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CN102563391A - Led light source - Google Patents

Led light source
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Publication number
CN102563391A
CN102563391ACN2010106006696ACN201010600669ACN102563391ACN 102563391 ACN102563391 ACN 102563391ACN 2010106006696 ACN2010106006696 ACN 2010106006696ACN 201010600669 ACN201010600669 ACN 201010600669ACN 102563391 ACN102563391 ACN 102563391A
Authority
CN
China
Prior art keywords
crystal grain
driving
chip
led light
light source
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2010106006696A
Other languages
Chinese (zh)
Inventor
文茂强
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SHENZHEN CYT OPTOELECTRONIC TECHNOLOGY CO LTD
Original Assignee
SHENZHEN CYT OPTOELECTRONIC TECHNOLOGY CO LTD
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SHENZHEN CYT OPTOELECTRONIC TECHNOLOGY CO LTDfiledCriticalSHENZHEN CYT OPTOELECTRONIC TECHNOLOGY CO LTD
Priority to CN2010106006696ApriorityCriticalpatent/CN102563391A/en
Priority to PCT/CN2011/082115prioritypatent/WO2012083768A1/en
Publication of CN102563391ApublicationCriticalpatent/CN102563391A/en
Pendinglegal-statusCriticalCurrent

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Abstract

The invention provides an LED light source, which is applicable to the field of light sources and comprises a driving chip and a plurality of LEDs. The LEDs are in series connection, the LEDs positioned at the head end and the tail end are connected with an external power supply and a first end of the driving chip respectively, a second end of the driving chip is grounded, the driving chip and the LEDs are packaged in packaging adhesives, and over-voltage and over-current protection is performed for the LEDs by the aid of the driving chip, so that the LED light source is adaptable to different driving voltage.

