CN102559092A - Circuit board conductive adhesive, single-sided and double-sided multi-layer printed circuit board and production method - Google Patents
Circuit board conductive adhesive, single-sided and double-sided multi-layer printed circuit board and production methodDownload PDFInfo
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Abstract
Description
Translated fromChinese技术领域technical field
本发明涉及一种导电胶，更具体地说，尤其涉及一种塞孔用的导电胶及用该导电胶制造的单双面多层印刷电路板。The invention relates to a conductive glue, more specifically, to a kind of conductive glue for plugging holes and a single-sided and double-sided multilayer printed circuit board made of the conductive glue.
背景技术Background technique
众所周知的，现时市场上的双面多层线路板的贯通孔技术采用大多是电镀技术，电镀技术除了造成环境污染外，在生产成本上也给企业造成极大的压力。故此，越来越多的印制线路板企业会考虑不采用电镀技术来处理贯通孔，一般都会采用银浆贯孔、铜浆贯孔、碳墨贯孔等手法，银浆贯孔成本高，大多不被采用，碳墨贯孔电阻值大，使用范围局限性很大，而且也只能制作一些要求较低的产品。铜浆贯孔成本适中，但由于铜氧化快，生产时操作较困难，特别是不耐酸碱，容易被酸碱腐蚀，造成贯通能力大打折扣。以上的几种贯孔方法还存在耐热冲击的可靠性，电阻值的稳定性和附着力度变弱等问题。As we all know, the through-hole technology of double-sided multilayer circuit boards currently on the market is mostly electroplating technology. In addition to causing environmental pollution, electroplating technology also puts great pressure on enterprises in terms of production costs. Therefore, more and more printed circuit board companies will consider not using electroplating technology to process through holes. Generally, silver paste through holes, copper paste through holes, carbon ink through holes, etc. are used. The cost of silver paste through holes is high. Most of them are not used, the carbon ink through-hole resistance value is large, the scope of use is very limited, and only some products with lower requirements can be produced. The cost of copper paste through hole is moderate, but due to the rapid oxidation of copper, it is difficult to operate during production, especially it is not resistant to acid and alkali, and is easily corroded by acid and alkali, resulting in greatly reduced penetration ability. The above several through-hole methods also have problems such as reliability of thermal shock resistance, stability of resistance value, and weak adhesion.
如专利号为：“99106371.6”的发明专利公开了一种小孔填充用的导电胶，该导电胶为了提高耐热冲击可靠性，电阻值的稳定性和附着力的稳定性等问题，提出了导电胶的粘度和TI值越低越好，将TI值调整在1.0以下以加强印刷的效果，令通孔饱满，但行业内专业人士所共知的是，这种作法必然会造成基板两面有导电胶冒出，必须增加打磨工序，将冒出的导电胶磨去，不然就会出现热压合后表面层铜箔破损或由于溢胶而造成的线路短路等问题。另外，该导电胶为了增加其在基板及其与铜箔之间的附着力，而将导电胶之载体-环氧化合物树脂的比例设定为30％以上，众所周知，树脂含量高导电物质就要相应减少其电阻值就会降低，树脂含量高，在受热冲击后，导电胶的膨胀率就较高，进一步影响电阻值，这样，在线路板的实际生产操作过程中，各施工的操作参数就要求相对严格，稍有偏差就会造成不良，令其品质保障系数降低，潜在的品质风险较大。还有，该导电胶要求的金属导电粒子的“平均粒径为0.5～20um，其比表面积为0.05～105m2/g”在导电粒子的选料上也带来诸多不便，成本上升。还有该导电胶针对较大的导通孔，辟如0.5mm以上的孔，容易在孔内造成气泡，经热冲击后容易爆孔等等，使其应用范围变小，操作便利性下降等情况。因此，如何解决上述问题，为亟待解决的问题。For example, the invention patent with the patent number "99106371.6" discloses a conductive adhesive for small hole filling. In order to improve the reliability of thermal shock resistance, the stability of resistance value and the stability of adhesion, the conductive adhesive proposes The lower the viscosity and TI value of the conductive adhesive, the better. Adjust the TI value below 1.0 to enhance the printing effect and make the through holes full. If the conductive adhesive emerges, it is necessary to increase the grinding process to remove the emerging conductive adhesive, otherwise there will be problems such as damage to the copper foil on the surface layer after hot pressing or short circuit caused by overflowing adhesive. In addition, in order to increase the adhesion between the substrate and the copper foil, the conductive adhesive sets the carrier-epoxy compound resin ratio to more than 30%. As we all know, conductive substances with high resin content require If the resistance value is reduced accordingly, the resin content is high, and after thermal shock, the expansion rate of the conductive adhesive will be higher, which will further affect the resistance value. In this way, in the actual production operation of the circuit board, the operating parameters of each construction will be The requirements are relatively strict, and a slight deviation will cause defects, which will reduce the quality assurance factor and cause a greater potential quality risk. In addition, the "average particle diameter of 0.5-20 um and specific surface area of 0.05-105 m2 /g" required by the conductive adhesive also brings a lot of inconvenience to the selection of conductive particles and increases the cost. In addition, the conductive adhesive is aimed at larger via holes, such as holes above 0.5mm, which are easy to cause air bubbles in the holes, and are easy to burst holes after thermal shock, etc., so that the application range is reduced and the operation convenience is reduced. Condition. Therefore, how to solve the above problems is an urgent problem to be solved.
发明内容Contents of the invention
本发明旨在提供成本少、吸附性好、应用范围广，品质保障系数较好且便于操作的一种线路板塞孔导通的导电胶，本发明还提供使用该导电胶的单双面多层印刷电路板及制作方法。The purpose of the present invention is to provide a conductive adhesive with low cost, good adsorption, wide application range, good quality assurance factor and easy operation. Multi-layer printed circuit board and manufacturing method.
本发明的一种用于线路板塞孔导通的导电胶，包含重量比为：5％～29％的(A)耐高温树脂、至少包含70％～5％的(B)锡或锡合金导电粒子和余量的(C)其它金属或非金属的导电粒子。A conductive adhesive for circuit board plug hole conduction according to the present invention, comprising (A) high-temperature-resistant resin in a weight ratio of 5% to 29%, and at least 70% to 5% of (B) tin or tin alloy Conductive particles and the remainder (C) other metallic or non-metallic conductive particles.
