CN102610712B - Light emitting diode (LED) package method and structure - Google Patents

Abstract

The invention discloses a light emitting diode (LED) package method and an LED package structure. A plurality of independent reflection slots are formed on an integrated heat conduction substrate; LED chips are fixedly arranged in the reflection slots; and fluorescent powder is injected into the reflection slots and used for solidifying the LED chips. According to the method and the structure, the stability and the light output efficiency of LEDs are improved; and furthermore, the requirement on LED package processing cost and precision can be reduced, and the yield and the production efficiency of an LED product are improved.

Description

A kind of LED method for packing and structure

Technical field

The present invention relates to a kind of LED method for packing and structure, belong to LED lighting technical field.

Background technology

LED light emitting diode illuminator has efficient, energy-conservation advantage, and the luminous efficiency of current LED illuminating lamp can surpass 70LM/W mostly, than traditional electricity-saving lamp, has more power savings advantages.And the stability that existing LED method for packing production efficiency is low, product yield is low, wafer bonding wire mode is unfavorable for wafer.Existing COB product mostly is planar package form, and board structure, to not well performance of reflection of light, has the packed internal reflection of part light to absorb, and causes light output efficiency on the low side.Light efficiency can only reach 80% of dual in-line package form LED.And MCOB product is due to board structure and the more high reason of machining accuracy, production capacity and cost are had to considerable influence.In addition, existing LED substrate module can only be realized connection in series-parallel and the welding between chip, and in chips welding process, the control of two weldering parameters is had relatively high expectations.Cause when occurring cannot repairing separately and cause scrapping of whole substrate light source when wherein a chips has fault.Considerable influence production yield, improved production cost.

Summary of the invention

The object of the invention is to, a kind of LED method for packing and structure are provided.It can improve stability and the light output efficiency of LED, and can reduce cost and the required precision of LED encapsulation process, promotes acceptance rate and the production efficiency of LED product.

Technical scheme of the present invention: a kind of LED method for packing, is characterized in: set up a plurality of independently reflection grooves on all-in-one-piece heat-conducting substrate, admittedly put LED wafer in reflection groove, and inject fluorescent material baking-curing.Reflection groove can improve the reflection efficiency of LED, and LED wafer is directly encapsulated on heat-conducting substrate, and radiating efficiency is higher.

In above-mentioned LED method for packing, on described heat-conducting substrate, be embedded with all-in-one-piece wiring frame, by carry out overall routing on wiring frame, realize the connection between each LED wafer.The leading foot of LED wafer is connected to the node on wiring frame, and then only need on wiring frame, connect each node complete the connection between each LED wafer.

In aforesaid LED method for packing, described fluorescent powder curing becomes prominent cup-shaped (convex configuration).

In aforesaid LED method for packing, described heat-conducting substrate bottom is provided with extraction electrode, for docking with driver.

A kind of LED encapsulating structure of realizing said method, is characterized in: comprise heat-conducting substrate, offer reflection groove on heat-conducting substrate, be fixed with LED wafer in reflection groove, and be solidified with fluorescent material and be enclosed on LED wafer.

In aforesaid LED encapsulating structure, on described heat-conducting substrate, be embedded with wiring frame.

In aforesaid LED encapsulating structure, the region that reflection groove is not set on described heat-conducting substrate is provided with groove, and wiring frame shape and groove shape match, and wiring frame is a plane after embedding heat-conducting substrate.

In aforesaid LED encapsulating structure, described curing fluorescent material is prominent cup-shaped.

In aforesaid LED encapsulating structure, described heat-conducting substrate bottom is provided with extraction electrode.

