The specific embodiment
In order to make the object of the invention, technical scheme and advantage clearer,, the present invention is further elaborated below in conjunction with accompanying drawing and embodiment.Should be appreciated that specific embodiment described herein only in order to explanation the present invention, and be not used in qualification the present invention.
The embodiment of the invention is through being connected in series some LED crystal grain; The LED crystal grain that is positioned at the head and the tail two ends links to each other with first end of external power source and chip for driving respectively; The second end ground connection of chip for driving, chip for driving is carried out overvoltage and overcurrent protection to LED crystal grain, thereby adapts to different driving voltages.
The embodiment of the invention is achieved in that
A kind of led light source comprises:
Chip for driving;
Some LED crystal grain; Said LED crystal grain serial connection links to each other; And the LED crystal grain that is positioned at the head and the tail two ends links to each other with first end of an external power source and said chip for driving respectively, the second end ground connection of said chip for driving, and said chip for driving is used for LED crystal grain is carried out overvoltage and overcurrent protection; And
Packing colloid is used to encapsulate said chip for driving and LED crystal grain.
In the embodiment of the invention, LED crystal grain is carried out overvoltage and overcurrent protection, thereby adapt to different driving voltages through integrated chip for driving.
Below in conjunction with specific embodiment, realization of the present invention is elaborated:
Please refer to Fig. 1, the led light source that the present invention's first preferred embodiment provides comprises someLED crystal grain 11, chip for driving 30 and packingcolloid 40.
LED crystal grain 11 joins end to end each other, makesLED crystal grain 11 link to each other through the mode of series connection.LED crystal grain 11 through the serial connection varying number can adapt to the requirement of different driving voltages.
TheLED crystal grain 11 that is positioned at the head and the tail two ends links to each other with first end of the integrated chip for driving 30 of external power source VCC and led light source respectively.The second end ground connection of chip for driving 30.
Chip for driving 30 andLED crystal grain 11 all are packaged in the packing colloid 40.Chip for driving 30 is used forLED crystal grain 11 is carried out overvoltage and overcurrent protection.When the overtension ofLED crystal grain 11, chip for driving 30 is promptly cut off the power supply of led light source, with protection LED crystal grain 11.Chip for driving 30 is stablized the electric current of led light source, makes the current constant of led light source.In this embodiment, chip for driving 30 can be born the above floating voltage of 500V, makes led light source work under the 500V high pressure can not damage, and so makes led light source can be suitable for city's electric standard of global different regions.
Led light source of the present invention is through being connected in series someLED crystal grain 11; TheLED crystal grain 11 that is positioned at the head and the tail two ends links to each other with first end of external power source VCC and chip for driving 30 respectively; The second end ground connection of chip for driving 30; Chip for driving 30 andLED crystal grain 11 are packaged in thepacking colloid 40, carry out overvoltage and overcurrent protection through 30 pairs of LED crystal grain of chip for driving 11, thereby adapt to different driving voltages.
As the preferred embodiments of the present invention, chip for driving 30 also is used forLED crystal grain 11 is carried out overheat protector, and when the temperature ofLED crystal grain 11 was too high, chip for driving 30 was promptly cut off the power supply of led light source, with protectionLED crystal grain 11.
As the preferred embodiments of the present invention, someLED crystal grain 11 link to each other through special facture technology serial connection, form wafer square 10.In this embodiment, eachwafer square 10 is in series by 6 LEDs crystal grain 11.In other embodiments, can be according to being suitable for the quantity that voltage or different power require to confirm theLED crystal grain 11 of serial connection in eachwafer square 10, at this not in order to restriction the present invention.
Allwafer squares 10 join end to end throughmetal connecting line 20 successively, make allwafer squares 10 link to each other through the mode of series connection.The driving voltage of eachwafer square 10 is about 4V, and thewafer square 10 through the serial connection varying number adapts to the requirement of different driving voltages.So can reduce the series quantity of metal connecting line significantly, realizeLEDs crystal grain 11 serial connections up to a hundred, improve packaging yield.
Thewafer square 10 that is positioned at the head and the tail two ends links to each other with external power source VCC and chip for driving 30 respectively.
As the preferred embodiments of the present invention, allwafer squares 10 are distributed in thepacking colloid 40 according to certain rules.In this embodiment,wafer square 10 is matrix distribution in packing colloid 40.Eachwafer square 10 dispels the heat through the mode of distributed heat radiation during work, has improved radiating efficiency.
As the preferred embodiments of the present invention,metal connecting line 20 is the alloy line segment of different materials such as gold, silver, copper.
Please refer to Fig. 2, as second preferred embodiment of the present invention, first end of allwafer squares 10 links to each other with external power source VCC throughmetal connecting line 20, and second end of allwafer squares 10 links to each other with chip for driving 30 through metal connecting line 20.So make allwafer squares 10 link to each other through the mode of parallel connection.
Led light source of the present invention is through being concatenated into the wafer square with some LED crystal grain, and the wafer square links to each other through the mode of serial or parallel connection, links to each other the second end ground connection of chip for driving behind the wafer square serial or parallel connection with first end of external power source and chip for driving.Through chip for driving LED crystal grain is carried out overvoltage and overcurrent protection, thereby adapt to different driving voltages.
The above is merely preferred embodiment of the present invention, not in order to restriction the present invention, all any modifications of within spirit of the present invention and principle, being done, is equal to and replaces and improvement etc., all should be included within protection scope of the present invention.