上述的用于线路板塞孔导通的导电胶，所述的耐高温树脂包括环氧化合物树脂、聚酰亚胺类树脂、酚醛树脂，乙烯类聚合物、丙烯酸类树脂、聚醚、聚酯树脂、聚酰胺树脂、聚氨酯中选择至少一种。The above-mentioned conductive adhesive for circuit board plug hole conduction, the high temperature resistant resin includes epoxy compound resin, polyimide resin, phenolic resin, vinyl polymer, acrylic resin, polyether, polyester At least one selected from resin, polyamide resin and polyurethane.
上述的用于线路板塞孔导通的导电胶，金属导电粒子的选料范围如下：The above-mentioned conductive adhesive for circuit board plug hole conduction, the material selection range of metal conductive particles is as follows:
①从金、铂、银、钯、铜、镍、铝、铟中选择至少一种的粒子。① Particles of at least one kind selected from gold, platinum, silver, palladium, copper, nickel, aluminum, and indium.
②从金、铂、银、钯、铜、镍、铝、铟中选择的任意组合的合金粒子。②Alloy particles in any combination selected from gold, platinum, silver, palladium, copper, nickel, aluminum, and indium.
③以导电或非导电粒子为核，用从金、铂、银、钯、铜、镍、铝、铟中选择至少一种金属包覆的粒子。③ Conductive or non-conductive particles as the core, coated with at least one metal selected from gold, platinum, silver, palladium, copper, nickel, aluminum, and indium.
④以导电或非导电粒子为核，用从金、铂、银、钯、铜、镍、铝、铟中选择的任意组合的合金包覆的粒子。④ Conductive or non-conductive particles as the core, coated with any combination of alloys selected from gold, platinum, silver, palladium, copper, nickel, aluminum, and indium.
上述的用于线路板塞孔导通的导电胶，非金属导电粒子选料范围如下：The above-mentioned conductive glue used for circuit board plug hole conduction, the material selection range of non-metallic conductive particles is as follows:
包括炭黑、碳纤维、石墨等任意一种粒子或任意一种组合的粒子。Including carbon black, carbon fiber, graphite and other particles or any combination of particles.
上述的用于线路板塞孔导通的导电胶，所述的耐高温树脂还包括与树脂和导电粒子相匹配的填充料以及与树脂和填充料相匹配的各种增进剂；所述的填充料导电钛白粉类的填充料；所述的增进剂为树脂固化剂、增塑剂、消泡剂、TI调整剂类的增进剂。The above-mentioned conductive adhesive for circuit board plug hole conduction, the high temperature resistant resin also includes fillers that match the resin and conductive particles and various promoters that match the resin and fillers; the filler Filling materials of conductive titanium dioxide; the accelerators are resin curing agents, plasticizers, defoamers, and TI regulators.
上述的用于线路板塞孔导通的导电胶，所述的锡合金导电粒子为锡铝合金、锡铋合金、锡银合金、锡铜合金，锡铅合全，锡铟氧化物、掺锑氧化锡及各种镀锡材料。The above-mentioned conductive adhesive for circuit board plug hole conduction, the tin alloy conductive particles are tin-aluminum alloy, tin-bismuth alloy, tin-silver alloy, tin-copper alloy, tin-lead alloy, tin-indium oxide, antimony-doped Tin oxide and various tin-plated materials.
本发明的一种双面多层印刷电路板，包括绝缘基材、复合在绝缘基材一侧的铜箔层，在上述复合板上开设导通孔，在绝缘基材的另一侧贴设有铜箔层，如上述任一权利要求所述的导电胶设置在上下铜箔之间的导通孔内。A double-sided multilayer printed circuit board of the present invention comprises an insulating base material, a copper foil layer compounded on one side of the insulating base material, a conducting hole is opened on the above-mentioned composite board, and a There is a copper foil layer, and the conductive adhesive according to any one of the above claims is arranged in the via hole between the upper and lower copper foils.
上述的双面多层印刷电路板，所述的绝缘基材可以是带有热熔粘胶的聚酯、聚碳酸酯、聚酰亚胺的耐高温材料或是聚酰胺纤维布浸渗或涂布热固性树脂的复合基材或是玻璃环氧型基材。For the above-mentioned double-sided multilayer printed circuit board, the insulating base material can be polyester, polycarbonate, polyimide high temperature resistant material with hot-melt adhesive or polyamide fiber cloth impregnated or coated Composite substrates of cloth thermosetting resins or glass epoxy substrates.
本发明的一种双面多层印刷电路板的制作方法，包括如下步骤：1)将一面铜箔以低温预压在绝缘基材的任意一面，形成单面覆铜基料，然后加工导通孔；2)将另一面铜箔复合在绝缘基材的另一面上，导通孔形成“凹”槽；3)将上述任一权利要求所述的导电胶施印至所述的“凹”槽中固化，令两面铜箔导通和加工双面电路板两面的线路。A method for manufacturing a double-sided multilayer printed circuit board of the present invention comprises the following steps: 1) pre-pressing one side of copper foil on either side of an insulating base material at low temperature to form a single-sided copper-clad base material, and then processing and conducting 2) compound the copper foil on the other side on the other side of the insulating substrate, and form a "concave" groove through the conduction hole; 3) apply the conductive adhesive according to any one of the above claims to the "concave" Solidify in the groove, make the copper foils on both sides conduct and process the lines on both sides of the double-sided circuit board.
上述的一种用导电胶制作双面多层印刷电路板的制作方法，在上述的步骤1～3的基础上增加步骤：4)然后再在内层两面覆合一层加工好导通孔的绝缘基材和铜箔，形成“凹”槽，施印导电胶，令内层与外一层线路导通和加工双面电路板两面的线路，依此步骤类推，形成更多层数的多层线路板。The above-mentioned method for making a double-sided multi-layer printed circuit board with conductive adhesive, on the basis of the above-mentioned
上述的一种用导电胶制作双面多层印刷电路板的制作方法，多层线路板的凹槽处的导电胶，也可以先加工线路再将导电胶施印至凹槽中固化。In the above-mentioned method of making double-sided multilayer printed circuit boards with conductive adhesive, the conductive adhesive at the groove of the multilayer circuit board can also be processed first and then printed into the groove to cure the conductive adhesive.
