CN102610712A - Light emitting diode (LED) package method and structure - Google Patents

Abstract

The invention discloses a light emitting diode (LED) package method and an LED package structure. A plurality of independent reflection slots are formed on an integrated heat conduction substrate; LED chips are fixedly arranged in the reflection slots; and fluorescent powder is injected into the reflection slots and used for solidifying the LED chips. According to the method and the structure, the stability and the light output efficiency of LEDs are improved; and furthermore, the requirement on LED package processing cost and precision can be reduced, and the yield and the production efficiency of an LED product are improved.

Description

A kind of LED method for packing and structure

Technical field

The present invention relates to a kind of LED method for packing and structure, belong to the LED lighting technical field.

Background technology

The LED light emitting diode illuminator has efficiently, energy-saving advantages, and the luminous efficiency of current LED illuminating lamp can surpass 70LM/W mostly, has more power savings advantages than traditional electricity-saving lamp.And the stability that existing LED method for packing production efficiency is low, the product yield is low, wafer bonding wire mode is unfavorable for wafer.Mostly existing C OB product is the planar package form, and board structure has the packed internal reflection of part light to absorb to not well performance of reflection of light, causes light output efficiency on the low side.Light efficiency can only reach 80% of dual in-line package form LED.And the MCOB product has considerable influence owing to board structure and the more high reason of machining accuracy to production capacity and cost.In addition, existing LED substrate module can only be realized connection in series-parallel and welding between the chip, and in the chips welding process, two weldering parameter control is had relatively high expectations.Cause when occurring to repair and to cause scrapping of whole base plate light source separately when wherein a chips has fault.Considerable influence the production yield, improved production cost.

Summary of the invention

The objective of the invention is to, a kind of LED method for packing and structure are provided.It can improve stability and the light output efficiency of LED, and can reduce the cost and the required precision of LED encapsulation process, promotes the acceptance rate and the production efficiency of LED product.

Technical scheme of the present invention: a kind of LED method for packing is characterized in: on all-in-one-piece heat-conducting substrate, set up a plurality of independently reflection grooves, in reflection groove, put the LED wafer admittedly, and inject the fluorescent material baking-curing.Reflection groove can improve the reflection efficiency of LED, and the LED wafer directly is encapsulated on the heat-conducting substrate, and radiating efficiency is higher.

In the above-mentioned LED method for packing, be embedded with all-in-one-piece cloth wire frame on the said heat-conducting substrate, through realizing the connection between each LED wafer in the enterprising capable overall routing of cloth wire frame.The leading foot of LED wafer is connected to the node on the cloth wire frame, only needs then promptly to accomplish the connection between each LED wafer at each node of connection on the cloth wire frame.

In the aforesaid LED method for packing, said fluorescent powder curing becomes prominent cup-shaped (convex configuration).

In the aforesaid LED method for packing, said heat-conducting substrate bottom is provided with extraction electrode, is used for docking with driver.

Realize a kind of LED encapsulating structure of said method, be characterized in: comprise heat-conducting substrate, offer reflection groove on the heat-conducting substrate, the reflection groove internal fixation has the LED wafer, and is solidified with fluorescent material and is enclosed on the LED wafer.

In the aforesaid LED encapsulating structure, be embedded with the cloth wire frame on the said heat-conducting substrate.

In the aforesaid LED encapsulating structure, the zone that reflection groove is not set on the said heat-conducting substrate is provided with groove, and wiring shaped as frame shape and groove shape are complementary, and the cloth wire frame is a plane after embedding heat-conducting substrate.

In the aforesaid LED encapsulating structure, the fluorescent material of said curing is prominent cup-shaped.

In the aforesaid LED encapsulating structure, said heat-conducting substrate bottom is provided with extraction electrode.