Compared with prior art, the present invention by setting up independently reflection groove on all-in-one-piece heat-conducting substrate, and in reflection groove direct fixed L ED wafer, not only can improve the light emission rate of LED, and wafer produces heat unification and is directly conducted to outer radiator heat-dissipation by all-in-one-piece heat-conducting substrate while normally working, thereby obtain lower LED junction temperature, further reduce the light decay of LED.In addition, the consolidated structures that reflection groove is equipped with protruding cup-shaped fluorescent material again can obtain more light emission rate, makes the light efficiency of whole device higher.Because the present invention adopts the design of overall routing structure, can realize the combination of different voltage, different colours, different-waveband LED chip again, the flexible light modulation that realizes is mixed colours.Because connecting between each wafer all, by the connected maintenance that can realize single wafer of wiring frame routing, avoid scrapping of whole module, the holistic cost of larger reduction finished product.The invention enables whole LED module in structural design, to realize different chips sharing solid weld-ring border, thereby can make the chip of different VF, different-waveband be used in combination simultaneously, the diversity that realizes light, look output, the flexible combination that can realize different-waveband and color wafer can obtain higher color rendering index Ra >=90.

Accompanying drawing explanation

Fig. 1 is structural representation of the present invention;

Fig. 2 is the polycrystalline substance schematic diagram of heat-conducting substrate of the present invention.

Being labeled as in accompanying drawing: 1-heat-conducting substrate, 2-reflection groove, 3-wiring frame, 4-extraction electrode.

Embodiment

Below in conjunction with drawings and Examples, the present invention is further illustrated, but not as the foundation to the present invention's restriction.

Embodiment.A LED method for packing is set up a plurality of independently reflection grooves on all-in-one-piece heat-conducting substrate, admittedly puts LED wafer in reflection groove, and injects fluorescent material baking-curing.On described heat-conducting substrate, be embedded with all-in-one-piece wiring frame, by carry out overall routing on wiring frame, realize the connection between each LED wafer.Described fluorescent powder curing becomes prominent cup-shaped.Described heat-conducting substrate bottom is provided with extraction electrode.

A kind of LED encapsulating structure of realizing said method, as shown in Figure 1, comprises heat-conducting substrate 1, offers reflection groove 2 on heat-conducting substrate 1, is fixed with the large power chip of 0.5～1W in reflection groove 2, and is solidified with fluorescent material and is enclosed on LED wafer.On described heat-conducting substrate 1, be embedded with wiring frame 3.The region that reflection groove 2 is not set on described heat-conducting substrate 1 is provided with groove, and wiring frame 3 shapes and groove shape match, and after wiring frame 3 embeds heat-conducting substrate 1, is a plane.Described curing fluorescent material is prominent cup-shaped.Described heat-conducting substrate 1 bottom is provided withextraction electrode 4, as shown in Figure 2.

On basis of the present invention to the change of the variation of the change of the quantity of reflection groove and dimensions, baseplate material, luminous zone shape or monnolithic case size all in the present invention's scope required for protection.

Claims (7)

1. a LED method for packing, is characterized in that: on all-in-one-piece heat-conducting substrate, set up a plurality of independently reflection grooves, admittedly put LED wafer in reflection groove, and inject fluorescent material baking-curing; On described heat-conducting substrate, be embedded with all-in-one-piece wiring frame, by carry out overall routing on wiring frame, realize the connection between each LED wafer.

2. LED method for packing according to claim 1, is characterized in that: described fluorescent powder curing becomes prominent cup-shaped.

3. LED method for packing according to claim 1, is characterized in that: described heat-conducting substrate bottom is provided with extraction electrode.

4. a LED encapsulating structure, is characterized in that: comprise heat-conducting substrate (1), offer reflection groove (2) on heat-conducting substrate (1), reflection groove is fixed with LED wafer in (2), and is solidified with fluorescent material and is enclosed on LED wafer; On described heat-conducting substrate (1), be embedded with wiring frame (3).

5. LED encapsulating structure according to claim 4, it is characterized in that: the region that reflection groove (2) is not set on described heat-conducting substrate (1) is provided with groove, wiring frame (3) shape and groove shape match, and wiring frame (3) is a plane after embedding heat-conducting substrate (1).

6. LED encapsulating structure according to claim 4, is characterized in that: described curing fluorescent material is prominent cup-shaped.

7. LED encapsulating structure according to claim 4, is characterized in that: described heat-conducting substrate (1) bottom is provided with extraction electrode (4).

Images