本方案制作的导电胶有以下几方面的优点：第一、导电胶的载体-A材料，其优选重量比设定为15-25％，降低了A材料在受热冲击后的膨胀系数，减少热冲击对其之影响。第二、A材料的选择范围可以是亲水性的树脂，也可以是亲油性的树脂，导电胶的固化方式也是多样的，可以是自然干燥的也可以是UV干燥的和热固化的等。第三、最关键的是，本方案设定有优选重量比为20-50％的锡粒子在里面，配合本方案提出的线路板制作方法，锡粒子在经热冲击或制作好的线路板在焊电子元件的工序段时，经受高温后锡粒子熔融，把设定在本方案里的金属粒子与线路板的铜箔紧密接着，故其附着力会非常好。第四、本方案中C材料的选料范围很宽，只要是1500目以上、方便通过印刷网版的金属粒子，不管是片状还是圆珠状，或是其它不规则的形状都可以被选用，大大降低了成本。第五、抗酸碱腐蚀能力强，因金属锡本身耐碱腐蚀能力强，故本方案的导电胶在线路板制作及使用过程中无需刻意避开酸碱物，方便了制程的制作。第六、本方案导电胶的粘度和TI值，不需特别设定，配合本方案提出的制作线路板方法的使用，只需满足印刷所求就行，方便了导电胶的制作及其制作线路板时的应用。The conductive adhesive produced by this program has the following advantages: First, the carrier-A material of the conductive adhesive has a preferred weight ratio of 15-25%, which reduces the expansion coefficient of the A material after thermal shock and reduces heat impact on it. Second, the selection range of A material can be hydrophilic resin or lipophilic resin, and the curing method of conductive adhesive is also various, which can be natural drying or UV drying and heat curing. Third, the most important thing is that the scheme is set with tin particles with a preferred weight ratio of 20-50%. With the circuit board manufacturing method proposed in this scheme, the tin particles are subjected to thermal shock or the prepared circuit board in the In the process section of soldering electronic components, the tin particles are melted after being subjected to high temperature, and the metal particles set in this solution are closely bonded to the copper foil of the circuit board, so the adhesion will be very good. Fourth, the material selection range of C material in this scheme is very wide, as long as it is more than 1500 mesh, metal particles that are convenient to pass through the printing screen, whether it is flake, bead, or other irregular shapes can be selected , greatly reducing the cost. Fifth, strong acid and alkali corrosion resistance. Because metal tin itself has strong alkali corrosion resistance, the conductive adhesive of this solution does not need to deliberately avoid acid and alkali substances during the production and use of circuit boards, which facilitates the production of the process. Sixth, the viscosity and TI value of the conductive adhesive in this scheme do not need to be specially set. With the use of the method for making circuit boards proposed in this scheme, it only needs to meet the printing requirements, which is convenient for the production of conductive adhesive and the production of circuit boards. Applications.
附图说明Description of drawings
下面将结合附图中的具体实施例对本发明作进一步地详细说明，但不构成对本发明的任何限制。The present invention will be described in further detail below in conjunction with specific embodiments in the accompanying drawings, but this does not constitute any limitation to the present invention.
图1为本发明的一种双面多层印刷电路板的制作方法的结构及步骤示意图；Fig. 1 is the structure and step schematic diagram of the manufacture method of a kind of double-sided multilayer printed circuit board of the present invention;
图2为本发明的另一种双面多层印刷电路板的制作方法的结构及步骤示意图；Fig. 2 is the structure and step schematic diagram of another kind of double-sided multilayer printed circuit board manufacturing method of the present invention;
图3为本发明的再一种双面多层印刷电路板的制作方法的结构及步骤示意图。3 is a schematic diagram of the structure and steps of another method for manufacturing a double-sided multilayer printed circuit board of the present invention.
图4为本发明的一种双面多层印刷电路板结构示意图。Fig. 4 is a schematic structural diagram of a double-sided multilayer printed circuit board of the present invention.
具体实施方式Detailed ways
本发明的一种用于线路板塞孔导通的导电胶，包含重量比为：5％～29％的(A)耐高温树脂、至少包含70％～5％的(B)锡或锡合金导电粒子和余量的(C)其它金属或非金属的导电粒子。A conductive adhesive for circuit board plug hole conduction according to the present invention, comprising (A) high-temperature-resistant resin in a weight ratio of 5% to 29%, and at least 70% to 5% of (B) tin or tin alloy Conductive particles and the remainder (C) other metallic or non-metallic conductive particles.
耐高温树脂包括环氧化合物树脂、聚酰亚胺类树脂、酚醛树脂，乙烯类聚合物、丙烯酸类树脂、聚醚、聚酯树脂、聚酰胺树脂、聚氨酯中选择至少一种。The high temperature resistant resin includes at least one selected from epoxy compound resin, polyimide resin, phenolic resin, vinyl polymer, acrylic resin, polyether, polyester resin, polyamide resin and polyurethane.
金属导电粒子的选料范围如下：The selection range of metal conductive particles is as follows:
①从金、铂、银、钯、铜、镍、铝、铟中选择至少一种的粒子。① Particles of at least one kind selected from gold, platinum, silver, palladium, copper, nickel, aluminum, and indium.
②从金、铂、银、钯、铜、镍、铝、铟中选择的任意组合的合金粒子。②Alloy particles in any combination selected from gold, platinum, silver, palladium, copper, nickel, aluminum, and indium.
③以导电或非导电粒子为核，用从金、铂、银、钯、铜、镍、铝铟中选择至少一种金属包覆的粒子。③ Conductive or non-conductive particles as the core, coated with at least one metal selected from gold, platinum, silver, palladium, copper, nickel, and aluminum indium.