Compared with prior art; The present invention is through setting up independently reflection groove on all-in-one-piece heat-conducting substrate; And in reflection groove direct fixed L ED wafer, not only can improve the light emission rate of LED, and wafer produces the heat unification and is directly conducted to outer radiator heat-dissipation through all-in-one-piece heat-conducting substrate during operate as normal; Thereby obtain lower LED junction temperature, further reduce the light decay of LED.In addition, the consolidated structures that reflection groove is equipped with protruding cup-shaped fluorescent material again can obtain more light emission rate, makes that the light efficiency of entire device is higher.Because the present invention adopts the overall routing structure Design can realize the combination of different voltages, different colours, different-waveband led chip, flexible realization light modulation is mixed colours again.Can realize that because of connecting between each wafer all to link to each other the maintenance of single wafer avoids scrapping of whole module, the whole cost of bigger reduction finished product through cloth wire frame routing.The invention enables the whole LED module to realize that on structural design different chips is to consolidating the shared of weld-ring border; Thereby the chip of different VF, different-waveband is used in combination simultaneously; Realize the diversity of light, look output, can realize that the flexible combination of different-waveband and color wafer can obtain higher color rendering index Ra >=90.

Description of drawings

Fig. 1 is a structural representation of the present invention;

Fig. 2 is the polycrystalline substance sketch map of heat-conducting substrate of the present invention.

Being labeled as in the accompanying drawing: 1-heat-conducting substrate, 2-reflection groove, 3-cloth wire frame, 4-extraction electrode.

Embodiment

Below in conjunction with accompanying drawing and embodiment the present invention is further described, but not as the foundation to the present invention's restriction.

Embodiment.A kind of LED method for packing is set up a plurality of independently reflection grooves on all-in-one-piece heat-conducting substrate, in reflection groove, put the LED wafer admittedly, and injects the fluorescent material baking-curing.Be embedded with all-in-one-piece cloth wire frame on the said heat-conducting substrate, through realizing the connection between each LED wafer in the enterprising capable overall routing of cloth wire frame.Said fluorescent powder curing becomes prominent cup-shaped.Said heat-conducting substrate bottom is provided with extraction electrode.

Realize a kind of LED encapsulating structure of said method, as shown in Figure 1, comprise heat-conductingsubstrate 1, offerreflection groove 2 on the heat-conductingsubstrate 1,reflection groove 2 internal fixation have the large power chip of 0.5～1W, and are solidified with fluorescent material and are enclosed on the LED wafer.Be embedded with cloth wire frame 3 on the said heat-conducting substrate 1.The zone thatreflection groove 2 is not set on the said heat-conductingsubstrate 1 is provided with groove, and cloth wire frame 3 shapes and groove shape are complementary, and is a plane after cloth wire frame 3 embeds heat-conducting substrate 1.The fluorescent material of said curing is prominent cup-shaped.Said heat-conductingsubstrate 1 bottom is provided withextraction electrode 4, and is as shown in Figure 2.

On the basis of the present invention to the change of variation, luminous zone shape or the monnolithic case size of the change of the quantity of reflection groove and dimensions, baseplate material all in the present invention's scope required for protection.

Claims (9)

1. a LED method for packing is characterized in that: on all-in-one-piece heat-conducting substrate, set up a plurality of independently reflection grooves, in reflection groove, put the LED wafer admittedly, and inject the fluorescent material baking-curing.

2. LED method for packing according to claim 1 is characterized in that: be embedded with all-in-one-piece cloth wire frame on the said heat-conducting substrate, through realizing the connection between each LED wafer in the enterprising capable overall routing of cloth wire frame.

3. LED method for packing according to claim 1 and 2 is characterized in that: said fluorescent powder curing becomes prominent cup-shaped.

4. LED method for packing according to claim 1 and 2 is characterized in that: said heat-conducting substrate bottom is provided with extraction electrode.

5. LED encapsulating structure, it is characterized in that: comprise heat-conducting substrate (1), offer reflection groove (2) on the heat-conducting substrate (1), reflection groove (2) internal fixation has the LED wafer, and is solidified with fluorescent material and is enclosed on the LED wafer.

6. LED encapsulating structure according to claim 5 is characterized in that: be embedded with cloth wire frame (3) on the said heat-conducting substrate (1).

7. LED encapsulating structure according to claim 6; It is characterized in that: the zone that reflection groove (2) is not set on the said heat-conducting substrate (1) is provided with groove; Cloth wire frame (3) shape and groove shape are complementary, and cloth wire frame (3) is a plane after embedding heat-conducting substrate (1).

8. LED encapsulating structure according to claim 5 is characterized in that: the fluorescent material of said curing is prominent cup-shaped.

9. LED encapsulating structure according to claim 5 is characterized in that: said heat-conducting substrate (1) bottom is provided with extraction electrode (4).

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