substrate, may have some defectives during coated glass cream, such as salient point, cavity and difference in thickness, these defectives possibly cause the finished product encapsulation to be lost efficacy.Because the existence of these defect problems has caused the yield of laser package lower.Thereby; US2010/0130091 proposes to compress layer glass substrate up and down with the Vitrea way of vacuum pressure tightening seal; Make frit approaching with glass substrate as much as possible; Reduce gap affects, can't obtain under the large substrates condition, to compress uniformly effect yet vacuum compresses scheme, particularly when packaged glass employing US2007/0267972 described pre-packaged after; And US2009/0233514 proposes to keep frit to press close to glass substrate as much as possible with the way of mechanical compaction; Reduce gap affects; But need before laser scanning, move corresponding mechanical clamping device, increase the running time, and snap-in force inconvenience adjustment.
Summary of the invention
For solving the problems of the technologies described above; The present invention provides a kind of packaging system and method for packing; The snap-in force at frit contact interface place is improved packaging yield in the time of not only can laser package being provided; Can also dynamically adjust the snap-in force of needs according to technological test, the snap-in force to different frits and glass substrate adjustment needs has better material flexibility and Technological adaptability.
For realizing the foregoing invention purpose, the present invention discloses a kind of packaging system, and this packaging system comprises:
Stage microscope is used to carry the encapsulating structure that is used to assemble, and affiliated encapsulating structure has first substrate, second substrate, and be arranged between this first substrate and second substrate, be used to form the melt of at least one chamber; Source of radiation is used to heat this melt, and its joint face place with the one the second substrates is combined, and makes above-mentioned chamber form a level Hermetic Package structure; Fluid source provides the fluid bundle, and this fluid bundle acts on this first substrate, is used to compress the melt between this first substrate and this second substrate.
Further, this melt comprises the watery fusion frit.This melt further comprises at least a in the following composition: organic one-tenth membrane carrier, organic binder, dispersion agent, tensio-active agent.
Further, this second substrate comprises at least one organic light-emitting device pixel region, and this first substrate is arranged on the pixel region of this second substrate, and this melt is arranged on the packaging line, and this packaging line is positioned at non-pixel region.This first substrate is a glass substrate.
Further, this fluid bundle is the gas beam that contains the non-aggressive composition.This gas beam is the rare gas element bundle.This fluid source comprises one or more splash heads.This splash head is point-like splash head, wire splash head or planar splash head.This fluid bundle acts on this pixel region or this packaging line.The decoration form of said splash head can be that single-point is arranged, multiple spot is arranged, wherein multiple spot is arranged and can is linear array arranged, face battle array arranged or arrange according to the particular combination mode.The decoration form of said splash head can be single-point layout, multiple spot layout, linear array arranged, face battle array arranged.
The present invention discloses a kind of method for packing that utilizes said apparatus simultaneously, comprising:
Step 1, placement one has first substrate of melt;
Step 2 is placed second substrate on the melt of said first substrate, and forms at least one chamber;
Step 3 provides a fluid bundle to apply power on said first substrate;
Step 4 provides a source of radiation, heats said melt, makes above-mentioned chamber form the level Hermetic Package structure.
This step 1 specifically comprises: utilize the method for spray glue or silk screen printing that this melt is coated on the packaging line that is positioned at this first substrate.This step 2 specifically comprises: this first substrate is carried out presintering under vacuum condition, form and to solidify in the glass frit sintered body of this first substrate, and discharge organic component and steam, oxygen composition.This step 3 specifically comprises: under vacuum or rare gas element, first substrate and second substrate are carried out folded.This step 4 specifically comprises: make this fluid source apply snap-in force on this packaging line; In this radiation source irradiates packaging line zone heating melt process, keep required snap-in force always; Make after its fusion after two linkage interface places form the level Hermetic Package structure, cancel snap-in force again.
With compared with techniques formerly, technique effect of the present invention is obviously excellent:
At first, the present invention adopts the on-mechanical contact to compress.Utilize spraying fluid and produce snap-in force, is that a kind of on-mechanical contact compresses mode, does not influence on the glass substrate in equipment or increases the miscellaneous equipment function on the mask, such as the optical detector signal path etc.; In addition, this injection fluid compresses mode, does not need the mechanical location adjustment process of used mechanical clamping device in the technology formerly itself, has practiced thrift the encapsulation time.