④以导电或非导电粒子为核，用从金、铂、银、钯、铜、镍、铝铟中选择的任意组合的合金包覆的粒子。④ Conductive or non-conductive particles as the core, coated with any combination of alloys selected from gold, platinum, silver, palladium, copper, nickel, and aluminum indium.
非金属导电粒子选料范围如下：The material selection range of non-metallic conductive particles is as follows:
包括炭黑、碳纤维、石墨等任意一种粒子或任意一种组合的粒子。Including carbon black, carbon fiber, graphite and other particles or any combination of particles.
耐高温树脂还包括与树脂和导电粒子相匹配的填充料以及与树脂和填充料相匹配的各种增进剂；所述的填充料导电钛白粉类的填充料；所述的增进剂为树脂固化剂、增塑剂、消泡剂、TI调整剂类的增进剂。The high temperature resistant resin also includes fillers that match the resin and conductive particles and various promoters that match the resin and fillers; the fillers are fillers that are conductive titanium dioxide; the promoters are resin cured Additives, plasticizers, defoamers, and TI regulators.
锡合金导电粒子为锡铝合金、锡铋合金、锡银合金、锡铜合金，锡铅合全，锡铟氧化物、掺锑氧化锡及各种镀锡材料。Tin alloy conductive particles are tin-aluminum alloy, tin-bismuth alloy, tin-silver alloy, tin-copper alloy, tin-lead alloy, tin-indium oxide, antimony-doped tin oxide and various tin-plated materials.
C材料中的各种材料可以是圆珠状或片状或其它不规则状态的。Various materials in material C may be in the shape of beads or flakes or other irregular states.
如图1～3所示，一种双面多层印刷电路板，包括绝缘基材1、复合在绝缘基材1一侧的铜箔层2，在上述复合板上开设导通孔3，在绝缘基材1的另一侧贴设有铜箔层2，如上述的导电胶4)设置在上下铜箔之间的导通孔3内。As shown in Figures 1 to 3, a double-sided multilayer printed circuit board includes an insulating
绝缘基材可以是带有热熔粘胶的聚酯、聚碳酸酯、聚酰亚胺等耐高温材料或是聚酰胺纤维布浸渗或涂布热固性树脂的复合基材或是玻璃环氧型基材。The insulating substrate can be polyester, polycarbonate, polyimide and other high-temperature-resistant materials with hot-melt adhesive, or a composite substrate of polyamide fiber cloth impregnated or coated with thermosetting resin, or glass epoxy type Substrate.
本组合导电胶应用于单、双面，多层线路板生产制作时的线路印刷(即直接代替导通线路)和层与层之间的粘合层、层与层之间的通孔导通、线与线之间粘合、修补连接和线路板与电子元件之间的焊接等作用。This combination of conductive adhesives is used in single-sided, double-sided, and multi-layer circuit boards for circuit printing (that is, directly replacing conductive lines) and bonding layers between layers, and through-hole conduction between layers. , Bonding between wires, repairing connections and welding between circuit boards and electronic components.
本组合导电胶除应用于硬性线路板外还可以适用于柔性线路板和柔-硬结合线路板，以及印刷在聚酯、聚碳酸酯、聚酰亚胺等材料上，作为粘合、灌孔、导通、线路连接和焊接使用。In addition to being applied to rigid circuit boards, this combined conductive adhesive can also be applied to flexible circuit boards and flexible-rigid circuit boards, as well as printed on polyester, polycarbonate, polyimide and other materials, as bonding and filling holes. , conduction, line connection and welding use.
本组合导电胶还可以应用于各种电子元件的粘接、封装和焊接使用。The combined conductive adhesive can also be applied to the bonding, packaging and welding of various electronic components.
如图1～2所示，一种双面多层印刷电路板的制作方法，包括如下步骤：1)将一面铜箔以低温预压在绝缘基材的任意一面，形成单面覆铜基料，然后加工导通孔；2)将另一面铜箔复合在绝缘基材的另一面上，导通孔形成“凹”槽；3)将上述任一权利要求所述的导电胶施印至所述的“凹”槽中固化，令两面铜箔导通和加工双面电路板两面的线路。As shown in Figures 1 and 2, a method for making a double-sided multilayer printed circuit board includes the following steps: 1) pre-pressing one side of copper foil on any side of an insulating substrate at low temperature to form a single-sided copper-clad base material , and then process the conduction hole; 2) compound the copper foil on the other side on the other side of the insulating substrate, and the conduction hole forms a "concave" groove; 3) apply the conductive adhesive described in any one of the above claims to the It is solidified in the "concave" groove mentioned above, so that the copper foils on both sides are conducted and the lines on both sides of the double-sided circuit board are processed.
如图3所示，一种用导电胶制作双面多层印刷电路板的制作方法，在权利要求9所述的步骤1～3的基础上增加步骤：4)然后再在内层两面覆合一层加工好导通孔的绝缘基材和铜箔，形成“凹”槽，施印导电胶，令内层与外一层线路导通，依此步骤类推，形成更多层数的多层线路板和加工双面电路板两面的线路。As shown in Figure 3, a method for making a double-sided multilayer printed circuit board with conductive adhesive, on the basis of
一种用导电胶制作双面多层印刷电路板的制作方法，多层线路板的凹槽处的导电胶，也可以先加工线路再将导电胶施印至凹槽中固化。A method for making a double-sided multi-layer printed circuit board with conductive adhesive. The conductive adhesive at the groove of the multi-layer circuit board can also process the circuit first and then apply the conductive adhesive to the groove for curing.
导电胶具体实施时的制作方法：The production method of conductive adhesive in specific implementation:
1、将A材料中的耐高温树脂溶于与之相匹配的溶剂中，然后加入填充料及各功能增进剂等，制作成溶液一；1. Dissolve the high-temperature-resistant resin in material A in a matching solvent, and then add fillers and various functional enhancers to make
2、将A材料中耐高温树脂的固化剂溶于溶剂中，经三辊研磨机充分研磨，制作成溶液二。(根据选用的A材料的树脂而定，如不需固化剂的，则免去此工序)；2. Dissolve the curing agent of the high-temperature-resistant resin in material A in the solvent, and fully grind it with a three-roll mill to make
3、将B材料和C材料分别加入与A材料相匹配的溶液之中，充分搅拌后，经三辊研磨机研磨二至四次，制作成溶液三。3. Add material B and material C into the solution that matches material A, stir well, and grind two to four times with a three-roll mill to make solution three.