Description

Led light source
Technical field
The invention belongs to light source field, particularly a kind of led light source.
Background technology
Led light source is that (Light Emitting Diode LED) is the light source of illuminator to light emitting diode.Light emitting diode was invented the sixties in 20th century, and in many decades subsequently, its basic purposes is the indicator lamp as electronic equipments such as radio cassette players.Led light source has become the main product of a new generation's illumination now, and this product has efficient height, long characteristics of life-span, can use continuously 100,000 hours, than long 100 times of ordinary incandescent lamp bubble.Yet the encapsulation inside of existing led light source does not have integrated overvoltage or overcurrent protection chip, if led light source is linked on civil power or the high voltage source, probably because overtension or the excessive led light source that causes of electric current burn.
Summary of the invention
The purpose of the embodiment of the invention is to provide a kind of led light source, and being intended to solve existing led light source inside does not have integrated overvoltage or overcurrent protection chip, the problem of burning easily.
The embodiment of the invention is achieved in that a kind of led light source, comprising:
Chip for driving;
Some LED crystal grain; Said LED crystal grain serial connection links to each other; And the LED crystal grain that is positioned at the head and the tail two ends links to each other with first end of an external power source and said chip for driving respectively, the second end ground connection of said chip for driving, and said chip for driving is used for LED crystal grain is carried out overvoltage and overcurrent protection; And
Packing colloid is used to encapsulate said chip for driving and LED crystal grain.
Embodiment of the invention led light source is through being connected in series some LED crystal grain; The LED crystal grain that is positioned at the head and the tail two ends links to each other with first end of external power source and chip for driving respectively; The second end ground connection of said chip for driving; Chip for driving and LED die package are carried out overvoltage and overcurrent protection through chip for driving to LED crystal grain in packing colloid, thereby adapt to different driving voltages.
Description of drawings
Fig. 1 is the sketch map of first preferred embodiment of led light source of the present invention.
Fig. 2 is the sketch map of second preferred embodiment of led light source of the present invention.
The specific embodiment
In order to make the object of the invention, technical scheme and advantage clearer,, the present invention is further elaborated below in conjunction with accompanying drawing and embodiment.Should be appreciated that specific embodiment described herein only in order to explanation the present invention, and be not used in qualification the present invention.
The embodiment of the invention is through being connected in series some LED crystal grain; The LED crystal grain that is positioned at the head and the tail two ends links to each other with first end of external power source and chip for driving respectively; The second end ground connection of chip for driving, chip for driving is carried out overvoltage and overcurrent protection to LED crystal grain, thereby adapts to different driving voltages.
The embodiment of the invention is achieved in that
A kind of led light source comprises:
Chip for driving;
Some LED crystal grain; Said LED crystal grain serial connection links to each other; And the LED crystal grain that is positioned at the head and the tail two ends links to each other with first end of an external power source and said chip for driving respectively, the second end ground connection of said chip for driving, and said chip for driving is used for LED crystal grain is carried out overvoltage and overcurrent protection; And
Packing colloid is used to encapsulate said chip for driving and LED crystal grain.
In the embodiment of the invention, LED crystal grain is carried out overvoltage and overcurrent protection, thereby adapt to different driving voltages through integrated chip for driving.
Below in conjunction with specific embodiment, realization of the present invention is elaborated:
Please refer to Fig. 1, the led light source that the present invention's first preferred embodiment provides comprises someLED crystal grain 11, chip for driving 30 and packingcolloid 40.
LED crystal grain 11 joins end to end each other, makesLED crystal grain 11 link to each other through the mode of series connection.LED crystal grain 11 through the serial connection varying number can adapt to the requirement of different driving voltages.
TheLED crystal grain 11 that is positioned at the head and the tail two ends links to each other with first end of the integrated chip for driving 30 of external power source VCC and led light source respectively.The second end ground connection of chip for driving 30.
Chip for driving 30 andLED crystal grain 11 all are packaged in the packing colloid 40.Chip for driving 30 is used forLED crystal grain 11 is carried out overvoltage and overcurrent protection.When the overtension ofLED crystal grain 11, chip for driving 30 is promptly cut off the power supply of led light source, with protection LED crystal grain 11.Chip for driving 30 is stablized the electric current of led light source, makes the current constant of led light source.In this embodiment, chip for driving 30 can be born the above floating voltage of 500V, makes led light source work under the 500V high pressure can not damage, and so makes led light source can be suitable for city's electric standard of global different regions.
Led light source of the present invention is through being connected in series someLED crystal grain 11; TheLED crystal grain 11 that is positioned at the head and the tail two ends links to each other with first end of external power source VCC and chip for driving 30 respectively; The second end ground connection of chip for driving 30; Chip for driving 30 andLED crystal grain 11 are packaged in thepacking colloid 40, carry out overvoltage and overcurrent protection through 30 pairs of LED crystal grain of chip for driving 11, thereby adapt to different driving voltages.
As the preferred embodiments of the present invention, chip for driving 30 also is used forLED crystal grain 11 is carried out overheat protector, and when the temperature ofLED crystal grain 11 was too high, chip for driving 30 was promptly cut off the power supply of led light source, with protectionLED crystal grain 11.
As the preferred embodiments of the present invention, someLED crystal grain 11 link to each other through special facture technology serial connection, form wafer square 10.In this embodiment, eachwafer square 10 is in series by 6 LEDs crystal grain 11.In other embodiments, can be according to being suitable for the quantity that voltage or different power require to confirm theLED crystal grain 11 of serial connection in eachwafer square 10, at this not in order to restriction the present invention.
Allwafer squares 10 join end to end throughmetal connecting line 20 successively, make allwafer squares 10 link to each other through the mode of series connection.The driving voltage of eachwafer square 10 is about 4V, and thewafer square 10 through the serial connection varying number adapts to the requirement of different driving voltages.So can reduce the series quantity of metal connecting line significantly, realizeLEDs crystal grain 11 serial connections up to a hundred, improve packaging yield.
Thewafer square 10 that is positioned at the head and the tail two ends links to each other with external power source VCC and chip for driving 30 respectively.
As the preferred embodiments of the present invention, allwafer squares 10 are distributed in thepacking colloid 40 according to certain rules.In this embodiment,wafer square 10 is matrix distribution in packing colloid 40.Eachwafer square 10 dispels the heat through the mode of distributed heat radiation during work, has improved radiating efficiency.
As the preferred embodiments of the present invention,metal connecting line 20 is the alloy line segment of different materials such as gold, silver, copper.
Please refer to Fig. 2, as second preferred embodiment of the present invention, first end of allwafer squares 10 links to each other with external power source VCC throughmetal connecting line 20, and second end of allwafer squares 10 links to each other with chip for driving 30 through metal connecting line 20.So make allwafer squares 10 link to each other through the mode of parallel connection.
Led light source of the present invention is through being concatenated into the wafer square with some LED crystal grain, and the wafer square links to each other through the mode of serial or parallel connection, links to each other the second end ground connection of chip for driving behind the wafer square serial or parallel connection with first end of external power source and chip for driving.Through chip for driving LED crystal grain is carried out overvoltage and overcurrent protection, thereby adapt to different driving voltages.
The above is merely preferred embodiment of the present invention, not in order to restriction the present invention, all any modifications of within spirit of the present invention and principle, being done, is equal to and replaces and improvement etc., all should be included within protection scope of the present invention.