Once more, device and method provided by the present invention, its snap-in force is adjustable.Can change the formed snap-in force of injection fluid through adjustment injection fluidic flow and flow velocity,, have good and well-to-do material flexibility so can adapt to different compacted materials.
Description of drawings
Can graphicly further be understood through following detailed Description Of The Invention and appended about advantage of the present invention and spirit.
Fig. 1 is the structural representation of packaging system involved in the present invention;
Fig. 2 is the structural representation of the cap glass substrate of coated glass material;
Fig. 3 is the structural representation of OLED glass substrate;
Fig. 4 is the schema of melt method for packing involved in the present invention.
Main diagram as follows
1-is along packaging line length direction 2-packaging line cross-wise direction;
101-cap glass substrate 102-OLED glass substrate;
200-packaging line 200 '-oled substrate on corresponding packaging line position;
White space 300 in the 300-packaging line '-oled substrate on white space in the corresponding packaging line
301-OLED pel array 700-sprays fluid ejection assembly
1001-sprays fluid 501-laser apparatus
The 502-laser beam
Embodiment
Specify specific embodiment of the present invention below in conjunction with accompanying drawing.
Fig. 1 is the structural representation of packaging system involved in the present invention.Though not shown among Fig. 1, should be appreciated that this sealing glass package of treating the scanning of laser or other source of radiation is placed on the smooth wafer-supporting platform and remains potted in the process position can measure.As shown in fig. 1, utilize laser or otherradiation source system 501 to produceradiation beam 502, see throughcap glass 101 and be radiated on the packaging line frit 200, form the scanning motion of radiation spot through relative displacement along packaging line.And the injectionfluid ejection assembly 700 that the present invention is somebody's turn to do is independent ofradiation source system 501; And inradiation source system 501radiation beams 502,spray fluid 1001 to packaging line and near zone, spraying fluid will produce required snap-in force on the packaging line surface of sealing glass package to be packaged.Utilize the snap-in force that is produced, can be so that in the process of radiation source irradiates packaging line, frit and package interface have minimum encapsulation gap, thereby can accelerate the infiltration speed of melten glass material, form good package interface.
Fig. 2 is the structural representation of the cap glass substrate of coated glass material, and Fig. 3 is the structural representation of OLED glass substrate.As shown in Figure 2, be divided into two distinct area bypackaging line 200 on thiscap glass substrate 101, the outer white space (not shown) of white space 300 and packaging line in the packaging line.Thispackaging line 200 has been formed the geometricdrawing of a sealing, could guarantee the resistance to air loss of encapsulation like this.Frit is applied on the packaging line 200.As shown in Figure 3, OLEDpel array 301 be positioned at corresponding packaging line white space 300 on the oled substrate '.
It can be N that the present invention should sprayfluid 10012, gaseous fluids such as rare gas element such as Ar or high purity dry air, also can be other fluid type that can produce this stress, its choice criteria is oxygen-free, water or hydroxide ion, does not contain corrodibility and adhesion composition simultaneously.The splash head that the present invention is somebody's turn to do can be single or a plurality of point-like splash heads, wire splash head or planar splash head.The present invention should spray the fluid snap-in force both can act on whole glass-encapsulated to be sealed surface, also can only act on the packaging line zone of glass packages to be sealed.Simultaneously, though the present invention is that example describes with the OLED device, be to utilize this method improvement that the application of the sealing effectiveness of the responsive thin-film device of surrounding environment (for example oxygen, moisture) is all belonged to protection scope of the present invention in every case.
Fig. 4 is the schema of melt method for packing involved in the present invention.
As shown in Figure 4, method for packing provided by the present invention mainly is made up of following steps:
S401-is coated in melt the packaging line that is positioned at first substrate.Particularly comprise: utilize the method for spray glue or silk screen printing can glass cream be coated on the predetermined packaging line.Certainly before glass cream being coated on the predetermined packaging line, must accomplish the system cream work of frit.Generally include and become membrane carrier (such as ester alcohol texanol), organic binder (such as TKK 021 ethyl cellulose) and specific dispersant, tensio-active agent to carry out uniform mixing with organic the watery fusion frit, obtain a kind of paste.
S402-roasting melt.Particularly comprise: the cap glass to having applied glass cream carries out presintering under vacuum condition, form solidify in cap on glass glass frit sintered body, and discharge organic component and steam, oxygen composition.