4、使用时将溶液二按比例加入溶液三中，充分搅拌均匀，使用稀释剂调制适合印刷或涂布的粘度，即可使用。如无固化剂的则直接调整粘度后使用。4. When using, add
5、印刷或涂布后的涂层经自然风干或UV固化或经130℃-230℃×15-30分钟(固化的方式和条件温度因选用的树脂及固化剂而定)固化即可。5. After printing or coating, the coating can be cured by natural air drying or UV curing or by 130°C-230°C×15-30 minutes (the curing method and condition temperature are determined by the selected resin and curing agent).
导电胶的制作的具体实施例：The specific embodiment of the making of conductive glue:
本例举方案采用的是98％左右的聚酯树脂(聚酯树脂是各种导电银浆、导电铜浆、导电碳浆经常使用的树脂之一，在各化工市场均很容易得到)作为A材料，采用2000目的纯锡粉作为B材料，采用2000目的银包铜片状粉沫作为C材料(以上产品在化工市场均有销售)，采用783慢干水作水溶剂调配，采用比例为，A材料20％B材料35％C材料45％，783慢干水应需要加入。What this exemplification scheme adopts is about 98% polyester resin (polyester resin is one of resins often used in various conductive silver pastes, conductive copper pastes, and conductive carbon pastes, and is all easy to obtain in various chemical markets) as A Materials, 2000 mesh pure tin powder is used as B material, 2000 mesh silver-clad copper flake powder is used as C material (the above products are sold in the chemical market), 783 slow-drying water is used as water solvent deployment, and the ratio is, A material 20% B material 35% C material 45%, 783 slow drying water should be added.
首先将B材料各C材料分别加入少量783慢干水，使之湿润，然后将B材料和C材料加入A材料中充分搅拌后，放入三辊研磨机研磨三次，制得导电胶，采用日本生产的RION VISCOTESTER VT-04F粘度计2号检测针作检测，将导电胶粘度调整到25℃时为100PS，即可使用。First, add a small amount of 783 slow-drying water to material B and material C respectively to make them wet, then add material B and material C to material A and stir them thoroughly, then put them into a three-roller grinder and grind them three times to prepare conductive adhesive, which is made from Japan The produced RION VISCOTESTER VT-04F viscometer No. 2 detection needle is used for detection, and the viscosity of the conductive adhesive is adjusted to 100PS at 25°C, and it can be used.
3、6、9号品3, 6, 9 products
耐高温树脂采用5％体积和锡或锡合金粒子采用5％体积，则铜粉采用90％体积。Use 5% volume of high temperature resistant resin and 5% volume of tin or tin alloy particles, then use 90% volume of copper powder.
4、7、10号品4, 7, 10 products
耐高温树脂采用25％体积和锡或锡合金粒子采用30％体积，则铜粉采用45％体积。25% by volume of high temperature resistant resin and 30% by volume of tin or tin alloy particles, and 45% by volume of copper powder.
12号品Product No. 12
耐高温树脂采用35％体积和锡或锡合金粒子采用30％体积，则铜粉采用35％体积。35% volume of high temperature resistant resin and 30% volume of tin or tin alloy particles are used, and 35% volume of copper powder is used.
13号品Product No. 13
耐高温树脂采用29％体积和锡或锡合金粒子采用41％体积，则铜粉采用30％体积。29% by volume of high temperature resistant resin and 41% by volume of tin or tin alloy particles, and 30% by volume of copper powder.
(一)基材选用：(1) Substrate selection:
1、0.1mm厚度的无热熔胶聚酰亚胺基材。1. 0.1mm thick polyimide substrate without hot melt adhesive.
2、0.1mm厚度的单面涂半固化热熔胶的聚酰亚胺基材(热熔胶厚度为30um)2. Polyimide substrate coated with semi-cured hot melt adhesive on one side with a thickness of 0.1mm (the thickness of the hot melt adhesive is 30um)
3、0.1mm厚度的双面涂半固化热熔胶的聚酰亚胺基材(热熔胶厚度为30um)3. Polyimide substrate coated with semi-cured hot-melt adhesive on both sides with a thickness of 0.1mm (the thickness of the hot-melt adhesive is 30um)
4、厚度为18um的纯铜箔。4. Pure copper foil with a thickness of 18um.
以上材料市场均有销售。The above materials are sold in the market.
(二)线路板制作实施方案：(2) Implementation plan for circuit board production:
实施方案一(单面板之制作)Implementation plan 1 (production of single-sided panel)
基材：0.1MM的无热熔胶聚酰亚胺；Substrate: 0.1MM polyimide without hot melt adhesive;
印刷工具：77T(即200目)的丝网；Printing tool: 77T (ie 200 mesh) screen;
操作方法：Operation method:
1、裁取基材后将基材表面的灰尘油渍等清除干净；1. After cutting the substrate, remove the dust and oil stains on the surface of the substrate;
2、采用77T丝网直接在基材表面印刷线路；2. Use 77T screen to print the circuit directly on the surface of the substrate;
3、印刷后经130℃-150℃×30分钟烘干即得到线路层；3. After printing, dry at 130°C-150°C for 30 minutes to obtain the circuit layer;
4、应用行业内所共知的方法制作保护层和字符层，即可得出完整的线路板。4. Apply the methods known in the industry to make the protective layer and the character layer, and then a complete circuit board can be obtained.