Claims (7)

CN2010106006696A2010-12-222010-12-22Led light sourcePendingCN102563391A (en)

Priority Applications (2)

Application NumberPriority DateFiling DateTitle
CN2010106006696ACN102563391A (en)2010-12-222010-12-22Led light source
PCT/CN2011/082115WO2012083768A1 (en)2010-12-222011-11-11Led light source

Applications Claiming Priority (1)

Application NumberPriority DateFiling DateTitle
CN2010106006696ACN102563391A (en)2010-12-222010-12-22Led light source

Publications (1)

Publication NumberPublication Date
CN102563391Atrue CN102563391A (en)2012-07-11

Family

ID=46313129

Family Applications (1)

Application NumberTitlePriority DateFiling Date
CN2010106006696APendingCN102563391A (en)2010-12-222010-12-22Led light source

Country Status (2)

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CN (1)CN102563391A (en)
WO (1)WO2012083768A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
CN102798015A (en)*2012-07-122012-11-28深圳市长运通光电技术有限公司Patch type LED (Light-Emitting Diode) luminescent device

Citations (8)

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Publication numberPriority datePublication dateAssigneeTitle
CN2731908Y (en)*2004-09-062005-10-05富微科技股份有限公司 Driver chips combined with light-emitting diodes
US20080083929A1 (en)*2006-10-062008-04-10Iii-N Technology, Inc.Ac/dc light emitting diodes with integrated protection mechanism
US20080188020A1 (en)*2007-02-052008-08-07Kuo Wei-MinMethod of LED packaging on transparent flexible film
CN201114899Y (en)*2007-08-302008-09-10杭州五联照明科技有限公司LED over-heat protection circuit
CN201180966Y (en)*2008-02-262009-01-14李史俊High power LED lamp refrigerating device
CN101532612A (en)*2009-03-102009-09-16广州南科集成电子有限公司Method for manufacturing integrated LED chip light source
CN201478302U (en)*2009-07-032010-05-19数能科技股份有限公司Packaging structure of light-emitting element
CN101908586A (en)*2009-06-032010-12-08亿光电子工业股份有限公司Light emitting diode packaging structure

Family Cites Families (4)

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Publication numberPriority datePublication dateAssigneeTitle
CN201234390Y (en)*2008-07-182009-05-06金诗电子技术(上海)有限公司High light modulation ratio LED driving chip
CN201341256Y (en)*2008-12-192009-11-04晶锜科技股份有限公司Backlight module and light-emitting device thereof
DE202009001880U1 (en)*2009-02-162009-07-16APA Electronic Co., Ltd., Chung-Ho City Packaging structure of a full color LED with drive mechanism
CN201414246Y (en)*2009-06-102010-02-24北京诚创星光科技有限公司 A High Efficiency Step-Down LED Driver

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
CN2731908Y (en)*2004-09-062005-10-05富微科技股份有限公司 Driver chips combined with light-emitting diodes
US20080083929A1 (en)*2006-10-062008-04-10Iii-N Technology, Inc.Ac/dc light emitting diodes with integrated protection mechanism
US20080188020A1 (en)*2007-02-052008-08-07Kuo Wei-MinMethod of LED packaging on transparent flexible film
CN201114899Y (en)*2007-08-302008-09-10杭州五联照明科技有限公司LED over-heat protection circuit
CN201180966Y (en)*2008-02-262009-01-14李史俊High power LED lamp refrigerating device
CN101532612A (en)*2009-03-102009-09-16广州南科集成电子有限公司Method for manufacturing integrated LED chip light source
CN101908586A (en)*2009-06-032010-12-08亿光电子工业股份有限公司Light emitting diode packaging structure
CN201478302U (en)*2009-07-032010-05-19数能科技股份有限公司Packaging structure of light-emitting element

Cited By (1)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
CN102798015A (en)*2012-07-122012-11-28深圳市长运通光电技术有限公司Patch type LED (Light-Emitting Diode) luminescent device

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Publication numberPublication date
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Application publication date:20120711


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