S403-is positioned over first substrate on second substrate.Particularly comprise: under vacuum or atmosphere of inert gases, cap glass and packed device substrate glass as shown in Figure 2 are carried out folded and/or pre-packaged.
S404-utilizes the fluid bundle to apply power on first substrate, utilizes laser apparatus heating melt.Particularly comprise: utilize laser or other radiation source irradiates packaging line zone, frit makes after its fusion and forms the level Hermetic Package structures at two linkage interface places.
What be somebody's turn to do in this specification sheets is preferred embodiment of the present invention, and above embodiment is only in order to explain technical scheme of the present invention but not limitation of the present invention.All those skilled in the art all should be within scope of the present invention under this invention's idea through the available technical scheme of logical analysis, reasoning, or a limited experiment.
Claims (16)
1. a packaging system is characterized in that, said packaging system comprises:
Stage microscope is used to carry the encapsulating structure that is used to assemble, and affiliated encapsulating structure has first substrate, second substrate, and be arranged between said first substrate and second substrate, be used to form the melt of at least one chamber;
Source of radiation is used to heat said melt, and its joint face place with said the one the second substrates is combined, and makes above-mentioned chamber form a level Hermetic Package structure;
Fluid source provides the fluid bundle, and said fluid bundle acts on said first substrate, is used to compress the melt between said first substrate and said second substrate.
2. packaging system as claimed in claim 1 is characterized in that said melt comprises the watery fusion frit.
3. packaging system as claimed in claim 2 is characterized in that, said melt further comprises at least a in the following composition: organic one-tenth membrane carrier, organic binder, dispersion agent, tensio-active agent.
4. packaging system as claimed in claim 1; It is characterized in that said second substrate comprises at least one organic light-emitting device pixel region, said first substrate is arranged on the pixel region of said second substrate; Said melt is arranged on the packaging line, and said packaging line is positioned at non-pixel region.
5. packaging system as claimed in claim 1 is characterized in that, said first substrate is a glass substrate.
6. packaging system as claimed in claim 1 is characterized in that, said fluid bundle is the gas beam that contains the non-aggressive composition.
7. packaging system as claimed in claim 6 is characterized in that, said fluid bundle is the rare gas element bundle.
8. packaging system as claimed in claim 1 is characterized in that said fluid source comprises one or more splash heads.
9. packaging system as claimed in claim 8 is characterized in that, said splash head is point-like splash head, wire splash head or planar splash head.
10. packaging system as claimed in claim 8 is characterized in that, the decoration form of said splash head can be that single-point is arranged or multiple spot is arranged; Wherein multiple spot is arranged and can is linear array arranged, face battle array arranged or arrange according to the particular combination mode.
11. packaging system as claimed in claim 4 is characterized in that, said fluid bundle acts on said pixel region or the said packaging line.
12. a method for packing is characterized in that, said method for packing comprises:
Step 1, placement one has first substrate of melt;
Step 2 is placed second substrate on the melt of said first substrate, and forms at least one chamber;
Step 3 provides a fluid bundle to apply power on said first substrate;
Step 4 provides a source of radiation, heats said melt, makes above-mentioned chamber form the level Hermetic Package structure.
13. method for packing as claimed in claim 12 is characterized in that, said step 1 specifically comprises: utilize the method for spray glue or silk screen printing that said melt is coated on the packaging line that is positioned at said first substrate.
14. method for packing as claimed in claim 12; It is characterized in that; Said step 2 specifically comprises: said first substrate is carried out presintering under vacuum condition, form and to solidify in the glass frit sintered body of said first substrate, and discharge organic component and steam, oxygen composition.
15. method for packing as claimed in claim 12 is characterized in that, said step 3 specifically comprises: under vacuum or rare gas element, first substrate and second substrate are carried out folded.