实施方案二(双面板之制作之一)Implementation plan 2 (one of the production of double-sided panels)
基材：1、0.1mm厚度的单面涂半固化热熔胶的聚酰亚胺基材(热熔胶厚度为30um)；Substrate: 1. Polyimide substrate coated with semi-cured hot melt adhesive on one side with a thickness of 0.1mm (the thickness of the hot melt adhesive is 30um);
2、18UM铜箔2. 18UM copper foil
导通孔的孔径：0.5MMAperture diameter of via hole: 0.5MM
印刷工具：77T(即200目)丝网Printing tool: 77T (ie 200 mesh) screen
操作方法1、先将单面覆有30um厚度的半固化热溶树脂的聚酰亚胺基材依工程资料采用机械冲压，机械钻孔或激光钻孔等形式加工导通孔及定位孔等；
2、将加工好导通孔的基材与铜箔压合在一起，压合条件为温度180℃，压力100公斤，时间60秒；2. Press the base material with the processed via hole and the copper foil together, the pressing conditions are temperature 180 ℃, pressure 100 kg, time 60 seconds;
3、将压合好的基材径150℃×60分钟固化；3. Curing the laminated substrate at 150°C for 60 minutes;
4、采用行业内熟知的腐蚀方法将铜箔的一面的线路制作出来；4. Use the well-known corrosion method in the industry to make the circuit on one side of the copper foil;
5、在没有铜箔的一面用本方案导电胶采用连塞带印的方法印刷线路。导电胶穿过此前留好的导通孔与铜箔面导通。经150℃×30分钟烘干后便制成双面导通的线路板。5. On the side without copper foil, use the conductive adhesive of this scheme to print the circuit with the method of plugging and printing. The conductive glue passes through the previously reserved via hole and conducts with the copper foil surface. After drying at 150°C for 30 minutes, a double-sided conductive circuit board is made.
6、用行之内所熟知方法制作防焊层及字符即得出完整的双面板线路板；6. Use the well-known methods in the industry to make the solder mask and characters to get a complete double-sided circuit board;
7、本实施方案中第4步聚和第5步聚的顺序可根据工厂的设备状况和工程人员的设计方案等实际情况灵活调换顺序制作，其做法和效果是一样的。7, the order of the 4th step gathering and the 5th step gathering in the present embodiment can be flexibly exchanged order making according to actual conditions such as the equipment status of the factory and the design scheme of the engineering personnel, and its way and effect are the same.
实施方案三(双面板制作之二)Implementation plan three (two-sided panel production)
基材：1、10.1mm厚度的双面涂半固化热熔胶的聚酰亚胺基材(热熔胶厚度为30um)Substrate: 1. Polyimide substrate coated with semi-cured hot-melt adhesive on both sides with a thickness of 10.1mm (the thickness of the hot-melt adhesive is 30um)
2、18UM铜箔；2. 18UM copper foil;
导通孔的孔径：0.5MM。Aperture diameter of via hole: 0.5MM.
印刷工具：77T(即200目)丝网。Printing tool: 77T (ie 200 mesh) screen.
操作方法：1、先将一面铜箔预压合在双面覆胶的基材的一面上，条件为：温度80-100℃，压力60-80公斤，时间15-25秒。Operation method: 1. Pre-press one side of copper foil on one side of the double-sided glue-coated substrate, the conditions are: temperature 80-100 ℃, pressure 60-80 kg, time 15-25 seconds.
2、然后再依据工程资料将其加工好通孔和定位孔等。2. Then process the through holes and positioning holes according to the engineering data.
3、再将另一面(没有铜箔面)覆上铜箔，经压合机压合成型，压合条件为：温度180℃，压力100-120公斤，时间80秒。3. Cover the other side (the side without copper foil) with copper foil, and press it into shape by a pressing machine. The pressing conditions are: temperature 180°C, pressure 100-120 kg, time 80 seconds.
4、再将压合好的双面铜箔基材经150℃×60分钟固化就制作好了其中一面铜箔不开通孔，另一面连基料一起开好通孔的基板，通孔处呈“凹”槽状。4. Then, the laminated double-sided copper foil substrate is cured at 150°C for 60 minutes to produce a substrate in which the copper foil on one side does not have a through hole, and the other side has a through hole with the base material. The through hole is "Concave" groove shape.
5、在“凹”槽处印刷导电胶。然后经150℃×30分钟烘干即可。5. Print conductive glue on the "concave" groove. Then it can be dried at 150°C for 30 minutes.
6、再用行业内所熟知的方法制作出两面线路。6. Make two-sided circuits by methods well known in the industry.
7、再用行业内所熟知的方法制作防焊层和字符等就形成了完整的线路板。7. Then use the well-known methods in the industry to make solder mask and characters to form a complete circuit board.
8、本实施方案中的第5步聚和第6步聚可互相灵活调换顺序其制作方法和效果是一样的。8. The 5th step poly and the 6th step poly in the present embodiment can flexibly exchange order and its production method and effect are the same.
实施方案四(多层板之制作之四层板制作)Embodiment 4 (Four-layer board production of multi-layer board production)
1、采用本例举实施方案三之方法先制作出第二第三层线路。1. The second and third layers of circuits are produced first by adopting the method of the third embodiment of the present example.
2、采用双面覆胶聚酰亚胺预压出第一层和第四层铜箔。2. The first layer and the fourth layer of copper foil are pre-pressed with double-sided adhesive polyimide.
3、将预压合好的第一层和第四层加工导通孔及定位孔。3. Process conduction holes and positioning holes on the pre-pressed first layer and fourth layer.
4、将加工好导通孔的第一层和第四层分别压合在第二和第三层上。4. Press the first layer and the fourth layer with the via holes processed on the second and third layers respectively.
5、在两面凹槽处施印导电胶并固化。5. Apply conductive adhesive to the grooves on both sides and cure.
6、采用行业内所熟知的方法制作第一和第四层线路。6. Fabricate the first and fourth layer circuits by methods well known in the industry.
7、采用行业所熟知的方法制作防焊层和字符层即制作成完整的四层线路板。7. Use the methods well known in the industry to make the solder mask layer and the character layer to make a complete four-layer circuit board.
另外：六层以上线路板可依照方案四中的第2、3、4、5、6步骤，由里往外加层即可。In addition: circuit boards with more than six layers can follow
三、功能测试3. Functional test
(一)测试条件：(1) Test conditions:
基材：0.1MM厚度的双面带半固化热熔胶的聚酰亚胺基材(热熔胶厚度为30UM)Substrate: Polyimide substrate with semi-cured hot melt adhesive on both sides of 0.1MM thickness (hot melt adhesive thickness is 30UM)
铜箔厚度：18UMCopper foil thickness: 18UM
导通孔直径：0.5MMVia hole diameter: 0.5MM
印刷工具：0.1MM厚度的铝片塞孔网版Printing tools: 0.1MM thick aluminum plug hole screen
(二)制作过程(2) Production process
1、先将一面铜箔预压在基材的其中一面上，预压条件：温度80℃，压力80KG，时间20秒。1. Pre-press one side of copper foil on one side of the substrate, pre-pressing conditions: temperature 80°C, pressure 80KG, time 20 seconds.
2、将预压好一面铜箔的基材采用机械钻孔方法钻好直径为0.5MM的导通孔。2. Drill a via hole with a diameter of 0.5 mm on the base material with a pre-pressed copper foil by mechanical drilling method.
3、将钻好导通孔的基材与另一面铜箔压合在一起，制作成一面带通孔的双面覆铜基材。3. Press the base material with drilled via holes and the copper foil on the other side together to make a double-sided copper-clad base material with through holes on one side.
4、依据基材的钻孔数据制作铝片塞孔网版。4. According to the drilling data of the base material, the screen plate of the aluminum plug hole is made.
5、采用线路板行业所熟知的方法制作出线路。5. Use the methods well known in the circuit board industry to make the circuit.
6、施印导电胶以及固化等。6. Printing and curing of conductive adhesive.
(三)测试品(3) Test items
1号品：日本生产的ASAHI TU-30SK导电碳浆。Product No. 1: ASAHI TU-30SK conductive carbon paste produced in Japan.
2号品：日本生产的ASAHI导电银浆。Product No. 2: ASAHI conductive silver paste produced in Japan.
以上A、B、C材料在各化工市场均有销售。The above materials A, B, and C are sold in various chemical markets.
(四)测试项目及方法(4) Test items and methods
测试项目及其方法采用线路板通常需检测的项目和检测方法检测。The test items and methods are tested by using the items and testing methods that circuit boards usually need to be tested.
(五)表面外观及附着力测试结果。(5) Surface appearance and adhesion test results.
(六)电阻值测试结果(单位：uΩ.cm)(6) Resistance value test results (unit: uΩ.cm)
以上测试结果来看，3号品、6号品和9号品因树脂含量过低、抗酸能力和抗绕曲能力较差，溶剂擦拭检验和3M胶纸拉扯检验的结果都不能令人满意。4号品、7号品和10号品都能很好地满足线路板的工艺要求，达到良好的导通效果，如果考虑生产成本和线路板本身对阻抗的要求不高等因素的话，5号品、8号品和11号品也是一个不错的选择！而12号品因树脂量高于本专利范围，其附着力和抗酸、抗绕曲等效果都比较满意，但电阻值较高，特别是经280℃高温冲击后，其电阻值变得十分不稳定，所以无法使用。According to the above test results, products No. 3, No. 6 and No. 9 are unsatisfactory due to the low resin content, poor acid resistance and bending resistance. . No. 4, No. 7 and No. 10 products can well meet the process requirements of the circuit board and achieve a good conduction effect. If considering the production cost and the low requirements of the circuit board itself on impedance, the No. 5 product , No. 8 and No. 11 products are also a good choice! Because the resin content of No. 12 is higher than the scope of this patent, its adhesion, anti-acid, and anti-bending effects are relatively satisfactory, but its resistance value is relatively high, especially after being subjected to high-temperature impact at 280°C, its resistance value becomes very high. Unstable, so unusable.
功能测试具体分析：Specific analysis of functional testing:
3、6、9号品3, 6, 9 products
耐高温树脂采用5％体积和锡和锡合金粒子采用5％体积，则铜粉采用90％体积，酒精及溶剂测试：轻微掉粉，附差力测试：切口边沿导电胶轻微脱落，耐酸测试：无脱落，轻微腐蚀，耐碱测试：无脱落，表面完好，溶剂测试：无脱落，表面完好，盐雾测试：无脱落，表面完好，耐高温测试：无脱落，表面完好，热循环测试：表面完好，绕曲测试：导电胶开裂。Use 5% volume of high temperature resistant resin and 5% volume of tin and tin alloy particles, then use 90% volume of copper powder. Alcohol and solvent test: slight powder drop, adhesion force test: conductive glue at the edge of the cut slightly falls off, acid resistance test: No peeling, slight corrosion, alkali resistance test: no peeling, the surface is intact, solvent test: no peeling, the surface is intact, salt spray test: no peeling, the surface is intact, high temperature resistance test: no peeling, the surface is intact, thermal cycle test: the surface In good condition, bending test: the conductive adhesive is cracked.
4、7、10号品4, 7, 10 products
耐高温树脂采用25％体积和锡和锡合金粒子采用30％体积，则铜粉采用45％体积，酒精及溶剂测试：轻微掉粉，附差力测试：切口边沿导电胶轻微脱落，耐酸测试：无脱落，轻微腐蚀，耐碱测试：无脱落，表面完好，溶剂测试：无脱落，表面完好，盐雾测试：无脱落，表面完好，耐高温测试：无脱落，表面完好，热循环测试：表面完好，绕曲测试：导电胶无开裂。Use 25% volume of high temperature resistant resin and 30% volume of tin and tin alloy particles, then use 45% volume of copper powder. Alcohol and solvent test: slight powder drop, adhesion force test: conductive glue at the edge of the cut slightly falls off, acid resistance test: No peeling, slight corrosion, alkali resistance test: no peeling, the surface is intact, solvent test: no peeling, the surface is intact, salt spray test: no peeling, the surface is intact, high temperature resistance test: no peeling, the surface is intact, thermal cycle test: the surface In good condition, bending test: the conductive adhesive has no cracks.