16. method for packing as claimed in claim 12; It is characterized in that; Said step 4 specifically comprises: make said fluid source apply snap-in force on said packaging line; In said radiation source irradiates packaging line zone heating melt process, keep required snap-in force always, make after its fusion after two linkage interface places form the level Hermetic Package structure, cancel snap-in force again.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100680891ACN102690045A (en) | 2011-03-21 | 2011-03-21 | Packaging device and packaging method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100680891ACN102690045A (en) | 2011-03-21 | 2011-03-21 | Packaging device and packaging method |
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| CN102690045Atrue CN102690045A (en) | 2012-09-26 |
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| CN2011100680891APendingCN102690045A (en) | 2011-03-21 | 2011-03-21 | Packaging device and packaging method |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103474587A (en)* | 2013-09-30 | 2013-12-25 | 上海大学 | OLED packaging device |
| CN103715371A (en)* | 2013-12-16 | 2014-04-09 | 京东方科技集团股份有限公司 | Packaging method and display device |
| CN104124179A (en)* | 2013-04-26 | 2014-10-29 | 上海和辉光电有限公司 | Display device packaging technology and device |
| CN104882557A (en)* | 2014-02-27 | 2015-09-02 | 群创光电股份有限公司 | Organic Light Emitting Diode Devices |
| CN105336877A (en)* | 2014-07-29 | 2016-02-17 | 上海微电子装备有限公司 | System and method for sealing glass packaging body through laser scanning |
| CN105895828A (en)* | 2014-05-12 | 2016-08-24 | 上海微电子装备有限公司 | Stepping type laser packaging temperature and power detection-control device and method |
| WO2016206125A1 (en)* | 2015-06-23 | 2016-12-29 | 深圳市华星光电技术有限公司 | Encapsulation method for organic light emitting diode and display device |
| CN108123052A (en)* | 2016-11-30 | 2018-06-05 | 上海微电子装备（集团）股份有限公司 | A kind of laser package apparatus and method |
| CN108857057A (en)* | 2018-06-26 | 2018-11-23 | 华南师范大学 | A kind of apparatus and method realized monocrystalline silicon and glass laser and weld preceding optical contact |
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| US20040207314A1 (en)* | 2003-04-16 | 2004-10-21 | Aitken Bruce G. | Glass package that is hermetically sealed with a frit and method of fabrication |
| CN101884246A (en)* | 2007-10-05 | 2010-11-10 | 康宁股份有限公司 | Method and apparatus for sealing glass packages |
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- 2011-03-21CNCN2011100680891Apatent/CN102690045A/enactivePending
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| US20030020181A1 (en)* | 2001-06-29 | 2003-01-30 | Tsutomu Yamada | Manufacturing method of electroluminescence display apparatus |
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Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104124179A (en)* | 2013-04-26 | 2014-10-29 | 上海和辉光电有限公司 | Display device packaging technology and device |
| CN104124179B (en)* | 2013-04-26 | 2017-08-29 | 上海和辉光电有限公司 | The packaging technology and device of display device |
| CN103474587A (en)* | 2013-09-30 | 2013-12-25 | 上海大学 | OLED packaging device |
| CN103474587B (en)* | 2013-09-30 | 2015-12-02 | 上海大学 | OLED packaging system |
| US9472777B2 (en) | 2013-12-16 | 2016-10-18 | Boe Technology Group Co., Ltd. | Packaging method and display device |
| CN103715371A (en)* | 2013-12-16 | 2014-04-09 | 京东方科技集团股份有限公司 | Packaging method and display device |
| CN104882557A (en)* | 2014-02-27 | 2015-09-02 | 群创光电股份有限公司 | Organic Light Emitting Diode Devices |
| CN105895828A (en)* | 2014-05-12 | 2016-08-24 | 上海微电子装备有限公司 | Stepping type laser packaging temperature and power detection-control device and method |
| CN105336877A (en)* | 2014-07-29 | 2016-02-17 | 上海微电子装备有限公司 | System and method for sealing glass packaging body through laser scanning |
| CN105336877B (en)* | 2014-07-29 | 2018-01-26 | 上海微电子装备（集团）股份有限公司 | Systems and methods for laser scanning hermetically sealed glass packages |
| WO2016206125A1 (en)* | 2015-06-23 | 2016-12-29 | 深圳市华星光电技术有限公司 | Encapsulation method for organic light emitting diode and display device |
| CN108123052A (en)* | 2016-11-30 | 2018-06-05 | 上海微电子装备（集团）股份有限公司 | A kind of laser package apparatus and method |
| CN108857057A (en)* | 2018-06-26 | 2018-11-23 | 华南师范大学 | A kind of apparatus and method realized monocrystalline silicon and glass laser and weld preceding optical contact |
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