12号品Product No. 12
耐高温树脂采用35％体积和锡和锡合金粒子采用30％体积，则铜粉采用35％体积，酒精及溶剂测试：轻微掉粉，附差力测试：切口边沿导电胶轻微脱落，耐酸测试：无脱落，轻微腐蚀，耐碱测试：无脱落，表面完好，溶剂测试：无脱落，表面完好，盐雾测试：无脱落，表面完好，耐高温测试：无脱落，表面完好，热循环测试：表面完好，绕曲测试：导电胶无开裂。Use 35% volume of high temperature resistant resin and 30% volume of tin and tin alloy particles, then use 35% volume of copper powder, alcohol and solvent test: slight powder drop, adhesion force test: conductive glue at the edge of the cut slightly falls off, acid resistance test: No peeling, slight corrosion, alkali resistance test: no peeling, the surface is intact, solvent test: no peeling, the surface is intact, salt spray test: no peeling, the surface is intact, high temperature resistance test: no peeling, the surface is intact, thermal cycle test: the surface In good condition, bending test: the conductive adhesive has no cracks.
13号品Product No. 13
耐高温树脂采用29％体积和锡和锡合金粒子采用41％体积，则铜粉采用30％体积，酒精及溶剂测试：轻微掉粉，附差力测试：切口边沿导电胶轻微脱落，耐酸测试：无脱落，轻微腐蚀，耐碱测试：无脱落，表面完好，溶剂测试：无脱落，表面完好，盐雾测试：无脱落，表面完好，耐高温测试：无脱落，表面完好，热循环测试：表面完好，绕曲测试：导电胶无开裂。Use 29% volume of high temperature resistant resin and 41% volume of tin and tin alloy particles, then use 30% volume of copper powder. Alcohol and solvent test: slight powder drop, adhesion force test: conductive glue at the edge of the cut slightly falls off, acid resistance test: No peeling, slight corrosion, alkali resistance test: no peeling, the surface is intact, solvent test: no peeling, the surface is intact, salt spray test: no peeling, the surface is intact, high temperature resistance test: no peeling, the surface is intact, thermal cycle test: the surface In good condition, bending test: the conductive adhesive has no cracks.
以上测试结果：3、6、9号品因树脂含量过低、抗酸能力和抗绕曲能力较差，溶剂擦拭检验和3M胶纸拉扯检验的结果都不能令人满意；4、7、10号品都能很好地满足线路板的工艺要求，达到良好的导通效果。如果考虑生产成本和线路板本身对阻抗的要求不高等因素的话；13号品也是一个不错的选择；而12号品因树脂量高于本专利范围，其附着力和抗酸、抗绕曲等效果都比较满意，但电阻值较高，特别是经280℃高温冲击后，其电阻值变得十分不稳定，所以无法使用。The above test results: No. 3, 6, and 9 products are not satisfactory due to low resin content, poor acid resistance and anti-bending ability, and the results of solvent wiping test and 3M gummed paper pulling test; 4, 7, 10 No. products can well meet the process requirements of the circuit board and achieve a good conduction effect. If the factors such as production cost and circuit board itself have low requirements on impedance are considered, product No. 13 is also a good choice; and product No. 12 has higher adhesion, acid resistance and warping resistance because the resin content is higher than the scope of this patent. The effect is quite satisfactory, but the resistance value is high, especially after being subjected to high temperature impact at 280°C, the resistance value becomes very unstable, so it cannot be used.
综上所述，本发明已如说明书及图示内容，制成实际样品且经多次使用测试，从使用测试的效果看，可证明本发明能达到其所预期之目的，实用性价值乃无庸置疑。以上所举实施例仅用来方便举例说明本发明，并非对本发明作任何形式上的限制，任何所属技术领域中具有通常知识者，若在不脱离本发明所提技术特征的范围内，利用本发明所揭示技术内容所作出局部更动或修饰的等效实施例，并且未脱离本发明的技术特征内容，均仍属于本发明技术特征的范围内。To sum up, the present invention has been made into actual samples according to the instructions and illustrations, and has been tested for many times. From the results of the test, it can be proved that the present invention can achieve its intended purpose, and its practical value is worthless. Doubt. The above-mentioned embodiments are only used to illustrate the present invention for convenience, and are not intended to limit the present invention in any form. Anyone with ordinary knowledge in the technical field, if within the scope of the technical characteristics of the present invention, can use this The equivalent embodiments of partial changes or modifications made in the technical content disclosed in the invention, and without departing from the technical features of the present invention, still fall within the scope of the technical features of the present invention.
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| CN102858087A (en)* | 2012-08-27 | 2013-01-02 | 吴祖 | Blind hole conduction double-sided circuit board and processing method |
| CN103635006A (en)* | 2012-08-23 | 2014-03-12 | 富葵精密组件(深圳)有限公司 | Circuit board and manufacturing method thereof |
| WO2014113937A1 (en)* | 2013-01-23 | 2014-07-31 | Henkel IP & Holding GmbH | Flexible conductive ink |
| CN104497924A (en)* | 2014-11-25 | 2015-04-08 | 四川大学 | New antistatic hot melt adhesive and preparation method thereof |
| CN104629643A (en)* | 2015-03-06 | 2015-05-20 | 廊坊市高瓷电子技术有限公司 | Conductive glue, preparation method thereof and circuit board |
| CN104661440A (en)* | 2015-03-06 | 2015-05-27 | 廊坊市高瓷电子技术有限公司 | Manufacturing method of printed circuit board and printed circuit board |
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| CN102858087A (en)* | 2012-08-27 | 2013-01-02 | 吴祖 | Blind hole conduction double-sided circuit board and processing method |
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| CN109135612A (en)* | 2018-08-10 | 2019-01-04 | 云南科威液态金属谷研发有限公司 | A kind of low-melting-point metal micro-nano powder conducting resinl and preparation method thereof |
| CN110505757A (en)* | 2019-08-19 | 2019-11-26 | 广德鼎星电子科技有限公司 | A kind of production method of the non-porous conducting of FPC |
| CN111668621A (en)* | 2020-06-09 | 2020-09-15 | 业成科技（成都）有限公司 | Flexible circuit board, laminating method and circuit board assembly |
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| CN116200160A (en)* | 2022-11-16 | 2023-06-02 | 深圳市励高表面处理材料有限公司 | Non-microetching organic copper surface bonding agent and preparation method thereof |
| CN116200160B (en)* | 2022-11-16 | 2024-04-09 | 深圳市励高表面处理材料有限公司 | Non-microetching organic copper surface bonding agent and preparation method thereof |
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